JP2006080281A - Stage apparatus, gas bearing apparatus, exposure apparatus, and device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To appropriately manage a floating amount of a stage and a bending amount of a stage with respect to a surface plate in a stage apparatus that supports the floating surface by gas pressure.
A stage apparatus includes a stage 220 that moves on a surface plate 210, and a levitation mechanism that performs gas supply and gas suction to the stage 220 through the surface plate 210, and levitates and supports the stage 220 with respect to the surface plate 210. With. The levitation mechanism includes a plurality of gas suction paths 322 and 323 where the suction locations 322a and 323a on the surface plate 210 with respect to the stage 220 are separated from each other, and a path used for gas suction among the plurality of gas suction paths 322 and 323. And controllers 331 and 332 for selecting.
[Selection] Figure 4

Description

  The present invention relates to a stage apparatus and an exposure apparatus, and more particularly to a technique for floatingly supporting a stage on a base.

  In an exposure apparatus (microlithography apparatus), illumination light (energy rays such as ultraviolet rays, X-rays, and electron beams) is irradiated onto a mask or the like on which a circuit pattern is drawn, so that the projection has the same magnification, a predetermined reduction magnification or enlargement magnification. Projection exposure is performed on a sensitive substrate (such as a semiconductor wafer or a glass plate coated with a resist layer) through an imaging system to form a circuit pattern of a semiconductor device, a liquid crystal display device, or the like. In such an exposure apparatus, a stage device is provided for placing a mask and a sensitive substrate and precisely moving in one or two dimensions within a plane (XY plane) under position servo control by a laser interferometer.

  Regarding stage devices, to avoid disturbances such as vibrations, a technology is known that supports the stage on which a substrate (mask or sensitive substrate) is placed in a floating manner with respect to the base using gas pressure (usually air pressure). It has been. The stage levitation technology obtains the levitation force of the stage by controlling the gas pressure in the gap (bearing part) between the stage and the base. In general, the stage levitation technique is used for gas supply or gas suction to the stage supported by levitation. Piping (such as a flexible tube) is directly connected.

  In the stage levitation technique, if the pipe is directly connected to the stage, the arrangement state of the pipe changes as the stage moves, so that a relatively large space is required for the pipe. Further, the change in the arrangement state of the piping may change the load on the stage, which may lead to a decrease in the position controllability of the stage.

On the other hand, there is a technique of supplying gas or sucking gas to the stage through a base for the purpose of reducing piping directly connected to the stage or reducing the number of piping (for example, see Patent Document 1). This stage levitation technique performs gas supply or gas suction to a gap (bearing portion) between the stage and the base through a hole provided in the base, and has an advantage that a relatively large levitation force can be easily obtained.
JP 2001-20951 A

  In such a stage flying technique, it is important to manage the flying height of the stage relative to the base, that is, the distance between the base and the stage. In particular, in the technique of supplying gas or sucking gas through the base, it is easy to obtain a relatively large levitation force, but it is necessary to appropriately suppress the lift of the stage and the bending of the stage.

The present invention has been made in view of the above circumstances, and an object of the present invention is to appropriately manage the floating amount of the stage and the bending amount of the stage with respect to the base in the stage apparatus that supports the floating surface by gas pressure.
Another object of the present invention is to provide an exposure apparatus capable of realizing highly accurate exposure.

  To achieve the above object, a stage apparatus according to the present invention includes a stage (220) that moves on a base (210), gas supply and gas suction to the stage through the base, and A levitation mechanism that levitates and supports the base, wherein the levitation mechanism includes a plurality of gas suction paths (322, 323) where the suction locations (322a, 323a) on the base with respect to the stage are separated from each other; And a controller (331, 332) for selecting a path used for the gas suction from the plurality of gas suction paths.

  In this stage apparatus, the gas pressure in the gap between the stage and the base is controlled by the levitating mechanism, and the stage is levitated and supported with respect to the base. In addition, a path to be used for gas suction is selected from among a plurality of gas suction paths by the controller, thereby optimizing the suction location on the base with respect to the stage. By optimizing the suction location, it is possible to appropriately manage the flying height of the stage relative to the base and the bending amount of the stage.

  The stage (220) holds the held member (R) by suction, and the controller (331, 332) is configured to hold the held member by the stage between the holding time and the non-holding time. The route may be selected.

  In this case, for example, the plurality of gas suction paths (322, 323) include the first gas suction path (322) used only for gas suction with respect to the stage (220) and the gas suction with respect to the stage. A second gas suction path (323) used for adsorbing and holding the held member, and the controller (331, 332) is configured to hold the second gas suction path ( 323) is selected, and the first gas suction path (322) is selected when the held member is not held.

  As a result, gas suction at a portion opened to the atmosphere, that is, useless gas suction is avoided, and reliable gas suction to the stage becomes possible. As a result, it is possible to appropriately manage the flying height of the stage relative to the base. In addition, since one gas suction path is used each time the held member is held and not held, the gas suction force with respect to the stage hardly changes, and the bending amount of the stage can be easily managed.

  The plurality of gas suction paths (322, 323) include a first gas suction path (322) used only for gas suction with respect to the stage (220), and the held member in addition to gas suction with respect to the stage. A second gas suction path (323) used for adsorbing and holding the first gas suction path (323) when the controller (331, 332) holds the held member (R) by the stage. 322) and the second gas suction path (323) may be selected, and the first gas suction path (322) may be selected when the held member is not held.

  When holding the member to be held, by using a plurality of gas suction paths and performing gas suction at a plurality of locations on the stage, it becomes possible to more appropriately manage the bending amount of the stage.

In this case, at least one of the gas supply pressure and the gas suction pressure can be changed between when the held member (R) is held and when it is not held.
As a result, even if the number of gas suction paths used changes between when the member to be held is held and when it is not held, it is possible to suppress a change in the amount of bending of the stage that accompanies it.

In the stage device, the stage (220) includes a static gas bearing (307) that is a region that receives a levitation force associated with the gas supply, and a recess (for forming a negative pressure space associated with the gas suction). 302, 303), the gas static pressure bearing (307) extends in a predetermined direction, the recesses (302, 303) are adjacent to the gas static pressure bearing and the gas static pressure bearing (307). It can be set as the structure extended in the same direction as a pressure bearing.
In this case, for example, the recess may include two grooves (302, 303) disposed on both sides of the gas hydrostatic bearing (307).
For example, the static gas bearing (307) is provided with a predetermined interval in the same direction as the extending direction of the static gas bearing and by a predetermined length in the same direction as the extending direction. A plurality of gas ejection grooves (306) can be provided.
Thereby, sufficient levitation force is generated in the gas hydrostatic bearing, and the pressure (positive pressure) remaining in the gas hydrostatic bearing can be surely reduced in a short time via the recess (groove).

  In the stage apparatus, at least one of the gas supply pressure and the gas suction pressure may be controlled so as to correct the curvature of the held member (R) held by the stage (220). Good.

  The gas bearing device of the present invention has a second member (222) that faces the first member (210) and is relatively movable with respect to the first member, the first member, and the second member. At least one gas supply part (321) for supplying a gas to at least a part of a surface facing the member, and at least two gas suction units provided at positions apart from each other, each of which sucks a gas from at least a part of the facing surface A gas suction unit (322, 323) and a controller (331, 332) for independently controlling the suction state of each gas in the at least two gas suction units.

  In this gas bearing device, the gas pressure in the gap between the first member and the second member can be controlled by the gas supply unit, and the second member can be levitated and supported with respect to the first member. Moreover, since the suction state of each gas in the at least two gas suction portions is controlled independently from each other by the controller, the suction state with respect to the second member can be optimized. By optimizing the suction state, the flying height of the second member relative to the first member and the bending amount of the second member can be appropriately managed.

In this case, for example, the controller (331, 332) may control the gas supply state in the gas supply unit (321).
Also, for example, the controller (331, 332) sucks the force and gas acting on the first member (210) by supplying gas before and after the control of the suction state or the supply state. Therefore, the balance with the force acting on the first member may be controlled so as not to change.
Further, for example, the controller (331, 332) may select a suction unit used for gas suction from the at least two gas suction units (322, 323).

Another stage apparatus according to the present invention includes a base member (210) having a guide surface, and a stage (222) having a facing portion facing the guide surface and movable relative to the base member. In the apparatus, the gas bearing device is provided between the guide surface and the facing portion.
In this stage apparatus, the flying height of the stage relative to the base member can be appropriately managed via the gas bearing apparatus.

  The exposure apparatus of the present invention has a mask stage (200) that holds a mask (R) and a substrate stage (200) that holds a substrate (W), and exposes a pattern formed on the mask onto the substrate. In the exposure apparatus, the stage apparatus is used for at least one of the mask stage and the substrate stage.

  Since this exposure apparatus uses a stage apparatus capable of appropriately managing the flying height and bending amount of the stage, a fine pattern can be exposed and transferred onto the substrate with high accuracy.

  According to the stage apparatus of the present invention, the stage can be supported by levitation by gas pressure, and the amount of stage floating and stage bending relative to the base can be appropriately managed.

  According to the gas bearing device of the present invention, the flying height of the second member relative to the first member and the bending amount of the second member can be appropriately managed.

  According to the exposure apparatus of the present invention, a fine pattern can be exposed and transferred onto a substrate with high accuracy, and a micro device having good quality can be manufactured.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a reticle stage device 200 according to the present embodiment, FIG. 2 is an exploded perspective view of the reticle stage device 200, and FIG. 3 is a perspective view and a cross-sectional view showing a stage unit 220.

  As shown in FIG. 1, reticle stage apparatus 200 includes reticle surface plate 210, frame-shaped member 230 arranged to surround reticle stage unit 220, and reticle stage drive system (linear motor 240, Voice coil motor 250) and the like.

  The reticle surface plate (base) 210 is supported substantially horizontally by a support member (not shown). As shown in FIG. 2, the reticle surface plate 210 is formed of a substantially plate-like member, and a protrusion 216a is formed at the approximate center thereof. A rectangular opening 216b whose longitudinal direction is the X-axis direction is formed in the Z-direction so as to allow the exposure illumination light EL to pass through substantially at the center of the protrusion 216a, and the rectangular opening 216b extends in the X-axis direction. On one side and the other side, XZ cross-section inverted L-shaped guide portions 216c and 216d having a longitudinal direction in the Y-axis direction are respectively provided. These guide portions 216c and 216d are provided in a state in which the upper end portion projects outwardly (projected portion 216e, see FIG. 4), and the upper end surface is parallel to the upper surface of the projection 216a.

  As shown in FIG. 3A, the stage portion (moving member) 220 is configured by a substantially rectangular stage main body 222 (slider), four extending portions 224 extending from the stage main body 222 in the Y direction, and the like. Is done.

  The bottom surface (lower surface, −Z side surface) of the extending portion 224 extends from the + Y end portion to the −Y end portion of the extending portion 224 with the L-shaped cross section shown in FIG. Angle plate-like members (hereinafter referred to as “angle members”) 227a and 227b, which are in the longitudinal direction, are fixed. The angle member 227 is actually fixed to the reticle stage main body 222 at a plurality of locations by screw members.

  The angle members 227a and 227b are engaged with the upper projecting portions of the guide portions 216c and 216d (see FIG. 2) of the reticle surface plate 210 from the side and below through predetermined clearances. That is, the angle members 227a and 227b are arranged so that the upper protrusions of the guide portions 216c and 216d are held by the angle members 227a and 227b and the stage main body 222 from both sides in the X-axis direction.

  In addition, static gas bearings are formed on the bottom surface (the surface on the −Z side) of the extended portion 224, respectively. The stage portion 220 is levitated and supported in a non-contact manner on the reticle surface plate 210 via a clearance of about several microns by the gas hydrostatic bearing. In addition, the structure (levitation mechanism) of the stage part 220 and the reticle surface plate 210 relating to the hydrostatic bearing will be described later.

  The stage unit 220 is made of a lightweight and highly rigid material, for example, MMC (metal matrix composite: Metal Matrix Composite: a composite of metal and ceramic (aluminum alloy or metal silicon as a matrix material, and various ceramic reinforcing materials therein). It is integrated by composite material)). However, in the following description, in order to make the description easy to understand, an expression as if each part is a separate member may be used as necessary. Any one of the above-described parts may be configured as a separate member from the other, or all may be configured as separate members.

  A pair of Y moving mirrors 233a and 233b made of a corner cube is fixed to the end portion of the stage portion 220 in the -Y direction, and the Y moving mirrors 233a and 233c are provided by interferometers 235a to 235c (see FIG. 11) provided outside. By measuring the position in the Y direction of 233b, the position in the Y direction of the stage unit 220 (reticle R) is measured with high accuracy.

  In addition, a stepped opening 223 serving as a passage for the exposure illumination light EL is formed substantially at the center of the stage main body 222, and a reticle R is placed in a stepped portion (a portion dug down by one step) of the stepped opening 223. A reticle holder (mounting surface) 225 that sucks and holds from the lower side is provided. Furthermore, four (two on each side) reticle clamps 270 are arranged along both sides of the stepped opening 223 in the X direction.

  In the stage unit 220, the mover unit 244 of the linear motor 240 is disposed on both sides in the X direction of the stepped opening 223. As shown in FIG. 3B, the mover unit 244 has a pair of magnetic pole units 244 a and 244 b embedded in the upper and lower surfaces of the stage main body 222. Furthermore, the mover unit 254 of the voice coil motor 250 is disposed at the end in the X direction. As the mover unit 254, a plate-like permanent magnet 254a is used.

  The reticle stage drive system includes a pair of linear motors 240 that drive the stage unit 220 in the Y direction and finely drive it in the θz direction, and a voice coil motor 250 that finely drives the stage unit 220 in the X direction. The pair of linear motors 240 includes a stator unit 242 and a mover unit 244 described above that are installed in the Y direction on both sides in the X direction inside the frame-shaped member 230. The voice coil motor 250 includes a stator unit 252 and a mover unit 254 described above that are installed in the Y-axis direction on the −X side of the frame-shaped member 230.

  The stator unit 242 includes a pair of Y-axis linear guides 242a and 242b whose longitudinal direction is the Y-axis direction. The stator unit 242 is opposed to each other with a predetermined interval in the Z direction and is held parallel to the XY plane. It is fixed to the inner wall surface of the frame-shaped member 230. A plurality of armatures are arranged at predetermined intervals in the Y-axis direction inside the Y-axis linear guides 242a and 242b. The magnetic pole units 244a and 244b of the stage unit 220 are arranged between the Y-axis linear guides 242a and 242b via a predetermined clearance.

  The stator unit 252 includes a pair of armature units 252a and 252b whose longitudinal direction is the Y-axis direction. The stator unit 252 is opposed to each other at a predetermined interval in the Z direction and is held in parallel with the XY plane. The inner member 230 is fixed to the inner wall surface. A permanent magnet 254a of the stage unit 220 is disposed between the armature units 252a and 252b with a predetermined clearance.

  In this manner, the moving magnet type linear motor 240 that can move the stage unit 220 in the Y direction is configured by the Y-axis linear guides 242a and 242b and the magnetic pole units 244a and 244b. Further, the armature units 252a and 252b and the permanent magnet 254a constitute a moving magnet type voice coil motor 250 capable of minutely moving the stage unit 220 in the X direction.

  When a current is supplied to the armature coils in the Y-axis linear guides 242a and 242b, a driving force that drives the stage unit 220 in the Y direction is generated. Further, when a current in the Y-axis direction flows through the armature coils constituting the armature units 252a and 252b, a driving force for driving the stage unit 220 in the X direction is generated.

  The frame-shaped member 230 has a gas hydrostatic bearing formed on the lower surface thereof. Thereby, the frame-like member 230 is levitated and supported on the reticle surface plate 210 in a non-contact manner through a clearance of about several microns. Also, movers 261, 263, 265, 267 made of a magnetic unit are provided on the + X side surface and the + Y side surface of the frame-shaped member 230. Corresponding to these movers 261, 263, 265, 267, the reticle surface plate 210 is provided with stators 262, 264, 266, 268 made of armature units via a support base 212. The movers 261, 263, 265, and 267 are provided with permanent magnets therein, and form a magnetic field in the Z direction. The stators 262 and 264 have armature coils therein and are formed so that current flows in the Y direction. The stators 266 and 268 have armature coils therein and are formed so that current flows in the X direction.

  Therefore, the movers 261 and 263 and the stators 262 and 264 constitute a trim motor 260X for driving in the X-axis direction, which is a moving magnet type voice coil motor. Similarly, the movers 265 and 267 and the stators 266 and 268 constitute a trim motor 260Y for driving in the Y-axis direction, which is a moving magnet type voice coil motor. As described above, the four trim motors 260X and 260Y can drive the frame-like member 230 in three degrees of freedom in the X-axis direction, the Y-axis direction, and the θz direction. Further, window glasses 232 and 234 are fitted on the side walls in the −X direction and the −Y direction of the frame-shaped member 230, respectively, and the length measuring beams from the laser interferometers 235 a to 235 c that measure the position of the stage unit 220. Can be transmitted.

  The position of the stage unit 220 in the Y direction is performed by irradiating the Y movable mirrors 233a and 233b with the measurement beams emitted from the laser interferometers 235a to 235c through the window glass 234 and detecting the reflected light. . The position of the stage unit 220 in the X direction and the θz direction is performed by irradiating a plurality of length measuring beams to an X fixed mirror (not shown) fixed to the reticle surface plate 210 and detecting the reflected light. . The X fixed mirror is formed in a long shape along the Y direction so as to cover the moving range of the stage unit 220, and is installed outside the frame-shaped member 230. The length measurement beam that has passed through the window glass 234 has its optical path bent by approximately 90 degrees by an optical element fixed to the stage unit 220, and then passes through the window glass 232 to reach the X fixed mirror. In addition, the window glass 232 and 234 may not be provided on the frame-shaped member 230, and the length measurement beam emitting portion and the X-fixed mirror may be disposed inside the frame-shaped member 230 (inside the frame).

  In reticle stage apparatus 200 configured as described above, the reaction force accompanying the movement of stage unit 220 is canceled by the movement of frame-shaped member 230. For example, when the stage unit 220 is driven in the X-axis direction, the mover of the voice coil motor 250 is driven in the X-axis direction integrally with the stage unit 220, and the reaction force of this driving force is the stator of the voice coil motor 250. (Armature units 252a and 252b) and the frame-like member 230 to which the stator is fixed. Since the frame-shaped member 230 is supported in a non-contact manner with respect to the reticle surface plate 210 via a predetermined clearance, the frame-shaped member 230 has a distance according to the law of conservation of momentum by the action of the reaction force described above. Only move in the direction according to the reaction force. Similarly, when driven in the Y-axis direction, the frame-shaped member 230 moves according to the law of conservation of momentum. In particular, since the frame-shaped member 230 is formed so as to surround the stage portion 220, the size is inevitably increased and the weight thereof is increased. Therefore, the weight ratio with the stage part 220 can be increased. For this reason, the moving distance of the frame-like member 230 is relatively short.

Next, the floating mechanism of the stage unit 220 will be described with reference to FIGS.
FIG. 4 is a diagram showing a floating mechanism of the stage unit 220, and schematically shows a cross section in the vicinity of the guide unit 216 d of the reticle surface plate 210 and the angle member 227 b of the stage main body 222. 5 is a cross-sectional view taken along line AA shown in FIG.

  As shown in FIG. 4, the bottom surface (the lower surface, the surface on the −Z side) of the stage main body 222 is formed with a first groove formed with a predetermined depth at a position facing the upper surface of the guide portion 216 d of the reticle surface plate 210. A groove 301, a second groove 302, and a third groove 303 are provided. As shown in FIG. 5, these grooves 301, 302, and 303 are provided so as to extend in the Y axis direction to the vicinity of both ends in the Y direction of the extending portion 224 of the stage main body 222, and are mutually X They are separated from each other by a predetermined distance in the direction and are parallel to each other. In the present embodiment, the widths and depths of the grooves 301, 302, and 303 are approximately the same as each other. The shapes of the grooves 301, 302, and 303 are not limited to the above, and for example, the width and depth may be different from each other. As will be described later, the first groove 301 is used for gas supply in the floating support of the stage body 222, and the second groove 302 and the third groove 303 are used for gas suction (gas discharge) in the floating support.

  As shown in FIG. 4, a fourth groove 304 made of a concave groove having a predetermined depth is provided on the upper surface of the angle member 227 b of the stage main body 222 at a position facing the first groove 301. The extension length, width, and depth of the fourth groove 304 are substantially the same as those of the first groove 301. As will be described later, the fourth groove 304 is used for gas supply in the floating support of the stage body 222.

  In addition, an air release groove 305 extending in the Y direction is provided between the first groove 301 and the second groove 302 on the bottom surface of the stage main body 222. The air release groove 305 is narrower than the grooves 301, 302, and 303, and both ends in the Y-axis direction are open.

  Furthermore, a plurality of gas ejection grooves 306 extending in the Y direction are provided between the second groove 302 and the third groove 303 on the bottom surface of the stage main body 222. The plurality of gas ejection grooves 306 are spaced apart from each other by a predetermined distance in the Y direction on the same straight line, each extends a predetermined length in the Y-axis direction, and are narrower than the grooves 301, 302, and 303. A region between the second groove 302 and the third groove 303 in which the plurality of gas ejection grooves 306 are provided on the bottom surface of the stage main body 222 is a gas static pressure bearing 307 (air pad).

  As shown in FIG. 4, the first groove 301 and each gas ejection groove 306 are communicated with each other via a ventilation path 310. In practice, the ventilation path 310 includes pores, connectors, piping tubes, and the like. One ventilation path 310 may be provided for each gas ejection groove 306, or a plurality of ventilation paths 310 may be provided.

  Further, a suction hole 315 for sucking and holding the reticle R is provided on the upper surface of the stage body 222. The suction hole 315 communicates with the third groove 303 via the ventilation path 316.

  Here, as described with reference to FIGS. 2 and 3, the protrusion 216a of the reticle surface plate 210 is provided with the guide portion 216c on one side in the X-axis direction, and the guide portion 216d on the other side. Is provided. Correspondingly, the stage body 222 is provided with an angle member 227a on one side in the X-axis direction and an angle member 227b on the other side. FIGS. 4 and 5 show the state in the vicinity of the guide portion 216d and the angle member 227b on the + X side, respectively, but the vicinity of the guide portion 216d and the angle member 227b on the −X side also includes a similar floating mechanism. Both structures are generally symmetrical.

  Returning to FIG. 4, the gas supply path 321 for supplying gas to the first groove 301 and the first gas suction for sucking gas to the second groove 302 are provided in the guide portion 216 d and the protrusion 216 a of the reticle base plate 210. A path 322 and a second gas suction path 323 for gas suction with respect to the third groove 303 are provided. Each of the gas supply path 321 and the gas suction paths 322 and 323 includes a pore, a connector, a piping tube, and the like.

  The gas supply path 321 includes a first jet port 321a provided at the upper end surface of the projecting portion 216e in the X direction of the guide portion 216d in the reticle surface plate 210, and a second jet port 321b provided at the lower end surface of the projecting portion 216e. including. The first jet port 321a is provided at a position facing the first groove 301 of the stage main body 222 on the upper end surface of the overhang portion 216e. The second jet port 321b is a position opposite to the first jet port 321a across the projecting portion 216e on the lower end surface of the projecting portion 216e, and a position facing the fourth groove 304 of the angle member 227b of the stage body 222. Is provided.

  The gas supply path 321 is connected via a control valve 330 to a gas supply device 325 that is a supply source of a predetermined gas such as nitrogen or a rare gas (for example, helium gas). The pressurized gas supplied from the gas supply device 325 is ejected from each of the first ejection port 321a and the second ejection port 321b. The gas ejected from the first ejection port 321a is once received by the first groove 301, and further, the gas continues to be ejected from the first ejection port 321a, so that the gas reaches the entire first groove 301, and the first When the static pressure of the gas in the groove 301 reaches a certain level, the gas is supplied to each gas ejection groove 306 via the ventilation path 310. Due to the gas ejection from the gas ejection groove 306, the pressure (static pressure, pressure in the gap) between the bottom surface of the stage main body 222 and the upper surface of the reticle surface plate 210 increases in the region of the gas static pressure bearing 307, and the pressure is increased to a certain level. As a result, the stage main body 222 is levitated and supported with respect to the reticle surface plate 210.

  At this time, the jet gas from the first jet port 321a in the overhanging portion 216e presses the stage body 222 upward via the first groove 301, and the jet gas from the second jet port 321b passes through the fourth groove 304. The stage main body 222 is pressed downward. Therefore, the upward force due to the gas acting on the first groove 301 is almost offset by the downward force due to the gas acting on the fourth groove 304, and as a result, the stage body 222 is prevented from floating more than necessary. That is, the weight of the stage unit 220 is supported by the pressure in the gas hydrostatic bearing 307. Note that the pressure (positive pressure) remaining in the gas hydrostatic bearing 307 is appropriately reduced via the gas suction paths 322 and 323.

  The gas suction paths 322 and 323 are connected to a vacuum pump 326 via control valves 331 and 332, respectively. The vacuum pump 326 is connected to a gas recovery device (not shown). The first gas suction path 322 and the second gas suction path 323 are independent of each other. The first gas suction path 322 includes a first suction port 322a provided on the upper end surface of the guide part 216d in the reticle surface plate 210, and the second gas suction path 323 is formed on the upper end surface of the guide part 216d in the reticle surface plate 210. A second suction port 323a is provided. The first suction port 322a is provided at a position facing the second groove 302 of the stage main body 222 on the upper end surface of the guide portion 216d. The second suction port 323a is provided at a position facing the third groove 303 of the stage main body 222 on the upper end surface of the guide portion 216d. That is, the first suction port 322 a and the second suction port 323 a are provided at positions adjacent to the static gas bearing 307, respectively. In other words, the first suction port 322a and the second suction port 323a are arranged symmetrically on both sides of the gas static pressure bearing 307 and spaced apart from each other in the X direction.

  The reason why the gas suction grooves 302 and 303 and the suction ports 322a and 323a are provided at positions adjacent to the gas hydrostatic bearing 307 is that the gas in the gas hydrostatic bearing 307 is directly sucked and remains in the gas hydrostatic bearing 307. The purpose is to reduce the pressure (positive pressure) to be applied reliably and in a short time. However, the arrangement positions of the suction ports 322a and 323a are not limited to the above. For example, both the second groove 302 and the third groove 303 for gas suction are provided side by side on one side in the X direction (for example, + X side) with respect to the gas static pressure bearing 307, and suction is performed correspondingly. The ports 322a and 323a may be provided side by side on one side (for example, + X side) in the X direction with respect to the hydrostatic bearing 307.

FIG. 6 is a diagram schematically showing how the gas suction paths 322 and 323 are switched between when the reticle R is held and when it is not held.
As shown in FIG. 6, in this embodiment, the gas suction paths 322 and 323 are selectively switched between when the reticle R is held and when it is not held. That is, the second gas suction path 323 is used when the reticle R is held, and the first gas suction path 322 is used when the reticle R is not held.

  More specifically, when the reticle R is mounted on the stage main body 222, the control valve 331 of the first gas suction path 322 is closed and the control valve 332 of the second gas suction path 323 is opened. As a result, the pressure in the second gas suction path 323 becomes negative, and the gas in the space facing the third groove 303 is sucked through the second suction port 323a of the second gas suction path 323. By sucking the gas from the position adjacent to the hydrostatic bearing 307, the stage body 222 is reliably prevented from floating more than necessary. Further, since the third groove 303 communicates with the reticle R suction hole 315 via the ventilation path 316, the reticle R is sucked and held on the stage main body 222 by the suction action by the negative pressure. At this time, the inside of the first gas suction path 322 is at atmospheric pressure.

  On the other hand, when the reticle R is not held, such as when the reticle R is replaced, the control valve 331 of the first gas suction path 322 is opened and the control valve 332 of the second gas suction path 323 is closed. Accordingly, the gas in the space facing the second groove 302 is sucked through the first suction port 322a of the first gas suction path 322. At this time, the inside of the second gas suction path 323 is at atmospheric pressure. By sucking the gas from the position adjacent to the hydrostatic bearing 307, the stage body 222 is reliably prevented from floating more than necessary.

  In particular, when the reticle R is not held, the reticle R adsorption suction hole 315 is open to the atmospheric pressure, and therefore it is sufficient to use the second gas suction path 323 communicating with the suction hole 315. Gas suction cannot be performed, the balance between the levitation force and the suction force may be lost, and the stage body 222 may rise excessively. When the reticle R is not held, the stage main body is used by using the first gas suction path 322 that is used only for gas suction of the stage main body 222 instead of the second gas suction path 323 that is used together to hold the reticle R by suction. The flying height of 222 can be appropriately managed.

  As the control valves 331 and 332, for example, electromagnetic valves are used. In this case, an electromagnetic valve only for opening / closing control may be used, or an electromagnetic valve for flow control may be used. Further, switching between the first gas suction path 322 and the second gas suction path 323 may be performed by one control valve such as a three-way valve. When switching between the first gas suction path 322 and the second gas suction path 323, a time for performing gas suction from both paths is provided (that is, overlapped), thereby preventing a shortage of gas suction that occurs at the time of switching. It is possible. In this case, for example, after confirming that one of the control valves has changed from the closed state to the open state, the other control valve may be changed from the open state to the closed state.

  In addition, since the above-described levitation mechanism is provided on both sides in the X direction of the stage main body 222 that is the mounting portion of the reticle R, a total of four gas suction paths are provided on the left and right. When the reticle R is held, the two inner gas suction paths are used, and when the reticle R is not held, the two outer gas suction paths are used. One control valve may be provided for each of the two inner gas suction paths, or one control valve may be shared. Similarly, one control valve may be provided for each of the two outer gas suction paths, or one control valve may be shared.

  In this example, the stage main body 222 is pressed vertically upward via the gas static pressure bearing 307 in one area, and is suctioned vertically downward via the gas suction paths 322 and 323 in another area. Therefore, a bending moment acts on the stage main body 222. However, since the suction location (second groove 302, third groove 303) with respect to the stage main body 222 is adjacent to the pressing location (gas hydrostatic bearing 307), the distance between the suction location and the pressing location is actually short. The resulting bending moment is very small.

FIG. 7 is a diagram schematically illustrating another example of switching of the gas suction paths 322 and 323 between when the reticle R is held and when it is not held.
7, in this example, both the first gas suction path 322 and the second gas suction path 323 are used when the reticle R is held, and the first gas suction path is used when the reticle R is not held. Only 322 is used.

  That is, when holding the reticle R, both the control valve 331 of the first gas suction path 322 and the control valve 332 of the second gas suction path 323 are opened. On the other hand, when the reticle R is not held, the control valve 331 of the first gas suction path 322 is opened and the control valve 332 of the second gas suction path 323 is closed. In this example, when the reticle R is held, gas suction is performed on both sides of the gas hydrostatic bearing 307, so that there is an advantage that a bending moment is hardly generated with respect to the stage main body 222.

  In the example of FIG. 7, the number of gas suction paths used varies between when the reticle R is held and when it is not held. Therefore, there is a possibility that the negative pressure on the stage main body 222 changes between when the reticle R is held and when it is not held, and the bending amount of the stage main body 222 may change. Therefore, as shown in FIG. 8 or FIG. 9, it is preferable to change at least one of the gas supply pressure and the gas suction pressure between when the reticle R is held and when it is not held.

  In the example of FIG. 8, both the first gas suction path 322 and the second gas suction path 323 are used when holding the reticle R, and only the first gas suction path 322 is used when the reticle R is not held. I use it. Further, in this example, when the reticle R is not held, the gas supply pressure is decreased by an amount corresponding to the decrease in order to compensate for the suction force associated with the decrease in the number of gas suction paths. That is, the balance between the levitation force and the suction force by the gas supply path 321, the first gas suction path 322, and the second gas suction path 323 is maintained between when the reticle R is held and when it is not held. The gas supply pressure (supply amount) in the gas supply path 321 is controlled. As a result, a change in the amount of bending of the stage main body 222 due to a change in the number of used gas suction paths between when the reticle R is held and when it is not held is suppressed.

  In the example of FIG. 9, when the reticle R is not held, the gas suction pressure is increased by an amount corresponding to the decrease in order to compensate for the suction force associated with the decrease in the number of gas suction paths. That is, the balance between the levitation force and the suction force by the gas supply path 321, the first gas suction path 322, and the second gas suction path 323 is maintained between when the reticle R is held and when it is not held. The gas suction pressure (suction amount) in the first gas suction path 322 is controlled. As a result, a change in the amount of bending of the stage main body 222 due to a change in the number of uses of the gas suction path is suppressed between when the reticle R is held and when it is not held.

FIG. 10 shows a modification of the above embodiment.
In the example of FIG. 10, the curvature of the reticle R held by the stage body 222 is corrected by controlling the gas supply pressure or the gas suction pressure. That is, in this example, when the reticle R is held, the vertical upward levitation force Fs by the gas supply path, the vertical downward suction force Fv1 by the inner gas suction path, and the outer gas suction to the stage main body 222. A vertical downward suction force Fv2 by the path is acting, and among these, the suction power Fv1 is increased by controlling the gas suction pressure of the inner gas suction path (Fv1 → Fv1 ′> Fv1). As a result, the bending moment M1 acts on the stage main body 222, the curvature of the stage main body 222 is corrected, and the curvature of the reticle R is corrected accordingly. Note that FIG. 10 is an example, and various shapes of curvature can be corrected by selecting a gas suction location and appropriately changing the balance between the gas supply pressure and the suction pressure.

  Next, an embodiment in which the above-described reticle stage apparatus 200 is applied to the exposure apparatus 100 will be described. FIG. 11 is a schematic diagram showing the exposure apparatus 100.

  The exposure apparatus 100 irradiates the reticle R with exposure illumination light (exposure light) EL, and relatively moves the reticle R and the wafer (plate-like body, substrate) W synchronously in the one-dimensional direction to thereby move the reticle R. A step-and-scan type scanning exposure apparatus, a so-called scanning stepper, which transfers a pattern (circuit pattern or the like) PA formed on the wafer W via the projection optical system 40.

  The exposure apparatus 100 irradiates the wafer W with the exposure illumination system 10 that illuminates the reticle R with the exposure illumination light EL, the reticle stage apparatus 200 that holds the reticle R, and the exposure illumination light EL that is emitted from the reticle R. It includes a projection optical system 40, a wafer stage device 50 for holding the wafer W, a main control system 70 for comprehensively controlling the operation of the exposure apparatus 100, and the like.

  The exposure illumination system 10 includes an optical integrator or the like so that the exposure illumination light EL emitted from the light source 12 irradiates a predetermined illumination region on the reticle R with a substantially uniform illuminance distribution.

  The exposure illumination light EL includes vacuum ultraviolet rays having a wavelength of about 120 nm to about 190 nm, for example, an ArF excimer laser (ArF laser) having an oscillation wavelength of 193 nm, a fluorine laser (F2 laser) having an oscillation wavelength of 157 nm, and a krypton dimer laser having an oscillation wavelength of 146 nm. (Kr2 laser), argon dimer laser (Ar2 laser) having an oscillation wavelength of 126 nm, or the like is used.

  Reticle stage apparatus 200 is provided directly under exposure illumination system 10. The specific configuration of reticle stage apparatus 200 is as described above.

  The projection optical system 40 is formed by sealing a plurality of projection lens systems such as a lens made of a fluoride crystal such as fluorite and lithium fluoride, and a reflecting mirror with a projection system housing (lens barrel). The projection lens system reduces the illumination light emitted through the reticle R by a predetermined projection magnification β (β is, for example, ¼), and converts the image of the pattern PA on the reticle R into a specific region ( Image in the shot area). Each element of the projection lens system of the projection optical system 40 is supported by the projection system housing via a holding member, and each holding member is formed in, for example, an annular shape so as to hold the peripheral edge of each element. (Both not shown).

  The wafer stage device (stage device) 50 includes a wafer holder 52 that holds the wafer W, a wafer stage 53 that can move in the XY plane, and the like. The wafer holder 52 is supported by the wafer stage 53 and holds the wafer W by vacuum suction. The wafer stage 53 is formed by superposing a pair of blocks movable in directions orthogonal to each other on a base 54, and can be moved in an XY plane by a drive unit (not shown).

  Then, the position of the wafer stage 53 in the X direction and the Y direction is sequentially detected by a laser interference measuring length device provided outside and is output to the main control system 70.

  At the end of the wafer holder 52 on the −Y side, a Y moving mirror 56 made of a plane mirror extends in the X direction. A length measurement beam from a Y-axis laser interferometer 57 disposed substantially perpendicularly to the outside is projected onto the Y moving mirror 56, and the reflected light is received by the Y-axis laser interferometer 57. Is detected. Further, the X position of the wafer W is detected by the X-axis laser interferometer with a substantially similar configuration.

  Then, by moving the wafer stage 53 in the XY plane, an arbitrary shot area on the wafer W is positioned at the projection position (exposure position) of the pattern PA on the reticle R, and an image of the pattern PA on the reticle R is formed on the wafer W. Project and transfer.

The main control system 70 controls the exposure apparatus 100 in an integrated manner. For example, an exposure operation in which an image of the pattern PA formed on the reticle R is transferred to a shot area on the wafer W by controlling the exposure amount (exposure light irradiation amount), the positions of the reticle stage apparatus 200 and the wafer stage 53, and the like. Repeat. The main control system 70 is provided with a storage unit 72 for recording various information in addition to a calculation unit 71 for performing various calculations.
This control system is also connected to the aforementioned control valves 331, 332, etc., for example, the open / closed state of the control valves 331, 332 based on information on whether or not the reticle R is held by the stage body 222 of the reticle stage device 200 Are appropriately selected, and the gas supply pressure and suction pressure can be adjusted.

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

  For example, in the above-described embodiment, the example in which the stage apparatus according to the present invention is applied to the reticle stage apparatus has been described, but the present invention may be applied to a wafer stage apparatus.

  In the above embodiment, the step-and-scan type exposure apparatus has been described as an example. However, the present invention can also be applied to a step-and-repeat type exposure apparatus. The illumination optical system 80 of the exposure apparatus according to the present embodiment includes not only an ultrahigh pressure mercury lamp, a KrF excimer laser, an ArF excimer laser, or an F2 laser (157 nm) but also charged particles such as an X-ray and an electron beam. Lines can be used. For example, when using an electron beam, thermionic emission type lanthanum hexabolite (LaB6) and tantalum (Ta) can be used as the electron gun.

  Furthermore, a single wavelength laser beam in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser as a light source is amplified by, for example, a fiber amplifier doped with erbium (or both erbium and yttrium), and nonlinear optics You may use the harmonic which wavelength-converted into the ultraviolet light using the crystal | crystallization. For example, if the oscillation wavelength of a single wavelength laser is in the range of 1.51 to 1.59 μm, the generated wavelength is in the range of 189 to 199 nm, the eighth harmonic, or the generated wavelength is in the range of 151 to 159 nm. A 10th harmonic is output.

  In particular, when the oscillation wavelength is in the range of 1.544 to 1.553 μm, an 8th harmonic in the range of 193 to 194 nm, that is, ultraviolet light having substantially the same wavelength as the ArF excimer laser light is obtained. When the oscillation wavelength is in the range of 1.57 to 1.58 μm, the 10th harmonic wave in the range of 157 to 158 nm, that is, ultraviolet light having substantially the same wavelength as the F2 laser light is obtained. Further, if the oscillation wavelength is in the range of 1.03 to 1.12 μm, a 7th harmonic whose output wavelength is in the range of 147 to 160 nm is output, and in particular, the oscillation wavelength is in the range of 1.099 to 1.106 μm. If it is inside, the 7th harmonic within the range of 157 to 158 μm, that is, ultraviolet light having substantially the same wavelength as the F2 laser light is obtained. In this case, for example, an yttrium-doped fiber laser can be used as the single wavelength oscillation laser.

Further, the present invention is not limited to an exposure apparatus used for manufacturing a semiconductor element, but also used for manufacturing a display including a liquid crystal display element (LCD) and the like, an exposure apparatus for transferring a device pattern onto a glass plate, and a thin film magnetic head. The present invention can also be applied to an exposure apparatus that is used for manufacturing and transfers a device pattern onto a ceramic wafer, and an exposure apparatus that is used to manufacture an image sensor such as a CCD. Furthermore, in an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer in order to manufacture a reticle or mask used in an optical exposure apparatus, EUV exposure apparatus, X-ray exposure apparatus, electron beam exposure apparatus, or the like. The present invention can also be applied. Here, in an exposure apparatus using DUV (far ultraviolet) light, VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. Further, in a proximity type X-ray exposure apparatus or an electron beam exposure apparatus, a transmission mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .
Further, for example, as disclosed in JP-A-10-154659, the present invention may be applied to an immersion exposure apparatus that forms an image on a substrate via a liquid on the substrate.

  The stage of the present invention is not limited to the reticle stage and wafer stage provided in the exposure apparatus, but is also a stage apparatus that moves with the object placed thereon (not limited to one-dimensional movement or two-dimensional movement). In the case of control, it can be applied in general.

  An exposure apparatus to which the present invention is applied assembles various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room in which the temperature, cleanliness, etc. are controlled.

  Next, an embodiment of a microdevice manufacturing method using the above-described exposure apparatus in a lithography process will be described. FIG. 12 is a flowchart showing a manufacturing example of a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, or the like). As shown in FIG. 12, first, in step S10 (design step), a function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and a pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

  Next, in step S13 (wafer processing step), using the mask and wafer prepared in steps S10 to S12, an actual circuit or the like is formed on the wafer by lithography or the like, as will be described later. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

  FIG. 13 is a diagram showing an example of a detailed flow of step S13 of FIG. 13 in the case of a semiconductor device. In FIG. 13, in step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pretreatment process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.

  At each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. Subsequently, in step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), the exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

  In the microdevice manufacturing method described above, since the positional information of the mask and the wafer is measured with high accuracy using the signal processing method described above in the exposure step (step S26), the pattern already formed on the wafer Overlay accuracy with a pattern transferred onto a wafer can be improved, and as a result, a highly integrated device having a minimum line width of about 0.1 μm can be produced with a high yield.

It is a perspective view which shows the reticle stage apparatus based on this invention. It is a disassembled perspective view of a reticle stage apparatus. It is the perspective view and sectional drawing which show a stage part. It is a figure which shows the floating mechanism of a stage part, and has shown typically the cross section of the vicinity of the angle part of the guide part of a reticle surface plate, and a stage main body. It is AA sectional drawing shown in FIG. It is a figure which shows typically the mode of the switching of the gas suction path | route between the time of holding | maintenance of a reticle, and the time of non-holding. It is a figure which shows typically the other example of the switching of the gas suction path | route between the time of holding | maintenance of a reticle, and the time of non-holding. It is a figure which shows the example which changes the supply pressure of gas between the time of holding | maintenance of a reticle, and the time of non-holding. It is a figure which shows the example which changes the suction pressure of gas between the time of holding | maintenance of a reticle, and the time of non-holding. It is a figure for demonstrating the example which correct | amends the curvature of a board | substrate (reticle) by control of the suction pressure of gas. It is a schematic diagram which shows exposure apparatus. It is a flowchart which shows an example of the manufacturing process of a microdevice. It is a figure which shows an example of the detailed flow of FIG.12 S13 in the case of a semiconductor device.

Explanation of symbols

EL: illumination light for exposure, R: reticle (mask, member to be held), W: wafer (substrate), 40: projection optical system, 50: wafer stage device, 70: main control system, 100: exposure device, 200 ... Reticle stage device, 210 ... reticle surface plate (base, first member, base member), 216c, 216d ... guide part, 216e ... projecting part, 220 ... stage part, 222 ... stage main body (second member, stage) 224 ... extension part, 227a, 227b ... angle member, 301 ... first groove, 302 ... second groove, 303 ... third groove, 304 ... fourth groove, 305 ... atmospheric release groove, 306 ... gas ejection groove, 307 ... Static gas bearing, 310, 316 ... Ventilation path, 315 ... Adsorption hole, 321 ... Gas supply path (gas supply part), 321a ... First jet, 321b ... Second jet, 322 ... 1 gas suction path (gas suction section), 323 ... second gas suction path (gas suction section), 322a ... first suction port, 323a ... second suction port, 325 ... gas supply device, 326 ... vacuum pump, 330, 331, 332 ... Control valves (controllers).

Claims (16)

A stage that moves on the base,
A levitation mechanism that performs gas supply and gas suction to the stage through the base and levitates and supports the stage with respect to the base;
The levitation mechanism includes a plurality of gas suction paths where suction points on the base with respect to the stage are separated from each other, and a controller for selecting a path used for the gas suction from the plurality of gas suction paths; A stage device characterized by comprising: The stage is for holding the held member by suction,
The stage device according to claim 1, wherein the controller selects the path between when the held member is held by the stage and when it is not held. The plurality of gas suction paths include a first gas suction path that is used only for gas suction with respect to the stage, and a second gas suction path that is used for sucking and holding the held member in addition to gas suction with respect to the stage. Including,
The controller selects the second gas suction path when the held member is held by the stage, and selects the first gas suction path when the held member is not held. The stage apparatus according to 2. The plurality of gas suction paths include a first gas suction path that is used only for gas suction with respect to the stage, and a second gas suction path that is used for sucking and holding the held member in addition to gas suction with respect to the stage. Including,
The controller selects the first gas suction path and the second gas suction path when the held member is held by the stage, and selects the first gas suction path when the held member is not held. The stage apparatus according to claim 2, wherein:   5. The stage apparatus according to claim 4, wherein at least one of a gas supply pressure and a gas suction pressure is changed between when the held member is held and when it is not held. The stage is provided with a gas static pressure bearing that is a region that receives a levitation force associated with the gas supply, and a recess for forming a negative pressure space associated with the gas suction,
The gas hydrostatic bearing extends in a predetermined direction,
The stage device according to claim 1, wherein the concave portion is adjacent to the gas static pressure bearing and extends in the same direction as the gas static pressure bearing.   The stage device according to claim 6, wherein the concave portion includes two grooves arranged on both sides of the gas hydrostatic bearing.   The gas hydrostatic bearing has a plurality of gas jets provided at predetermined intervals in the same direction as the extending direction of the gas hydrostatic bearing and extending by a predetermined length in the same direction as the extending direction. The stage apparatus according to claim 6 or 7, wherein a groove is provided.   9. At least one of a gas supply pressure and a gas suction pressure is controlled so as to correct the curvature of the held member held on the stage. The stage apparatus as described. A second member facing the first member and movable relative to the first member;
At least one gas supply unit for supplying gas to at least a part of the opposing surfaces of the first member and the second member;
At least two gas suction portions provided at positions separated from each other, each sucking gas from at least a part of the facing surface;
A gas bearing device comprising: a controller that controls the suction state of each gas in the at least two gas suction units independently of each other.   The gas bearing device according to claim 10, wherein the controller controls a gas supply state in the gas supply unit.   The controller includes a force acting on the first member by supplying gas and a force acting on the first member by sucking gas before and after the control of the suction state or the supply state. The gas bearing device according to claim 10 or 11, wherein the balance is controlled so as not to change.   The gas bearing device according to any one of claims 10 to 12, wherein the controller selects a suction unit used for gas suction from the at least two gas suction units. In a stage apparatus comprising a base member having a guide surface, and a stage having a facing portion facing the guide surface and movable relative to the base member,
A stage apparatus, wherein the gas bearing device according to any one of claims 10 to 13 is provided between the guide surface and the facing portion. An exposure apparatus having a mask stage for holding a mask and a substrate stage for holding a substrate, and exposing the pattern formed on the mask onto the substrate,
An exposure apparatus using the stage apparatus according to any one of claims 1 to 9 and 14 as at least one of the mask stage and the substrate stage. A device manufacturing method comprising a lithography step of forming a predetermined pattern on an object using the exposure apparatus according to claim 15.

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