JP2005329093A - Solid-state imaging device for electronic endoscope - Google Patents

Abstract

An electronic endoscope in which a lead bent backward from the light receiving surface side of a solid-state image sensor is less likely to be damaged during bending and less likely to short-circuit with the solid-state image sensor when used. A mirror solid-state imaging device is provided.
A plurality of leads 11 having one ends connected to the front surface side of a solid-state imaging device 5 on which a light-receiving surface 5a is arranged are arranged in parallel, and each lead 11 is oriented in parallel with a side surface of the solid-state imaging device 5. In a solid-state imaging device of an electronic endoscope that is bent and extended toward the rear of the solid-state imaging device 5, a single electrically insulating rod-like member 13 is formed of a plurality of leads 11 arranged in parallel. It arrange | positioned in the state along the inner side of a bending part.
[Selection] Figure 1

Description

  The present invention relates to a solid-state imaging device for an electronic endoscope.

In an electronic endoscope incorporating a solid-state image sensor at the tip of an insertion portion, generally, a plurality of leads having one end connected to the front side of a solid-state image sensor on which a light receiving surface is arranged are arranged in parallel, and each lead is arranged. The sheet-like member is bent in a direction parallel to the side surface of the solid-state image sensor and extended toward the rear of the solid-state image sensor, and an electrically insulating sheet-like member is interposed between each lead and the side surface of the solid-state image sensor. (For example, Patent Document 1).
JP-A-10-192234

  When the lead is bent in the assembly process of the solid-state imaging device as described above, the lead is bent so as to be pressed against the outer surface of the electrically insulating sheet-like member disposed along the side surface of the solid-state imaging device.

  However, in such a bending process, since the bent part is not mechanically received, a large bending stress acts locally on the bent part and the lead is damaged, and the solid-state imaging device becomes defective. There is.

  In addition, while the solid-state imaging device is incorporated in an endoscope, the sheet-like member is deformed or moved due to the distortion of the lead caused by heat generation of the solid-state imaging device, so that the lead is solid-state imaged. There is a case where an electrical short circuit occurs in contact with the side surface of the element.

  Therefore, the present invention provides an electronic device in which a lead bent backward from the light receiving surface side of the solid-state image sensor is less likely to be damaged during bending and less likely to short-circuit with the solid-state image sensor during use. An object of the present invention is to provide a solid-state imaging device for an endoscope.

  In order to achieve the above object, a solid-state imaging device for an electronic endoscope according to the present invention has a plurality of leads, one end of which is connected to the front side of a solid-state imaging device on which a light receiving surface is arranged, arranged in parallel. In a solid-state imaging device of an electronic endoscope, each of which is bent in a direction parallel to the side surface of the solid-state imaging device and extended toward the rear of the solid-state imaging device, a single electrically insulating rod-like member is connected in parallel The plurality of leads arranged side by side are arranged along the inner side of the bent portions.

  In addition, an electrically insulating sheet-like member may be disposed between the side surface of the solid-state imaging device and the plurality of leads, and the material of the electrically insulating rod-like member may be glass fiber or plastic.

  In addition, the electrically insulating rod-shaped member may be formed in a cross-sectional shape having an arc-shaped portion, and a plurality of leads may be bent along the arc-shaped portion. The cross-sectional shape may be circular, and a plurality of leads may be bent along the outer surface.

  Alternatively, the cross-sectional shape of the electrically insulating rod-shaped member may be formed in a fan shape with a substantially right angle, and a plurality of leads may be bent along the arc-shaped portion. The cross-sectional shape may be formed in a semicircular shape, and a plurality of leads may be bent along the arc-shaped portion.

  According to the present invention, a single electrically insulating rod-shaped member is arranged in a state along the inner side of the bent portions of a plurality of leads arranged in parallel, thereby rearward from the light receiving surface side of the solid-state imaging device. The lead bent toward the surface is less likely to break during bending, and less likely to short-circuit with the solid-state imaging device during use, so that excellent durability can be obtained.

  A plurality of leads having one end connected to the front side of the solid-state imaging device on which the light receiving surface is arranged are arranged in parallel, and each lead is bent in a direction parallel to the side surface of the solid-state imaging device to be behind the solid-state imaging device. In the solid-state imaging device of the electronic endoscope extended toward the front, a single electrically insulating rod-like member is arranged along the inside of the bent portions of a plurality of leads arranged in parallel.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 2 shows the distal end portion of the insertion portion of the electronic endoscope incorporating the solid-state imaging device 5, and the bending portion 1 formed at the distal end portion of the insertion portion flexible tube (not shown) can be inserted. It is bent at an arbitrary angle in an arbitrary direction by a remote operation from an operation unit provided on the proximal end side of the flexible tube.

  An observation window 3 or the like is disposed on the distal end surface of the distal end main body 2 connected to the distal end of the bending portion 1. For example, a CCD is placed at the projection position of the subject by the objective optical system 4 built in the back of the observation window 3. The light receiving surface 5a of the solid-state imaging device 5 made of (charge coupled device) is disposed.

  In an imaging unit frame 6 that holds the objective optical system 4 and the solid-state imaging device 5, there is a circuit board 8 on which an electronic component 7 such as a capacitor or an IC chip that constitutes a drive circuit of the solid-state imaging device 5 is attached. It is arranged immediately behind the solid-state imaging device 5.

  Reference numeral 9 denotes a signal cable that is inserted and disposed over the entire length in the insertion portion in order to transmit an imaging signal of an endoscopic observation image captured by the solid-state imaging device 5, and a plurality of signal lines 10 drawn from the distal ends thereof. Are connected to connection terminals formed in the latter half of the circuit board 8.

  Reference numeral 11 denotes a plurality of leads, one end of which is bonded to a pad portion provided in parallel with the light receiving surface 5a on the front surface side of the solid-state imaging device 5, and as shown in FIG. A plurality of upper side portions and lower side portions are arranged in parallel.

  Each lead 11 is bent from the front surface side of the solid-state image sensor 5 in a direction substantially parallel to the side surface and is extended substantially in parallel toward the rear of the solid-state image sensor 5. A sheet-like member 12 made of an electrically insulating plastic is sandwiched between the side surfaces of the element 5, and the rear end portion of each lead 11 is connected to a connection terminal of the circuit board 8.

  In addition, an electric insulating glass fiber material or plastic material (for example, PC, POM, PP) having a round bar shape in a cross-sectional shape in a state along the inner side of the bent portion of the plurality of leads 11 arranged in parallel. , PE, PS, PTFE, PFA, FEP or the like) is disposed.

  FIG. 1 shows a state in which the bar-like member 13 is attached to the upper side of the solid-state imaging device 5, and shows a state in which the bar-like member 13 on the lower side is removed from a predetermined position for easy understanding. Yes. However, the rod-shaped member 13 once assembled to the solid-state imaging device 5 is not an object of disassembly.

  In the assembly process of the solid-state imaging device of the electronic endoscope configured as described above, when the lead 11 is bent, an electrically insulating sheet-like member is formed along the side surfaces (upper surface side and lower surface side) of the solid-state imaging device 5. 12 and bar members 13 are arranged along the upper and lower sides of the front surface of the solid-state imaging device 5, and in this state, the lead 11 is bent rearward substantially at a right angle.

  Therefore, since the rod-shaped member 13 exists at the inner position of the bent portion of each lead 11 arranged side by side, each lead 11 is smoothly bent while being applied to the arc-shaped outer surface of the rod-shaped member 13. In addition, since a large bending stress does not act locally on the bent portion, the possibility that the lead 11 is damaged is small.

  Further, since the rod-like member 13 is pressed inside the bent portion of the lead 11, even if the lead 11 is distorted due to heat generated by the solid-state imaging device 5, the possibility that the rod-like member 13 moves is low, and glass fiber or The rod-shaped member 13 made of the above-described plastic or the like is not easily thermally deformed.

  The present invention is not limited to the above-described embodiments. For example, as shown in FIGS. 3 and 4, the cross-sectional shape of the cross section perpendicular to the axis of the rod-shaped member 13 is a sector shape or a half shape with a substantially perpendicular angle. It may be formed in a circular shape or the like. In short, the rod-shaped member 13 is formed in a cross-sectional shape having an arc-shaped portion, and each lead 11 may be bent along the arc-shaped portion.

1 is a perspective view of a solid-state imaging device of an electronic endoscope according to a first embodiment of the present invention. It is side surface sectional drawing of the insertion part front-end | tip part of the endoscope of 1st Example of this invention. It is a perspective view of the solid-state imaging device of the electronic endoscope of 2nd Example of this invention. It is a perspective view of the solid-state imaging device of the electronic endoscope of the 3rd Example of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 Solid-state image sensor 5a Light-receiving surface 8 Circuit board 11 Lead 12 Sheet-like member 13 Rod-like member

Claims (7)

A plurality of leads having one end connected to the front side of the solid-state image sensor on which the light-receiving surface is arranged are arranged in parallel, and the leads are bent in a direction parallel to the side surface of the solid-state image sensor, and the solid-state image sensor In the solid-state imaging device of the electronic endoscope extended toward the rear of the
A solid-state imaging device for an electronic endoscope, characterized in that a single electrically insulating rod-shaped member is arranged along the inside of the bent portions of the plurality of leads arranged in parallel. The solid-state imaging device for an electronic endoscope according to claim 1, wherein an electrically insulating sheet-like member is disposed between a side surface of the solid-state imaging element and the plurality of leads. The solid-state imaging device for an electronic endoscope according to claim 1 or 2, wherein a material of the electrically insulating rod-shaped member is glass fiber or plastic. 4. The electronic endoscope according to claim 1, wherein the electrically insulating rod-shaped member is formed in a cross-sectional shape having an arc-shaped portion, and the plurality of leads are bent along the arc-shaped portion. Solid-state imaging device. The solid-state imaging device for an electronic endoscope according to claim 4, wherein the cross-sectional shape of the electrically insulating rod-like member is formed in a circular shape, and the plurality of leads are bent along an outer surface thereof. The electronic endoscope according to claim 4, wherein a cross-sectional shape of the electrically insulating rod-like member is formed in a fan shape with a substantially included angle, and the plurality of leads are bent along an arc-shaped portion thereof. Solid-state imaging device. The solid-state imaging device for an electronic endoscope according to claim 4, wherein the cross-sectional shape of the electrically insulating rod-like member is formed in a semicircular shape, and the plurality of leads are bent along an arcuate portion thereof.

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