JP2005303050A - Spacer tape for film carrier tape for mounting electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a single layer of a spacer tape having heat resistance and sufficient thickness to be used for a film carrier tape for mounting a plurality of electronic components, and further compressing the film carrier tape in a heating process Thus, a spacer tape that is not damaged is provided.
A spacer tape of the present invention is formed using a polyetherimide in which an inorganic filler such as talc is dispersed as a base material. In this spacer tape, the linear expansion coefficient can be 4.0 × 10 ⁻⁵ ° C. ⁻¹ or less, and the pressure on the film carrier tape during heating is suppressed.
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Description

  The present invention is a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, CSP (Chip Size Package) tape, ASIC (Application Specific Integrated Circuit) tape). , COF (Chip on Film) tape, 2 metal (double-sided wiring tape, multilayer wiring tape, etc.) manufacturing process, and when the film carrier tape is wound on a reel, the spacer is wound on the reel Regarding tape. In the present specification, “film carrier tape for mounting electronic components” includes not only a film carrier tape before mounting electronic components but also a film carrier tape after mounting electronic components.

  A film carrier is used when electronic parts are mounted on personal computers, liquid crystals, printers, mobile phones and the like. In this film carrier, for example, a conductive metal foil is attached to at least one surface of an insulating film such as a polyimide film, and then a photosensitive resin is applied on the conductive metal foil, and the photosensitive resin is exposed. After forming a resin layer corresponding to a desired pattern shape by development, a conductive metal foil is etched to form a wiring pattern made of a conductive metal, and then a terminal that contacts an electronic component to be mounted ( Apply solder resist on the wiring pattern, leaving the inner lead) part and the terminal (outer lead) part to connect to this terminal and connect to the outside, and then harden the inner lead and outer lead. It is manufactured by giving.

  The bump electrode formed on the semiconductor chip is placed in contact with the inner lead of the film carrier tape for mounting electronic parts manufactured in this way, and the bump electrode and the inner lead are electrically connected using a bonding tool or the like. By doing so, an electronic component is mounted on the film carrier.

  Recently, for the purpose of improving the efficiency in the manufacturing process, a plurality of electronic component mounting portions are formed in the tape width direction, and the mounting portion rows are formed in two or more rows in the longitudinal direction of the tape. Carrier tape is also used.

  In the film carrier described above, the film carrier tape in the manufacturing process is unwound from the reel on which the film carrier is wound and conveyed to a processing unit that performs a predetermined processing process, and the processed film carrier tape is wound around the reel. It is manufactured by the so-called reel-to-reel method. For example, in the solder resist coating process, the film carrier tape is unwound from the unwinding reel and transported to the coating section. After the solder resist is applied, the film carrier tape is wound up by the winding reel, and the entire winding reel is heated. The solder resist is hardened by holding in the above.

  In this manufacturing process, when the film carrier tape is wound around the reel, the spacer tape is overlapped and wound around the reel in order to protect the film carrier tape. The spacer tape is embossed at positions corresponding to the vicinity of sprocket holes formed at both ends in the width direction of the film carrier tape, for example, and the film carrier tape adjacent by winding on the reel due to the unevenness by this embossing And the spacer tape are prevented from contacting each other. This spacer tape is also used for a film carrier tape on which electronic components are mounted.

Conventionally, a spacer tape made of PET (polyethylene terephthalate) is used for transferring products. However, a PET spacer tape can be used in processes that reach 150 to 180 ° C., such as a heat curing process (100 to 180 ° C.) after solder resist coating and a heating process (100 to 180 ° C.) after tin plating. If used, the spacer tape is greatly deformed due to high temperature, so it cannot be used in these processes.

  Therefore, in such a process, a spacer tape made of heat-resistant polyimide has been proposed (see Patent Document 1). The spacer tape made of polyimide is formed by adhering and laminating a plurality of polyimide films to each other. Has been. That is, the spacer tape is required to have a certain degree of rigidity in order to prevent its central portion from being bent and coming into contact with the film carrier tape during use. When the film carrier tape is used in the manufacturing process, a single layer does not have sufficient rigidity, and the thickness of the spacer tape usually needs to be 150 μm or more by adhering and laminating a plurality of polyimide films.

  However, in the process of multilayering the polyimide film, problems such as deformation of the tape and mixing of bubbles may occur, and there is a problem of operation cost due to an increase in the number of processes.

Patent Document 2 discloses a spacer tape made of polyetherimide as a spacer tape that can be obtained as a single layer having a thickness of 150 μm or more and can withstand the heating in the process of reaching 150 to 170 ° C. ing.
JP-A-8-335608 JP-A-4-192537

  However, when this spacer tape is used together with a film carrier tape based on polyimide film or the like, the film carrier tape is pressed by the spacer tape in the heating process and the film carrier tape is broken or the inner leads are deformed. Sometimes

That is, the linear expansion coefficient of polyetherimide from 25 ° C. to 150 ° C. to 170 ° C. is 5.6 × 10 ⁻⁵ ° C.− ¹ , and a general film carrier tape based on a polyimide film in this temperature range is used. Spacer tape at the time of heating in processes such as a heat curing process after solder resist coating and a heating process after tin plating because it is significantly larger than the linear expansion coefficient of 1.0 to 2.0 × 10 ⁻⁵ ° C. ⁻¹ Expands relatively larger than the film carrier tape. For this reason, the spacer tape interposed between the film carrier tapes wound around the reel presses the film carrier tape and causes the above problems.

  The present invention has been made in order to solve the above-described problems in the prior art, and has a heat resistance and a spacer tape having a sufficient thickness for use in a multi-carrier film carrier tape for mounting electronic components. It is an object of the present invention to provide a spacer tape that can be formed as a single layer and that does not damage the film carrier tape by pressing in the heating step.

The spacer tape of the present invention is used in a manufacturing process of a film carrier tape for mounting a plurality of electronic components. When the film carrier tape is wound around a reel in the manufacturing process, the spacer tape is overlapped with the film carrier tape and wound around the reel. A spacer tape to be worn,
It consists essentially of polyetherimide having an average thickness of 150 to 300 μm in which inorganic fillers are dispersed.

  As the inorganic filler, those containing talc having a major axis of 1 to 5 μm as a main component are preferable, and the content of the inorganic filler is preferably 1 to 50%, more preferably 1 to 10% in volume ratio.

  The spacer tape of the present invention has heat resistance, and can form a single layer of spacer tape having a sufficient thickness for use in a film carrier tape for mounting multiple strips of electronic components. The carrier tape is not pressed and damaged.

  Hereinafter, the present invention will be described in detail. Examples of the polyetherimide used to form the spacer tape of the present invention include ULTEM (registered trademark) manufactured by General Electric Co., Ltd. Polyetherimide has heat resistance that can withstand a heating step reaching 150 ° C. to 180 ° C., such as a heating and curing step after solder resist application and a heating step after tin plating.

  Furthermore, in order to obtain sufficient rigidity that the central part of the spacer tape is bent and does not contact the film carrier tape even if it is used for a multiple film carrier tape having a width of 35 to 200 mm, particularly 70 to 200 mm, A spacer tape having a thickness of 150 μm or more, particularly 150 to 300 μm can be formed as a single layer. The spacer tape of the present invention can be embossed at a position corresponding to the vicinity of the sprocket hole of each strip in the multi-layer film carrier tape in the same manner as a general embossed spacer tape.

  The spacer tape of the present invention is formed of a base material in which an inorganic filler is uniformly dispersed in this polyetherimide. By mixing and dispersing the inorganic filler in the polyetherimide, the linear expansion coefficient of the spacer tape can be reduced. For this reason, it becomes close to the linear expansion coefficient of a film carrier tape based on polyimide or the like, and in the film carrier tape manufacturing process with heating described above, the expansion amount of the spacer tape wound on the reel and the film carrier Significant deviation from the expansion amount of the tape is suppressed, and the pressure on the film carrier tape due to relatively large expansion of the spacer tape can be effectively prevented.

In order to effectively prevent the bending of the film carrier tape due to the pressure on the film carrier tape and the deformation of the inner lead, etc., the linear expansion coefficient of the spacer tape is set to 4.0 × 10 ⁻⁵ by adding an inorganic filler. It is desirable that the temperature is not more than ⁻¹ , preferably 0.5 × 10 ^{−5 to} 4.0 × 10 ^{−5 −1} .

  Examples of such inorganic fillers include inorganic particles such as silicates such as talc and mica, metal powders such as silica, barium sulfate, calcium carbonate, kaolin, clay, and copper powder. The use of an inorganic filler mainly composed of talc, which is a salt, is particularly preferable from the viewpoint of the balance between the mechanical strength and the linear expansion coefficient of the spacer tape.

  The content of the inorganic filler is preferably 1 to 50% by volume ratio, more preferably 1 to 10%. If the content of the inorganic filler is low, the spacer film has a high linear expansion coefficient, which is not preferable. If the content of the inorganic filler is excessive, the physical properties of the molded product may be impaired.

The spacer tape of the present invention is, for example, uniformly mixed by melt-kneading polyetherimide and an inorganic filler with an extruder or the like, then melt-extruded into a sheet using a normal extruder, It can be manufactured by slitting the obtained sheet to a predetermined width and embossing it using an embossing machine or the like.

  The spacer tape thus obtained can of course be used with a single film carrier tape in which only one row of mounting parts on which electronic parts such as IC and LSI are mounted, but the mounting part is in the width direction of the tape. It is also possible to use in a manufacturing process of a multi-strip film carrier tape in which a plurality of the mounting part rows are formed in the longitudinal direction of the tape. The width of the spacer tape is substantially equal to that of the film carrier tape that is wound on the reel in an overlapping manner, and the thickness thereof is 150 μm or more and has sufficient rigidity.

EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to this Example.
<Example 1>
Using a commercially available polyetherimide having a linear expansion coefficient of 5.6 × 10 ⁻⁵ ° C. ⁻¹ , talc with a major axis of about 3 μm is 5% by volume (converted with a talc density of 2.8 g / cm ^3). ) To obtain a sheet having a thickness of 200 μm. Next, this sheet was slit using a slitter so as to have a width of 160 mm and subjected to normal embossing to obtain a spacer tape. The linear expansion coefficient of this spacer tape at 25 ° C. to 160 ° C. was 4.0 × 10 ⁻⁵ ° C. ⁻¹ . Further, the rigidity was the same level as the spacer tape in which a plurality of polyimide films were laminated.

This spacer tape was wound around a reel, overlaid on four 100m long TAB tapes made of polyimide as a base material. The reel was heated from 25 ° C., kept under heating at 180 ° C. for 1.5 hours and then cooled to 25 ° C. 100 times, but no TAB tape bending was detected.
<Comparative Example 1>
A spacer film was obtained in the same manner as in Example 1 except that talc was not used. This spacer film is wound on a reel with four strips of TAB tape based on polyimide, and this reel is kept under heating at 180 ° C. for 1.5 hours, and the heating cycle is repeated in the same manner as in Example 1. As a result, bending of the TAB tape was detected in several places.

Claims (3)

A spacer tape that is used in a manufacturing process of a film carrier tape for mounting multiple strips of electronic components, and is wound on a reel so as to overlap the film carrier tape when the film carrier tape is wound on a reel in the manufacturing process. ,
A spacer tape comprising substantially a polyetherimide having an average thickness of 150 to 300 μm in which an inorganic filler is dispersed. The spacer tape according to claim 1, wherein the linear expansion coefficient is 4.0 × 10 ^-5 ° C ^-1 or less.   The spacer tape according to claim 2, wherein the inorganic filler is contained in an amount of 1 to 50% by volume.