JP2005311344A - Semiconductor element mounting method and semiconductor element mounting body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to efficiently arrange functional chips at the arrangement positions of a plurality of functional chips on a mounting substrate in a mounting method using self-alignment in a liquid.
A mounting substrate having a plurality of recess portions 104 formed on a main surface and corresponding to a plurality of functional chips 103, and placed on the mounting substrate 102 to expose each recess portion 104. In addition, a flat plate 101 having a plurality of confinement regions 101a each having an opening for confining each functional chip 103 is prepared. Subsequently, each functional chip 103 is put into each confinement region 101 a on the mounting substrate 102, and then the mounting substrate 102 having the functional chip 103 is immersed in a liquid together with the flat plate 101. By applying vibration to the flat plate 101 immersed in the liquid, each functional chip 103 can be quickly fitted into the recessed portion 104 of the mounting substrate 102.
[Selection] Figure 2

Description

  The present invention relates to a semiconductor element mounting method and a semiconductor element mounting body using a mounting method in which a fine and a plurality of functional chips, such as semiconductor elements, are collectively mounted on a mounting substrate.

  2. Description of the Related Art In recent years, when a semiconductor element is manufactured, a technique for mounting minute functional chips such as electronic components on a mounting substrate such as a wafer or a substrate at the same time has attracted a great deal of attention. At present, mounting by normal mass production employs a method in which an assembly robot holds a functional chip and places it at a predetermined position. However, since the assembly robot has limitations on its cost and processing speed, it has become necessary to search for other means capable of mounting a large number of functional chips more quickly and at a lower cost.

  Recently, a fluid self assembly (FSA) method, which is a technique for mounting a plurality of functional chips on a mounting substrate in a liquid in a self-aligned manner, has been proposed as one of the techniques for achieving this object. Hereinafter, the conventional FSA method will be described with reference to FIGS.

  FIG. 7 schematically shows a semiconductor element mounting body 300A using the FSA method according to the first conventional example. As shown in FIG. 7, a mounting substrate 410 made of a wafer or a printed circuit board and provided with a plurality of recess portions 410a for regulating the mounting position on the surface thereof is held in the liquid with its surface tilted from the liquid surface. The Subsequently, a slurry-like liquid 311 in which a large number of functional chips 400 are dispersed is poured onto the surface of the mounting substrate 410 through the pipette 310. Here, the shape of the functional chip 400 is usually a square shape, a disk shape, or a spherical shape. A large number of functional chips 400 contained in the liquid 311 poured on the surface of the mounting substrate 410 are accidentally and naturally fitted into an empty recess portion 410a having the same shape while sliding on the surface of the mounting substrate 410. Include.

  FIG. 8 schematically shows a semiconductor element mounting body 300B with a bubble pump according to a second conventional example. As shown in FIG. 8, the semiconductor element mounting body 300 </ b> B with a bubble pump includes a container 312 that stores a liquid 311 and a mounting substrate 410, and a bubble pump system 313 that circulates the functional chip 400.

The bubble pump system 313 conveys the functional chip 400 that has not been fitted into the recess portion of the mounting substrate 410 to a position higher than the mounting substrate 410 by the buoyancy of the bubbles 311a. The conveyed functional chip 400 is poured again on the surface of the mounting substrate 410. The bubble 311 a is generated from the nitrogen gas 314 supplied to the bubble pump system 313 by a bubble speed controller 313 a provided at the lower part of the bubble pump system 313.
US Pat. No. 5,904,545

  However, in the conventional semiconductor element mounting body, the probability that the functional chip fits into each recess portion of the mounting substrate depends on the density of each recess. Therefore, in order to obtain high mounting efficiency, it is necessary to prepare a huge number of functional chips as compared with the density of each recess. On the other hand, in the bubble pump shown in FIG. 8, since the functional chips that are not fitted in the recesses can be reused, the number of necessary functional chips can be reduced. However, even if these semiconductor element mounting bodies are used, the mounting efficiency is limited, and for example, there is a problem that the mounting efficiency depends on the shape of the semiconductor element. For example, it has been reported that when a disk-shaped functional chip having a certain thickness and size is changed to a planar square shape, the mounting efficiency is reduced from 90% to 40%. This indicates that the mounting efficiency of the functional chip having a shape with fewer symmetry axes is further reduced. Therefore, for example, when a planar square functional chip is changed to a planar rectangle, the square end is symmetrical in four directions, whereas the rectangle is only symmetric in two directions. It is thought to decrease to about half. In addition, when these planar rectangular functional chips are given directionality to the chip itself like a semiconductor laser, the mounting efficiency is further reduced by half, and the mounting efficiency must not exceed 10%. Conceivable. Usually, since the mounting efficiency of a functional chip needs to exceed 99% (at least 90%), a functional chip mounting method that can be mounted with high mounting efficiency is required regardless of the size and shape of the functional chip.

  The present invention solves the above-described conventional problems, and in a liquid, a plurality of functional chips are provided in a recess portion provided on a mounting substrate and having the same size as the functional chip in a liquid, regardless of the size and shape. The purpose is to enable efficient and quick implementation.

  In order to achieve the above-mentioned object, the present invention does not randomly pour a liquid in which a plurality of functional chips are dispersed onto a mounting substrate provided with a large number of recesses, but rather than the recesses on the mounting substrate. By enclosing each functional chip for each area that is larger and smaller than the limit specified by the size of the functional chip, the desired number of functional chips, that is, the number of functional chips that are desired to be mounted on the mounting substrate, regardless of their size and shape. It is possible to achieve a mounting efficiency of almost 100% simply by preparing the above.

  Specifically, a first semiconductor element mounting method according to the present invention includes a mounting substrate formed on a main surface and having a plurality of recess portions each corresponding to a plurality of functional chips and a planar shape, and the mounting A step (a) of preparing a flat plate having a plurality of confinement regions each having an opening for confining each functional chip while being exposed on each substrate and exposing each recess and its peripheral part; The step (b) of putting each functional chip into each confinement region on the substrate, the step (c) of immersing the mounting substrate having the functional chip in the liquid together with the flat plate, and the liquid in a state where the mounting substrate is fixed A step (d) of fitting a plurality of functional chips into the recesses of the mounting substrate by applying displacement to the flat plate immersed in the substrate.

  According to the first semiconductor element mounting method, the recesses and their peripheral portions are exposed and the functional chips are confined on the mounting substrate having a plurality of recess portions whose planar shapes correspond to the functional chips. A flat plate having a plurality of confining regions is placed, and each functional chip is placed in each confining region, and then a plurality of displacements are applied to the flat plate while being immersed in liquid. Fit the functional chip into the recess of the mounting board. As a result, regardless of the size and shape of multiple functional chips, high efficiency, high reliability, and quick mounting are achieved using fluid flow and gravity in the recesses provided on the mounting board and corresponding to the functional chips. It becomes possible to do.

  A second semiconductor element mounting method according to the present invention includes a mounting substrate formed on a main surface, each having a plurality of recesses corresponding to a plurality of functional chips each including a semiconductor element and a planar shape, and the mounting A step (a) of preparing a flat plate having a plurality of confinement regions each having an opening for confining each functional chip while being exposed on each substrate and exposing each recess and its peripheral part; The step (b) of putting each functional chip into each confinement region on the substrate, the step (c) of immersing the mounting substrate having the functional chip in the liquid together with the flat plate, and the liquid in the state where the flat plate is fixed. And a step (d) of fitting a plurality of functional chips into the recesses of the mounting substrate by applying displacement to the immersed mounting substrate.

  According to the second semiconductor element mounting method, the recesses and their peripheral portions are exposed and the functional chips are confined on the mounting substrate having a plurality of recess portions whose planar shapes correspond to the functional chips. By placing a flat plate having a plurality of confinement regions and placing each functional chip in each confinement region and then displacing the mounting substrate in a state immersed in liquid, a plurality of Is inserted into the recess of the mounting board. As a result, regardless of the size and shape of multiple functional chips, high efficiency, high reliability, and quick mounting are achieved using fluid flow and gravity in the recesses provided on the mounting board and corresponding to the functional chips. It becomes possible to do.

  A third semiconductor element mounting method according to the present invention includes a plurality of recess portions formed on a main surface, each having a plurality of functional chips each including a semiconductor element and corresponding to a planar shape, and in the vicinity of each recess portion. A mounting substrate having a minute groove having a smaller planar dimension than the recessed portion, a minute pin that is movably provided inside the minute groove on the mounting substrate, and placed on the mounting substrate. And (a) preparing a flat plate having a plurality of confinement regions each having an opening for confining each functional chip while exposing each minute groove, and each functional chip in each confinement region on the mounting substrate. A step (b) of charging, a step (c) of immersing the mounting substrate having the functional chip in the liquid together with the flat plate and the micro pins, and a fine submerged in the liquid while the mounting substrate and the flat plate are fixed. By providing a displacement relative to the pin, characterized in that it comprises a step (d) of fitting a plurality of functional chips in the recessed portion of the mounting substrate.

  According to the third semiconductor element mounting method, the top surface of the mounting substrate having a plurality of recess portions corresponding to the functional chip and a minute groove formed in the vicinity of each recess portion and having a smaller planar dimension than the recess portion. In addition, a flat plate having a plurality of confinement regions each having an opening that confines each functional chip and exposing each recess and each minute groove is placed, and after each functional chip is put into each confinement region, By displacing the micro pins while being immersed in the liquid, the plurality of functional chips are fitted into the recess portions of the mounting substrate. As a result, regardless of the size and shape of a plurality of functional chips, high-efficiency, high-reliability, and quick mounting using a fluid flow and gravity in a recess portion provided on the mounting substrate and corresponding to the functional chip. It becomes possible.

  In the mounting method of the first semiconductor element, in step (d), the limit of displacement given to the flat plate is that the unmounted functional chip that is not fitted in the recess portion moves to the recess portion, and A range that does not come into contact with the mounted functional chip is preferable.

  In the first semiconductor element mounting method, in step (d), the direction of displacement applied to the flat plate is parallel to the substrate surface and perpendicular to the edge of the functional chip or the peripheral edge of the recess. It is preferable.

  In the mounting method of the second semiconductor element, in step (d), the limit of displacement given to the mounting substrate is that an unmounted functional chip that is not fitted in the recessed portion moves to the recessed portion, and the recessed portion It is preferable that it is in a range that does not come into contact with the mounted functional chip fitted in.

  In the second semiconductor element mounting method, in the step (d), the direction of displacement applied to the mounting substrate is parallel to the substrate surface and perpendicular to the edge of the functional chip or the peripheral edge of the recess. Preferably there is.

  In the third semiconductor element mounting method, in step (d), the limit of displacement given to the micro pin is that the unmounted functional chip that is not fitted in the recess portion moves to the recess portion, and A range that does not come into contact with the mounted functional chip is preferable.

  Further, in the third semiconductor element mounting method, the minute groove in the mounting substrate has a direction in which the minute pin is displaced in the step (d) parallel to the substrate surface and at the edge of the functional chip or the peripheral edge of the recess. It is preferably formed so as to be perpendicular to the surface.

  In the first or second semiconductor element mounting method, when each functional chip has high symmetry in its planar shape and no directionality, the planar shape of each confinement region is the plane of the functional chip or the recess portion. It is preferable that the shape is similar to the shape.

  Further, in the first or second semiconductor element mounting method, when each functional chip has low symmetry in its planar shape, the size of each confinement region does not rotate by 90 ° or more within each confinement region. It is preferable to set the value.

  In the method for mounting the first to third semiconductor elements, in the step (c), it is preferable to immerse the mounting substrate and the flat plate in a liquid with the flat plate covered with a lid.

  The first to third semiconductor element mounting methods include a step (e) of providing a solder material on the bottom surface of each recess portion of the mounting substrate or the bottom surface of each functional chip prior to the step (b). And after the step (d), after removing the liquid from the mounting substrate, the mounting substrate is heated to further fix the mounting substrate and the plurality of functional chips, respectively (f). It is preferable.

  In this case, in the step (f), it is preferable to heat the plurality of functional chips while pressing them from above.

  According to a fourth semiconductor element mounting method of the present invention, a plurality of functional chips of at least two types, each including a semiconductor element, having different sizes and similar planar shapes, are mounted on a mounting substrate. A mounting substrate having a plurality of recess portions formed on a main surface and corresponding to two types of functional chips and corresponding planar shapes, on a mounting method of a semiconductor element to be mounted, and on the mounting substrate A step (a) of preparing a flat plate having a plurality of confinement regions formed by opening and confining each of the two types of functional chips while exposing each recess portion and its peripheral portion; and a plurality of functional chips Solder material on the bottom surface of one type of functional chip and on the bottom surface of the recess portion corresponding to another type of functional chip among the plurality of recessed portions on the mounting substrate. Each type of functional chip in the confinement region corresponding to each type of functional chip of the plurality of confinement regions on the mounting substrate and including a recess portion provided with a solder material. (C), a step (d) of immersing a mounting substrate having another type of functional chip in a liquid together with a flat plate, and a displacement relative to the mounting substrate or the flat plate immersed in the liquid. The step (e) of fitting another type of functional chip into the corresponding recess portion of the mounting substrate, and the mounting substrate by heating the mounting substrate after removing the liquid from the mounting substrate And (f) fixing each of the other types of functional chips, and among the plurality of confinement regions on the mounting substrate, the confinement region including the recess corresponding to each type of functional chip. A step (g) of introducing each type of functional chip having a solder material provided on the bottom surface thereof; a step (h) of immersing a mounting substrate having the functional chip of one type in a liquid together with a flat plate; The step (i) of fitting one type of functional chip into the corresponding recess portion of the mounting substrate by applying displacement to the mounting substrate or the flat plate immersed in the liquid, and the liquid from the mounting substrate After the removal, the method includes a step (j) of fixing the mounting substrate and each functional chip of one type by heating the mounting substrate.

  According to the fourth method for mounting a semiconductor element, when mounting a plurality of functional chips of at least two types having different sizes and similar planar shapes on a mounting substrate, the step (b) As shown, on the bottom surface of one type of functional chip among the plurality of functional chips, and on the bottom surface of the recessed portion corresponding to the planar shape of the other type functional chip among the plurality of recessed portions in the mounting substrate. After each solder material is provided, in the subsequent step (c), no solder material is provided in the confinement region including the recess portion in which the planar shape corresponds to each type of other functional chip and the solder material is provided. Other types of functional chips are introduced, and thereafter, mounting is performed in the same manner as in the first mounting method of the present invention. Thereafter, in step (g), one type of each functional chip having a solder material on the bottom surface is put into a confinement region including a recess corresponding to each type of functional chip. In this case, for example, even if another functional chip not provided with solder material on the bottom surface is fitted into the recess corresponding to the one functional chip, the recess corresponding to the one functional chip Since no solder material is provided, other functional chips are not fixed to the recesses corresponding to the one functional chip. Therefore, even functional chips having different planar shapes can be selectively and self-alignedly mounted at a predetermined mounting position.

  In the fourth semiconductor element mounting method, in the step (f) or the step (j), it is preferable to heat each functional chip while pressing it from above.

  A first semiconductor element mounting body according to the present invention includes a mounting board having a plurality of recess portions formed on a main surface, each of which has a plurality of recess portions corresponding to a plurality of functional chips each including a semiconductor element, and a planar shape. A flat plate having a plurality of confinement regions each having an opening for confining each functional chip while exposing each recess portion and its peripheral portion. After each functional chip is inserted, the mounting substrate having the inserted functional chip is immersed in a liquid together with the flat plate, and a displacement is given to the flat plate, so that the plural functional chips are fitted into the recesses of the mounting substrate. It is characterized by.

  The second semiconductor element mounting body according to the present invention is formed on the main surface, and is formed in the vicinity of each of the plurality of recess portions corresponding to the plurality of functional chips each including the semiconductor element and the planar shape, and each recess portion. A mounting substrate having a micro-groove having a smaller planar dimension than the recess, a micro-pin that is movably provided inside the micro-groove on the mounting substrate, and mounted on the mounting substrate. And a planar plate having a plurality of confinement regions each having an opening for confining each functional chip and exposing each minute chip, and after each functional chip is introduced into each confinement region on the mounting substrate, the function introduced A mounting substrate having a chip is immersed in a liquid together with a flat plate and micro pins, and a displacement is applied to the micro pins, so that a plurality of functional chips are fitted into the recesses of the mounting substrate. And wherein the door.

  According to the semiconductor element mounting method and the semiconductor element mounting body according to the present invention, the main surface of the mounting substrate is covered with a flat plate having openings corresponding to the plurality of recess portions, and the openings of the flat plate are guided. After the functional chip is inserted into the confinement region, the plane plate, the mounting substrate or the micro pin is displaced in the liquid, and the fluid flow and gravity are applied to the recess portion provided on the mounting substrate and corresponding to the functional chip. By using it, it becomes possible to mount a plurality of functional chips with high efficiency, high reliability and promptness regardless of their size and shape.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings.

  1A and 1B show a semiconductor element mounting body according to the first embodiment of the present invention, in which FIG. 1A shows a planar configuration of a grid-like plane plate, and FIG. The plane structure of the container which accommodates the liquid which immerses the board | substrate for water is shown.

  As shown in FIG. 1A, the flat plate 101 is made of nickel (Ni) or a nickel alloy having a thickness of about 150 nm, for example, and has a plurality of openings 101a arranged in a matrix. FIG. 1B shows a container 200 in which a mounting substrate (not shown) in a state where the flat plate 101 is held on the main surface is immersed in the liquid 115 together with the functional chip.

  As shown in FIG. 2A and an enlarged view of FIG. 2B, first, the mounting substrate 102 is put into the container 200, and then the flat plate 101 is placed on the mounting substrate 102. To do. Here, the depth of the container 200 is substantially equal to the thickness of the mounting substrate 102, and the inner method of the container 200 is that the flat plate 101 is movable in the horizontal direction only within a predetermined range. It is set to be.

  Each opening 101a formed in the flat plate 101 surrounds a region including each recess 104 and its peripheral portion in the mounting substrate 102 having a plurality of recesses 104 having a planar rectangular shape, thereby at least one functional chip. 103 can be confined. Here, the planar shape of each recess 104 is the same shape as the bottom surface of the functional chip 103, and is set to a size such that the lower part of the functional chip 103 fits. Further, the flat plate 101 is perpendicular to each side of the opening 104 (hereinafter referred to as a confinement region) 101 a in the flat plate 101 with respect to the mounting substrate 102. Arrange them so that they are parallel. In FIG. 2B, an area 102a shown on the mounting substrate 102 is obtained by dividing the mounting substrate 102 into individual pieces for each functional chip 103 after the functional chip 103 is mounted on the recess 104. A submount area to be divided as a submount is shown. The mounting substrate 102 may be a wafer made of, for example, silicon (Si) or silicon carbide (SiC), or may be a printed circuit board or the like.

  Subsequently, for example, the plurality of functional chips 103 are dropped with their orientations aligned if necessary for each row or column of the plurality of confinement regions 101a of the flat plate 101. Here, the thickness of each functional chip 103 is about 135 μm, and at this time, half the length of the chip so that the functional chip 103 does not lie down and the direction of the functional chip 103 is reversed. It is good to drop from the following height. After dropping the functional chips 103 into all the rows or columns of the confinement region 101a, the liquid 115 is poured into the container 200.

  Subsequently, the flat plate 101 or the mounting substrate 102 having the functional chip 103 in each confinement region 101 a is displaced by vibration in a direction perpendicular or parallel to the edge (edge) of the recess 104. Due to the displacement, the functional chip 103 in an unmounted state that is confined in the confinement region 101a and not in the recess 104 is fitted in the recess 104 at the same time and in a self-aligning manner. The displacement applied to the flat plate 101 or the mounting substrate 102 enables self-aligned and highly accurate mounting in the fluid, while preventing the functional structure 103 from affecting the device structure as much as possible. be able to. However, the functional chip 103 mounted on the recess 104 is not hindered by the movement (displacement) of the flat plate 101 and the mounting substrate 102.

  Until all the functional chips 103 are fitted in the recesses 104, vibration is applied in several times to obtain the state shown in FIG. 3A and the enlarged view of FIG. 3B. Here, the flat plate 101 is held by the mounting substrate 102, but the present invention is not limited to this, and the mounting substrate 102 may be fixed and vibration may be applied to the flat plate 101. May be fixed and applied to the mounting substrate 102. Further, when vibration is applied to the flat plate 101 or the like, each functional chip 103 is made of glass or plastic so that each functional chip 103 does not jump out of the confinement region 101a and each functional chip 103 does not fall within the confinement region 101a. A transparent plate provided with a plurality of minute holes may be provided on the flat plate 101. When a transparent plate is used, the thickness of the flat plate 101 is made larger than that of the functional chip 103.

  Here, the confinement region 101a has such an area and shape that the functional chip 103 does not rotate more than 90 ° within the confinement region 101a when the directionality is important, such as a semiconductor laser. When the functional chip 103 has directionality, the functional chip 103 is confined in the confined region 101a in a predetermined direction. The directionality of the semiconductor laser can be confirmed, for example, by drawing a graphic pattern such as a circle on the end of the bottom surface of each semiconductor laser. As an example, all the functional chips 103 are allowed to pass through a restricted area made up of passive guides (passive tracks) provided in a parts feeder or the like, and the functional chips 103 that have passed in the reverse direction are confirmed based on a graphic pattern indicating directionality. In such a case, the function chip 103 is excluded.

  On the other hand, when the planar shape of the functional chip 103 is not rectangular like a semiconductor laser but has a high-order symmetry such as a planar square shape or a circular shape, the area of the confinement region 101a is not limited. In general, the planar shape of the functional chip only needs to match the planar shape of the recess. Therefore, the movement (displacement) to the recess portion having the same size as that of the functional chip having high symmetry is performed by the movement (displacement) of the flat plate 101 and the mounting substrate 102 itself.

  Next, a solder material is previously provided by plating or the like on the bottom surface of each functional chip 103 or the bottom surface of each recess 104 in the mounting substrate 102, and the mounting substrate 102 on which the functional chip 103 is disposed is removed from the container 200. After being taken out, the mounting substrate 102 is heated to weld the mounting substrate 102 and each functional chip 103 with a solder material. Thereafter, the mounting substrate 102 is separated for each submount formation region 102a, and a predetermined wiring is applied to obtain a semiconductor element.

(One modification of the first embodiment)
4 (a) and 4 (b) show a modification of the first embodiment of the present invention. As shown in FIG. 4A, two recess portions 104A and 104B are formed in one submount formation region 102a in the mounting substrate 102. The first recess 104A corresponds to the first functional chip 103A, and the second recess 104B corresponds to the second functional chip 103B having a larger planar size than the first functional chip 103A. Therefore, in this modification, the flat plate 101 is disposed on the mounting substrate 102 so that each confinement region includes a pair of recess portions 104A and 104B.

  Next, as shown in FIG. 4B, the flat plate 101 or the mounting substrate 102 is vibrated in a direction parallel to or perpendicular to the long sides or short sides of the functional chips 103A and 103B. Then, each of the functional chips 103A and 103B is fitted into the corresponding recesses 104A and 104B.

  As an example of mounting two types of functional chips in one submount formation region 102a, for example, it is mounted on an optical pickup that can handle both a compact disc (Compact Disc: CD) and a digital versatile disc (Digital Versatile Disc: DVD). Hybrid type two-wavelength laser.

  Here, as in this modification, as a procedure for fixing a pair of functional chips 103A and 103B having different planar shapes to one confinement region 101a with a solder material or the like, there are the following methods. First, a solder material is plated only on the bottom surface of the first recess 104A having a small area among the recesses 104A and 104B of the pair of mounting substrates 102. On the other hand, the solder material is plated only on the bottom surface (lower surface) of the second functional chip 103B having a large bottom area among the pair of functional chips 103A and 103B. Next, the first functional chip 103A is confined in each confinement region 101a, and then the first functional chip 103A is fitted in the first recess 104A by applying vibration. Thereafter, heat treatment is performed to fix the first functional chip 103A in the first recess 104A with a solder material plated on the bottom surface of the first recess 104A. Here, since the solder material is not plated on the bottom surface of the first functional chip 103A and the bottom surface of the second recess portion 104B, the first functional chip 103A fits into the second recess portion 104B. Even if this is the case, the first functional chip 103A is not fixed in the second recess 104B. Next, the second functional chip 103B plated with the solder material on the bottom surface (lower surface) is confined in each confinement region 101a, and then the second functional chip 103B is applied to the second recess 104B by applying vibration. Fit. Thereafter, heat treatment is performed to fix the second functional chip 103B in the second recess 104B with a solder material plated on the bottom surface of the second functional chip 103B.

  Here, when the upper surfaces of the first functional chip 103A and the second functional chip 103B are lightly pressed during the heat treatment for welding the solder material, the functional chips 103A and 103B can be securely fixed to the mounting substrate 102. .

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

  FIG. 5 shows a semiconductor element mounting body according to the second embodiment of the present invention together with a partially enlarged view.

  As illustrated in FIG. 5, the manufacturing apparatus 100 includes a planar rectangular mount 110 that holds a mounting substrate 102 made of silicon (Si) or silicon carbide (SiC) and a planar plate 101 placed thereon. The flat plate stopper 111 holds the flat plate 101 at the four corners of the mount 110.

  As a feature of the second embodiment, as shown in the enlarged view of FIG. 5, the confinement region 101 a surrounded by one opening of the flat plate 101 in the mounting substrate 102 has a recess portion 104 having a flat rectangular shape. A plurality of first through-grooves 102b and second through-grooves 102c are formed so as to surround the periphery of each of the first through-grooves 102b and penetrate the mounting substrate 102 in the front-back direction. The first through-groove 102b sandwiches both short sides of the recess 104 from the outside, is spaced from each other in a direction parallel to the short sides of the recess 104, and the long side of the groove is the short side of the recess 104. It is arranged in a direction orthogonal to. The second through-groove 102 c sandwiches both long sides of the recess 104 from the outside, and is arranged in a direction that is spaced from each other and that the long side of the groove is orthogonal to the long side of the recess 104.

  In the first through groove 102b, for example, a first micro pin tool 105A made of silicon in a planar comb shape, for example, can move its teeth perpendicularly to the substrate surface from the upper side or the lower side of each first through groove 102b. It is penetrated and arranged. Similarly, in the second through groove 102c, the second micro pin tool 105B having a planar comb shape can move its teeth perpendicularly to the substrate surface from the upper side or the lower side of each second through groove 102c. It is arranged through.

  When the first micropin tool 105A and the second micropin tool 105B are penetrated from the upper side of the through grooves 102b and 102c, each micropin tool 105A is disposed after the functional chip 103 is arranged in each confinement region 101a. , 105B. Further, when penetrating from below the through grooves 102b and 102c, the micropin tools 105A and 105B are arranged before the functional chip 103 is arranged in each confinement region 101a.

  As described above, in the second embodiment, each functional chip 103 disposed (mounted) in each recess 104 of the mounting substrate 102 is only confined in the confinement region 101 a formed by each opening of the flat plate 101. Instead, the position is further restricted by the micropin tools 105A and 105B movably disposed around the recess 104 in the confinement region 101a.

  Accordingly, when the manufacturing apparatus 100 according to the second embodiment is immersed in a liquid and further subjected to vibration, the teeth of the micropin tools 105A and 105B are brought into contact with the substrate surface by the liquid flowing through the through grooves 102b and 102c. Due to the parallel displacement, the unmounted functional chip 103 confined in the confinement region 101a quickly approaches the predetermined recess 104 due to the displacement of the micropin tools 105A and 105B.

  By the way, when each micropin tool 105A, 105B is formed of silicon, the main surface of the silicon wafer is patterned into a planar comb shape using a lithography method and an etching method, and then the silicon wafer is formed to a required thickness. It can be obtained by cutting out. In addition, the material which comprises each micropin tool 105A, 105B is not restricted to a silicon | silicone, A conductor, a semiconductor, or an insulator will be ask | required if it does not rust.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

  FIG. 6 shows a partial cross-sectional configuration of a semiconductor element mounting body according to the third embodiment of the present invention.

  FIG. 6 shows a method of mounting the functional chip 103 on the mounting substrate 102 using the transparent plate 109. In the manufacturing apparatus (semiconductor element mounting body) 100 according to the third embodiment, the flat plate 101 has such a height that the functional chip 103 is not reversed, and further covers the flat plate 101, for example, transparent made of transparent glass. A plate 109 is provided. In this case, the functional chip 103 confined in the confinement region 101a is inverted or jumped out in the confinement region 101a due to vibration (displacement) applied to the liquid or the mounting substrate 102 in the mounting process. Can be prevented.

  Hereinafter, a semiconductor element mounting method using the manufacturing apparatus according to the third embodiment having the above-described configuration will be described.

  (1) A mounting substrate 102 in which a plurality of recess portions 104 are provided in a matrix on the main surface, and a flat plate 101 in which a plurality of openings are provided at positions corresponding to the recess portions of the mounting substrate 102 Then, the flat plate 101 is placed on the main surface of the prepared mounting substrate 102 so as to expose each recess 104. Thereafter, the functional chip 103 is inserted into each confinement region 101a formed by the opening of the flat plate 101 surrounding each recess 104. Here, on the bottom surface of each functional chip 103, an electrode 112 that fits into the recess 104 is formed.

  (2) The upper surface of the flat plate 101 in which the functional chip 103 is confined is covered with a transparent plate 109 for each confinement region 101a.

(3) The manufacturing apparatus 100 is put into the container 200 shown in FIG. 1B, and then the liquid 115 is slowly poured onto the manufacturing apparatus 100 until the entire manufacturing apparatus 100 is immersed. Here, methyl alcohol (CH ₃ OH) or water (H ₂ O) can be used for the liquid 115.

  (4) Once the transparent plate 109 is opened to remove bubbles accumulated between the transparent plate 109 and the mounting substrate 102 in each confinement region 101a, the transparent plate 109 is attached again. The transparent plate 109 may be a plastic plate in which holes corresponding to the functional chip 103 are provided with holes smaller than the functional chip 103. In this way, air accumulated on the back side of the plastic plate can be released, so that the liquid 115 can be filled in the area in the manufacturing apparatus 100 where the functional chip 103 is held.

  (5) By applying vibration to the liquid 115 or the mounting substrate 102 until the functional chip 103 confined in the confinement region 101a approaches each recess 104 of the mounting substrate 102, each functional chip 103 is made to be recessed. Each is mounted in a self-aligned manner in 104. At this time, the direction is changed to a direction regulated by the mount 110 and the flat plate stopper 111 shown in FIG. Here, as in the second embodiment, the through grooves 102b and 102c and the micropin tools 105A and 105B passing through the through grooves 102b and 102c are provided around the recess portions 104 of the mounting substrate 102. First, each functional chip 103 moves to the mounting position more quickly by the function of the micropin tools 105A and 105B.

  (6) After the mounting of the functional chip 103 on the mounting substrate 102 is completed, the transparent plate 109 is removed from the flat plate 101, and then the liquid 115 is removed from the container 200. Further, the mounting substrate 102 and the functional chip 103 are removed. dry.

  (7) After removing the flat plate 101 from the mounting substrate 102, solder material plated on the bottom surface of the recess 104 or the bottom surface of the electrode 112 of the functional chip 103 is applied to the upper surface of all the functional chips 103. Each functional chip 103 is fixed on the mounting substrate 102 by performing heat treatment while lightly pressing. Subsequently, the mounting substrate 102 is divided into, for example, submount formation regions 102b.

  The functional chip 103 is not limited to a semiconductor laser. That is, the functional chip 103 is a conductor, semiconductor, insulating glass, insulating resin, or dielectric material used for electronic components such as an IC chip, an optical element, a resistance element or a capacitor, or a microelectromechanical system (MEMS). A functional element made of can be used.

  The semiconductor element manufacturing method and semiconductor element mounting body according to the present invention are applicable to semiconductor lasers, MEMS, optical elements, liquid crystal display elements, IC chips, and the like. The present invention is equally useful for functional chips made of conductors, semiconductors, insulators or dielectric materials in technical fields other than those described above.

(A) And (b) shows the semiconductor element mounting body which concerns on the 1st Embodiment of this invention, (a) is a top view which shows a grid | lattice-like plane board, (b) immerses a mounting board | substrate. It is a top view which shows the container which accommodates a liquid. (A) And (b) shows the semiconductor element mounting body which concerns on the 1st Embodiment of this invention, (a) is the state which immersed the board | substrate for mounting and the plane board in the container, Comprising: The state before mounting completion (B) is a partial perspective view. (A) And (b) shows the semiconductor element mounting body which concerns on the 1st Embodiment of this invention, (a) is the state which immersed the board | substrate for mounting and the plane board in the container, Comprising: The state after mounting completion (B) is a partial perspective view. (A) is a partial perspective view which shows the state before the completion of mounting in the semiconductor element mounting body which concerns on the modification of the 1st Embodiment of this invention, (b) is a part which shows the state after the completion of mounting FIG. It is the perspective view which showed the semiconductor element mounting body which concerns on the 2nd Embodiment of this invention with the partial enlarged view. It is a fragmentary sectional view showing the state after the completion of mounting in a semiconductor element mounting object concerning a 3rd embodiment of the present invention. It is a typical perspective view which shows the semiconductor element mounting body which concerns on a 1st prior art example. It is a typical block diagram which shows the semiconductor element mounting body with a bubble pump which concerns on a 2nd prior art example.

Explanation of symbols

100 Manufacturing equipment (semiconductor element mounting body)
101 flat plate 101a opening (confinement region)
102 mounting substrate 102a submount formation region 102b first through groove 102c second through groove 103 functional chip 103A first functional chip 103B second functional chip 104 recess 104A first recess 104B second recess Part 105A First micropin tool 105B Second micropin tool 109 Transparent plate 110 Mount 111 Planar plate stopper 112 Electrode 115 Liquid 200 Container

Claims (18)

A mounting substrate formed on the main surface and having a plurality of recess portions each corresponding to a plurality of functional chips and a planar shape, and mounted on the mounting substrate, each recess portion and its peripheral portion being A step (a) of preparing a flat plate having a plurality of confinement regions that are exposed and each of the functional chips is confined;
A step (b) of injecting each functional chip into each confinement region on the mounting substrate;
A step (c) of immersing a mounting substrate having the functional chip in a liquid together with the planar plate;
(D) a step of fitting the plurality of functional chips into the recess portion of the mounting substrate by applying displacement to the flat plate immersed in the liquid in a state where the mounting substrate is fixed; A method for mounting a semiconductor element, comprising: A mounting substrate formed on the main surface and having a plurality of recess portions each corresponding to a plurality of functional chips and a planar shape, and mounted on the mounting substrate, each recess portion and its peripheral portion being A step (a) of preparing a flat plate having a plurality of confinement regions that are exposed and each of the functional chips is confined;
A step (b) of injecting each functional chip into each confinement region on the mounting substrate;
A step (c) of immersing a mounting substrate having the functional chip in a liquid together with the planar plate;
(D) a step of fitting the plurality of functional chips into the recess portion of the mounting substrate by applying displacement to the mounting substrate immersed in the liquid in a state where the flat plate is fixed; A method for mounting a semiconductor element, comprising: A mounting substrate formed on the main surface, each having a plurality of recess portions each having a planar shape corresponding to a plurality of functional chips, and a minute groove formed in the vicinity of each recess portion and having a smaller planar dimension than the recess portion. And a micro pin that is movably provided inside the microgroove on the mounting substrate, and is mounted on the mounting substrate to expose the recesses and microgrooves and to expose the functional chips, respectively. Providing a planar plate having a plurality of confinement regions comprising confinement openings;
A step (b) of injecting each functional chip into each confinement region on the mounting substrate;
A step (c) of immersing the mounting substrate having the functional chip in a liquid together with the planar plate and the micro pins;
A step of fitting the plurality of functional chips into the recesses of the mounting substrate by applying displacement to the micro pins immersed in the liquid in a state where the mounting substrate and the flat plate are fixed ( and d) a semiconductor device mounting method.   In the step (d), the limit of displacement given to the flat plate is a mounted state in which a functional chip in an unmounted state that is not fitted in the recessed portion moves to the recessed portion and is fitted in the recessed portion. The method of mounting a semiconductor element according to claim 1, wherein the semiconductor chip is in a range that does not contact the functional chip.   The direction of displacement applied to the flat plate in the step (d) is parallel to the substrate surface and perpendicular to the edge of the functional chip or the peripheral edge of the recess. The mounting method of the semiconductor element as described in 2.   In the step (d), the limit of displacement given to the mounting substrate is that the unmounted functional chip that has not been fitted into the recessed portion has moved to the recessed portion, and has been fitted into the recessed portion. The method for mounting a semiconductor element according to claim 2, wherein the semiconductor element mounting range is a range that does not contact the functional chip in a state.   The direction of displacement given to the mounting substrate in the step (d) is parallel to the substrate surface and perpendicular to the edge of the functional chip or the peripheral edge of the recess. 3. A method for mounting a semiconductor element according to 2.   In the step (d), the limit of displacement given to the micro pin is a mounted state in which an unmounted functional chip that is not fitted in the recessed portion moves to the recessed portion and is fitted in the recessed portion. The method of mounting a semiconductor element according to claim 3, wherein the semiconductor chip is in a range not contacting the functional chip.   The minute grooves in the mounting substrate are arranged such that the direction in which the minute pins are displaced in the step (d) is parallel to the substrate surface and perpendicular to the edge of the functional chip or the peripheral edge of the recess. The method of mounting a semiconductor element according to claim 3, wherein the semiconductor element mounting method is formed as follows.   The planar shape of each confinement region is similar to the planar shape of the functional chip or the recess portion when the functional chips have high symmetry in the planar shape and do not have directionality. The mounting method of the semiconductor element of any one of Claims 4-7.   The size of each confinement region is set to a value at which each functional chip does not rotate more than 90 ° within each confinement region when the symmetry of each functional chip is low in planar shape. Item 8. The method for mounting a semiconductor element according to any one of Items 4 to 7.   4. The method according to claim 1, wherein, in the step (c), the mounting board and the flat plate are immersed in the liquid in a state where the flat plate is covered with a lid. 5. A method for mounting a semiconductor element. Before the step (b), a step (e) of providing a solder material on the bottom surface of each recess portion of the mounting substrate or the bottom surface of each functional chip;
After the step (d), after removing the liquid from the mounting substrate, the mounting substrate and the plurality of functional chips are fixed by heating the mounting substrate, respectively (f) The method for mounting a semiconductor element according to claim 1, further comprising:   14. The method of mounting a semiconductor element according to claim 13, wherein in the step (f), the plurality of functional chips are heated while being pressed from above. A method of mounting a semiconductor element, wherein a plurality of functional chips each of which has a size different from each other and whose planar shape is similar to each other are mounted on a mounting substrate,
A mounting substrate formed on the main surface and having a plurality of recess portions corresponding to the two types of functional chips and the respective planar shapes, and mounted on the mounting substrate, each of the recess portions and its Providing a flat plate having a plurality of confinement regions that are exposed to the periphery and have openings for confining the two types of functional chips;
Solder material is provided on the bottom surface of one type of functional chip among the plurality of functional chips and on the bottom surface of a recess portion corresponding to another type of functional chip among the plurality of recessed portions in the mounting substrate. Providing step (b);
Each of the other types of functional chips is put into a confinement region corresponding to each of the other types of functional chips of the plurality of confinement regions on the mounting substrate and including a recess portion provided with a solder material. Step (c);
A step (d) of immersing a mounting substrate having the other type of functional chip in a liquid together with the planar plate;
A step (e) of fitting the other type of functional chip into a corresponding recess portion of the mounting substrate by applying displacement to the mounting substrate or the flat plate immersed in the liquid;
After removing the liquid from the mounting substrate, the step of fixing the mounting substrate and each of the other types of functional chips by heating the mounting substrate (f),
Of the plurality of confinement regions on the mounting substrate, each functional chip of the one type in which a solder material is provided on a bottom surface of the confinement region including a recess corresponding to each functional chip of the one type. Step (g),
A step (h) of immersing a mounting substrate having the functional chip of the one type together with the flat plate in a liquid;
(I) the step of fitting the functional chip of the one type into the corresponding recess portion of the mounting substrate by applying displacement to the mounting substrate or the flat plate immersed in the liquid;
A step (j) of fixing the mounting substrate and each functional chip of the one type by heating the mounting substrate after removing the liquid from the mounting substrate; A method for mounting a semiconductor element.   16. The method of mounting a semiconductor element according to claim 15, wherein, in the step (f) or the step (j), the functional chips are heated while being pressed from above. A mounting substrate having a plurality of recess portions formed on the main surface and each having a plurality of functional chips each including a semiconductor element and a planar shape;
A flat plate mounted on the mounting substrate and having a plurality of confinement regions each including an opening for confining each functional chip while exposing each of the recesses and their peripheral portions;
After each functional chip is put into each confinement region on the mounting substrate, the mounting substrate having the loaded functional chip is immersed in a liquid together with the flat plate, and displacement is given to the flat plate. Thereby, the plurality of functional chips are fitted into the recesses of the mounting substrate. Formed on the main surface are a plurality of recessed portions each having a planar shape corresponding to a plurality of functional chips each including a semiconductor element, and a minute groove formed in the vicinity of each recessed portion and having a smaller planar dimension than the recessed portion. A mounting board having,
A micro pin provided movably inside the micro groove on the mounting substrate;
A flat plate mounted on the mounting substrate and having a plurality of confining regions each having an opening for confining the functional chip while exposing the recesses and the microgrooves;
After each functional chip is put into each confinement region on the mounting substrate, the mounting substrate having the loaded functional chip is immersed in a liquid together with the plane plate and the micro pins, A semiconductor element mounting body, wherein the plurality of functional chips are fitted into the recess portions of the mounting substrate by applying displacement.

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