JP2006048388A - Input device, display device using the input device and electronic device using the display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an input device which can raise the breaking resistance of a wiring member extending to the outside from the side of the input device, a display device using the input device, and an electronic device using the display device. <P>SOLUTION: An installation part 8 is formed integratedly with a lower substrate 3 at the side end 3b of a side to which a flexible printed circuit board (FPC) 6 of the lower substrate 3 is led out. A projection length L0 from the side end 2b of an upper sheet 2 of the installation part 8 is made longer than the length L1 of a wiring exposing part 6a2 of the FPC 6. On the installation part 8, the wiring exposing part 6a2 and a part of the back end 6e of the FPC 6 is installed. By this way, when trying to bend the FPC 6 downward, a bending force becomes hard to act on the wiring exposing part 6a2 which is the weakest against the bending force, and the breaking resistance of the FPC 6 can be raised properly. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an input device such as a touch panel, a display device using the input device, and an electronic apparatus using the display device, and in particular, the folding resistance of a wiring member extending from the side of the input device to the outside. The present invention relates to an input device that can be improved, a display device using the input device, and an electronic apparatus using the display device.

Patent Document 1 below discloses a specific structure of a touch panel.
The touch panel has a transparent electrode made of ITO (indium tin oxide) or the like on the lower surface, a flexible upper electrode sheet made of a transparent film formed in a substantially rectangular shape, and a transparent electrode made of ITO or the like on the upper surface. And a lower electrode substrate made of a transparent plastic substrate formed substantially in the same shape as the upper electrode sheet. The upper electrode sheet and the lower electrode substrate are disposed to face each other with a circuit resist formed on the outer periphery of the rectangle with a predetermined width so that the transparent electrodes face each other with a predetermined interval.

A specific structure of the touch panel will be described with reference to FIGS.
As shown in FIG. 6, the input device 1 includes an upper sheet 2 and a lower substrate 3, and is positioned and fixed to the housing 5 at a predetermined interval above a display member 4 such as a liquid crystal display. The

  A resistance film (ITO film) (not shown) is formed on the entire lower surface 2a of the upper sheet 2 with a predetermined thickness. Under the resistance film, the resistance film is formed in parallel in the X1-X2 direction. A pair of upper electrodes (not shown) are formed.

  A resistance film (ITO film) (not shown) is formed on the entire upper surface 3a of the lower substrate 3 with a predetermined thickness. On the resistance film, a pair formed in parallel with an interval in the Y direction. The lower electrode (not shown) is formed.

  The upper sheet 2 is arranged such that the resistance film formed on the lower surface 2a is opposed to the resistance film formed on the lower substrate 3, and the upper electrode is positioned on the side where the lower electrode does not exist, not shown. The circuit resist is combined so as to face the lower substrate 3 at a predetermined interval.

  The circuit resist is not formed in the vicinity of the predetermined side end portions of the upper sheet 2 and the lower substrate 3, and as shown in FIG. 7, the lower electrode and the upper electrode are disposed in the vicinity of the predetermined side end portion. Lead electrodes 21 and 31 are formed, and the lead electrodes 21 and 31 are joined to a flexible printed circuit board 6 (hereinafter referred to as FPC 6) via a conductive adhesive 7. The FPC 6 is thermocompression-bonded and pulled out from the side sheets 2b and 3b of the upper sheet 2 and the lower substrate 3 to the outside.

  As shown in FIG. 7, the FPC 6 includes a base film 8, wiring portions 90 and 90 formed above and below the base film 8, and a cover layer 100 such as polyimide covering the wiring portions 90 and 90.

As shown in FIG. 7, the tip portion 6 a of the FPC 6 is in a state where the wiring portion 90 is exposed above and below the base film 8. This is because the lead electrodes 21 and 31 and the wiring portions 90 and 90 are electrically connected via the conductive adhesives 7 and 7.
JP 2002-2222055 A

  As shown in FIG. 7, the length T <b> 0 of the front end portion 6 a of the FPC 6 is formed with a dimension longer than the joining length T <b> 2 between the upper sheet 2 and the lower substrate 3.

  For example, when the length T0 and the joining length T2 of the front end portion 6a are formed to be approximately the same, the FPC 6 is configured when the FPC 6 is joined between the upper sheet 2 and the lower substrate 3 due to misalignment or the like. The cover layer 100 to be inserted may enter between the extraction electrodes 21 and 31, and in such a case, the extraction electrodes 21 and 31 and the wiring portion 90 cannot be appropriately electrically connected. It is.

  For this reason, the length T0 of the front end portion 6a is longer than the joining length T2, and as a result, the portions where the wiring portion 90 is exposed are the side end portions 2b of the upper sheet 2 and the lower substrate 3, From 3b, the state is extended to the outside by a length T1.

  The external connection terminal 6b of the FPC 6 shown in FIG. 6 is a portion joined to a terminal portion of a display device or an electronic device (not shown), and is usually bent downward or upward as shown in FIG. It is electrically connected to a terminal portion of the display device or the like.

  However, since the FPC 6 has a wiring portion of the length T1 where the wiring portion 90 is exposed, the folding resistance at this portion is very weak. When the FPC 6 is bent up and down several times, the length There was a problem that the wiring portion 90 at the T1 portion was disconnected.

  On the other hand, in order to suppress the disconnection as described above, means such as providing a reinforcing member such as an adhesive, resin, and tape on the lower surface of the wiring portion where the wiring portion 90 is exposed has been considered. However, even in such a case, when the FPC 6 is bent, a strong bending force acts on the exposed wiring portion 90 and is easily disconnected. In addition, there are problems such as the complexity of forming the reinforcing member and the FPC 6 cannot be bent from a predetermined location unless the reinforcing member is formed with high accuracy.

  The present invention solves the above-described conventional problems, and in particular, an input device capable of improving the folding resistance of a wiring member extending from the side of the input device to the outside, and a display device using the input device An object of the present invention is to provide an electronic device using the display device.

The present invention
An upper resistance film is formed on the lower surface, a flexible upper sheet having a pair of upper electrodes formed below the upper resistance film, a lower resistance film is formed on the upper surface, and on the lower resistance film A lower substrate on which a pair of lower electrodes are formed; and interposed between the lower substrate and the upper sheet; and electrically connected to the upper electrode and the lower electrode; and A wiring member drawn out from the side to the outside,
In the input device in which the plane coordinates of the pressing point are detected from the upper electrode and the lower electrode through the wiring member when the operation area on the upper sheet is pressed toward the lower substrate.
A placement part that projects partially outward from the side edge of the upper sheet is formed integrally with the lower board at the side edge of the lower board,
The front end portion of the wiring member is fixed between the lower substrate and the upper sheet and is placed on the placement portion.

  In the present invention, a mounting portion that projects partially outward from the side edge of the upper sheet is formed integrally with the lower substrate at the side edge of the lower substrate.

  Conventionally, the lower substrate and the upper sheet are formed with the same dimensions. However, in the present invention, the tip of the wiring member that protrudes outward from the side edge of the upper sheet is placed on the lower substrate. The mounting part was provided. For this reason, conventionally, the vicinity of the root of the fixed end of the wiring member that is likely to be disconnected (the portion fixed between the lower substrate and the upper sheet) can be placed on the placement portion, and the bending force is as much as possible. It can be prevented from acting, and the folding resistance of the wiring member can be improved.

  Conventionally, it has been considered that the folding resistance of the wiring member is secured by a reinforcing member made of another member such as an adhesive or resin. However, in the present invention, the mounting portion for the wiring member is integrated with the lower substrate. By forming, it becomes possible to improve the bending resistance of the wiring member by a simpler method.

In the present invention, the wiring member is configured to include a base film, wiring portions formed above and below the base film, and a cover layer covering the wiring portion,
The wiring portion is electrically connected to the upper electrode and the lower electrode;
The wiring member has a front end portion in a state where the wiring portion is exposed, and a rear end portion of the wiring member is in a state in which the wiring portion is covered with the cover layer,
It is preferable that the protruding length of the placement portion from the side end portion of the upper sheet is longer than the length of the exposed wiring portion extending outward from the side end portion of the upper sheet in the tip portion.

  As a result, the wiring exposed part that is the weakest to the bending force is completely placed on the mounting part, so that the force when bending the wiring exposed part is less likely to act, and the folding resistance of the wiring member is appropriately set. Can be improved.

  In the present invention, it is preferable that the placement portion is provided with positioning means for the wiring member. In this case, the mounting portion is provided with a protruding portion protruding toward the wiring member direction, the wiring member is provided with an opening at a position facing the protruding portion, and the protruding portion is the opening portion. It is preferable that the wiring member is positioned by being inserted into the wiring. Alternatively, it is preferable that the placement portion is provided with a protruding portion that protrudes in the direction of the wiring member, and the wiring member is positioned by fixing the wiring member in the width direction.

  Thus, by providing the mounting part which protrudes, it is possible to provide positioning means for the wiring member on the mounting part, and it is possible to appropriately fix the wiring member on the mounting part.

  Moreover, in this invention, it is preferable that the said wiring member is joined and fixed via a fixing member on the said mounting part. As a result, the wiring member can be more effectively fixed on the placement portion.

  In the present invention, it is preferable that the mounting portion is injection-molded integrally with the lower substrate.

By the injection molding, the mounting portion can be easily integrally formed with the lower substrate.
In the present invention, the lower substrate is preferably made of a plastic material. In this case, it is preferable that the lower substrate is formed of a norbon-based transparent resin or a polyolefin-based transparent resin.

  Norbon-based transparent resins and polyolefin-based transparent resins have high light transmittance, and birefringence hardly occurs inside the lower substrate. For this reason, an image or the like displayed on the display member provided below the lower substrate is clearly displayed, and the image or the like can be reliably viewed from above. Further, the norbon-based transparent resin and the polyolefin-based transparent resin are excellent in heat resistance, can withstand high temperatures during injection molding, and can reduce warpage during molding of the lower substrate. Furthermore, norborn transparent resin and polyolefin transparent resin are inferior in hygroscopicity. For this reason, there are few water vapor | steam etc. in the air to absorb moisture, and it can prevent the intensity | strength change of the lower board | substrate by moisture absorption.

A display device according to the present invention is characterized in that any one of the input devices described above is mounted.
An electronic apparatus according to the present invention is characterized in that the display device is mounted.

  As described above, in the present invention, since the folding resistance of the wiring member can be improved, no matter how the wiring member is bent in order to be connected to the terminal portion of the display device or electronic device, the wiring member It is possible to provide a display device and an electronic device that are less likely to be disconnected and have excellent electrical connectivity.

  In the present invention, the folding resistance of the wiring member extending from the side of the input device to the outside can be improved by a simpler method than in the past.

  FIG. 1 is a cross-sectional view showing the input device of the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIG. 3 is a partially enlarged plan view of the flexible printed circuit board of the present invention and the vicinity of the mounting portion. The same parts as those in the conventional input device shown in FIGS. 6 and 7 are denoted by the same reference numerals as those shown in FIGS.

  As shown in FIG. 1, the input device 1 of the present invention has an upper sheet 2 and a lower substrate 3, and is attached to a housing 5 at a predetermined interval above a display member 4 such as a liquid crystal display. Positioning is fixed.

  The upper sheet 2 is made of a synthetic resin such as transparent polyethylene terephthalate and has flexibility, and an upper resistance film (not shown) is formed on the entire lower surface 2a of the upper sheet 2 with a predetermined thickness. . The upper resistance film is formed by sputtering or vacuum deposition using ITO (indium tin oxide) as a raw material. Under the upper resistance film, a pair of upper electrodes 21a, 21a made of silver or the like are formed in parallel with an interval in the X1-X2 direction, and an operation region 22 is formed between the upper electrodes 21a, 21a. Has been.

  The lower substrate 3 is a transparent plastic substrate, and a lower resistance film (not shown) made of ITO is formed on the entire upper surface 3a of the lower substrate 3 in the same manner as the resistance film formed on the upper sheet 2. Is formed. On this lower resistance film, a pair of lower electrodes 31a, 31a made of silver or the like formed in parallel with a gap in the Y1-Y2 direction is formed, and an operation region 32 is formed between the lower electrodes 31a, 31a. Has been.

  The upper sheet 2 is arranged with the upper resistive film formed on the lower surface 2a facing the lower resistive film formed on the lower substrate 3, and the upper electrode 21a is positioned on the side where the lower electrode 31a does not exist, The insulating spacers (not shown) are combined so as to face the lower substrate 3 at a predetermined interval.

  As shown in FIG. 2, an extraction upper electrode 21 b connected to the upper electrode 21 a is formed in the vicinity of the side edge of the upper sheet 2, while an extraction lower electrode 31 b connected to the lower electrode 31 a is formed on the lower substrate 3. It is formed near the side end.

  The insulating spacer is not formed in the vicinity of the side edge of the upper sheet 2 on which the extraction upper electrode 21b is formed and the lower substrate 3 on which the extraction lower electrode 31b is formed. As shown in FIG. A flexible printed circuit board 6 (hereinafter referred to as FPC 6) is joined to 21b and the lead-out lower electrode 31b via a conductive adhesive 7.

  For example, when an arbitrary position in the operation area 22 of the upper sheet 2 is pressed downward with an input pen or the like (not shown), the upper sheet 2 is first deformed downward and the upper sheet 2 is moved between the operation areas 22 and 32. The upper resistance film formed on the lower substrate 3 is in contact with the lower resistance film formed on the lower substrate 3.

  In the X coordinate detection at the pressing point, when a voltage is applied between the upper electrodes 21a of the upper sheet 2, a potential gradient is generated between the upper electrodes 21a due to the resistance of the upper resistance film formed on the lower surface 2a of the upper sheet 2. When the potential at the pressing point is detected from the lower electrode 31a formed on the lower substrate 3 through the external connection terminal 6b of the FPC 6, the X coordinate at the pressing point can be known.

  Further, in the Y coordinate detection at the pressing point, when a voltage is applied between the lower electrodes 31 a of the lower substrate 3, a potential gradient is generated between the lower electrodes 31 a due to the resistance of the lower resistance film formed on the upper surface 3 a of the lower substrate 3. . When the potential at the pressing point is detected from the upper electrode 21a of the upper sheet 2 through the external connection terminal 6b of the FPC 6, the Y coordinate at the pressing point can be known.

  The FPC 6 includes a base film 6d made of polyimide film or the like, wiring portions 6b1 and 6b2 made of copper foil or the like formed above and below the base film 6d, a cover layer 6c made of polyimide or the like and covering the wiring portions 6b1 and 6b2. It is comprised.

  As shown in FIGS. 2 and 3, two upper wiring portions 6 b 1 are provided, and are joined to the lead-out upper electrode 21 b provided with the same two via the conductive adhesive 7. Similarly, two lower wiring portions 6b2 are also provided, and are joined to the lead-out lower electrode 31b provided with the same two via the conductive adhesive 7. Each lead electrode and each wiring part are preferably bonded by thermocompression bonding.

  In the present invention, as shown in FIGS. 2 and 3, the side end portion 3 b of the lower substrate 3 has a placement portion 8 that partially protrudes outward from the side end portion 2 b of the upper sheet 2. It is molded integrally with the substrate 3.

  The front end portion 6a of the FPC 6 is formed by only the base film 6d and the wiring portions 6b1 and 6b2 formed above and below the base film 6d, and the wiring portions 6b1 and 6b2 are exposed. The rear end portion 6e of the FPC 6 is a region where the wiring portions 6b1 and 6b2 formed above and below the base film 6d are covered with the cover layer 6c.

  The front end portion 6a of the FPC 6 includes a fixed end portion 6a1 joined to the lead electrodes 21b and 31b via the conductive adhesive 7, and a wiring exposed portion in which the wiring portions 6b1 and 6b2 are exposed to the outside. 6a2.

  On the placement part 8, the wiring exposed part 6a2 of the FPC 6 and a part of the rear end part 6e are placed.

  That is, the mounting portion 8 has a wiring exposure in which a protruding length (length in the X1-X2 direction) L0 from the side end 2b of the upper sheet 2 extends outward from the side end 2b of the upper sheet 2. It is formed longer than the length L1 of the part 6a2. As shown in FIG. 3, the placement portion 8 is partially protruded from the side end portion 3 b of the lower substrate 3. The width dimension of the placement portion 8 (the length in the Y1-Y2 direction in the drawing) may be at least wider than the width dimension of the FPC 6.

  As described above, the wiring exposed portion 6a2 and a part of the rear end portion 6e where the wiring portions 6b1 and 6b2 are protected by the cover layer 6c are placed on the placement portion 8. Therefore, as shown in FIG. 2, when the FPC 6 is bent downward, the FPC 6 is lowered from the vicinity of the boundary with the mounting portion 8 of the rear end portion 6e of the FPC 6 that is most resistant to bending force due to the presence of the cover layer 6c. Since it is bent in the direction, it becomes difficult for the bending force to act on the wiring exposed portion 6a2 which is the weakest in the bending force, and the folding resistance of the FPC 6 can be improved appropriately.

  Further, as shown in the arrow direction of FIG. 2, when the FPC 6 is to be bent upward in the drawing, the cover layer 6c is not formed, and therefore, the FPC 6 is easily bent from the wiring exposed portion 6a2 having the lowest rigidity. The disconnection at the wiring exposed portion 6a2 is likely to occur.

  Therefore, as shown in FIGS. 2 and 3, it is preferable to fix the mounting portion 8 and the FPC 6 by interposing a fixing member 40 such as an adhesive between the mounting portion 8 and the FPC 6.

The fixing member 40 can be a double-sided tape or an adhesive.
For example, a single-sided adhesive tape may be used for the fixing member 40, and the FPC 6 and the placement unit 8 may be fixed by attaching the single-sided adhesive tape to the upper surface of the placement unit 8 from the upper surface side of the FPC 6.

  In the present invention, the fixing member 40 may be provided when the FPC 6 is bent in the downward direction in the figure, that is, in the direction of the placing portion 8. Even in such a case, it is possible to appropriately suppress the bending force from acting on the wiring exposed portion 6a2, and to achieve a structure with excellent folding resistance.

  The shape of the mounting portion 8 is not limited to the shape as shown in FIGS. 2 and 3 as long as the wiring exposed portion 6a2 and part of the rear end portion 6e of the FPC 6 can be mounted. The cross-sectional shape (the shape in FIG. 2) may be a rectangle, and the shape when viewed from above (the shape in FIG. 3) may be an elliptical shape or the like.

  FIG. 4 is a partially enlarged plan view of the vicinity of the FPC 6 and the mounting portion 8 according to another modification of the present invention as viewed from above, and FIG. 5 is a portion cut from the film thickness direction of another modification shown in FIG. It is sectional drawing.

  In this modification, as shown in FIGS. 4 and 5, a protrusion 9 is provided from above the placement portion 8, and a through hole 10 is provided in the FPC 6 at a position facing the protrusion 9. . The protruding portion 9 is preferably formed integrally with the mounting portion 8, and in such a case, the protruding portion 9 is formed by injection molding.

  The protrusion 9 and the through hole 10 function as positioning means for the FPC 6. For example, as shown in FIG. 5, by forming both the protrusion 9 and the through hole 10 and fitting the protrusion 9 into the through hole 10, the FPC 6 can be appropriately fixed on the mounting portion 8, and the FPC 6 Can be properly positioned. Further, due to the fitting of the projection 9 and the through-hole 10, for example, during the manufacturing process (during the process before joining the FPC 6 and the lead electrodes 21b and 31b with the conductive adhesive 7) in the horizontal direction (XY). When a pulling force in a direction parallel to the plane) is applied to the FPC 6, durability against the pulling force is improved, and the pulling force prevents the FPC 6 from being removed from the mounting portion 8. it can.

  The positioning means of the FPC 6 is not limited to the form (shape) shown in FIGS. As shown in FIG. 4, the protrusion 9 has a pin shape, but may have a rib shape. Further, the protrusion 9 is not penetrated through the FPC 6, but is a protrusion matching the width of the FPC 6, and the FPC 6 may be fixed by the protrusion 9 in the width direction and positioned. Moreover, not the through-hole 10 but a notch may be sufficient.

  In addition, the dimensions of the mounting portion 8 and the fixing member 40 are the same as those described with reference to FIGS.

  The lower substrate 3 of the present invention is formed of a plastic material, and is particularly preferably formed of a norbon-based transparent resin or a polyolefin-based transparent resin. The norbon-based transparent resin and the polyolefin-based transparent resin have high light transmittance, and birefringence hardly occurs inside the lower substrate 3. For this reason, the image displayed on the display member 4 is clearly projected, and the image or the like can be reliably viewed from above. Further, the norbon-based transparent resin and the polyolefin-based transparent resin are excellent in heat resistance, can withstand high temperatures during injection molding, and can reduce warping during molding of the lower substrate 3. Furthermore, norborn transparent resin and polyolefin transparent resin are inferior in hygroscopicity. For this reason, there are few water vapor | steam etc. in the air to absorb moisture, and the strength change of the lower board | substrate 3 by moisture absorption can be prevented.

  In the present invention, as described above, the lower substrate 3 is formed of a plastic material, so that the mounting portion 8 and the protruding portion 9 formed on the mounting portion 8 are injection-molded integrally with the lower substrate 3. Is possible.

  As shown in FIG. 1, an apparatus having the input device 1, the display member 4, the light guide member 11, and a light source (not shown) as described above can be used as the display device. In such a display device, disconnection of the FPC 6 is prevented. For this reason, it is prevented that the reliability of the input device 1 is impaired, and an image projected from the display member 4 can be reliably selected by the input device 1.

  The display device on which the input device 1 of the present invention is mounted as described above can be mounted on an electronic device such as a PDA (personal digital assistant), a palm-sized small personal computer, or a mobile phone.

  Since such an electronic device includes the input device 1 of the present invention, disconnection of the FPC 6 is prevented, and thus the reliability of the input device 1 may be impaired even in a small electronic device such as a PDA. Thus, the desired information can be reliably input by the input device 1.

  Further, since the electronic apparatus includes the display device, an image displayed from the display member 4 can be reliably selected by the input device 1. Therefore, the operator of the electronic device can operate the electronic device accurately while confirming the image or the like.

Sectional drawing which shows the input device of this invention, FIG. 1 is a partially enlarged view of FIG. Partial enlarged plan view of the vicinity of the flexible printed circuit board and the mounting portion of the present invention from above, The partial enlarged plan view when the vicinity of FPC6 and the mounting part 8 of the other modification of this invention is seen from upper direction, FIG. 4 is a partial cross-sectional view of another modification shown in FIG. 4 cut from the film thickness direction; The figure which shows the reinforcement method of the flexible printed circuit board in the conventional input device, Partial enlarged view of FIG.

Explanation of symbols

1 Input device 2 Upper sheet 3 Lower substrate 4 Display member 5 Housing 6 Flexible printed circuit board (FPC)
6a2 Wiring exposed portion 6e Rear end portion 7 Conductive adhesive 8 Mounting portion 9 Protruding portion 10 Through hole 11 Light guide member 21b Drawer upper electrode 31b Drawer lower electrode 40 Fixing member

Claims (11)

An upper resistance film is formed on the lower surface, a flexible upper sheet having a pair of upper electrodes formed below the upper resistance film, a lower resistance film is formed on the upper surface, and on the lower resistance film A lower substrate on which a pair of lower electrodes are formed; and interposed between the lower substrate and the upper sheet; and electrically connected to the upper electrode and the lower electrode; and A wiring member drawn out from the side to the outside,
In the input device, when the operation area of the upper sheet is pressed toward the lower substrate, the plane coordinates of the pressing point are detected from the upper electrode and the lower electrode via the wiring member.
A placement part that projects partially outward from the side edge of the upper sheet is formed integrally with the lower board at the side edge of the lower board,
The input device according to claim 1, wherein a front end portion of the wiring member is fixed between the lower substrate and the upper sheet and is placed on the placement portion. The wiring member includes a base film, a wiring portion formed above and below the base film, and a cover layer that covers the wiring portion,
The wiring portion is electrically connected to the upper electrode and the lower electrode;
The wiring member has a front end portion in a state where the wiring portion is exposed, and a rear end portion of the wiring member is in a state in which the wiring portion is covered with the cover layer,
The protrusion length from the side edge part of the said upper sheet of the said mounting part is longer than the length of the wiring exposure part extended outward from the side edge part of the said upper sheet among the said front-end | tip parts. Input device.   The input device according to claim 1, wherein the placement portion is provided with positioning means for the wiring member.   The mounting portion is provided with a protruding portion that protrudes in the direction of the wiring member, the wiring member is provided with an opening at a position facing the protruding portion, and the protruding portion is inserted into the opening. The input device according to claim 3, wherein the wiring member is positioned.   The input according to claim 3, wherein the mounting portion is provided with a protruding portion that protrudes toward the wiring member direction, and the protruding portion positions the wiring member by fixing the wiring member in the width direction. apparatus.   The input device according to claim 1, wherein the wiring member is bonded and fixed on the placement portion via a fixing member.   The input device according to claim 1, wherein the placement unit is injection-molded integrally with the lower substrate.   The input device according to claim 1, wherein the lower substrate is made of a plastic material.   The input device according to claim 8, wherein the lower substrate is formed of a norbon-based transparent resin or a polyolefin-based transparent resin.   A display device comprising the input device according to claim 1.   An electronic apparatus comprising the display device according to claim 10.

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