JP2005285840A - Component transfer apparatus, surface mounting apparatus, and component testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component transfer apparatus, surface mounting apparatus, and component testing apparatus wherein an imaging means for imaging a suction point, etc. is installed in a head unit and imaging of the suction point, etc. can be effectively performed without causing any disadvantages such as a decline in working efficiency. <P>SOLUTION: In the surface mounting apparatus, a component mounting head 16 having a suction nozzle 16a at the lower end is mounted in the head unit 5 so that it can be moved up and down. The surface mounting apparatus includes an elevation/displacement mechanism 20 which displaces the component mounting head 16 horizontally with the rise and fall thereof. In the surface mounting apparatus, a camera 36 for recognizing a lower condition is so arranged that it may image a suction point, etc. located immediately below the suction nozzle 16a when the component mounting head 16 is located in the lower range of the vertical movement nearly from upward in the vertical direction. When the component mounting head 16 is in the upper range of the up and down movement, the head 16 will be out of a view of the camera 36. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention is applied to a component transport device configured to suck, hold, and transport an electronic component such as an IC by a head unit including a head that can be moved up and down with a suction nozzle at the lower end, and this device is applied. The present invention relates to a surface mounter and a component testing apparatus.

  Conventionally, a mounting head with a suction nozzle at the lower end can be moved up and down, and an electronic component such as an IC is sucked by a movable head unit and transported onto a printed circuit board positioned at the mounting work position. A surface mounter that is mounted at a predetermined position on a printed circuit board is generally known.

  In this surface mounting machine, an image pickup means for picking up an image of the component sucked by the suction nozzle of the mounting head is provided, and the suitability of the component pick-up state is determined based on the image of the pick-up component picked up by the image pickup means, It is generally performed to check the displacement of the suction position and correct the mounting position. For example, there is an apparatus in which an imaging unit including a camera or the like is provided on a base of a surface mounter so that the head unit moves onto the camera after picking up a component to perform imaging. Or what arrange | positioned the camera, the mirror, etc. to the head unit so that an adsorption | suction component can be imaged from the downward direction is also known (for example, refer patent document 1).

In addition, it has also been conventionally performed that a substrate recognition camera is provided in the head unit, and a fiducial mark attached to a printed circuit board is imaged by the camera to check the substrate position. (For example, refer to Patent Document 2). The substrate recognition camera is provided at the side end of the head unit so as not to interfere with the mounting head so as not to interfere with the mounting head.
JP 11-298198 A JP 2001-320159 A

  As described above, imaging of the component sucked by the suction nozzle of the mounting head and imaging of the fiducial mark of the printed circuit board has been conventionally performed. In addition, in the component supply unit, a feeder is mounted by the mounting head. It is desirable to pick up the pick-up point immediately before picking up the part from the pick-up, and to check the state of the pick-up point (presence / absence of the part, misalignment of the part, etc.) based on the image. It is desirable to capture the mounting point immediately before and after mounting the component on the printed board by the mounting head so that the state of the mounting point can be confirmed.

  However, in the past, it has been difficult to effectively capture the suction point and the mounting point.

  In other words, for example, it is conceivable to take an image of the suction point and the mounting point using the substrate recognition camera, but this camera is provided at the side end of the head unit avoiding the mounting head mounting portion. When picking up the pick-up point before and after picking up the component, the camera first moves the head unit to the position corresponding to the pick-up point and then picks up the image until the mounting head corresponds to the component. An operation is required in which the head unit is moved to pick up the components, and then the camera further moves the head unit to a position corresponding to the pickup point to perform imaging. The same applies to the case where the mounting point is imaged before and after component mounting. For this reason, there exists a problem of reducing mounting efficiency.

  The present invention has been made in view of the circumstances as described above, and includes an imaging unit that images a suction point or the like below the head. In particular, the suction point or the like without causing inconvenience such as a reduction in work efficiency. It is an object of the present invention to provide a component conveying device capable of effectively performing imaging, a surface mounter equipped with the device, and a component testing apparatus.

  In order to solve the above-described problems, the present invention provides a head having a suction nozzle at the lower end so that the head can be moved up and down, and sucks a component from a component supply position by the head of the head unit that is movable. In the component conveying device configured to convey the head up and down, when the head is above the head raising / lowering range, the head raising / lowering is performed so as to be offset horizontally with respect to the position when the head is below the head raising / lowering range. A lifting / displacement mechanism that displaces the head in the horizontal direction as the head moves up and down in at least a part of the range is provided, and an object to be imaged at a position directly below the suction nozzle when the head is below the head lifting range is substantially The head unit is provided with an image pickup means in which an imaging optical member is arranged so as to pick up an image from vertically above, and the head is raised. In a state in the upper range in which are configured to deviate from the visual field of the imaging means.

  According to this apparatus, the imaging object can be imaged by the imaging means in a state where the head is above the head lifting range, and the imaging object can be recognized based on the image. On the other hand, if the head is lowered, it is possible to suck parts. Therefore, it is possible to effectively perform imaging of the object to be imaged and suction of parts by moving the head up and down without moving the head unit.

  The lifting / displacement mechanism includes, for example, a guide portion that guides the head in an oblique direction with respect to the vertical direction, a ball screw disposed in parallel with the guide portion, and a motor that drives the ball screw. According to this structure, when the ball screw is driven by the motor, the head moves in an oblique direction along the guide, and is displaced in the horizontal direction as it moves up and down.

  Alternatively, the elevating / displacement mechanism includes an elevating body attached to the head unit so as to elevate in a substantially vertical direction, a drive mechanism for elevating the elevating body, and allowing the head to swing and displace relative to the elevating body. A parallel link mechanism to be coupled; and an operation cam that has an oblique cam surface and is fixed to the head unit. The cam surface of the operation cam when the head is raised and lowered. It may be comprised so that it may move along. According to this structure, the head moves along the cam surface of the follow-up operation cam as the elevating body moves up and down, so that the head is displaced in the horizontal direction along with the up and down movement.

  Alternatively, the elevating / displacement mechanism guides the head in an oblique direction with respect to the vertical direction, and has an orbital portion in which N-pole and S-pole magnetic poles are alternately arranged in the oblique direction, You may have a linear motor which consists of a core arrange | positioned in parallel and facing a magnetic pole, and the coil wound around this core. According to this structure, when a predetermined alternating current is passed through the coil, the head moves in an oblique direction along the track portion, and is displaced in the horizontal direction as it moves up and down.

  The component conveying apparatus as described above is effectively applied to a surface mounter.

  That is, in a surface mounter that transports a component supplied by a component supply unit onto a substrate positioned at a mounting work position and mounts the component at a predetermined position on the substrate, the component is transferred from the component supply unit onto the substrate. It is set as the structure provided with the above component conveyance apparatuses as a means.

  When applied to a surface mounting machine in this way, in the component supply unit, just before the head descends from above the ascending / descending range in order to adsorb the component at the adsorption point, and after the head adsorbs the component, the ascending / descending range It is preferable to control so that the suction point is imaged by the imaging means at least at one of the time immediately after rising upward.

  In this way, the pick-up point is imaged when the head is above the lifting range, and the component at the pick-up point is picked up when the head is lowered. In this way, the pickup point imaging and the component pickup are efficiently performed. And when imaging of the suction point is performed before component suction, based on the image, it is possible to check whether there is a component at the suction point, and if there is a component, check the positional displacement of the component, The component suction position can be corrected as necessary. When the pick-up point is imaged after picking up the component, it can be checked whether or not there is any pick-up error of the component by the head.

  Further, in the surface mounter, the head is raised immediately above the lifting range in order to mount the component on the mounting point of the substrate on the substrate, and the head is lifted above the lifting range after mounting the component. It is preferable that control is performed so that the mounting point is imaged by the imaging means at least at one of the time immediately after.

  In this way, the mounting point is imaged when the head is above the lifting range, and the component is mounted at the mounting point on the board when the head is lowered. In this way, mounting point imaging and component mounting are efficiently performed. If the mounting point is imaged before the component is picked up, the mounting position can be recognized, the mounting position can be corrected accordingly, and the soldering state or dirt of the mounting position can be checked. it can. When the mounting point is imaged after the component is picked up, it is possible to check whether the component has been mounted correctly.

  Particularly preferably, the head is lowered from above the lifting range in order to mount the component on the board mounting point from an image obtained by imaging the mounting point immediately after the head has been mounted and then moved upward in the lifting range. A difference image obtained by subtracting an image obtained by imaging the mounting point immediately before the determination is obtained, and a component mounting presence / absence determination unit that determines whether a component is mounted at the mounting point from the difference image is provided.

  In this way, it is possible to investigate whether or not the component has been correctly mounted at the mounting point of the board by the head by obtaining the difference image. Furthermore, when the head fails to pick up the component and it moves up and down at the mounting point of the board, even if there is no component at the mounting point or when there is already a component, the difference image is obtained, and the same component mounting Can be investigated.

  The component conveying apparatus as described above is also effectively applied to a component testing apparatus. That is, in a component testing apparatus that performs various tests by conveying a component supplied in a component supply unit to a test unit, the component conveyance device as described above is provided as a unit for conveying the component from the component supply unit to the test unit. What is necessary is just to be the structure which is.

  As described above, according to the present invention, it is possible to effectively image the imaging object under the head by the imaging means provided in the head unit. Operations such as suction of parts by the head can be performed efficiently.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter to which the present invention is applied. As shown in the figure, on a base 1 of a surface mounting machine (hereinafter, abbreviated as a mounting machine), a printed board carrying conveyor 2 is arranged, and the printed board 3 is carried on the conveyor 2 to a predetermined level. Is stopped at the mounting work position. In this embodiment, the substrate transport direction (the direction of the conveyor 2) is referred to as the X-axis direction, the direction orthogonal to the X-axis on the horizontal plane is referred to as the Y-axis direction, and the vertical direction orthogonal to the XY plane (horizontal plane) is referred to as the Z-axis direction. .

  On both sides of the conveyor 2, component supply units 4 are arranged. These component supply units 4 are provided with multiple rows of tape feeders 4a. Each tape feeder 4a is configured such that small pieces of electronic components such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tape is led out from the reel. Electronic components are taken out from the tape feeder 4a.

  Above the base 1, a component mounting head unit 5 is provided. The head unit 5 is movable across the component supply unit 4 and the component mounting unit on which the printed board 3 is located, and can move in the X-axis direction and the Y-axis direction.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. The support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 14 driven by an X-axis servo motor 15, and the head unit 5 is movably held by the guide member 13. A nut portion (not shown) provided on the head unit 5 is screwed onto the ball screw shaft 14. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, and the head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. ing.

  The head unit 5 is provided with a plurality of mounting heads 16 each having a suction nozzle 16a at the tip. In the illustrated example, six mounting heads 16 are mounted in a line at equal intervals in the X-axis direction. Has been.

  Each of the mounting heads 16 can be moved up and down with respect to the head unit main body 5a. In particular, as shown in FIGS. 3 and 4, when the mounting head 16 is above the lifting range, at least a part of the lifting range is at a position offset in the horizontal direction with respect to the position at the bottom. In FIG. 2, there is provided a lifting / displacement mechanism 20 that displaces the mounting head 16 in the horizontal direction as it is lifted. Further, in the head unit 5, the first imaging means 30 for imaging the component sucked by the suction nozzle 16a from below, and the mounting head 16 at the component supply position or component mounting position are below the lifting range. The second imaging means 35 for imaging an object to be imaged at a position directly below the suction nozzle 16a from above is provided for each mounting head 16 and mounting head arrangement direction A board recognition camera 40 (see FIGS. 1 and 2) that images the fiducial mark of the printed board 3 is provided on the side of the one end side.

  The specific structures of the lifting / displacement mechanism 20 and the first and second imaging means 30 and 35 will be described below with reference to FIGS.

  The lifting / displacement mechanism 20 includes a guide 21 that guides the mounting head 16 in an oblique direction, a ball screw shaft 22, and a servo motor 23. The guides 16 are provided at two positions spaced at predetermined intervals on both sides of the mounting head 16 in the X-axis direction, and are arranged so as to extend in a direction inclined with respect to the vertical direction on the YZ plane. The head unit body 5a is fixed via a bracket (not shown). The ball screw shaft 22 is rotatably supported on the head unit main body 5a via a bearing member (not shown) while being arranged so as to extend in parallel with the guide 21, and is connected to the servo motor 23. ing.

  A head mounting frame 24 that holds the mounting head 16 is movably supported by the guide 21, and a nut portion 25 provided on the head mounting frame 21 is screwed onto the ball screw shaft 22. The head mounting frame 21 and the mounting head 16 are configured to move obliquely along the guide 21 as the ball screw shaft 22 is rotationally driven by the servo motor 23. The mounting head 16 can be moved up and down by a fixed small stroke smaller than the movement range of the head mounting frame 21 with respect to the head mounting frame 21, and the air cylinder 26 moves up and down by the fixed small stroke. At the same time, it can be rotated and is driven to rotate by an R-axis servomotor 27. Further, the mounting head 16 is provided with a passage (not shown) that guides the suction negative pressure to the suction nozzle 16a at the lower end thereof.

  The first image pickup means 30 has a component recognition camera 31 as an image pickup optical member so that the camera 31 can pick up the component sucked by the suction nozzle 16a of the mounting head 16 from below vertically. In the state of being faced upward, it is attached to a camera attachment frame 32 fixed to the lower end portion of the head unit main body 5a. The positional relationship between the mounting head 16 and the component recognition camera 31 is such that the camera is located at a position substantially vertically below the suction nozzle 16a when the mounting head 16 is above the lifting range (for example, the rising end). 31 is arranged, and when the mounting head 16 moves below the lifting range, the suction nozzle 16a and the camera 31 are set so as to be displaced forward and backward (Y-axis direction) without interfering with each other. An illumination device 33 made up of a large number of LEDs and the like is disposed around the camera 31, and a component adsorbed by the adsorption nozzle 16a in a state where the mounting head 16 is above the lifting range is a component recognition camera. When the image is picked up by 31, the light is irradiated from the illumination device 33 to the suction component.

  The second imaging means 35 has a lower state recognition camera 36 as an imaging optical member, and this camera 36 captures an adsorption point immediately before component adsorption at the component supply unit and mounts a component on a printed circuit board. It is attached to the camera attachment frame 37 fixed to the upper end portion of the head unit main body 5a in the state of being directed downward so that the mounting point immediately after can be imaged. The positional relationship between the mounting head 16 and the lower state recognition camera 36 is that the object to be imaged is located immediately below the suction nozzle when the mounting head 16 is below the lifting range (for example, the lower end). The camera 36 is disposed so as to capture an image from substantially vertically above, that is, the camera 36 is disposed at a position that is substantially vertically above the suction nozzle 16a when the mounting head 16 is below the elevation range. When the mounting head 16 moves above the lifting range, the optical axis of the camera 36 and the mounting head 16 are displaced from each other back and forth (in the Y-axis direction), and the mounting head 16 is out of the field of view of the camera 36. Set to evacuate.

  Note that an illumination device 38 that illuminates the imaging target position of the lower state recognition camera 36 is provided on the side of the suction nozzle 16 a in the lower portion of the mounting head 16.

  Further, the mounting machine described above is provided with a controller 41 (control means) as shown in FIG. The controller 41 includes a main control unit 42, and includes an X and Y axis control unit 43, an R axis control unit 44, an elevation control unit 45, a camera control unit 46, and an image processing unit 47.

  The X and Y axis control unit 43 is provided corresponding to the head unit 5 and controls the movement of the head unit 5 in the X and Y axis directions by controlling the X axis servo motor 15 and the Y axis servo motor 9. . The R-axis control unit 44 is provided corresponding to each mounting head 16 and controls the rotation of the mounting head 16 around the R-axis by controlling the R-axis servomotor 27. The raising / lowering control unit 45 is provided corresponding to each mounting head 16, and controls the raising / lowering of the mounting head 16 and the accompanying horizontal displacement operation by controlling the servo motor 23 of the raising / lowering / displacement mechanism 20. . For controlling the servo motors 9, 15, 27, and 23, signals from encoders 9a, 15a, 27a, and 23a provided for the servo motors 9, 15, 27, and 23 are input to the control units 43, 44, and 45, respectively. . Further, the elevation controller 45 also controls the air cylinder 26 (not shown in FIG. 5).

  The camera control unit 46 controls the imaging operation by the lower state recognition camera 36, is provided corresponding to each mounting head 16, and in a state where the head unit 5 is on the component supply unit 4, At least one of immediately before the mounting head 16 descends from above the lift range to pick up the component at the suction point and immediately after the mounting head 16 lifts up the lift range after picking up the component The picking point is imaged at one time, or the mounting unit 16 is mounted on the printed circuit board 3 immediately before the mounting head 16 is lowered from above the lifting range in order to mount the component on the mounting point. The camera 36 is configured so that the mounting point is imaged at least at one of the time after the mounting head 16 mounts the component and immediately after the head 16 is lifted upward. Control to. You may make it perform both the imaging of the said adsorption | suction point, and the imaging of the said attachment point.

  The image processing unit 47 processes the images of the suction points and mounting points taken by the camera 36. In particular, in order to effectively process the image of the mounting point, from an image obtained by imaging the mounting point immediately after the mounting head 16 has moved up the lifting range after mounting the component on the mounting point on the printed circuit board 3, A means 47a for creating a difference image obtained by subtracting an image obtained by imaging the mounting point immediately before the mounting head 16 descends from above the ascending / descending range in order to mount the component at the mounting point, and a component image at the mounting point from the difference image. The image processing unit 47 includes a component mounting presence / absence determination unit 47b that determines whether or not mounting is present.

  Next, the mounting operation of the mounting machine and the imaging performed by the first and second imaging means 30 and 35 and the processing based thereon will be described with reference to FIGS.

  At the time of component mounting, the head unit 5 first moves to a position above the component supply unit 4, and electronic components are sucked from the suction points of the tape feeder 4 a by the nozzles 16 a of the mounting heads 16. The suction point is picked up by the second imaging means 35 immediately before the mounting head 16 descends from above the lifting range and immediately after the mounting head 16 rises above the lifting range after the component suction. The operation of the second imaging means 35 and the component suction operation are controlled by the control means.

  That is, prior to the component suction operation, the suction point of the tape feeder 4a is imaged by the lower state recognition camera 36 with the mounting head 16 in the raised position (FIG. 3). In this case, the suction point, which is the position corresponding to the suction nozzle 16 when the mounting head 16 is lowered, is imaged by the camera 36. However, when the mounting head 16 is in the raised position, the field of view of the camera 36 is used. Since the mounting head 16 is displaced, the suction point is imaged without any trouble.

  Then, based on the image picked up by the camera 36, it is determined whether or not there is a component at the suction point. If there is no component, as a process corresponding thereto, for example, until the component is present, the tape Feeder tape is fed out. If there is a component at the suction point, it is checked whether or not the component in the tape is deviated from the predetermined reference position. If it is deviated, a correction amount of the suction position corresponding to the component is obtained.

  After the imaging by the lower state recognition camera 36, the ball screw shaft 22 is rotationally driven by the motor 23 of the lifting / displacement mechanism 20, so that the mounting head 16 moves obliquely downward from the raised position (FIG. 4). Further, the mounting head 16 is lowered by a certain small stroke from the end of the oblique movement range by the operation of the air cylinder 26, and the suction nozzle 16a at the lower end of the mounting head 16 reaches the suction position. When the correction amount of the suction position is obtained, the suction position is also corrected by moving the head unit 5 by a minute amount.

  When the mounting head 16 is lowered to the suction position, the negative pressure is supplied to the suction nozzle 16a to suck the parts from the tape feeder. Then, the operation of the air cylinder 26 and the above-mentioned operation are performed in the opposite direction to that when the mounting head is lowered. When the ball screw shaft 22 is rotationally driven by the motor 23 of the lifting / displacement mechanism, the mounting head 16 is moved to the raised position.

  The suction point is imaged again by the lower state recognition camera 36 after the mounting head 16 is raised and before the next part is fed out by the tape feeder. Based on the image, it is determined whether or not there is any part from the suction point. If there is no part, it is determined that the part has been normally sucked. If the part remains at the suction point, it is determined that the suction is wrong and the suction operation is repeated.

  The component suction operation and the pick-up point imaging as described above are performed simultaneously or sequentially on the plurality of mounting heads 16.

  Further, when the mounting head 16 reaches the ascending position after the components are picked up, the components picked up by the suction nozzle 16a are positioned directly above the component recognition camera 31, and the picked-up components are imaged by the camera 31. . Then, based on the image, whether or not the suction component and the suction state are good is determined. If the suction component is good, the shift of the component suction position is checked, and the correction amount of the mounting position corresponding thereto is obtained.

  Such imaging of the picked-up component by the component recognizing camera 31, determination based on the picked-up component, and calculation of the mounting position correction amount are performed after the picked-up component and before the head unit 5 moves and reaches the printed circuit board 3. Is called.

  When the head unit 5 reaches the printed circuit board 3, the component sucked by the suction nozzle 16 a of each mounting head 16 is mounted at the mounting point of the printed circuit board 3. The second imaging unit 35 picks up the suction point immediately before the mounting head 16 rises above the lifting range immediately after the component is mounted. The operation of the means 35 and the component mounting operation are controlled by the control means.

  That is, prior to the component mounting operation, the mounting point of the printed circuit board 3 is imaged by the lower state recognition camera 36 in a state where the mounting head 16 is in the raised position (FIG. 3). In this case, the camera 36 captures an image of a mounting point that is a position corresponding to the suction nozzle 16 when the mounting head 16 is lowered. Also at this time, when the mounting head 16 is in the raised position, the mounting head 16 is displaced from the field of view of the camera 36, so that the mounting point is imaged without any trouble. Same as time.

  Then, based on the image captured by the camera 36, the position of the mounting point is checked, and if the position of the mounting point is deviated, the mounting position is corrected as necessary. Further, the state of solder applied in advance to the mounting point, the presence or absence of foreign matter, and the like are also checked, and if these are in an inappropriate state, a display to that effect, a warning, etc. are performed.

  After imaging by the lower state recognition camera 36, the mounting head 16 is moved obliquely downward by the operation of the motor 23 of the lifting / displacement mechanism 20 and the mounting head 16 is lowered by the operation of the air cylinder 26. Thus, the component sucked by the suction nozzle 16 a at the lower end of the mounting head 16 reaches the mounting point of the printed circuit board 3. The components are mounted on the printed circuit board 3 by removing the suction negative pressure from the suction nozzle 16a, and then the air cylinder 26 is operated in the direction opposite to that when the mounting head is lowered, and the lifting / displacement mechanism 20 is operated. When the ball screw shaft 22 is rotationally driven by the motor 23, the mounting head 16 is moved to the raised position.

  Immediately after the mounting head 16 is raised, the mounting point is imaged again by the lower state recognition camera 36, and it is determined based on the image whether or not a component is correctly mounted at the mounting point. In this case, in this embodiment, the mounting head 16 mounts the component at the mounting point by the difference image creating unit 47a and the component mounting presence / absence determining unit 47b included in the image processing unit 47 in the controller 41 shown in FIG. Then, from an image obtained by imaging the mounting point immediately after rising upward in the lifting range, an image obtained by imaging the mounting point immediately before the mounting head 16 descends from above the lifting range in order to mount a component on the mounting point. A subtracted difference image is created, and it is determined from this difference image whether or not a component is mounted at the mounting point. By obtaining the difference image in this way, an image of the component mounted at the mounting point is clearly extracted, and it can be easily and accurately determined whether or not the component is mounted.

  When the mounting of the component by one mounting head 16 and the imaging by the lower state recognition camera 36 before and after the mounting are completed, the mounting head 16 moves to the next mounting point, and the operation is repeated. Parts are sequentially mounted at the corresponding mounting points.

  According to the mounting machine of the present embodiment as described above, since the lower state recognition camera 36 is provided in the head unit 5, the component supply unit 4 uses the lower state recognition camera 36 before or after component suction. By picking up the pick-up point, it is possible to recognize the pick-up position, determine whether there is a part at the pick-up point, confirm that the part has been picked up after picking up the part, etc. Whether the mounting position is recognized, the solder state is checked, and the component is correctly mounted after the component is mounted by imaging the mounting point with the above-described lower state recognition camera 36 before or after mounting the component. Can be confirmed.

  In addition, when the lower state recognition camera 36 is disposed at a position substantially vertically above the suction nozzle 16a when the mounting head 16 is below the lifting range, and when the mounting head 16 moves above the lifting range, Since the mounting head 16 is deviated from the field of view of the camera 36, imaging of the suction point or mounting point by the lower state recognition camera 36 in a state where the mounting head 15 is in the raised position, and the mounting head 16. The component can be effectively picked up or mounted without moving the head unit 5 in the state where the head is in the lowered position, and a series of mounting operations including imaging by the lower state recognition camera 36 is efficiently performed. Can be done well.

  Furthermore, in this embodiment, since the component recognition camera 31 is also mounted on the head unit 5, the picked-up component is imaged by the component recognition camera 31 before the head unit 5 moves onto the printed circuit board 3 after the component suction. And component recognition based on that. In addition, by utilizing the fact that the mounting head 16 moves obliquely, when the mounting head 16 is in the raised position, the suction nozzle 16a is positioned directly above the component recognition camera 31, and the picked-up component can be imaged. On the other hand, when the mounting head 16 is lowered, the mounting head 16 and the component recognition camera 36 are displaced forward and backward, so that the component recognition camera 36 is set to the imaging position with respect to the mounting head 16. It is not necessary to move over the retracted position, and the structure can be simplified.

  6 to 8 show another embodiment of a lifting / displacement mechanism that horizontally displaces the mounting head 16 as it moves up and down.

  The lifting / displacement mechanism 50 of this embodiment includes a lifting body 51 attached to the main body 5a of the head unit 5 via a guide 52 in the Z-axis direction so as to be lifted and lowered, a drive mechanism 53 for lifting and lowering the lifting body 51, A parallel link mechanism 54 for connecting the mounting head 16 to the lifting body 51 so as to be swingable and displaceable, and a follow-up cam 57 are provided.

  The drive mechanism 53 has a ball screw shaft 53b that is arranged in the Z-axis direction and is driven to rotate by a servo motor 53a. A nut portion 53c provided on the elevating body 51 is screwed onto the ball screw shaft 53b. Yes. As the ball screw shaft 53b is driven and rotated by the servomotor 53a, the elevating body 51 moves linearly in the Z-axis direction.

  The mounting head 16 is attached to a head mounting frame 58 that is separate from the lifting body 51, and a first link 55 and a second link 56 are disposed between the head mounting frame 58 and the lifting body 51. Yes. These links 55 and 56 are arranged in parallel with each other at an interval in the vertical direction, and both ends of the links 55 and 56 rotate around the lift 51 and the head mounting frame 58 via shafts 55a and 55b and 56a and 56b. The parallel link mechanism 54 is comprised by being connected movably. The parallel link mechanism 54 is configured such that the head mounting frame 58 that holds the mounting head 16 can be oscillated and displaced with respect to the elevating body 51 while the mounting head 16 is maintained in a vertically arranged state. Has been.

  Further, the tracing operation cam 57 is fixedly provided to the head unit main body 5a, and has a cam surface 57a oblique to the Z-axis at an intermediate portion, and is located above and below the oblique cam surface 57a. The cam surfaces 57b and 57c in the vertical direction are connected to each other. A cam follower 59 in contact with the cam surfaces 57a, 57b, 57c is provided on the head mounting frame 58 for the follow-up cam 57. Further, between the lifting body 51 and the head mounting frame 58, the cam follower 59 is moved along the direction in which the cam followers 59 are pressed against the cam surfaces 57a, 57b, 57c of the operation cam 57 (the direction in which the head mounting frame 58 approaches the lifting body). A spring 60 is provided.

  According to the lifting / displacement mechanism 50, as the lifting body 51 is lifted and lowered by driving of the driving mechanism 53, the cam surfaces 57a and 57b of the operation cam 57 follow the head mounting frame 58 and the mounting head 16 attached thereto. , 57c, and moves in the direction defined by 57c. Then, when the cam follower 59 passes through the oblique cam surface 57a in the middle of the ascending / descending range, the mounting head 16 moves obliquely, so that it is displaced in the horizontal direction as the ascending / descending.

  Also in this embodiment, the component recognition camera 31 of the first imaging means 30 is fixedly provided below the head unit 5, and the suction nozzle 16a when the mounting head 16 is in the raised position (see FIG. 6). When the mounting head 16 moves below the lifting range, the suction nozzle 16a and the camera 31 are displaced from each other back and forth (Y-axis direction) without interfering with each other. Is set.

  The lower state recognition camera 36 of the second imaging means 35 is fixedly provided above the head unit 5 and is positioned substantially vertically above the suction nozzle 16a when the mounting head 16 is in the lowered position. When the mounting head 16 moves above the lifting range, the optical axis of the camera 36 and the mounting head 16 are displaced from each other in the front-rear direction (Y-axis direction), and the mounting head 16 It is set to evacuate from the field of view.

  The illumination devices 33 and 38 are provided for the respective image pickup means 30 and 35, and the R-axis servomotor 27 is provided on the head mounting frame 58, etc., as in the embodiment shown in FIGS. It is substantially the same.

  Also in this embodiment, the same operations and effects as those of the embodiment shown in FIGS. 3 and 4 are obtained.

  FIG. 9 shows another embodiment of a lifting / displacement mechanism that horizontally displaces the mounting head as it moves up and down.

  The lifting / displacement mechanism of this embodiment is constituted by a linear motor 70 arranged so as to move the mounting head in an oblique direction. That is, the linear motor 70 constituting the lifting / displacement mechanism guides the mounting head (not shown) in an oblique direction with respect to the vertical direction, and the N-pole and S-pole magnetic poles 77 are alternately arranged in the oblique direction. A track portion 72, a core 75 arranged parallel to the track portion 72 and facing the magnetic pole 77, and a coil 76 wound around the core 75.

  The track portion 72 is fixed to the head unit main body 5a in a state where the track portion 72 is disposed obliquely in parallel with the guide 21. The core 75 and the coil 76 are held by a coil holding member 54 attached to the head attachment frame 24. More specifically, the coil holding member 74 is formed in a hollow shape by releasably connecting the upper bracket 74a and the lower bracket 74b, and is screwed to the head mounting frame 24. A portion where the magnetic pole 77 of the track portion 72 is disposed is inserted into the center portion of the track portion 72 so as to be relatively movable, and the core 75 and the coil 76 are disposed around the portion of the magnetic pole 77 of the track portion 72 inside the coil holding member 74. Is arranged.

  Since other structures are the same as those of the embodiment shown in FIGS. 3 and 4 described above, illustration and description thereof are omitted.

  According to this lifting / displacement mechanism, by passing a predetermined alternating current through the coil 76, the head mounting frame 24 and the mounting head attached thereto move in the oblique direction along the track portion 72, and as it is lifted / lowered It is also displaced in the horizontal direction. Therefore, the same operation and effect as the embodiment shown in FIGS. 3 and 4 are obtained.

The specific structure of the apparatus of the present invention is not limited to the above-described embodiments, and various modifications can be made. Other embodiments will be described below.
(1) In each of the above embodiments, the lower state recognition camera 36 is used as the imaging optical member of the second imaging means 35 at a position substantially vertically above the suction nozzle 16a when the mounting head 16 is in the lowered position. Although the mirror is arranged at an angle of approximately 45 ° at this position and a camera for recognizing the lower state is installed on the side of the mirror, the suction point or the mounting point is imaged from above via the mirror. You may do it. Also for the first imaging means, a mirror may be arranged at an angle of about 45 ° at the position of the camera 31 shown in the above embodiments, and the camera may be installed on the side thereof.
(2) In the above embodiment, the imaging of the suction points before and after the component suction by the lower state recognition camera 36 and the imaging of the mounting points before and after the component placement are performed four times for convenience. However, it is not always necessary to perform all these four imaging operations, and at least one of these imaging operations may be performed as required. For example, in the component supply unit, only the pick-up point is imaged before picking up the component for pick-up position correction, etc., and mounting after mounting the component to confirm that the mounting is done correctly on the printed circuit board. Only point imaging may be performed.
(3) In the embodiment shown in FIGS. 3 and 4, in addition to the lifting / displacement mechanism 20 that moves the mounting head 16 in an oblique direction, an air cylinder that moves the mounting head 16 up and down in the Z-axis direction by a fixed small stroke. However, the air cylinder 26 may be omitted, and the lifting / displacement mechanism may be configured to move the mounting head 16 diagonally over the entire lifting range.
(4) In each of the above embodiments, a case where the present invention is applied to a surface mounter is shown, but the present invention can also be applied to a component testing apparatus that performs various tests on electronic components such as ICs. That is, although not shown in the figure, for example, it has a movable head unit on which one or more heads for component mounting are mounted, and the component placed at the component supply position is sucked by the head and conveyed to the test means. At the same time, there is a device that picks up the picked-up component by the image pickup means mounted on the head unit after picking up the component, and corrects the picked-up position based on the recognition of the image. It is conceivable to adopt the same configuration as the head unit as shown in the above embodiments as the configuration of the head unit.

It is a top view which shows roughly the surface mounting machine with which the component conveying apparatus which concerns on embodiment of this invention was mounted. It is a front view which abbreviate | omits and shows a part of surface mounting machine of FIG. FIG. 2 is a schematic side view showing a first embodiment of a component conveying apparatus in the surface mounting machine of FIG. 1 and showing a state in which a mounting head is in a raised position. It is a schematic side view which shows the state which has the mounting head in a lowered position in the apparatus of the said 1st Embodiment. It is a block diagram which shows a control system. FIG. 9 is a schematic side view showing a state in which the mounting head is in the raised position, showing the second embodiment of the component conveying apparatus. It is a schematic side view which shows the state which has the mounting head in the middle of the raising / lowering range in the apparatus of the said 2nd Embodiment. It is a schematic side view which shows the state which has the mounting head in a lowered position in the apparatus of the said 2nd Embodiment. FIG. 4 shows still another embodiment of the lifting / displacement mechanism, wherein (a) is a side view of a main part of a section, and (b) is an enlarged section along the line AA in (a). FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 3 Printed circuit board 5 Head unit 16 Mounting head 16a Suction nozzle 20 Lifting / displacement mechanism 21 Guide 22 Ball screw shaft 23 Servo motor 30 First imaging means 31 Component recognition camera 50 Lift / displacement mechanism 51 Lifting body 54 Parallel link mechanism 57 Cam for profile operation 70 Linear motor 72 Track part 75 Core 76 Coil 77 Magnetic pole

Claims (9)

In a component conveying apparatus configured to adsorb a component from a component supply position by the above-mentioned head of a head unit that can move up and down with a suction nozzle provided at the lower end and convey it to a target position. ,
When the head is above the head lifting range, the head is moved horizontally in the head lifting range so that the head is offset horizontally relative to the position below the head lifting range. A lift / displacement mechanism to displace is provided,
The head unit is provided with an imaging means in which an imaging optical member is arranged so as to take an image of an object to be imaged at a position directly below the suction nozzle when the head is below the head raising / lowering range from substantially vertically above,
A component conveying apparatus characterized in that the head is displaced from the field of view of the imaging means in a state where the head is above the head lifting range.   The elevating / displacement mechanism includes a guide portion for guiding the head in an oblique direction with respect to a vertical direction, a ball screw arranged in parallel to the guide portion, and a motor for driving the ball screw. Item transportation device according to Item 1.   The elevating / displacement mechanism includes an elevating body attached to the head unit so as to be movable up and down in a substantially vertical direction, a drive mechanism for elevating the elevating body, and the head being connected to the elevating body so as to be able to swing and displace. A parallel link mechanism and a cam for operation that has a cam surface in an oblique direction and is fixed to the head unit, and the head moves along the cam surface of the cam for operation following the ascending / descending of the elevating body. The component conveying device according to claim 1, wherein the component conveying device is configured to move.   The lifting / displacement mechanism guides the head in an oblique direction with respect to a vertical direction, and arranges a parallel orbital portion in which N-pole and S-pole magnetic poles are alternately arranged in the oblique direction. The component conveying apparatus according to claim 1, further comprising a linear motor including a core opposed to the magnetic pole and a coil wound around the core.   In a surface mounter that transports a component supplied in a component supply unit onto a substrate positioned at a mounting work position and mounts the component on a predetermined position on the substrate, as means for conveying the component from the component supply unit onto the substrate, A surface mounting machine comprising the component conveying device according to claim 1.   At least one of immediately before the head is lowered from above the lifting range in order to pick up the component at the suction point in the component supply unit, and immediately after the head is lifted upward from the lifting range after picking up the component 6. The surface mounter according to claim 5, further comprising control means for controlling the pick-up point to be picked up by the image pick-up means at the time.   At least one of immediately before the head is lowered from above the lifting range in order to mount the component on the mounting point of the substrate on the substrate, and immediately after the head is lifted above the lifting range after mounting the component 7. The surface mounter according to claim 5, further comprising control means for controlling the image pickup means to pick up a mounting point at the time of the step.   Mounted immediately before the head is lowered from above the lifting range in order to mount the component at the mounting point of the board from an image obtained by imaging the mounting point immediately after the head is mounted above the lifting range after mounting the component. 8. The surface mounter according to claim 7, further comprising: a component mounting presence / absence determining unit that obtains a difference image obtained by subtracting an image obtained by capturing a point and determines whether or not a component is mounted at the mounting point from the difference image.   5. The component testing apparatus according to claim 1, wherein the component feeding unit transports the component supplied to the testing unit to perform various tests, and the unit feeding unit transfers the component from the component feeding unit to the testing unit. A component testing apparatus comprising the component conveying apparatus described above.

Images