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JP2005301114A - Optical connector structure - Google Patents

Optical connector structure Download PDF

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Publication number
JP2005301114A
JP2005301114A JP2004120109A JP2004120109A JP2005301114A JP 2005301114 A JP2005301114 A JP 2005301114A JP 2004120109 A JP2004120109 A JP 2004120109A JP 2004120109 A JP2004120109 A JP 2004120109A JP 2005301114 A JP2005301114 A JP 2005301114A
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Japan
Prior art keywords
wiring board
optical element
optical
optical connector
recess
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JP2004120109A
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Japanese (ja)
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Hiroki Takamatsu
裕樹 高松
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
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Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2004120109A priority Critical patent/JP2005301114A/en
Publication of JP2005301114A publication Critical patent/JP2005301114A/en
Pending legal-status Critical Current

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Abstract

【課題】 光素子を配線基板上の所定位置に位置決め精度を高めて実装できる光コネクタ構造を提供する。
【解決手段】 この光コネクタ構造1は、所定の相手側光コネクタと着脱自在に接続され、その相手側光コネクタと光結合する光素子5が配線基板7上に実装されるものであり、光素子5と配線基板7との互いの対向面のうち、一方の対向面上に凸部5cが形成され、他方の対向面上に凹部7cが形成され、凸部5cと凹部7cとが嵌合することにより光素子5が配線基板7上の所定位置に位置決めされて実装される。
【選択図】図2
PROBLEM TO BE SOLVED: To provide an optical connector structure capable of mounting an optical element at a predetermined position on a wiring board with an increased positioning accuracy.
An optical connector structure 1 is detachably connected to a predetermined counterpart optical connector, and an optical element 5 that is optically coupled to the counterpart optical connector is mounted on a wiring board 7. Of the opposing surfaces of the element 5 and the wiring substrate 7, a convex portion 5c is formed on one opposing surface, a concave portion 7c is formed on the other opposing surface, and the convex portion 5c and the concave portion 7c are fitted. Thus, the optical element 5 is positioned and mounted at a predetermined position on the wiring board 7.
[Selection] Figure 2

Description

本発明は、OA、FAや車載機器等の光通信分野で用いられる光コネクタの構造であって、特に相手側光コネクタと光結合する光素子を備えた光コネクタの構造に関する。   The present invention relates to the structure of an optical connector used in the field of optical communication such as OA, FA, and in-vehicle equipment, and more particularly to the structure of an optical connector provided with an optical element that is optically coupled to a counterpart optical connector.

この種の光コネクタとして、配線基板と、配線基板の一側主面上に表面実装される表面実装タイプの光素子と、相手側光コネクタが着脱自在に嵌合すると共に配線基板が配設されるハウジングとを備えるものがある。この様な光コネクタにおいては、図6の様に、配線基板101の一側主面は平坦に形成されており、その一側主面上において、光素子103は、相手側光コネクタ(図示省略)との光学的アライメントが具備される様にリフロー実装される。光素子102を実装した配線基板101は、相手側光コネクタと光素子102との光学的アライメントが具備される様にハウジング(図示省略)に配設される。   As this type of optical connector, a wiring board, a surface mounting type optical element that is surface-mounted on one main surface of the wiring board, and a mating optical connector are detachably fitted and a wiring board is provided. Some have a housing. In such an optical connector, as shown in FIG. 6, one side main surface of the wiring board 101 is formed flat, and on one side main surface, the optical element 103 is a counterpart optical connector (not shown). And reflow mounting so as to be provided with an optical alignment. The wiring board 101 on which the optical element 102 is mounted is disposed in a housing (not shown) so that optical alignment between the counterpart optical connector and the optical element 102 is provided.

上記の様な光コネクタでは、配線基板102の一側主面が平坦に形成されており、その一側主面上に光素子102がリフロー実装されるので、そのリフロー実装の際に、半田流れによる実装ズレが生じて、光素子102と相手側光コネクタとの光学的アライメントがずれるという欠点がある。この様に光学的アライメントがずれた場合は、光素子実装後に調芯作業を行う必要があり、その調芯作業が困難であるという欠点もある。   In the optical connector as described above, one side main surface of the wiring board 102 is formed flat, and the optical element 102 is reflow mounted on the one side main surface. There is a drawback that the optical alignment between the optical element 102 and the counterpart optical connector is shifted due to mounting displacement due to the above. When the optical alignment is deviated in this way, it is necessary to perform alignment work after mounting the optical element, and there is a disadvantage that the alignment work is difficult.

また、光素子102を実装した配線基板101をハウジングに配設する際に、配線基板101とハウジングとの間にずれが生じて、光素子102と相手側光コネクタとの光学的アライメントがずれるという欠点もある。   Further, when the wiring board 101 on which the optical element 102 is mounted is disposed in the housing, a shift occurs between the wiring board 101 and the housing, and the optical alignment between the optical element 102 and the counterpart optical connector is shifted. There are also drawbacks.

そこで、この発明の課題は、第1に、光素子を配線基板上の所定位置に位置決め精度を高めて実装できる光コネクタ構造を提供すること、第2に、光素子の実装された配線基板をハウジングの所定位置に位置決め精度を高めて配設できる光コネクタ構造を提供することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide, firstly, an optical connector structure capable of mounting an optical element at a predetermined position on the wiring board with high positioning accuracy, and secondly, a wiring board on which the optical element is mounted. An object of the present invention is to provide an optical connector structure that can be disposed at a predetermined position of a housing with increased positioning accuracy.

上記課題を解決する為に、請求項1に記載の発明は、所定の相手側光コネクタと着脱自在に接続され、その相手側光コネクタと光結合する光素子が配線基板上に実装されて備えられる光コネクタの構造であって、前記光素子の外周側面上の複数箇所にそれぞれ凸部または凹部の一方が形成されると共に、前記配線基板の実装面上に素子収容凹部が形成されて、その素子収容凹部の内周側面上の対応する複数箇所にそれぞれ凸部または凹部の他方が形成され、前記光素子は、その外周側面上の前記複数箇所にそれぞれ形成された前記凸部または凹部の一方がそれぞれ、前記素子収容凹部の内周側面上の対応する前記複数箇所にそれぞれ形成された前記凸部または凹部の他方に嵌合することにより、前記素子収容凹部内の所定位置に位置決めされて配設されるものである。   In order to solve the above problems, the invention described in claim 1 is provided with an optical element that is detachably connected to a predetermined counterpart optical connector and optically coupled to the counterpart optical connector mounted on a wiring board. The optical connector has a structure in which one of a convex portion or a concave portion is formed at each of a plurality of locations on the outer peripheral side surface of the optical element, and an element receiving concave portion is formed on the mounting surface of the wiring board. The other of the convex portions or the concave portions is formed at a plurality of corresponding positions on the inner peripheral side surface of the element housing concave portion, and the optical element is one of the convex portions or the concave portions formed at the plurality of positions on the outer peripheral side surface, respectively. Are respectively positioned at predetermined positions in the element receiving recesses by fitting into the other of the protrusions or the recesses respectively formed at the plurality of corresponding positions on the inner peripheral side surface of the element receiving recess. It is intended to be disposed.

請求項2に記載の発明は、前記光素子の一方の相対する各外側面上に前記凸部または凹部の一方が形成されると共に、前記配線基板の前記素子収容凹部の一方の相対する各内側面上に前記凸部または凹部の他方が形成され、前記光素子は、その前記一方の相対する各外側面間が前記素子収容凹部の前記一方の相対する各内側面間に嵌合すると共に、その前記凸部または凹部の一方が前記素子収容凹部側の前記凸部または凹部の他方と嵌合することにより、前記素子収容凹部内の所定位置に位置決めされて配設されるものである。   According to a second aspect of the present invention, one of the convex portion or the concave portion is formed on each of the opposing outer surfaces of the optical element, and one of the inner sides of the element accommodating concave portion of the wiring board is opposed to each other. The other of the convex part or the concave part is formed on the side surface, and the optical element is fitted between the one opposing inner side surface of the element accommodating concave part between the one opposing outer side surfaces, One of the convex portion or the concave portion is fitted to the other of the convex portion or the concave portion on the element accommodating concave portion, thereby being positioned and disposed at a predetermined position in the element accommodating concave portion.

請求項3に記載の発明は、前記光素子の外側面上に電極部が配設されると共に、前記配線基板の前記素子収容凹部の内側面上に前記光素子側の前記電極部とリフロー接続される電極部が配設され、前記光素子が前記配線基板の前記素子収容凹部内の前記所定位置に位置決めされて配設された状態で、前記光素子側の前記電極部と前記配線基板側の前記電極部との間にリフロー接続用の隙間が確保される様に、前記光素子の前記外側面と前記配線基板の前記内側面とが隙間を空けて対向するものである。   According to a third aspect of the present invention, an electrode portion is disposed on the outer surface of the optical element, and the electrode portion on the optical element side and the reflow connection are provided on the inner surface of the element receiving recess of the wiring board. The electrode portion on the optical element side and the wiring substrate side in a state where the optical element is disposed and the optical element is positioned and disposed at the predetermined position in the element receiving recess of the wiring substrate. The outer surface of the optical element and the inner surface of the wiring board are opposed to each other with a gap so that a gap for reflow connection is secured between the electrode portion and the electrode portion.

請求項4に記載の発明は、前記相手側光コネクタが着脱自在に嵌合されるハウジングを更に備え、前記配線基板にスリット部が形成され、前記ハウジングに前記スリット部に嵌合する嵌合部が形成され、前記スリット部と前記嵌合部とが嵌合することにより前記配線基板が前記ハウジングの所定位置に位置決めされて配設されるものである。   The invention according to claim 4 further includes a housing in which the counterpart optical connector is detachably fitted, and a slit portion is formed in the wiring board, and the fitting portion is fitted into the slit portion in the housing. When the slit portion and the fitting portion are fitted, the wiring board is positioned and disposed at a predetermined position of the housing.

請求項5に記載の発明は、前記スリット部は、前記配線基板にくびれ部が形成される様に前記配線基板の縁側から切り込まれて形成され、前記ハウジングに、前記配線基板が収容配設される基板収容凹部が形成され、前記嵌合部は、前記基板収容凹部内において、その一端部が前記基板収容凹部の相対する各内側面のうちの一方の内側面に連成されると共に、その他端部が前記相対する各内側面のうちの他方の内側面と所定間隔空けて対向された板状に形成され、前記配線基板は、その前記スリット部が前記基板収容凹部の前記嵌合部に嵌合すると共にその前記くびれ部が前記基板収容凹部の前記他方の内側面と前記嵌合部の前記他端部との間の前記所定間隔内に嵌合することにより、前記基板収容凹部内の前記所定位置に位置決めされて配設されるものである。   According to a fifth aspect of the present invention, the slit portion is formed by being cut from an edge side of the wiring board so that a constriction is formed in the wiring board, and the wiring board is accommodated in the housing. A substrate housing recess is formed, and the fitting portion is coupled to one inner surface of each of the opposing inner surfaces of the substrate housing recess in the substrate housing recess, The other end portion is formed in a plate shape facing the other inner side surface of each of the opposing inner side surfaces at a predetermined interval, and the wiring board has the slit portion that is the fitting portion of the substrate housing recess. And the constricted portion is fitted within the predetermined interval between the other inner side surface of the substrate receiving recess and the other end of the fitting portion, thereby the inside of the substrate receiving recess. Positioned at the predetermined position. It is intended to be.

請求項1に記載の発明によれば、光素子が、その外側面上の複数箇所にそれぞれ形成された凸部または凹部の一方がそれぞれ、配線基板の素子収容凹部の内側面上の対応する複数箇所にそれぞれ形成された凸部または凹部の他方に嵌合することにより、素子収容凹部内の所定位置に位置決めされて配設されるので、光素子を配線基板上の所定位置に位置決め精度を高めて実装できる。   According to the first aspect of the present invention, the optical element has a plurality of convex portions or concave portions respectively formed at a plurality of locations on the outer side surface, and each of the corresponding ones on the inner side surface of the element receiving concave portion of the wiring board. The optical element is positioned at a predetermined position on the wiring board to increase the positioning accuracy because the optical element is positioned at a predetermined position in the element receiving recess by being fitted to the other of the convex part or the concave part formed at each location. Can be implemented.

請求項2に記載の発明によれば、光素子が、その一方の相対する各外側面間が素子収容凹部内の一方の相対する内側面間に嵌合すると共に、その前記各外側面に形成された凸部または凹部の一方が素子収容凹部側の前記各内側面に形成された凸部または凹部の他方と嵌合することにより、素子収容凹部内の所定位置に位置決めされて配設されるので、光素子と素子収容凹部間とが一方の方向に関してしか位置決め状に嵌合できない場合でも、凹部と凸部との嵌合を組み合わせて有効に光素子を素子収容凹部内の所定位置に位置決め精度を高めて実装できる。   According to the second aspect of the present invention, the optical element is formed on each of the outer surfaces while the one of the outer surfaces of the optical element is fitted between the inner surfaces of the element housing recess. One of the formed convex portions or concave portions is positioned and arranged at a predetermined position in the element accommodating concave portion by fitting with the other convex portion or concave portion formed on each inner side surface on the element accommodating concave portion side. Therefore, even when the optical element and the element receiving recess can be fitted in a positioning manner only in one direction, the optical element is effectively positioned at a predetermined position in the element receiving recess by combining the fitting of the recess and the protruding part. Can be implemented with higher accuracy.

請求項3に記載の発明によれば、光素子が配線基板の素子収容凹部内の所定位置に位置決めされて配置された状態で、素子収容凹部側の電極部と光素子側の電極部とがリフロー接続用の隙間を空けて対向する様に、配線基板の内側面と光素子の外側面とを隙間を空けて対向させる場合においても、その条件を満たして光素子を配線基板上の所定位置に位置決め精度を高めて実装できる。   According to the third aspect of the present invention, in a state where the optical element is positioned and arranged at a predetermined position in the element receiving recess of the wiring board, the electrode portion on the element receiving recess side and the electrode portion on the optical element side are Even when the inner surface of the wiring board and the outer surface of the optical element are opposed to each other with a gap so as to face each other with a gap for reflow connection, the optical element is placed at a predetermined position on the wiring board while satisfying that condition. Can be mounted with higher positioning accuracy.

請求項4に記載の発明によれば、配線基板にスリット部が形成され、ハウジングに前記スリット部に嵌合する嵌合部が形成され、前記スリット部と前記嵌合部とが嵌合することにより配線基板がハウジングの所定位置に位置決めされて配設されるので、配線基板をハウジングの所定位置に位置決め精度を高めて配設できる。   According to invention of Claim 4, a slit part is formed in a wiring board, the fitting part fitted to the said slit part is formed in a housing, and the said slit part and the said fitting part fit. Since the wiring board is positioned and arranged at a predetermined position of the housing, the wiring board can be arranged at a predetermined position of the housing with high positioning accuracy.

請求項5に記載の発明によれば、スリット部が、配線基板にくびれ部が形成される様に配線基板の縁側から切り込まれて形成され、嵌合部が、ハウジングの基板収容凹部内において、その一端部が前記基板収容凹部の相対する各内側面のうちの一方の内側面に連成されると共に、その他端部が前記相対する各内側面のうちの他方の内側面と所定間隔空けて対向された板状に形成され、前記配線基板は、その前記スリット部が前記基板収容凹部の前記嵌合部に嵌合すると共にその前記くびれ部が前記基板収容凹部の前記他方の内側面と前記嵌合部の他端部との間の前記所定間隔内に嵌合することにより、前記基板収容凹部内の前記所定位置に位置決めされて配設されるので、簡単な構造で配線基板をハウジングの所定位置に位置決め精度を高めて配設できる。   According to the fifth aspect of the present invention, the slit portion is formed by being cut from the edge side of the wiring board so that the constricted portion is formed in the wiring board, and the fitting portion is formed in the substrate receiving recess of the housing. The one end portion is coupled to one inner side surface of the opposing inner side surfaces of the substrate receiving recess, and the other end portion is spaced from the other inner side surface of the opposing inner side surfaces by a predetermined distance. The wiring board has a slit portion that fits into the fitting portion of the substrate accommodating recess, and a constricted portion that is connected to the other inner surface of the substrate accommodating recess. By fitting within the predetermined interval between the other end of the fitting portion, the wiring substrate is positioned and arranged at the predetermined position in the substrate receiving recess, so that the wiring board can be housed with a simple structure. Increases the positioning accuracy to the predetermined position Distribution can be set.

この実施の形態に係る光コネクタ構造1は、図1および図2の様に、1本以上(ここでは2本)の光ファイバ3bを保持した相手側光コネクタ3が着脱自在に接続され、その相手側光コネクタ3に保持された光ファイバ3bと光結合する光素子5が配線基板7上に実装されて備えられるものであり、配線基板7と、配線基板7に実装された1つ以上(ここでは相手側光コネクタ3の光ファイバ3bの数に合わせて2つ)の表面実装タイプの光素子5と、相手側光コネクタ3が着脱自在に嵌合接続されると共に配線基板7が収容配設されるハウジング9とを備えて構成される。   As shown in FIGS. 1 and 2, the optical connector structure 1 according to this embodiment is configured such that a counterpart optical connector 3 holding one or more (here, two) optical fibers 3b is detachably connected. An optical element 5 that is optically coupled to the optical fiber 3b held by the counterpart optical connector 3 is mounted and provided on the wiring board 7. The wiring board 7 and one or more (1 or more) mounted on the wiring board 7 ( Here, the surface mount type optical element 5 and the counterpart optical connector 3 are detachably fitted and connected, and the wiring board 7 is accommodated and distributed. And a housing 9 provided.

尚、ここでは、各光ファイバ3bは、例えばフェルール部3aを介して相手側光コネクタ3内に保持されている。   In addition, here, each optical fiber 3b is hold | maintained in the other party optical connector 3 via the ferrule part 3a, for example.

各光素子5は、フォトダイオードやフォトトランジスタ等の受光素子または発光ダイオード等の発光素子である。各光素子5は、図2〜図4の様に、例えば平面視矩形状の板状に形成された素子本体5aを有し、その素子本体5aの外周側面上の複数箇所に(ここでは素子本体5aの一方の相対する各外側面5b上の例えば中央に)、配線基板7側の後述の凹部7cと嵌合する位置決め用の凸部5cが形成される。素子本体5aの一側主面上の所定箇所には、受光部または発光部(以後、受発光部と称す)5dが配設される。また、素子本体5aの外側面上には(ここでは素子本体5aの他方の相対する各外側面5e上および凸部5cの先端面上には)、配線基板7側の後述の電極部7fと電気接続される電極部5fが配設される。   Each optical element 5 is a light receiving element such as a photodiode or a phototransistor or a light emitting element such as a light emitting diode. Each optical element 5 has an element body 5a formed in a plate shape having a rectangular shape in plan view as shown in FIGS. 2 to 4, for example (in this case, the element body 5a) at a plurality of locations on the outer peripheral side surface of the element body 5a. A positioning convex portion 5c that fits into a concave portion 7c, which will be described later, on the wiring board 7 side is formed on one opposing outer surface 5b of the main body 5a. A light receiving portion or a light emitting portion (hereinafter referred to as a light receiving and emitting portion) 5d is disposed at a predetermined location on one main surface of the element body 5a. Further, on the outer surface of the element body 5a (here, on the other opposing outer surface 5e of the element body 5a and on the front end surface of the convex portion 5c) An electrode portion 5f to be electrically connected is provided.

配線基板7は、例えば平面視矩形状の板状に形成される。配線基板7の一側主面(実装面)上には、各光素子5が収容される2つの素子収容凹部7aが形成される。   The wiring board 7 is formed, for example, in a rectangular plate shape in plan view. On one side main surface (mounting surface) of the wiring board 7, two element accommodating recesses 7 a for accommodating the respective optical elements 5 are formed.

各素子収容凹部7aの平面視寸法は、例えば、その一方(y方向)の辺の長さが光素子5の同方向の辺の長さと略同一寸法に形成され、その他方(x方向)の辺の長さが光素子5の同方向の辺の長さより少し大きく形成される。即ち、素子収容凹部7aは、その一方の辺方向(y方向)においては光素子5と嵌合して光素子5を位置決めして収容し、その他方の辺方向(x方向)においては光素子5との間に所定隙間が生じる様に収容する。また、素子収容凹部7aの深さは、ここでは光素子5の厚さより浅く形成されるが、光素子5の厚さより深く形成してもよく、また光素子5の厚さと同程度に形成してもよい。   The dimension of each element receiving recess 7a in plan view is such that, for example, the length of one side (y direction) is substantially the same as the length of the side of the optical element 5 in the same direction, and the other dimension (x direction). The length of the side is formed to be slightly larger than the length of the side of the optical element 5 in the same direction. That is, the element accommodating recess 7a is fitted to the optical element 5 in one side direction (y direction) to position and accommodate the optical element 5, and the optical element 5 in the other side direction (x direction). It is accommodated so that a predetermined gap is formed between the two. In addition, the depth of the element accommodating recess 7a is formed shallower than the thickness of the optical element 5 here, but it may be formed deeper than the thickness of the optical element 5 or formed to be approximately the same as the thickness of the optical element 5. May be.

尚、ここでは、配線基板7における一方の相対する各内側面7bは、配線基板7のx方向の辺に平行に形成され、配線基板7における他方の相対する各内側面7dは、配線基板7のy方向の辺に平行に形成される。   Here, one opposing inner side surface 7b of the wiring board 7 is formed in parallel to the x-direction side of the wiring board 7, and the other opposing inner side face 7d of the wiring board 7 Formed in parallel to the side in the y direction.

各素子収容凹部7aの内周側面上の複数箇所には(ここでは各素子収容凹部7aの一方の相対する各内側面7b上の例えば中央には)、光素子5側の凸部5cと嵌合する凹部7cが形成される。各凹部7cは、配線基板7の一側主面(図2では上面(実装面))側に開放している。   At a plurality of locations on the inner peripheral side surface of each element receiving recess 7a (here, for example, at the center on one opposing inner side surface 7b of each element receiving recess 7a), the projection 5c on the optical element 5 side is fitted. A mating recess 7c is formed. Each recess 7 c is open to one side main surface (the upper surface (mounting surface) in FIG. 2) side of the wiring board 7.

各凹部7cにおける凹方向の奥行きは、光素子5の凸部5cの凸方向の長さよりも長く形成される。これにより、光素子5の凸部5cと配線基板7の凹部7cとが嵌合した際に、凸部5cの先端面に配設された電極部5fと、凹部7cの奥面7eに配設される後述の電極部7fとの間にリフロー接続用の隙間が確保される。   The depth in the concave direction of each concave portion 7 c is formed longer than the length in the convex direction of the convex portion 5 c of the optical element 5. Thereby, when the convex part 5c of the optical element 5 and the concave part 7c of the wiring board 7 are fitted, the electrode part 5f provided on the front end surface of the convex part 5c and the back surface 7e of the concave part 7c are provided. A gap for reflow connection is secured between the electrode portion 7f described later.

各素子収容凹部7aの内側面上には(ここでは各素子収容凹部7aにおける他方の相対する各内側面7d上および各凹部7cの奥面7e上には)、光素子5側の電極部5fと電気接続される電極部7fが配設される。この電極部7fは、配線基板7に配設された配線パターン7g(図3参照)に接続される。   On the inner side surface of each element receiving recess 7a (here, on the other opposing inner side surface 7d of each element receiving recess 7a and on the back surface 7e of each recess 7c), the electrode portion 5f on the optical element 5 side The electrode part 7f electrically connected to is disposed. The electrode portion 7f is connected to a wiring pattern 7g (see FIG. 3) disposed on the wiring board 7.

尚、ここでは、配線基板7は、図3の様に、例えば多層基板(例えば上層基板7Uと下層基板7Dからなる2層基板)として構成される。そして、素子収容凹部7aおよび凹部7cは、多層基板7のうちの上層基板7Uの所定領域が各素子収容凹部7aおよび各凹部7cの形に切り抜かれて形成される。配線基板7側の電極部7fは、例えば上層基板7Uと下層基板7Dの間に配設された配線パターン7gに接続される。   Here, the wiring board 7 is configured as a multilayer board (for example, a two-layer board including an upper layer board 7U and a lower layer board 7D) as shown in FIG. The element receiving recess 7a and the recess 7c are formed by cutting out a predetermined region of the upper substrate 7U of the multilayer substrate 7 into the shape of each element receiving recess 7a and each recess 7c. The electrode portion 7f on the wiring board 7 side is connected to a wiring pattern 7g disposed between the upper layer board 7U and the lower layer board 7D, for example.

配線基板7には、図1および図2の様にスリット部7hが形成される。このスリット部7hは、例えば配線基板7にくびれ部7jが形成される様に配線基板7の縁側から切り込まれて(ここでは配線基板7の一の辺(x方向に沿った辺)の中央からその辺の直交方向(y方向)に向けて2つの素子収容凹部7aの間に切り込まれて)形成される。   The wiring board 7 is formed with a slit portion 7h as shown in FIGS. The slit portion 7h is cut from the edge side of the wiring board 7 so that a constricted portion 7j is formed on the wiring board 7, for example (here, the center of one side (side along the x direction) of the wiring board 7). To the direction perpendicular to the side (y direction) is formed between the two element receiving recesses 7a.

そして、この配線基板7に光素子5を実装するには、図2および図3を参照して、先ず例えば配線基板7の電極部7f上に半田ペースト(図示省略)が塗布される。   In order to mount the optical element 5 on the wiring board 7, referring to FIGS. 2 and 3, first, for example, a solder paste (not shown) is applied onto the electrode portion 7 f of the wiring board 7.

そして、光素子5を、その受発光部5dが表側を向く様に且つその各凸部5cが配線基板7の素子収容凹部7aの各凹部7cに嵌合する様にして、素子収容凹部7a内に収容配置させる。これにより、(1)光素子5の一方の相対する各外側面間5bが素子収容凹部7aの一方の相対する各内側面7bの間に嵌合すると共に(2)光素子5の各凸部5cが素子収容凹部7aの各凹部7cに嵌合して、光素子5が素子収容凹部7a内の所定位置(従って配線基板7上の所定位置)に位置決めされて配置される。特に上記(1)の嵌合により、光素子5における配線基板7上のy方向の位置(素子収容凹部7aの一方の相対する各内側面7bの相対方向の位置)が所定位置(後述の様に光素子5の受発光部5dのy方向の位置と対応する光ファイバ端面3cのy方向の位置とが一致する位置)に位置決めされる。また、上記(2)の嵌合により、光素子5における配線基板7上のx方向の位置(素子収容凹部7aの他方の相対する各内側面7dの相対方向の位置)が、所定位置(後述の様に光素子5の受発光部5dのx方向の位置と対応する光ファイバ端面3cのx方向の位置とが一致する位置)に位置決めされると共に素子収容凹部7aの内側面7dと光素子5の外側面5eとが所定隙間を空けて対向してこれにより光素子5側の電極部5fと配線基板7側の対応する電極部7fとがリフロー接続用の隙間を空けて対向する様に位置決めされる。この様にして、光素子5が配線基板7上の所定位置に位置決めされて実装される。   Then, the optical element 5 is placed in the element accommodating recess 7a so that the light emitting / receiving portion 5d faces the front side and each convex portion 5c is fitted in each concave portion 7c of the element accommodating concave portion 7a of the wiring board 7. To accommodate. As a result, (1) one of the opposing outer side surfaces 5b of the optical element 5 is fitted between one opposing inner side surface 7b of the element accommodating recess 7a, and (2) each convex part of the optical element 5 5c fits into each recess 7c of the element receiving recess 7a, and the optical element 5 is positioned and arranged at a predetermined position in the element receiving recess 7a (accordingly, a predetermined position on the wiring board 7). In particular, due to the fitting in (1) above, the position in the y direction on the wiring board 7 in the optical element 5 (the position in the relative direction of one of the inner surfaces 7b facing each other of the element receiving recess 7a) is a predetermined position (as described later) The position in the y direction of the light receiving / emitting part 5d of the optical element 5 and the corresponding position in the y direction of the end face 3c of the optical fiber are positioned. Further, by the fitting in (2) above, the position in the x direction on the wiring board 7 in the optical element 5 (the position in the relative direction of the other opposing inner side surface 7d of the element accommodating recess 7a) is a predetermined position (described later). In this way, the position of the light receiving / emitting portion 5d of the optical element 5 is positioned at a position where the corresponding position of the optical fiber end surface 3c in the x direction matches) and the inner surface 7d of the element receiving recess 7a and the optical element 5 so as to face the outer surface 5e with a predetermined gap, so that the electrode portion 5f on the optical element 5 side and the corresponding electrode portion 7f on the wiring board 7 side face each other with a gap for reflow connection. Positioned. In this way, the optical element 5 is positioned and mounted at a predetermined position on the wiring board 7.

そして、この状態で、配線基板7側の電極部7fに塗布された半田ペーストが溶融されて、光素子5側の電極部5fと配線基板7側の対応する電極部7fとが半田7i(図4参照)により電気的に接続される。この様にして、光素子5が配線基板7上の所定位置に位置決めされて実装される。   In this state, the solder paste applied to the electrode part 7f on the wiring board 7 side is melted, and the electrode part 5f on the optical element 5 side and the corresponding electrode part 7f on the wiring board 7 side are soldered to the solder 7i (FIG. 4)). In this way, the optical element 5 is positioned and mounted at a predetermined position on the wiring board 7.

ハウジング9は、図1および図5の様に、概略扁平な筒状に形成されており、その一端開口部9a側に、相手側光コネクタ3が嵌合接続される接続筒部9bが形成され、その他端開口部9c側に、配線基板7が収容配設される基板収容凹部9dが形成される。   The housing 9 is formed in a substantially flat cylindrical shape as shown in FIGS. 1 and 5, and a connection cylindrical portion 9 b to which the counterpart optical connector 3 is fitted and connected is formed on one end opening 9 a side thereof. A substrate housing recess 9d for housing the wiring board 7 is formed on the other end opening 9c side.

接続筒部9bは、相手側光コネクタ3を内嵌め可能な有底筒状に形成される。接続筒部9bの底面(奥面)上には、1つ以上(ここでは相手側光コネクタ3の光ファイバ3bの数に合わせて2つ)のスリーブ部9eが突出形成される。各スリーブ部9eは、相手側光コネクタ3の対応するフェルール部3aを挿入可能でかつ基板収容凹部9d内に連通する筒孔9gを有する略筒状に形成される。   The connecting tube portion 9b is formed in a bottomed tube shape into which the counterpart optical connector 3 can be fitted. One or more (here, two in accordance with the number of optical fibers 3b of the counterpart optical connector 3) sleeve portions 9e project from the bottom surface (back surface) of the connecting tube portion 9b. Each sleeve portion 9e is formed in a substantially cylindrical shape having a cylindrical hole 9g into which the corresponding ferrule portion 3a of the counterpart optical connector 3 can be inserted and communicated with the substrate housing recess 9d.

そして、この接続筒部9bに相手側光コネクタ3が接続されると、まず、相手側光コネクタ3は、接続筒部9bの内周面に沿って大まかに案内されて挿入される。そして、相手側光コネクタ3がより奥に挿入されると、相手側光コネクタ3の各フェルール部3aが、接続筒部9b内の対応するスリーブ部9eの筒孔9gの内周面に沿って精密に案内されて挿入される。そして、相手側光コネクタ3が接続筒部9bの最も奥に挿入されると、相手側光コネクタ3の各光ファイバ3bの端面3cは、対応するスリーブ部9eの筒孔9gにおける基板収容凹部9d側の開口面上の所定位置に位置決めされて配置され、この状態で、後述の様に基板収容凹部9dに収容配設される配線基板7上の対応する光素子5の受発光部5dと対向して、両者3c,5dの光学的な結合がなされる。   When the counterpart optical connector 3 is connected to the connection cylinder portion 9b, first, the counterpart optical connector 3 is roughly guided and inserted along the inner peripheral surface of the connection cylinder portion 9b. And when the other party optical connector 3 is inserted in the back, each ferrule part 3a of the other party optical connector 3 follows the inner peripheral surface of the cylindrical hole 9g of the corresponding sleeve part 9e in the connection cylinder part 9b. Inserted with precise guidance. When the counterpart optical connector 3 is inserted into the innermost part of the connection cylinder portion 9b, the end face 3c of each optical fiber 3b of the counterpart optical connector 3 is connected to the substrate receiving recess 9d in the cylindrical hole 9g of the corresponding sleeve portion 9e. In this state, the light receiving / emitting portion 5d of the corresponding optical element 5 on the wiring substrate 7 accommodated and disposed in the substrate accommodating recess 9d as described later is disposed. Thus, the optical coupling of both 3c and 5d is performed.

尚、図示省略されるが、接続筒部9bの内周面上には、例えば係止突起または係止凹部の一方が形成され、相手側光コネクタ3の外側面上には、例えば係止突起または係止凹部の他方が形成されており、相手側光コネクタ3が接続筒部9bの最も奥に挿入されると、両者3,9bの係止突起および係止凹部が互いに係合して、これにより両者3,9bの接続状態が保持されるものとする。   Although not shown, for example, one of a locking projection or a locking recess is formed on the inner peripheral surface of the connecting tube portion 9b, and for example, a locking projection is formed on the outer surface of the counterpart optical connector 3. Alternatively, the other of the locking recesses is formed, and when the counterpart optical connector 3 is inserted into the innermost part of the connecting tube portion 9b, the locking projections and the locking recesses of both 3 and 9b are engaged with each other, Thereby, the connection state of both 3 and 9b shall be hold | maintained.

基板収容凹部9dの開口部(即ちハウジング9の他端開口部)9cの寸法は、配線基板7の平面視寸法よりも少し大きめの寸法に形成される。基板収容凹部9dの奥行き(深さ)は、配線基板7の厚さと同じか、それよりも深く形成される。基板収容凹部9dの奥面9n上には、各光素子5における配線基板7から突出した部分5g(図5参照)がそれぞれ収容配置される素子収容凹部9fが形成される。そして、各素子収容凹部9fの奥面上にはそれぞれ、対応するスリーブ部9eの筒孔9gが連通される。   The size of the opening 9c of the substrate housing recess 9d (that is, the opening of the other end of the housing 9) 9c is slightly larger than the plan view size of the wiring board 7. The depth (depth) of the substrate housing recess 9d is the same as or deeper than the thickness of the wiring substrate 7. On the back surface 9n of the substrate housing recess 9d, there are formed element housing recesses 9f in which the portions 5g (see FIG. 5) protruding from the wiring board 7 in the respective optical elements 5 are respectively housed. And the cylindrical hole 9g of the corresponding sleeve part 9e is connected to the back surface of each element accommodating recessed part 9f, respectively.

また、基板収容凹部9d内には、図1および図5の様に、配線基板7のスリット部7hと嵌合する例えば板状の嵌合部9hが形成される。即ち、嵌合部9hのx方向の幅(壁厚)とスリット部7hのx方向の幅(スリット幅)とは、ほぼ同一寸法に形成される。ここでは、この嵌合部9hは、例えば基板収容凹部9dを左右に2分する様に縦方向(y方向)に沿って基板収容凹部9dの奥面9n上に立設されており、その一端部9i側が基板収容凹部9dの上側の内側面9j上に連成されると共に、その他端部9kが基板収容凹部9dの下側の内側面9mと所定間隔(配線基板7のくびれ部7jの幅と同じ幅)空けて対向する様に形成される。尚、嵌合部9hの後端面9pは、基板収容凹部9dの後端面(開口面)9qより突出しない様に形成される。   Further, as shown in FIGS. 1 and 5, for example, a plate-like fitting portion 9 h that fits with the slit portion 7 h of the wiring board 7 is formed in the substrate housing recess 9 d. That is, the width (wall thickness) in the x direction of the fitting portion 9h and the width in the x direction (slit width) of the slit portion 7h are formed to have substantially the same dimensions. Here, the fitting portion 9h is erected on the back surface 9n of the substrate housing recess 9d along the vertical direction (y direction) so as to divide the substrate housing recess 9d into left and right, for example. The portion 9i is coupled to the upper inner surface 9j of the substrate housing recess 9d, and the other end 9k is spaced from the lower inner surface 9m of the substrate housing recess 9d by a predetermined distance (the width of the constricted portion 7j of the wiring substrate 7). And the same width). The rear end surface 9p of the fitting portion 9h is formed so as not to protrude from the rear end surface (opening surface) 9q of the substrate housing recess 9d.

そして、この基板収容凹部9dに配線基板7を配設するには、図1および図5を参照して、配線基板7の光素子5側主面が基板収容凹部9dの奥面9n上に当接する様に、且つ配線基板7のスリット部7hが基板収容凹部9dの嵌合部9hに嵌合する様にして、配線基板7を基板収容凹部9d内に収容配置させる。これにより、配線基板7に実装された光素子5が基板収容凹部9dの素子収容凹部9f内に収容配置される。そして、(1)配線基板7のスリット部7hが基板収容凹部9dの嵌合部9hに嵌合すると共に(2)配線基板7のくびれ部7jが基板収容凹部9dの下側内側面9mと嵌合部9hの他端部9kとの間の所定間隔内に嵌合して、配線基板7が基板収容凹部9d内の所定位置(各光素子5の受発光部5dの中心部の位置と、対応するスリーブ部9e内の光ファイバ3bの端面3cの中心部の位置とが一致する位置)に位置決めされて配設される。特に、上記(1)の嵌合により、配線基板7における基板収容凹部9d内でのスリット部7hに直交する方向(x方向)の位置が所定位置に位置決めされる。また、上記(2)の嵌合により、配線基板7における基板収容凹部9d内でのスリット部7hに平行な方向(y方向)の位置が所定位置に位置決めされる。この様にして、配線基板7が基板収容凹部9d内の所定位置に位置決めされて配設される。   In order to dispose the wiring board 7 in the board housing recess 9d, referring to FIGS. 1 and 5, the optical element 5 side main surface of the wiring board 7 is placed on the back surface 9n of the board housing recess 9d. The wiring substrate 7 is accommodated and disposed in the substrate accommodating recess 9d so that the slit portion 7h of the wiring substrate 7 is fitted into the fitting portion 9h of the substrate accommodating recess 9d so as to be in contact with each other. Thereby, the optical element 5 mounted on the wiring board 7 is accommodated in the element accommodating recess 9f of the substrate accommodating recess 9d. (1) The slit portion 7h of the wiring board 7 is fitted into the fitting portion 9h of the board housing recess 9d, and (2) the constricted portion 7j of the wiring board 7 is fitted with the lower inner side surface 9m of the board housing recess 9d. The wiring board 7 is fitted within a predetermined interval between the other end portion 9k of the joint portion 9h, and the wiring board 7 is located at a predetermined position in the substrate housing recess 9d (the position of the central portion of the light emitting / receiving portion 5d of each optical element 5). The corresponding sleeve portion 9e is positioned and disposed at a position where the position of the center portion of the end face 3c of the optical fiber 3b coincides. In particular, the position in the direction (x direction) orthogonal to the slit portion 7 h in the board housing recess 9 d in the wiring board 7 is positioned at a predetermined position by the fitting in (1) above. Moreover, the position (y direction) parallel to the slit part 7h in the board | substrate accommodation recessed part 9d in the wiring board 7 is positioned by the fitting of said (2) in a predetermined position. In this way, the wiring board 7 is positioned and arranged at a predetermined position in the board housing recess 9d.

尚、図示省略されるが、例えば基板収容凹部9dの内側面上における開口部9c付近に係止突起が複数形成されており、配線基板7が上記の様に基板収容凹部9d内の所定位置に収容配置されると、基板収容凹部9dの当該各係止突起が配線基板7の他側主面(背面)に係合して、これにより配線基板7が基板収容凹部9d内に上記の状態で収容保持されるものとする。または、例えば基板収容凹部9dの奥面9n上に係止フックが立設されると共に配線基板7に係止孔が形成されており、配線基板7が上記の様に基板収容凹部9d内の所定位置に収容配置されると、両者7,9dの係止フックと係止孔とが係合して、これにより配線基板7が基板収容凹部9d内に上記の状態で収容保持されるものとする。   Although not shown, for example, a plurality of locking projections are formed in the vicinity of the opening 9c on the inner side surface of the substrate housing recess 9d, and the wiring board 7 is placed at a predetermined position in the substrate housing recess 9d as described above. When accommodated and disposed, each of the locking projections of the substrate accommodating recess 9d engages with the other main surface (back surface) of the wiring board 7, whereby the wiring substrate 7 is placed in the substrate accommodating recess 9d in the above state. It shall be contained and held. Alternatively, for example, a latching hook is erected on the back surface 9n of the substrate housing recess 9d and a latching hole is formed in the wiring substrate 7, and the wiring substrate 7 has a predetermined inside of the substrate housing recess 9d as described above. When placed in the position, the locking hooks and the locking holes of the both 7 and 9d are engaged, whereby the wiring board 7 is received and held in the board receiving recess 9d in the above state. .

以上の様に構成された光コネクタ構造1によれば、光素子5が、その外周側面上の複数箇所にそれぞれ形成された凸部5cがそれぞれ、配線基板7の素子収容凹部7aの内周側面上の対応する複数箇所にそれぞれ形成された凹部7cに嵌合することにより、素子収容凹部7a内の所定位置に位置決めされて配設されるので、光素子5を配線基板7上の所定位置に位置決め精度を高めて実装できる。   According to the optical connector structure 1 configured as described above, the convex portions 5c formed at a plurality of locations on the outer peripheral side surface of the optical element 5 are respectively the inner peripheral side surfaces of the element housing concave portions 7a of the wiring board 7. The optical element 5 is placed at a predetermined position on the wiring board 7 because the optical element 5 is positioned and arranged at a predetermined position in the element receiving concave portion 7a by fitting into the concave portions 7c formed at a plurality of corresponding positions on the upper side. Can be mounted with higher positioning accuracy.

また、光素子5が、その一方の相対する各外側面5e間が素子収容凹部7a内の一方の相対する各内側面7d間に嵌合すると共に、その各外側面5eに形成された凸部5cが素子収容凹部7a側の各内側面7dに形成された凹部7cと嵌合することにより、素子収容凹部7a内の所定位置に位置決めされて配設されるので、光素子5と素子収容凹部7a間とが一方の方向に関してしか位置決め状に嵌合できない場合でも、凹部7cと凸部5cとの嵌合を組み合わせて有効に光素子5を素子収容凹部7a内の所定位置に位置決め精度を高めて実装できる。   Further, the optical element 5 is fitted between the one opposing inner side surfaces 7d in the element accommodating recess 7a between the one opposing outer side surfaces 5e, and the convex portions formed on the respective outer side surfaces 5e. The optical element 5 and the element accommodating concave portion 5c are positioned and arranged at a predetermined position in the element accommodating concave portion 7a by fitting with the concave portions 7c formed on the inner side surfaces 7d on the element accommodating concave portion 7a side. Even when the distance between the two elements 7a can be fitted only in one direction, the optical element 5 can be effectively positioned at a predetermined position in the element accommodating concave part 7a by combining the fitting of the concave part 7c and the convex part 5c. Can be implemented.

また、光素子5が配線基板7の素子収容凹部7a内の所定位置に位置決めされて配置された状態で、素子収容凹部7a側の電極部7fと光素子5側の電極部5fとがリフロー接続用の隙間を空けて対向する様に、配線基板7の内側面7dと光素子5の外側面5eとを隙間を空けて対向させる場合においても、その条件を満たして光素子5を配線基板7上の所定位置に位置決め精度を高めて実装できる。   In addition, in a state where the optical element 5 is positioned and arranged at a predetermined position in the element accommodating recess 7a of the wiring substrate 7, the electrode portion 7f on the element accommodating recess 7a side and the electrode portion 5f on the optical element 5 side are connected by reflow connection. Even when the inner surface 7d of the wiring board 7 and the outer surface 5e of the optical element 5 are opposed to each other with a gap so as to face each other with a gap therebetween, the optical element 5 is satisfied by satisfying that condition. It can be mounted at a predetermined position above with higher positioning accuracy.

この様にして、上記の様に光素子5が配線基板7に形成された素子収容凹部7a内に配置されることにより、光素子5が配線基板7から突出することを抑制でき、光素子5を実装した配線基板7を薄型化できる。また、上記の様に配線基板7の素子収容凹部7aの内側面に配設された電極部7fと光素子5の外側面に配設された電極部5fとがリフロー接続用の隙間を空けて対向する様に、配線基板7の前記内側面と光素子5の前記外側面とが隙間を空けて対向されることにより、リフロー半田を配線基板7の素子収容凹部7aと光素子5との間の隙間に集中でき、これによりリフロー半田が半田を必要としない周囲部分に流れることを防止でき、半田を有効に用いて電極部間をリフロー接続できる。   Thus, by arranging the optical element 5 in the element accommodating recess 7a formed in the wiring board 7 as described above, it is possible to suppress the optical element 5 from protruding from the wiring board 7, and the optical element 5 The wiring board 7 mounted with can be reduced in thickness. Further, as described above, the electrode portion 7f disposed on the inner side surface of the element accommodating recess 7a of the wiring substrate 7 and the electrode portion 5f disposed on the outer side surface of the optical element 5 provide a gap for reflow connection. The inner surface of the wiring board 7 and the outer surface of the optical element 5 are opposed to each other with a gap therebetween so that the reflow soldering is performed between the element housing recess 7 a of the wiring board 7 and the optical element 5. Therefore, the reflow solder can be prevented from flowing to the peripheral portion where no solder is required, and the reflow connection can be made between the electrode portions by using the solder effectively.

また、凸部5cまたは凹部7cが、配線基板7の側面上または光素子5の側面上に形成されるので、凸部5cの高さ分または凹部7cの深さ分、配線基板7や光素子5が厚くなることを防止でき、光素子5を実装した配線基板7を薄型化できる。   Further, since the convex portion 5c or the concave portion 7c is formed on the side surface of the wiring substrate 7 or the side surface of the optical element 5, the height of the convex portion 5c or the depth of the concave portion 7c, the wiring substrate 7 or the optical element. 5 can be prevented from becoming thick, and the wiring board 7 on which the optical element 5 is mounted can be made thinner.

また、配線基板7にスリット部7hが形成されると共にハウジング9に嵌合部9hが形成されて、それらスリット部7hと嵌合部9hとが嵌合することにより配線基板7がハウジング9の所定位置に位置決めされて配設されるので、配線基板7をハウジング9の所定位置に位置決め精度を高めて配設できる。   Further, a slit portion 7 h is formed in the wiring board 7 and a fitting portion 9 h is formed in the housing 9, and the wiring substrate 7 is fixed to the housing 9 by fitting the slit portion 7 h and the fitting portion 9 h. Since the wiring board 7 is disposed at the position, the wiring board 7 can be disposed at a predetermined position of the housing 9 with high positioning accuracy.

また、スリット部7hが、配線基板7にくびれ部7jが形成される様に配線基板7の縁側から切り込まれて形成され、嵌合部9hが、ハウジング9の基板収容凹部9d内において、その一端部9iが基板収容凹部9dの相対する各内側面9j,9mのうちの一方の内側面9jに連成されると共に、その他端部9kが相対する各内側面9j,9mのうちの他方の内側面9mと所定間隔空けて対向された板状に形成され、配線基板7は、そのスリット部7hが基板収容凹部9dの嵌合部9hに嵌合すると共にそのくびれ部7jが基板収容凹部9dの他方の内側面9mと嵌合部9hの他端部9kとの間の前記所定間隔内に嵌合することにより、基板収容凹部9d内の所定位置に位置決めされて配設されるので、簡単な構造で配線基板7をハウジング9の所定位置に位置決め精度を高めて配設できる。   In addition, the slit portion 7h is formed by being cut from the edge side of the wiring substrate 7 so that the constricted portion 7j is formed in the wiring substrate 7, and the fitting portion 9h is formed in the substrate accommodating recess 9d of the housing 9 One end portion 9i is coupled to one inner side surface 9j of each of the inner side surfaces 9j and 9m facing each other of the substrate housing recess 9d, and the other end portion 9k is opposed to the other of the inner side surfaces 9j and 9m facing each other. The wiring board 7 is formed in a plate shape facing the inner side surface 9m with a predetermined interval, and the slit portion 7h of the wiring board 7 is fitted into the fitting portion 9h of the substrate receiving recess 9d, and the constricted portion 7j thereof is the substrate receiving recess 9d. By being fitted within the predetermined interval between the other inner side surface 9m of the other and the other end portion 9k of the fitting portion 9h, it is positioned and arranged at a predetermined position in the substrate housing recess 9d. Housing the wiring board 7 with a simple structure Possible arrangement and to enhance the positioning accuracy in position.

尚、この実施の形態では、光素子5側に凸部5cを形成すると共に配線基板7側に凹部7cを形成したが、それら凸部と凹部を逆にして、光素子5側に凹部7cを形成すると共に配線基板7側に凸部5cを形成してもい。   In this embodiment, the convex portion 5c is formed on the optical element 5 side and the concave portion 7c is formed on the wiring board 7 side. However, the concave portion 7c is formed on the optical element 5 side by reversing the convex portion and the concave portion. The protrusion 5c may be formed on the wiring board 7 side as well as formed.

本発明の実施の形態に係る光コネクタ構造の概略分解斜視図である。1 is a schematic exploded perspective view of an optical connector structure according to an embodiment of the present invention. 本発明の実施の形態に係る光コネクタ構造における光素子および配線基板の分解斜視図である。It is a disassembled perspective view of the optical element and wiring board in the optical connector structure which concerns on embodiment of this invention. 図1のIII−III断面の部分断面図である。It is a fragmentary sectional view of the III-III cross section of FIG. 本発明の実施の形態に係る光コネクタ構造における光素子を実装した配線基板の部分平面視図である。It is a partial top view of the wiring board which mounted the optical element in the optical connector structure concerning embodiment of this invention. 図1のV-V断面図である。It is VV sectional drawing of FIG. 従来の光コネクタ構造における光素子および配線基板の分解斜視図である。It is a disassembled perspective view of the optical element and wiring board in the conventional optical connector structure.

符号の説明Explanation of symbols

1 光コネクタ構造
3 相手側光コネクタ
3b 光ファイバ
3c 光ファイバ端面
5 光素子
5b 一方の相対する各外側面
5c 凸部
5e 他方の相対する各外側面
5f 電極部
7 配線基板
7a 素子収容凹部
7b 一方の相対する各内側面
7c 凹部
7d 他方の相対する各内側面
7f 電極部
7h スリット部
7i 半田ペースト
7j くびれ部
9 ハウジング
9d 基板収容凹部
9h 嵌合部
9i 嵌合部の一端面
9k 嵌合部の他端面
9m 下側の内側面
DESCRIPTION OF SYMBOLS 1 Optical connector structure 3 Opposite side optical connector 3b Optical fiber 3c Optical fiber end surface 5 Optical element 5b Each opposing outer surface 5c Convex part 5e The other opposing outer surface 5f Electrode part 7 Wiring board 7a Element accommodating recessed part 7b One Respective inner side surfaces 7c Recessed portion 7d The other opposite inner side surfaces 7f Electrode portion 7h Slit portion 7i Solder paste 7j Constricted portion 9 Housing 9d Substrate housing recessed portion 9h Fitting portion 9i One end surface of fitting portion 9k of fitting portion The other side 9m Lower inner side

Claims (5)

所定の相手側光コネクタと着脱自在に接続され、その相手側光コネクタと光結合する光素子が配線基板上に実装されて備えられる光コネクタの構造であって、
前記光素子の外周側面上の複数箇所にそれぞれ凸部または凹部の一方が形成されると共に、前記配線基板の実装面上に素子収容凹部が形成されて、その素子収容凹部の内周側面上の対応する複数箇所にそれぞれ凸部または凹部の他方が形成され、
前記光素子は、その外周側面上の前記複数箇所にそれぞれ形成された前記凸部または凹部の一方がそれぞれ、前記素子収容凹部の内周側面上の対応する前記複数箇所にそれぞれ形成された前記凸部または凹部の他方に嵌合することにより、前記素子収容凹部内の所定位置に位置決めされて配設されることを特徴とする光コネクタ構造。
A structure of an optical connector that is detachably connected to a predetermined counterpart optical connector, and is provided with an optical element that is optically coupled to the counterpart optical connector mounted on a wiring board,
One of a convex portion or a concave portion is formed at each of a plurality of locations on the outer peripheral side surface of the optical element, and an element accommodating concave portion is formed on the mounting surface of the wiring board, on the inner peripheral side surface of the element accommodating concave portion. The other of the convex portion or the concave portion is formed at each of a plurality of corresponding locations,
In the optical element, one of the convex portion or the concave portion formed at each of the plurality of locations on the outer peripheral side surface of the optical element is respectively formed at the corresponding plurality of locations on the inner peripheral side surface of the element receiving concave portion. An optical connector structure characterized in that the optical connector structure is positioned and disposed at a predetermined position in the element receiving recess by being fitted to the other of the portion and the recess.
前記光素子の一方の相対する各外側面上に前記凸部または凹部の一方が形成されると共に、前記配線基板の前記素子収容凹部の一方の相対する各内側面上に前記凸部または凹部の他方が形成され、
前記光素子は、その前記一方の相対する各外側面間が前記素子収容凹部の前記一方の相対する各内側面間に嵌合すると共に、その前記凸部または凹部の一方が前記素子収容凹部側の前記凸部または凹部の他方と嵌合することにより、前記素子収容凹部内の所定位置に位置決めされて配設されることを特徴とする請求項1に記載の光コネクタ構造。
One of the convex portions or concave portions is formed on one outer surface of each of the optical elements, and the convex portion or concave portions of each of the inner surfaces of the element housing concave portion of the wiring board are opposed to each other. The other is formed,
The optical element is fitted between the one opposing inner side surfaces of the element receiving recess between the one opposing outer surfaces, and one of the convex portion or the concave portion is on the element receiving recess side. 2. The optical connector structure according to claim 1, wherein the optical connector structure is positioned and disposed at a predetermined position in the element housing recess by fitting with the other of the protrusion or the recess.
前記光素子の外側面上に電極部が配設されると共に、前記配線基板の前記素子収容凹部の内側面上に前記光素子側の前記電極部とリフロー接続される電極部が配設され、
前記光素子が前記配線基板の前記素子収容凹部内の前記所定位置に位置決めされて配設された状態で、前記光素子側の前記電極部と前記配線基板側の前記電極部との間にリフロー接続用の隙間が確保される様に、前記光素子の前記外側面と前記配線基板の前記内側面とが隙間を空けて対向することを特徴とする請求項1または請求項2に記載の光コネクタ構造。
An electrode portion is disposed on the outer surface of the optical element, and an electrode portion that is reflow-connected to the electrode portion on the optical element side is disposed on the inner surface of the element housing recess of the wiring board,
The optical element is reflowed between the electrode part on the optical element side and the electrode part on the wiring board side in a state where the optical element is positioned and arranged at the predetermined position in the element receiving recess of the wiring board. 3. The light according to claim 1, wherein the outer surface of the optical element and the inner surface of the wiring board face each other with a gap so that a connection gap is secured. Connector structure.
前記相手側光コネクタが着脱自在に嵌合されるハウジングを更に備え、
前記配線基板にスリット部が形成され、前記ハウジングに前記スリット部に嵌合する嵌合部が形成され、前記スリット部と前記嵌合部とが嵌合することにより前記配線基板が前記ハウジングの所定位置に位置決めされて配設されることを特徴とする請求項1〜請求項3の何れかに記載の光コネクタ構造。
Further comprising a housing in which the counterpart optical connector is detachably fitted,
A slit portion is formed in the wiring board, and a fitting portion that fits into the slit portion is formed in the housing, and the wiring substrate fits the predetermined portion of the housing by fitting the slit portion and the fitting portion. The optical connector structure according to any one of claims 1 to 3, wherein the optical connector structure is disposed at a position.
前記スリット部は、前記配線基板にくびれ部が形成される様に前記配線基板の縁側から切り込まれて形成され、
前記ハウジングに、前記配線基板が収容配設される基板収容凹部が形成され、
前記嵌合部は、前記基板収容凹部内において、その一端部が前記基板収容凹部の相対する各内側面のうちの一方の内側面に連成されると共に、その他端部が前記相対する各内側面のうちの他方の内側面と所定間隔空けて対向された板状に形成され、
前記配線基板は、その前記スリット部が前記基板収容凹部の前記嵌合部に嵌合すると共にその前記くびれ部が前記基板収容凹部の前記他方の内側面と前記嵌合部の前記他端部との間の前記所定間隔内に嵌合することにより、前記基板収容凹部内の前記所定位置に位置決めされて配設されることを特徴とする請求項4に記載の光コネクタ構造。
The slit portion is formed by cutting from the edge side of the wiring board so that a constriction is formed in the wiring board,
The housing is formed with a substrate housing recess in which the wiring board is housed and disposed.
One end of the fitting portion is coupled to one inner surface of the opposing inner surfaces of the substrate receiving recess, and the other end of each of the fitting portions is connected to each of the opposing inner surfaces. It is formed in a plate shape facing the other inner side surface of the side surfaces with a predetermined interval,
In the wiring board, the slit portion is fitted into the fitting portion of the substrate receiving recess, and the constricted portion is the other inner surface of the substrate receiving recess and the other end portion of the fitting portion. 5. The optical connector structure according to claim 4, wherein the optical connector structure is positioned and disposed at the predetermined position in the substrate housing recess by being fitted within the predetermined interval between.
JP2004120109A 2004-04-15 2004-04-15 Optical connector structure Pending JP2005301114A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009003253A (en) * 2007-06-22 2009-01-08 Hitachi Ltd Structure of opto-electric hybrid board and opto-electric package
JP2012194401A (en) * 2011-03-16 2012-10-11 Nitto Denko Corp Opto-electric hybrid substrate and manufacturing method of the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009003253A (en) * 2007-06-22 2009-01-08 Hitachi Ltd Structure of opto-electric hybrid board and opto-electric package
US8374470B2 (en) 2007-06-22 2013-02-12 Hitachi, Ltd. Structure comprising opto-electric hybrid board and opto-electric package
JP2012194401A (en) * 2011-03-16 2012-10-11 Nitto Denko Corp Opto-electric hybrid substrate and manufacturing method of the same
US9265141B2 (en) 2011-03-16 2016-02-16 Nitto Denko Corporation Opto-electric hybrid board and manufacturing method therefor

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