JP2005294241A - Method for connecting bus bar to conductive member, and bus bar - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for easily connecting a bus bar to a conductive member, and to provide the bus bar. <P>SOLUTION: Terminal sections 12a, 12b, and 12c have retention sections 21a, 21b, 21c, 21d, and 21e, 12f. In the retention sections, and the clearance of the retention sections to an opposite retention section becomes narrower toward the tip side. For example, in the case of the retention sections 21a, 21b, the clearance between tip sections 22a, 22b is the same as or is narrower than the diameter of a lead 31a. With the connection to a semiconductor device 30, the lead 31a is passed through a through hole 26a at a substrate section 25 toward the retention sections 21a, 21b. When a mold resin 32 in the semiconductor device 30 comes into contact with a spacer 42, the lead 31a is sandwiched by the tip sections 22a, 22b. In this state, welding is made. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for connecting a bus bar and a conductive member, and a bus bar.

  A bus bar (or bus bar) is a kind of wiring for constituting an electric circuit, and is mainly used for the purpose of lowering wiring impedance. By the way, welding is generally used for connection between the bus bar and another conductive member such as a lead or tab terminal of an electronic component or between the bus bars.

  Below, an example of the connection method by a prior art is shown. FIG. 8 is a perspective view showing a method of connecting a bus bar and another conductive member in the prior art. In FIG. 8, 50 is a welding site, and 51 and 52 are bus bars.

  In this method, the bus bar 51 and the bus bar 52 are first butted together, and then the state of being abutted using a clip or the like (not shown) is held. And the welding site | part 50 is welded by laser welding (for example, refer patent document 1). Note that welding may be performed by spot welding or the like. In any case, such a connection method has an advantage that it can be widely applied to connection with other conductive members such as leads of electronic parts.

However, in this connection method, since it is necessary to hold the conductive members to be connected to each other, it is difficult to say that the method is high in work efficiency. In addition, when one or both of the conductive members are thin, there is also a problem that welding cannot be reliably performed unless matching is performed accurately.
JP 10-334957 A

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a method for connecting a bus bar to a conductive member and a bus bar, and a method for easily connecting the bus bar to the conductive member.

  As a means for solving the above-mentioned problems, the present invention provides a method for connecting a bus bar and a conductive member to electrically connect the bus bar and the conductive member, and a first surface of the base portion on the base portion of the bus bar. A first procedure for forming a through hole or a slit penetrating between the first surface and the second surface, and an opening of the through hole or the slit between the first surface side of the base portion And forming a first holding portion and a second holding portion facing each other with a gap that is the same as the diameter or width of the conductive member or smaller than the diameter or width of the conductive member. , A third procedure for inserting the conductive member into the through hole or the slit from the second surface side of the base portion, and the first holding portion of the conductive member that has passed through the through hole or the slit. Part and said A fourth procedure for holding the conductive member between the first holding part and the second holding part by inserting between the conductive member, the first holding part, and the second holding part. And a fifth procedure for connecting the second holding portion by welding or soldering.

  Therefore, according to the above means, the alignment can be facilitated by passing the conductive member through the through hole of the bus bar, and further, the first holding portion and the second holding portion of the bus bar hold the conductive member so as to hold the clip. It is not necessary to keep the butted state. The width of the conductive member in the above means is the width of the cross section that appears when the conductive member is cut in parallel to the first surface of the base portion with respect to the arrangement direction of the first holding portion and the second holding portion. Means.

  Further, in the above means according to the present invention, in the above means, the second procedure may include two predetermined portions positioned so as to sandwich the through hole of the base portion or the opening of the slit between the first portion of the base portion. The first holding part and the second holding part can be formed by bending to the surface side.

  Furthermore, in the above-mentioned means, there is a recess formation procedure for forming recesses in the two predetermined portions of the base body between the first procedure and the second procedure, and the fourth procedure includes the step of A part of the lead that has passed through the through hole or the slit may be inserted into the recesses of the first holding part and the second holding part formed by the recess forming procedure.

  In addition, in the above means, the second procedure includes bending the portions of the first holding portion and the second holding portion at a predetermined height so that these holding portions come closer to each other. it can.

  Further, in the above means, the second procedure may include bending the portions of the first holding portion and the second holding portion at a predetermined height so that the holding portions come closer to each other. it can.

  Further, the present invention provides a bus bar having a base portion and a terminal portion that is integrally formed with the base portion and can be electrically connected to the conductive member, wherein the base portion is a first surface of the base portion. A through-hole having a diameter larger than the diameter or width of the conductive member or a slit having a large width, and the terminal portion on the first surface side of the base portion; A first holding that stands up with the through hole or the opening of the slit in between and faces each other with a gap equal to or smaller than the diameter or width of the conductive member. And a second holding part.

  Therefore, according to the above means, alignment can be facilitated by passing the conductive member through the through hole or slit of the bus bar, and the terminal part itself has a holding function of the conductive member, so it is necessary to hold the butt state by a clip or the like. There is no bus bar. The width of the conductive member in the above means is the width of the cross section that appears when the conductive member is cut in parallel to the first surface of the base portion with respect to the arrangement direction of the first holding portion and the second holding portion. Means.

  Further, in the above means, the terminal portion is formed by bending two predetermined portions between the through hole of the base portion or the opening portion of the slit to the first surface side of the base portion. Can be formed.

  Further, in the above means, the first holding part and the second holding part can be formed by forming a concave part into which a part of the conductive member can be put in a part near the tip.

  In addition, in the above-described means, the first holding part and the second holding part can be bent so as to approach each other at a portion having a predetermined height.

  According to the present invention, since the bus bar and the conductive member can be easily connected, the productivity of an electronic device or the like using the bus bar can be improved.

  The present invention has a great feature in the method of connecting the bus bar and the conductive member and in the bus bar, where the terminal portion of the bus bar holds the conductive member such as the lead of the electronic component. Also, when inspecting the welded portion between the bus bar and the conductive member, there is a feature that there is little thing covering the portion and the visibility is good.

  Hereinafter, embodiments having this feature will be described in detail with reference to the drawings. Further, in the following description, a method for connecting the lead of the semiconductor element to the terminal portion of the bus bar will be taken up. However, the present invention is not limited to the lead of the semiconductor element, but other conductivity such as when connecting another bus bar. It can be preferably applied to the connection of members. The present invention is not limited to the examples described below, and various modifications can be made without departing from the scope described in each claim. For example, the detailed portions related to the width and shape of the holding portion are not limited to those described as examples, and the structure and the like can be changed within the scope described in each claim.

  FIG. 1 is a perspective view showing a method of connecting a bus bar and leads according to Embodiment 1 of the present invention. In FIG. 1, 12a, 12b, and 12c are terminal portions, 21a, 21b, 21c, 21d, 21e, and 21f are holding portions, 22a and 22b are front end portions, 24a and 24b are notched portions, 25 is a base portion, and 30. Is a semiconductor element, 31a, 31b and 31c are leads, 32 is a mold resin, and 42 is a spacer.

  FIG. 1 shows a state where the three leads 31a, 31b, 31c of the semiconductor element 30 are held by the terminal portions 12a, 12b, 12c formed on the base portion 25 of the bus bar. The terminal portions 12a, 12b, and 12c include a holding portion 21a and a holding portion 21b that are formed to face each other, a holding portion 21c and a holding portion 21d, and a holding portion 21e and a holding portion 12f. . That is, the leads 31a, 31b, and 31c are held by being inserted from the lower side between the holding portion 21a and the holding portion 21b, the holding portion 21c and the holding portion 21d, and the holding portion 21e and the holding portion 12f, respectively. Yes. Moreover, these terminal parts and holding | maintenance parts are each welded in this state.

  As will be described later, the base portion 25 and the terminal portions 12a, 12b, and 12c form part of a bus bar of the electrical component, and are formed of copper or a copper alloy. In addition, these are plated with tin in order to improve connectivity with other conductive members, corrosion resistance, and the like. The material of the base portion 25 or the like may be a metal other than copper or copper alloy as long as the wiring impedance is not high and the workability is good. The plating may be plating with other metals such as nickel. Further, the portion to be plated may be a part of the bus bar, for example, only the holding portions 21a, 21b, 21c, 21d, 21e, and 12f constituting the terminal portion.

  The base portion 25 is a main conductive path of the bus bar, and at the same time, is a portion serving as a base for providing the terminal portions 12a, 12b, and 12c. As will be described later, through holes are formed through which the leads 31a, 31b, 31c of the semiconductor element 30 are passed. In the embodiment shown in FIG. 1, the base portion 25 has a band shape, but any shape can be used as long as the terminal portions 12a, 12b, and 12c can be provided in the portion where the through hole is formed. There may be. In FIG. 1, a spacer 42 is provided on the surface opposite to the surface on which the terminal portions 12a, 12b, and 12c are provided, that is, the surface on the side where the mold resin 32 of the semiconductor element 30 is located. The spacer 42 holds a predetermined distance between the base portion 25 and the mold resin 32. Further, a through hole is provided in a portion where the lead 31a of the spacer 42 passes, and a portion where the lead 31b passes is formed as a groove-like recess.

  As described above, the terminal portions 12a, 12b, and 12c include the holding portion 21a and the holding portion 21b, the holding portion 21c and the holding portion 21d, and the holding portion 21e and the holding portion 12f, respectively. The gap between these holding portions and the holding portions facing each other is narrowed toward the tip side. In the case of the gap between the opposing holding portions, for example, the holding portion 21a and the holding portion 21b, the gap between the leading end portion 22a and the leading end portion 22b is equal to or smaller than the diameter of the lead 31a. It is said. Further, in consideration of securing the holding force of the holding portion 21a and the holding portion 21b with respect to the lead 31a and the ease of passing the lead 31a through the gap between the tip portion 22a and the tip portion 22b, the tip portion 22a and the tip portion 22b. Is smaller than the diameter of the lead 31a, and the lead 31a pressed against the tip 22a and the tip 22b is not bent so that the gap between the tip 22a and the tip 22b can be expanded. It is preferable that it is wider than this width.

  When the lead or other conductive member is formed in the shape of a square bar or a strip, the gap between the tip 22a and the tip 22b appears when the lead or the like is cut in parallel with the top surface of the base body 25. The width of the cross section is the same as or narrower than the width of the holding portion 21a and the holding portion 21b in the arrangement direction. Although FIG. 1 shows a state in which three terminal portions are gathered, only one can be provided independently, or a number other than three, such as two, four, etc., is gathered and provided. Of course it is also possible.

  Further, these holding portions are formed by bending, but in order to facilitate this processing, for example, in the case of the holding portion 21a, a notch portion 24a is formed. Cutout portions such as the cutout portions 24a are formed on both sides of the base end portions of these holding portions. Further, a groove-shaped recess shown in FIG. 3 to be described later is formed in a portion in contact with the lead on the tip side of these holding portions. The recess serves as a guide for inserting the lead and plays a role of increasing the certainty of welding and soldering. When the bus bar is formed of a material that can be bent easily, only one notch portion may be formed in the holding portion of the bus bar or may not be formed at all. In addition to forming these holding portions by bending, each holding portion may be formed separately and then attached to the base portion by welding or the like. In this method, the processing of the bus bar is considerably complicated, but it is an effective forming method when the base portion is very thick and bending is difficult. Further, the groove-shaped recess formed in the holding portion may be formed from the distal end to the proximal end of the holding portion.

  FIG. 2 is a perspective view showing a state where the bus bar according to the first embodiment of the present invention is applied to an electrical component. 2, 10a and 10b are bus bars, 11a and 11b are terminal portions, 40 is a resin case, 41 is an opening, 50 is an electrical component, and other reference numerals are the same as those in FIG. In addition, about the electrical component 50 and bus bar 10a, 10b, the description of the part which is not required for description of this Example is abbreviate | omitted.

  FIG. 2 shows an example in which the bus bar having the base portion 25 and the terminal portions 12a, 12b, and 12c shown in FIG. 1 is applied to an electrical component 50 that is an electronic component housing case. The electrical component 50 is a storage case for electronic components, and also has a role of a connector box that ensures electrical connection between the electronic components or between the electronic component and an external electrical device. The resin case 40 supports the bus bars 10a and 10b and covers a part of the bus bars 10a and 10b. Moreover, the opening part 41 is formed in a part of resin case 40, and the terminal part 11a and the terminal parts 12a, 12b, and 12c are arrange | positioned here. The resin case 40 can be manufactured by placing the bus bars 10a and 10b inside an injection mold and then injecting the resin into the mold. Further, a part of the resin case 40 may be used as the spacer 42 in FIG.

  Next, a method for manufacturing a bus bar and a method for connecting semiconductor elements will be described in detail. FIG. 3 is a perspective view showing the bus bar manufacturing method of the present invention. In FIG. 3, 23a, 23b, 23c, 23d, 23e, and 23f are recesses, 26a, 26b, and 26c are through holes, 27 is a copper plate, and the other symbols are the same as those in FIG. Moreover, FIG. 4 is explanatory drawing which shows the connection method of the bus bar of this invention, and a semiconductor element. In FIG. 4, 22a and 22b show a front-end | tip part, and another code | symbol shows the same thing as FIG.1 and FIG.3. Note that FIG. 4 shows only the terminal portion 12a for convenience of explanation.

  In the method for manufacturing a bus bar of the present invention, a copper plate 27 is first prepared as shown in FIG. Next, as shown in FIG. 3 (b), the copper plate 27 is punched out with a press die, and the entire outer shape and the through holes 26a. 26b and 26c are formed. Furthermore, it presses with another metal mold | die, and the recessed parts 23a, 23b, 23c, 23d, 23e, and 23f are formed. Next, as shown in FIG. 3 (c), the holding portions 21a, 21b, 21c, 21d, 21e, and 21f are bent by a bending mold to rise. At this time, the front ends of these holding portions have the gaps described above. In addition, since the above-mentioned notch part is formed in the base end side of holding | maintenance part 21a, 21b, 21c, 21d, 21e, 21f, it is easy to bend even if it is a thick copper plate. Further, although not shown in FIG. 3, the press working frame is cut and then plated. When the bus bar is completed through the above steps, it is assembled into the electrical component shown in FIG.

  As for the connection with the semiconductor element 30, as shown in FIG. 4A, the lead 31a is passed through the through hole 26a of the base portion 25 toward the holding portions 21a and 21b. By passing the lead 31a through the through hole 26a, the lead 31a can be easily guided to the gap between the tip portions 22a and 22b of the holding portions 21a and 21b. When the mold resin 32 and the spacer 42 of the semiconductor element 30 abut against each other, as shown in FIG. 4B, the lead 31a is held between the tip portions 22a and 22b. Further, as shown in FIG. 4C, the leading end side of the lead 31a is guided by the recesses 23a and 23b of the holding portions 21a and 21b, so that it does not protrude from the gap between the leading end portion 22a and the leading end portion 22b. .

  Next, in this state, welding or soldering is performed. If the lead 31a is not cut out in advance, it is cut according to the height of the holding portions 21a and 21b before welding or soldering. Since a part of the lead 31a is in a state of entering into the recesses 23a and 23b, the state of welding and soldering is improved, and the connection strength is improved. It should be noted that the welding or soldering range may be any part on the upper side of the holding part and may be performed from either direction as long as the electrical connection can be appropriately ensured. However, if the lead 31a is welded from above the holding portions 21a and 21b, there is no thing that obstructs the movement such as the soldering iron and the welding torch, so that the connection can be made easily. Further, the connection between the lead 31a and the holding portion 21a and the connection between the lead 31a and the holding portion 21b can be performed simultaneously.

  Further, welding is preferable to soldering as a connecting means between the lead 31a and the holding portions 21a and 21b. Furthermore, TIG (Tungsten Inert Gas) welding in which the size of the connection object is not limited is particularly preferable.

  As described above, since the lead is sandwiched and held at the tip of the holding portion, there is an advantage that it is not necessary to use a clip or the like. Furthermore, since there are few parts which have covered the lead | read | reed near the welding part in the state after welding, there also exists an advantage that a visual inspection is easy to do.

  FIG. 5 is a perspective view showing a method of connecting a bus bar and leads according to the second embodiment of the present invention. In FIG. 5, reference numerals 28a and 28b denote bent portions, and other reference numerals are the same as those in FIG.

  As shown in FIGS. 5A and 5B, in the second embodiment of the present invention, bent portions 28a and 28b are formed in the holding portions 21a and 21b. The bent portions 28a and 28b are formed by bending the holding portions 21a and 21b so that the distal ends of the holding portions 21a and 21b approach the lead 31a. The structure of the bus bar other than the bent part, the method of manufacturing the bus bar, and the method of connecting the holding part and the lead are the same as those in the first embodiment.

  Therefore, in this embodiment, in addition to the advantages of the first embodiment, the leading end side of the holding portion approaches the lead, so that the state of welding and soldering between the holding portion and the lead is better than that of the first embodiment. is there. However, the bus bar forming process is more complicated than the process of the first embodiment because the bent portion is formed in the holding portion. In addition, the bending part formed in one holding | maintenance part is good also as two places or more, if a holding | maintenance part and a lead can be brought close. Further, it is more preferable that the holding portion is bent so as to be close to each other at the bent portion which is a portion of these predetermined heights, and the portion above the bent portion is parallel to the lead which is the conductive member. In this way, there is an advantage that the upper part is closer to the lead than the bent part and the two can be welded more reliably.

  FIG. 6 is a perspective view showing a method of connecting a bus bar and leads according to the third embodiment of the present invention. Moreover, in FIG. 6, 29a, 29b shows an arc-shaped curved part, and other code | symbol shows the same thing as FIG.

  As shown in FIG. 6A, in Embodiment 3 of the present invention, arcuate curved portions 29a and 29b projecting left and right are formed near the tips of the holding portions 21a and 21b. As shown in FIG. 6B, the arc-shaped curved portions 29a and 29b are formed to have an arc-shaped surface that encloses the vicinity of the tip of the lead 31a, and the portions where the holding portions 21a and 21b contact the lead 31a. Is larger than that of the first embodiment.

  Therefore, in this embodiment, in addition to the advantages of the first embodiment, the retention of the holding portion with respect to the lead is improved, and the state of welding and soldering between the holding portion and the lead is better than that of the first embodiment. There are advantages. However, the bus bar forming process is more complicated than the process of the first embodiment because the bent portion is formed in the holding portion. In this embodiment, it is assumed that the lead is cylindrical. However, if the lead is a rectangular tube, the arc-shaped curved portions 29a and 29b have flat surfaces and corners that match the rectangular tube shape. Needless to say, it is formed to have. Further, when forming the arc-shaped curved portions 29a and 29b, it is necessary to consider so as not to prevent the insertion of the lead 31a even if they are in contact with the lead 31a.

  FIG. 7 is a perspective view showing a method of connecting a bus bar and leads according to Embodiment 4 of the present invention. In FIG. 7, reference numerals 45 and 46 denote slits, and other reference numerals are the same as those in FIG.

  As shown in FIGS. 7A and 7B, in Example 4 of the present invention, slits 45 and slits 46 are formed in the base portion 25 in place of the through holes, respectively. Furthermore, the slit 45 shown to Fig.7 (a) has reached to the edge part of the base | substrate part 25, and has not reached in FIG.7 (b).

  Therefore, in this embodiment, in addition to the advantages of the first embodiment, the lead of a semiconductor element or the like is flat and formed in a strip shape, or is suitable for connecting bus bars. Further, in the embodiment of FIG. 7A, the lead or the like is inserted from the opening portion of the base portion 25, that is, the lead or the like is moved in the horizontal direction toward the terminal portions 11a and 11b and inserted. Is possible. In this case, the shape of the concave portion on the tip side of the holding portions 21h and 21g may be such that a lead or the like can be easily inserted from the front side, for example, a shape opened to the front side.

It is a perspective view which shows the connection method of the bus-bar and lead | read | reed which concerns on Example 1 of this invention. It is a perspective view which shows the state which applied the bus-bar which concerns on Example 1 of this invention to the electrical equipment. It is a perspective view which shows the manufacturing method of the bus bar of this invention. It is explanatory drawing which shows the connection method of the bus bar of this invention, and a semiconductor element. It is a perspective view which shows the connection method of the bus-bar and lead | read | reed which concerns on Example 2 of this invention. It is a perspective view which shows the connection method of the bus-bar and lead | read | reed which concerns on Example 3 of this invention. It is a perspective view which shows the connection method of the bus-bar and lead | read | reed which concerns on Example 4 of this invention. It is a perspective view which shows the connection method of the bus bar and another electrically-conductive member in a prior art.

Explanation of symbols

10a bus bar 10b bus bar 11a terminal part 11b terminal part 12a terminal part 12b terminal part 12c terminal part 20 electrical equipment 21a holding part 21b holding part 21c holding part 21d holding part 21e holding part 21f holding part 21h holding part 21g holding part 22a tip part 22b Tip 23a Recess 23b Recess 23c Recess 23c Recess 23d Recess 23e Recess 23f Recess 24a Notch 24b Notch 25 Base 26a Through Hole 26b Through Hole 27 Copper Plate 28a Bent 28b Bent 29a Arc Bent 29b Arc Bent 30 Semiconductor Element 31a Lead 31b Lead 31c Lead 32 Mold resin 40 Resin case 41 Opening 42 Spacer 45 Slit 46 Slit 50 Welded part 51 Bus bar 52 Bus bar

Claims (9)

In the method of connecting the bus bar and the conductive member to electrically connect the bus bar and the conductive member,
A first procedure for forming a through hole or a slit penetrating between the first surface and the second surface of the base portion in the base portion of the bus bar;
Stands on the first surface side of the base portion so that the opening of the through hole or the slit is positioned therebetween, and is the same as the diameter or width of the conductive member or larger than the diameter or width of the conductive member A second procedure for forming a first holding part and a second holding part facing each other with a small gap;
A third procedure for inserting the conductive member into the through hole or the slit from the second surface side of the base portion;
The conductive member is inserted into the first holding portion and the second holding portion by inserting a portion of the conductive member that has passed through the through hole or the slit between the first holding portion and the second holding portion. A fourth procedure of holding with the holding unit,
A fifth procedure for connecting the conductive member, the first holding part and the second holding part by welding or soldering;
A method for connecting a bus bar and a conductive member. The second procedure includes the step of bending the two predetermined portions between the through hole of the base portion or the opening of the slit toward the first surface side of the base portion. The method of connecting a bus bar and a conductive member according to claim 1, wherein the holding portion and the second holding portion are formed. Furthermore, between the 1st procedure and the 2nd procedure, it has a crevice formation procedure which forms a crevice in the two predetermined parts of the base part,
In the fourth procedure, a part of the lead that passes through the through-hole or the slit is inserted into the concave portions of the first holding portion and the second holding portion formed in the concave portion forming procedure. The connection method of the bus-bar and electrically-conductive member of Claim 2 characterized by the above-mentioned. The second procedure includes bending the portions of the first holding portion and the second holding portion at a predetermined height so that these holding portions come closer to each other. A method of connecting the described bus bar and the conductive member. Furthermore, between the second procedure and the third procedure, the portions that protrude from the left and right ends near the tips of the first holding part and the second holding part are shaped so as to wrap the conductive member. The method of connecting a bus bar and a conductive member according to claim 1, further comprising a bending procedure for bending. In a bus bar having a base portion and a terminal portion that is integrally formed with the base portion and can be electrically connected to a conductive member,
The base portion includes a through-hole having a diameter larger than a diameter or a width of the conductive member or a slit having a large width while penetrating between the first surface and the second surface of the base portion.
The terminal portion rises on the first surface side of the base portion so that the through hole or the opening of the slit is positioned therebetween, and has the same diameter or width as the conductive member, or of the conductive member. A bus bar comprising a first holding part and a second holding part facing each other with a gap smaller than a diameter or a width. The terminal portion is formed by bending two predetermined portions between the through hole of the base portion or the opening of the slit to the first surface side of the base portion. The bus bar according to claim 6. The said 1st holding | maintenance part and the said 2nd holding | maintenance part form the recessed part which can put in a part of said electrically-conductive member in the part near these front-end | tips, It is characterized by the above-mentioned. Bus bar. The bus bar according to claim 6, wherein the first holding portion and the second holding portion are bent so as to approach each other at a portion having a predetermined height.

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