JP2005272533A5 - - Google Patents
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- JP2005272533A5 JP2005272533A5 JP2004085145A JP2004085145A JP2005272533A5 JP 2005272533 A5 JP2005272533 A5 JP 2005272533A5 JP 2004085145 A JP2004085145 A JP 2004085145A JP 2004085145 A JP2004085145 A JP 2004085145A JP 2005272533 A5 JP2005272533 A5 JP 2005272533A5
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- JP
- Japan
- Prior art keywords
- parts
- resin composition
- weight
- polyphenylene ether
- component
- Prior art date
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- 239000011342 resin composition Substances 0.000 claims description 42
- 229920001955 polyphenylene ether Polymers 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 229910052604 silicate mineral Inorganic materials 0.000 claims description 17
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 238000004898 kneading Methods 0.000 claims description 9
- 239000000440 bentonite Substances 0.000 claims description 8
- 229910000278 bentonite Inorganic materials 0.000 claims description 8
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 7
- 239000000194 fatty acid Substances 0.000 claims description 7
- 229930195729 fatty acid Natural products 0.000 claims description 7
- 150000004665 fatty acids Chemical class 0.000 claims description 7
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims description 6
- 229910000271 hectorite Inorganic materials 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 5
- 150000004671 saturated fatty acids Chemical class 0.000 claims description 4
- 125000001453 quaternary ammonium group Chemical class 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 238000002441 X-ray diffraction Methods 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 31
- -1 poly (2,6-dimethyl-1,4-phenylene) Polymers 0.000 description 30
- 238000012360 testing method Methods 0.000 description 16
- 230000000704 physical effect Effects 0.000 description 15
- 239000000203 mixture Substances 0.000 description 13
- 239000004793 Polystyrene Substances 0.000 description 12
- 238000002156 mixing Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000011256 inorganic filler Substances 0.000 description 10
- 229910003475 inorganic filler Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000001033 ether group Chemical group 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 150000004756 silanes Chemical class 0.000 description 3
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical group C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 2
- BQPNUOYXSVUVMY-UHFFFAOYSA-N [4-[2-(4-diphenoxyphosphoryloxyphenyl)propan-2-yl]phenyl] diphenyl phosphate Chemical compound C=1C=C(OP(=O)(OC=2C=CC=CC=2)OC=2C=CC=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 BQPNUOYXSVUVMY-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- PFBWBEXCUGKYKO-UHFFFAOYSA-N ethene;n-octadecyloctadecan-1-amine Chemical compound C=C.CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC PFBWBEXCUGKYKO-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- FEEPBTVZSYQUDP-UHFFFAOYSA-N heptatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O FEEPBTVZSYQUDP-UHFFFAOYSA-N 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229910052901 montmorillonite Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 2
- OYUBNQOGHWGLJB-WRBBJXAJSA-N (13z,33z)-hexatetraconta-13,33-dienediamide Chemical group NC(=O)CCCCCCCCCCC\C=C/CCCCCCCCCCCCCCCCCC\C=C/CCCCCCCCCCCC(N)=O OYUBNQOGHWGLJB-WRBBJXAJSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- GBZVNKQWXLVYNG-UHFFFAOYSA-N (3-phosphonooxyphenyl) dihydrogen phosphate Chemical compound OP(O)(=O)OC1=CC=CC(OP(O)(O)=O)=C1 GBZVNKQWXLVYNG-UHFFFAOYSA-N 0.000 description 1
- ZVKUMHCVHAVPON-AUYXYSRISA-N (9z,28z)-heptatriaconta-9,28-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O ZVKUMHCVHAVPON-AUYXYSRISA-N 0.000 description 1
- CPUBMKFFRRFXIP-YPAXQUSRSA-N (9z,33z)-dotetraconta-9,33-dienediamide Chemical compound NC(=O)CCCCCCC\C=C/CCCCCCCCCCCCCCCCCCCCCC\C=C/CCCCCCCC(N)=O CPUBMKFFRRFXIP-YPAXQUSRSA-N 0.000 description 1
- KVPQFVHBQUTWLQ-CVBJKYQLSA-N (z)-docos-13-enamide;ethene Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O KVPQFVHBQUTWLQ-CVBJKYQLSA-N 0.000 description 1
- GCAONVVVMAVFDE-CLFAGFIQSA-N (z)-n-[(z)-octadec-9-enyl]octadec-9-enamide Chemical compound CCCCCCCC\C=C/CCCCCCCCNC(=O)CCCCCCC\C=C/CCCCCCCC GCAONVVVMAVFDE-CLFAGFIQSA-N 0.000 description 1
- VZGOTNLOZGRSJA-ZZEZOPTASA-N (z)-n-octadecyloctadec-9-enamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCC\C=C/CCCCCCCC VZGOTNLOZGRSJA-ZZEZOPTASA-N 0.000 description 1
- WZSYKGHOYGNHKS-UHFFFAOYSA-N 1,2-ditert-butyl-4-methylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CCC(O)(C(C)(C)C)C(C(C)(C)C)=C1 WZSYKGHOYGNHKS-UHFFFAOYSA-N 0.000 description 1
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- PINDOMZKBLEDIG-YPKPFQOOSA-N 12-hydroxy-n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCC\C=C/CCCCCCCCNC(=O)CCCCCCCCCCC(O)CCCCCC PINDOMZKBLEDIG-YPKPFQOOSA-N 0.000 description 1
- XJOOKFNMTRPLEG-UHFFFAOYSA-N 12-hydroxy-n-octadecyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCC(O)CCCCCC XJOOKFNMTRPLEG-UHFFFAOYSA-N 0.000 description 1
- RDYWHMBYTHVOKZ-UHFFFAOYSA-N 18-hydroxyoctadecanamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCO RDYWHMBYTHVOKZ-UHFFFAOYSA-N 0.000 description 1
- XHSVWKJCURCWFU-UHFFFAOYSA-N 19-[3-(19-amino-19-oxononadecyl)phenyl]nonadecanamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCC1=CC=CC(CCCCCCCCCCCCCCCCCCC(N)=O)=C1 XHSVWKJCURCWFU-UHFFFAOYSA-N 0.000 description 1
- DKNLMUCCEFHGNE-UHFFFAOYSA-N 2,2-dihydroxy-3-methylideneoctadecanamide Chemical compound CCCCCCCCCCCCCCCC(=C)C(O)(O)C(N)=O DKNLMUCCEFHGNE-UHFFFAOYSA-N 0.000 description 1
- VESQWGARFWAICR-UHFFFAOYSA-N 2,2-dihydroxyoctadecanamide;ethene Chemical compound C=C.CCCCCCCCCCCCCCCCC(O)(O)C(N)=O VESQWGARFWAICR-UHFFFAOYSA-N 0.000 description 1
- XRUGBBIQLIVCSI-UHFFFAOYSA-N 2,3,4-trimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1C XRUGBBIQLIVCSI-UHFFFAOYSA-N 0.000 description 1
- NODRXLWVBKZXOO-UHFFFAOYSA-N 2-(hydroxymethyl)docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCC(CO)C(N)=O NODRXLWVBKZXOO-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- DDTHMESPCBONDT-UHFFFAOYSA-N 4-(4-oxocyclohexa-2,5-dien-1-ylidene)cyclohexa-2,5-dien-1-one Chemical compound C1=CC(=O)C=CC1=C1C=CC(=O)C=C1 DDTHMESPCBONDT-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZSEMHRBWSJLCMJ-UHFFFAOYSA-N C(CCCCCCCCCCCCCCC(C)C)(=O)N.C(CCCCCCCCCCCCCCC(C)C)(=O)N.C=C Chemical compound C(CCCCCCCCCCCCCCC(C)C)(=O)N.C(CCCCCCCCCCCCCCC(C)C)(=O)N.C=C ZSEMHRBWSJLCMJ-UHFFFAOYSA-N 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002152 alkylating effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- GKAWAQNIMXHVNI-UHFFFAOYSA-N decanamide;ethene Chemical compound C=C.CCCCCCCCCC(N)=O.CCCCCCCCCC(N)=O GKAWAQNIMXHVNI-UHFFFAOYSA-N 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 description 1
- GFQOFGWPGYRLAO-UHFFFAOYSA-N dodecanamide;ethene Chemical compound C=C.CCCCCCCCCCCC(N)=O.CCCCCCCCCCCC(N)=O GFQOFGWPGYRLAO-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UAUDZVJPLUQNMU-KTKRTIGZSA-N erucamide Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(N)=O UAUDZVJPLUQNMU-KTKRTIGZSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SWSBIGKFUOXRNJ-CVBJKYQLSA-N ethene;(z)-octadec-9-enamide Chemical compound C=C.CCCCCCCC\C=C/CCCCCCCC(N)=O.CCCCCCCC\C=C/CCCCCCCC(N)=O SWSBIGKFUOXRNJ-CVBJKYQLSA-N 0.000 description 1
- TXLQIJBYHKQZME-UHFFFAOYSA-N ethene;octanamide Chemical compound C=C.CCCCCCCC(N)=O.CCCCCCCC(N)=O TXLQIJBYHKQZME-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical group [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- XMYQHJDBLRZMLW-UHFFFAOYSA-N methanolamine Chemical compound NCO XMYQHJDBLRZMLW-UHFFFAOYSA-N 0.000 description 1
- 125000006178 methyl benzyl group Chemical group 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PECBPCUKEFYARY-ZPHPHTNESA-N n-[(z)-octadec-9-enyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCCCCCCC\C=C/CCCCCCCC PECBPCUKEFYARY-ZPHPHTNESA-N 0.000 description 1
- GKCGAKGJCYKIIS-UHFFFAOYSA-N n-dodecyldodecanamide Chemical compound CCCCCCCCCCCCNC(=O)CCCCCCCCCCC GKCGAKGJCYKIIS-UHFFFAOYSA-N 0.000 description 1
- RZTXRJXISDSZQL-UHFFFAOYSA-N n-hexadecylhexadecanamide Chemical compound CCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCCCCCC RZTXRJXISDSZQL-UHFFFAOYSA-N 0.000 description 1
- DJWFNQUDPJTSAD-UHFFFAOYSA-N n-octadecyloctadecanamide Chemical compound CCCCCCCCCCCCCCCCCCNC(=O)CCCCCCCCCCCCCCCCC DJWFNQUDPJTSAD-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- 150000004010 onium ions Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- MGDIOJPGJAGMGP-UHFFFAOYSA-N pentacosanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCC(N)=O MGDIOJPGJAGMGP-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- KOWVWXQNQNCRRS-UHFFFAOYSA-N tris(2,4-dimethylphenyl) phosphate Chemical compound CC1=CC(C)=CC=C1OP(=O)(OC=1C(=CC(C)=CC=1)C)OC1=CC=C(C)C=C1C KOWVWXQNQNCRRS-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical class [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical group [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Description
本発明は、良好な成形品表面光沢を保持して、極めて優れた耐面衝撃性、引張伸度と、剛性とのバランスを示すポリフェニレンエーテル樹脂組成物に関する。 The present invention relates to a polyphenylene ether resin composition that retains a good surface gloss of a molded article and exhibits an excellent balance between surface impact resistance, tensile elongation, and rigidity.
ポリフェニレンエーテル系樹脂は軽量性、機械的性質、成形加工性、耐熱性、寸法安定性あるいは電気特性等に優れるため、家電OA分野、事務機分野や情報機器分野、自動車分野等に広く用いられている。
一般に熱可塑性樹脂の欠点は金属に比べて剛性が低いことであり、剛性を改良するために無機質充填剤を配合する手法が広く用いられている。しかし、熱可塑性樹脂に無機質充填剤を配合する場合、剛性や機械的強度は向上するが、一方では耐衝撃性、引張伸度、表面平滑性等の低下が伴う。
Polyphenylene ether-based resins are excellent in lightness, mechanical properties, molding processability, heat resistance, dimensional stability, electrical characteristics, etc., so they are widely used in the home appliance OA field, office machine field, information equipment field, automobile field, etc. Yes.
In general, a drawback of thermoplastic resins is that they are less rigid than metals, and a technique of blending an inorganic filler is widely used to improve the rigidity. However, when an inorganic filler is blended with a thermoplastic resin, rigidity and mechanical strength are improved, but on the other hand, impact resistance, tensile elongation, surface smoothness and the like are reduced.
ポリフェニレンエーテル系樹脂に無機質充填剤を配合して、剛性を向上させると共に延性を改良する技術として、アルキル基で置換した四級アンモニウムイオン等の有機化剤で層間処理した層状珪酸塩鉱物を少量添加する方法が既に開示されている(例えば、特許文献1、2、3参照。)。これらの特許文献にはいずれも、ポリフェニレンエーテル樹脂またはこれを含む熱可塑性樹脂に、このような層状珪酸塩鉱物を添加した樹脂組成物を作成する際に、層状珪酸塩鉱物を樹脂中に均一に微分散させることが延性を保持するためには好ましいこと、そのために二軸押出機のような強いせん断力を伴う溶融混練の必要性や、予め樹脂成分と層状珪酸塩鉱物とを予備混練しておく方法が示されている。また、熱可塑性樹脂の溶融状態での機械的せん断下で混合することが肝要であり、重合終了後の粉体、フレーク、チップ等、任意の形態の熱可塑性樹脂に添加し、押出機等の混練機にて溶融混合する方法も混合可能である旨、記載されている(例えば、特許文献2参照)。 Add a small amount of layered silicate mineral that has been intercalated with an organic agent such as quaternary ammonium ion substituted with an alkyl group as a technique to improve rigidity and improve ductility by blending an inorganic filler with polyphenylene ether resin. Have already been disclosed (for example, see Patent Documents 1, 2, and 3). In any of these patent documents, when preparing a resin composition in which such a layered silicate mineral is added to a polyphenylene ether resin or a thermoplastic resin containing the same, the layered silicate mineral is uniformly contained in the resin. Fine dispersion is preferable in order to maintain ductility. Therefore, the necessity of melt kneading with strong shearing force as in a twin-screw extruder, preliminarily kneading resin component and layered silicate mineral in advance It shows how to keep it. Also, it is important to mix under mechanical shear in the molten state of the thermoplastic resin, and it can be added to any form of thermoplastic resin such as powder, flakes and chips after polymerization, It is described that a method of melt mixing in a kneader can also be mixed (see, for example, Patent Document 2).
しかし、これらの特許文献に記載された方法では、ポリフェニレンエーテル系樹脂中にこのような特定の無機質充填剤を少量分散させて延性を改良することは可能であるが、無機質充填剤を多量に配合して十分に剛性を向上させた上で、良好な成形品表面光沢を保持して、なおかつ耐面衝撃性、引張伸度を改良するためには十分ではなかった。
本発明は、家電・OA、事務機、情報機器分野や自動車分野に有効に使用できる、高剛性で、なおかつ成形品表面光沢、耐面衝撃性、引張伸度に優れ、リワーク性、リサイクル性にも優れた樹脂組成物を提供することを目的とする。 The present invention can be effectively used in the fields of home appliances / OA, office machines, information equipment and automobiles, has high rigidity, and has excellent surface gloss, surface impact resistance, tensile elongation, reworkability and recyclability. Another object of the present invention is to provide an excellent resin composition.
本発明者らは、環境に悪影響を及ぼさず、高耐熱性、高剛性を付与し、成形流動性を低下させずに、無機質充填剤で強化したポリフェニレンエーテル系樹脂組成物からなる成形品の耐面衝撃性や引張伸度を改良することを目的として鋭意検討した結果、ポリフェニレンエーテル樹脂、またはポリフェニレンエーテル樹脂とスチレン系樹脂とからなる樹脂に無機質充填剤を配合する際に、有機化剤で処理した層状珪酸塩鉱物粉体を使用すること、脂肪酸アマイドを微量添加することによって、耐熱性、流動性、成形品表面光沢に優れ、剛性と耐面衝撃性、引張伸度とのバランスに著しく優れる樹脂組成物の製造が可能であり、リワーク性、リサイクル性にも優れることを見出して、本発明に至った。 The present inventors have not adversely affected the environment, imparted high heat resistance and high rigidity, and did not deteriorate the molding fluidity, and the resistance of molded products comprising a polyphenylene ether-based resin composition reinforced with an inorganic filler. As a result of intensive studies aimed at improving surface impact and tensile elongation, treated with an organic agent when blending an inorganic filler into a polyphenylene ether resin or a resin comprising a polyphenylene ether resin and a styrene resin. By using a layered silicate mineral powder and adding a small amount of fatty acid amide, it has excellent heat resistance, fluidity, surface gloss of molded products, and remarkably excellent balance between rigidity, surface impact resistance, and tensile elongation. The present inventors have found that a resin composition can be produced and are excellent in reworkability and recyclability, and have reached the present invention.
即ち本発明は、
[1]ポリフェニレンエーテル樹脂(a)50〜95重量部、有機化剤で処理した層状珪酸塩鉱物粉体(b)50〜5重量部、(a)成分および(b)成分の合計量100重量部に対してスチレン系樹脂0〜150重量部、(a)成分、(b)成分および(c)成分の合計量100重量部に対して、脂肪酸アマイド(d)0.005〜5重量部を含有し、溶融混練してなるポリフェニレンエーテル樹脂組成物、
[2](b)成分が、有機化剤であるアルキル置換四級アンモニウムイオンで層間処理されたベントナイト或いはヘクトライトで、その処理量が100〜200ミリ当量/100gの範囲にあり、なおかつX線回折で測定したd(001)面の層間距離の値が20Å以上である、上記[1]に記載のポリフェニレンエーテル樹脂組成物、
[3](d)成分が、炭素数がC8〜C25の高級飽和脂肪酸ビスアマイドである上記[1]または[2]に記載のポリフェニレンエーテル樹脂組成物、
[4]上記[1]〜[3]のポリフェニレンエーテル樹脂組成物を用いて成形した成形体、である。
That is, the present invention
[1] 50 to 95 parts by weight of polyphenylene ether resin (a), layered silicate mineral powder treated with an organic agent (b) 50 to 5 parts by weight, total amount of component (a) and component (b) 100 weight 0 to 150 parts by weight of styrene-based resin, 100 parts by weight of the total amount of component (a), component (b) and component (c), and 0.005 to 5 parts by weight of fatty acid amide (d) Containing, melt-kneaded polyphenylene ether resin composition,
[ 2 ] The component (b) is bentonite or hectorite treated with an alkylating quaternary ammonium ion as an organic agent, and the amount of treatment is in the range of 100 to 200 meq / 100 g, and X-ray The polyphenylene ether resin composition according to the above [ 1 ], wherein the value of the interlayer distance of the d (001) plane measured by diffraction is 20 mm or more;
[ 3 ] The polyphenylene ether resin composition according to the above [1] or [2] , wherein the component (d) is a higher saturated fatty acid bisamide having C8 to C25,
[ 4 ] A molded article molded using the polyphenylene ether resin composition of [1] to [3 ] above.
本発明により、樹脂中での無機質充填剤の分散性が著しく改良され、高耐熱、高剛性で、なおかつ成形品の耐面衝撃性、表面光沢、引張伸度に優れ、リサイクル性にも優れたポリフェニレンエーテル樹脂組成物が得られた。 According to the present invention, the dispersibility of the inorganic filler in the resin is remarkably improved, high heat resistance, high rigidity, excellent surface impact resistance, surface gloss, tensile elongation, and recyclability of the molded product. A polyphenylene ether resin composition was obtained.
本発明を更に詳細に説明する。
本発明の(a)成分であるポリフェニレンエーテル樹脂とは、次に示す一般式(1)を繰り返し単位とし、構成単位が一般式(1)の〔a〕または〔b〕からなる単独重合体、あるいは共重合体が使用できる。
The present invention will be described in further detail.
The polyphenylene ether resin which is the component (a) of the present invention is a homopolymer comprising the following general formula (1) as a repeating unit and the structural unit consisting of [a] or [b] in the general formula (1): Alternatively, a copolymer can be used.
(式中、R1 ,R2 ,R3 ,R4 ,R5 ,R6 は炭素1〜4のアルキル基、アリール基、ハロゲン、水素等の一価の残基であり、R5 ,R6 は同時に水素ではない) (In the formula, R 1, R 2, R 3, R 4, R 5 and R 6 are monovalent residues such as an alkyl group having 1 to 4 carbon atoms, an aryl group, halogen and hydrogen, and R 5 and R 6 are not hydrogen at the same time)
ポリフェニレンエーテル系樹脂の単独重合体の代表例としては、ポリ(2,6−ジメチル−1,4−フェニレン)エーテル、ポリ(2−メチル−6−エチル1,4−フェニレン)エーテル、ポリ(2,6−ジエチル−1,4−フェニレン)エーテル、ポリ(2−エチル−6−n−プロピル−1,4−フェニレン)エーテル、ポリ(2,6−ジ−n−プロピル−1,4−フェニレン)エーテル、ポリ(2−メチル−6−n−ブチル−1,4−フェニレン)エーテル、ポリ(2−エチル−6−イソプロピル−1,4−フェニレン)エーテル、ポリ(2−メチル−6−クロロエチル−1,4−フェニレン)エーテル、ポリ(2−メチル−6−ヒドロキシエチル−1,4−フェニレン)エーテル、ポリ(2−メチル−6−クロロエチル−1,4−フェニレン)エーテル等のホモポリマーが挙げられる。 Typical examples of the homopolymer of polyphenylene ether resin include poly (2,6-dimethyl-1,4-phenylene) ether, poly (2-methyl-6-ethyl 1,4-phenylene) ether, poly (2 , 6-Diethyl-1,4-phenylene) ether, poly (2-ethyl-6-n-propyl-1,4-phenylene) ether, poly (2,6-di-n-propyl-1,4-phenylene) ) Ether, poly (2-methyl-6-n-butyl-1,4-phenylene) ether, poly (2-ethyl-6-isopropyl-1,4-phenylene) ether, poly (2-methyl-6-chloroethyl) -1,4-phenylene) ether, poly (2-methyl-6-hydroxyethyl-1,4-phenylene) ether, poly (2-methyl-6-chloroethyl-1,4-phenol) Include homopolymers of alkylene) ether.
ポリフェニレンエーテル共重合体としては、2,6−ジメチルフェノールと2,3,6−トリメチルフェノールとの共重合体、2,6−ジメチルフェノールとo−クレゾールとの共重合体あるいは2,3,6−トリメチルフェノールとo−クレゾールとの共重合体等、ポリフェニレンエーテル構造を主体としてなるポリフェニレンエーテル共重合体を包含する。
また、本発明で使用されるポリフェニレンエーテル樹脂には、本発明の主旨に反しない限り、他の種々のフェニレンエーテルユニットを部分構造として含んでいても構わない。これらフェニレンエーテルユニットとしては、例えば、特開平01−297428号公報及び特開昭63−301222号公報に記載されている、2−(ジアルキルアミノメチル)−6−メチルフェニレンエーテルユニットや、2−(N−アルキル−N−フェニルアミノメチル)−6−メチルフェニレンエーテルユニット等が挙げられる。
また、ポリフェニレンエーテル樹脂の主鎖中にジフェノキノン等が少量結合したものも含まれる。
Examples of the polyphenylene ether copolymer include a copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, a copolymer of 2,6-dimethylphenol and o-cresol, or 2,3,6. -Polyphenylene ether copolymers mainly composed of a polyphenylene ether structure, such as a copolymer of trimethylphenol and o-cresol, are included.
Further, the polyphenylene ether resin used in the present invention may contain other various phenylene ether units as a partial structure as long as it does not contradict the gist of the present invention. Examples of these phenylene ether units include 2- (dialkylaminomethyl) -6-methylphenylene ether units described in JP-A-01-297428 and JP-A-63-301222, and 2- ( N-alkyl-N-phenylaminomethyl) -6-methylphenylene ether unit and the like.
Also included are those in which a small amount of diphenoquinone or the like is bonded to the main chain of the polyphenylene ether resin.
本発明で使用されるポリフェニレンエーテル樹脂において、その一部または全部を不飽和カルボン酸等の官能的誘導体で変性した官能化ポリフェニレンエーテルで置き換えることが可能である。この場合、変性は官能的誘導体の中の1種により行われても良いし、2種以上の組み合わせによって行われても良い。
本発明に用いられるポリフェニレンエーテル樹脂の固有粘度(クロロホルム溶媒で30℃にて測定)は0.3〜0.9の範囲が好ましく、より好ましくは0.4〜0.6の範囲にあることである。無機質充填剤を十分に微分散させるためには0.3以上が好ましく、成形加工性の観点から0.9以下が好ましい。
本発明で使用されるポリフェニレンエーテル樹脂の性状は、特に限定されるものではないが、(b)成分との混和性の観点から、重合後の粉体性状のものを用いることが好ましい。
In the polyphenylene ether resin used in the present invention, a part or all of the polyphenylene ether resin can be replaced with a functionalized polyphenylene ether modified with a functional derivative such as an unsaturated carboxylic acid. In this case, the modification may be performed with one of the functional derivatives or a combination of two or more.
The intrinsic viscosity (measured with a chloroform solvent at 30 ° C.) of the polyphenylene ether resin used in the present invention is preferably in the range of 0.3 to 0.9, more preferably in the range of 0.4 to 0.6. is there. In order to sufficiently finely disperse the inorganic filler, 0.3 or more is preferable, and 0.9 or less is preferable from the viewpoint of moldability.
The property of the polyphenylene ether resin used in the present invention is not particularly limited, but from the viewpoint of miscibility with the component (b), it is preferable to use a polymerized powdery property.
本発明の(b)成分において、層状珪酸鉱物塩粉体を処理するために用いられる有機化剤とは、特定の界面活性剤や水溶性ポリマーといった層状珪酸鉱物塩表面と親和性、反応性を有するもの、或いはモンモリロナイトや膨潤性マイカといった層状珪酸塩鉱物の粒子層間に取り込まれるオニウムイオン等であり、無機質充填剤粒子の表面或いは、層間の面上に局在化してポリフェニレンエーテル樹脂に対する溶融混和性を改良するものであれば特に制限はない。このような有機化剤として好ましいのが、シラン化合物とアルキル置換四級アンモニウムイオンである。 In the component (b) of the present invention, the organic agent used for treating the layered silicate mineral salt powder has affinity and reactivity with the surface of the layered silicate mineral salt such as a specific surfactant or water-soluble polymer. Or onium ions incorporated between layer layers of layered silicate minerals such as montmorillonite and swellable mica, etc., localized on the surface of the inorganic filler particles or on the surface between layers, and melt miscible with polyphenylene ether resin There is no particular limitation as long as it improves. Preferred as such an organic agent are silane compounds and alkyl-substituted quaternary ammonium ions.
シラン化合物は通常、ガラスフィラーやミネラルフィラー等を表面処理するために用いられるものである。その具体例としては、ビニルトリクロルシラン、ビニルトリエトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン等のビニルシラン化合物、γ−グリシドキシプロピルトリメトキシシラン等のエポキシシラン化合物、ビスー(3−トリエトキシシリルプロピル)テトラサルファイド等の硫黄系シラン化合物、γ−メルカプトプロピルトリメトキシシラン等のメルカプトシラン化合物、γ−アミノプロピルトリエトキシシラン、γ−ユレイドプロピルトリエトキシシラン等のアミノシラン化合物等が挙げられる。 The silane compound is usually used for surface treatment of glass fillers, mineral fillers and the like. Specific examples thereof include vinyl silane compounds such as vinyltrichlorosilane, vinyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, epoxy silane compounds such as γ-glycidoxypropyltrimethoxysilane, and bis (3-triethoxysilyl). Sulfur-based silane compounds such as propyl) tetrasulfide, mercaptosilane compounds such as γ-mercaptopropyltrimethoxysilane, and aminosilane compounds such as γ-aminopropyltriethoxysilane and γ-ureidopropyltriethoxysilane.
アルキル置換四級アンモニウムイオンは、層状珪酸塩鉱物の層間処理剤として使用されるもので、層状珪酸塩鉱物粒子の層間に取り込ませて層間の間隔を広げて溶融混練時に層剥離を促進させるものである。その具体例として、ジメチル水添ジタローアンモニウムイオン、ベンジルジメチル水添タローアンモニウムイオン、メチルベンジル水添ジタローアンモニウムイオンなどが挙げられる。
このような有機化剤を用いて、層状珪酸鉱物塩粉体を処理することによって、ポリフェニレンエーテル樹脂と溶融混練した際に、樹脂と層状珪酸鉱物塩粒子との界面密着性が補強されるだけでなく、層状珪酸鉱物塩粉体自体の粉体特性も同時に著しく改良され、取り扱い性も良好となり、溶融混練による樹脂との混和性も良好となる。
Alkyl-substituted quaternary ammonium ions are used as an interlaminar treatment agent for layered silicate minerals, and are incorporated between layers of layered silicate mineral particles to increase the spacing between layers and promote delamination during melt-kneading. is there. Specific examples thereof include dimethyl hydrogenated ditallow ammonium ion, benzyldimethyl hydrogenated tallow ammonium ion, and methylbenzyl hydrogenated ditallow ammonium ion.
By treating the layered silicate mineral salt powder with such an organic agent, the interfacial adhesion between the resin and the layered silicate mineral salt particles is only reinforced when melt-kneaded with the polyphenylene ether resin. At the same time, the powder properties of the layered silicate mineral salt powder itself are remarkably improved, the handleability is improved, and the miscibility with the resin by melt kneading is also improved.
本発明の(b)成分である有機化剤で処理した層状珪酸鉱物塩粉体として、特に好ましいのは、ジメチル水添ジタローアンモニウムイオンで層間処理したベントナイト或いはヘクトライトである。
本発明で使用されるベントナイト或いはヘクトライトにおける、ジメチル水添ジタローアンモニウムイオンの処理量は100〜200ミリ当量/100gの範囲にあることが好ましく、より好ましくは100〜150ミリ当量/100gの範囲内である。ベントナイト或いはヘクトライトの粒子における層間隔を十分に広げて、溶融混練時に層剥離を容易にするためには100ミリ当量/100g以上が望ましく、十分な耐熱性、剛性保持の観点から200ミリ当量/100g以下が望ましい。
As the layered silicate mineral salt powder treated with the organic agent which is the component (b) of the present invention, bentonite or hectorite treated with dimethyl hydrogenated ditallow ammonium ions is particularly preferred.
In the bentonite or hectorite used in the present invention, the treatment amount of dimethyl hydrogenated ditallow ammonium ion is preferably in the range of 100 to 200 meq / 100 g, more preferably in the range of 100 to 150 meq / 100 g. Is within. 100 milliequivalents / 100 g or more is desirable in order to sufficiently widen the layer interval in the bentonite or hectorite particles and to facilitate delamination during melt-kneading. From the viewpoint of sufficient heat resistance and rigidity maintenance, 200 milliequivalent / 100 g or less is desirable.
本発明に使用されるベントナイト或いはヘクトライトの、X線回折で測定したd(001)面の層間距離の値は20Å以上であることが好ましく、より好ましくは25〜40Åの範囲である。溶融混練時の十分な層剥離促進の観点から、層間距離は20Å以上であるとが好ましい。
本発明(c)成分であるスチレン系樹脂とは、スチレン系化合物またはスチレン系化合物と共重合可能な化合物を、ゴム質重合体存在下または非存在下に重合して得られる重合体である。
スチレン系化合物とは、一般式〔2〕で表される化合物を意味する。
The bentonite or hectorite used in the present invention preferably has a d (001) plane interlayer distance measured by X-ray diffraction of 20 mm or more, more preferably 25 to 40 mm. From the viewpoint of sufficient layer peeling promotion during melt-kneading, the interlayer distance is preferably 20 mm or more.
The styrene resin as the component (c) of the present invention is a polymer obtained by polymerizing a styrene compound or a compound copolymerizable with the styrene compound in the presence or absence of a rubbery polymer.
The styrene compound means a compound represented by the general formula [2].
(式中、Rは水素、低級アルキルまたはハロゲンを示し、Zはビニル、水素、ハロゲン及び低級アルキルよりなる群から選択され、pは0〜5の整数である。) (In the formula, R represents hydrogen, lower alkyl, or halogen, Z is selected from the group consisting of vinyl, hydrogen, halogen, and lower alkyl, and p is an integer of 0-5.)
これらの具体例としては、スチレン、α−メチルスチレン、2,4−ジメチルスチレン、モノクロロスチレン、p−メチルスチレン、p−tert−ブチルスチレン、エチルスチレン等が挙げられる。また、スチレン系化合物と共重合可能な化合物としては、メチルメタクリレート、エチルメタクリレート等のメタクリル酸エステル類;アクリロニトリル、メタクリロニトリル等の不飽和ニトリル化合物類;無水マレイン酸等の酸無水物等が挙げられ、スチレン系化合物と共に使用される。また、ゴム質重合体としては共役ジエン系ゴムおよび共役ジエンと芳香族ビニル化合物のコポリマーまたはこれらの水添物あるいはエチレン−プロピレン共重合体系ゴム等が挙げられる。本発明のために特に好適なポリスチレン系樹脂はポリスチレンおよびゴム強化ポリスチレンである。 Specific examples thereof include styrene, α-methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, and ethylstyrene. Examples of the compound copolymerizable with the styrene compound include methacrylic acid esters such as methyl methacrylate and ethyl methacrylate; unsaturated nitrile compounds such as acrylonitrile and methacrylonitrile; and acid anhydrides such as maleic anhydride. And used with styrenic compounds. Examples of rubbery polymers include conjugated diene rubbers, copolymers of conjugated dienes and aromatic vinyl compounds, hydrogenated products thereof, or ethylene-propylene copolymer rubbers. Particularly preferred polystyrene resins for the present invention are polystyrene and rubber reinforced polystyrene.
本発明(d)成分である脂肪酸アマイドとは、一般式、RCONHR(R:アルキル基)で示される化合物である。本発明に用いる(d)成分のアルキル基の好ましい炭素数の範囲はC8〜C25であり、より好ましくはC10〜C22である。耐熱性、取り扱い性の観点からC8以上が望ましく、成形品光沢、耐衝撃性改良の観点からC25以下が望ましい。
その具体例としては、ラウリン酸アマイド、パルミチン酸アマイド、ステアリン酸アマイド、ベヘン酸アマイド、ヒドロキシステアリン酸アマイド等の飽和脂肪酸モノアマイド類、オレイン酸アマイド、エルカ酸アマイド、リシノール酸アマイド等の不飽和脂肪酸モノアマイド類、N−ラウリルラウリン酸アマイド、N−パルミチルパルミチン酸アマイド、N−ステアリルステアリン酸アマイド、N−オレイルオレイン酸アマイド、N−ステアリルオレイン酸アマイド、N−オレイルステアリン酸アマイド、N−ステアリルエルカ酸アマイド、N−オレイルパルミチン酸アマイド、N−ステアリル12ヒドロキシステアリン酸アマイド、N−オレイル12ヒドロキシステアリン酸アマイド等の置換アマイド類、メチロールステアリン酸アマイド、メチロールベヘン酸アマイド等のメチロールアマイド類が挙げられる。
The fatty acid amide as the component (d) of the present invention is a compound represented by the general formula, RCONHR (R: alkyl group). The range of the preferable carbon number of the alkyl group of (d) component used for this invention is C8-C25, More preferably, it is C10-C22. C8 or more is desirable from the viewpoints of heat resistance and handleability, and C25 or less is desirable from the viewpoint of improving gloss of molded products and impact resistance.
Specific examples thereof include saturated fatty acid monoamides such as lauric acid amide, palmitic acid amide, stearic acid amide, behenic acid amide and hydroxystearic acid amide, unsaturated fatty acid monoamides such as oleic acid amide, erucic acid amide and ricinoleic acid amide. N-lauryl lauric acid amide, N-palmityl palmitic acid amide, N-stearyl stearic acid amide, N-oleyl oleic acid amide, N-stearyl oleic acid amide, N-oleyl stearic acid amide, N-stearyl erucic acid Amide, N-oleyl palmitate amide, N-stearyl 12 hydroxystearic acid amide, substituted amides such as N-oleyl 12 hydroxystearic acid amide, methylol stearate amide , Methylol amide such as methylol behenic acid amide and the like.
また、メチレンビスステアリン酸アマイド、メチレンビスステアリン酸アマイド、メチレンビスラウリン酸アマイド、メチレンビスヒドロキシステアリン酸アマイド、エチレンビスカプリル酸アマイド、エチレンビスカプリン酸アマイド、エチレンビスラウリン酸アマイド、エチレンビスステアリン酸アマイド、エチレンビスイソステアリン酸アマイド、エチレンビスヒドロキシステアリン酸アマイド等の飽和脂肪酸ビスアマイド類、メチレンビスオレイン酸アマイド、エチレンビスオレイン酸アマイド、エチレンビスエルカ酸アマイド、ヘキサメチレンビスオレイン酸アマイド等の不飽和脂肪酸ビスアマイド、m−キシリレンビスステアリン酸アマイド、N,N‘−ジステアリルイソフタル酸アマイド等の芳香族ビスアマイド類等が挙げられる。 Also, methylene bis stearic acid amide, methylene bis stearic acid amide, methylene bis lauric acid amide, methylene bis hydroxystearic acid amide, ethylene biscaprylic acid amide, ethylene biscapric acid amide, ethylene bis lauric acid amide, ethylene bis stearic acid amide Saturated fatty acid bisamides such as ethylene bisisostearic acid amide and ethylene bishydroxystearic acid amide, unsaturated fatty acid bisamides such as methylene bisoleic acid amide, ethylene bisoleic acid amide, ethylene biserucic acid amide and hexamethylene bisoleic acid amide And aromatic bisamides such as m-xylylene bis stearic acid amide and N, N′-distearylisophthalic acid amide. That.
本発明の(d)成分として使用される脂肪酸アマイドの中で、より好ましいものは飽和脂肪酸ビスアマイド類であり、特に、エチレンビスステアリルアマイド等のエチレンビス飽和脂肪酸アマイドが好ましい。
本発明の(a)成分である、ポリフェニレンエーテル樹脂の配合量は50〜99.9重量部の範囲より選ばれる。好ましい範囲は60〜99重量部、より好ましい範囲は70〜95重量部である。(b)成分との混和性や耐熱性、加工性の観点から50重量部以上の配合量が望ましく、剛性等の機械物性の観点から99.9重量部以下の配合が望ましい。
本発明の(b)成分である有機化剤で処理した層状珪酸鉱物塩粉体の配合量は50〜0.1重量部の範囲より選ばれる。好ましい範囲は40〜1重量部、より好ましい範囲は30〜5重量部である。(a)成分との混和性、加工性等の観点から50重量部以下での配合が望ましく、機械物性改良の観点から0.1重量部以上の配合が望ましい。
Among the fatty acid amides used as the component (d) of the present invention, more preferable are saturated fatty acid bisamides, and ethylene bissaturated fatty acid amides such as ethylene bisstearyl amide are particularly preferable.
The blending amount of the polyphenylene ether resin which is the component (a) of the present invention is selected from the range of 50 to 99.9 parts by weight. A preferred range is 60 to 99 parts by weight, and a more preferred range is 70 to 95 parts by weight. A blending amount of 50 parts by weight or more is desirable from the viewpoint of miscibility with component (b), heat resistance, and processability, and a blending amount of 99.9 parts by weight or less is desirable from the viewpoint of mechanical properties such as rigidity.
The compounding quantity of the layered silicate mineral salt powder processed with the organic agent which is (b) component of this invention is chosen from the range of 50-0.1 weight part. A preferred range is 40 to 1 part by weight, and a more preferred range is 30 to 5 parts by weight. From the viewpoints of miscibility with the component (a), processability, etc., 50 parts by weight or less is desirable, and from the viewpoint of improving mechanical properties, 0.1 part by weight or more is desirable.
本発明の(c)成分であるスチレン系樹脂の配合量は、(a)成分と(b)成分との合計量100重量部に対して、0〜150重量部の範囲より選ばれる。好ましくは10〜130重量部、より好ましくは20〜100重量部である。十分な耐熱性付与の観点から150重量部以下の配合が望ましい。
本発明の(d)成分である脂肪酸アマイドの添加量は、(a)成分と(b)成分と(c)成分の合計量100重量部に対して、0.005〜5重量部の範囲より選ばれ、好ましい範囲は0.01〜3重量部、より好ましくは0.05〜1重量部である。十分な対面衝撃性、成形品表面光沢改良の観点から0.005重量部以上の添加が望ましく、十分な耐熱性保持の観点から5重量部以下の添加が望ましい。
The blending amount of the styrene resin as the component (c) of the present invention is selected from the range of 0 to 150 parts by weight with respect to 100 parts by weight of the total amount of the components (a) and (b). Preferably it is 10-130 weight part, More preferably, it is 20-100 weight part. A blending amount of 150 parts by weight or less is desirable from the viewpoint of providing sufficient heat resistance.
The addition amount of the fatty acid amide which is the component (d) of the present invention is from 0.005 to 5 parts by weight with respect to 100 parts by weight of the total amount of the component (a), the component (b) and the component (c). The preferred range is 0.01 to 3 parts by weight, more preferably 0.05 to 1 part by weight. Addition of 0.005 parts by weight or more is desirable from the viewpoint of sufficient impact resistance and improvement of surface gloss of the molded article, and addition of 5 parts by weight or less is desirable from the viewpoint of maintaining sufficient heat resistance.
本発明において、難燃性付与が必要な場合には難燃剤が用いられる。本発明の樹脂組成物は芳香族リン酸エステル系難燃剤の配合によって特に優れた難燃性が発現される。例えばトリフェニルホスフェート、トリクレジルホスフェート、トリキシレニルホスフェート、クレジルジフェニルホスフェート、キシレニルジフェニルホスフェート、ジキシレニルフェニルホスフェート、ヒドロキシノンビスフェノール、レゾルシノールビスホスフェート、ビスフェノールAビスホスフェート等のトリフェニル置換タイプの芳香族リン酸エステル類が特に好適に用いられる。これらは単独でも二種以上組み合わせて用いても良い。
本発明の樹脂組成物には必要に応じて酸化防止剤、紫外線吸収剤、熱安定剤等の安定剤類や着色剤、離型剤等も添加することができる。
In the present invention, a flame retardant is used when it is necessary to impart flame retardancy. The resin composition of the present invention exhibits particularly excellent flame retardancy when blended with an aromatic phosphate ester flame retardant. For example, triphenyl substitution type such as triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresyl diphenyl phosphate, xylenyl diphenyl phosphate, dixylenyl phenyl phosphate, hydroxynon bisphenol, resorcinol bisphosphate, bisphenol A bisphosphate, etc. The aromatic phosphoric acid esters are particularly preferably used. These may be used alone or in combination of two or more.
If necessary, stabilizers such as antioxidants, ultraviolet absorbers, heat stabilizers, coloring agents, release agents and the like can be added to the resin composition of the present invention.
本発明の樹脂組成物のより具体的な調整方法として、樹脂組成物を大量に安定して製造するには単軸または二軸の押出機が好適に用いられる。特に、(b)成分をより高度に微分散させるには、二軸の押出機を用いることが望ましく、例えば(a)成分と(b)成分の混合物、或いは(a)成分と(b)成分と(c)成分の混合物を十分に溶融混練した後、残りの(c)成分や難燃剤等をフィードできるように、押出機のシリンダーの途中に原料フィード口を備えた二軸押出機を用いることがより好ましい。このような原料フィード口を備えた二軸押出機を用いて、一段押出で目的とする樹脂組成物を得ることも可能であるし、また、例えば、単軸押出機で予め(a)成分と(b)成分の混合物、或いは(a)成分と(b)成分と(c)成分等の混合物を押出した後、押出ペレットに残りの原材料を配合、溶融混練して、最終樹脂組成物を得てもよい。 As a more specific adjustment method of the resin composition of the present invention, a single-screw or twin-screw extruder is preferably used for stably producing a large amount of the resin composition. In particular, in order to finely disperse component (b), it is desirable to use a twin screw extruder, for example, a mixture of component (a) and component (b), or component (a) and component (b). And a mixture of the component (c) is sufficiently melt-kneaded, and then a twin screw extruder having a raw material feed port in the middle of the cylinder of the extruder is used so that the remaining component (c), a flame retardant, etc. can be fed. It is more preferable. Using a twin-screw extruder equipped with such a raw material feed port, it is possible to obtain the desired resin composition by single-stage extrusion. After extruding the mixture of component (b) or the mixture of component (a), component (b), component (c), etc., the remaining raw materials are blended into the extruded pellets and melt-kneaded to obtain the final resin composition. May be.
また、本発明の樹脂組成物の射出成形等で発生したランナー部などの成形屑や、市場に出回った後に回収した成形品を粉砕して、任意の割合で未使用の樹脂ペレットに配合して新たな成形品を作成することも、材料の物性保持、向上の点から十分に可能であり、資源の有効利用と環境保護の観点から好ましい。
本発明の樹脂組成物を用いて成形体を成形する場合、特に成形法に制限はないが、射出成形、押出成形、真空成形、圧空成形など既に広く知られた成形法が好適に用いられる。
In addition, molding waste such as runner parts generated by injection molding of the resin composition of the present invention and molded products collected after being marketed are pulverized and blended into unused resin pellets at an arbitrary ratio. Creating a new molded article is also possible from the viewpoint of maintaining and improving the physical properties of the material, which is preferable from the viewpoint of effective use of resources and environmental protection.
When the molded body is molded using the resin composition of the present invention, the molding method is not particularly limited, but already known molding methods such as injection molding, extrusion molding, vacuum molding, and pressure molding are preferably used.
本発明について、実施例に基づき以下具体的に説明する。本発明がこれらの例によって何ら限定されるものではない。尚、以下の用いる部は重量部である。
実施例および比較例中の各測定値は以下の方法によって求めた。
(1)ノッチ付きアイゾッド衝撃値
ASTMのD256に基づき、厚み0.635cmの試験片を用いて23℃にて測定した。
(2)落錘衝撃強度(耐面衝撃性)
50mm×90mm×2.5mm(厚さ)の平板を用い、(株)東洋精機製作所製の落錘グラフィックインパクトテスターにより、23℃における破壊時の全吸収エネルギーを測定した。
The present invention will be specifically described below based on examples. The present invention is not limited to these examples. The parts used below are parts by weight.
Each measured value in Examples and Comparative Examples was determined by the following method.
(1) Izod impact value with notch Based on ASTM D256, it measured at 23 degreeC using the test piece of thickness 0.635cm.
(2) Drop weight impact strength (surface impact resistance)
Using a flat plate of 50 mm × 90 mm × 2.5 mm (thickness), the total absorbed energy at break at 23 ° C. was measured with a falling weight graphic impact tester manufactured by Toyo Seiki Seisakusho.
(3)引張強度、引張破断伸び
ASTMのD638による引張試験法に基づいて23℃で測定した。
(4)曲げ弾性率
ASTMのD790による曲げ試験法に基づいて三点曲げ試験を23℃で測定した。
(5)成形品表面外観
50mm×90mm×2.5mm(厚さ)の平板を用い、目視で評価した(◎:特に良好、○:良好、×:ブツ有り)。
(6)グロス(光沢)
50mm×90mm×2.5mm(厚さ)の平板を用い、(株)村上色彩技術研究所製のグロスメーターGM−26Dにより、平板中央部のグロス(光沢値)を測定した。
(3) Tensile strength, tensile elongation at break Measured at 23 ° C. based on a tensile test method according to ASTM D638.
(4) Flexural Modulus A three-point bending test was measured at 23 ° C. based on the bending test method according to ASTM D790.
(5) Surface appearance of molded product Using a flat plate of 50 mm × 90 mm × 2.5 mm (thickness), it was visually evaluated (◎: particularly good, ○: good, ×: with flaws).
(6) Gloss (gloss)
Using a flat plate of 50 mm × 90 mm × 2.5 mm (thickness), the gloss (gloss value) at the center of the flat plate was measured with a gloss meter GM-26D manufactured by Murakami Color Research Laboratory.
[実施例1]
固有粘度(クロロホルム溶媒で30℃にて測定)が0.43dl/gのポリ(2,6−ジメチル−1,4−フェニレン)エーテル粉体40部と、ジメチル水添ジタローアンモニウムイオンで層間処理したベントナイト(商品名:BENTONR107、米国エレメンティススペシャリティーズ社製、処理量101ミリ当量/100g、d(001)26Å)10部、エチレンビスステアリルアマイド(商品名:カオーワックスREB−FF、花王(株)製)0.5部、と2,6−ジ−t−ブチル−4−メチルフェノール(BHT)1部、とを混合した後、独国Werner&Pfleiderer社製ベントポート付きZSK25二軸押出機(ニーディングディスクL:3個、ニーディングディスクR:5個、シーリング:1個を有するスクリューパターン)の駆動側供給口から供給して十分に溶融混練させた後、PSジャパン(株)社製ポリスチレンH9405を50部、シリンダーの途中に設けた供給口から供給して、シリンダー温度280℃、スクリュー回転数500rpmで溶融混練して樹脂組成物を得た。該樹脂組成物の物性試験結果を表1に示す。
[Example 1]
Interlayer treatment with 40 parts of poly (2,6-dimethyl-1,4-phenylene) ether powder having an intrinsic viscosity (measured with chloroform solvent at 30 ° C.) of 0.43 dl / g and dimethyl hydrogenated ditallow ammonium ion Bentonite (trade name: BENTONR107, manufactured by US Elementis Specialties Co., Ltd., throughput: 101 meq / 100 g, d (001) 26Å), 10 parts ethylene bisstearyl amide (trade name: Kao Wax REB-FF, Kao Corporation )) After mixing 0.5 part and 1,6-di-t-butyl-4-methylphenol (BHT) 1 part, ZSK25 twin screw extruder with a vent port manufactured by Werner & Pfleiderer, Germany (knee) Skating with 3 discs of discs L, 5 discs of discs R, and 1 seal After being supplied from the drive side supply port of the new pattern) and sufficiently melted and kneaded, 50 parts of polystyrene H9405 made by PS Japan Co., Ltd. was supplied from the supply port provided in the middle of the cylinder, and the cylinder temperature was 280 ° C. The resin composition was obtained by melt-kneading at a screw rotation speed of 500 rpm. Table 1 shows the physical property test results of the resin composition.
[参考例1]
実施例1のポリ(2,6−ジメチル−1,4−フェニレン)エーテル粉体の内、5部を無水マレイン酸により変性したポリ(2,6−ジメチル−1,4−フェニレン)エーテル〔ナトリウムメチラートの滴定により求めた無水マレイン酸変性ポリ(2,6−ジメチル−1,4−フェニレン)エーテル100重量%中における無水マレイン酸付加量0.48重量%〕に置き換え、ジメチル水添ジタローアンモニウムイオンで層間処理したベントナイト(商品名:BENTONR107)全量を、シラン化合物で表面処理した水酸化マグネシウム(商品名:KISUMAR5P、協和化学工業(株)製)に置き換えた以外は実施例1を繰り返して樹脂組成物を得た。該樹脂組成物の物性試験結果を表1に示す。
[ Reference Example 1 ]
Of the poly (2,6-dimethyl-1,4-phenylene) ether powder of Example 1, 5 parts of poly (2,6-dimethyl-1,4-phenylene) ether modified with maleic anhydride [sodium Dimethyl hydrogenated ditallow replaced with maleic anhydride-modified poly (2,6-dimethyl-1,4-phenylene) ether 100% by weight 0.48% by weight obtained by titration of methylate] Example 1 was repeated except that the total amount of bentonite (trade name: BENTONR107) treated with ammonium ions was replaced with magnesium hydroxide (trade name: KISUMAR5P, manufactured by Kyowa Chemical Industry Co., Ltd.) surface-treated with a silane compound. A resin composition was obtained. Table 1 shows the physical property test results of the resin composition.
[実施例2]
実施例1で使用したポリ(2,6−ジメチル−1,4−フェニレン)エーテル粉体54部、実施例1で使用したBENTONR107を5部、実施例1で使用したカオーワックスREB−FFを0.5部、実施例1で使用したBHT1部、とを混合した後、実施例1で使用した二軸押出機を用いて、シリンダー温度280℃、スクリュー回転数500rpmの条件で、駆動側供給口から供給して十分に溶融混練させた後、PSジャパン(株)製ポリスチレンH9405を19部、PSジャパン(株)製ポリスチレン685を7部とをシリンダーの途中に設けた第一供給口から供給して、駆動側供給物と溶融混練し、更に、シリンダーの途中に設けた第二供給口から、ビスフェノールA−ビス(ジフェニルフォスフェート)を15部、供給して溶融混練することによって樹脂組成物を得た。該樹脂組成物の物性試験結果を表3に示す。
[ Example 2 ]
54 parts of poly (2,6-dimethyl-1,4-phenylene) ether powder used in Example 1, 5 parts of BENTONR107 used in Example 1, and 0 of Kao wax REB-FF used in Example 1 After mixing 5 parts and 1 part of BHT used in Example 1, using the twin screw extruder used in Example 1, the cylinder side was 280 ° C. and the screw rotation speed was 500 rpm. From the first supply port provided in the middle of the cylinder with 19 parts of polystyrene H9405 from PS Japan and 7 parts of polystyrene 685 from PS Japan. Then, 15 parts of bisphenol A-bis (diphenyl phosphate) is supplied from a second supply port provided in the middle of the cylinder. To obtain a resin composition by melt kneading. Table 3 shows the physical property test results of the resin composition.
[実施例3]
実施例2のカオーワックスREB−FFを、ステアリン酸アマイド(商品名:アマイドAP−1、日本化成(株)製)に置き換えた以外は、実施例3を繰り返して樹脂組成物を得た。該樹脂組成物の物性試験結果を表4に示す。
[ Example 3 ]
Example 3 was repeated to obtain a resin composition, except that the Kao wax REB-FF of Example 2 was replaced with stearic acid amide (trade name: Amide AP-1, manufactured by Nippon Kasei Co., Ltd.). Table 4 shows the physical property test results of the resin composition.
[実施例4]
実施例2のカオーワックスREB−FFを、エチレンビスエルカ酸アマイド(商品名:スリパックスR、日本化成(株)製)に置き換えた以外は、実施例3を繰り返して樹脂組
成物を得た。該樹脂組成物の物性試験結果を表4に示す。
[ Example 4 ]
Example 3 was repeated to obtain a resin composition, except that the Kao wax REB-FF of Example 2 was replaced with ethylenebiserucic acid amide (trade name: SLIPAX R, manufactured by Nippon Kasei Co., Ltd.). Table 4 shows the physical property test results of the resin composition.
[比較例1]
実施例1のBENTONR107と、カオーワックスREB−FFを抜いた以外は、実施例1の操作を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表1に示す。
[Comparative Example 1]
A resin composition was obtained by repeating the operation of Example 1 except that BENTONR107 of Example 1 and Kao wax REB-FF were removed. The physical property test results of the composition are shown in Table 1.
[比較例2]
実施例1のBENTONR107を抜いた以外は、実施例1を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表1に示す。
[Comparative Example 2]
Example 1 was repeated except that BENTONR107 of Example 1 was omitted to obtain a resin composition. The physical property test results of the composition are shown in Table 1.
[比較例3]
実施例1のカオーワックスREB−FFを抜いた以外は、実施例1を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表2に示す。
[Comparative Example 3]
Example 1 was repeated except that the Kao wax REB-FF of Example 1 was removed to obtain a resin composition. The physical property test results of the composition are shown in Table 2.
[比較例4]
参考例1のカオーワックスREB−FFを抜いた以外は、実施例2を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表2に示す。
[Comparative Example 4]
Example 2 was repeated except that the Kao wax REB-FF of Reference Example 1 was removed to obtain a resin composition. The physical property test results of the composition are shown in Table 2.
[比較例5]
参考例1のKISUMAR5Pを、未処理タルク(商品名:ハイトロンA、竹原化学工業(株)製)に置き換えた以外は、実施例2を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表2に示す。
[Comparative Example 5]
Example 2 was repeated to obtain a resin composition, except that KISUMAR5P of Reference Example 1 was replaced with untreated talc (trade name: Hytron A, manufactured by Takehara Chemical Co., Ltd.). The physical property test results of the composition are shown in Table 2.
[比較例6]
実施例1のBENTONR107を、未処理モンモリロナイト(商品名:クニピアF、クニミネ工業(株)製)に置き換えた以外は、実施例1を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表2に示す。
[Comparative Example 6]
Example 1 was repeated to obtain a resin composition, except that BENTONR107 of Example 1 was replaced with untreated montmorillonite (trade name: Kunipia F, manufactured by Kunimine Kogyo Co., Ltd.). The physical property test results of the composition are shown in Table 2.
[比較例7]
実施例1で使用したポリ(2,6−ジメチル−1,4−フェニレン)エーテル粉体57部、実施例1で使用したカオーワックスREB−FFを0.5部、実施例1で使用したBHT1部、とを混合した後、実施例1で使用した二軸押出機を用いて、シリンダー温度280℃、スクリュー回転数500rpmの条件で、駆動側供給口から供給して十分に溶融混練させた後、PSジャパン(株)製ポリスチレンH9405を19部、PSジャパン(株)製ポリスチレン685を8部とをシリンダーの途中に設けた第一供給口から供給して、駆動側供給物と溶融混練し、更に、シリンダーの途中に設けた第二供給口から、ビスフェノールA−ビス(ジフェニルフォスフェート)を15部、供給して溶融混練することによって樹脂組成物を得た。該組成物の物性試験結果を表3に示す。
[Comparative Example 7]
57 parts of poly (2,6-dimethyl-1,4-phenylene) ether powder used in Example 1, 0.5 part of Kao wax REB-FF used in Example 1, BHT 1 used in Example 1 After being mixed and fully melted and kneaded using the twin-screw extruder used in Example 1 at a cylinder temperature of 280 ° C. and a screw rotation speed of 500 rpm, supplied from the drive side supply port , PS Japan Co., Ltd. polystyrene H9405 19 parts, PS Japan Co., Ltd. polystyrene 685 8 parts supplied from the first supply port provided in the middle of the cylinder, melt-kneaded with the drive side supply, Further, 15 parts of bisphenol A-bis (diphenyl phosphate) was supplied from a second supply port provided in the middle of the cylinder and melt kneaded to obtain a resin composition. Table 3 shows the physical property test results of the composition.
[比較例8]
実施例2のカオーワックスREB−FFを抜いた以外は、実施例3を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表3に示す。
[Comparative Example 8]
A resin composition was obtained by repeating Example 3 except that the Kao wax REB-FF of Example 2 was removed. Table 3 shows the physical property test results of the composition.
[比較例9]
実施例2のカオーワックスREB−FFを、ステアリン酸亜鉛(商品名:ダイワックスZ、大日化学工業(株)製)に置き換えた以外は、実施例3を繰り返して樹脂組成物を得た。該組成物の物性試験結果を表3に示す。
[Comparative Example 9]
Example 3 was repeated to obtain a resin composition, except that Kao wax REB-FF of Example 2 was replaced with zinc stearate (trade name: Die Wax Z, manufactured by Dainichi Chemical Industry Co., Ltd.). Table 3 shows the physical property test results of the composition.
本発明のポリフェニレンエーテル樹脂組成物は、優れた耐熱性、剛性を有し、なおかつ
極めて良好な耐面衝撃性、成形品表面光沢、引張伸度と剛性とのバランスを有し、更にリ
ワークやリサイクルにも有利であるため、家電OA機器、事務機、情報・通信機器、電気
電子部品、建材、日用品、玩具、自動車部品等に広く用いることができる。例えば、テレ
ビハウジング、テレビシャーシ、デフレクションヨーク等のテレビ部品、エアコン部品、
オーディオ部品、TVゲーム機部品、モニターハウジング、モニターシャーシ、ノート型
PCハウジング、MDシャーシ類、DVDシャーシ類、DVDスリムトレー、車載用CD
チェンジャートレー、車載用DVDデッキフレーム、モーターカバー、ギアボックス、液
晶プロジェクターハウジング、PDAハウジング、アンテナカバー、プリンターハウジン
グ、プリンターシャーシ、プリンター光学箱、トナーカートリッジ、給紙用トレー、スキ
ャナーハウジング、スキャナーフレーム、携帯電話ハウジング、デジタルカメラ周辺部品
、空気清浄機部品、煙検知器部品、自動車バンパー、フェンダー、ドアミラー、ドアパネ
ル、ホイールカバー、サイドリアカバー、スポイラー、バッテリーハウジング、バッテリ
ートレー等の用途が挙げられる。
The polyphenylene ether resin composition of the present invention has excellent heat resistance and rigidity, and has a very good balance between surface impact resistance, molded product surface gloss, tensile elongation and rigidity, and rework and recycling. Therefore, it can be widely used for home appliances OA equipment, office machines, information / communication equipment, electrical and electronic parts, building materials, daily necessities, toys, automobile parts and the like. For example, TV housing, TV chassis, TV parts such as deflection yoke, air conditioner parts,
Audio parts, TV game machine parts, monitor housing, monitor chassis, notebook PC housing, MD chassis, DVD chassis, DVD slim tray, in-vehicle CD
Changer tray, in-vehicle DVD deck frame, motor cover, gear box, LCD projector housing, PDA housing, antenna cover, printer housing, printer chassis, printer optical box, toner cartridge, paper feed tray, scanner housing, scanner frame, mobile phone Applications include telephone housing, digital camera peripheral parts, air purifier parts, smoke detector parts, automobile bumpers, fenders, door mirrors, door panels, wheel covers, side rear covers, spoilers, battery housings, battery trays, and the like.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004085145A JP2005272533A (en) | 2004-03-23 | 2004-03-23 | Polyphenylene ether resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004085145A JP2005272533A (en) | 2004-03-23 | 2004-03-23 | Polyphenylene ether resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005272533A JP2005272533A (en) | 2005-10-06 |
| JP2005272533A5 true JP2005272533A5 (en) | 2007-04-19 |
Family
ID=35172554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004085145A Pending JP2005272533A (en) | 2004-03-23 | 2004-03-23 | Polyphenylene ether resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005272533A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2113526A4 (en) * | 2007-02-22 | 2011-11-02 | Asahi Kasei Chemicals Corp | CLAY COMPLEX (ORGANIC) -POLYMER, COMPOSITION COMPRISING THE COMPLEX, SHEET-LIKE MATERIAL COMPRISING THE COMPLEX OR THE COMPOSITION, AND METHOD FOR PRODUCING THE CLAY COMPLEX (ORGANIC) -POLYMER |
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2004
- 2004-03-23 JP JP2004085145A patent/JP2005272533A/en active Pending
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