JP2005322450A - Electronic component module and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a new electronic component module which is superior in durability and manufacturing method, capable of coping with complex three-dimensional shapes. <P>SOLUTION: This electronic component module (LED unit) U in which the LED 14 is mounted between a pair of metal layers 12, 12 which are feeder cable routes, a pair of metal layers 12, 12 are constituted as respective surface layer parts of a conductive film 10 in which the whole body is enabled to be bent in the three-dimensional direction by laminating a synthetic resin layer 11, and the metal layer 12 of the pair of conductive films 10 and a connecting terminal 16 led out from the LED 14 are jointed by diffusion-joining. The LED unit U is enabled to be easily assembled and attached to a region having irregularities and complicated shape in which installment is conventionally difficult, and general applicability of the LED 14 as an electricity supply wire is markedly enhanced. In the manufacturing process of the LED unit U, a conventionally indispensable bending working is excluded, and the process is simplified and production efficiency is increased. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component module in which an electronic component is mounted between a pair of metal layers that are power supply paths, and a method for manufacturing the same.

  As a first prior art of this type, there is Patent Document 1 below, and here, as shown in FIG. 14, a pair of connection terminals 3b led out from the LED main body 3a to bus bars 2 and 2 which are power supply paths arranged in parallel. , 3b are fixed by caulking, whereby the LED module 1 having the LED 3 mounted between the bus bars 2 and 2 is formed.

  The bus bars 2 and 2 of the LED module 1 are formed into a shape that follows the stepped portion 4a of the lamp body 4 by bending.

Further, as a second prior art, there is Patent Document 2 below, and here, as shown in FIG. 15, a pair of power supply paths that are formed in a predetermined shape that can be accommodated in the lamp housing 8 is formed in the insulating substrate 5. The metal plates 6 and 6 are juxtaposed, and the LED 7 is mounted between the metal plates 6 and 6 by fixing the pair of connection terminals 7b and 7b led out from the LED body 7a to the metal plates 6 and 6 by laser welding, respectively. An LED module is configured. Reference numeral 9 denotes a lens that is assembled in the front opening of the lamp housing 8 to define a lamp chamber.
JP 2000-260206 A JP 2000-222915

  However, in the first and second prior arts described above, the bus bar 2 and the metal plate 6 that are power supply paths are configured to have a thickness that is hardly bent in a three-dimensional direction due to the principle of joining by caulking or laser welding. ing. For example, when caulking is fixed, the thickness is about 350 to 400 μm, and laser welding requires a thickness of 300 μm or more. For this reason, in the LED module manufacturing process, it is indispensable to bend the bus bar or metal plate, which is the power supply path of the LED module, into a shape that follows the predetermined mounting surface on the lamp body. It is bad and not versatile.

  In particular, in the automotive industry in recent years, the shape of a lamp whose front lens is three-dimensionally curved in the vertical and horizontal directions is mainstream, and the LED module is also required to be three-dimensionally curved. It is extremely troublesome to bend and form a power supply path such as a bus bar or a metal plate into a complicated three-dimensional shape.

  Furthermore, for example, the LED module and the reflector may be shared in the vehicular lamp, and in such a configuration, the reflector passes through the LED light-emitting portion through the front surface of the LED module fixed to the lamp body. Although it is arranged, the load on the LED module side (when the LED and the reflector are engaged and fixed, due to dimensional errors or mounting errors, etc., it is an unexpected occurrence that occurs at the connection between the LED and the power bar bus bar or metal plate, etc. There is no direct positioning between the LED and the reflector so that (stress) does not act. For this reason, the positional accuracy of the LED with respect to the bus bar and the metal plate fixed to the lamp body is required, and the work for fixing the LED to the bus bar and the metal plate is troublesome, and the production efficiency does not increase. As long as it is not directly positioned, there is a problem that there is a limit in improving the positioning accuracy of the LED in the lamp (ensuring proper light distribution in the lamp).

  Further, the second prior art (Patent Document 2) has a problem that the LED may be damaged by welding heat.

  Therefore, the inventor thought that a power supply path such as a bus bar or a metal plate could be configured to be three-dimensionally bendable, and then was very thin that could be bent in a three-dimensional direction in which a metal layer and an insulating synthetic resin layer were laminated. I came up with the idea to use a film-like laminate as a feed path. Then, when the effect was confirmed by making a prototype, it was found that it was very excellent, so that the present invention was proposed.

  The present invention has been made in view of the above problems of the prior art, and an object thereof is to provide a novel electronic component module excellent in durability that can follow a complicated three-dimensional shape and a method for manufacturing the same. .

  In order to achieve the object, the electronic component module according to claim 1 is an electronic component module in which an electronic component is mounted between a pair of metal layers that are power supply paths, and the pair of metal layers are insulatively synthesized. A resin layer is laminated and formed as a surface layer portion of each of a pair of film-like laminates that can be bent in a three-dimensional direction, and is derived from each metal layer of the pair of film-like laminates and the electronic component main body. The connection terminal is composed of a diffusion junction.

  The electronic component module according to claim 2 is an electronic component module in which an electronic component is mounted between a pair of metal layers which are power supply paths, and the pair of metal layers are laminated with an insulating synthetic resin layer as a whole. Is configured as a pair of surface layer portions in a single film-like laminate that can be bent in a three-dimensional direction, and a pair of metal layers of the film-like laminate and connection terminals derived from the electronic component main body are formed by diffusion bonding portions. I made it up.

  The film-like laminate referred to here is an emergency of 350 μm or less, for example, in which a conductive metal layer such as copper of 250 μm or less is laminated and integrated on a synthetic resin layer such as epoxy resin of 100 μm or less. It is a thin resin-coated metal foil with excellent flexibility, flexibility and durability.

  (Operation) The metal layer in the film-like laminate functions as a power supply path to the electronic component, and the insulating synthetic resin layer in the film-like laminate functions as a member for ensuring the durability of the metal layer as the power supply path. . And the film-like laminate with electronic parts is free to bend in each three-dimensional direction and has the same properties (characteristics) as the metal foil that can follow any three-dimensional shape, and the metal layer is resin-coated. Therefore, the metal foil is not easily broken by pulling and has excellent durability.

  In addition, in diffusion bonding, a metal-to-metal bonding surface can be bonded in a short time without applying high heat or large pressure to the bonding surface. The metal layer) is not broken and the electronic component is not damaged by heat.

  According to a third aspect of the present invention, in the electronic component module according to the first or second aspect, the electronic component is composed of an LED, which is a light source for a vehicle lamp derived from a plurality of connection terminals from the LED body, and a lamp component member. The LED main body is engaged with the LED engaging portion of the LED, and the light emission center of the LED is positioned at a predetermined position in the lamp chamber.

  (Operation) Since the LED main body is engaged with the LED engaging portion of the lamp component and the LED (light emission center) is positioned at a predetermined position in the lamp chamber, the light emission center of the LED can be accurately positioned with respect to the reflector, etc. The light source position in the lamp can be accurately arranged.

  Further, since the LED (the light emission center) is accurately positioned with respect to the lamp by the engagement between the LED engaging portion and the LED main body in the lamp component member, the LED is positioned with high accuracy with respect to the power supply path as in the past. That is not required.

And as a method of manufacturing the electronic component module according to claim 1, as shown in claim 4, a plurality of connection terminals led out from the electronic component main body are arranged in parallel with the pair of film-like laminates. When the metal layer is overlapped at a predetermined position, and through the horn that is a vibration transmission member, ultrasonic bonding is applied while applying pressure to the overlapping portion, and diffusion bonding is performed,
According to a fifth aspect of the present invention, a plurality of connection terminals led out from the electronic component main body are respectively overlapped at predetermined positions of the metal layer in the single film-like laminate in which the insulating synthetic resin layer and the metal layer are laminated and integrated. In addition, after applying the ultrasonic vibration while applying pressure to the overlapping portion through a horn that is a vibration transmitting member and performing diffusion bonding, a part of the film-like laminate is insulated to insulate the pair of bonding portions. It may be cut and removed.

  (Operation) Superposed portion of connection terminal derived from electronic component main body and metal layer in each film-like laminate (in the method of claim 5, connection terminal derived from electronic component main body and one film-like laminate) In the superposed portion with the metal layer in FIG. 2, the applied pressure and ultrasonic vibration act simultaneously through a horn as a vibration transmitting member, and the superposed surface is diffusion-bonded in a very short time. In addition, in the method of Claim 5, after carrying out a diffusion joining, the electric power feeding path corresponding to the connection terminal of an electronic component is isolate | separated by cutting and removing the partial area | region of one sheet-like laminated body.

  In diffusion bonding, a metal-to-metal bonding surface can be bonded in a short time without applying high heat or large pressure to the bonding surface, so the very thin film-like laminate (metal layer) that is the member to be bonded breaks. And electronic parts are not damaged by heat.

  In addition, since the film-like laminate can follow any three-dimensional shape like a metal foil, the electronic component module (film-like laminate) is preliminarily formed into a predetermined shape that follows the planned location as in the conventional manufacturing method. Since it is not necessary to bend and mold, it is not necessary to bend the electronic component module (film-like laminate) in the manufacturing process.

  Moreover, as a method of manufacturing the electronic component module according to claim 2, as shown in claim 6, a plurality of connection terminals derived from the electronic component main body are juxtaposed as a surface layer portion of the film-like laminate. Each of the paired metal layers is superposed on a predetermined position, and the superposition part is pressed through a horn as a vibration transmitting member while applying ultrasonic vibration to perform diffusion bonding.

  (Operation) The overlapping portion of the connection terminal derived from the electronic component main body and the pair of metal layers in the film-like laminate is simultaneously subjected to pressure and ultrasonic vibration via a horn as a vibration transmitting member, The overlapping surface is diffusion bonded in a very short time.

  In diffusion bonding, a metal-to-metal bonding surface can be bonded in a short time without applying high heat or large pressure to the bonding surface, so the very thin film-like laminate (metal layer) that is the member to be bonded breaks. And electronic parts are not damaged by heat.

  In addition, since the film-like laminate can follow any three-dimensional shape like a metal foil, the electronic component module (film-like laminate) is preliminarily formed into a predetermined shape that follows the planned location as in the conventional manufacturing method. Since it is not necessary to bend and mold, it is not necessary to bend the electronic component module (film-like laminate) in the manufacturing process.

  In addition, since the pair of metal layers is formed in advance as a predetermined pattern adjacent on one synthetic resin layer, the pair of film-like laminates are adjacent to each other when the connection terminal of the electronic component is diffusion bonded to the metal layer. The step of arranging in such a manner (the step required in the method shown in claim 4) and the step of cutting and removing a part of the film-like laminate after diffusion bonding (the step required in the method shown in claim 5) are unnecessary. is there.

  In Claim 7, The manufacturing method of the electronic component module in any one of Claims 4-6 WHEREIN: The recessed part which can accommodate the said electronic component main body is provided in the front-end | tip part of the said horn, The said electronic component main body is provided in this recessed part. The plurality of overlapping portions were simultaneously pressurized and applied with ultrasonic vibration to perform diffusion bonding.

  (Effect) When the vibration transmitting member (horn) is pressed against the metal layer side in such a manner that the electronic component arranged at the position where the electronic component is to be mounted between the pair of metal layers as the power feeding path is housed in the recess at the tip, the electronic component Since the end face of the horn tip hits a plurality of connection terminals that are led out from the main body and are in close contact with the surface of the metal layer, an overlapping portion of each of the plurality of connection terminals with the metal layer is simultaneously added via the horn (the end face of the tip part). By applying ultrasonic vibration while pressing, a plurality of overlapping portions can be diffusion-bonded simultaneously. In addition, as a vibration transmission member (horn) provided with a recess capable of accommodating the electronic component main body at the tip portion, for example, a cup type or a portal type horn can be considered. In addition, as a method of accommodating the electronic component main body in the concave portion of the horn tip portion and making the end surface of the horn hit the overlapping portion with the metal layers of the plurality of connection terminals, for example, in the concave portion of the horn tip portion The electronic component main body is accommodated and held in advance, and the horn accommodating and holding the electronic component is lowered from above to the electronic component mounting planned position in the metal layer, and the electronic component placed in advance at the predetermined position of the metal layer. A method is conceivable in which the horn is lowered and the electronic component main body is accommodated in the concave portion of the horn tip.

  According to the electronic component module according to claim 1, the film-like laminate as the electronic component module constituent member can follow any three-dimensional shape like a metal foil, and has much higher durability than a metal foil. For this reason, it is possible to easily assemble a complicated and complicated region that is difficult to arrange in the related art, and the versatility of the electronic component as a power supply wiring is greatly expanded. In particular, since the pair of film-like laminates constituting the power feeding path can be arranged in different directions, versatility is further enhanced.

  In addition, since the connection terminal on the electronic component side and the metal layer on the film-like laminate side are joined by diffusion bonding that does not apply high heat or large pressure, the film-like laminate (the metal layer) breaks or the heat of the electronic component There is no damage and the defective product rate is low.

  Further, if the electronic component is configured to be positioned with respect to the lamp by, for example, being directly fixed and held on the lamp body side, the positioning accuracy of the electronic component with respect to the film-like laminate is not required to be as strict as in the past, so that The manufacturing process of the component module is also simplified.

  According to the electronic component module of the second aspect, the same effect as the electronic component module according to the first aspect can be obtained, but the pair of power supply paths are configured by a single film-like laminate. Although it is less versatile than Item 1, the configuration is simpler than the electronic component module of Claim 1 because the number of components is small.

  According to claim 3, since the light emission center of the LED can be accurately positioned at a predetermined position in the lamp chamber, it is possible to ensure an appropriate light distribution of the lamp, and to relax the accuracy of the bonding position of the LED with respect to the power supply path. By doing so, the manufacturing process of the electronic component module is simplified, and the production efficiency of the LED module is also increased.

  According to the method for manufacturing an electronic component module according to claim 4, 5 or 6, in the manufacturing process of the electronic component module, the troublesome bending process that has been indispensable in the past is omitted, and the manufacturing process is simplified. Increases production efficiency of component modules.

  According to the method of claim 4, since the pair of film-like laminates on which electronic components are mounted (bonded and fixed) are configured in advance as separate members, the electronic components are placed between the pair of film-like laminates by diffusion bonding. It is possible to easily manufacture a predetermined electronic component module simply by mounting (bonding and fixing) to the substrate.

  Further, according to the method of claim 5, in the manufacturing process of the electronic component module, a step of cutting and removing a part of the film-shaped laminate after the diffusion bonding of the connection terminal of the electronic component to the metal layer is necessary. For diffusion bonding of electronic components, the connection terminals of the electronic components may be bonded to predetermined positions of the metal layer in one film-shaped laminate, and the connection terminals of the electronic components are respectively bonded to the metal layers in the pair of film-shaped laminates. Compared with the method of claim 4, the positioning of the connection terminals and the metal layers is simple, and the handling is easy and the workability is good because the film-like laminate is a single sheet. In particular, since the power supply path can be formed after mounting the electronic component, an electronic component module having a power supply path of a desired shape can be easily manufactured.

  According to the method of claim 6, since the connection terminals of the electronic components may be diffusion-bonded to the predetermined positions of the pair of metal layers on one film-like laminate, the positions between the connection terminals of the electronic components and the metal layers Matching is easy, and it is not necessary to cut and remove the film-like laminate after mounting the electronic component, so that the manufacturing process of the electronic component module is simplified accordingly.

  According to the method for manufacturing an electronic component module according to claim 7, since the overlapping portions of the plurality of connection terminals derived from the electronic component main body and the metal layer of the film-like laminate can be diffusion-bonded simultaneously, The efficiency of the electronic component mounting work on the metal layer of the body can be improved, and the production efficiency of the electronic component module in which the electronic component is mounted on the metal layer that is the feeding path of the film-like laminate is increased.

  Next, embodiments of the present invention will be described based on examples.

  1 to 7 show an embodiment of the present invention, and FIG. 1 is a plan view of an electronic component module (LED unit) for an automotive lamp (marker lamp) according to a first embodiment of the present invention. Is an enlarged perspective view of the LED and the film-like laminate, FIG. 3 is a front view of a lamp (marker lamp) containing the LED unit, and FIG. 4 is a horizontal sectional view of the lamp (marker lamp) (line IV- shown in FIG. 3). FIG. 5 is a longitudinal sectional view of the same lamp (marker lamp) (cross sectional view taken along line V-V shown in FIG. 3), and FIG. 6 is a connection layer of the LED and a metal layer of the film-like laminate. FIG. 7A is a side view of a horn that is a vibration transmitting member, FIG. 7B is a perspective view of the tip of the horn, and FIG. 8 is an LED connection terminal and bus bar. 9 is an enlarged perspective view around the tip of the horn that pressurizes the overlapping portion with FIG. 9, FIG. 9 shows contact between the horn and the connection terminal It is a diagram showing a product.

  1 and 2, reference numeral 10 (10A, 10B, 10C, 10D) is composed of a very thin metal foil coated with a resin, and has the same flexibility and flexibility as the metal foil, compared with the metal foil. A film-like laminate (hereinafter referred to as a conductive film) that can be bent in a three-dimensional direction with exceptional durability, and specifically, an insulating synthetic resin (epoxy resin) layer 11 having a thickness of 50 μm and a thickness A 150 μm metal (Cu) layer 12 is laminated and integrated, and each is formed in a strip shape having a predetermined width. And red light emitting LED14 was mounted so that it might straddle between the conductive films 10 and 10 arrange | positioned adjacently in parallel, and several red light emitting LED14 was arrange | positioned at the whole surface side of the four conductive films 10 at the checkerboard shape. An LED unit U which is an LED module is configured. That is, one of the pair of connection terminals 16 led out from the LED main body 15 is joined to the metal layers 12 and 12 which are the surface layer portions of the adjacent conductive films 10 and 10 by diffusion bonding, respectively. 10B, 10C, and 10D) each metal layer 12 constitutes a feeding path in the LED. In addition, one end portions of the conductive films 10 </ b> A and 10 </ b> D are connected to a control board 90 that controls lighting of the LED 14, and a power supply cord 92 is connected to the control board 90.

  As shown in FIGS. 3 to 5, the LED unit U is disposed in a lamp chamber S defined by a lamp body 101 of a tail unstop lamp 100 that is a marker lamp and a front lens 102 that is curved. It is disposed on the back side of the reflector 80. That is, the reflector 80 that is curved on the tertiary surface in the vertical and horizontal directions is provided with a plurality of parabolic reflection surface portions 84, and an LED engaging portion 85 is provided on the rear top portion of each parabolic reflection surface portion 84. By engaging the main body 15 with the LED engaging portion 85, the light emission center of the LED 14 is naturally positioned with respect to the parabolic reflecting surface portion 84. Reference numeral 103a is a fisheye lens provided in an area corresponding to the entire area where the parabolic reflection surface portion 84 of the reflector 80 is formed at least on the back side of the front lens 102.

  The LED engaging portion 85 is provided with an elastic hook 86 that holds and holds the LED main body 15, and by elastically deforming the elastic hook 86, the back side of the reflector 80 of the LED main body 15 to the LED engaging portion 85 is provided. Insertion and removal from the is easy. Further, the conductive film 10 (10A, 10B, 10C, 10D) is flexible when the LED main body 15 is engaged and held by the LED engaging portion 85 or when the LED unit U is disposed on the reflector 80. 4 and 5, the conductive film 10 is bent at the joint between the connection terminal 16 and the conductive film 10 of the LED 14 and the like. The load that accompanies this is hardly affected.

  3, 4, and 5, reference numerals 104 and 106 are reflectors assembled on the front side of the left and right side edges of the reflector 80, and are closer to the center of the reflector 80 that supports the reflector reflector 106 in the vehicle width direction. On the back side of the side edge 81, a control board 90 connected with a power supply cord 92 is held and fixed by an elastic hook 82. In addition, the area | region corresponding to the reflex reflectors 104 and 106 of the front lens 102 is a non-step area | region where the fisheye lens 103a is not formed (refer FIG. 4).

  As shown in an enlarged view in FIG. 2, the LED 14 has a structure in which a pair of tongue-shaped metal connection terminals 16 and 16 are led out in an L shape from the back side of the LED body 15 which is a rectangular synthetic resin molded body. The bent ends of the connection terminals 16 and 16 are each diffusion bonded to the metal layer 14 of the conductive film 10 so that the LED unit U is integrated.

  On the other hand, each conductive film 10 on which the LED 14 is mounted is formed in a strip shape having predetermined widths d1 and d2 as shown in FIG. 1, but initially includes the respective conductive films 10A, 10B, 10C, and 10D. The entire region (the region indicated by the phantom line in FIG. 1) is composed of one conductive film 10 ′, and after 18 LEDs 14 are mounted on one conductive film 10 ′, a predetermined region of the conductive film 10 ′. By cutting and removing (regions other than the respective conductive films 10A, 10B, 10C, and 10D shown in FIG. 1), the six right and left LEDs 14 are separated by the respective conductive films 10A, 10B, 10C, and 10D, which are separated from each other. LED unit U which is a power supply circuit connected in series in three stages is configured. In addition, the dashed-two dotted line in FIG.8, 9 shows the cutting position in the electrically conductive film 10 'after mounting LED14.

  6 to 9 show a terminal bonding apparatus for diffusion bonding the connection terminal 16 of the LED 14 to the conductive film 10 '. This terminal joining apparatus includes a film support base 20 having an anvil 22 made of a metal plate, a horn 30 that is a vibration transmission member disposed in a vertically movable manner above the film support base 20, and a horn 30. The oscillator 34 that generates ultrasonic vibrations in the coupled and integrated vibrator 35, the horn 30 supported by the frame 24, and the conductive film 10 ′ of the connection terminal 16 of the LED 14 through the horn 30 And an air cylinder 26 for applying pressure to the overlapping portion.

  The film support base 20 is composed of an XY table that can move in the horizontal direction, and is controlled so that a predetermined position (a planned LED mounting position) on the placed conductive film 10 ′ sequentially comes directly below the horn 30.

  As shown in FIGS. 6 and 7, the horn 30 has a round bar portion 30 b on the distal end side coaxially formed on a base end portion 30 a having a rectangular cross section on the coupling side of the vibrator 35. A columnar recess 31 that can accommodate the LED main body 15 in a loosely fitted state is provided at the center of the tip of the round bar portion 30 b, and a pair of connection terminals 16, 16 led out from the LED main body 15 are provided on the outer periphery of the recess 31. An annular end face 32 is provided in contact with the. Inside the horn 30, an intake passage 33 that opens to the top surface (bottom surface) of the recess 31 and the outer surface of the base end 30a is formed, and a negative such as a suction pump is provided in the opening 33a on the base end 30a side. A hose 37 extending from the pressure generator 36 is connected. For this reason, by operating the negative pressure generator 36 to generate a negative pressure in the recess 31, the LED body 15 is sucked into the recess 31, and the terminals 16 and 16 are hooked on the end face 32 of the tip portion, and the LED body 15 The LED 14 is sucked and held in a form in which the LED is accommodated in the recess 31.

  The vibrator 35 and the horn 30 are connected and integrated with a cylinder rod 26 a of the air cylinder 26 disposed downward, and can be moved up and down by the operation of the air cylinder 26, and connected to the connection terminal via the front end surface 32 of the horn 30. The overlapping portion of 16 and the conductive film 10 can be pressurized with a predetermined pressure.

  In addition, the oscillator 35 and the horn 30 are torsionally vibrated (reciprocating rotational vibration) around the axis by the operation of the transmitter 34, and this ultrasonic torsional vibration (reciprocating rotational vibration) is connected to the connection terminal via the horn tip surface 32. It is transmitted to the overlapping portion with 16 conductive films 10 '.

  A predetermined slight pressing force acts on each overlapping portion of the connection terminals 16 and 16 and the conductive film 10 ′ (the metal layer 12 thereof) via the horn tip surface 32. When ultrasonic torsional vibration (reciprocating rotational vibration) acts on the surface, the joint interface between the connection terminal 16 and the conductive film 10 ′ is rubbed, and the oxide film and attached impurities are mechanically cleaned, and rapid plastic flow occurs. It is generated and diffusion-bonded (also called solid-phase bonding). In particular, since the surface of the anvil 22 and the front end surface 32 of the horn 30 that sandwich the overlapped portion are each constituted by a knurled uneven surface, ultrasonic torsional vibration (reciprocating rotational vibration) acts on the overlapped portion. In this case, no slip occurs between the anvil 22 and the conductive film 10 'and between the connection terminal 16 and the horn tip surface 32, and the joint interface between the connection terminal 16 and the conductive film 10' (the metal layer 12) is efficient. As a result of being rubbed well, mechanical cleaning and diffusion bonding are completed in a very short time, and the LED 14 (the connection terminal 16) is connected to the conductive film 10 ′ (the metal thereof) without giving a thermal shock to the LED body 15. Bonded to layer 12). In this manner, the LEDs 14 can be sequentially mounted at the LED mounting planned positions of the conductive film 10 '. Further, the conductive film 10 ′ in which the LED 14 is mounted at the LED mounting planned position is cut and removed in a predetermined region, and the separated conductive films 10 </ b> A to 10 </ b> D are formed, and the LED unit U is completed.

  In this embodiment, the ultrasonic vibration acting on the overlapping portion of the connection terminal 16 and the conductive film 10 ′ (the metal layer 12) is torsional vibration (rotational reciprocal vibration), and the connection terminals 16 and 16 vibrate. However, even if the LED 14 is slightly shifted in the circumferential direction, the light emission center position of the LED 14 is not shifted from the planned LED mounting position.

  Further, the horn tip end face 32 vibrates in the circumferential direction due to the transmitted ultrasonic torsional vibration (rotational reciprocating vibration). However, since the horn tip end face 32 has a perfect annular shape, as shown in FIG. The contact area between the contact terminal 16 and the contact terminal 16 does not change at all, and the applied pressure and vibration energy acting on the respective overlapping portions of the connection terminals 16 and 16 and the conductive film 10 '(the metal layer 12 thereof) are always constant. Thus, the LED unit U can be manufactured which has excellent durability in which the bonding strength at both overlapping portions is uniform and the bonding portions are less likely to peel off.

  Next, a method of bonding the connection terminal 16 of the LED 14 to the metal layer 12 of the conductive film 10 'using the terminal bonding apparatus shown in FIGS.

  First, the horn 30 is set at a predetermined position above the film support 20, and the negative pressure generator 36 is operated to hold the LED 14 in the tip recess 31 of the horn 30 by suction. On the other hand, one conductive film 10 ′ is placed and fixed on the support base 20 configured with an XY table so that the metal layer 12 faces upward, and the LED mounting planned position of the conductive film 10 ′ is the axis center of the horn 30. The support base (XY table) 20 is set so that it is directly below. Note that either the adsorption holding of the LED 14 in the tip recess 31 of the horn 30 or the mounting and fixing of the conductive film 10 ′ on the support base 20 may be performed first. Next, the horn 30 is lowered by actuating the air cylinder 26 set in advance so as to have a predetermined cylinder set pressure, and the horn is placed on each overlapping portion of the connection terminals 16 and 16 with the conductive film 10 '. A predetermined pressure is applied via 30. At the same time, the oscillator 34 operates to vibrate the vibrator 35, and ultrasonic torsional vibration (in the overlapping portion of the connection terminals 16 and 16 with the conductive film 10 ′ (the metal layer 12 thereof) via the horn 30 ( Reciprocating rotation vibration) acts. Thereby, each overlapping portion of the connection terminals 16 and 16 with the conductive film 10 ′ is diffusion bonded.

  When the joining at the first scheduled joining position is completed, the horn 30 is raised and the support base (XY table) 20 is driven, so that the second scheduled joining position of the conductive film 10 ′ is directly below the horn 30. During this time, a new LED 14 is held in the recess 31 of the horn 30, the horn 30 is lowered, and ultrasonic torsional vibration is applied while pressing the overlapping portion of the terminal 16 and the conductive film 10 ′ (the metal layer 12 thereof). As a result, the overlapping portion is diffusion bonded.

  In this way, when the mounting of the LEDs 14 at all the bonding positions is completed, the unit in which the LEDs 14 are mounted on the conductive film 10 ′ is removed from the support base 20, and a predetermined region (the conductive film to be formed) of the conductive film 10 ′ is removed. By cutting and removing regions other than those corresponding to 10A to 10D, an LED unit U in which the LEDs 14 are mounted on the conductive films 10A to 10D, which are power supply paths, is completed.

  In the above-described manufacturing method of the LED unit U, the power supply path corresponding to the connection terminal of the LED 14 is obtained by cutting and removing a predetermined region of the conductive film 10 ′ after mounting the LED 14 on one large conductive film 10 ′. However, if the conductive film on which the LED 14 is to be mounted is formed in a predetermined size as shown by reference numerals 10A to 10D in advance, the conductive film 10 arranged so as to be adjacent to each other is formed. , 10, the LED unit U is completed simply by mounting the LED 14, so that the conductive film cutting step after mounting the LED 14 as described above can be omitted.

  10 to 12 show another embodiment of a lamp (marker lamp) containing an LED unit, and FIG. 10 shows an electronic component module for an automotive lamp (marker lamp) according to a second embodiment of the present invention ( FIG. 11 is a horizontal sectional view of a lamp (marker lamp) corresponding to FIG. 4, and FIG. 12 is an exploded perspective view of the LED unit and the reinforcing plate.

  In these figures, a pair of metal layers 12 and 12 having a predetermined width d1 are provided on the front side of an insulating synthetic resin layer 11 having a predetermined width d3 so as to be adjacent to each other in parallel. The LED 14 is mounted between the adjacent metal layers 12 and 12 which are the surface layer portions of the respective conductive films 10 to constitute the LED unit U1.

  Reference numeral 70 denotes a synthetic resin reinforcing plate for disposing the LED unit U1, which is disposed in the lamp chamber S between a lamp body (not shown) and a front lens 102A that is curved vertically and horizontally. Is formed in a cubic curved surface that follows the curved surface of the front lens 102A. A circular hole 74 through which the tip light emitting portion of the LED 14 can protrude is provided at the center of each step plane 72, and an LED engagement portion 75 including an elastic hook 76 is provided on the back side of the step plane 72.

  Then, each LED unit U1 is attached to the back side of the reinforcing plate 70 so that the LED main body 15 is engaged and held with the LED engaging portion 75 by the elastic hook 76, and the tip light emitting portion of the LED 14 is exposed from the circular hole 74. It has been. In FIG. 11, reference numeral 103a is a fish-eye lens provided on the front side of the front lens 102A, and reference numeral 103b is a Fresnel lens provided on the back side of the front lens 102A.

  Each conductive film 10 is provided with a right fold line 10a corresponding to the stepped plane 72 of the reinforcing plate 70, but may have a structure that does not have a fold line as in the first embodiment.

  FIG. 13 is a plan view of an electronic component module (LED unit) for an automotive lamp (marker lamp) according to a third embodiment of the present invention. In the LED unit U of the first embodiment described above, the LEDs 14 are mounted across the adjacent conductive films 10A to 10D, but in the LED unit U2 of this embodiment, continuous insulation is provided. A metal layer 12A to 12D is provided adjacent to the surface layer portion of the synthetic resin layer 11 to form a single conductive film, and an LED 14 is mounted between the adjacent metal layers 12A to 12D as the surface layer portion of the conductive film. Has been.

  In the third embodiment, the metal layers 12A to 12D, which are power supply paths, are configured as a predetermined pattern insulated from each other by a single conductive film. Therefore, the LED units U and Although the versatility is inferior to that of the LED unit U1 in the second embodiment, the configuration as the LED unit is simplified because the number of components is small. In addition, since the metal layers 12A to 12D are integrated in the conductive film, the process of diffusion bonding the connection terminals of the LEDs 14 is simplified.

  Moreover, although the above-mentioned Example demonstrated the LED unit and its manufacturing method as an electronic component module and its manufacturing method, the electronic component module which mounted electronic components other than LED on the metal layer of a conductive film, and its manufacturing method are also mentioned. Needless to say, the present invention can be applied.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an electronic component module (LED unit) for an automotive lamp (marker lamp) that is a first embodiment of the present invention. It is an expansion perspective view of LED and a film-form laminated body. It is a front view of the lamp (marker lamp) which accommodated the LED unit. It is a horizontal sectional view (sectional view along line IV-IV shown in FIG. 3) of the lamp (marker lamp). It is a longitudinal cross-sectional view (cross-sectional view which follows the line VV shown in FIG. 3) of the lamp (marker lamp). It is a whole block diagram of the diffusion bonding apparatus which carries out diffusion bonding of the connection terminal of LED, and the metal layer of a film-form laminated body. (A) It is a side view of the horn which is a vibration transmission member. (B) It is a perspective view of the front-end | tip part of a horn. It is an expansion perspective view of the horn front-end | tip part periphery which pressurizes the overlapping part of the connection terminal and bus bar of LED. It is a figure which shows the contact area of a horn and a connection terminal. It is a top view of the electronic component module (LED unit) for the vehicle lamp (marker lamp) which is the 2nd Example of this invention. It is a horizontal sectional view of the other Example of the lamp (marker lamp) which accommodated the LED unit. It is a disassembled perspective view of the LED unit and a reinforcing plate. It is a top view of the electronic component module (LED unit) for the vehicle lamp (marker lamp) which is the 3rd Example of this invention. It is a schematic diagram of a prior art (patent document 1). It is a schematic diagram of a prior art (patent document 2).

Explanation of symbols

U, U1, U2 LED unit 10 which is an electronic component module (10A to 10D) Conductive film 11 which is a film-like laminated body Insulating synthetic resin layer 12 (12a, 12b, 12c, 12d) Metal layer 14 which is a feeding path Electron LED as a component
DESCRIPTION OF SYMBOLS 15 LED main body 16 Connection terminal 10 'One film-like laminated body S Lamp chamber 20 Film support stand 22 Anvil 26 Air cylinder 30 which is a pressurizing means Horn 31 which is a vibration transmission member LED accommodation provided in the front-end | tip part of a horn Recessed portion 32 End face 33 of horn tip portion Intake passage 34 as LED adsorption holding means Transmitter 36 as ultrasonic generator Negative pressure generator 80 as LED adsorption holding means Reflector 84 Parabolic reflection surface portion 100 Tail and tail lamp Stop lamp 101 Lamp body 102 Front lens

Claims (7)

  An electronic component module in which an electronic component is mounted between a pair of metal layers that are power supply paths, wherein the pair of metal layers is a pair of film-like laminates in which an insulating synthetic resin layer is laminated and bent as a whole in a three-dimensional direction. An electronic component module characterized in that each metal layer of the pair of film-like laminates and a connection terminal derived from the electronic component main body are joined by diffusion bonding while being configured as each surface layer portion of the body.   An electronic component module in which an electronic component is mounted between a pair of metal layers that are power supply paths, wherein the pair of metal layers is a single film that can be bent in a three-dimensional direction by laminating an insulating synthetic resin layer. An electronic component module configured as a pair of surface layer portions in a laminate, wherein a pair of metal layers of the film-like laminate and connection terminals derived from the electronic component body are joined by diffusion bonding.   The electronic component is configured by an LED that is a light source for a vehicle lamp that is derived from a plurality of connection terminals from the LED body, and the LED body is engaged with an LED engaging portion of a lamp component member, so that a predetermined lamp interior is obtained. The electronic component module according to claim 1, wherein a light emission center of the LED is positioned at a position.   The method of manufacturing the electronic component module according to claim 1, wherein a plurality of connection terminals derived from the electronic component main body are superposed on predetermined positions of the metal layers of the pair of film-shaped laminates arranged side by side, A method of manufacturing an electronic component module, comprising applying ultrasonic vibration while pressurizing the overlapping portion through a horn as a vibration transmitting member to perform diffusion bonding.   The method of manufacturing the electronic component module according to claim 1, wherein the plurality of connection terminals led out from the electronic component main body are a single film-like laminate in which an insulating synthetic resin layer and a metal layer are laminated and integrated. Each of the metal layers in the body is superposed at a predetermined position, and after ultrasonic diffusion is applied and pressure is applied to the superposed portion through a horn as a vibration transmitting member, diffusion bonding is performed, and then the plurality of connection terminals and the metal layer are joined. A part of the film-like laminate is cut and removed so as to insulate the parts.   It is a manufacturing method of the electronic component module of Claim 2, Comprising: The some connecting terminal derived | led-out from the said electronic component main body is a predetermined pair of metal layer arranged in parallel as a surface layer part of the said film-like laminated body. A method of manufacturing an electronic component module, characterized by applying ultrasonic vibration while applying pressure to the overlapped portion via a horn that is an overlapped and vibration transmitting member and applying ultrasonic vibration. The tip of the horn is provided with a recess capable of accommodating the electronic component main body, and ultrasonic vibration is performed while simultaneously pressing the plurality of overlapping portions so that the electronic component main body is accommodated in the concave portion. The method of manufacturing an electronic component module according to claim 4, wherein diffusion bonding is performed.

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