JP2005321911A - Transparent IC card with light emitting element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transparent with a light emitting element in which an organic EL element is disposed in an IC card in an IC card having a predetermined infrared transmission density in a transmission density regulation region, while the entire card is made of a transparent substrate and has a transparent feeling. Provide IC card.
A transparent IC card with a light emitting element according to the present invention comprises a structure in which a wallet-sized card is laminated with a transparent base material, and an infrared ray so as to satisfy a predetermined light transmission density in an area defined by JISX6301. It is a transparent card | curd by which the ink containing an absorber was coated on the base material, Comprising: The organic electroluminescent element 6 is provided in the transparent base | substrate 10 of the said card | curd, It is characterized by the above-mentioned. The transparent IC card 1 may further include a solar panel 2 for power generation and a paper battery 4. The IC card may be any of a contact type, a non-contact type, and a contact / non-contact type.
[Selection] Figure 1

Description

The present invention relates to a transparent IC card, and in particular, the card base is composed of a transparent base, the organic base is provided with an organic electroluminescence element in the transparent base, and a predetermined light transmission density is defined in a region defined by JISX6301. It is related with the transparent IC card with a light emitting element with which the ink containing the infrared absorber was applied so that it might satisfy | fill.
Such a transparent IC card with a light-emitting element is used for various credit cards and cash cards, but is preferably used as a card that allows visual confirmation of the operating state of the IC card and as a card with a stylish sensation.

The operation state of the IC card, for example, whether or not power is supplied to the IC card from an external device such as a reader / writer is displayed on the display device of the external device so that the user of the IC card can be identified. is there. For example, a display device such as a light emitting diode (LED) or a liquid crystal (LCD) is provided in the external device, and the operation status of the external device and the IC card, for example, communication with the IC card is determined. The operation status is displayed.
However, in the case of a non-contact IC card, an external device such as a reader / writer may communicate with a plurality of IC cards at the same time, and whether the user's own IC card is operating even when viewing the display on the external device. In some cases, it cannot be determined whether another person's IC card is operating. Therefore, there is a demand for an IC card that can recognize itself by emitting light.

On the other hand, there is a potential need to provide a power supply in the card, and a solar panel for power generation has been provided as a solution. Conventionally, most solar panels attached to ISO-compliant cards such as cash cards and credit cards are arranged on the outermost surface of the card. This is because a transparent base material cannot be used due to problems such as suitability for ATM (automated teller machine), and it is difficult to install in a card substrate.
That is, if the transparency is too high, the ATM card detection sensor misidentifies, so the card needs a certain light transmission density and is required to have a certain density.
On the other hand, the card that satisfies the requirement is opaque, which makes it difficult to install the solar panel in the card base. If the solar panel can be installed in the card base, there are advantages that the restriction on the card design is reduced and the information display area can be increased.
In the case of a non-contact IC card, main wiring processing such as a solar panel can be performed at the stage of the antenna sheet, and the manufacture becomes easy.

Cards such as credit cards, cash cards, point cards, employee ID cards having a magnetic recording unit are driven in a card reader for reading magnetic recording data.
For example, when a card is inserted into an ATM, the sensor detects that the leading end of the card has been inserted, and the ATM starts reading the magnetic recording unit.
For this reason, JISX6301's 8.1.10 conforming to ISO / IEC7810 specifies the light transmittance of the card. “All machine-reading cards have a light transmission density of 1.5 or more in the specified area. It must have. "
Many IC cards also use a magnetic recording unit together, and the card detection is performed in the same way, so it is necessary to satisfy the standard.

The area defined in JIS X6305 is an area of 21.0 mm from the upper edge of the card and the lower edge of the card in an ID-1 type card (width 85.6 mm, height 53.98 mm, thickness 0.76 mm). To 10.0 mm.
In addition, a light transmission densitometer having a sensitivity with a wavelength up to 900 nm is designated as a test apparatus for measuring the light transmission density.

Therefore, in order to detect this card, a transmissive infrared sensor is often used. In the transmissive infrared sensor, for example, an infrared light projecting unit is attached to the front side of the card and a light receiving unit is attached to the back side along the ATM card travel path. When the card passes between the light projecting unit and the light receiving unit, the light receiving unit detects that the card has passed because the infrared rays irradiated from the light projecting unit are blocked by the card.
However, depending on the external reading device, the card may be detected using an infrared sensor at a position other than the light transmittance regulation region. In this case, the entire surface of the card needs to have infrared absorption characteristics.

  In order for the card to be detected, the card substrate must block infrared rays. In the case of a normal card, an opaque white pigment is kneaded into the base material, so that infrared rays are blocked. On the other hand, the transparent card is also called a skeleton card, and since it has a fashionable feeling, there are many lovers from the past, but pigments and the like cannot be kneaded. Therefore, in order to realize a skeleton card, it is necessary to have a sense of transparency sufficiently visually and to block the near-infrared light and satisfy the light transmission density regulations such as ATM.

In order to satisfy such needs, conventionally, an infrared absorbent is kneaded with a card base resin or used as a printing ink and applied to a card base.
For example, Patent Document 1 relates to a “transparent card”, but a light-absorbing material such as a phthalocyanine compound, an anthraquinone compound, a polymethine compound, a cyanine compound, an aminium compound, or a diimonium compound is used alone or as a card substrate. A transparent card that absorbs light having a wavelength of 550 nm or more and 1000 nm or less by using a mixture is proposed.
However, when an infrared absorbent is kneaded into a card substrate, it is necessary to manufacture a large amount of the substrate in advance, and it is difficult to handle a small lot.

Patent Document 2 relates to a “transparent magnetic card”, but proposes printing an ink layer containing a dye that absorbs an infrared region of 800 nm to 1000 nm on a card substrate. However, the specific content of the infrared absorbing material has not been clarified.
Patent Document 3 is a prior application by the applicant of the present application, but is a transparent card using a printing ink using an infrared absorbent having a maximum absorption range at wavelengths of 800 nm to 1050 nm, and the printing ink includes two types of the printing ink. It is proposed to use a mixture of infrared absorbers.

JP 2001-301369 A JP 2001-319325 A Japanese Patent Application No. 2003-327646

The prior art for supporting a light emitter on an IC card includes the following.
Patent Document 4 proposes that an IC card is provided with an LED to emit light. However, the specific contents of the LED lamp that can be incorporated into an IC card having a thickness of about 0.76 mm are not disclosed. Patent Document 5 proposes providing a non-contact IC card with an organic electroluminescence (hereinafter also referred to as “organic EL”) element. The organic EL element has an advantage that it can be made into a thin layer, and can be installed in a card substrate.

On the other hand, there is a request to incorporate a primary battery into the IC card base, but there is a problem that the life of the battery itself becomes the life of the card due to the difficulty of battery replacement. Therefore, in reality, the contact IC card is supplied with power from an external terminal, and the non-contact IC card satisfies the need by receiving power via an antenna. However, the time for the non-contact IC card to communicate with the external device is very short, and sufficient power cannot be obtained.
Various prior arts exist for providing a card with a solar panel (solar cell). Patent Document 6 describes that a solar cell is used for an IC card, but the solar cell is arranged on the card surface. Patent Document 7 also describes that a solar cell is stacked on a display IC card, but does not describe that the base material of the IC card is a transparent base material and satisfies ATM suitability.

JP 2004-94561 A JP 2000-194808 A JP-A-6-96301 JP 2001-338273 A

  Therefore, the present invention makes the transparent card base material opaque in the near-infrared region by selecting an absorbent having a high infrared absorption effect to make a printing ink, and includes an organic EL element in the transparent base of the card, The present invention has been completed by researching light emission during operation and incorporating a solar panel together.

  The first of the gist of the present invention for solving the above-mentioned problem is that a wallet-sized card is formed by laminating a transparent base material, and an infrared ray so as to satisfy a predetermined light transmission density in an area defined by JISX6301. In the transparent card | curd by which the ink containing an absorber was coated on the base material, it is in the transparent IC card with a light emitting element provided with an organic electroluminescent element in the transparent base | substrate of the said card | curd.

  The second of the gist of the present invention for solving the above-mentioned problem is that the wallet-sized card is formed by laminating transparent base materials, and an infrared ray so as to satisfy a predetermined light transmission density in an area defined by JISX6301. In the transparent card | curd by which the ink containing an absorber was coated on the base material, an organic electroluminescent element and the solar panel for electric power generation are provided in the transparent base | substrate of the said card | curd, It exists in the transparent IC card with a light emitting element.

The transparent IC card with a light emitting element of the present invention has a stylish visual effect called a skeleton because the card is a laminated structure of transparent base materials.
Since the card substrate is transparent, the organic EL element of the IC card and other internal components can be viewed through in a three-dimensional manner, so that the user's interest can be raised.
Furthermore, the predetermined area of the card has a transmission density that satisfies international or domestic standards, and has the effect that the detection sensor can be identified.
Since the organic EL element and the solar panel are laminated and provided in the transparent card base, the design restrictions on the card surface can be reduced.

The organic EL element can be reduced in size and thickness, and can be more flexible than a liquid crystal display element. Further, surface light emission is performed, and light emission can be seen from an oblique direction in addition to the front direction, and the light emission can be easily recognized. The IC card is thin and often bends, and the card user often sees the IC card from an oblique direction. For this reason, an organic EL element is used suitably for an IC card.
If the circuit configuration is such that the organic electroluminescence element displays the operation status of the IC card, the operation status can be confirmed from the viewing angle, so that a pleasant IC card can be used.
Since an organic EL element and a solar panel can be installed in the transparent card base, in the case of a non-contact IC card, main wiring processing can be performed at the stage of preparing the antenna sheet.

First, the EL element provided in the card will be described. There are two types of EL: an intrinsic EL and a charge injection type EL. Intrinsic EL (inorganic EL) emits light by sandwiching a thin film of a dielectric layer, in which a phosphor is dispersed in a dielectric, between electrodes, applying an alternating voltage and applying an alternating electric field.
A phosphor using zinc sulfide (ZnS) is generally used, and is also called an inorganic EL because an inorganic compound is used as a light-emitting substance.
However, the drive circuit (driver) of the inorganic EL element needs to generate an alternating voltage of about 100V to 300V as an example, and there are various problems in preparing the IC card.

  Next, a charge injection type EL (organic EL) will be described. The charge injection type EL is a structure in which a direct current voltage is applied to a semiconductor thin film, holes and electrons are injected from the electrodes on both sides of the semiconductor thin film, and light is emitted, and light is emitted by a mechanism similar to a light emitting diode (LED). To do. An organic single crystal such as anthracene has been studied as a semiconductor thin film, but in recent years, a high-luminance light emitting element using the organic thin film has been found. Thus, EL using an organic thin film is called an organic EL element.

  FIG. 8 is an explanatory diagram for explaining an example of the organic EL element. The organic EL element 6 was formed on a plastic substrate 61, a transparent electrode 62 laminated on the plastic substrate 61, a hole transport layer 63 laminated on the transparent electrode 62, and the hole transport layer 63. The light emitting layer 64 includes an electron transporting layer 65 stacked on the light emitting layer 64, and a back electrode 66 stacked on the electron transporting layer 65. The transparent electrode 62 is connected to the anode (positive electrode) of the DC power source 69, and the back electrode 66 is connected to the cathode (negative electrode) of the DC power source 69.

  A transparent electrode 62 such as an ITO electrode is formed on a plastic substrate 61, a hole transport layer 63 that facilitates the flow of holes and an electron transport layer 65 that facilitates the flow of electrons are sequentially formed, and a back electrode 66 such as an MgAg alloy is formed. . The hole transport layer (hole injection transport layer) 63 receives and transports hole injection from the anode, and the electron transport layer (electron injection transport layer) 63 receives and transports electron injection from the cathode. When a positive electrode is connected to the transparent electrode 62 and a cathode is connected to the back electrode 66 to supply a DC voltage, holes flowing from the transparent electrode 62 to the hole transport layer 63 and electrons flowing from the back electrode 66 to the electron transport layer 65 are supplied. Are recombined in the light emitting layer 64 between the hole transport layer 63 and the electron transport layer 65 to emit light. The plastic substrate 61 transmits visible light emitted from the light emitting layer 64, and the visible light can be seen through the plastic substrate 61.

In the configuration of FIG. 8 described above, if the light emitting layer 64 is a red light emitting layer, a red organic EL element is obtained, and if the light emitting layer 64 is a blue light emitting layer, a blue organic EL element is obtained.
Further, a full-color display panel can be obtained by adding organic EL elements of red and blue as well as green and sequentially forming them on the common electrode surface in a matrix. A full color display panel can be obtained in the same manner even when the light emitting layer for each color is replaced by a combination of a white light emitting layer and the three color filters.

The organic EL element can be driven by a DC voltage and can be operated at a low voltage of 10 V or less. As the EL element mounted on the non-contact type IC card, an organic EL element that operates at a low driving voltage is preferable for the purpose of receiving power from an external device. Since an IC card normally has a drive voltage of 5.0 V or less, it is desirable that the IC card can be driven at a lower voltage.
For example, the organic EL element can have a current consumption of about 2.3 mA / cm ² . Also in the organic EL element, each color display, pattern display, and multicolor full color display are possible.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
1 is a plan view showing an example of a transparent IC card with a light emitting element according to the present invention, FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. FIG. 4 is a cross-sectional view taken along line AA in FIG. 3, FIG. 5 is a schematic block diagram showing a power supply system of an organic EL element, and FIG. 6 is a circuit of a transparent IC card with a light emitting element. A block diagram and FIG. 7 are graphs showing a spectral transmittance curve of a card substrate coated with an ink containing an infrared absorbent.

The transparent IC card 1 with a light emitting element has a shape (85.6 mm × 53.98 mm) conforming to the ID-1 type card standard, and the entire is formed with a substantially constant thickness.
In the case of FIG. 1, it is a contact / non-contact type IC card having an organic EL element 6, a solar panel 2, a paper battery 4, and an antenna coil 11 in a card base 10, and a contact terminal plate of the IC module. 8 on the card surface. The organic EL element 6 performs red, blue, and green pattern display. The pattern is displayed by a matrix or a segment indicating whether the element itself has a pattern shape.

  Since the card is basically visually transparent, a transparent substrate is used. However, the above-mentioned specified area (the card edge area having a width of A1 and A2 in FIG. 1) is opaque to infrared rays. Therefore, an ink containing an infrared absorbent is applied to the card substrate. The ink may be applied in a predetermined transmission density regulation range, but it is often applied on the whole surface for convenience of process and design. The substrate on which the ink containing the infrared absorber is applied is a core sheet or an oversheet, or both of them, but it is applied to the core sheet that is the inner surface of the card substrate 10 rather than the oversheet that is the surface. This is preferable in terms of durability of the ink layer containing an infrared absorber.

  The organic EL element 6 and the solar panel 2 are provided in a transparent portion where there is no card base design or the like. However, the organic EL element 6 and the solar panel 2 may be a coated portion of ink containing an infrared absorber or a non-coated portion. This is because the infrared absorber used for the transparent card is one that hardly absorbs in the visible light region. The installation position of the paper battery 4 may be the back of the design portion provided on the card surface. Although the paper battery 4 is not indispensable, if it is provided, it can be charged even when the IC card is not used. Therefore, there is an advantage that power can be supplied in low light or at night when sunlight cannot be obtained. The area other than the organic EL element 6 and the solar panel 2 may be an embossed area for specifying a general print information display unit of a card or a card user.

In the embodiment of FIG. 1, if the power from the solar panel 2 is supplied to the transmitter of the IC chip, the non-contact communication range can be widened as compared with the case of weak power by an external device.
Conventionally, in the case of non-contact communication, externally supplied power is received by an antenna coil connected to a non-contact IC chip and converted to power. However, when power supply is received from an external device, the communication distance is limited. There was a problem. Improvement can be achieved by enabling the power supply from the inside. Even in the case of a contact IC card, if the solar panel 2 is provided, the organic EL element 6 can be displayed as necessary even when not connected to the terminal.

FIG. 2 is an exploded sectional view taken along line AA in FIG.
In many cases, the card base 10 is composed of two layers of core sheets 101 and 102 and transparent oversheets 103 and 104 on both sides thereof. In the case of a transparent card, the two-layer core sheets 101 and 102 are also transparent. In the case of a contact / non-contact type IC card, the core sheet 101 is also referred to as an antenna sheet (or inlay sheet), and an antenna coil 11 is formed in advance on either surface thereof.

In the case of FIG. 2, the antenna sheet 101 is punched to form a space into which the organic EL element 6, the solar panel 2, and the paper battery 4 are fitted.
Normally, the antenna coil 11 is formed in a square ring around the card base 10, and therefore, the space inside the ring is used as a storage portion. Of course, another spacer sheet into which the solar panel 2 and the paper battery 4 are fitted, or a base material on the core sheet 102 side may be used, but providing the housing portion in the same antenna sheet 101 as the antenna coil 11 Necessary wiring processing and the like can be completed in the preparation stage of the antenna sheet 101 before the hot press, and the manufacture becomes easy.
The IC module mounting recess 20 is formed by counterbore from the card surface by an end mill or the like after the card base 10 is integrated by pressing.

In the case of FIG. 3, it is a non-contact type IC card and does not have a contact terminal plate of the IC module on the card surface, but the non-contact type IC chip 3 and the organic EL element 6, the solar panel 2, the paper battery 4, An antenna coil 11 is provided in the card base 10.
The organic EL element 6 and the solar panel 2 are provided in the transparent portion of the card base 10, but the paper battery 4 may be provided on the back surface of the design portion provided on the card surface as described above.

FIG. 4 is a cross section taken along line AA in FIG. 3, but the thickness direction is similarly enlarged.
The configuration of the card base 10 is substantially the same as that in the case of FIG. 2, and a core sheet (antenna sheet) 101, a core sheet 102, and oversheets 103 and 104 are laminated. The antenna sheet 101 is punched out to form a space into which the organic EL element 6, the solar panel 2, and the paper battery 4 are fitted, as in the case of FIG. In addition, since the organic EL element 6 exists in the position which overlaps with the solar panel 2, it does not appear in FIG. 2, FIG.
The core sheet 102 is often formed with an opening 30 h that absorbs the thickness of the non-contact IC chip 3.

FIG. 5 is a schematic block diagram showing a power supply system of the organic EL element. As for FIG. 5, the transparent IC card 1 with a light emitting element will be described as an example of the non-contact IC card 100.
Examples of the method for driving the organic EL element 6 include the following (a) to (c).
(A) The output of the rectifier circuit is used.
FIG. 5A is a schematic block diagram of the power supply system, and is related to (a) above. The non-contact IC card 100 includes an IC chip 30, a coil (antenna coil) 11 that converts a magnetic signal from a reader / writer (not shown) into an electrical signal, a rectifier circuit 120 that rectifies the output voltage of the coil 11, A constant voltage circuit (regulator) 130 that generates a drive voltage of the IC chip 30 from an output voltage of the rectifier circuit 120, and an organic EL element 6 that emits visible light when excited by the output voltage of the rectifier circuit 120. .

  Further, the non-contact IC card 100 includes a smoothing capacitor C1 connected to the output terminal of the rectifier circuit 120 and a smoothing capacitor C2 connected to the output terminal of the constant voltage circuit 130. The advantage of the non-contact IC card 100 is that the circuit configuration of the IC card is simplified. For this reason, the circuit scale mounted in the non-contact IC card 100 can be reduced, and the IC card can be reduced in cost. In the non-contact IC card 100, since the output voltage of the rectifier circuit 120 becomes the driving voltage of the organic EL element 6, the organic EL element depends on the communication distance between the non-contact IC card 100 and the external device, that is, the power receiving state of the non-contact IC card 100. 6 drive voltage changes. For this reason, the light emission luminance of the organic EL element 6 changes depending on the distance between the non-contact IC card 100 and the external device.

(B) The output of the constant voltage circuit is used.
FIG. 5B is another schematic block diagram showing the power supply system, and is related to the above (b).
The non-contact IC card 100 includes an IC chip 30, a coil 11 that converts a magnetic signal from a reader / writer (not shown) into an electric signal, a rectifier circuit 120 that rectifies an output voltage of the coil 11, and the rectifier circuit 120. A constant voltage circuit 130 that generates a driving voltage of the IC chip 30 from the output voltage of the organic EL element 6 and an organic EL element 6 that emits visible light when excited by the output voltage of the constant voltage circuit 130. Further, the non-contact IC card 100 includes a smoothing capacitor C1 connected to the output terminal of the rectifier circuit 120 and a smoothing capacitor C2 connected to the output terminal of the constant voltage circuit 130. The advantage of this IC card 100 is that the drive voltage of the organic EL element 6 is stabilized.

  For this reason, in the communication area where the non-contact IC card 100 can operate, the light emission luminance of the organic EL element 6 can be stabilized regardless of the distance between the non-contact IC card 100 and the external device. Even in the vicinity of the boundary of the communication area, it is easy to confirm whether the IC card 100 is operating. In the IC card 100, the constant voltage circuit 130 generates a drive voltage for the IC chip 30 and the organic EL element 6, and therefore requires a performance for generating a larger output current than the configuration of (a). There is a possibility that the circuit scale of the IC card becomes larger than the configuration of (a). Further, since the driving voltages of the IC chip 30 and the organic EL element 6 are equal, when the power supply voltage V of the IC chip 30 is lower than the operating voltage Ve emitted from the organic EL element 6, the IC chip is at a voltage higher than the power supply voltage V. 30 will be driven. In this case, the power consumption of the non-contact IC card 100 is increased, and the communicable distance between the non-contact IC card 100 and the external device may be shortened.

(C) The output of a power supply circuit different from the constant voltage circuit for driving the IC is used.
FIG. 5C is still another schematic block diagram showing the power supply system, and is related to the above (c). In the non-contact IC card 100, an IC chip 30, a coil 11 that converts a magnetic signal from a reader / writer (not shown) into an electric signal, a rectifier circuit 120 that rectifies an output voltage of the coil 11, and the rectifier circuit 120. A constant voltage circuit 130 for generating a driving voltage of the IC chip 30 from the output voltage of the output voltage, a booster circuit 160 for boosting the output voltage of the rectifier circuit 120, and emitting visible light when excited by the output voltage of the booster circuit 160. And an organic EL element 6 to be used. The non-contact IC card 100 includes a smoothing capacitor C1 connected to the output terminal of the rectifier circuit 120, a smoothing capacitor C2 connected to the output terminal of the constant voltage circuit 130, and an output terminal of the booster circuit 160. And a smoothing capacitor C3 connected to.
The booster circuit 160 may be configured to boost the output voltage of the constant voltage circuit 130 instead of the output voltage of the rectifier circuit 120. The booster circuit 160 is an example of a drive circuit that drives the organic EL element 6.

In FIG. 5C, the output of the rectifier circuit 120 is input to a constant voltage circuit 130 for driving the IC chip 30 and a booster circuit 160 that is a power supply circuit for driving the organic EL element 6.
The booster circuit 160 can drive the organic EL element 6 by generating a voltage higher than that of the constant voltage circuit 130 for driving the IC chip 30. The advantage of this non-contact IC card 100 is that separate power supply circuits for driving the IC 30 and the organic EL element 6 can obtain drive voltages according to the characteristics of the IC chip 30 and the organic EL element 6. Is a point. For this reason, power consumption can be reduced and the communication distance between the non-contact IC card 100 and the external device can be increased. Since the non-contact IC card 100 has more power supply circuits than the above configurations (a) and (b), the circuit scale mounted on the IC card may be increased.

In addition to the above, there are various power control methods. The transparent IC card 1 is provided with the power supply circuit as described above and connected to the IC card IC chip 30 via the circuit. The non-contact IC chip and the contact / non-contact type IC chip 30 include: Many IC chips 30 include the rectifier circuit and the like.
In that case, the power source of the organic EL element 6 is obtained from the terminal of the IC chip 30 (or an IC module obtained by modularizing the IC chip).

FIG. 6 is a circuit block diagram of the transparent IC card 1 with a light emitting element, which means an IC card including a contact / non-contact type IC chip 3.
On the card surface, contact terminals C1 (VCC), C2 (RST), C3 (CLK), C4 (battery charging terminal), C5 (GND), C6 (Vpp; unused), C7 (I / O), C8 It has a contact terminal plate 8 made of (reserved terminal for the future; RFU).

  The IC chip 3 has a data processing device composed of a CPU, ROM, RAM, and EEPROM. When contact-type data exchange is performed, a terminal device into which an IC card is inserted from a contact terminal C1 to a VCC (normally 5V) terminal. And a signal is input to the CLK (clock) terminal, the RST (reset) terminal, and the GND (ground potential) terminal through the contact terminals C3, C2, and C5. At the same time, the contact terminal C7 and the I / O port are connected to each other. Connected for data communication.

The IC chip 3 further has a non-contact interface unit 30i, and the antenna coil 11 serves as a transmitting / receiving antenna. A signal received by the antenna coil 11 is taken into the IC chip 3 from the antenna coil connection terminal plates 31 and 32 of the IC chip 3, demodulated, and converted into data. In the case of transmission, the data is converted and modulated and transmitted.
The antenna coil connection terminal plates 31 and 32 are terminals for connecting the end of the antenna coil 11 in the card base and the IC module.
The electric power received by the antenna coil 11 and rectified by the IC chip 3 is supplied to the red light emitting portion 6R of the organic EL element 6.

The paper battery 4 is a secondary battery that satisfies the ISO standard. In addition to charging the power from the solar panel 2 via the charging circuit 7, the paper battery 4 is also charged when a voltage higher than a predetermined voltage is detected from the terminal device during contact communication.
The power of the paper battery 4 is supplied to the IC chip 3 through the C4 terminal. The IC card has a voltage detection selector 9. When a voltage higher than a predetermined voltage is detected, the Vcc terminal is connected to the contact terminal C1, and Vcc is supplied to the IC chip through the contact terminal C1.
When the voltage cannot be detected or the detected voltage is less than the predetermined voltage, the Vcc terminal is connected to the paper battery 4 side, and Vcc is supplied from the paper battery 4 to the IC chip. The power of the paper battery 4 is also supplied to the blue light emitting part 6B of the organic EL element 6.

Next, the manufacturing method of the transparent IC card with a light emitting element is demonstrated. Various manufacturing methods can be adopted for such an IC card. As an example, an example of manufacturing a contact / non-contact type IC card using a two-layer core sheet will be described.
First, the transparent core sheet 102 or the oversheets 103 and 104 is coated with ink containing an infrared absorbent by silk screen printing (see FIG. 2). The infrared absorber-containing ink may be applied only to the transparent oversheet, but it is preferably applied to the core sheet 102 from the viewpoint of durability. Since the core sheet 101 forms the antenna coil 11 and the like, coating is difficult.
Inks containing infrared absorbers can be coated with a mixture of two types of infrared absorbers, for example, a mixture of ink A and ink B, but ink A and ink B can be applied independently to different substrates. You may work.

Therefore, the ink A may be applied to the surface of the oversheet 104 on the non-light-receiving surface side of the solar panel, and the ink B may be applied to the surface of the core sheet 102. It will not be affected.
In addition, a mixed ink of ink A and ink B may be applied to the surface of the core sheet 102, and in this case, the solar panel 2 is not affected by the ink containing the infrared absorbent.
Alternatively, the ink A or the ink B may be applied to the surface of the oversheet 103 on the light receiving surface side of the solar panel 2 and another ink may be applied to the core sheet surface. In this case, although influenced by one infrared absorber, the influence can be reduced.

Next, the antenna sheet is prepared. For this, a transparent base material laminated with an aluminum foil or a copper foil is used as the transparent core sheet 101, an antenna pattern or a wiring pattern is formed on the surface of the metal foil by a printing resist or a photoresist, and then the antenna is formed by photoetching means. A wiring pattern necessary for connecting the coil 11 to the solar panel 2 or the battery 4 is left on the core sheet 101 surface. In addition, both connection end portions of the antenna coil are formed so as to face the IC module mounting recess 20 of the core sheet 101. As means other than photo-etching, printing with conductive ink, a method of welding a resin-coated copper wire while melting the coating resin on the card base surface, and the like are well known.
In the transparent core sheet 101, a portion for housing the organic EL element 6, the solar panel 2, and the paper battery 4 is punched out. The organic EL element 6, the solar panel 2, and the paper battery 4 are fitted into the punched space, and necessary connection wiring is performed.

For example, the circuit wiring can be as shown in FIG. 6. In this case, when the antenna coil 11 obtains sufficient power from an external device and performs communication, the red light emitting unit 6 </ b> R of the organic EL element 6 is connected. Can emit light. On the other hand, when the paper battery 4 stores sufficient power, the blue light emitting portion 6B of the organic EL element 6 can emit light. With such circuit wiring, the operation status of the IC card can be known.
Of course, it is not limited to such a circuit configuration, and the full color display of the organic EL element 6 may be performed by any power source. In general, in the case of non-contact communication, since it is a short-time communication, it is difficult to obtain sufficient power continuously.

The laminated body of the core sheets 101 and 102 and the oversheets 103 and 104 is hot-pressed to form an integrated card base 10. At this time, when the card base material is self-adhesive, it is adhered by hot press, but when it is not self-adhesive, such as polyethylene terephthalate (PET), an adhesive is used in combination.
It is preferable to use an appropriate transparent adhesive or filler in combination so that the organic EL element 6, the solar panel 2, and the paper battery 4 are not fitted to the card surface. It is also necessary to consider the heat fusibility of the ink containing the infrared absorber.
In the case where the organic EL element 6 can have a thickness equal to or less than the thickness of the core sheet 101, a thickness adjusting sheet is used.

  The IC module 5 is mounted after forming the recess 20 for mounting the IC module. At that time, both end portions of the antenna coil 11 are connected to the non-contact interface portion of the IC chip 3 via antenna coil connection terminal plates (not shown) 31 and 32 of the IC module 5. The IC module 5 is mounted, and the transparent IC card 1 with a light emitting element is completed.

[Embodiments related to materials]
(About card base)
As materials for the transparent core sheet and transparent oversheet, polyvinyl chloride, PET sheet, PET-G (copolyester resin in which a part of ethylene glycol component in polyethylene terephthalate is substituted with cyclohexanedimethanol), acrylonitrile-butadiene- Highly transparent resins such as styrene copolymer resin (ABS), polypropylene, and triacetate can be used.
The thickness of the transparent core sheet is about 0.20 to 0.30 mm. However, since the organic EL element 6, the solar panel 2, and the paper battery 4 are fitted into the core sheet 101, those corresponding to the thickness thereof are used. In order to set the entire thickness of the transparent IC card 1 with the light emitting element to about 0.76 to 0.80 mm defined by ISO, the thickness is adjusted according to the thickness of the oversheet to be used.

(Ink with infrared absorber)
As described above, phthalocyanine compounds, anthraquinone compounds, polymethine compounds, cyanine compounds, aminium compounds, diimonium compounds and the like are known as infrared absorbers. Of these, it is naturally preferable to use an infrared absorbent ink having a high visible part transmittance and a high absorption effect in the near infrared part, but the following can be used.

Here, specific contents of the ink A and the ink B will be described with reference to FIG.
FIG. 7 shows the spectral transmittance curves A and B of the ink A and the ink B and the spectral transmittance curve M of the mixed ink M. Both are converted into ink for silk screen printing under the same conditions as in the examples described below, and after printing on the core sheet, the core sheet and the oversheet are integrated by hot pressing to form a transparent card. It is a measurement at. The measurement is with a spectrophotometer. It may be considered that there is no absorption by the transparent card substrate itself.

Ink A is an ink for silk screen printing by adding 3.0% (mass ratio) of an infrared absorber “YKR-5010” (phthalocyanine compound) manufactured by Yamamoto Kasei Co., Ltd. to a vinyl resin and a solvent. It has become. In FIG. 7, the maximum absorption wavelength region of ink A is recognized in the range of 800 nm to 900 nm.
Ink B is an ink for silk screen printing by adding 10.0% (mass ratio) of an infrared absorber “YKR-3080” (phthalocyanine compound) manufactured by Yamamoto Kasei Co., Ltd. to a vinyl resin and a solvent. It has become. The maximum absorption wavelength region of ink B is found in the range of 1000 nm to 1050 nm.
The maximum absorption wavelength region of the mixed ink M is observed in the range of 800 nm to 900 nm.

It can be seen that ink A, ink B, and mixed ink M all show considerably high transmittance in the visible light wavelength region of 500 to 650 nm. Moreover, it is recognized that the transmittance | permeability has fallen in any ink in the near infrared region of 800 nm-1000 nm.
It has been confirmed that such an ink containing an infrared absorbent may print ink A and ink B on different substrate surfaces, respectively, and can obtain almost the same effect even when mixed and used. Of course, the same result can be obtained by mixing two infrared absorbers into ink.

  Binders (resins) for converting infrared absorbers into silk screen printing inks include vinyl chloride / vinyl acetate copolymers, vinyl chloride / vinyl acetate / vinyl alcohol copolymers, and vinyl chloride / vinyl acetate / maleic. Various resins such as an acid copolymer, a fiber-based resin, an acrylic resin, a vinyl chloride / acrylate copolymer, and a bisphenol A type epoxy resin can be used. In the case where the card base is integrated by self-fusion, it is necessary to consider the heat-fusibility of the ink containing the infrared absorber.

(About solar panels)
The solar panel 2 is commercially available, and an electromotive force of about 1.5 v to 5 v and 3 μA can be obtained, and power suitable for the driving voltage-current of an LSI used for a card or a calculator can be obtained. The solar panel 2 mainly supplies a voltage to the electrodes of the organic EL element 6, but can also be used to drive the IC chip 3 as described above.
Since the transparent IC card with a light emitting element is usually used outdoors or in a brightly illuminated store, a sufficient electromotive force can be generated by the illumination light. Commercially available products include “Amorton AL-1406” (37.0 × 17.0 × 0.2 mm thickness) manufactured by Sanyo Electric Co., Ltd.

(About paper battery)
The paper battery 4 is a secondary battery that can satisfy the ISO standard. In the battery that is currently put into practical use, for example, an amorphous V ₂ O ₅ gel thin film as a positive electrode active material and a highly ionic conductive polyphosphazene as an electrolyte. An ultra-thin secondary battery having a thickness of 0.1 mm using a thin film, a flexible ultra-thin lithium secondary battery having a thickness of 0.2 mm, and the like can be used.

(Preparation of printing ink A with infrared absorber)
As an infrared absorber A, a phthalocyanine compound “YKR-5010” manufactured by Yamamoto Kasei Co., Ltd. is used, and mixed with a vinyl chloride-based medium together with a solvent composed of cyclohexanone and an aromatic hydrocarbon, stirred, and silk screen printed. It was converted into ink.
In the state of the screen ink, the proportion of the infrared absorber A was 3.0% by mass.

(Preparation of printing ink B with infrared absorber)
As the infrared absorber B, a phthalocyanine compound “YKR-5010” manufactured by Yamamoto Kasei Co., Ltd. is used, mixed with a vinyl chloride-based medium together with a solvent composed of cyclohexanone and aromatic hydrocarbon, stirred, and silk screen printed. It was converted into ink.
In the state of the screen ink, the ratio of the infrared absorber B was 10.0% by mass.

(Preparation of base material)
A transparent hard vinyl chloride sheet having a thickness of 0.22 mm obtained by laminating a 30 μm copper foil was used as the core sheet 101, and a transparent hard vinyl chloride sheet having a thickness of 0.22 mm was used as the core sheet 102. As the oversheets 103 and 104, two transparent vinyl chloride sheets having a thickness of 0.18 mm were used. The oversheet 103 has already been magnetically bonded with a magnetic tape.

(Printing of printing ink with infrared absorber on core sheet)
On the surface of the core sheet 102 on the side in contact with the oversheet 104, the ink A and the ink B, which were prepared previously, were printed with silk screen printing. The thickness of the infrared shielding ink layer after drying was 15 μm.

(Preparation of antenna sheet)
The antenna coil 11 and necessary wiring were formed on the core sheet 101 by photoetching. Both connection ends of the antenna coil 11 face the position where the IC module 5 is mounted. A space for accommodating the organic EL element 6, the solar panel 2, and the paper battery 4 is formed by punching in a rectangular ring formed by the antenna coil 11, and the solar panel 2 having a thickness of 200 μm and a thickness are formed in the space. A 200 μm paper battery 4 was placed and necessary electrical wiring was performed. The organic EL element 6 was used having a thickness of 170 μm adhered to a vinyl chloride sheet having a thickness of 30 μm.

(Card, IC module installed)
After the oversheets 103 and 104 were aligned with the core sheets 101 and 102, the whole sheet was sandwiched between mirror plates made of chrome-plated steel plates and hot-pressed to form a multi-sided integrated card base.
After punching into individual card sizes, the IC module mounting recess 20 was counterbored from the surface of the IC card by an end mill. A first recess for suspending the printed circuit board portion of the IC module 5 and a second recess for housing the resin mold portion in the center thereof were excavated. The conductive recesses reaching the both connection end portions of the antenna coil 11 from the first concave surface are excavated, and the conductive recesses are filled into the conductive recesses, so that the antenna coil connection terminal plates 31 and 32 of the IC module 5 are filled. The contact / non-contact type IC module 5 was mounted so as to be connected.

The transparent IC card 1 with a light emitting element was completed by the above.
In the transparent IC card 1, the red organic EL element 6R is lit during non-contact communication, and the blue organic EL element 6B is lit when the paper battery 4 is charged. It was a fun way to use.
Moreover, the organic EL element 6 was lit in the base material of the transparent IC card, and the IC card with a fashionable feeling could be obtained.

In the embodiment of the present invention, a card having a configuration of a two-layer core sheet and a two-layer oversheet is illustrated, but an appropriate transparent spacer sheet substrate can be used in combination between layers, and an infrared ray is applied to the substrate. An ink containing an absorbent may be applied. Therefore, the base material structure of the card is not limited to that of the example.
In the present invention, a predetermined transmission density in the near-infrared region is obtained by coating the base material with ink containing an infrared absorber, but the same applies even if a similar infrared absorber is kneaded into the base material. The above effect is obtained only by a person skilled in the art from the present invention.

It is a top view which shows the example of the transparent IC card with a light emitting element by this invention. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. It is a top view which shows the other example of the transparent IC card with the said light emitting element. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. It is a schematic block diagram which shows the power supply system of an organic EL element. It is a block diagram which shows the electric circuit of the transparent IC card with a light emitting element. It is a graph which shows the spectral transmittance curve of the card | curd base | substrate which applied the ink with an infrared absorber. It is explanatory drawing explaining an example of an organic EL element.

Explanation of symbols

1 Transparent IC card with light emitting element 2 Solar panel 3,30 IC chip, IC
DESCRIPTION OF SYMBOLS 4 Paper battery 5 IC module 6 Organic EL element 7 Charging circuit 8 Contact terminal board 10 Card base 11 Antenna coil, coil 20 IC module mounting recessed part 30i Non-contact interface part 31, 32 Antenna coil connection terminal board 100 Non-contact IC card 101 Core sheet, antenna sheet 102 Core sheet 103, 104 Oversheet 120 Rectifier circuit 130 Constant voltage circuit 160 Booster circuit

Claims (11)

A transparent card in which a wallet-sized card has a structure in which a transparent base material is laminated, and an ink containing an infrared absorbent is applied to the base material so as to satisfy a predetermined light transmission density in an area defined by JISX6301. A transparent IC card with a light-emitting element, comprising an organic electroluminescence element in a transparent substrate of the card. A transparent card in which a wallet-sized card has a structure in which a transparent base material is laminated, and an ink containing an infrared absorbent is applied to the base material so as to satisfy a predetermined light transmission density in an area defined by JISX6301. A transparent IC card with a light-emitting element, comprising an organic electroluminescence element and a solar panel for power generation in the transparent base of the card. The transparent IC card with a light emitting element according to claim 1, further comprising a paper battery. The light emission according to claim 1 or 2, wherein one infrared absorbing ink is applied to the oversheet surface, and another infrared absorbing ink is applied to the core sheet surface. Transparent IC card with elements. 3. A transparent IC card with a light-emitting element according to claim 1, wherein a mixed ink of one infrared absorbent ink and another infrared absorbent ink is coated on the core sheet surface. . The transparent IC card with a light emitting element according to claim 1 or 2, wherein the IC card is a contact type IC card. The transparent IC card with a light emitting element according to claim 1 or 2, wherein the IC card is a non-contact type IC card. 3. The transparent IC card with a light emitting element according to claim 1, wherein the IC card is a contact / non-contact type IC card. 2. The transparent IC card with a light-emitting element according to claim 1, wherein the organic electroluminescence element is provided on the antenna sheet. 3. The transparent IC card with a light emitting element according to claim 2, wherein the organic electroluminescence element and the solar panel for power generation are provided on the antenna sheet. 3. The transparent IC card with a light-emitting element according to claim 1, wherein the organic electroluminescence element displays an operation status of the IC card.

Images