JP2005301738A - Method for manufacturing inlet for electronic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technique by which the pattern of an antenna for an inlet for an electronic tag is formed with good accuracy and at a low cost. <P>SOLUTION: A method for manufacturing the inlet for the electronic tag comprises; chemically etching an Al foil on an insulating film 1 by using a resist film formed by the gravure printing method as a mask to form a slit pattern 5A; and then forming the antenna 3 by forming a slit pattern 5B having a width narrower than that of the slit pattern 5A by cutting the Al foil at a region mounting a chip at a post-process by using a dicing blade. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a manufacturing technique for an inlet for a non-contact type electronic tag, and more particularly to a technique effective when applied to an antenna patterning process.

  For example, a circuit pattern resist pattern is gravure-printed on an aluminum foil bonded to a resin film substrate, and the circuit pattern is formed by etching the aluminum foil using the resist pattern as a mask. There is a technique that can be formed (see, for example, Patent Document 1).

In addition, when forming a circuit pattern including a fine wire portion on a substrate by using a gravure printing method using a conductive ink, the printing plate is formed by a direct printing method, and the pattern of the fine wire portion is arranged in the direction of the doctor. Forming a printing plate that is vertically or obliquely oriented with respect to the substrate, and using this plate, gravure-printing a resist pattern of a circuit pattern including the thin wire portion on the workpiece includes the thin wire portion. There is a technique capable of forming a circuit pattern at a low cost (see, for example, Patent Document 2).
JP 2002-7990 A JP 2003-37347 A

  A non-contact type electronic tag is a tag in which desired data is stored in a memory circuit in a semiconductor chip, and this data is read using a microwave. A semiconductor chip is mounted on an antenna constituted by a lead frame. It has a structure.

  Since the electronic tag stores data in a memory circuit in the semiconductor chip, there is an advantage that a large amount of data can be stored as compared with a tag using a barcode. In addition, the data stored in the memory circuit has an advantage that unauthorized tampering is difficult as compared with the data stored in the barcode.

  However, since this type of electronic tag has a more complicated structure than a tag using a barcode or the like, its manufacturing cost is high, which is one factor hindering the spread of the electronic tag. The inventors of the present invention are focusing their attention on the manufacturing process of the antenna and are proceeding with their studies. In an example of an antenna manufacturing process investigated by the present inventors, a copper foil affixed to a polyimide resin base material with an adhesive is chemically etched (wet etching) using a resist film patterned by photolithography as a mask. Thus, an antenna pattern is formed. This technique has a problem that the processing cost is high because the material cost of polyimide resin and copper is high and the TAT (Turn Around Time) required for patterning the resist film becomes long.

  Accordingly, the present inventors use PEN (polyethylene naphthalate) or PET (polyethylene terephthalate) as a base material, and an aluminum foil is attached to the base material with an adhesive, and an antenna pattern is formed on the aluminum foil by gravure printing. We studied a technique to form an antenna pattern by transferring a pattern of a resist film having the same planar shape as in Fig. 1, and chemically etching the resist film as a mask. According to this technology, since PEN and PET are cheaper than polyimide resin, and aluminum foil is cheaper than copper foil, a reduction in material cost can be expected. Further, in the gravure printing method, the exposure process and the development process can be omitted as compared with the photolithography technique. Therefore, the resist film pattern can be transferred with a short TAT, and a reduction in processing cost can be expected. However, when the gravure printing method is used, since the pattern formed becomes rough as compared with the photolithography technique, the inventor has a problem that the groove between the patterns is filled or spread too much. Found.

  An object of the present invention is to provide a technique capable of forming an antenna pattern of an inlet for an electronic tag accurately and inexpensively.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

The present invention includes an antenna formed of a conductor film formed on a main surface of an insulating film, and formed on a part of the antenna, one end extending to an outer edge of the antenna, and being narrower than the first pattern and the first pattern An inlet for an electronic tag, comprising: a slit formed from a second pattern having a width; a semiconductor chip electrically connected to the antenna through a plurality of bump electrodes; and a resin for sealing the semiconductor chip. Manufacturing method,
(A) preparing the insulating film and the semiconductor chip;
(B) forming the conductor film on the main surface of the insulating film;
(C) forming the first pattern on the conductor film;
(D) forming the second pattern by processing the conductor film using a dicing blade or a laser;
(E) After the step (d), the plurality of bump electrodes are connected to corresponding positions of the respective bump electrodes on the main surface of the conductor film, and the semiconductor chip and the conductor film are electrically connected. Process,
(F) sealing the semiconductor chip with the resin;
(G) After the steps (a) to (f), the step of cutting the conductor film and the insulating film at a cutting region to form the antenna;
Is included.

The present invention also includes an antenna made of a conductor film and a second pattern formed on a part of the antenna, one end extending to the outer edge of the antenna, and having a narrower width than the first pattern. A manufacturing method of an inlet for an electronic tag comprising a formed slit, a semiconductor chip electrically connected to the antenna via a plurality of bump electrodes, and a resin for sealing the semiconductor chip,
(A) preparing a first film comprising the conductor film;
(B) forming the first pattern on the first film;
(C) connecting the plurality of bump electrodes to corresponding positions of the respective bump electrodes on the main surface of the first film, and electrically connecting the semiconductor chip and the conductor film;
(D) After the step (c), the step of sealing the semiconductor chip with the resin,
(E) After the step (d), a step of forming the second pattern by processing the first film from the back surface using a dicing blade or a laser;
(F) After the steps (a) to (e), the step of cutting the first film at a cutting region to form the antenna;
Is included.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, the antenna pattern of the electronic tag inlet can be formed accurately and inexpensively.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

(Embodiment 1)
The electronic tag inlet of the first embodiment (hereinafter simply referred to as “inlet”) constitutes a main part of a non-contact type electronic tag provided with an antenna for receiving microwaves.

  FIG. 1 is a plan view showing an insulating film 1 used for manufacturing the inlet of the first embodiment, and FIG. 2 is an enlarged plan view showing a part of FIG. FIG. 3 shows a cross section in the region indicated by A in FIG. 2 (substantially the central portion of the antenna 3).

  As shown in FIGS. 1 and 2, the insulating film 1 is carried into the inlet manufacturing process according to the first embodiment in a state of being wound around the reel 2. A large number of antennas 3 are previously formed on one surface of the insulating film 1 at a predetermined interval. In the present embodiment, insulating film 1 is made of, for example, PEN or PET, and antenna 3 is made of, for example, an Al (aluminum) film (conductor film). The antenna 3 is attached to the insulating film 1 with an adhesive SCZ made of, for example, urethane resin. Thus, by using PEN or PET as the material of the insulating film 1 and using Al as the material of the antenna 3, for example, polyimide resin is used as the material of the insulating film 1, and Cu (copper) is used as the material of the antenna 3. Compared to the case, the material cost of the inlet can be reduced.

  The insulating film 1 conforms to the standard of the film carrier tape and is formed, for example, with a width of about 48 mm or about 70 mm and a thickness of about 50 μm, and sprocket holes 4 for conveying the insulating film 1 on both sides. Are formed at predetermined intervals. The sprocket hole 4 can be formed, for example, by punching a part of the insulating film 1 with a punch.

  The length of the antenna 3 in the long side direction is, for example, about 51 mm, and is optimized so that microwaves with a frequency of 2.45 GHz can be received efficiently. Moreover, the width of the antenna 3 is about 1.5 mm, and is optimized so that both the downsizing of the inlet and the securing of the strength can be achieved at the same time.

  Next, the process of forming the antenna 3 will be described with reference to FIGS.

  4 and 5 are a perspective view and a plan view, respectively, of the region indicated by A in FIG. 2 (substantially the central portion of the antenna 3). First, as shown in FIGS. 4 and 5, an Al foil 3A having a thickness of about 18 μm is bonded to one surface of the insulating film 1 with an adhesive SCZ. Subsequently, the Al foil is selectively chemically etched to form a slit pattern (first pattern) 5A. In the first embodiment, the pattern of the resist film serving as a mask at the time of chemical etching is formed by a gravure printing method using a gravure printing machine as shown in FIG. The gravure printing machine includes a gravure plate 11 having irregularities corresponding to the pattern of the resist film formed on the surface, a pressing roll 12 that presses the surface of the insulating film 1 to which the Al foil is bonded, onto the surface of the gravure plate 11, resist resin A resist resin liquid tank 14 for holding the liquid 13 and a doctor (doctor blade) 15 are formed. The gravure plate 11 is formed, for example, by subjecting the surface of a material made of Fe (iron) or Al to Cu (copper) plating, and then subjecting the surface to concave processing and further applying Cr (chromium) plating. Has been. The doctor 15 is a blade formed from thin steel. As the gravure plate 11 rotates, the resist resin liquid 13 adheres to the surface of the gravure plate 11 and fills the recesses on the surface. Next, the doctor 15 rubs the surface of the gravure plate 11, scrapes off the excess resist resin solution 13 on the surface of the gravure plate 11, and leaves the resist resin solution 13 in the recess. Further, when the gravure plate 11 is rotated and the insulating resin 1 pressed by the pressing roll 12 comes into contact with the resist resin liquid 13 remaining in the concave portion on the surface of the gravure plate 11, the resist resin liquid 13 remaining in the concave portion is contacted. Is transferred to the insulating film 1. The transferred resist resin liquid 13 becomes a resist film that serves as a mask during the chemical etching.

  By forming a resist film pattern using such a gravure printing machine, for example, the exposure process and the development process can be omitted as compared with the case where the resist film pattern is formed by patterning using a photolithography technique. Thereby, it becomes possible to transfer the pattern of the resist film to the insulating film 1 with a short TAT as compared with the case where the photolithography technique is used, and the processing cost can be reduced.

  Next, as shown in FIGS. 7 to 9, the Al foil 3 </ b> A in a region where a semiconductor chip (hereinafter simply referred to as a chip) is mounted in a later process is cut using a dicing blade DB. FIG. 9 shows a cross section along the line BB in FIG. As a result, as shown in FIGS. 10 to 12, a slit pattern (second pattern) 5B having a width W1 smaller than the width of the slit pattern 5A and having a maximum of 150 μm or less is formed, and the slit made of the slit patterns 5A and 5B. Is completed. Moreover, the antenna 3 is formed by forming this slit. The slit pattern 5B may be formed to a depth reaching the adhesive SCZ and the insulating film 1, but does not penetrate the insulating film 1. Thereby, the mechanical strength of the insulating film can be maintained. One end of the slit formed of the slit patterns 5 </ b> A and 5 </ b> B reaches the outer edge of the antenna 3.

  By the way, when the slit pattern 5B is also formed by chemical etching using a resist film patterned by the gravure printing method, the pattern of the resist film to be formed becomes rough compared to the photolithography technique. There is a concern that the slits are interrupted in the slit pattern 5B, or that the width W1 of the slit pattern 5B becomes too wide. On the other hand, according to the first embodiment, the dimension of the width W1 of the slit pattern 5B is reliably controlled by selecting the dicing blade DB having a thickness such that the width W1 of the slit pattern 5B becomes a desired dimension. can do. For example, the width W1 of the slit pattern 5B can be reduced to about 30 μm. That is, according to the first embodiment, it is possible to reliably prevent a problem that the slit is interrupted in the slit pattern 5B or the width W1 of the slit pattern 5B becomes too wide.

  Further, when the slit is formed using the dicing blade DB, it is difficult to form the pattern of the bent portion in the slit with the dicing blade DB. Therefore, as in the first embodiment, by combining the formation of the slit pattern 5A by chemical etching and the formation of the slit pattern 5B having the minimum width by the dicing blade DB, the slit can be formed easily and with high processing accuracy. It becomes possible.

  After the antenna 3 is formed by the above means, a chip CHP as shown in FIG. 13 is prepared. The chip CHP is formed of a single crystal silicon substrate having a thickness of about 0.15 mm, and a circuit including rectification / transmission, clock extraction, a selector, a counter, a ROM, and the like as described later is formed on the main surface. . The ROM has a storage capacity of 128 bits and can store a large amount of data compared to a storage medium such as a barcode. In addition, the data stored in the ROM has an advantage that unauthorized tampering is difficult as compared with the data stored in the barcode.

  On the main surface of the chip CHP on which the circuit is formed, four bump electrodes BMP1 to BMP4 made of, for example, Au (gold) are formed. These four bump electrodes BMP1 to BMP4 are located on a pair of virtual diagonal lines indicated by a two-dot chain line in FIG. 13, and the distance from the intersection of these diagonal lines (the center of the main surface of the chip CHIP) is approximately They are laid out to be equal. By adopting such a layout, it is possible to easily balance the weight when the chip CHP is connected to the antenna 3. These bump electrodes BMP1 to BMP4 are formed by using, for example, a well-known electrolytic plating method, and the height thereof is, for example, about 15 μm. Further, a distance W2 between adjacent bump electrodes (excluding adjacent on the same diagonal) is, for example, 200 μm. In the first embodiment, in order to prevent the bump electrodes BMP1 to BMP4 from falling into the slit pattern 5B when such a chip CHP is mounted on the antenna 3 including the slit pattern 5B in a later process. It can be exemplified that the alignment margin of the connection positions of the bump electrodes BMP1 to BMP4 is about 25 μm in each direction on the insulating film 1 (antenna 3).

  Next, as shown in FIGS. 14 to 16, the chip CHP is mounted on the antenna 3 so as to straddle the slit pattern 5 </ b> B having the narrowest width among the slits formed in the antenna 3. In order to mount the chip CHP on the antenna 3, as shown in FIG. 17, the reel 2 is mounted on a bonder 23 having a bonding stage 21 and an ultrasonic bonding tool 22, and an insulating film is formed along the upper surface of the bonding stage 21. The chip CHP is connected to the antenna 3 while moving 1. Here, FIGS. 18 and 19 are cross-sectional views of the bump electrodes BMP1 to BMP4 shown in FIG. 13 and the vicinity thereof. Among the bump electrodes BMP1 to BMP4, for example, the bump electrode BMP1 constitutes an input terminal of a circuit to be described later, and the bump electrode BMP2 constitutes a GND terminal. The remaining two bump electrodes BMP3 and BMP4 constitute dummy bumps not connected to the circuit. As shown in FIG. 18, the bump electrode BMP1 constituting the input terminal of the circuit is formed on the uppermost metal wiring 27 exposed by etching the passivation film 25 and the polyimide resin film 26 covering the main surface of the chip CHP. Is formed. In addition, a barrier metal film 28 is formed between the bump electrode BMP1 and the uppermost metal wiring 27 to increase the adhesion between them. The passivation film 25 is composed of, for example, a laminated film of a silicon oxide film and a silicon nitride film, and the uppermost metal wiring 27 is composed of, for example, an Al alloy film. Further, the barrier metal film 28 is composed of, for example, a laminated film of a Ti film having high adhesion to the Al alloy film and a Pd (palladium) film having high adhesion to the bump electrode BMP1. Although illustration is omitted, the connection part between the bump electrode BMP2 constituting the GND terminal of the circuit and the uppermost metal wiring 27 has the same structure as described above. On the other hand, as shown in FIG. 19, the bump electrode BMP3 (and BMP4) constituting the dummy bump is connected to a metal layer 29 formed in the same wiring layer as the uppermost metal wiring 27. Layer 29 is not connected to the circuit.

  In order to connect the chip CHP to the antenna 3, the antenna 3 is installed on the bonding stage 21 heated to about 100 ° C. as shown in FIG. A chip CHP is mounted at the tip. Next, after positioning the chip CHP and the antenna 3, the chip CHP is pressed against the upper surface of the antenna 3 to bring the bump electrodes (BMP 1 to BMP 4) into contact with the antenna 3. At this time, by applying a predetermined load and ultrasonic waves to the ultrasonic bonding tool 22 for about 0.3 seconds, the antenna 3 and the bump electrodes (BMP1 to BMP4) are bonded to each other at the interface, and the bump electrodes (BMP1 to BMP1) are bonded. BMP4) and antenna 3 are bonded.

  Here, FIG. 21 is a block diagram of a circuit formed in the chip CHP (see FIG. 13). As described above, a circuit including rectification / transmission, clock extraction, a selector, a counter, a ROM, and the like is formed on the main surface of the chip CHP. In the inlet according to the first embodiment, a part of the antenna 3 formed on one surface of the insulating film 1 is provided with a slit 5 whose one end reaches the outer edge of the antenna 3, and one of the antennas 3 divided into two by the slit 5. The input terminal (bump electrode BMP1) of the chip CHP is connected to the other terminal, and the GND terminal (bump electrode BMP2) of the chip CHP is connected to the other terminal. With this configuration, the effective length of the antenna 3 can be increased, so that the inlet can be downsized while ensuring the necessary antenna length.

  Next, a new chip CHP is mounted on the bonding stage 21. Subsequently, the insulating film 1 is moved by one pitch of the antenna 3, and then the same operation as described above is performed. Connect to 3. Thereafter, the chip CHP is connected to all the antennas 3 formed on the insulating film 1 by repeating the same operation as described above. The insulating film 1 for which the connection work between the chip CHP and the antenna 3 has been completed is conveyed to the next resin sealing step while being wound around the reel 2.

  Next, as shown in FIGS. 22 to 24, the underfill resin 31 is filled into the gap between the lower surface of the chip CHP and the insulating film 1 (and the antenna 3) using a dispenser 30 or the like, and then the underfill resin 31. Is cured in a heating furnace. When the underfill resin 31 is cured in the heating furnace, the underfill resin 31 is first semi-cured and the insulating film 1 is wound around the reel 2, and then the reel 2 is carried into the heating furnace and the underfill is performed. Resin 31 is completely cured. In addition, after semi-curing the underfill resin 31, prior to the step of winding the insulating film 1 onto the reel 2, an inspection for determining whether or not the antenna 3 and the chip CHP are connected may be performed. Since a large number of antennas 3 formed on the insulating film 1 are electrically separated from each other, the continuity test between the individual antennas 3 and the chip CHP can be easily performed. Thereafter, as shown in FIG. 25, the cover film 32 is laminated on one surface of the insulating film 1 (the surface on which the antenna 3 is formed), thereby completing the manufacturing process of the inlet 33 of the first embodiment.

  As shown in FIG. 26, the inlet 33 manufactured as described above is packed in a state of being wound around the reel 2 and shipped to a customer.

  A customer who has purchased the inlet 33 cuts the insulating film 1 at a cutting region to obtain an individualized inlet 33 as shown in FIG. 27, and then combines the inlet 33 with another member. An electronic tag is produced. For example, FIG. 28 shows an example in which a double-sided adhesive tape or the like is attached to the back surface of the inlet 33 to produce an electronic tag and this is attached to the surface of an article such as a slip 34.

(Embodiment 2)
Next, the manufacturing process of the inlet of this Embodiment 2 is demonstrated using FIG. 29 and FIG.

  The inlet manufacturing process of the second embodiment is substantially the same as that of the first embodiment except for the process of forming the slit pattern 5B (see FIGS. 7 to 12).

  In the second embodiment, after forming up to the slit pattern 5A in the same process as in the first embodiment, the Al foil 3A in the region where the slit pattern 5B is formed by irradiation with the laser beam LB by the laser irradiator LI is formed. The slit pattern 5B is formed by removing. Similar to the first embodiment, in the second embodiment, the slit pattern 5B may be formed to a depth reaching the adhesive SCZ and the insulating film 1, but not to penetrate the insulating film 1.

  When the slit pattern 5B is formed by irradiation with the laser beam LB as in the second embodiment, the Al foil 3A is cut using the dicing blade DB as described in the first embodiment. As compared with the case where the slit pattern 5B is formed, the width W1 of the slit pattern 5B can be reduced, and the width W1 can be reduced to about 10 μm. That is, even when the chip CHP (see FIGS. 14 to 16) mounted on the antenna 3 is downsized, the chip CHP can be mounted across the slit pattern 5B.

  Further, when the slit pattern 5B is formed by irradiation with the laser beam LB, it is prepared to incorporate the process of irradiating the laser beam LB with the laser irradiator LI in-line and to make the manufacturing process of the inlet consistent. Therefore, the inlet can be manufactured with a shorter TAT than in the first embodiment. Further, the slit pattern 5A may also be formed by irradiation with the laser beam LB. In this case, the slit patterns 5A and 5B can be formed in a lump, so that the inlet can be manufactured with a shorter TAT. Is possible.

  According to the second embodiment, the same effects as those of the first embodiment can be obtained.

(Embodiment 3)
Next, the manufacturing process of the inlet of this Embodiment 3 is demonstrated using FIGS. 31-44.

  FIG. 31 is a plan view showing an Al foil (first film) 3A used for manufacturing the inlet of the third embodiment, and FIG. 32 is a plan view showing a part of FIG. 31 in an enlarged manner. FIG. 33 shows a cross section taken along the line CC in FIG.

  As shown in FIG. 31, in Embodiment 3, the insulating film used in Embodiment 1 is omitted. That is, only the Al foil 3 </ b> A having a thickness of about 20 μm is carried into the inlet manufacturing process of the third embodiment while being wound around the reel 2. As shown in FIG. 32, the Al foil 32 is provided with a cutting region 3C for cutting and dividing into individual antennas in a later step. In the third embodiment, the width W3 of the cutting region 3C can be exemplified as about 0.7 mm.

  In order to form an antenna using such an Al foil 3A, first, as shown in FIGS. 34 to 36, a slit pattern 5A similar to the slit pattern 5A shown in the first embodiment is formed. 34 is a plan view showing the Al foil 3A when the slit pattern 5A is formed, and FIG. 35 is a plan view showing a part of FIG. 34 in an enlarged manner. FIG. 36 illustrates a cross section taken along line DD in FIG. Also in the third embodiment, the slit pattern 5A can be formed by chemical etching using a resist film pattern formed by gravure printing as a mask. In the third embodiment, instead of such chemical etching, the slit pattern 5A may be formed by punching the Al foil 3A with a punch.

  Next, as shown in FIGS. 37 to 39, a chip CHP is mounted on the main surface of the Al foil 3A. FIG. 39 shows a cross section taken along the line BB in FIG. The chip CHP can be mounted on the main surface of the Al foil 3A by a process similar to the process described using FIGS. 14 to 20 in the first embodiment. At this time, the position where the chip CHP is mounted is between the two slit patterns 5A in each antenna formation region, so that the chip CHP does not straddle the slit pattern 5A.

  Next, as shown in FIG. 40, the underfill resin 31 is filled in the gap between the lower surface of the chip CHP and the main surface of the Al foil 3A using a dispenser 30 or the like, and then the underfill resin 31 is placed in a heating furnace. Harden.

  Next, as shown in FIG. 41, the back surface of the Al foil 3A between the bump electrode BMP1 and the bump electrode BMP2 (between the bump electrode BMP3 and the bump electrode BMP4) is cut with a dicing blade DB. At this time, by positioning the Al foil 3A by confirming the mounting position of the chip CHP by the camera CMR, it is possible to cut from the back surface of the Al foil 3A at an accurate cutting position by the dicing blade DB. Thereby, as shown in FIG. 42, the slit pattern 5B similar to the slit pattern 5B (refer FIGS. 10-12) in the said Embodiment 1 can be formed. In the third embodiment, if the slit pattern 5B is formed before the chip CHP is mounted, the mechanical strength of the Al foil 3A is lowered, and the Al foil 3A is deformed or bumps when the chip CHP is mounted. There is concern about the occurrence of a problem that the connection strength between the electrodes BMP1 to BMP4 and the Al foil 3A is lowered. Therefore, as described above, the slit pattern 5B is preferably formed after the chip CHP is mounted.

  Next, after laminating a cover film on the main surface of Al foil 3A (the surface on which chip CHP is mounted), as shown in FIG. 43, Al foil 3A is packed in a state of being wound around reel 2, and the customer Shipped first. The customer can obtain the separated inlet 33 as shown in FIG. 44 by cutting the Al foil 3A at the cutting region 3C. Further, the antenna 3 is completed by cutting the Al foil 3A.

  According to the third embodiment as described above, the insulating tape 1 (see FIG. 3) and the adhesive SCZ (see FIG. 3) used in the first embodiment can be omitted. Thereby, the manufacturing cost of the inlet of the third embodiment can be reduced.

  According to the third embodiment, the same effect as that of the first embodiment can be obtained.

(Embodiment 4)
Next, the manufacturing process of the inlet of this Embodiment 4 is demonstrated using FIG.

  The manufacturing process of the inlet of the fourth embodiment is substantially the same as that of the third embodiment except for the process of forming the slit pattern 5B (see FIGS. 41 and 42).

  In the fourth embodiment, the Al foil 3A in the region where the slit pattern 5B is formed by the irradiation of the laser beam LB by the laser irradiator LI is removed from the back surface to form the slit pattern 5B.

  When the slit pattern 5B is formed by irradiation with the laser beam LB as in the second embodiment, the Al foil 3A is cut using the dicing blade DB as described in the third embodiment. As compared with the case where the slit pattern 5B is formed, the width of the slit pattern 5B can be reduced, and the width can be reduced to about 10 μm. That is, even when the chip CHP to be mounted on the antenna 3 is downsized, the chip CHP can be mounted so as to straddle the slit pattern 5B.

  Further, when the slit pattern 5B is formed by irradiation with the laser beam LB, it is prepared to incorporate the process of irradiating the laser beam LB with the laser irradiator LI in-line and to make the manufacturing process of the inlet consistent. Therefore, it is possible to manufacture the inlet with a shorter TAT than in the third embodiment. Further, the slit pattern 5A may also be formed by irradiation with the laser beam LB. In this case, the slit patterns 5A and 5B can be formed in a lump, so that the inlet can be manufactured with a shorter TAT. Is possible.

  According to the fourth embodiment, the same effect as that of the third embodiment can be obtained.

(Embodiment 5)
Next, an inlet manufacturing process according to the fifth embodiment will be described with reference to FIGS.

  Also in the fifth embodiment, an antenna is formed using the same Al foil 3A as in the third embodiment. First, as shown in FIGS. 46 and 47, a resin film (first film) made of a resist material having a film thickness of about 1 μm to 2 μm on the front surface (main surface and back surface) of the Al foil 3A and having grooves 41 on the back surface of the Al foil 3A. 1 film) 42 is formed. 47 shows a cross section taken along line EE in FIG. A region F where the chip CHP is mounted in a later process is provided on the middle of the groove 41. The width of the groove 41 is the narrowest in the portion overlapping with the region F. Since a slit is formed in the Al foil 3A below the groove 41 in a later step and a chip is mounted so as to straddle the slit, by narrowing the width of the groove 41 in the portion overlapping the region F, It becomes possible to prevent the area F from being enlarged, and it is possible to prevent the chip CHP mounted in the area F from being enlarged.

  The resin film 42 can be formed using, for example, the gravure printing machine described in the first embodiment with reference to FIG. In the fifth embodiment, the concavo-convex portion on the surface of the gravure plate 11 is formed according to the design rule as shown in FIGS. 48 and 49 are explanatory views showing the main part of the surface of the gravure plate 11 and showing the convex part 43 corresponding to one groove 41. FIG.

  As shown in FIGS. 48 and 49, the surface of the convex portion 43 has a shape reflecting the planar shape of the groove 41. Further, the convex portion 43 has regions 43A (shown with coloring in FIGS. 48 and 49), 43B (shown with hatching in FIGS. 48 and 49), 43C (shown in FIGS. 48 and 49). ) And 43D (shown by hatching in FIG. 48 and FIG. 49), and each region includes an overlapping portion. Of the region 43C, the shape of the portion that does not overlap with the regions 43B and 43D corresponds to the planar shape of the portion of the groove 41 that overlaps with the region F, and the width of the convex portion 43 (the region 43C). The width WC) is the smallest in this part. Such a convex portion 43 is surrounded by a concave portion 44, and regions 43C and 43D including one end of the convex portion 43 are opposite to the rotation direction C of the gravure plate 11 (viewed from the gravure plate 11). And the end of the doctor 15 extends beyond a position D corresponding to the outer edge of the antenna 3 formed in a later step. The region 43A extends in a direction crossing the rotation direction C of the gravure plate 11, and the region 43B has a plurality of bent portions (three in FIGS. 48 and 49).

  By making the extending direction of the region 43C having the minimum width WC in the convex portion 43 substantially parallel to the rotation direction C of the gravure plate 11 as described above, the doctor 15 causes the excess resin liquid (on the surface of the gravure plate 11 ( When the resin film 42 is scraped off, the resin liquid can be satisfactorily prevented from remaining on the surface even in the narrowest region 43C of the convex portion 43. That is, on the back surface of the Al foil 3A, the resin film 42 having the groove 5 having a desired dimension can be formed with high processing accuracy.

  In the fifth embodiment, the radius of curvature of the inner periphery of the bent portion in the region 43B is made larger than the radius of curvature of the outer periphery. That is, as shown in FIG. 48, R4 is larger than R5 at the bent portion where R4 is the radius of curvature of the inner circumference and R5 is the radius of curvature of the outer circumference, R1 is the radius of curvature of the inner circumference, and R3 is the outer radius of curvature. R1 is set to be larger than R3 in the bent portion having the radius of curvature, and R1 is set to be larger than R2 in the bent portion having R1 as the radius of curvature of the inner periphery and R2 as the radius of curvature of the outer periphery. Thereby, when the doctor 15 scrapes off the excess resin liquid on the surface of the gravure plate 11, the change in the shape of the convex portion 43 at the contact portion between the doctor 15 and the gravure plate 11 can be moderated. Since the bleeding of the liquid can be suppressed as much as possible and the distance from R5 is wide, the phenomenon that the resin liquid is connected by R4 and R5 due to the bleeding can be prevented. In addition, even if the resin liquid oozes out between R3 and R2, since the distance from R1 is wide, the phenomenon that the resin liquid is connected can be prevented. That is, on the back surface of the Al foil 3A, the resin film 42 having the groove 5 having a desired dimension can be formed with high processing accuracy.

  In the present embodiment, the outer edge of the region 43D is forward tapered toward the position D so that the width WD of the region 43D is larger than the width WC of the region 43C at the position D where one end of the convex portion 43 reaches. It forms so that it may become a shape. Here, the region corresponding to the region 43D in the groove 41 does not overlap with the region F in which the chip CHP is mounted. Therefore, by making the width of the region 43D larger than the width WC of the region 43C, it is possible to secure a wide width of the groove 41 in the region where the chip CHP is not disposed on the upper portion, so that the resin film 41 is formed on the back surface of the Al foil 3A. When formed, the possibility that the groove 5 is blocked in the middle can be reduced. Further, by forming the outer edge of the region 43D so as to have a forward taper shape toward the position D, the bent portion can be eliminated in the region 43D, so that the resin liquid can be prevented from seeping out at the outer edge of the region 43D. It is possible to prevent excess resin liquid from remaining on the surface of the convex portion 43.

  In the fifth embodiment, the center line CL in the extending direction of the region 43C and the relative traveling direction E of the doctor 15 viewed from the gravure plate 11 have been described as being substantially parallel. In order to improve the shape of the groove 41 and avoid the problem that the groove 41 is interrupted, the angle deviation (angle θ) between the center line CL and the traveling direction E of the doctor 15 is within 15 ° at the maximum. It is preferable that In addition, when the dimensional error of the resist pattern shape is taken into consideration, the problem that the groove 41 is interrupted can be more reliably prevented by setting the angle deviation within 7 °.

  Next, as shown in FIG. 50, a chip CHP is mounted on the main surface of the Al foil 3A. The chip CHP can be mounted on the main surface of the Al foil 3A by a process similar to the process described using FIGS. 14 to 20 in the first embodiment. At this time, the resin film 42 is interposed between the bump electrodes BMP1 to BMP4 and the Al foil 3A. As described above, since the resin film 42 has a film thickness of about 1 μm to 2 μm, the chip CHP is mounted. Can be broken with ultrasonic vibration at room temperature applied. Therefore, after mounting the chip CHP, the bump electrodes BMP1 to BMP4 and the Al foil 3A can be electrically connected. Further, since the resin film 42 can be broken by ultrasonic vibration when the chip CHP is mounted, the step of removing the resin film 42 under the electrodes BMP1 to BMP4 can be omitted. Thereby, the inlet according to the fifth embodiment can be manufactured with a short TAT. Moreover, since the process of removing the resin film 42 under the electrodes BMP1 to BMP4 can be omitted, the manufacturing cost of the inlet according to the fifth embodiment can be reduced.

  Subsequently, after filling the gap between the lower surface of the chip CHP and the main surface of the Al foil 3A with a dispenser 30 (see FIG. 24) or the like, the underfill resin 31 is cured in a heating furnace. .

  Next, as shown in FIG. 51, by chemically etching the Al foil 3A using the resin film 42 as a mask, a slit 5C having substantially the same planar shape as the groove 41 is formed, and the antenna 3 is completed. At this time, since the resin film 42 on the main surface side of the Al foil 3A serves as an etching stopper, it is possible to prevent the chip CHP from being contaminated by the etching solution.

  Next, after laminating a cover film on the main surface (surface on which the chip CHP is mounted) of the Al foil 3A, the fifth embodiment is performed through the steps described with reference to FIGS. 43 and 44 in the third embodiment. Manufacturing inlets.

  According to the above-described fifth embodiment, since it is not necessary to remove the resin film 42, the problem that the Al foil 3A forming the antenna 3 is eroded by the stripping solution used when the resin film 42 is removed is prevented. be able to. Thereby, it becomes possible to prevent the width of the slit 5C from expanding.

(Embodiment 6)
Next, the manufacturing process of the inlet according to the sixth embodiment will be described with reference to FIGS.

  As shown in FIG. 52, in the sixth embodiment, the insulating film 1 is used in the same manner as in the first embodiment. First, the Al foil 3A is applied to one surface (main surface) of the insulating film 1 with the adhesive SCZ. Glue. Subsequently, a resin film 42 having grooves 41 is formed on the Al foil 3A. The resin film 42 is the same as the resin film 42 shown in the fifth embodiment, and the groove 41 has the same planar shape as the groove 41 shown in the fifth embodiment. Also in the sixth embodiment, the resin film 42 can be formed using, for example, the gravure printing machine described in the first embodiment with reference to FIG. The rotation direction C of 11 and the relative traveling direction of the doctor 15 viewed from the gravure plate 11 are also formed by the design rules shown in FIGS. 48 and 49 in the fifth embodiment.

  Next, as shown in FIG. 53, the Al foil 3A is chemically etched using the resin film 42 as a mask to form slits 5C having substantially the same planar shape as the grooves 41, and the antenna 3 is completed.

  Next, as shown in FIG. 54, a chip CHP is mounted on the main surface of the Al foil 3A. The chip CHP can be mounted on the main surface of the Al foil 3A by a process similar to the process described using FIGS. 14 to 20 in the first embodiment. At this time, as in the fifth embodiment, the resin film 42 is interposed between the bump electrodes BMP1 to BMP4 and the Al foil 3A. As described above, the resin film 42 has a film thickness of about 1 μm to 2 μm. Therefore, it can be broken by ultrasonic vibration at normal temperature which is applied when the chip CHP is mounted. That is, when the chip is mounted, the bump electrodes BMP1 to BMP4 penetrate the resin film 42 by applying ultrasonic vibration and pressure to the bump electrodes BMP1 to BMP4. Therefore, after mounting the chip CHP, the bump electrodes BMP1 to BMP4 and the Al foil 3A can be electrically connected.

  Subsequently, after filling the gap between the lower surface of the chip CHP and the main surface of the Al foil 3A with a dispenser 30 (see FIG. 24) or the like, the underfill resin 31 is cured in a heating furnace. . The heat at this time causes Al atoms forming the antenna 3 and Au atoms forming the bump electrodes BMP1 to BMP4 to diffuse to each other, thereby further strengthening the bonding between the antenna 3 and the bump electrodes BMP1 to BMP4. it can.

  Next, after laminating a cover film on the main surface (surface on which the chip CHP is mounted) of the Al foil 3A, the sixth embodiment is performed through the steps described with reference to FIGS. 43 and 44 in the third embodiment. Manufacturing inlets.

  According to the sixth embodiment as described above, the same effects as those of the fifth embodiment can be obtained.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the above embodiment, the case where PET or PEN is selected as the material of the insulating film and Al is selected as the material of the antenna has been described. For example, polyimide resin is selected as the material of the insulating film, and Cu ( Other materials may be selected such as (copper).

  The electronic tag inlet manufacturing method of the present invention can be applied, for example, to an antenna manufacturing process in an electronic tag inlet.

It is a top view which shows a part of elongate insulating film used for manufacture of the inlet for electronic tags which is Embodiment 1 of this invention. It is a top view which expands and shows a part of insulating film shown in FIG. It is principal part sectional drawing which shows a part of insulating film shown in FIG. 1 and FIG. It is a principal part perspective view which shows a part of insulating film shown in FIG. 1 and FIG. It is a principal part top view which shows a part of insulating film shown in FIG. 1 and FIG. It is explanatory drawing of the gravure printing machine used for manufacture of the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part perspective view in the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part top view in the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is principal part sectional drawing in the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. FIG. 8 is a perspective view of main parts in the manufacturing process of the electronic tag inlet continued from FIG. 7. It is a principal part top view in the manufacturing process of the inlet for electronic tags following FIG. FIG. 10 is an essential part cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 9; It is a top view of the semiconductor chip mounted in the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part perspective view in the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part top view in the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is principal part sectional drawing in the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is the schematic of the bonder which shows a part (semiconductor chip and antenna connection process) of the manufacturing process of the inlet for electronic tags which is Embodiment 1 of this invention. It is sectional drawing of the bump electrode formed in the main surface of the semiconductor chip shown in FIG. 13, and its vicinity. It is sectional drawing of the dummy bump electrode formed in the main surface of the semiconductor chip shown in FIG. 13, and its vicinity. It is the schematic which expands and shows the principal part of the bonder shown in FIG. It is a block diagram of the circuit formed in the main surface of the semiconductor chip shown in FIG. It is a principal part perspective view in the manufacturing process of the inlet for electronic tags following FIG. FIG. 16 is a plan view of a principal part in the manufacturing process of the electronic tag inlet continued from FIG. 15. FIG. 17 is an essential part cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 16; It is a side view which shows the inlet for electronic tags which is Embodiment 1 of this invention. It is a side view which shows the state which wound up the insulating film used for manufacture of the inlet for electronic tags which is Embodiment 1 of this invention on the reel. It is a top view (surface side) which shows the inlet for electronic tags which is Embodiment 1 of this invention. It is explanatory drawing which shows the usage method of the electronic tag using the inlet for electronic tags which is Embodiment 1 of this invention. It is a principal part top view explaining the manufacturing method of the inlet for electronic tags which is Embodiment 2 of this invention. It is principal part sectional drawing explaining the manufacturing method of the inlet for electronic tags which is Embodiment 2 of this invention. It is a top view which shows a part of elongate Al foil used for manufacture of the inlet for electronic tags which is Embodiment 3 of this invention. It is a top view which expands and shows a part of Al foil shown in FIG. It is principal part sectional drawing which shows a part of Al foil shown in FIG.31 and FIG.32. It is a top view which shows a part of Al foil in the manufacturing process of the inlet for electronic tags which is Embodiment 3 of this invention. It is a top view which expands and shows a part of Al foil shown in FIG. It is principal part sectional drawing which shows a part of Al foil shown to FIG. 34 and FIG. It is a top view which shows a part of Al foil in the manufacturing process of the inlet for electronic tags following FIG. It is a top view which shows a part of Al foil in the manufacturing process of the inlet for electronic tags following FIG. It is principal part sectional drawing in the manufacturing process of the inlet for electronic tags which is Embodiment 3 of this invention. It is principal part sectional drawing in the manufacturing process of the inlet for electronic tags which is Embodiment 3 of this invention. It is principal part sectional drawing in the manufacturing process of the inlet for electronic tags following FIG. FIG. 42 is a main-portion cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 41; It is a side view which shows the state which wound Al foil used for manufacture of the inlet for electronic tags which is Embodiment 3 of this invention on the reel. It is a top view (surface side) which shows the inlet for electronic tags which is Embodiment 3 of this invention. It is principal part sectional drawing explaining the manufacturing method of the inlet for electronic tags which is Embodiment 4 of this invention. It is a principal part top view explaining the manufacturing method of the inlet for electronic tags which is Embodiment 5 of this invention. It is principal part sectional drawing explaining the manufacturing method of the inlet for electronic tags which is Embodiment 5 of this invention. It is explanatory drawing which shows the principal part of the surface of the gravure plate contained in the gravure printing machine used in Embodiment 5 of this invention. It is explanatory drawing which shows the principal part of the surface of the gravure plate contained in the gravure printing machine used in Embodiment 5 of this invention. It is principal part sectional drawing in the manufacturing process of the inlet for electronic tags which is Embodiment 5 of this invention. FIG. 52 is a main-portion cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 50; It is principal part sectional drawing explaining the manufacturing method of the inlet for electronic tags which is Embodiment 6 of this invention. FIG. 53 is a main-portion cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 52; FIG. 54 is a main-portion cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 53; FIG. 55 is a main-portion cross-sectional view of the electronic tag inlet during the manufacturing process following FIG. 54;

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulating film 2 Reel 3 Antenna 3A Al foil (1st film)
3C Cutting area 4 Sprocket hole 5A Slit pattern (first pattern)
5B Slit pattern (second pattern)
5C slit 11 gravure plate 12 presser roll 13 resist resin solution 14 resist resin solution tank 15 doctor (doctor blade)
21 Bonding stage 22 Ultrasonic bonding tool 23 Bonder 25 Passivation film 26 Polyimide resin film 27 Top layer metal wiring 28 Barrier metal film 29 Metal layer 30 Dispenser 31 Underfill resin 32 Cover film 33 Inlet 34 Voucher 41 Groove 42 Resin film (first film) Film)
43 convex part 43A, 43B, 43C, 43D area 44 concave part CHP chip CMR camera DB dicing blade F area LB laser light LI laser irradiator SCZ adhesive

Claims (24)

An antenna composed of a conductor film formed on the main surface of the insulating film, and a first pattern formed on a part of the antenna, one end extending to the outer edge of the antenna, and having a width narrower than that of the first pattern and the first pattern. An electronic tag inlet manufacturing method comprising: a slit formed from two patterns; a semiconductor chip electrically connected to the antenna via a plurality of bump electrodes; and a resin for sealing the semiconductor chip. And
(A) preparing the insulating film and the semiconductor chip;
(B) forming the conductor film on the main surface of the insulating film;
(C) forming the first pattern on the conductor film;
(D) forming the second pattern by processing the conductor film using a dicing blade or a laser;
(E) After the step (d), the plurality of bump electrodes are connected to corresponding positions of the respective bump electrodes on the main surface of the conductor film, and the semiconductor chip and the conductor film are electrically connected. Process,
(F) sealing the semiconductor chip with the resin;
(G) After the steps (a) to (f), the step of cutting the conductor film and the insulating film at a cutting region to form the antenna;
The manufacturing method of the inlet for electronic tags characterized by including this. In the manufacturing method of the inlet for electronic tags of Claim 1,
The method of manufacturing an inlet for an electronic tag, wherein the slit has a width that allows the semiconductor chip to straddle at a position where the second pattern is formed. In the manufacturing method of the inlet for electronic tags of Claim 2,
The method of manufacturing an inlet for an electronic tag, wherein the width of the second pattern is 150 μm or less. In the manufacturing method of the inlet for electronic tags of Claim 1,
The first pattern is:
(C1) Masking a shape corresponding to the concave pattern on the main surface of the conductor film by a gravure printing method using a gravure plate in which a convex pattern corresponding to the first pattern and a concave pattern other than that are formed Forming a pattern and etching the conductive film using the masking pattern as a mask,
The manufacturing method of the inlet for electronic tags characterized by forming by these. In the manufacturing method of the inlet for electronic tags of Claim 1,
The step (d) is included in the step (c).
The method of manufacturing an inlet for an electronic tag, wherein the first pattern and the second pattern are collectively formed by processing with the laser. In the manufacturing method of the inlet for electronic tags of Claim 1,
The method for producing an inlet for an electronic tag, wherein the insulating film contains polyethylene naphthalate or polyethylene terephthalate as a main component. In the manufacturing method of the inlet for electronic tags of Claim 1,
The method of manufacturing an inlet for an electronic tag, wherein the conductor film contains aluminum as a main component. An antenna formed of a conductor film; a slit formed in a part of the antenna, one end extending to an outer edge of the antenna, and a first pattern and a second pattern having a narrower width than the first pattern; A method for producing an inlet for an electronic tag comprising a semiconductor chip electrically connected to the antenna via a plurality of bump electrodes, and a resin for sealing the semiconductor chip,
(A) preparing a first film comprising the conductor film;
(B) forming the first pattern on the first film;
(C) connecting the plurality of bump electrodes to corresponding positions of the respective bump electrodes on the main surface of the first film, and electrically connecting the semiconductor chip and the conductor film;
(D) After the step (c), the step of sealing the semiconductor chip with the resin,
(E) After the step (d), a step of forming the second pattern by processing the first film from the back surface using a dicing blade or a laser;
(F) After the steps (a) to (e), the step of cutting the first film at a cutting region to form the antenna;
The manufacturing method of the inlet for electronic tags characterized by including this. In the manufacturing method of the inlet for electronic tags of Claim 8,
The method of manufacturing an inlet for an electronic tag, wherein the slit has a width that allows the semiconductor chip to straddle at a position where the second pattern is formed. In the manufacturing method of the inlet for electronic tags of Claim 9,
The method of manufacturing an inlet for an electronic tag, wherein the width of the second pattern is 150 μm or less. In the manufacturing method of the inlet for electronic tags of Claim 8,
The first pattern is:
(C1) By a gravure printing method using a gravure plate in which a convex pattern corresponding to the first pattern and a concave pattern other than that are formed, the shape corresponding to the concave pattern on the main surface of the first film Forming a masking pattern and etching the first film using the masking pattern as a mask;
Or
(C2) a step of punching a position corresponding to the first pattern of the first film with a punch;
The manufacturing method of the inlet for electronic tags characterized by forming by any one of these. In the manufacturing method of the inlet for electronic tags of Claim 8,
The step (b) is included in the step (e).
The method of manufacturing an inlet for an electronic tag, wherein the first pattern and the second pattern are collectively formed by processing with the laser. In the manufacturing method of the inlet for electronic tags of Claim 8,
The method for producing an inlet for an electronic tag, wherein the first film contains aluminum as a main component. An antenna formed of a conductive film; a slit formed on a part of the antenna; one end extending to an outer edge of the antenna; a semiconductor chip electrically connected to the antenna via a plurality of bump electrodes; A method for manufacturing an inlet for an electronic tag comprising a resin for sealing a semiconductor chip,
(A) preparing a first film comprising the conductor film;
(B) The first film having a first film having an etching selectivity different from that of the conductor film on the main surface of the first film, and having an opening having a shape corresponding to the slit on the back surface of the first film. Forming a process,
(C) connecting the plurality of bump electrodes to corresponding positions of the respective bump electrodes on the main surface of the first film, and electrically connecting the semiconductor chip and the conductor film;
(D) After the step (c), the step of sealing the semiconductor chip with the resin,
(E) After the step (d), the first film on the back surface of the first film is used as a mask, the first film on the main surface of the first film is used as an etching stopper, and the first film is etched. Forming a slit;
(F) After the steps (a) to (e), the step of cutting the first film at a cutting region to form the antenna;
The manufacturing method of the inlet for electronic tags characterized by including this. In the manufacturing method of the inlet for electronic tags of Claim 14,
The method of manufacturing an inlet for an electronic tag, wherein the slit has a width that allows the semiconductor chip to straddle under the semiconductor chip. In the manufacturing method of the inlet for electronic tags of Claim 15,
The method of manufacturing an inlet for an electronic tag, wherein a width of the slit is 150 μm or less under the semiconductor chip. In the manufacturing method of the inlet for electronic tags of Claim 14,
The step (b)
(B1) The first of the shape corresponding to the concave pattern on the back surface of the first film by a gravure printing method using a gravure plate having a convex pattern corresponding to the slit and a concave pattern other than that. Forming a film;
The manufacturing method of the inlet for electronic tags characterized by including this. In the manufacturing method of the inlet for electronic tags of Claim 14,
The method for producing an inlet for an electronic tag, wherein the first film contains aluminum as a main component. An antenna made of a conductive film formed on the main surface of the insulating film, a slit formed on a part of the antenna, one end extending to the outer edge of the antenna, and a plurality of bump electrodes are electrically connected to the antenna. A manufacturing method of an inlet for an electronic tag, comprising: a semiconductor chip connected to the semiconductor chip; and a resin that seals the semiconductor chip,
(A) preparing the insulating film and the semiconductor chip;
(B) forming the conductor film on the main surface of the insulating film;
(C) forming a first film having an opening having a shape corresponding to the slit on the main surface of the conductor film and having an etching selectivity different from that of the conductor film;
(D) etching the conductor film using the first film as a mask to form the slit;
(E) After the step (d), the plurality of bump electrodes are connected to corresponding positions of the respective bump electrodes on the main surface of the conductor film, and the semiconductor chip and the conductor film are electrically connected. Process,
(F) sealing the semiconductor chip with the resin;
(G) After the steps (a) to (f), the step of cutting the conductor film and the insulating film at a cutting region to form the antenna;
The manufacturing method of the inlet for electronic tags characterized by including this. In the manufacturing method of the inlet for electronic tags of Claim 19,
The method of manufacturing an inlet for an electronic tag, wherein the slit has a width that allows the semiconductor chip to straddle under the semiconductor chip. In the manufacturing method of the inlet for electronic tags of Claim 19,
The method of manufacturing an inlet for an electronic tag, wherein a width of the slit is 150 μm or less under the semiconductor chip. In the manufacturing method of the inlet for electronic tags of Claim 19,
The step (c)
(C1) The first shape having a shape corresponding to the concave pattern on the main surface of the conductor film by a gravure printing method using a gravure plate in which a convex pattern corresponding to the slit and other concave patterns are formed. Forming a film;
The manufacturing method of the inlet for electronic tags characterized by including this. In the manufacturing method of the inlet for electronic tags of Claim 19,
The method for producing an inlet for an electronic tag, wherein the insulating film contains polyethylene naphthalate or polyethylene terephthalate as a main component. In the manufacturing method of the inlet for electronic tags of Claim 19,
The method of manufacturing an inlet for an electronic tag, wherein the conductor film contains aluminum as a main component.

Images