JP2006049070A - コネクタ部材 - Google Patents
コネクタ部材 Download PDFInfo
- Publication number
- JP2006049070A JP2006049070A JP2004227842A JP2004227842A JP2006049070A JP 2006049070 A JP2006049070 A JP 2006049070A JP 2004227842 A JP2004227842 A JP 2004227842A JP 2004227842 A JP2004227842 A JP 2004227842A JP 2006049070 A JP2006049070 A JP 2006049070A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- connector member
- metal terminals
- metal
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 62
- 229910052751 metal Inorganic materials 0.000 claims abstract description 62
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 238000000465 moulding Methods 0.000 claims abstract description 13
- 239000003990 capacitor Substances 0.000 abstract description 23
- 230000005611 electricity Effects 0.000 abstract description 5
- 230000003068 static effect Effects 0.000 abstract description 5
- 230000037431 insertion Effects 0.000 abstract 2
- 238000003780 insertion Methods 0.000 abstract 2
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6477—Impedance matching by variation of dielectric properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/6608—Structural association with built-in electrical component with built-in single component
- H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
Landscapes
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
【解決手段】 複数本の金属ターミナル20を樹脂10でインサート成形してなるコネクタ部材において、樹脂10の内部にて、各々の金属ターミナル20同士が重なり合って重なり部30を形成しており、この重なり部30において金属ターミナル20自身を電極とした静電容量部が形成されている。
【選択図】 図1
Description
ここで、上記PBT等の樹脂10を誘電体として用いた場合、重なり部30において、金属ターミナル20の交差する面積を5mm2、金属ターミナル20同士の間隔を0.3mmに設定した場合、静電容量部としては数pF程度の容量が得られる。
なお、本発明のコネクタ部材は、センサなどのコネクタケースだけに留まらず、ECU用のコネクタに適用してもよいことはいうまでもなく、その場合には、プリント板上のノイズ除去フィルタを大幅に削減できる。
40…誘電体としてのフィルム。
Claims (2)
- 複数本の金属ターミナル(20)を樹脂(10)でインサート成形してなるコネクタ部材において、
前記樹脂(10)の内部にて、各々の前記金属ターミナル(20)同士が重なり合って重なり部(30)を形成しており、この重なり部(30)において前記金属ターミナル(20)自身を電極とした静電容量部が形成されていることを特徴とするコネクタ部材。 - 前記重なり部(30)において、前記金属ターミナル(20)の間には、前記樹脂(10)よりも高い誘電率を有する誘電体(40)が介在していることを特徴とする請求項1に記載のコネクタ部材。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004227842A JP2006049070A (ja) | 2004-08-04 | 2004-08-04 | コネクタ部材 |
| US11/185,753 US7347737B2 (en) | 2004-08-04 | 2005-07-21 | Connector housing with internal capacitor constructed with overlapping portions of terminals |
| DE102005034910A DE102005034910A1 (de) | 2004-08-04 | 2005-07-26 | Verbindergehäuse |
| KR1020050069674A KR100725917B1 (ko) | 2004-08-04 | 2005-07-29 | 커넥터 하우징 |
| CNB2005100882864A CN100440632C (zh) | 2004-08-04 | 2005-08-03 | 连接器外壳 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004227842A JP2006049070A (ja) | 2004-08-04 | 2004-08-04 | コネクタ部材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2006049070A true JP2006049070A (ja) | 2006-02-16 |
Family
ID=35758011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004227842A Pending JP2006049070A (ja) | 2004-08-04 | 2004-08-04 | コネクタ部材 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7347737B2 (ja) |
| JP (1) | JP2006049070A (ja) |
| KR (1) | KR100725917B1 (ja) |
| CN (1) | CN100440632C (ja) |
| DE (1) | DE102005034910A1 (ja) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4180613B2 (ja) * | 2006-04-20 | 2008-11-12 | 三菱電機株式会社 | センサ装置 |
| US8192232B2 (en) * | 2009-09-15 | 2012-06-05 | Tyco Electronics Corporation | Connector assembly having an electrical compensation component |
| JP5212488B2 (ja) * | 2011-01-13 | 2013-06-19 | 株式会社デンソー | センサモジュール |
| JP5699792B2 (ja) * | 2011-05-11 | 2015-04-15 | 住友電装株式会社 | コネクタ |
| JP6354285B2 (ja) * | 2014-04-22 | 2018-07-11 | オムロン株式会社 | 電子部品を埋設した樹脂構造体およびその製造方法 |
| KR102309622B1 (ko) * | 2015-04-03 | 2021-10-07 | 삼성디스플레이 주식회사 | 커넥터 및 그 제조 방법 |
| CN106299894A (zh) * | 2015-05-22 | 2017-01-04 | 富士康(昆山)电脑接插件有限公司 | 电源连接器线缆组件 |
| DE102015218959A1 (de) * | 2015-09-30 | 2017-03-30 | Zf Friedrichshafen Ag | Diagnose eines Steuergeräts |
| JP6809285B2 (ja) * | 2017-02-23 | 2021-01-06 | 富士電機株式会社 | 物理量センサ装置の製造方法および物理量センサ装置 |
| JP7124400B2 (ja) * | 2018-04-10 | 2022-08-24 | 株式会社デンソー | 駆動装置 |
| KR102878337B1 (ko) * | 2021-05-13 | 2025-10-29 | 엘지이노텍 주식회사 | 필터가 구비된 커넥터 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2546590Y2 (ja) * | 1991-05-31 | 1997-09-03 | 日本エー・エム・ピー株式会社 | フィルタコネクタ及びフィルタコネクタ用遮蔽板 |
| US5456616A (en) * | 1994-02-04 | 1995-10-10 | Molex Incorporated | Electrical device employing a flat flexible circuit |
| US5509825A (en) * | 1994-11-14 | 1996-04-23 | General Motors Corporation | Header assembly having a quick connect filter pack |
| JP3508453B2 (ja) | 1997-03-14 | 2004-03-22 | 株式会社デンソー | 電子回路装置 |
| US6776661B2 (en) * | 1999-02-02 | 2004-08-17 | Filtec Filtertechnologie Fuer Die Elektronikindustrie Gmbh | Planar filter and multi-pole angle-connecting device with a planar filter |
| GB9903970D0 (en) * | 1999-02-23 | 1999-04-14 | Smiths Industries Plc | Electrical connector assemblies |
| US6254435B1 (en) * | 1999-06-01 | 2001-07-03 | Molex Incorporated | Edge card connector for a printed circuit board |
| US6176742B1 (en) * | 1999-06-25 | 2001-01-23 | Avaya Inc. | Capacitive crosstalk compensation arrangement for communication connectors |
| DE29911342U1 (de) * | 1999-07-02 | 2000-08-24 | Filtec Filtertechnologie für die Elektronikindustrie GmbH, 59557 Lippstadt | Vielpolige Winkelsteckvorrichtung |
| DE20014791U1 (de) * | 2000-08-26 | 2001-10-04 | Filtec Filtertechnologie für die Elektronikindustrie GmbH, 59557 Lippstadt | Mehrpoliger Steckverbinder für elektronische Signalleitungen |
| JP4240790B2 (ja) | 2000-09-26 | 2009-03-18 | 株式会社デンソー | センサ装置 |
| EP2315510A3 (en) * | 2001-06-05 | 2012-05-02 | Dai Nippon Printing Co., Ltd. | Wiring board provided with passive element |
| JP3873792B2 (ja) | 2002-03-29 | 2007-01-24 | 株式会社デンソー | 圧力センサ |
| US6964587B2 (en) * | 2002-11-10 | 2005-11-15 | Bel Fuse Ltd. | High performance, high capacitance gain, jack connector for data transmission or the like |
-
2004
- 2004-08-04 JP JP2004227842A patent/JP2006049070A/ja active Pending
-
2005
- 2005-07-21 US US11/185,753 patent/US7347737B2/en not_active Expired - Fee Related
- 2005-07-26 DE DE102005034910A patent/DE102005034910A1/de not_active Ceased
- 2005-07-29 KR KR1020050069674A patent/KR100725917B1/ko not_active Expired - Fee Related
- 2005-08-03 CN CNB2005100882864A patent/CN100440632C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7347737B2 (en) | 2008-03-25 |
| KR20060048958A (ko) | 2006-05-18 |
| KR100725917B1 (ko) | 2007-06-11 |
| DE102005034910A1 (de) | 2006-03-16 |
| CN100440632C (zh) | 2008-12-03 |
| US20060030216A1 (en) | 2006-02-09 |
| CN1734850A (zh) | 2006-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060904 |
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| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080718 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080729 |
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| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080820 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20081111 |