JP2006048881A - Imprint apparatus and imprint method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for imprinting capable of performing imprinting where a plurality of sets of magnetic recording media and stampers are stacked, and a method for imprinting. <P>SOLUTION: The device for imprinting is provided with: a press bottom plate; a press top board facing the press bottom plate, a plurality of stampers which are arranged between the press bottom plate and the press top board and have recessed and projected parts to be transferred to the resist film of a laminate prepared by sequentially stacking a magnetic film and a resist film on a substrate; a mechanism for positioning the laminate and the stampers; a pressure dispersion plate arranged between adjacent stampers; a press bottom plate; and a mechanism for arranging the press bottom plate and the pressure dispersion plate in a parallel direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an imprint technique used for manufacturing an information recording apparatus, and more particularly to an imprint apparatus and an imprint method for processing a magnetic recording medium.

  In recent years, the recording capacity of information recording apparatuses has been increased by miniaturization of recording cells of magnetic recording media. Along with this, a microfabrication technique of about 100 nm or less is required in the recording cell manufacturing process. Examples of these fine processing techniques include electron beam lithography, focused ion beam lithography, and nanoimprint lithography (hereinafter, NIL).

  Above all, the NIL technology is a technology that performs pattern transfer by pressing a stamper on which the desired concavo-convex pattern has been created in advance by electron beam lithography or the like against the resist surface of the substrate. Therefore, high throughput can be realized (see Patent Document 1).

As an imprint method of the NIL technique, there are a 2P method, a hot embossing method, a high pressure press method, and the like. Among these, a high-pressure press method is desirable for increasing the accuracy and throughput of pattern transfer.
US Pat. No. 5,772,905

  As a result of intensive studies, the present inventors have found the following.

  When the high-pressure press method is used, the stamper and the magnetic recording medium are subjected to a pressure of about 30 MPa or more, and therefore it is required to apply a uniform weight with high accuracy. At this time, it was found that the distortion of the pressure dispersion plate caused by non-uniform pressure is allowed to about 10 μm, and beyond that, the substrate of the magnetic recording medium is damaged. In addition, since the concavo-convex pattern to be transferred is extremely fine, even if the substrate is not damaged, this distortion tends to cause a transfer failure.

  For example, in a donut-type magnetic recording medium substrate, the outer peripheral portion tends to be excessive in pressure compared to the inner peripheral portion due to the structure. Further, due to the distortion accompanying this, a fine uneven pattern of about 200 nm or less was liable to cause a partial transfer failure in the inner peripheral portion.

  Incidentally, the multi-layered imprint apparatus is an apparatus that performs imprinting by stacking a plurality of sets of stampers and magnetic recording media. This apparatus is preferable from the viewpoint of throughput improvement because it enables pattern transfer of a plurality of magnetic recording media by one imprint. However, in the multi-layered imprint apparatus, the strain described above is accumulated, causing further pressure non-uniformity, and the magnetic recording medium substrate is damaged.

  SUMMARY OF THE INVENTION In view of the above circumstances, an object of the present invention is to provide an imprint apparatus and an imprint method that can perform imprinting in which a plurality of sets of magnetic recording media and stampers are stacked.

  The imprint apparatus according to the first aspect of the present invention includes a press bottom plate, a press top plate facing the press bottom plate, and a plurality of layers disposed between the press bottom plate and the press top plate, and a magnetic film and a resist film are sequentially laminated on the substrate. A stamper having irregularities to be transferred to the resist film of the laminated body, a mechanism for positioning the laminated body and the stamper, a pressure dispersion plate disposed between the stampers adjacent to each other, a press bottom plate, a press top plate, and pressure dispersion And a mechanism for arranging the plates in a parallel direction.

  The imprint apparatus according to the second aspect of the present invention is a press bottom plate, a press top plate facing the press bottom plate, and a plurality of plates arranged between the press bottom plate and the press top plate, and a magnetic film and a resist film are sequentially formed on the substrate. A stamper having projections and depressions to be transferred to the resist film of the laminated laminate, a mechanism for positioning the laminate and the stamper, a plate made of cemented carbide or low carbon steel, disposed between adjacent stampers, A press bottom plate, a press top plate, and a mechanism for arranging plates made of cemented carbide or low carbon steel in a parallel direction.

  The imprint method of the third invention is such that the resist film of the laminate in which the magnetic film and the resist film are sequentially laminated on the substrate and the surface on which the unevenness to be transferred to the stamper resist film is formed are opposed to each other. The step of determining the transfer position of the unevenness, the step of arranging a plurality of sets of laminates and stampers between the press bottom plate and the press top plate, and the press bottom plate and the press top plate so as to be parallel to the press surface And a step of disposing the pressure dispersion plate between the sets, and then a step of pressing the laminate, stamper and pressure dispersion plate using a press bottom plate and a press top plate.

  The imprint method according to the fourth aspect of the present invention is such that a resist film of a laminate in which a magnetic film and a resist film are sequentially laminated on a substrate and a surface on which irregularities to be transferred are formed on a resist film of a stamper are opposed to each other The step of determining the transfer position of the unevenness, the step of arranging a plurality of pairs of laminates and stampers between the press bottom plate and the press top plate, and the press bottom plate and the press top plate so as to be parallel to the press surface A plate made of cemented carbide or low carbon steel, and a plate made of laminate, stamper and cemented carbide or low carbon steel using a press bottom plate and a press top plate. And a step of pressing.

  ADVANTAGE OF THE INVENTION According to this invention, the imprint apparatus and imprint method which can perform the imprint which laminated | stacked multiple sets of the magnetic recording medium and the stamper can be provided.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol shall be attached | subjected to a common structure through embodiment, and the overlapping description is abbreviate | omitted. Each figure is a schematic diagram for promoting explanation and understanding of the invention, and its shape, dimensions, ratio, and the like are different from those of an actual device. However, these are in consideration of the following explanation and known techniques. The design can be changed as appropriate.

(First embodiment)
An example of the imprint apparatus according to the first embodiment will be described with reference to FIGS. 1 (a) and 1 (b).

  FIG. 1A is a schematic side view of the imprint apparatus according to the first embodiment.

  As shown in FIG. 1A, the imprint apparatus includes a precision lifting mechanism called a die set, a hydraulic cylinder for driving the lifting mechanism, and a mechanism for supporting them. The die set includes a press top plate 5, a press bottom plate 10 and a guide 1. The guide 1 is made to be parallel to the press bottom plate 10 when the press top plate 5 moves up and down. The press top plate 5 and the press bottom plate 10 press the components uniformly.

FIG. 1B is a schematic cross-sectional view of the inside of the die set during imprinting of the imprinting apparatus according to the first embodiment.

  As shown in FIG. 1B, the components sandwiched between the press top plate 5 and the press bottom plate 10 at the time of imprinting are a laminate 15, a stamper 20, and a pressure dispersion plate 25. The stacked body 15 has a structure in which a substrate, a magnetic film, and a resist film are sequentially stacked, and a surface on which the resist film is provided faces the stamper 20. In the stamper 20, the surface having unevenness to be transferred to the resist faces the laminate 15. There are a plurality of laminated bodies 15 and stampers 20, and a pressure dispersion plate 25 is provided between the pairs. Therefore, at the time of imprinting, the laminated body 15 and the stamper 20 are configured to be sandwiched between the press top plate 5, the press bottom plate 10, and the pressure dispersion plate 25.

  At the time of imprinting, the press top plate 5 descends along the guide 1 and a predetermined pressure is applied by a hydraulic cylinder. Thereby, the unevenness of the stamper 20 is transferred to the resist film of the stacked body 15. Next, the press top plate 5 rises, the laminate 15 is removed, and the components become the stamper 20 and the pressure dispersion plate 25. Thereafter, a new laminate 15 is arranged and imprinting is performed.

  For convenience, FIG. 1B shows a set of three stacked bodies 15 and stampers 20. However, the number of sets of the stacked body 15 and the stamper 20 is not limited to this. Further, the vertical relationship between the stacked body 15 and the stamper 20 may be reversed. Further, the stamper 20, the laminated body 15, and the stamper 20 may be combined. In this case, the unevenness of the resist film of the laminate 15 and the stamper 20 is opposed to each other, and the laminate 15 has a structure in which a magnetic film and a resist film are sequentially laminated on both surfaces of the substrate.

  In addition to the illustration, a mechanism for positioning the laminated body 15 and the stamper 20 used for accurately transferring the unevenness of the stamper 20 to the laminated body 15 and a pressure applied to the laminated body 15 and the stamper 20 are used. The mechanism which arrange | positions the press top plate 5, the press bottom plate 10, and the pressure distribution plate 25 in a parallel direction is required.

  According to the present invention, the pressure dispersion plate blocks the further pressure non-uniformity caused by the strain of the stamper and the laminate, and prevents the accumulation of strain. For this reason, it is possible to perform the laminated imprint by the plural laminated imprint apparatus without causing a transfer failure or a substrate damage.

  Hereinafter, the configuration of the first embodiment will be described in detail.

  First, the pressure dispersion plate 25 will be described. The pressure dispersion plate 25 is a plate for correcting strain on the order of microns, the plane thereof is a plane with an accuracy of less than a micron order, and the deformation amount of the pressure dispersion plate 25 itself by the press is less than a micron order. It is necessary.

Examples of the material of the pressure dispersion plate 25 include a material having a higher longitudinal elastic modulus than the laminate 15 and the stamper 20, and examples thereof include cemented carbide and low carbon steel. The longitudinal elastic modulus of the cemented carbide is 46000 kgf / mm ² or more and 62000 kgf / mm ² or less.

  Among these, cemented carbide is preferable from the viewpoints of longitudinal elastic modulus and wear resistance. The cemented carbide refers to an extremely hard alloy obtained by appropriately mixing and sintering a metal element carbide powder and a metal powder. In general, carbides of Group IV to VI metal elements and metals such as Fe, Ni, and Co are used, and WC-Co system is considered to have the most excellent mechanical properties. In addition, alloys such as WC-TaC-Co, WC-TiC-Co, and WC-TiC-TaC-Co are also widely used (see Iwanami Rikagaku Dictionary 5th edition). Here, the longitudinal elastic modulus and the wear resistance can be adjusted by the content of the binder. For example, if the content of the Co binder is small, the longitudinal elastic modulus and the wear resistance increase, and the impact resistance decreases.

  When the pressure dispersion plate 25 is a cemented carbide, the thickness is preferably in the range of 0.5 mm to 10.0 mm. When it is 0.5 mm or more, deformation of the pressure dispersion plate 25 itself is suppressed, and when it is 10.0 mm or less, transfer failure due to the weight of the pressure dispersion plate 25 itself can be avoided.

  Next, the plane size of the pressure dispersion plate 25 is preferably larger by 10 μm or more and 10 cm or less than the laminate 15 to be imprinted. When the thickness is 10 μm or more, variations in the sizes of the stacked body 15 and the stamper 20 during imprinting and variations due to the accuracy of the mechanism for positioning the stacked body 15 and the stamper 20 can be allowed. By being 10 cm or less, excessive pressure at the outer peripheral portion due to the weight of the protruding portion of the pressure dispersion plate 25 and resist film peeling due to this are suppressed.

  For example, when producing a 2.5 inch magnetic recording medium, if the diameter of a 2.5 inch glass substrate is 63.5 mm, the pressure dispersion plate 25 is preferably about 1 mm thick and about 63.7 mm in diameter.

Examples of the stamper 20 include metals such as Fe and Ni. Those made of Ni (longitudinal elastic modulus: about 20000 kgf / mm ² ) that can be satisfactorily produced using electroforming are preferred. In the present embodiment, the concave / convex pattern of the stamper 20 has a groove structure or a peak structure such as a circular shape or a square shape having a depth in the film thickness direction of 500 nm or less and a width of 200 nm or less, and the top and bottom of the concave / convex structure. The plane is assumed to be a flat structure with a strain of 10 nm or less.

  The material of the press top plate 5 and the press bottom plate 10 is preferably a cemented carbide, and other materials include low carbon steel.

  The mechanism for positioning the stacked body 15 and the stamper 20 plays a role of precisely transferring the unevenness to the stacked body 15. Examples of the positioning mechanism include a laser for grasping the position and a mechanical mechanism for controlling the position. The laser is irradiated from the upper surface or the lower surface, and the horizontal positions of the stamper 20 and the stacked body 15 are grasped. The mechanical mechanism extends from several points in the lateral direction and controls the lateral positions of the stamper 20 and the stacked body 15.

  The mechanism that arranges the press top plate 5, the press bottom plate 10 and the pressure dispersion plate 25 in the parallel direction plays a role of improving the uniformity of the pressure received by the laminate 15 and the stamper 20. As for the mechanism arranged in the parallel direction, for example, the guide 1 for keeping the press top plate 5 and the press bottom plate 10 parallel, the press top plate 5, the laminate 15, the stamper 20, the pressure dispersion plate 25, and the press bottom plate 10 are adjacent to each other. A mechanism for bringing the interface to be brought into close contact with a vacuum state or a quasi-vacuum state. The guide 1 maintains the parallel state of the press top plate 5 and the press bottom plate 10, and the mechanism for closely contacting maintains the parallel state of the pressure dispersion plate 25, the press top plate 5 and the press bottom plate 10.

As described above, the laminate 15 has a structure in which a substrate, a magnetic film, and a resist film are sequentially laminated. As the material of the substrate, glass, Al alloy, ceramic, carbon, Si single crystal having an oxidized surface, etc., and those obtained by plating them with NiP or the like can be used. Examples of the glass include general-purpose soda-lime glass and amorphous glass such as aluminosilicate glass, and crystallized glass such as lithium-based crystallized glass (vertical number coefficient is about 7200 kgf / mm ² ).

(Modification 1.1)
An example of an imprint apparatus according to Modification 1.1 will be described with reference to FIG. For convenience, the points different from the first embodiment will be described.

  FIG. 2 is a schematic perspective view for explaining a die set of an imprint apparatus according to Modification Example 1.1.

  In Modification 1.1, a cylindrical centering pin formed on the press bottom plate 10 and provided perpendicular to the press bottom plate 10 is used as a mechanism for positioning the laminated body 15 and the stamper 20.

  Usually, the magnetic recording medium has a donut shape, and the laminated body 15 also has a donut shape. Therefore, the centering pin 30 is passed through the center holes of the laminate 15, the stamper 20 and the pressure dispersion plate 25 to perform positioning.

  The stamper 20 is preferably provided with an alignment mark. By pressing the laminate 15 and the stamper 20 against the centering pin 30 from the direction of the alignment mark, the positional deviation of the pattern transferred to the laminate 15 can be suppressed, and the positioning accuracy is improved.

  According to Modification 1.1, the positioning accuracy between the stacked body 15 and the stamper 20 can be easily improved.

(Modification 1.2)
An example of an imprint apparatus according to Modification 1.2 will be described with reference to FIG. For convenience, the points different from the first embodiment will be described.

  FIG. 3 is a schematic cross-sectional view for explaining a die set of an imprint apparatus according to Modification 1.2. For convenience, the points different from the first embodiment will be described.

  In Modification 1.2, as a mechanism for arranging the press bottom plate 10 and the pressure dispersion plate 25 in the parallel direction, a guide 1 arranged in a direction perpendicular to the press top plate 5 and the press bottom plate 10 is used.

  That is, the pressure dispersion plate 25 is penetrated by the guide 1 so that the elevation can be appropriately controlled, and is arranged in a direction parallel to the press top plate 5 and the press bottom plate 10. One set of the laminated body 15 and the stamper 20 is disposed on the press bottom plate 10 and the pressure dispersion plate 25, respectively.

  It is preferable that there are several guides 1 around them so that the laminated body 15 and the stamper 20 can be easily arranged. The accuracy of arranging the pressure dispersion plate 25 in the parallel direction and the weight of the pressure dispersion plate 25 itself. From the request for evenly supporting 3 to 4 is preferable.

  According to the modified example 1.2, the laminated body 15 and the stamper 20 do not cause a transfer failure due to the weight of the pressure dispersion plate 25 as described above, and thus it is possible to perform imprint with higher accuracy. Since there is no inconvenience due to the weight of the pressure dispersion plate 25, the upper limit of the thickness of the pressure dispersion plate 25 is 50.0 mm or less for convenience of use.

  In addition, if the centering pin 30 is provided on the press bottom plate 10 and the pressure dispersion plate 25, the effect described in the modification 1.1 is obtained, which is more preferable.

(Second Embodiment)
An example of the imprint method according to the second embodiment will be described.

  In the imprint method according to the second embodiment, first, a laminated resist film in which a magnetic film and a resist film are sequentially laminated on a substrate, and a surface on which irregularities to be transferred to the stamper resist film are formed. , And the transfer position of the unevenness is determined. Before and after this, a plurality of sets of laminates and stampers are arranged between the press bottom plate and the press top plate. Further, a pressure dispersion plate is disposed between the sets so as to be parallel to the press surfaces of the press bottom plate and the press top plate. Then, using the press bottom plate and the press top plate, the laminate, the stamper, and the pressure dispersion plate are pressed.

  This imprinting method assumes conditions of a pressure of 30 MPa or more and a printing temperature of 80 ° C. or less.

  When a magnetic recording medium is manufactured by using the imprint method of this embodiment, a process for processing the magnetic layer is further required using the unevenness transferred to the resist layer of the laminate as a mask. An example of the process will be described.

After imprinting, the resist residue in the resist recess is removed using reactive ion etching to expose the magnetic layer. Next, by using ion milling such as Ar milling, the exposed portion of the magnetic layer is processed using the uneven pattern formed of the resist film as a mask. Thereafter, the resist film on the convex portion of the magnetic layer is removed. Incidentally, after this step, the magnetic layer recesses, SiO _2, carbon, alumina, PMMA (polymethylmethacrylate), may be filled with nonmagnetic material PS (polystyrene) polymer or smooth oil such like.

  An imprint method using the imprint apparatus according to the modification 1.1 will be described. The step of arranging a plurality of laminates, stampers, and pressure dispersion plates is installed on the centering pin in order from the bottom. When installing the laminate and the stamper, the alignment mark of the stamper is fixed in one direction and pressed against the centering pin. This positioning can improve positioning accuracy.

  An imprint method using the imprint apparatus according to the modification 1.2 will be described. The step of arranging a plurality of laminated bodies and stampers is performed by arranging the laminated bodies and stampers on the press bottom plate and the pressure dispersion plate.

(Modification 2.1)
An example of an imprint method according to Modification 2.1 will be described with reference to FIG.

  The imprint method according to modification 2.1 is the same as that of the second embodiment except that a step of placing a buffer above or below the set is added.

  FIG. 4 is a schematic cross-sectional view for explaining the imprint method according to the second embodiment.

  As shown in FIG. 4, a buffer 35 is provided on the set of the laminate 15 and the stamper 20.

  The buffer 35 used here is deformed by pressure during imprinting, thereby correcting the micron-order distortion of the laminate 15, the stamper 20, and the pressure dispersion plate 25 itself, thereby enabling uniform weighting.

  Since the buffer 35 is required to be easily deformed, it is preferable that a material having a low longitudinal elastic modulus is used, and the buffer 35 is approximately two orders of magnitude lower than the longitudinal elastic modulus of the pressure dispersion plate 25 and the stamper 20.

  In addition, the buffer 35 is made of a material having a low coefficient of friction in order to prevent the structure facing the buffer 35 from being dragged by the distortion of the buffer 35 itself during imprinting.

Specific examples include synthetic resins, synthetic rubbers, superplastic aluminum alloys, and the like. Among these, a PET (polyethylene terephthalate) sheet is preferable from the viewpoints of longitudinal elastic modulus (402 kgf / mm ² ), friction coefficient (about 0.7), ease of processing, and the like.

  When a PET sheet is used, the thickness is preferably 0.5 mm or more and 2.0 mm or less. If it is less than 0.5 mm, the outer periphery will be overloaded, and if it is greater than 2.0 mm, the inner periphery will be overloaded. In addition, when the buffer 35 is thick, the distortion increases and the components are more easily dragged.

  The buffer 35 may not be used when the distortion of the laminate 15, the stamper 20, and the pressure dispersion plate 25 itself is less than a micron order.

  In addition, it is unsuitable to arrange the buffers 35 at two locations above and below the set of the laminate 15 and the stamper 20. This is because the buffer 35 is distorted at the top and bottom of the set and the pressure becomes non-uniform, and the substrate of the stacked body 15 sandwiched therebetween is broken.

  Examples will be described below, but the present invention is not limited to the examples described below unless the gist of the present invention is exceeded.

  (Test A) Lamination imprint test of various imprint apparatuses, (Test B) Relationship between thickness of pressure dispersion plate, strain of pressure dispersion plate and substrate breakage, (Test C) Number of substrate lamination and strain of pressure dispersion plate Relationship with substrate breakage was performed.

(Test A) Laminate imprint test of various imprint apparatuses Using the imprint apparatus shown in FIG. 1 (a), the inside of the die set was changed as shown below, and a multilayer imprint test was performed.

The pressure dispersion plate is made of cemented carbide composed of WC fine powder and Co binder (longitudinal elastic modulus about 56000 kgf / mm ² , grade symbol V3 of Futaba Electronics Co., Ltd. 3.5 μm), medium Co content, hardness 88.0 (HRA)). The thickness of the pressure dispersion plate was 5.0 mm.

  The laminate is composed of a substrate, a magnetic film, and a resist film. As a substrate, a crystallized glass substrate having a diameter of 65 mm, an inner diameter of 20 mm, and a thickness of 0.6 mm and having a 2.5 inch donut shape was used. The magnetic film was formed on the substrate using sputtering. The resist film was formed by applying a novolac resist (trade name S1801 manufactured by Rohm and Haas Electronic Materials Co., Ltd.) to a thickness of about 100 nm using a spin coater. The spin coater was rotated at 500 rpm for 2 seconds, 1000 rpm for 3 seconds, and finally 4000 rpm. The reason why the spin speed is gradually increased is to increase the flatness of the resist film.

  The stamper used was a donut-shaped Ni product having a diameter of 65 mm, an inner diameter of 20 mm, and a thickness of 0.3 mm. On the stamper surface, concentric recording tracks and servo information patterns having a track width of 300 nm, a groove width of 200 nm, and a concavo-convex pattern depth of 70 nm are embedded from a radial position of 21 mm to 32 mm.

  As the buffer, a PET sheet having a thickness of 0.1 mm (trade name EMBLET manufactured by Unitika Ltd.) was used. The cemented carbide similar to the pressure dispersion plate was used for the press bottom plate and the press top plate.

  Using the above configuration, for the imprint apparatuses shown in Examples A1 to A4 and Comparative Example A1, the die set was lowered, and a 30-t press was performed for 1 minute at room temperature (20 ° C.) and atmospheric pressure.

(Example A1)
A buffer was placed on a set in which a stamper was placed on the laminate to form one unit, and the pressure dispersion plates were sandwiched and placed between these units. This corresponds to the imprint apparatus of FIG. 1A according to the first embodiment.

  Two to three units of laminated imprint could be transferred satisfactorily. The positioning accuracy at this time was about 200 μm.

(Example A2)
The configuration was the same as in Example A1 except that a centering pin was provided on the press bottom plate. The example A2 corresponds to the imprint apparatus shown in FIG. Positioning was performed by using a stamper alignment mark to hit the centering pin.

  Two to three units of laminated imprint could be performed. At this time, the positioning accuracy was about 3 μm.

(Example A3)
The pressure dispersion plate was penetrated by the guide, and the configuration was the same as Example A1, except that the thickness of the pressure dispersion plate was 20 mm. The example A3 corresponds to the imprint apparatus shown in FIG.

  Two to three units of laminated imprint could be transferred satisfactorily. The positioning accuracy at this time was about 200 μm.

(Example A4)
The configuration was the same as that of Example A1 except that a stamper, a laminate, and a set in which stampers were arranged in this order from the bottom.

  Two to three units of laminated imprint could be performed.

(Comparative Example A1)
The configuration was the same as in Example A1 except that the pressure dispersion plate and the buffer of the unit other than the uppermost layer were removed. In addition, if a structure is described from the top, in the case of 2 units, it will become a buffer (laminate, stamper) (laminate, stamper).

  As a result of performing the laminated imprint with 2 to 3 units, it was confirmed that the lower layer unit had cracks on the substrate of the laminated body. As a result of performing the laminated imprint with 4 units, it was confirmed that the substrate of the laminated body was damaged. This damage is considered to be due to accumulation of strain.

  Note that the same experiment as in Examples A1 to A4 and Comparative Example A1 was performed on laminated bodies having different substrate sizes of 1.8 inches. As a result, except for the amount of distortion, the same tendency was observed in terms of transfer quality. At this time, even if the buffer was not used, the same result as that obtained when the buffer was used was obtained.

(Test B) Relationship between Pressure Dispersion Plate Thickness, Pressure Dispersion Plate Distortion, and Substrate Breakage Imprints with different thickness of the pressure dispersion plate were performed, and the amount of strain on the press surface was examined. The amount of strain was defined as the difference between the maximum value and the minimum value of the pressure distribution appearing on the pressure sensitive paper sandwiched under the pressure dispersion plate. Using the imprint apparatus of Example A2, two units of laminated imprint were performed.

  As shown in Table 1, when a cemented carbide is used for the pressure dispersion plate, if the thickness is 0.5 mm or more, the amount of strain is drastically reduced, and breakage of the substrate can be prevented. Further, when the thickness is 10 mm or more, the amount of strain is further reduced. Therefore, the pressure dispersion plate made of cemented carbide is preferably 0.5 mm or more, and more preferably 10 mm or more.

(Test C) Relationship Between Number of Substrate Layers, Pressure Dispersion Plate Strain and Substrate Breakage Using the imprint apparatus of Comparative Example A1, laminate imprinting was performed, and the amount of strain on the press surface of the pressure dispersion plate was examined. The amount of strain was defined as the difference between the maximum value and the minimum value of the pressure distribution appearing on the pressure sensitive paper sandwiched under the pressure dispersion plate.

  As shown in Table 2, it was found that the substrate was damaged when the strain amount of the pressure dispersion plate was about 10 μm or more.

  As mentioned above, although embodiment of this invention was described, this invention is not restricted to these, In the category of the summary of the invention as described in a claim, it can change variously. In addition, the present invention can be variously modified without departing from the scope of the invention in the implementation stage. Furthermore, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.

(A) The side surface schematic diagram of the imprint apparatus concerning 1st Embodiment. (B) The cross-sectional schematic diagram inside the die set at the time of the imprint of the imprint apparatus concerning 1st Embodiment. The perspective schematic diagram for demonstrating the die set of the imprint apparatus concerning the modification 1.1. Sectional schematic diagram for demonstrating the die set of the imprint apparatus concerning the modification 1.2. Sectional schematic diagram for demonstrating the imprint method concerning 2nd Embodiment.

Explanation of symbols

1 Guide 5 Press Top Plate 10 Press Bottom Plate 15 Laminate 20 Stamper 25 Pressure Dispersion Plate 30 Centering Pin 35 Buffer

Claims (6)

Press bottom plate,
A press top plate facing the press bottom plate;
A plurality of stampers disposed between the press bottom plate and the press top plate, and having a concavo-convex to be transferred to the resist film of a laminate in which a magnetic film and a resist film are sequentially laminated on a substrate;
A mechanism for positioning the laminate and the stamper;
A pressure distribution plate disposed between the stampers adjacent to each other;
An imprint apparatus comprising: a mechanism that arranges the press bottom plate, the press top plate, and the pressure dispersion plate in parallel directions. Press bottom plate,
A press top plate facing the press bottom plate;
A plurality of stampers disposed between the press bottom plate and the press top plate, and having a concavo-convex to be transferred to the resist film of a laminate in which a magnetic film and a resist film are sequentially laminated on a substrate;
A mechanism for positioning the laminate and the stamper;
A plate made of cemented carbide or low carbon steel, disposed between the stampers adjacent to each other;
An imprint apparatus comprising: a mechanism for arranging the press bottom plate, the press top plate, and a plate made of the cemented carbide or low carbon steel in a parallel direction.   3. The imprint apparatus according to claim 1, wherein a thickness of the pressure dispersion plate or the cemented carbide or low carbon steel plate is 0.5 mm or greater and 10.0 mm or less. A step of determining a transfer position of the concavo-convex by opposing the resist film of the laminate in which a magnetic film and a resist film are sequentially laminated on a substrate and a surface of the stamper on which the concavo-convex to be transferred is formed. ,
Arranging a plurality of sets of the laminate and the stamper between a press bottom plate and a press top plate;
Arranging the pressure dispersion plate between the sets so as to be parallel to the press surface of the press bottom plate and the press top plate;
And a step of pressing the laminate, the stamper, and the pressure dispersion plate using the press bottom plate and the press top plate. A step of determining a transfer position of the concavo-convex by opposing the resist film of the laminate in which a magnetic film and a resist film are sequentially laminated on a substrate and a surface of the stamper on which the concavo-convex to be transferred is formed. ,
Arranging a plurality of sets of the laminate and the stamper between a press bottom plate and a press top plate;
Placing a plate made of cemented carbide or low carbon steel between the sets so as to be parallel to the press surface of the press bottom plate and the press top plate; and
And a step of pressing the laminate, the stamper, and a plate made of the cemented carbide or low carbon steel using the press bottom plate and the press top plate. 6. The imprint method according to claim 4, further comprising a step of placing a buffer above or below the set.

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