JP2005328340A - Capacitor microphone - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make a capacitor microphone thin. <P>SOLUTION: An FET 20 is mounted on a circuit board 26 by soldering terminal pieces 20G, 20S, and 20D of the FET 20 to respective conductive layers 44A, 44B, and 44C while mounted on a top surface 42a of a circuit board main body 42 at a main body exposure part 42a1 where the conductive layers 44A, 44B, and 44C are not formed. Consequently, the capacitor microphone 10 can be made thinner by component flotation resulting from the thickness of the conductive layers and interposed solder as compared with a conventional case wherein a FET is arranged on solder supplied onto top surfaces of conductive layers. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a condenser microphone, and more particularly to a mounting structure of an electronic chip component on a circuit board.

  In general, a condenser microphone has a capacitor part in which a vibration film and a back electrode plate are arranged to face each other, and an electronic chip component such as an impedance conversion element that converts an impedance of the capacitor part into an electric impedance is provided. The structure is mounted on a circuit board.

  In this case, “Patent Document 1” describes a condenser microphone in which the electronic chip component is disposed on the outer peripheral side of the capacitor unit and the capacitor unit, the electronic chip component, and the circuit board are accommodated in the housing. .

Japanese Utility Model Publication No. 7-7299

  In a condenser microphone mounted on a mobile phone or the like, it is strongly demanded to reduce its thickness.

  However, in the conventional condenser microphone, as described in the above “Patent Document 1”, the mounting of the electronic chip component on the circuit board is previously performed on the upper surface of the conductive layer formed on the upper surface of the substrate body. There is a problem in that the capacitor microphone cannot be sufficiently thinned because it is configured by supplying solder and placing electronic chip components on the solder.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a condenser microphone that can be sufficiently thinned.

  The present invention is intended to achieve the above object by devising a mounting structure of electronic chip components on a circuit board.

That is, the condenser microphone according to the present invention is
Capacitor portion in which vibration membrane and back electrode plate are arranged opposite to each other, at least one electronic chip component, a circuit board on which this electronic chip component is mounted, and a housing for housing these capacitor portion, electronic chip component and circuit substrate In a condenser microphone comprising:
The circuit board comprises a substrate body and a conductive layer formed in a predetermined pattern on the upper surface of the substrate body,
When the electronic chip component is mounted on the circuit board, each terminal portion of the electronic chip component is mounted in a state where the electronic chip component is placed on the exposed body portion where the conductive layer is not formed on the upper surface of the substrate body. Is performed by soldering to the conductive layer.

  The type of the “at least one electronic chip component” is not particularly limited, and for example, an impedance conversion element, a capacitor, a resistor, or the like can be employed.

  The specific arrangement of the “capacitor portion, electronic chip component and circuit board” in the housing is not particularly limited.

  As long as the “conductive layer” is formed in a pattern having the “main body exposed portion”, the specific pattern shape is not particularly limited.

  As shown in the above configuration, in the condenser microphone according to the present invention, the capacitor portion, the electronic chip component, and the circuit board are accommodated in the housing, and the conductive layer is formed in a predetermined pattern on the upper surface of the circuit board body. However, in that case, the mounting of the electronic chip component on the circuit board is in a state where the electronic chip component is placed on the exposed body portion where the conductive layer is not formed on the upper surface of the substrate body. Since each terminal portion of the electronic chip component is soldered to the conductive layer, when the electronic chip component is arranged on the solder supplied to the upper surface of the conductive layer as in the prior art, On the other hand, the thickness of the condenser microphone can be reduced by the thickness of the conductive layer and the part floating due to the presence of solder.

  Thus, according to the present invention, the condenser microphone can be thinned.

  In the above configuration, if the adhesive for temporary fixing is filled between the lower surface of the electronic chip component and the upper surface of the substrate body, when the terminals of the electronic chip component are soldered to the conductive layer, Even if the chip component is not held, it is possible to prevent the electronic chip component from being moved inadvertently, thereby improving the soldering workability. At this time, the material of the “adhesive for temporary fixing” is not particularly limited as long as it has an adhesive force that does not move the electronic chip component during soldering. This "adhesive for temporary fixing" is. Since the coating thickness can be set to be extremely thin, filling it can prevent the thinning of the condenser microphone from being hindered.

  In the above configuration, the electronic chip component may be arranged so as to overlap the capacitor unit in the vertical direction. However, if the configuration is arranged on the outer peripheral side of the capacitor unit, the capacitor microphone can be made thinner. Can be achieved.

  In the above configuration, an insulating layer covering the conductive layer is formed on the upper surface of the substrate body so as to partially expose the conductive layer, and in this case, the exposed shape in the vicinity of each terminal portion of the conductive layer, If the terminal portion is set to have a substantially U-shape, the solder supplied on the conductive layer in the vicinity of each terminal portion will unnecessarily spread along the conductive layer. It can be blocked by the weir action.

  In the above configuration, when each terminal portion is configured as a terminal piece protruding sideways from the chip body of the electronic chip component, these terminal pieces extend obliquely upward from the lower end portion of the side wall of the chip body. If it is set as the structure formed in this, the following effects can be acquired.

  That is, in the vicinity of each terminal piece on the upper surface of the substrate body of the circuit board, there is a step corresponding to the thickness of the conductive layer at the boundary between the exposed body portion where the chip body is disposed and the surrounding conductive layer. However, by forming each terminal piece so as to extend obliquely upward from the lower end of the side wall of the chip body, a predetermined space can be ensured between each terminal piece and the upper surface of the conductive layer. The terminal strip can be easily soldered to the conductive layer. At that time, as a method of forming each terminal piece so as to extend obliquely upward from the lower end of the side wall of the chip body, in addition to the method of setting each terminal piece in such a shape from the beginning, It is also possible to adopt a method in which each terminal piece formed so as to extend substantially horizontally from the lower end portion of the side wall is bent upward to be extended upward. When the latter method is employed, a general-purpose electronic chip component can be used.

  Alternatively, instead of doing this, each terminal piece is formed so as to extend substantially horizontally from an intermediate position in the vertical direction of the side wall of the chip body, and a predetermined space is provided between each terminal piece and the upper surface of the conductive layer. Therefore, each terminal piece can be easily soldered to the conductive layer.

  Further, instead of doing this, each terminal piece is formed so as to extend substantially horizontally from the upper end of the side wall of the chip body, thereby securing a predetermined space between each terminal piece and the upper surface of the conductive layer. Thus, each terminal piece can be easily soldered to the conductive layer. When such a configuration is adopted, it is possible to use a general-purpose electronic chip component as it is upside down.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a side sectional view showing a condenser microphone 10 according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line II-II in FIG.

  As shown in these drawings, the condenser microphone 10 is a small electret condenser microphone, and has a low profile and a substantially cylindrical outer shape with a height of about 0.6 mm and a diameter of about 4 mm. .

  In the condenser microphone 10, an insulating bush 14, a capacitor portion 16, a contact spring 18, three electronic chip components 20, 22, and 24, and a circuit board 26 are accommodated in a housing 12. .

  The housing 12 is a cylindrical metal member having a lower end opened, and the lower end 12b of the peripheral wall is bent to the inner peripheral side in a state in which each member is covered from the upper side. A caulking is fixed to the peripheral edge of the substrate 26. A plurality of sound holes 12 a are formed in the upper surface portion of the housing 12.

  The insulating bush 14 is a synthetic resin member, and has a ring-shaped peripheral wall portion 14 a formed along the inner peripheral surface of the housing 12, and is slightly closer to the inner peripheral side of the peripheral wall portion 14 a than the peripheral wall portion 14 a. The partition wall portion 14b is formed at a low height, and the peripheral wall portion 14a and the partition wall portion 14b form four space portions C1, C2, C3, and C4.

  The space portion C1 is a space that accommodates the capacitor portion 16, and is formed as a relatively large circular space portion. The space portions C1, C2, C3, and C4 surround the space portion C1 in an arc shape. It is formed as a relatively small space portion arranged in the space. At this time, the space portion C2 is isolated from the space portion C1, but the space portions C3 and C4 communicate with the space portion C1 through the communication groove 14b1 formed on the upper surface of the partition wall portion 14b. Thus, the back pressure space of the capacitor portion 16 is expanded.

  The capacitor unit 16 includes a diaphragm subassembly 32, a spacer 34, and a back electrode plate 36.

  The vibration membrane subassembly 32 has a vibration film 32A stretched and fixed on the lower surface of a metal support ring 32B, and the vibration film 32A is composed of a polymer film having a metal vapor deposition film formed on the upper surface. . The spacer 34 is composed of a metal thin plate ring. The back electrode plate 36 includes a metal electrode plate main body 36A and an electret layer 36B heat-sealed to the upper surface of the electrode plate main body 36A. The back electrode plate 36 is formed in a substantially cross shape in plan view, but its outer diameter is set to be substantially the same as the outer diameter of the support ring 32B.

  In the capacitor section 16, the vibration film 32 </ b> A of the vibration film subassembly 32 and the electret layer 36 </ b> B of the back electrode plate 36 are opposed to each other with a predetermined minute interval.

  Of the three electronic chip components 20, 22, and 24, the electronic chip component 20 is a junction-type field effect transistor (hereinafter referred to as “FET”), and converts the change in capacitance of the capacitor unit 16 into electrical impedance. Is provided as an impedance conversion element. The remaining two electronic chip components 22 and 24 are two types of capacitors having different electrostatic capacities, and are provided for noise removal. The FET 20 is mounted on the circuit board 26 while being accommodated in the space C2, and the two capacitors 22 and 24 are both mounted on the circuit board 26 while being accommodated in the space C3.

  The circuit board 26 includes a substrate body 42, conductive layers 44A, 44B, 44C formed in a predetermined pattern on the upper surface 42a of the substrate body 42, and conductive layers 46A, 46B formed on the lower surface 42b of the substrate body 42. It is made up of.

  At that time, the conductive layer 46A is formed at the center of the lower surface 42b of the substrate body 42, and the conductive layer 46B is formed in an annular shape at the outer peripheral edge of the lower surface 42b. The conductive layer 46A is electrically connected to the conductive layer 44C via a through hole (not shown), and the conductive layer 46B is electrically connected to the conductive layer 44B via a through hole (not shown).

  Further, in this circuit board 26, an insulating layer 48 is formed on the upper surface 42a of the board body 42 so as to partially expose the conductive layers 44A, 44B and 44C in a predetermined pattern. Yes.

  The substrate body 42 has a thickness of about 0.06 mm, and the conductive layers 44A, 44B, 44C, the conductive layers 46A, 46B, and the insulating layer 48 all have a thickness of about 0.04 mm. doing.

  The contact spring 18 is a metal plate spring formed in a substantially annular cone shape. The contact spring 18 is in contact with the electrode plate main body 36A of the back electrode plate 36 at the upper end portion thereof, and the conductive layer of the circuit board 26 at the lower end portion thereof. 44A and the insulating layer 48 are in contact.

  The FET 20 includes a chip body 20A having a rectangular parallelepiped shape with a height of about 0.3 mm, and three terminal pieces 20G, 20S, and 20D projecting sideways from the chip body 20A.

  The terminal piece 20G is a terminal portion constituting a gate electrode, and is formed to extend obliquely upward from the lower end portion of the horizontal central portion on one side wall of the chip body 20A. The remaining two terminal pieces 20S and 20D are terminal portions that constitute a source electrode and a drain electrode, and are formed so as to extend obliquely upward from a lower end portion of a portion in the vicinity of both ends in the horizontal direction on the other side wall of the chip body 20A. ing.

  The terminal piece 20G constituting the gate electrode is electrically connected to the electrode plate body 36A of the back electrode plate 36 via the conductive layer 44A and the contact spring 18, and the terminal piece 20S constituting the source electrode is electrically connected to the conductive layer 44B. The conductive film 46B, the housing 12, and the support ring 32B are electrically connected to the vibrating membrane 32A, and the terminal piece 20D constituting the drain electrode is electrically connected to the conductive layer 46A via the conductive layer 44C.

  FIG. 3 is a detailed view of part III in FIG. FIG. 4 is a plan view showing the mounting structure of the FET 20 on the circuit board 26.

  As shown in these figures, the FET 20 is mounted on the circuit board 26 when the chip main body 20A is exposed to the main body where the conductive layers 44A, 44B, 44C and the insulating layer 48 are not formed on the upper surface 42a of the substrate main body 42. This is performed by soldering the terminal pieces 20G, 20S, and 20D of the FET 20 to the conductive layers 44A, 44B, and 44C while being placed on the portion 42a1, respectively.

  In order to achieve this, the conductive layers 44A, 44B, and 44C are such that the end face 44A1 of the conductive layer 44A and the end faces 44B1 and 44C1 of the conductive layers 44B and 44C face each other at a slightly larger interval than the width of the chip body 20A of the FET 20. Is formed. The insulating layer 48 is formed with a substantially rectangular opening 48a that is slightly larger than the chip body 20A of the FET 20. At that time, substantially U-shaped cutout portions 48a1, 48a2, and 48a3 are formed at positions corresponding to the terminal pieces 20G, 20S, and 20D in the opening portion 48a, whereby the conductive layers 44A and 44B are formed. 44C, the exposed shape in the vicinity of each terminal piece 20G, 20S, 20D is set to a shape surrounding the terminal pieces 20G, 20S, 20D in a substantially U-shape.

  The soldering is performed by supplying solder S between the exposed portions of the conductive layers 44A, 44B, and 44C and the terminal pieces 20G, 20S, and 20D. At that time, the solder S supplied to these three places is within a range surrounded by the respective end faces 44A1, 44B1, 44C1 of the conductive layers 44A, 44B, 44C and the notches 48a1, 48a2, 48a3 of the insulating layer 48. It becomes a shape that rises in a generally dome shape. This is due to the surface tension of the solder S and the action of each notch 48a1, 48a2, 48a3 as a weir.

  A temporary fixing adhesive A is filled between the lower surface of the chip body 20A of the FET 20 and the upper surface 42a of the substrate body 42. By filling the adhesive A for temporary fixing, the FET 20 is prevented from inadvertently moving during soldering.

  FIG. 5 is a detailed cross-sectional view taken along the line V-V in FIG. 2, and is a side cross-sectional view showing a mounting structure of the capacitor 22 on the circuit board 26.

  As shown in the figure, the capacitor 22 has a rectangular parallelepiped shape that is slightly lower than the FET 20, and both end faces in the longitudinal direction are configured as terminal portions 22a and 22b. In the capacitor 22, the terminal portions 22a and 22b are electrically connected to the conductive layers 44B and 44C, respectively.

  The capacitor 22 is mounted on the circuit board 26 in substantially the same manner as the FET 20. That is, in a state where the capacitor 22 is placed on the exposed body portion 42a2 where the conductive layers 44B and 44C are not formed on the upper surface 42a of the substrate body 42, the terminal portions 22a and 22b of the capacitor 22 are connected to the conductive layers 44B and 44B, respectively. By soldering to 44C, the mounting to the circuit board 26 is performed.

  In order to realize this, the conductive layers 44B and 44C are formed such that the end face 44B2 of the conductive layer 44B and the end face 44C2 of the conductive layer 44C face each other at a slightly larger interval than the entire length of the capacitor 22. In addition, a substantially rectangular opening 48b (see FIG. 6A) that is slightly larger than the capacitor 22 is formed in the insulating layer 48. At this time, substantially U-shaped cutout portions 48b1 and 48b2 are formed at positions corresponding to the respective terminal portions 22a and 22b in the opening portion 48b, whereby the respective terminal portions of the respective conductive layers 44B and 44C. The exposed shape in the vicinity of 22a and 22b is set to a shape surrounding the terminal portions 22a and 22b in a substantially U shape.

  The soldering is performed by supplying solder S between the exposed portions of the conductive layers 44B and 44C and the terminal portions 22a and 22b. At that time, since each terminal portion 22a, 22b is constituted by each end face of the capacitor 22 instead of the terminal piece, the solder S is supplied not only to each conductive layer 44B, 44C but also to the upper surface 42a of the substrate body 42. However, the upper surface 42a hardly expands, and the upper surfaces of the conductive layers 44B and 44C also have a limited range of expansion due to the action of the notches 48b1 and 48b2. .

  A temporary fixing adhesive A is filled between the lower surface of the capacitor 22 and the upper surface 42 a of the substrate body 42. By filling the adhesive A for temporary fixing, it is possible to prevent the capacitor 22 from being inadvertently moved during soldering.

  6 is a diagram for explaining a phenomenon that may occur when the temporary fixing adhesive A is not temporarily filled, and FIG. 6B is a diagram similar to FIG. (A) is the top view.

  As shown in FIGS. 4A and 4B, when solder S is supplied between the exposed portions of the conductive layers 44B and 44C and the terminal portions 22a and 22b, the capacitor 22 has solder S on both sides thereof. Since the surface tension acts with a delicate balance, the surface tension becomes considerably unstable and is easily attracted to either one. Therefore, for example, as indicated by an arrow in the figure, if the capacitor 22 is attracted to the terminal portion 22b side, the capacitor 22 moves to the terminal portion 22b side to a position where it abuts on the end face 44C2 of the conductive layer 44C. At that time, as shown in FIGS. 4C and 4D, the solder S supplied between the exposed portion of the conductive layer 44B on the opposite side and the terminal portion 22a is separated from the terminal portion 22a to be conductive. The upper surface of the exposed portion of the layer 44B has a shape that rises substantially in the shape of a dome, and poor soldering occurs.

  On the other hand, if the temporary fixing adhesive A is filled between the lower surface of the capacitor 22 and the upper surface 42a of the substrate body 42 as in the present embodiment, the capacitor 22 is attached during soldering. Even if it is not held, it is possible to prevent the capacitor 22 from inadvertently moving.

  The mounting structure of the other capacitor 24 on the circuit board 26 is exactly the same as that of the capacitor 22.

  As described above in detail, in the capacitor microphone 10 according to the present embodiment, the FET 20 is mounted on the circuit board 26, and the FET 20 has the conductive layers 44A, 44B, 44C and the insulating layer 48 on the upper surface 42a of the substrate body 42. This is performed by soldering the terminal pieces 20G, 20S, and 20D of the FET 20 to the conductive layers 44A, 44B, and 44C in a state where the FET 20 is placed on the unexposed main body exposed portion 42a1. Compared with the case where the FET is arranged on the solder supplied to the upper surface of the conductive layer, the thickness of the capacitor microphone 10 can be reduced by the thickness of the conductive layer and the amount of component floating due to the presence of the solder. Can do. Similarly, regarding the mounting of the capacitors 22 and 24 on the circuit board 26, the capacitors 22 and 24 are placed on the main body exposed portion 42a2 where the conductive layers 44B and 44C are not formed on the upper surface 42a of the board main body 42. In this state, the terminal portions 22a and 22b of the capacitors 22 and 24 are soldered to the conductive layers 44B and 44C, so that the capacitor microphone 10 is provided by providing the capacitors 22 and 24. It is possible to prevent the thinning of the film from being hindered.

  In addition, in the present embodiment, since the FET 20 and the capacitors 22 and 24 are disposed on the outer peripheral side of the capacitor portion 16 in the housing 12, the capacitor microphone 10 can be further reduced in thickness.

  In the present embodiment, since the temporary fixing adhesive A is filled between the lower surface of the FET 20 and the upper surface 42a of the substrate body 42, the terminal pieces 20G, 20S, and 20D of the FET 20 are connected to the conductive layers 44A. , 44B, 44C can prevent the FET 20 from inadvertently moving, thereby eliminating the need to hold the FET 20 during soldering. Can increase the sex. Similarly, since the adhesive A for temporary fixing is filled between the lower surfaces of the capacitors 22 and 24 and the upper surface 42a of the substrate body 42, the terminal portions 22a and 22b of the capacitors 22 and 24 are connected. When soldering to the conductive layers 44B and 44C, it is possible to prevent the capacitors 22 and 24 from inadvertently moving, thereby holding the capacitors 22 and 24 during soldering. It is possible to improve the workability. In particular, each of the capacitors 22 and 24 is not configured as a terminal piece, and is easily moved when soldered, so the adhesive A for temporary fixing is filled. It is extremely effective to have a configuration.

  Furthermore, in this embodiment, the insulating layer 48 is formed on the upper surface 42a of the substrate body 42 so as to partially expose the conductive layers 44A, 44B, and 44C. The exposed shapes of the conductive layers 44A, 44B, 44C in the vicinity of the terminal pieces 20G, 20S, 20D are set to surround the terminal pieces 20G, 20S, 20D in a substantially U shape. In the insulating layer 48, the solder S supplied on the conductive layers 44A, 44B, 44C in the vicinity of 20S, 20D spreads unnecessarily along the conductive layers 44A, 44B, 44C in a substantially U shape. It can prevent by the dam action of the end surface of each notch part 48a1, 48a2, 48a3 formed. Similarly, the exposed shapes of the conductive layers 44B and 44C in the vicinity of the terminal portions 22a and 22b of the capacitors 22 and 24 are set to surround the terminal portions 22a and 22b in a substantially U shape. In the vicinity of the terminal portions 22a, 22b, etc., the solder S supplied on the conductive layers 44B, 44C spreads along the conductive layers 44B, 44C, and is formed in a substantially U shape in the insulating layer 48. Moreover, it can block | prevent by the dam action of end surfaces, such as each notch part 48b1 and 48b2.

  Further, in the present embodiment, in the FET 20, the terminal pieces 20G, 20S, and 20D projecting sideways from the chip body 20A are formed so as to extend obliquely upward from the lower end portion of the side wall. The terminal strips are formed even though there are steps corresponding to the thicknesses of the conductive layers 44A, 44B, 44C at the boundary portions between the main body exposed portion 42a1 where the conductive layer 44a1 is disposed and the conductive layers 44A, 44B, 44C around it. A predetermined space can be ensured between 20G, 20S, and 20D and the upper surface of each conductive layer 44A, 44B, and 44C, so that each terminal piece 20G, 20S, and 20D can be placed in each conductive layer 44A, 44B, and 44C. On the other hand, it can be easily soldered.

  Incidentally, instead of the FET 20 of the above-described embodiment, an FET 120 or an FET 220 as shown in FIG. 7 can be used.

  The FET 120 shown in FIG. 6A is formed such that each of the terminal pieces 120G, 120D and the like extend substantially horizontally from an intermediate position in the vertical direction of the side wall of the chip body 120A. Even when such a configuration is adopted, a predetermined space can be ensured between each terminal piece 120G, 120D, etc. and the upper surface of each conductive layer 44A, 44C, etc., so that each terminal piece 120G, 120D, etc. Can be easily soldered to the conductive layers 44A, 44C and the like.

  Further, the FET 220 shown in FIG. 5B is formed such that each of the terminal pieces 220G, 220D and the like extend substantially horizontally from the upper end portion of the side wall of the chip body 220A. Even when such a configuration is adopted, a predetermined space can be secured between the terminal pieces 220G and 220D and the upper surfaces of the conductive layers 44B and 44C. Can be easily soldered to the conductive layers 44B, 44C and the like. When such a configuration is employed, a general-purpose FET can be inverted and used as it is as the FET 220.

  Note that when these FET 120 or FET 220 are used, the supply amount of the solder S may be appropriately changed according to the size of the supply space, as compared with the case where the FET 20 of the above embodiment is used. At that time, if the sizes of the notches 48a1, 48a3 and the like of the insulating layer 48 are appropriately changed according to the supply amount of the solder S, the solder S unnecessarily expands along the conductive layers 44B, 44C. In addition, it is possible to obtain a shape that rises substantially in a dome shape.

  In the above embodiment, the mounting of the FET 20 on the circuit board 26 is such that the terminal pieces 20G, 20S, and 20D are connected to the conductive layers 44A, with the lower surface of the chip body 20A temporarily fixed to the upper surface 42a of the substrate body 42, respectively. Although described as being performed by soldering to 44B and 44C, the lower surface of the FET 20 is in contact with the upper surface 42a of the substrate body 42 with the solder S supplied in advance to the exposed portions of the conductive layers 44A, 44B and 44C. It is also possible to adopt a configuration in which the above mounting is performed. In this case, it is possible to avoid the occurrence of a problem that the FET 20 moves carelessly during soldering without using the temporary fixing adhesive A. This is the same when the FET 120 or the FET 220 is used.

  In the above embodiment, the FET 20 is mounted on the circuit board 26 by soldering the terminal pieces 20G, 20S, and 20D on the conductive layers 44A, 44B, and 44C. Instead of doing this, it is also possible to perform soldering by supplying solder S in the lateral direction of each of the terminal pieces 20G, 20S, 20D, similarly to the case where the capacitor 22 is mounted on the circuit board 26. is there.

  Furthermore, in the above-described embodiment, the condenser microphone 10 is described as an electret condenser microphone. However, even when the condenser microphone 10 is a condenser microphone other than the above, by adopting the same configuration as the above-described embodiment, Similar effects can be obtained.

Side sectional view showing a condenser microphone according to an embodiment of the present invention II-II sectional view of Fig. 1 Detailed view of part III in Fig. 1 The top view which shows the mounting structure to the circuit board of FET in the above-mentioned condenser microphone Detailed cross-sectional view taken along line V-V in Fig. 2 The figure for demonstrating the phenomenon which may occur when the adhesive for temporary fixing is not filled temporarily in the said condenser microphone Side sectional view showing two modified examples of the FET mounting structure

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Condenser microphone 12 Housing 12a Sound hole 12b Lower end edge part 14 Insulating bush 14a Perimeter wall part 14b Partition part 14b1 Communication groove 16 Capacitor part 18 Contact spring 20, 120, 220 FET (electronic chip component)
20A, 120A, 220A Chip body 20D, 20G, 20S, 120D, 120G, 220D, 220G Terminal pieces 22, 24 Capacitors (electronic chip components)
22a, 22b Terminal portion 26 Circuit board 32 Vibration membrane sub-assembly 32A Vibration membrane 32B Support ring 34 Spacer 36 Back electrode plate 36A Electrode plate body 36B Electret layer 42 Substrate body 42a Upper surface 42a1, 42a2 Main body exposed portion 42b Lower surface 44A, 44B, 44C , 46A, 46B Conductive layer 44A1, 44B1, 44B2, 44C1, 44C2 End face 48 Insulating layer 48a, 48b Opening 48a1, 48a2, 48a3, 48b1, 48b2 Notch S Solder A Temporary fixing adhesive C1, C2, C3, C4 space

Claims (7)

Capacitor portion in which vibration membrane and back electrode plate are arranged opposite to each other, at least one electronic chip component, a circuit board on which this electronic chip component is mounted, and a housing for housing these capacitor portion, electronic chip component and circuit substrate In a condenser microphone comprising:
The circuit board comprises a substrate body and a conductive layer formed in a predetermined pattern on the upper surface of the substrate body,
When the electronic chip component is mounted on the circuit board, each terminal portion of the electronic chip component is mounted in a state where the electronic chip component is placed on the exposed body portion where the conductive layer is not formed on the upper surface of the substrate body. A capacitor microphone, wherein the capacitor microphone is soldered to the conductive layer.   The condenser microphone according to claim 1, wherein a temporary fixing adhesive is filled between a lower surface of the electronic chip component and an upper surface of the substrate body.   The condenser microphone according to claim 1, wherein the electronic chip component is disposed on an outer peripheral side of the capacitor unit. An insulating layer covering the conductive layer is formed on the upper surface of the substrate body so as to partially expose the conductive layer,
The capacitor microphone according to any one of claims 1 to 3, wherein an exposed shape of the conductive layer in the vicinity of each terminal portion is set to a shape surrounding the terminal portion in a substantially U shape. Each of the terminal portions is configured as a terminal piece protruding sideways from the chip body of the electronic chip component,
5. The condenser microphone according to claim 1, wherein each of the terminal pieces is formed so as to extend obliquely upward from a lower end portion of a side wall of the chip body. Each of the terminal portions is configured as a terminal piece protruding sideways from the chip body of the electronic chip component,
5. The condenser microphone according to claim 1, wherein each of the terminal pieces is formed to extend substantially horizontally from an intermediate position in the vertical direction of the side wall of the chip body. Each of the terminal portions is configured as a terminal piece protruding sideways from the chip body of the electronic chip component,
5. The condenser microphone according to claim 1, wherein each of the terminal pieces is formed so as to extend substantially horizontally from an upper end portion of the side wall of the chip body.

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