JP2006080391A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device in which the directivity in the case of using a plurality of LEDs is widened and the illumination effect is improved by changing the emission color depending on the viewing angle.
In a light emitting device 10A, leads 1A to 1D made of a conductive material are arranged around a common conductive support 4 made of a conductive material, and side surfaces 4A to 4D and a top surface 4E of the common conductive support 4 are arranged. Are mounted in common with LED chips 2A to 2D, respectively. The LED chip 2A is formed on the first side surface 4A of the common conductive support 4, the LED chip 2B is formed on the side surface 4B, the LED chip 2C is formed on the side surface 4C, the LED chip 2D is formed on the side surface 4D, and the top surface 4E is formed on the top surface 4E. Each LED chip 2E is mounted.
[Selection] Figure 1

Description

  The present invention relates to a light-emitting device that emits light from a light-emitting element such as a light-emitting diode (LED), and in particular, widens the directivity when using a plurality of LEDs, and produces an illumination effect by varying the emission color depending on the viewing angle. The present invention relates to a light emitting device that is improved.

  Conventionally, LEDs have been used as decorative lamps in show windows, showrooms, and the like (see, for example, Patent Document 1).

In this case, in order to improve the illumination effect, it is common to illuminate the object to be decorated by mounting on the same surface or parallel surfaces using a plurality of LEDs emitting the same color or emitting a plurality of colors. Has been done. In particular, when a plurality of LEDs that emit a plurality of colors are used, the decoration becomes gorgeous, so that the illumination effect can be improved.
JP 2001-306003 A

  However, according to a conventional light emitting device, a decorative lamp configured by mounting a plurality of LEDs on the same surface or parallel surfaces has a narrow directivity compared with a decorative lamp configured by a light bulb or the like, and thus has uneven brightness. It feels like Therefore, a strange feeling is given to the person who sees the object to be decorated. In addition, when the LED is caused to emit light, it becomes difficult to improve the illumination effect because the emitted color looks the same even if the viewing angle is changed.

  Accordingly, an object of the present invention is to provide a light-emitting device in which the directivity when a plurality of LEDs are used is widened and the illumination effect is improved by changing the emission color depending on the viewing angle.

  In order to achieve the above object, the present invention comprises a plurality of common or individual conductive supports provided in different directions and having a plurality of LED mounting surfaces on which LED chips are mounted, and first and second electrodes. And a plurality of LED chips mounted by electrically connecting the first electrodes to the plurality of LED mounting surfaces of the conductive support, and bonding wires to the second electrodes of the plurality of LED chips. There is provided a light-emitting device comprising a plurality of individual conductors connected via each other.

  According to the light emitting device of the present invention, since a plurality of LED chips are mounted on LED mounting surfaces provided in different directions on a common or individual conductive support, directivity is widened. In addition, by changing the emission color of each LED chip, the emission color varies depending on the viewing angle, and the illumination effect can be improved.

[First Embodiment]
FIG. 1 is a perspective view showing a light emitting device according to a first embodiment of the present invention, and FIG. 2 is a plan view thereof. The light emitting device 10A includes LED chips 2A to 2E as light emitting elements, a common conductive support 4 made of a conductive material, on which the LED chips 2A to 2E are mounted, and leads 1A as individual conductors made of a conductive material. To 1D, LED chips 2A to 2E, and bonding wires 3A to 3E for connecting the leads 1A to 1D. The LED chips 2A to 2E, the upper part of the common conductive support 4, the upper parts of the leads 1A to 1D, and the bonding wires 3A to 3E are covered with a sealing resin 11 made of a transparent resin material.

  The LED chips 2A to 2E are mounted on the side surfaces 4A to 4D and the top surface 4E of the common conductive support 4. Here, since the LED chips 2A to 2E are of a type having electrodes on the upper and lower surfaces of the chip, the LED chips 2A to 2E are connected to one electrode of the LED chips 2A to 2E by being mounted on the common conductive support 4. The LED chips 2A to 2E may be a combination of LED chips that emit light of the same color, or a red LED chip that emits red light and a green light that emits green light. It may be a combination of a system LED chip, a blue LED chip that emits light of blue color, and a combination of LED chips that emit other colors.

  In the common conductive support 4, the surfaces on which the LED chips 2A to 2E are mounted are formed at right angles, and the side surfaces 4A to 4D and the top surface 4E are electrically connected to each other. Note that the surfaces on which the LED chips 2A to 2E are mounted do not need to be formed at right angles, and may be inclined depending on the emission direction of the emitted light.

  The LED chips 2A to 2D and the leads 1A to 1D are connected by bonding wires 3A to 3D, respectively. The lead 1D is connected to the bonding wires 3A and 3E, and supplies power to the plurality of LED chips 2A and 2E from one lead.

  The light emitting device 10A is covered with, for example, a sealing resin 11 made of a transparent resin material molded into a shell shape, and constitutes a discrete type light emitting device 10A. The discrete type light emitting device 10A is assembled as a decorative lamp by inserting the leads 1A to 1D and the common conductive support 4 into a substrate such as a printed wiring board and mounting them by soldering or the like.

  FIG. 3 shows an equivalent circuit of the light emitting device 10 according to the first embodiment. LED chip 2A-2E shows a cathode common type. D2A is an LED composed of LED chip 2A, D2B is an LED composed of LED chip 2B, D2C is an LED composed of LED chip 2C, D2D is an LED composed of LED chip 2D, and D2E is Each of the LEDs formed by the LED chip 2E is shown. Each of the LEDs D2A to D2E is lit by applying a forward voltage between the lead 1A to 1D serving as the anode terminal and the common conductive support 4 serving as the cathode common terminal.

(Effects of the first embodiment)
According to the light emitting device 10A according to the first embodiment, the following effects can be obtained.
(1) Since each of the five LED chips 2A to 2E is mounted on different surfaces 4A to 4E of the common conductive support 4 to constitute a decorative lamp, the directivity can be widened. Therefore, since the brightness unevenness is not felt, it does not give a sense of incongruity to the person who sees the object to be decorated. In addition, since the light emitting device 10 can be used as a substitute for a decorative lamp constituted by a light bulb or the like, the life of the lamp can be extended by taking advantage of the LED.
(2) Since the plurality of LED chips 2A to 2E are respectively mounted on the different surfaces 4A to 4E of the common conductive support 4, the emission color can be varied depending on the viewing angle, so that even a single LED lamp Irradiation with different emission colors can be performed on the irradiation surface. Therefore, the illumination effect can be improved.
(3) Since the LED chips 2A to 2E can emit light individually, the illumination effect can be improved by changing the light emission color or changing the light emission time or light emission pattern even in the same color.

[Second Embodiment]
FIG. 4 is a perspective view showing a light emitting device according to the second embodiment of the present invention, FIG. 5 shows a light emitting device according to the second embodiment of the present invention, (a) is a front view thereof, (B) is a plan view thereof, and FIG. 6 shows an equivalent circuit thereof. Here, since the same reference numerals as those shown in FIGS. 1 to 3 represent the same parts, detailed description thereof will be omitted.

  The light emitting device 10B is different from the light emitting device 10A according to the first embodiment in that the shape of the common conductive support 12 made of a conductive material and four LED chips to be mounted are used.

  The common conductive support 12 is formed with slopes 12A to 12D adjacent to each other above, and the LED chips 2A to 2D are mounted on the slopes 12A to 12D, respectively.

  The LED chips 2A to 2D are configured to supply power to one LED chip from the leads 1A to 1D, respectively.

(Effect of the second embodiment)
According to the light emitting device 10B according to the second embodiment, the following effects can be obtained.
(1) Since each of the four LED chips 2A to 2D is mounted on different slopes 12A to 12D of the common conductive support 12, a decorative lamp is configured, so that the directivity can be widened. Therefore, since the brightness unevenness is not felt, it does not give a sense of incongruity to the person who sees the object to be decorated. In addition, since the light emitting device 10B can be used as a substitute for a decorative lamp constituted by a light bulb or the like, the life of the lamp can be extended by taking advantage of the LED.
(2) Since the plurality of LED chips 2A to 2D are mounted on the different slopes 12A to 12D of the common conductive support 12, respectively, the emission color can be varied depending on the viewing angle, so that even a single LED lamp can have many Irradiation with different emission colors can be performed on the irradiation surface. Therefore, the illumination effect can be improved.
(3) The emission angle of emitted light as the light emitting device 10B can be changed by changing the angles of the inclined surfaces 12A to 12D of the common conductive support 12.

[Third Embodiment]
7A and 7B show a light emitting device according to a third embodiment of the present invention. FIG. 7A is a plan view thereof, FIG. 7B is a perspective view thereof, and FIG. 8 is an equivalent circuit thereof. The light emitting device 10C is different from the light emitting device 10B according to the second embodiment in that the conductive supports 13A to 13D are made of a conductive material instead of the common conductive support 12 and are provided independently. The difference is that LED chips 2A to 2D are provided above the conductive supports 13A to 13D, respectively. That is, as shown in FIG. 8, LED chips 2A to 2D having electrodes on the upper and lower surfaces are mounted on one conductive support 13A to 13D, respectively, and from one lead 1A to 1D to one LED chip 2A to 2D. Power is supplied. Since other points are the same as those of the light emitting device 10B according to the second embodiment, detailed description thereof is omitted.

(Effect of the third embodiment)
According to the light emitting device 10C according to the third embodiment, the following effects can be obtained.
(1) Since each of the four LED chips 2A to 2D is mounted on the conductive supports 13A to 13D to form a decorative lamp, the directivity can be widened. Therefore, since the brightness unevenness is not felt, it does not give a sense of incongruity to the person who sees the object to be decorated. Further, since the light emitting device 10C can be used as a substitute for a decorative lamp constituted by a light bulb or the like, the life of the lamp can be extended by taking advantage of the LED.
(2) Since each of the plurality of LED chips 2A to 2D is mounted on the conductive supports 13A to 13D, the emission color can be varied depending on the viewing angle. Can be irradiated with different emission colors. Therefore, the illumination effect can be improved.
(3) Since the LED chips 2A to 2D can individually emit light, the illumination effect can be improved by changing the light emission color or changing the light emission time or light emission pattern even in the same color.

(Fourth embodiment)
FIG. 9 shows a light emitting device according to a fourth embodiment of the present invention, in which (a) is a plan view thereof and (b) is an equivalent circuit thereof. This light emitting device 10D is different from the light emitting device 10B according to the second embodiment in that power is supplied from one lead 1A to one LED chip 2A, but from one lead 1A to two LED chips 2A, The difference is that power is supplied to 2B and power is supplied from the lead 1B to the two LED chips 2C and 2D. Since other points are the same as those of the light emitting device 10B according to the second embodiment, detailed description thereof is omitted.

(Effect of the fourth embodiment)
According to the light emitting device 10D according to the fourth embodiment, the following effects can be obtained.
(1) Since power is supplied from the lead 1A to the two LED chips 2A and 2B, and power is supplied from the lead 1B to the two LED chips 2C and 2D, the number of leads can be reduced, and thus the structure is simplified and the manufacturing is performed. Cost can be reduced.
(2) Since each of the four LED chips 2A to 2D is mounted on different surfaces 12A to 12D of the common conductive support 12, a decorative lamp is configured, so that the directivity can be widened. Therefore, since the brightness unevenness is not felt, it does not give a sense of incongruity to the person who sees the object to be decorated. Further, since the light emitting device 10D can be used as an alternative to a decorative lamp configured with a light bulb or the like, the life of the lamp can be extended by taking advantage of the LED.
(3) Since the plurality of LED chips 2A to 2D are mounted on the different surfaces 12A to 12D of the common conductive support 12, respectively, the emission color can be varied depending on the viewing angle. Irradiation with different emission colors can be performed on the irradiation surface. Therefore, the illumination effect can be improved.

[Fifth Embodiment]
FIG. 10 shows a light emitting device according to a fifth embodiment of the present invention, in which (a) is a plan view thereof and (b) is an equivalent circuit thereof. This light emitting device 10E is different from the light emitting device 10B according to the second embodiment in that LED chips 8A and 8B mounted on 12A and 12C are provided on one side of the chip on the inclined surface of the common conductive support 12. The LED chip 8A is fed by the two leads 1A and 1B via the bonding wires 3A and 3B, and the LED chip 8B is fed by the two leads 1C and 1D via the bonding wires 3C and 3D. The point is different. Since other points are the same as those of the light emitting device 10B according to the second embodiment, detailed description thereof is omitted.

(Effect of 5th Embodiment)
According to the light emitting device 10E according to the fifth embodiment, the following effects can be obtained.
(1) Even if the electrodes are provided on one side of the LED chips 8A and 8B, since power can be supplied by the leads 1A to 1D, it is not necessary to increase the number of leads.
(2) Since the LED chip 8A is fed by the two leads 1A and 1B and the LED chip 8B is fed by the two leads 1C and 1D, the common conductive support 4 is sealed as in the first embodiment. Since there is no need to protrude outward of the stop resin, the structure is simplified and the manufacturing cost can be reduced.

(Modification of the fifth embodiment)
By mounting other LED chips on the inclined surfaces 12B and 12D in addition to the plurality of LED chips 8A and 8B, the directivity of the emitted light can be widened. In addition, since the luminance unevenness is not felt, the person who sees the object to be decorated does not feel uncomfortable.

[Sixth Embodiment]
FIG. 11 shows a light emitting device according to a sixth embodiment of the present invention, in which (a) is a plan view thereof and (b) is an equivalent circuit thereof. The light emitting device 10F is different from the light emitting device 10B according to the second embodiment in that two LED chips 2A and 2B are mounted on one inclined surface 12A of the common conductive support 12 and the inclined surface 12 is opposed to the light emitting device 10B. The difference is that two LED chips 2C and 2D are mounted on one inclined surface 12C. Since other points are the same as those of the light emitting device 10B according to the second embodiment, detailed description thereof is omitted.

(Effect of 6th Embodiment)
According to the light emitting device 10F according to the sixth embodiment, the following effects can be obtained.
(1) Since two LED chips 2A and 2B are mounted on one inclined surface 12A and two LED chips 2C and 2D are mounted on one inclined surface 12C facing the inclined surface 12, emitted light in a predetermined direction is brightened. be able to.
(2) Since the LED chips 2A to 2D can emit light individually, the illumination effect can be improved by changing the light emission color or changing the light emission time or light emission pattern even in the same color.

[Seventh Embodiment]
FIG. 12 is a perspective view of a light emitting device according to a seventh embodiment of the present invention. The light emitting device 10G is different from the light emitting device 10A according to the first embodiment in that no LED chip is mounted on the top surface 4E of the common conductive support 4, and LED chips 8A mounted on the side surfaces 4A to 4D. ˜8D (8C and 8D are not shown) is a type in which an electrode is provided on one side. That is, the leads 1A to 1D and the LED chips 8A to 8D, and the LED chips 8A to 8D and the common conductive support are connected by the bonding wires 3A to 3D and 30A to 30D. Since the other points are the same as those of the light emitting device 10A according to the first embodiment, detailed description thereof is omitted.

(Effect of 7th Embodiment)
According to the light emitting device 10G according to the seventh embodiment, the following effects can be obtained.
(1) Even if the electrodes are provided on one side of the LED chips 8A to 8D, power can be supplied by the leads 1A to 1D, so that it is not necessary to increase the number of leads.
(2) Since either the anode or the cathode can be shared by the common conductive support 4, it is not necessary to increase the number of leads.

[Eighth Embodiment]
FIG. 13 shows a light emitting device according to an eighth embodiment of the present invention, where (a) is a perspective view thereof and (b) is an equivalent circuit thereof. The light emitting device 10H is different from the light emitting device 10G according to the seventh embodiment in that the LED chips 8A to 8D (8C and 8D are not visible) mounted on the common conductive support 4 are electrodes on one side of the LED chip. A point where power is supplied from one lead 1A to two LED chips 8A and 8D (not shown), and power is supplied from lead 1B to two LED chips 8B and 8C (not shown). The LED chips 8A to 8D are connected to the common conductive support 4 through bonding wires 30A to 30D (30C and 30D are not visible). Since the other points are the same as those of the light emitting device 10G according to the seventh embodiment, detailed description thereof is omitted.

(Effect of 8th Embodiment)
According to the light emitting device 10H according to the eighth embodiment, the following effects can be obtained.
(1) Power is supplied from one lead 1A to two LED chips 8A and 8D (not shown), and power is supplied from lead 1B to two LED chips 8B and 8C (not shown). Therefore, the structure is simplified and the manufacturing cost can be reduced.
(2) Since either the anode or the cathode can be shared by the common conductive support 4, it is not necessary to increase the number of leads.
(3) Since the LED chips 8A to 8D can emit light in a plurality of units, the illumination effect can be improved by changing the light emission color or changing the light emission time or light emission pattern even in the same color.

[Ninth Embodiment]
FIG. 14 shows a light emitting device according to a ninth embodiment of the present invention, where (a) is a perspective view thereof and (b) is an equivalent circuit thereof. This light emitting device 10I is different from the light emitting device 10C according to the third embodiment in that power is supplied from one lead 1A to the two LED chips 2A and 2D, and power is supplied from the lead 1B to the two LED chips 2B and 2C. The point is different. Since other points are the same as those of the light emitting device 10C according to the third embodiment, detailed description thereof is omitted.

(Effect of 9th Embodiment)
According to the light emitting device 10I according to the ninth embodiment, the following effects can be obtained.
(1) Since the power is supplied from the lead 1A to the two LED chips 2A and 2D and from the lead 1B to the two LED chips 2B and 2C, the number of leads can be reduced, and the structure is simple. Thus, the manufacturing cost can be reduced.
(2) Since the LED chips 2A to 2D can emit light in a plurality of units, the illumination effect can be improved by changing the emission color or changing the emission time or the emission pattern for the same color.
[Tenth embodiment]
FIG. 15 is a perspective view of a light emitting device according to a tenth embodiment of the present invention. This light emitting device 10J is different from the light emitting device 10I according to the ninth embodiment in that the LED chips 8A to 8D are of a type in which electrodes are provided on one side of the chip. That is, the lead 1A is connected to the LED chips 8A and 8D via bonding wires 3A and 3D, the lead 1B is connected to the LED chips 8B and 8C via bonding wires 3B and 3C, and the LED chips 8A to 8D are The conductive supports 13A to 13D are connected to the conductive supports 13A to 13D through bonding wires 30A to 30D, respectively. Since the other points are the same as those of the light emitting device 10I according to the ninth embodiment, detailed description thereof is omitted.

(Effect of 10th Embodiment)
According to the light emitting device 10J according to the tenth embodiment, the following effects can be obtained.
(1) Since power is supplied from one lead 1A to the two LED chips 8A and 8D and power is supplied from the lead 1B to the two LED chips 8B and 8C, the number of leads can be reduced, and the structure is simplified. The manufacturing cost can be reduced.
(2) Since the LED chips 8A to 8D can emit light in a plurality of units, the illumination effect can be improved by changing the emission color or changing the emission time or the emission pattern even in the same color.

[Eleventh embodiment]
FIG. 16 shows a light emitting device according to an eleventh embodiment of the present invention, where (a) is a perspective view thereof, (b) is a plan view thereof, and (c) is an equivalent circuit thereof. The light emitting device 20A includes an insulating substrate 26, a plurality of pedestals 24A to 24D that are provided on the insulating substrate 26 and are made of a conductive material and formed at a predetermined angle, and LEDs mounted on the pedestals 24A to 24D. Chips 2A to 2D, leads 21A to 24D for supplying power to the LED chips 2A to 2D via wire bonding 3A to 3D, leads 21E to 21H connected to the LED chips 2A to 2D via pedestals 24A to 24D, and LEDs A sealing resin 25 for sealing the chips 2A to 2D and the wire bondings 3A to 3D is provided.

  This light-emitting device 20A is a surface-mount type that is mounted on a substrate, whereas the above-described light-emitting devices 10A to 10J are discrete types that are inserted into the substrate. The light emitting device 20A is assembled as a decorative lamp by surface-mounting the leads 21A to 21H on a substrate such as a printed wiring board by soldering or the like.

  Here, the LED chip 2A is fed from the lead 21A to the LED chip 2A via the bonding wire 3A, and the fed current flows to the lead 21E via the base 24A. The other LED chips 2B to 2D are also wired independently by different leads.

(Effect of 11th Embodiment)
According to the light emitting device 20A according to the eleventh embodiment, the following effects can be obtained.
(1) Since the LED chips 2A to 2D can individually emit light, the illumination effect can be improved by changing the light emission color or changing the light emission time or light emission pattern even in the same color.
(2) Since the LED chips 2A to 2D are mounted on different pedestals 24A to 24D to form a decorative lamp, the directivity can be widened. Therefore, since the brightness unevenness is not felt, it does not give a sense of incongruity to the person who sees the object to be decorated. In addition, since the light emitting device 20A can be used as an alternative to a decorative lamp constituted by a light bulb or the like, the life of the lamp can be extended by taking advantage of the LED.
(3) Since a plurality of LED chips 2A to 2E are mounted on different pedestals 24A to 24D, the emission color can be varied depending on the viewing angle, so even one LED lamp is different for many irradiation surfaces. Irradiation with luminescent color is possible. Therefore, the illumination effect can be improved.
(4) The emission angle of emitted light as the light emitting device 20A can be changed by changing the angles of the bases 24A to 24D.

[Twelfth embodiment]
FIG. 17 shows a light emitting device according to a twelfth embodiment of the present invention, in which (a) is a perspective view thereof and (b) is an equivalent circuit thereof. The light emitting device 20B is different from the light emitting device 20A according to the first embodiment in that the cathode side is shared and the lead is single. Since the other points are the same as those of the light emitting device 20A according to the eleventh embodiment, detailed description thereof is omitted.

(Effect of 12th Embodiment)
According to the light emitting device 20B according to the twelfth embodiment, the following effects can be obtained.
(1) Since the LED chips 2A to 2D can emit light by one unit, the illumination effect can be improved by changing the emission color or changing the emission time or the emission pattern even in the same color.
(2) Since the wiring on the cathode side can be made common, the number of leads can be reduced, so that the structure is simplified and the manufacturing cost can be reduced.

[Thirteenth embodiment]
FIG. 18 is a perspective view of a light emitting device according to a thirteenth embodiment of the present invention. This light emitting device 20C is different from the light emitting device 20B according to the twelfth embodiment in that the LED chips 8A to 8D are of a type in which electrodes are provided on one side of the chip. That is, the leads 21A to 21D are connected to the LED chips 8A to 8D through the bonding wires 3A to 3D, respectively. The LED chips 8A to 8D and the lead 21E are common supports in which the bonding wires 30A to 30D are connected to the lead 21E. Connect to the body 27. Since the other points are the same as those of the light emitting device 20B according to the twelfth embodiment, detailed description thereof is omitted.

(Effect of 13th Embodiment)
According to the light emitting device 20C according to the thirteenth embodiment, the following effects can be obtained.
(1) Since the LED chips 2A to 2D can emit light by one unit, the illumination effect can be improved by changing the emission color or changing the emission time or the emission pattern even in the same color.
(2) Even in the type where the electrode is provided on one side of the chip, the wiring on the cathode side can be made common, so the number of leads can be reduced, the structure is simplified, and the manufacturing cost is reduced. can do.

[Fourteenth embodiment]
FIG. 19 shows a light emitting device according to a fourteenth embodiment of the present invention, in which (a) is a perspective view thereof and (b) is an equivalent circuit thereof. The light emitting device 20D is different from the light emitting device 20C according to the thirteenth embodiment in that the LED chips 2A to 2D are provided with electrodes on the upper and lower surfaces thereof, and from one lead 21A via bonding wires 3A and 3D. The difference is that power is supplied to the two LED chips 2A and 2D, and power is supplied to the two LED chips 2B and 2C from the lead 21B via the bonding wires 3B and 3C. Since the other points are the same as those of the light emitting device 20C according to the thirteenth embodiment, detailed description thereof is omitted.

(Effect of 14th Embodiment)
According to the light emitting device 20D according to the fourteenth embodiment, power is supplied from one lead 21A to the two LED chips 2A and 2D, and power is supplied from the one lead 21B to the two LED chips 2B and 2C. Since the number of leads can be reduced, the structure is simplified and the manufacturing cost can be reduced.

[Fifteenth embodiment]
FIG. 20 shows a light emitting device according to a fifteenth embodiment of the present invention, in which (a) is a perspective view thereof and (b) is an equivalent circuit thereof. The light emitting device 20E is different from the light emitting device 20D according to the fourteenth embodiment in that the LED chips 8A to 8D are of a type in which electrodes are provided on one side of the chip. Since other points are the same as those of the light emitting device 20D according to the fourteenth embodiment, detailed description thereof is omitted.

(Effect of 15th Embodiment)
According to the light emitting device 20E according to the fifteenth embodiment, the following effects can be obtained.
(1) Since power is supplied from one lead 21A to the two LED chips 8A and 8D and power is supplied from the one lead 21B to the two LED chips 8B and 8C, the number of leads can be reduced. This simplifies the manufacturing cost.
(2) Even in the type where the electrode is provided on one side of the chip, the wiring on the cathode side can be made common, so the number of leads can be reduced, the structure is simplified, and the manufacturing cost is reduced. can do.

[Sixteenth embodiment]
FIG. 21 shows a light emitting device according to a sixteenth embodiment of the present invention, wherein (a) is a perspective view thereof and (b) is an equivalent circuit thereof. The light emitting device 20F is different from the light emitting device 20A according to the eleventh embodiment in that the LED chips 8A to 8D are of a type in which electrodes are provided on one side of the chip. Since the other points are the same as those of the light emitting device 20A according to the eleventh embodiment, detailed description thereof is omitted.

(Effect of 16th Embodiment)
According to the light emitting device 20F according to the sixteenth embodiment, the LED chips 8A to 8D can individually emit light even if the electrodes are provided on one side of the chip. Even in the same color, it is possible to improve the illumination effect by changing the light emission time or the light emission pattern.

[Seventeenth embodiment]
FIG. 22 shows a light emitting device according to a seventeenth embodiment of the present invention, in which (a) is a perspective view thereof and (b) is an equivalent circuit thereof. The light emitting device 20G is different from the light emitting device 20A according to the eleventh embodiment in that the two LED chips 8A and 8B are fed by one lead 21A, and the two LED chips 8C and 8D are fed by the lead 21B. The LED chips 8A to 8D are different from each other in that the electrodes are provided on one side of the chip. Since the other points are the same as those of the light emitting device 20A according to the eleventh embodiment, detailed description thereof is omitted.

(Effect of 17th Embodiment)
According to the light emitting device 20G according to the seventeenth embodiment, power is supplied to the two LED chips 8A and 8B by one lead 21A, and power is supplied to the two LED chips 8C and 8D by the lead 21B. Since the number of leads can be reduced, the structure is simplified and the manufacturing cost can be reduced. Moreover, since the LED chip can emit light in a plurality of units, the illumination effect can be improved by changing the light emission color or changing the light emission time or light emission pattern even in the same color.

[Other embodiments]
In the seventeenth embodiment, LED chips 8A to 8D in which electrodes are provided on one side may be changed to LED chips in which electrodes are provided on the upper and lower surfaces. With this configuration, the number of leads can be reduced, so that the structure is simplified and the manufacturing cost can be reduced. Moreover, since the LED chip can emit light in a plurality of units, the illumination effect can be improved by changing the emission color or changing the emission time or the emission pattern even in the same color.

  The embodiment of the present invention has been described in detail above, but the specific configuration is not limited to each embodiment, and the present invention can be changed even if there is a design change without departing from the gist of the present invention. included. For example, in the light emitting device according to each embodiment, a partition plate may be provided between the LED chips when it is desired to separate the emission colors more clearly. In the light emitting device according to each embodiment, the example applied to the decorative lamp has been described. However, the present invention is not limited to this and can be applied to general lamps. Moreover, in the light emitting device according to each embodiment, the example in which 4 to 5 LED chips are used has been described.

  In addition, as described above, there are a discrete type and a surface mount type as the light emitting device, and it is possible to select whether the lead is common or individual, and not only one LED chip but also a plurality of LED chips from one lead. There are LED chips that are provided with electrodes on the top and bottom or one side of the chip, and it is preferable to combine these appropriately.

1 is a perspective view showing a light emitting device according to a first embodiment of the present invention. 1 is a plan view of a light emitting device according to a first embodiment of the present invention. It is a figure which shows the equivalent circuit of the light-emitting device which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the light-emitting device which concerns on the 2nd Embodiment of this invention. The light-emitting device which concerns on the 2nd Embodiment of this invention is shown, (a) is the front view, (b) The top view. It is a figure which shows the equivalent circuit of the light-emitting device which concerns on the 2nd Embodiment of this invention. The light-emitting device which concerns on the 3rd Embodiment of this invention is shown, (a) is the top view, (b) is the perspective view. It is a figure which shows the equivalent circuit of the light-emitting device which concerns on the 3rd Embodiment of this invention. The light-emitting device which concerns on the 4th Embodiment of this invention is shown, (a) is the top view, (b) is the figure which shows the equivalent circuit. The light-emitting device which concerns on the 5th Embodiment of this invention is shown, (a) is the top view, (b) is the figure which shows the equivalent circuit. The light-emitting device which concerns on the 6th Embodiment of this invention is shown, (a) is the top view, (b) is the figure which shows the equivalent circuit. It is a perspective view of the light-emitting device which concerns on the 7th Embodiment of this invention. The light-emitting device which concerns on the 8th Embodiment of this invention is shown, (a) is the perspective view, (b) is the figure which shows the equivalent circuit. The light-emitting device which concerns on the 9th Embodiment of this invention is shown, (a) is the perspective view, (b) is the figure which shows the equivalent circuit. It is a perspective view of the light-emitting device which concerns on the 10th Embodiment of this invention. The light-emitting device based on the 11th Embodiment of this invention is shown, (a) is the perspective view, (b) is the top view, (c) is the figure which shows the equivalent circuit. The light-emitting device based on the 12th Embodiment of this invention is shown, (a) is the perspective view, (b) is the figure which shows the equivalent circuit. It is a perspective view of the light-emitting device concerning the 13th Embodiment of this invention. The light-emitting device based on the 14th Embodiment of this invention is shown, (a) is the perspective view, (b) is the figure which shows the equivalent circuit. The light-emitting device based on the 15th Embodiment of this invention is shown, (a) is the perspective view, (b) is the figure which shows the equivalent circuit. FIG. 21 shows a light emitting device according to a sixteenth embodiment of the present invention, wherein (a) is a perspective view thereof and (b) is an equivalent circuit thereof. FIG. 22 shows a light emitting device according to a seventeenth embodiment of the present invention, in which (a) is a perspective view and (b) is an equivalent circuit thereof.

Explanation of symbols

1A to 1D Lead 2A to 2E LED chip 3A to 3E Bonding wire 4 Common conductive support 4A to 4D Side surface 4E Top surface 8A to 8D LED chip 10A to 10J Light emitting device 11 Sealing resin 12 Common conductive support 12A to 12D Slope 13A -13D Conductive supports 20A-20G Light emitting devices 21A-21H Leads 24A-24D Base 25 Sealing resin 26 Insulating substrate

Claims (9)

A plurality of common or individual conductive supports provided in different orientations and having a plurality of LED mounting surfaces on which LED chips are mounted;
A plurality of LED chips having first and second electrodes and mounted by electrically connecting the first electrodes to the plurality of LED mounting surfaces of the conductive support;
A light emitting device comprising: a plurality of individual conductors connected to the second electrodes of the plurality of LED chips via bonding wires.   The light emitting device according to claim 1, wherein the conductive support has the plurality of LED mounting surfaces on a plurality of side surfaces or a plurality of inclined surfaces.   The light emitting device according to claim 2, wherein the conductive support has the LED mounting surface on a top surface.   The light-emitting device according to claim 1, wherein the conductive support has a plurality of support portions that are joined via an insulator and have the LED mounting surface.   The plurality of individual conductors include individual conductors in which the second electrodes of the plurality of LED chips are connected in common via the plurality of bonding wires. Light emitting device.   The light emitting device according to claim 1, wherein the plurality of LED chips are configured by a combination of LED chips that emit different colors.   The light emitting device according to claim 1, wherein the plurality of LED chips are configured by a combination of LED chips that emit light of the same color.   The light emitting device according to claim 1, wherein the conductive support and the plurality of individual conductors are led out in parallel in the same direction.   The light emitting device according to claim 1, wherein the plurality of individual conductors are led out in a direction perpendicular to a direction of the conductive support.