JP2006060281A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator which is made small-sized and multifunctional. <P>SOLUTION: The piezoelectric oscillator 30 is constituted so that a circuit element 50 is laminatingly arranged on an external surface side of a package 61 which stores a piezoelectric vibration piece 32 inside and which is sealed with a cover body 63, so that the circuit element 50 is mounted on a substrate 60, wherein the circuit element 50 has insulating films 71 and 72 formed on the side of one surface 81 opposed to the external surface of the package 61 and also has a wiring part 73 which can electrically connect a terminal of the circuit element 50 and a terminal on the side of the package 61. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a piezoelectric oscillator in which a piezoelectric vibration piece is accommodated inside and a circuit element is placed on an outer surface side of a package sealed with a lid.

Piezoelectric oscillators are widely used in small information devices such as HDDs (hard disk drives), mobile computers, or IC (integrated circuit) cards, and mobile communication devices such as mobile phones, car phones, and paging systems. ing.
Some conventional piezoelectric oscillators contain a piezoelectric vibrating piece and a plurality of IC (integrated circuit) substrates in the internal space of a package. The plurality of IC substrates are accommodated inside the package, and a piezoelectric vibrating piece is further accommodated on these IC substrates. These piezoelectric vibrating pieces and the plurality of IC substrates are sealed in the internal space of the package (see, for example, Patent Document 1).
JP 2001-332933 A (2nd to 3rd pages, FIG. 1)

However, since the conventional piezoelectric oscillator has a structure in which a plurality of IC substrates and piezoelectric vibrating pieces are accommodated in the internal space of the package, the internal space of the package must be increased as the number of IC substrates increases. In addition, the maximum number of IC substrates required must be determined in advance to increase the internal space of the package. Therefore, an increase in the size of the piezoelectric oscillator having the package is inevitable, and the cost of the piezoelectric oscillator increases. In addition, since the piezoelectric vibrating piece is accommodated after mounting a plurality of IC substrates in the internal space of the package, if the piezoelectric vibrating piece becomes defective, the IC substrate of the product is discarded, and the disposal cost is high.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a piezoelectric oscillator that solves the above-described problems and that can be miniaturized and also can be multifunctional.

  According to the first aspect of the present invention, in the first invention, a circuit element is placed on the outer surface side of a package which accommodates a piezoelectric vibrating piece inside and is sealed by a lid, and the circuit element is disposed on a substrate. The piezoelectric oscillator is configured to be mounted on the circuit element, wherein the circuit element has an insulating film formed on one side facing the outer surface of the package, and the circuit element includes the circuit element This is achieved by a piezoelectric oscillator having a wiring part that can electrically connect a terminal and a terminal on the package side.

According to the configuration of the first invention, the circuit element has the insulating film formed on one side facing the outer surface of the package. This circuit element has a wiring portion that can electrically connect the terminal of the circuit element and the terminal on the package side.
Thereby, since the circuit element can be arranged on the outer surface side of the package, it is possible to avoid the increase in size of the package and to prevent the piezoelectric oscillator itself from increasing in size regardless of the number of circuit elements. Even if the number of circuit elements arranged in an overlapping manner is increased, the size of the package itself does not need to be increased, so that the size of the piezoelectric oscillator can be reduced. And the terminal of a circuit element and the terminal of a package side can be electrically connected reliably. In addition, since the piezoelectric vibrating piece is accommodated in the package and sealed with the lid, the circuit element is overlaid on the non-defective product inspected by the piezoelectric vibrating piece to constitute the piezoelectric oscillator, so that the disposal cost can be reduced.

A second invention is characterized in that, in the configuration of the first invention, a plurality of circuit elements are arranged on the outer surface side of the package.
According to the configuration of the second aspect of the invention, the plurality of circuit elements are stacked on the outer surface side of the package.
As a result, the plurality of circuit elements may be arranged so as to overlap without enlarging the package.
As a result, the piezoelectric oscillator can be multifunctional.

  According to a third invention, in the configuration of the first invention or the second invention, another insulating film is formed on the other surface side of the circuit element facing the substrate, and the other insulating film Are provided with an adjustment terminal for electrical adjustment of the circuit element and a connection terminal electrically connected to the terminal of the substrate, and the first of the adjustment terminals. The protruding height is lower than the second protruding height of the connection terminal.

According to the configuration of the third invention, another insulating film is formed on the side of the circuit element facing the substrate. This other insulating film is provided with an adjustment terminal and a connection terminal. The first protrusion height of the adjustment terminal is lower than the second protrusion height of the connection terminal.
Thereby, since the adjustment terminal is lower than the connection terminal, the adjustment terminal can be prevented from being electrically touched except in the case of adjustment. That is, the adjustment terminal can be prevented from being electrically touched by providing a difference in height between the adjustment terminal and the connection terminal.

A fourth invention is characterized in that, in the configuration of the third invention, the thickness in the vicinity of the adjustment terminal relating to the other insulating film is smaller than the thickness in the vicinity of the connection terminal relating to the other insulating film. To do.
According to the configuration of the fourth invention, the thickness in the vicinity of the adjustment terminal relating to another insulating film is smaller than the thickness in the vicinity of the connection terminal relating to another insulating film.
Thereby, although it is a simple structure, the 1st protrusion height of the terminal for adjustment can be made low compared with the 2nd protrusion height of a connection terminal.

  According to a fifth aspect of the invention, in the configuration of the third aspect of the invention, the connection terminal is a ball-shaped protruding electrode that is larger than the thickness of the adjustment terminal.

According to the structure of 5th invention, another insulating film is formed in the other surface side which faces the board | substrate of a circuit element. This other insulating film is provided with an adjustment terminal and a connection terminal. The connection terminal is a ball-shaped protruding electrode that is larger than the thickness of the adjustment terminal.
Thereby, since the adjustment terminal can be arranged low with a difference in height compared to the connection terminal, the adjustment terminal can be prevented from being electrically touched in cases other than electrical adjustment.

According to a sixth invention, in the configuration of the first invention or the second invention, the terminal of the circuit element and the terminal on the package side are electrically connected by a ball-shaped protruding electrode. .
According to the configuration of the sixth invention, the terminal of the circuit element and the terminal on the package side are electrically connected by the ball-shaped protruding electrode.
Thereby, both terminals can be reliably electrically connected by the ball-shaped protruding electrodes.

According to a seventh invention, in any one of the configurations of the first invention to the sixth invention, one surface side facing the outer surface of the package and / or the other surface side facing the substrate of the circuit element. Is characterized in that a plurality of different insulating films are formed.
According to the configuration of the seventh invention, a plurality of different insulating films are formed on at least one of the one surface side facing the outer surface of the package and the other surface side facing the circuit element substrate.
Thus, a plurality of different insulating films are formed, so that various electrical wiring portions can be formed in each insulating film.

According to an eighth invention, in any one of the first to seventh inventions, the terminal on the insulating film side on the one surface side and the terminal on the other insulating film side on the other surface side. Are electrically connected through the circuit elements.
According to the configuration of the eighth invention, the terminal on the insulating film side on one surface side and the terminal on the other insulating film side on the other surface side are electrically connected through the circuit element.
Thereby, each terminal of the insulating film on one surface side and the insulating film on the other surface side can be electrically connected as necessary.

Preferred embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a first embodiment of the piezoelectric oscillator of the present invention.
A piezoelectric oscillator 30 shown in FIG. 1 includes a piezoelectric vibrator 35 and an IC chip 50. The piezoelectric oscillator 30 has a configuration in which the IC chip 50 is placed on the outer surface 61 A side of the package 61 of the piezoelectric vibrator 35 and is mounted on the substrate 60.
The IC chip 50 is, for example, an oscillation circuit element, and the IC chip 50 is driven by supplying a driving voltage to the piezoelectric vibrating piece 32 of the piezoelectric vibrator 35. The IC chip 50 uses one or a plurality of integrated circuits or electronic components such as capacitors, and includes at least a predetermined circuit structure for exciting the piezoelectric vibrating piece 32.

The IC chip 50 is an example of a circuit element, and can also be called a semiconductor element or an integrated circuit element.
The piezoelectric vibrator 35 shown in FIG. 1 is a versatile product, and here has a package 61 and a piezoelectric vibrating piece 32 housed in a cavity 62 of the package 61.

The package 61 of the piezoelectric vibrator 35 is formed by, for example, laminating a plurality of substrates formed by molding a ceramic green sheet made of aluminum oxide as an insulating material and then sintering. The package 61 is formed in a rectangular box shape having a substantially U-shaped cross section. A piezoelectric vibrating piece 32 is accommodated in the cavity 62 inside the package 61.
The package 61 has external terminals 64 and 65. The external terminal 64 is electrically connected to the conductive adhesive 45 in the cavity 62 through a via hole 46 of the package 61 or a castellation (not shown) around the package 61 and an electrode on the side surface of the castellation. The extraction electrode 47 provided on the surface of the piezoelectric vibrating piece 32 is electrically and mechanically bonded by being cured using the conductive adhesive 45.

The piezoelectric vibrating piece 32 is formed of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to quartz. For example, the quartz wafer is rectangular along a predetermined direction. A so-called AT-cut vibrating piece or a tuning-fork type vibrating piece that is cut into two pieces can be used.
In the case of this embodiment, the piezoelectric vibrating piece 32 has an excitation electrode and an extraction electrode 47 connected to the excitation electrode, and uses an AT-cut vibrating piece. The excitation electrode is formed on the surface of the piezoelectric vibrating piece 32 as a driving electrode.

The package 61 shown in FIG. 1 is a ceramic package, for example. The package 61 may be made of an epoxy-based resin, or a package having a cavity formed by squeezing a metal plate. The cavity 62 of the package 61 is hermetically sealed with a lid 63 using a brazing material 67.
Next, a structural example of the IC chip 50 shown in FIG. 1 will be described.
The IC chip 50 shown in FIG. 1 has a main body part 70, a first insulating film 71, a second insulating film 72, and a wiring part 73.

The main body portion 70 has a size that is substantially the same as the bottom surface portion 66 of the package 61, for example. The bottom surface portion 66 is a portion on the opposite side to the lid body 63.
A first insulating film 71 is formed on the one surface 81 side of the main body 70. A second insulating film 72 is formed on the other surface 82 side of the main body 70. The first insulating film 71 and the second insulating film 72 are films for achieving electrical insulation.
The first insulating film 71 on the one surface 81 side faces the outer surface 61 </ b> A of the bottom surface portion 66 of the package 61. The second insulating film 72 on the other surface 82 side faces the mounting surface 84 side of the substrate 60. The first insulating film 71 is an insulating film on one side, but the second insulating film is an insulating film different from that (an insulating film on the other side).

A wiring part 73 is formed on the first insulating film 71 side. The wiring portion 73 has, for example, wiring pads 101, 102, 103 and wiring terminals 106, 107. The wiring pad 101 is electrically connected to the connection terminal 105 on the second insulating film 72 side through the via wiring portion 104. The via wiring portion 104 passes through the through hole of the main body portion 70, and an insulating film 106 </ b> A is formed around the via wiring portion 104 to be electrically insulated.
The wiring pad 102 is electrically connected to the wiring terminal 106. In addition, the first insulating film 71 has a wiring terminal 107.
The wiring pad 103 is electrically connected to the connection terminal 108 </ b> A on the second insulating film 72 side through the via wiring portion 108. The via wiring portion 108 is disposed in the through hole of the main body portion 70, and the via wiring portion 108 is electrically insulated by an insulating film 109A.

The wiring terminal 106 and the wiring terminal 107 of the IC chip 50 are reliably electrically connected to the wiring portions 65 and 64 by bumps 120 and 121 which are ball-shaped protruding electrodes, respectively. Thereby, the wiring part 73 on the one surface 81 side of the IC chip 50 is reliably electrically connected to the electrical terminals of the piezoelectric vibrator 35. In order to increase the mechanical connection strength between the piezoelectric vibrator 35 and the IC chip 50, a plurality of electrically open wiring terminals such as the wiring terminal 107 are arranged on the surface of the first insulating film 71 on the piezoelectric vibrator 35 side. In addition, there are a method of connecting with bumps and a method of connecting the piezoelectric vibrator 35 and the IC chip 50 with a non-conductive adhesive such as epoxy as well as the connection with bumps.
Further, the electrical connection between the IC chip 50 and the piezoelectric vibrator 35 may be made by using a conductive paste such as solder or a resin containing a conductive filler.

FIG. 2 shows an example of wiring on the front and back of the IC chip 50 of FIG. FIG. 2A shows the surface (top view) of the second insulating film 72 on the piezoelectric vibrator 35 side, and wiring pads that are not exposed on the surface are indicated by dotted lines. FIG. 2B shows the surface (top view) of the first insulating film 71 of the main body portion 70, and the wiring pad provided with the via wiring portion in the main body portion 70 is painted. FIG. 2C shows a surface of the second insulating film 72 on the substrate 60 side (a bottom view with respect to the piezoelectric oscillator 30).
The method of connecting the connection terminal and the substrate 60 is to apply a ball-shaped bump as shown in FIG. 1 and a conductive bonding material such as solder (solder paste is applied to the wiring portion 60A, and then melted by mounting a piezoelectric oscillator. Can be considered). In the case of this conductive bonding material, the connection terminal is enlarged to ensure the connection strength between the substrate 60 and the piezoelectric oscillator 30.
Note that a conductive bonding material may also be used for the connection between the piezoelectric vibrator and the IC chip.
Returning to FIG. 1, the connection terminal 105 of the second insulating film 72 is electrically connected to the wiring portion 60 </ b> A of the mounting surface 84 of the substrate 60 by a bump 130 that is a protruding electrode. Similarly, the connection terminal 108A of the via wiring portion 108 is electrically connected to the wiring portion 60B on the mounting surface 84 side of the substrate 60 via the bump 131.
In this manner, the IC chip 50 as an example of a circuit element is mounted on the package 61 of the piezoelectric vibrator 35 in an overlapping manner. The IC chip 50 can be electrically connected by being mounted on the substrate 60.
Note that a temperature sensor for detecting the temperature of the piezoelectric vibrating piece 32 is an IC chip for reducing fluctuations in the output frequency of the piezoelectric oscillator 30 due to an electric field or radio waves generated from a wiring pattern (not shown) formed on the substrate 60, or for detecting the temperature of the piezoelectric vibrating piece 32. In order to accurately detect the temperature of the piezoelectric vibrating piece 32 that is built in 50, it is preferable to arrange an active circuit (not shown) formed on the IC chip 50 on the one surface 81 side.

  As shown in FIG. 1, the IC chip 50 can be arranged not on the inside of the package 61 but on the outer surface 61 </ b> A side of the bottom surface portion 66. Therefore, the package 61 of the piezoelectric oscillator 30 does not need to be enlarged regardless of the size of the IC chip and the number of IC chips, and the package 61 can be downsized. As a result, the package 61 and the piezoelectric oscillator 30 including the package 61 can be reduced in size.

Next, a second embodiment of the present invention will be described with reference to FIGS.
The piezoelectric oscillator 30 according to the second embodiment of the present invention shown in FIG. 3 is different from the piezoelectric oscillator 30 shown in FIG. 1 in that a plurality of second insulating films 72A and 72B are stacked on the other surface 82 side. It is formed.
On the other hand, in the first embodiment of FIG. 1, only one layer of the second insulating film 72 is formed on the other surface 82 of the IC chip 50.
The other components of the piezoelectric oscillator 30 of the second embodiment shown in FIGS. 3 and 4 are substantially the same as the corresponding components of the piezoelectric oscillator 30 shown in FIG. I will decide.
FIG. 4 shows an example of wiring on the front and back of the IC chip 50 of FIG. FIG. 4A shows the surface (top view) of the first insulating film 71 on the piezoelectric vibrator 35 side, and the wiring pads that are not exposed on the surface are indicated by dotted lines. FIG. 4B shows the surface (top view) of the main body portion 70 on the first insulating film 71 side, and the wiring pad provided with the via wiring portion in the main body portion 70 is displayed in black. . FIG. 4C is a surface view of the second insulating film 72B on the substrate 60 side (a bottom view with respect to the piezoelectric oscillator 30). FIG. 4D is a surface view of the second insulating film 72A on the substrate 60 side (a bottom view with respect to the piezoelectric oscillator 30), and the pattern wiring indicated by a dotted line is not exposed on the bottom surface.
In FIG. 4D, if an unnecessary pattern is exposed on the substrate 60 side, problems such as a short circuit between terminals due to solder or the like during mounting occur. Therefore, unnecessary pattern wiring can be prevented from being exposed on the surface of the piezoelectric oscillator on the substrate 60 side by the second insulating film 72A. By configuring the first insulating film 71 with a plurality of insulating films, unnecessary patterns can be prevented from being exposed.

A feature of the second embodiment shown in FIGS. 3 and 4 is that a connection terminal 105 is formed on the outer surface side of the first insulating film 71A, and a wiring pad 109 is formed on the second insulating film 72B. It has been done. The wiring pad 101 on one surface 81 side is electrically connected to the wiring pad 109 via the via wiring portion 104. The wiring pad 109 is further electrically connected to the connection terminal 105 which is an outer layer.
Thus, by laminating the plurality of second insulating films 72A and 72B on the other surface 82 side, it is possible to form a wider variety of wiring patterns as compared to forming a single insulating film. The connection terminal 108A of the via wiring portion 108 is exposed to the outer surface side of the second insulating film 72A.
When an active circuit (not shown) formed on the IC chip 50 is formed on the substrate 60 side, a ground electrode pattern is formed on the surface of the second insulating film 72B on the substrate 60 side, thereby forming the substrate. It is possible to reduce fluctuations in the output frequency of the piezoelectric oscillator 30 due to an electric field or radio waves generated from a wiring pattern (not shown) formed in 60.

Next, a third embodiment of the present invention will be described with reference to FIG.
The piezoelectric oscillator 30 shown in FIG. 5 differs from the first embodiment of FIG. 1 in the wiring pattern structure on the other surface 82 side of the IC chip 50. The other components of the third embodiment in FIG. 5 are the same as the corresponding components in FIG.

  As shown in FIG. 5, a via wiring portion 108 and another via wiring portion 140 are provided through the through holes of the main body portion 70 in the second insulating film 72 on the other surface 82 side. The via wiring portion 108 electrically connects the wiring pad 103 on the one surface 81 side and the bump 131 on the other surface 82 side. The via wiring portion 140 electrically connects the wiring pad 111 on the one surface 81 side and the wiring pad 160 on the other surface 82 side. The via wiring portions 108 and 140 are formed through the through holes of the main body portion 70, but are electrically insulated by the insulating films 109A and 113, respectively.

  Characteristically, a bump 131 which is a ball-shaped protruding electrode is provided on the connection terminal 108A side of the via wiring portion 108. On the other hand, a thin connection terminal 160 is provided on the via wiring part 140 side. The wiring pad 160 is an adjustment terminal for performing electrical adjustment of the IC chip 50. The first protrusion height D1 in the Z direction of the connection terminal 160 that is the adjustment terminal is set to be smaller than the second protrusion height D2 of the bump 131.

The reason why the first protrusion height D1 of the adjustment terminal 160 is set to be smaller than the second protrusion height D2 of the bump 131 is as follows. That is, the connection terminal 160 that is an adjustment terminal is used only when the probe is applied when the IC chip 50 is electrically adjusted. Therefore, in a normal case, by making the protruding height in the Z direction smaller than the bump 131, when the piezoelectric oscillator 30 is mounted on the substrate 60, no electrical connection is made to the connection terminal 160. It is for doing so.
For this reason, by providing a positive difference in height between the connection terminal 160 and the bump 171, an erroneous electrical contact of the connection terminal 160 is prevented at times other than during adjustment.

Next, a fourth embodiment of the present invention will be described with reference to FIG.
The piezoelectric oscillator 30 of the fourth embodiment shown in FIG. 6 is different from the piezoelectric oscillator 30 of the third embodiment of FIG. 5 in that no bump 131 is used. In FIG. 6, the height in the Z direction of the second insulating film 72 is partially changed instead of using the bump 130. The thickness T1 of the second insulating film 72 in the vicinity of the connection terminal 160 is set smaller than the thickness T2 of the second insulating film 72 in the vicinity of the other connection terminal 131A. From this, the connection terminal 160 also has the 1st protrusion height D1 of the connection terminal 160 smaller than the 2nd protrusion height D2 of the connection terminal 131A in this case. Compared with the other connection terminal 131A, the height position in the Z direction can be lowered. For this reason, the connection terminal 160 which is an adjustment terminal can be prevented from being electrically touched at times other than during adjustment.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
Unlike the previous embodiments, the piezoelectric oscillator 30 of the fifth embodiment of FIG. 7 has a plurality of IC chips 50 arranged in an overlapping manner.
In the example of FIG. 7, for example, two IC chips 50 are mounted in an overlapping manner. Each IC chip 50 can have different functions. In FIG. 7, the upper IC chip 50 can be the same as the IC chip 50 of FIG. On the other hand, the lower IC chip 50 may have a different structural example from the upper IC chip 50. The IC chips 50 and 50 can be electrically connected by bumps 170. The lower IC chip 50 can be securely connected to the wiring portions 60A and 60B of the substrate 60 using the bumps 130 and 131.

  In the example of FIG. 7, IC chips 50 and 50, which are two different types of circuit elements, are mounted. The IC chips 50 and 50 may be, for example, an oscillation circuit element that applies a voltage to the piezoelectric vibrating piece 32, a voltage generation circuit for temperature compensation, or a varicap for controlling the voltage. However, the present invention is not limited to this, and the piezoelectric oscillator 30 according to the embodiment of the present invention can be mounted with at least one IC chip having a necessary function.

FIG. 8 shows a comparative example of a piezoelectric oscillator outside the scope of the present invention.
In the comparative example illustrated in FIG. 8, an example in which the IC chip 250 is mounted on the bottom surface portion 266 of the package 261 is illustrated. The external terminal 400 of the package 261 is electrically connected to the wiring portion 461 of the substrate 460 so as to avoid the IC chip 250 by using relatively large bumps 500. If the structure in which the bumps 500 on the package 261 side are directly connected to the circuit board side in this way is adopted, the relatively large bumps 500 limit the space of the bottom surface portion 266, and as a result, the small IC chip 250. However, it cannot be mounted on the bottom surface portion 266.
On the other hand, the piezoelectric oscillator 30 of the present invention in the illustrated example described above has an advantage that, for example, the size occupied by each IC chip 50 can be arranged so as to overlap with the bottom surface portion 266.

In the embodiment of the present invention, since the circuit element can be arranged on the outer surface side of the package, the enlargement of the package can be avoided and the enlargement of the piezoelectric oscillator itself can be prevented. Even if the number of circuit elements arranged in an overlapping manner is increased, the size of the package itself does not need to be increased, so that the size of the piezoelectric oscillator can be reduced. And the terminal of a circuit element and the terminal of a package side can be electrically connected reliably.
In the embodiment of the present invention, the plurality of circuit elements may be stacked without increasing the size of the package. As a result, the piezoelectric oscillator can be multifunctional.

  In the embodiment of the present invention, the height of the adjustment terminal is lower than that of the connection terminal, so that the adjustment terminal can be prevented from being electrically touched except in the case of adjustment. By making a difference in height between the adjustment terminal and the connection terminal, the adjustment terminal can be prevented from being electrically touched.

In the embodiment of the present invention, the first projecting height of the adjustment terminal can be made lower than the second projecting height of the connection terminal while having a simple structure. In the embodiment of the present invention, since the adjustment terminal can be arranged low with a difference in height compared to the connection terminal, the adjustment terminal should not be electrically touched in cases other than electrical adjustment. Can do. In a circuit element such as an IC chip, the wiring part on one insulating film side and the wiring part on the other insulating film side can be electrically connected as needed through a through hole in the main body part of the IC chip.
In the conventional example, the piezoelectric vibrating reed is accommodated after mounting a plurality of IC substrates in the internal space of the package. If the piezoelectric vibrating reed becomes defective, all the IC substrates of the product are discarded, and the disposal cost Is expensive.
Therefore, in the embodiment of the present invention, since the piezoelectric vibrating piece is accommodated in the package and sealed with the lid, the circuit is compared with the package that is found to be a good piezoelectric vibrating piece as a result of the inspection of the piezoelectric vibrating piece. Since the piezoelectric oscillator is formed by stacking elements, the disposal cost can be reduced.
In the embodiment of the present invention, a plurality of insulating layers are formed on one or both of the one surface 81 facing the outer surface of the package of the IC chip 50 and the other surface 82 facing the substrate 60. May be. That is, in this embodiment, only the second insulating film 72 side is composed of a plurality of insulating films, but only the first insulating film 71 or both of the insulating films 71 and 72 are composed of a plurality of insulating films. May be.
Further, for example, as shown in FIG. 9, a connection terminal (or wiring terminal) capable of forming a fillet can be formed by forming the insulating layer in a plurality of stages. As illustrated in FIG. 9, the connection terminals 105 provided on the second insulating films 72 </ b> A and 72 </ b> B are electrically connected to the wiring portion 60 </ b> B of the substrate 60 by a solder 800 when connected electrically. The connection state between the side end face of the solder and the solder 800 can be confirmed by visual inspection. Thereby, when connecting a piezoelectric oscillator to a board | substrate with solder paste etc., a connection state can be confirmed by an external appearance test | inspection after board | substrate mounting. That is, a state in which the solder paste is placed on the end face of the connection terminal (wiring terminal) can be confirmed by appearance inspection.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the claims.
A part of each configuration of the above embodiment can be omitted, or can be arbitrarily combined so as to be different from the above.

The figure which shows 1st Embodiment with preferable piezoelectric oscillator of this invention. The figure which shows the example of wiring of the front and back of the IC chip of the piezoelectric oscillator of FIG. The figure which shows the 2nd Embodiment of this invention. The figure which shows the example of wiring of the front and back of the IC chip of embodiment of FIG. The figure which shows the 3rd Embodiment of this invention. The figure which shows the 4th Embodiment of this invention. The figure which shows the 5th Embodiment of this invention. The figure which shows the comparative example different from this invention. The figure which shows another embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 30 ... Piezoelectric oscillator, 32 ... Piezoelectric vibrating piece, 35 ... Piezoelectric vibrator, 50 ... IC chip, 60 ... Substrate, 61 ... Package, 63 ... Lid, 71 ... 1st insulating film, 72 ... 2nd insulating film, 73 ... Wiring part, 81 ... One side, 82 ... The other side, 120, 121, 131 ... Bump ( Ball-shaped protruding electrode)

Claims (8)

A piezoelectric oscillator configured to have circuit elements stacked on the outer surface side of a package containing a piezoelectric vibrating piece and sealed with a lid, and mounting the circuit elements on a substrate. And
The circuit element has an insulating film formed on one side facing the outer surface of the package, and the circuit element is a wiring portion that can electrically connect the terminal of the circuit element and the terminal on the package side. A piezoelectric oscillator comprising:   The piezoelectric oscillator according to claim 1, wherein a plurality of circuit elements are arranged on the outer surface side of the package. Another insulating film is formed on the other surface side facing the substrate of the circuit element, and the other insulating film has an adjustment terminal for electrical adjustment of the circuit element. A connection terminal electrically connected to the terminal of the substrate is provided,
3. The piezoelectric oscillator according to claim 1, wherein a first protrusion height of the adjustment terminal is lower than a second protrusion height of the connection terminal.   4. The piezoelectric oscillator according to claim 3, wherein a thickness in the vicinity of the adjustment terminal relating to the another insulating film is smaller than a thickness in the vicinity of the connection terminal relating to the another insulating film.   The piezoelectric oscillator according to claim 3, wherein the connection terminal is a ball-shaped protruding electrode that is larger than a thickness of the adjustment terminal.   3. The piezoelectric oscillator according to claim 1, wherein the terminal of the circuit element and the terminal on the package side are electrically connected by a ball-shaped protruding electrode.   2. A plurality of different insulating films are formed on one surface side facing the outer surface of the package and / or on the other surface side facing the substrate of the circuit element. 7. The piezoelectric oscillator according to any one of 6 to 6.   The terminal on the insulating film side on the one surface side and the terminal on the other insulating film side on the other surface side are electrically connected through the circuit element. 8. The piezoelectric oscillator according to any one of 7 above.

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