JP2005271315A - Resin material bonding method, permeable resin member, inkjet head manufacturing method, ink flow path member, and inkjet recording apparatus - Google Patents

Abstract

The present invention makes it possible to continuously weld and bond a transparent resin material having a thick portion with a laser beam.
A laser transmitting plastic has a characteristic of transmitting a laser beam. Also it has a projecting portion 2b of the laser transmitting plastic 2 and base 2a thickness of the thickness t ₁ t ₁ + t _2. An inclined surface 2c which is a side surface of the convex portion 2b having a thickness t ₁ + t ₂ is formed at an inclination angle θ. The inclination angle θ of the inclined surface 2c is an angle with respect to the normal line of the welding surface 4, and this inclination angle θ is substantially parallel to the angle of the optical axis of the laser beam 1 incident on the thick stepped portion 2e including the inclined surface 2c. It is formed to become.
[Selection] Figure 1

Description

  The present invention relates to a resin material joining method, a transmissive resin member, an ink jet head manufacturing method, an ink flow path member, and an ink jet recording apparatus capable of continuous welding and joining with a laser beam.

  Conventionally, Patent Document 1 discloses a technique for performing this using a laser beam when bonding a plastic material and a plastic material. This is because, when a plastic material and a plastic material are overlapped and joined together, one of the plastic materials is transparent to the laser beam and the other is absorbing to the laser beam. After laminating these two plastic materials, the laser beam is irradiated from the direction of the plastic material that is transparent to the laser beam. The plastic material that absorbs the laser beam is first dissolved, Next, the heat is transmitted to the surface of the plastic material that transmits the laser beam and melts, so that the plastic that absorbs the laser beam and the plastic material that transmits the laser beam are melted at the contact portion to form an intertwined joint. Both are joined. This welding method using a laser beam is also used for manufacturing a recording head cartridge used in an ink jet recording apparatus.

  FIG. 23 shows an example of a laser irradiation apparatus that irradiates an irradiation object with a laser beam and welds the irradiation object. This laser irradiation apparatus is an apparatus that irradiates a laser beam 1 from a laser beam source (not shown) to a target target through a flat field lens 11 by driving an X-direction galvanometer 10X and a Y-direction galvanometer 10Y. Yes, by scanning the laser beam irradiation data converted from CAD data at high speed, it is possible to join the plastics in a short time, and the assembly tact can be shortened.

  FIG. 24 is a diagram for explaining an example of a conventional welding method in which a laser transmitting plastic is welded to a laser absorbing plastic using a laser beam.

  As shown in FIG. 24A, after the laser transmitting plastic 502 is brought into close contact with the laser absorbing plastic 503 in the direction of the arrow, as shown in FIG. A laser beam 501 is driven by a galvanometer mirror 510 to pass through a laser transmitting plastic 502 that transmits the laser through a flat field lens 511 and irradiates the welding surface 504, whereby the laser transmitting plastic 502 and the laser absorbing plastic 503 are obtained. Weld and join.

  Here, a recording head cartridge used in the ink jet recording apparatus will be described with reference to FIGS. FIG. 25 is a side sectional view of the ink jet head with the ink tank attached. 26 is an exploded perspective view of the recording head cartridge, FIG. 27 is an exploded perspective view of the recording head cartridge viewed from the flow path forming member side, and FIG. 27 is a flow path formation in a state where the flow path forming member is joined. FIG. 3 is an external perspective view of the recording head cartridge as viewed from the member side.

  The recording head cartridge H2000 includes a recording head H2001 and an ink tank H2900 that is detachably attached to the recording head H2001. The flow path forming member H2600 is joined to the holder member H2500 that holds the ink tank H2900, thereby forming an ink flow path that communicates with a discharge port (not shown).

  Ink is supplied into the inkjet head 102 from the ink supply port of the ink tank H2900 via the joint portion in a state where the ink tank H2900 is attached to the recording head H2001. Ink is supplied to the recording element substrate H2100 through the ink flow path H2501 and is discharged onto a recording sheet (not shown) by energy generated by an energy element (not shown) in the silicon substrate.

  Next, a method for joining the flow path forming member H2600 to the tank holder H2500 by laser welding in order to form the ink flow path H2501 will be described.

  The tank holder H2500 is formed of a plastic containing a dye or pigment that absorbs a laser, and the flow path forming member H2600 is formed of a plastic that transmits the laser.

The flow path forming member H2600 is attached to the tank holder H2500 as shown in FIG. 27 and FIG. 28, and then presses the flow path forming member H2600 to bring the joining surface into close contact, and then irradiates the tank holder H2500 with the laser beam. The dye or pigment that absorbs the laser beam contained in the resin mold to be formed generates heat and the resin is melted, and the heat generation at that time also causes the flow path forming member H2600 to heat and melt, and the tank holder H2500 and the flow path forming member H2600 Will be joined.
Japanese Examined Patent Publication No. 62-49850

  The method described above is a reasonable method as a means for reliably forming an airtight ink flow path at a low cost in a short time.

  However, the flow path forming member has a structure in which the portion where the ink supply port is formed protrudes thicker than the other portions, and thus the following problems may occur during welding.

  That is, as shown in FIG. 29A, when a laser transmitting plastic 502 having a plurality of portions with different thicknesses and having a step at a portion where the thickness changes is welded to the laser absorbing plastic 503, FIG. As shown in FIG. 30, which is an enlarged view of part A of FIG. 29B and FIG. 29B, an unwelded portion P may be formed in a part of the weld surface 504. This is because the laser beam 501 is reflected or refracted by the side surface 502a of the step where the thickness changes, and the laser beam 501 does not reach a part of the target joint, and thus an unwelded portion P is generated. It is.

  The above phenomenon will be described more specifically with reference to FIGS. 31 and 32. FIG. FIG. 31 is an explanatory diagram for explaining the process of laser welding the flow path forming member to the tank holder, and FIG. 32 is a diagram for explaining the laser welding process by enlarging part A of FIG. It is explanatory drawing.

As shown in FIGS. 31 (a) and 32 (a), the flow path forming member H2600 is pressed against the tank holder H2500, and then the laser beam 501 is formed with a thicker ink supply port H2602 than other portions. Irradiate from the side of the affected part. Then, as shown in FIG. 32 (b), the laser beam 501 is reflected or refracted by the side wall H2602a, and a laser beam non-reaching region P ₁ where the laser beam 501 does not reach a part of the target joint is generated. Resulting in. In the laser beam non-reaching region P ₁ , the laser absorbing plastic 503 cannot be heated and melted by the laser beam 501, so the laser transmitting plastic 502 is not melted. Thereby, an unwelded portion P as shown in FIG. 32C can be formed in the vicinity of the side wall h2602a, and a continuous welded seal cannot be obtained.

  Accordingly, an object of the present invention is to provide a resin material joining method, a permeable resin member, an ink jet head manufacturing method, an ink flow path member, and an ink jet recording apparatus capable of continuous welding and joining with a laser beam. To do.

In order to achieve the above object, the resin material joining method of the present invention transmits at least one thick portion of a transparent resin material that transmits a laser beam and an absorbent resin material that absorbs the laser beam. Of the resin material that is bonded by irradiating a laser beam from the thick-walled portion side of the transparent resin material, with the surface where the thick-walled resin material portion is not formed in contact with the absorbent resin material In the method
The method includes a step of making the optical axis of the laser beam substantially parallel to the side surface of the thick portion.

  According to the joining method of the resin material of the present invention, since the optical axis of the laser beam and the side surface of the thick part are joined substantially in parallel, the laser beam incident on the thick part or the vicinity of the thick part is passed. The laser beam can be prevented from being refracted and reflected by the side surface of the thick part. Therefore, it is possible to prevent the occurrence of a laser beam non-reaching region in the vicinity of the thick portion, which has conventionally occurred due to the refraction and reflection of the laser beam on the side surface of the thick portion, without forming an unwelded portion. Thus, continuous welding and joining of the permeable resin material and the absorbent resin material are possible.

  According to the present invention, it is possible to continuously weld and join a transparent resin material and an absorbent resin material with a laser beam without forming an unwelded portion.

Embodiments of the present invention will be described below in detail with reference to the drawings.
(First embodiment)
FIGS. 1A and 1B are diagrams for explaining a process of bonding a resin using a laser beam in the present embodiment, and FIG. 2 is a partially enlarged view of part A in FIG. It is an enlarged view. Below, the joining process of the laser transmission plastic 2 and the laser absorption plastic 3 by the laser beam 1 in this embodiment is demonstrated.

  The laser absorbing plastic 3 has a characteristic of absorbing the laser beam 1.

On the other hand, the laser transmitting plastic 2 has a characteristic of transmitting the laser beam 1 and has a base portion 2a having a thickness t ₁ and a convex portion 2b having a thickness t ₁ + t ₂ . That is, the laser-transmitting plastic 2 has the thick stepped portion 2e including the inclined surface 2c having the inclination angle θ by forming the base portion 2a having the thickness t ₁ in the peripheral portion of the convex portion 2b having the thickness t ₁ + t _2. Is formed. In FIG. 2, the inclination angle θ of the inclined surface 2 c is an angle with respect to the normal line of the welding surface 4, and this inclination angle θ is the light of the laser beam 1 incident on the thick stepped portion 2 e as will be described later. It is defined to be substantially parallel to the angle of the shaft.

  As shown in FIG. 1A, the laser transmitting plastic 2 and the laser absorbing plastic 3 are placed on the bonding surface 3b of the laser absorbing plastic 3 so that the bonding surface 2d of the laser transmitting plastic 2 faces each other, and a load is applied to each other. Make contact. That is, the laser-transmitting plastic 2 and the laser-absorbing plastic 3 are pressed against each other at the welding surface 4 so that the convex portion 2 b of the laser-transmitting plastic 2 protrudes.

  Then, as shown in FIG. 1B, the laser beam 1 emitted from a light source (not shown) is deflected by the galvanometer mirror 10 and irradiated from the convex portion 2b side through the flat field lens 11.

  When the laser beam 1 is applied to the contact surface portion between the laser transmitting plastic 2 and the laser absorbing plastic 3, the laser absorbing plastic 3 absorbs the laser beam 1, and first, the laser absorbing plastic 3 generates heat and melts. . Then, this heat is transmitted to the surface of the laser transmitting plastic 2 and the laser transmitting plastic 2 is also melted, whereby both are melt-bonded at the welding surface 4.

  The laser beam 1 is applied to the laser transmitting plastic 2 and the laser absorbing plastic 3 which are irradiated objects through the flat field lens 11. At this time, the laser beam 1 is incident on the inclined surface 2c of the thick stepped portion 2e near the inclined surface 2c at an angle θ with respect to the normal line of the welding surface 4.

On the other hand, the inclined surface 2c is formed at an angle θ corresponding to this. That is, the laser beam 1 enters the thick stepped portion 2e near the inclined surface 2c substantially parallel to the inclined surface 2c. Therefore, the laser beam 1 passes through the thick stepped portion 2e without reaching the welding surface 4 without being reflected or refracted by the inclined surface 2c. The laser beam 1 passing through the vicinity of the inclined surface 2c outside the thick stepped portion 2e also enters the base portion 2a without being reflected or refracted by the inclined surface 2c. Thus, according to this embodiment, the laser beam 1 can reach the welding surface 4 without being influenced by the side surface of the thickened portion. For this reason, it is possible to prevent partial welding failure on the weld surface due to reflection and refraction at the side surface of the thick-walled portion.
(Configuration of recording apparatus to which the present invention is applicable)
Next, the configuration of each part of a suitable head cartridge, recording head, ink tank, ink jet recording apparatus main body, and carriage to which the present invention is implemented or applied will be described with reference to FIGS.

  First, FIG. 3 shows an external perspective view of an ink jet recording apparatus in which the recording head of this embodiment can be mounted.

  A guide shaft 1003 is attached to the main body chassis 1012, and the carriage 1008 is supported by the guide shaft 1003 so as to be slidable in the arrow B direction. In the carriage 1008, a part of the carriage 1008 is fixed to a timing belt 1010 stretched between a drive pulley 1006 and an idler pulley 1007 coupled to a drive motor (not shown), and the drive motor rotates. Accordingly, it can reciprocate in the direction of arrow B along the guide shaft 1003.

  The recording head cartridge H1000 is detachably mounted on the carriage 1008 and is attached to the back surface of the main body chassis 1012 via a flexible cable 1002 that transmits and receives current and signals for driving the recording head cartridge H1000. It is electrically connected to a control board which is a board for controlling the main body.

  The ink jet recording head 1016 of the recording head cartridge H1000 has a discharge port H1100T formed downward in the figure.

  A conveyance roller (not shown) is connected to a recording medium conveyance motor (not shown) via a conveyance gear, and conveys the recording medium in the sub-scanning direction indicated by an arrow A.

  Recording is performed by ejecting ink supplied from the ink tank H1900 from the ejection port H1100T of the recording head H1001 onto the recording paper 1004 which is a recording medium conveyed to the recording area.

As can be seen from the perspective views shown in FIGS. 4A and 4B, the recording head H1001 of the present invention is one constituent element of the recording head cartridge H1000. The recording head cartridge H1000 is connected to the recording head H1001. An ink tank H1900 (H1901, H1902, H1903, H1904, H1905, and H1906) provided detachably on the head H1001. The recording head cartridge H1000 is fixedly supported by positioning means and electrical contacts of a carriage 1008 mounted on the ink jet recording apparatus main body, and is detachable from the carriage 1008. Ink tank H1901 is for black ink, ink tank H1902 is for light cyan ink, ink tank H1903 is for light magenta ink, ink tank H1904 is for cyan ink, ink tank H1905 is for magenta ink, and ink tank 1906 is for ink tank 1906 For yellow ink. In this way, each of the ink tanks H1901, H1902, H1903, H1904, H1905, and H1906 is detachable from the recording head H1001, and each ink tank can be replaced, so that printing running in the ink jet recording apparatus can be performed. Cost is reduced. 4 to 9 are configurations to which a number of new technologies made at the formation stage of the present invention are applied. Therefore, the entire configuration will be described while briefly explaining these configurations.
(1) Description of recording head The recording head H1001 is a bubble jet side shooter type that performs recording using an electrothermal transducer that generates thermal energy for causing film boiling to the ink in response to an electrical signal. It is a recording head.

As shown in the exploded perspective view of FIG. 5, the recording head H1001 includes a recording element unit H1002 and a tank holder unit H1500. Further, as shown in the exploded perspective view of FIG. 6, the recording element unit H1002 includes a recording element substrate H1100, a first plate H1200, an electric wiring substrate H1300, and a second plate H1400, and a tank holder. The unit H1003 includes a tank holder H1500, a flow path forming member H1600, a filter H1700, and a seal rubber H1800.
(1-1) Recording Element Unit FIG. 7 is a partially broken perspective view for explaining the configuration of the recording element substrate H1100. The recording element substrate H1100 has a thin film formed of, for example, a Si substrate H1101 having a thickness of 0.5 to 1 mm. In addition, six rows of ink supply ports H1102 each having a long groove-like through-hole are formed as six-color ink flow paths, and electrothermal conversion elements H1103 are arranged in a staggered manner, one row on each side of each ink supply port H1102. The electrothermal transducer H1103 and the electrical wiring such as Al for supplying electric power to the electrothermal transducer H1103 are formed by a film forming technique. A bump H1105 such as Au is provided on the electrode portion H1104 for supplying power to the electrical wiring. The ink supply port H1102 performs anisotropic etching using the crystal orientation of the Si substrate H1101. When the wafer surface has a crystal orientation of <100> and a thickness direction of <111>, etching proceeds at an angle of about 54.7 degrees by anisotropic etching (KOH, TMAH, human radine, etc.). . Using this method, etching is performed to a desired depth. In addition, on the Si substrate H1101, ink flow path walls H1106 and ejection openings H1107 for forming ink flow paths corresponding to the electrothermal conversion elements H1103 are formed by photolithography, and six rows corresponding to six colors of ink. The discharge port array H1108 is formed. Further, the electrothermal conversion element H1103 is provided so as to face the ejection port H1107, and the ink supplied from the ink flow path H1102 is caused to generate bubbles by the electrothermal conversion element H1103 to eject the ink.

The first plate H1200 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 10 mm. The material of the first plate H1200 is not limited to alumina, and has a linear expansion coefficient equivalent to the linear expansion coefficient of the material of the recording element substrate H1100, and the thermal conductivity of the recording element substrate H1100 material. It may be made of a material having a thermal conductivity equivalent or equal to or higher. The material of the first plate H1200 is, for example, silicon (Si), aluminum nitride (AlN), zirconia (ZrO ₂ ), silicon nitride (Si ₃ N ₄ ), silicon carbide (SiC), molybdenum (Mo), tungsten ( W). Six ink supply ports H1201 for supplying six colors of ink to the recording element substrate H1100 are formed in the first plate H1200, and the six ink supply ports H1102 of the recording element substrate H1100 are the first plate. The recording element substrate H1100 corresponds to each of the six ink supply ports H1201 of H1200, and is bonded and fixed to the first plate H1200 with high positional accuracy. The first adhesive H1202 used for bonding is applied on the first plate H1200 in the shape of a recording element substrate, and so as not to generate an air path between adjacent ink supply ports. The first adhesive H1202 is desirably, for example, a material having a low viscosity, a thin adhesive layer formed on the contact surface, a relatively high hardness after curing, and ink resistance. The first adhesive H1202 is, for example, a thermosetting adhesive mainly composed of an epoxy resin, and the thickness of the adhesive layer is desirably 50 μm or less.

  The electrical wiring substrate H1300 applies an electrical signal for ejecting ink to the recording element substrate H1100, and corresponds to an opening for incorporating the recording element substrate H1100 and an electrode portion H1104 of the recording element substrate H1100. Electrode terminal H1302 (not shown), and an external signal input terminal H1301 for receiving an electrical signal from the main unit located at the end of the wiring. The electrical wiring substrate H1300 and the recording element substrate H1100 are electrically connected. For example, a thermosetting adhesive resin H1304 (between the electrode portion H1104 of the recording element substrate H1100 and the electrode terminal H1302 of the electrical wiring substrate H1300 is used. After coating, the electrode portion H1104 of the recording element substrate H1100 and the electrode terminal H1302 of the electric wiring substrate H1300 are collectively heated and pressed with a heat tool to cure the thermosetting adhesive resin H1304, thereby the electrode portion. H1104 and the electrode terminal H1302 are electrically connected together. Further, as the thermosetting adhesive resin H1304, the case where an anisotropic conductive adhesive containing conductive particles is used is also possible. In the configuration of this embodiment, for example, an anisotropic conductive adhesive film composed of conductive particles having a single particle diameter of 2 to 6 μm of nickel and an adhesive mainly composed of an epoxy resin is used to form the recording element substrate H1100. When the electrode part H1104 and the gold-plated electrode terminal H1302 part of the electric wiring board H1300 were hot-pressed at a temperature of 170 to 250 ° C., electrical connection was suitably made. As a material of the electrical wiring board H1300, for example, a flexible wiring board having a two-layer structure is used, and the surface layer is covered with a resist film. In addition, a reinforcing plate H1303 is bonded to the back side of the external signal input terminal H1301 to improve the flatness of the external signal input terminal H1301. As a material of the reinforcing plate H1303, for example, a heat resistant material such as glass epoxy or aluminum having a thickness of 0.5 to 2 mm is used.

The second plate H1400 is made of, for example, an alumina (Al ₂ O ₃ ) material having a thickness of 0.5 to 1 mm. The material of the second plate H1400 is not limited to alumina, but has a linear expansion coefficient equivalent to that of the recording element substrate H1100 and the first plate H1200, and is equivalent to or more than the thermal conductivity thereof. It may be made of a material having a thermal conductivity of The second plate H1400 has a shape having an opening larger than the outer dimension of the recording element substrate H1100 bonded and fixed to the first plate H1200. Further, the recording element substrate H1100 and the electric wiring substrate H1300 are bonded to the first plate H1200 with a second adhesive (not shown) so as to be electrically connected in a plane, and the back surface of the electric wiring substrate H1300 is third. Are bonded and fixed by an adhesive (not shown). In addition, the electric wiring board H1300 is bonded to the second plate H1400, and at the same time, is bent on one side of the first plate H1200 and the second plate H1400, and the third bonding is performed on the side of the first plate H1200. Glued with agent. As the second adhesive, for example, an adhesive having a low viscosity, a thin adhesive layer formed on the contact surface, and ink resistance is used. Further, as the third adhesive, for example, a thermosetting adhesive film having a thickness of 10 to 100 μm mainly composed of an epoxy resin is used.

The electrical connection portion of the recording element substrate H1100 and the electrical wiring board H1300 of the recording element unit H1002 configured as described above is sealed with a first sealant (not shown) and a second sealant, The connection is protected from ink corrosion and external impact. The first sealing agent mainly seals the outer peripheral portion of the recording element substrate H1100, and the second sealing agent seals the edge of the opening of the electrical wiring substrate H1300. Further, the folded electric wiring board H1300 is further formed in accordance with the shape of the holder unit H1003.
(1-2) Tank Holder Unit The tank holder H1500 is formed by resin molding, for example. As the resin material, it is desirable to use a resin material mixed with 5 to 40% of glass filler in order to improve the shape rigidity. The tank holder H1500 holds a detachable ink tank H1900.

As shown in FIG. 6, the tank holder H1500 is a component of the tank holder unit H1003 that forms an ink flow path H1501 for guiding ink from the ink tank H1900 to the recording element unit H1002, and a flow path forming member of the H1600. The ink flow path H1501 is formed by ultrasonic welding. In addition, a filter H1700 for preventing dust from entering from the outside is joined to the joint portion engaged with the ink tank H1900 by thermal welding. Further, in order to prevent ink from evaporating from the joint portion, A seal rubber H1800 is attached.
(1-3) Coupling of recording head unit and tank holder unit As shown in FIG. 5 described above, the recording head H1001 is completed by coupling the recording head unit H1002 to the tank holder unit H1003. The coupling is performed as follows. An adhesive is applied so that the ink supply port of the recording element unit H1002 (ink supply port H1201 of the first plate H1200) communicates with the ink supply port of the tank holder unit H1003 (ink supply port H1601 of the flow path forming member H1600). And fix them by gluing. Further, in addition to the ink supply port portion, a portion where the recording element unit H1002 and the tank holder unit H1003 are in contact is bonded and fixed with several adhesives. The adhesive is preferably an adhesive that has ink resistance, is hardened at room temperature, and is flexible enough to withstand the difference in linear expansion between different materials. Silicone adhesive is used.
(2) Description of Print Head Cartridge FIG. 8 described above is a diagram for explaining mounting of the print head H1001 and the ink tanks H1901, H1902, H1903, H1904, H1905, and H1906 constituting the printhead cartridge 1000, and the ink tank H1901. , H1902, H1903, H1904, H1905, and H1906 contain ink of corresponding colors. Each ink tank has an ink supply port H1907 for supplying ink in the ink tank to the recording head H1001. For example, an ink supply port H1907 is formed in the ink tank H1901, and in a state where the ink tank H1901 is attached to the recording head H1001, black ink in the ink tank H1901 enters the recording head H1001 via the ink supply port H1907. Supplied.

Further, FIG. 9 described above is a cross-sectional view of the recording head cartridge H1000. As shown in FIG. 9, a recording element substrate H1100 is provided on one side of the lower surface of the box-shaped recording head H1001. The print head H1001 is provided with the joint H1517 as described above, and the ink flow path H1501 extending toward the print element substrate 1100 is formed in the joint H1517. As an ink flow in such a recording head cartridge, an ink tank H1901 for black ink will be described as an example. The ink in the ink tank H1901 is supplied into the recording head H1001 through the ink supply port H1907 and the joint H1517 of the ink tank H1901. The ink supplied into the recording head H1001 is supplied to the first plate H1200 through the ink flow path H1501, and further supplied from the first plate H1200 to the ink supply port H1102 of the recording element substrate H1100, and further electrothermal conversion. It is supplied to a foaming chamber H1109 having an element H1103 and a discharge port H1107. The ink supplied to the bubbling chamber H1109 is ejected toward a recording sheet which is a recording medium by the thermal energy given to the electrothermal conversion element H1103.
(Joint process of tank holder and flow path forming member)
Next, the process of joining the tank holder H1500 and the flow path forming member H1600 will be described with reference to FIGS.

  FIG. 10 is a perspective view for explaining a process of joining the tank holder and the flow path forming member. FIG. 11 is an external perspective view of the recording head cartridge shown in FIG. 9 viewed from the flow path forming member side.

  FIG. 12 is a diagram for explaining the ink flow path H1601 of the flow path forming member H1600, and the hatched portion in the figure is a welding location for forming the ink flow path. FIG. 13 is a diagram for explaining the ink flow path H1501 of the tank holder H1500, and the hatched portion in the figure is a welding location for forming the ink flow path. FIG. 14 is CAD data for accurately irradiating the welding location with the laser beam 1 and represents the center line of the welding width of the portion indicated by the hatched portion in FIG.

  15 and 16 are cross-sectional views for explaining a process of joining the tank holder and the flow path forming member, and FIG. 15 shows a state before the tank holder is pressed against the flow path forming member. FIG. 16 is a view showing a state in which a laser beam is applied to the pressure-contacted tank holder and the flow path forming member.

  FIGS. 17A, 17B, and 17C are views for explaining a process of joining the tank holder H1500 and the flow path forming member H1600, and a partial enlargement around the ink flow path shown by A portion in FIG. It is sectional drawing.

  The tank holder H1500 is formed of a plastic containing a dye or pigment that absorbs a laser. The flow path forming member H1600 is formed of a resin that transmits laser.

  First, as shown in FIGS. 10, 15, and 17A, the flow path forming member H1600 is pressed against the tank holder H1500 in the direction of the arrow. At this time, the hatched portion of the flow path forming member H1600 in FIG. 12 and the hatched portion of the holder member H1500 in FIG. 13 are in close contact with each other. That is, the groove shown as the ink flow path H1601 communicating with the ink supply port H1602 of the flow path forming member H1600 in FIG. 12 and the groove shown as the ink flow path H1501 of the tank holder H1500 in FIG. The two are brought into close contact with each other.

  Next, as shown in FIGS. 11, 16, and 17B, the laser beam 1 is driven to drive the galvanometer mirror 10 based on the CAD data 200 shown in FIG. , The ink flow path H1501 of the tank holder H1500 and the ink flow path H1601 of the flow path forming member H1600 are joined. In this way, the ink flow path of the ink jet head H1001 is formed by welding and joining the joint surfaces around the ink flow path with the laser beam 1.

  As shown in FIG. 17C, the flow path forming member H1600 has a chimney-shaped protruding ink supply port H1602 for supplying ink, and the side surface portion of the ink supply port H1602 is described above. The thick stepped portion 2e includes the inclined surface 2c having the inclination angle θ. The side surface of the ink supply port H1602 has the same inclination angle θ as the angle θ of the optical axis center of the laser beam 1 incident on the side surface portion of the ink supply port H1602. For this reason, the laser beam 1 can be made to reach the entire target welding region indicated by the oblique lines in FIGS. 12 and 13 without causing reflection or refraction of the laser beam 1 by the side surface of the ink supply port H1602. Partial welding failure on the weld surface can be prevented.

As described above, the irradiation angle of the laser beam is calculated in advance at the stepped portion where the thickness of the side surface around the ink supply port H1602 of the flow path forming member H1600 changes, and the side surface of the stepped portion has the same inclination as that. With this configuration, it is possible to perform laser welding with high accuracy, and it is possible to form a highly reliable ink flow path with good sealing performance.
(Second Embodiment)
FIG. 18 is a diagram for explaining a process of bonding a resin using a laser beam in the present embodiment. Note that the same reference numerals as those used in the description of the first embodiment are used for the same members as those described in the first embodiment and in the drawings.

  In the first embodiment, the laser transmitting plastic 102 of the present embodiment is formed with adjacent convex portions 102b and 202b adjacent to each other, and the laser absorbing plastic 3 is placed on a movable table 115 that can be moved. Basically the same except for the form. Therefore, detailed description of the same points as in the first embodiment is omitted.

  First, the laser transmitting plastic 102 is pressed against the laser absorbing plastic 3 (FIG. 18A).

  Next, the moving table 115 is moved so that the convex portion 102b is positioned below the flat field lens 11, and first, the portion corresponding to the convex portion 102b is welded by irradiating the convex portion 102b with the laser beam 1. (FIG. 18 (b)). Similarly to the first embodiment, the side surface of the convex portion 102b is formed as an inclined surface 102c having an inclination angle θ corresponding to the angle of the optical axis of the laser beam 1 so as to avoid reflection and refraction of the laser beam 1. The portion corresponding to the convex portion 102b of the welding surface 4 is welded without causing poor welding due to the presence of the thick stepped portion 102e. In addition, the laser beam 1 is not irradiated to the convex part 202b when the convex part 102b is welded.

  Next, the moving table 115 is moved in the direction of arrow C shown in FIG. 18C to place the convex portion 202b under the flat field lens 11, and the convex portion 202b is irradiated with the laser beam 1 so as to correspond to the corresponding portion. Weld. At this time, the laser beam 1 is not applied to the convex portion 102b.

  As described above, the laser-transmitting plastic 102 is welded to the laser-absorbing plastic 3 without causing a partial welding failure on the welding surface 4 due to reflection and refraction of the laser beam 1 by the side surface of the thick stepped portion 102e ( FIG. 18 (d)).

  In FIG. 18, the thicknesses of the convex portions 102b and 202b are shown as the same thickness, but this embodiment is not limited to this, and can be applied to those having different thicknesses. It is.

  Moreover, although the example which welds in order of the convex parts 102b and 202b was shown, this order may naturally be reversed.

  Further, in the case where two sets of the galvano mirror 10, the flat field lens 11, and the laser light source 1 are provided so as to correspond to the convex portions 102b and 202b, the convex portions 102b and 202b are welded simultaneously. You may do it. In this case, the table on which the laser absorbing plastic 3 is placed may not move. In the present embodiment, the inclined surfaces 102c of the convex portions 102b and 202b have the same angle. However, when two locations are welded simultaneously, the angles are defined according to the irradiation angles of the respective laser beams. It does not have to be the same angle.

  In this embodiment, the laser transmitting plastic 102 having two convex portions is described as an example. However, even when two or more convex portions are formed, a similar inclined surface is formed on the side surface of each convex portion. By repeating the above-described steps according to the number of convex portions formed, good welding can be performed without causing poor welding.

  Next, the process of welding and joining the tank holder H1505 and the flow path forming member H1605 will be described with reference to FIGS.

  The flow path forming member H1605 of this embodiment is also formed of a laser transmitting plastic material. However, the flow path forming member H1605 of the present embodiment is different from the flow path forming member H1600 of the first embodiment, and the thick portion has a black ink supply port H1607b portion and yellow ink supply of three types of ink colors. The opening H1607y, the magenta ink supply port H1607m, and the cyan ink supply port H1607c are formed in two portions, that is, a portion formed collectively. In other words, the portion of the black ink supply port H1607b of the flow path forming member H1605 corresponds to the above-described convex portion 202c, and the portion formed by combining the three types of ink supply ports corresponds to the convex portion 102c. Each supply port communicates with a groove indicated as an ink flow path H1606.

  First, as shown in FIG. 19, the flow path forming member H1605 is pressed against the tank holder H1505 in the direction of the arrow. In the tank holder H1505, grooves indicated as ink flow paths H1506 are formed at positions corresponding to the ink flow paths H1606 communicating with the respective supply ports, and the flow paths are formed so as to correspond to the respective grooves. The member H1605 and the tank holder H1505 are pressed against each other.

  Next, as shown in FIG. 20, the central portion of the black ink supply port H1607b, which is a thick portion, is moved directly below the center of the flat field lens 11 by the moving stage 115, and the first laser irradiation is performed. Thus, the periphery of the black ink supply port H1607b is welded to form an ink flow path.

  Next, as shown in FIG. 21, the moving stage 15 is further moved to provide another thick portion of three types of ink color yellow ink supply port H1607y, magenta ink supply port H1607m, and cyan ink supply. By moving the central portion of the portion where the mouths H1607c are gathered directly below the central portion of the flat field lens 11 and performing the second laser irradiation, the periphery of the gathered portion is welded and finally shown in FIG. In this way, the flow path forming member H1605 is welded to the tank holder H1501, and the ink flow path H1506 is formed.

  Here, the thick portion (the portion corresponding to the convex portion 202c) where the black ink supply port H1607b is formed is first welded, and then the thick portion (the convex portion) where the three types of ink supply ports are formed together. The portion corresponding to 102c is welded, but as described above, any of them may be welded first.

  As described above, in the flow path forming member H1605 of the present embodiment, the thick portion where the black ink supply port H1607b is formed, the yellow ink supply port H1607y, the magenta ink supply port H1607m, and the cyan ink supply port H1607c gather. Each of the side portions of the thick portion formed in this manner is formed as an inclined surface having an inclination angle θ so as to be substantially parallel to the optical axis of the laser beam 1 incident on each thick portion. For this reason, it becomes possible to make the laser beam 1 reach the entire target welding region without causing the laser beam 1 to be reflected or refracted by the side surfaces of the respective thick portions, thereby causing a partial welding failure on the welding surface. Therefore, it is possible to form a highly reliable ink flow path having good sealing characteristics.

  In each of the above-described embodiments, the relationship between the optical axis of the laser beam and the inclination angle of the side surface of the thick portion assumes the angle of the optical axis of the laser beam in the vicinity of the side surface in advance and is approximately parallel to this. The angle of the optical axis of the laser beam may be adjusted so as to be substantially parallel to the angle of inclination of the side surface. In addition, the optical axis of the laser beam passing through the vicinity of the side surface of the thick portion and the side surface may not be transmitted through the thick portion, or the side surface may be in a substantially parallel relationship. The optical axis of the laser beam incident on the thick portion and the side surface may be in a substantially parallel relationship, and further, the laser beam passing near the side surface of the thick portion and the thick wall near the side surface. The side surface may be in a substantially parallel relationship with any of the optical axes of the laser beams incident on the part.

It is explanatory drawing for demonstrating the process of joining resin using the laser beam in the 1st Embodiment of this invention. It is the partially expanded view which expanded the A section in FIG.1 (b). 1 is a perspective view of an ink jet recording apparatus in which a recording head cartridge according to a first embodiment of the present invention can be mounted. 2 is an external perspective view of a recording head cartridge. FIG. FIG. 2 is an exploded perspective view of a recording head cartridge. FIG. 3 is an exploded perspective view of a recording element unit. 1 is an external perspective view of a recording element substrate. FIG. 3 is a perspective view of a recording head cartridge and an ink tank. FIG. 3 is a side cross-sectional view of a recording head cartridge with an ink tank attached. It is a perspective view explaining the process of joining a tank holder and a channel formation member. FIG. 10 is an external perspective view of the recording head cartridge shown in FIG. 9 as viewed from the flow path forming member side. It is a figure explaining the groove | channel used as the ink flow path formed in the flow path formation member. It is a figure explaining the groove | channel used as the ink flow path formed in the tank holder. It is CAD data of the ink flow path for irradiating a welding location with a laser beam. It is sectional drawing which shows the state before a flow-path formation member is press-contacted to a tank holder. It is sectional drawing which shows the state which has irradiated the laser beam to the tank holder and flow-path formation member which were press-contacted. FIG. 17 is a partially enlarged cross-sectional view around the ink flow path indicated by A portion in FIG. 16. It is explanatory drawing for demonstrating the process of joining resin using the laser beam in the 2nd Embodiment of this invention. It is sectional drawing which shows the state before a flow-path formation member is press-contacted to a tank holder. It is sectional drawing which shows the state which irradiates the laser beam to the thick part in which the black ink supply port was formed among the tank holder and the flow-path formation member which were press-contacted. It is sectional drawing which shows the state which has irradiated the laser beam to the thick part in which each color ink supply port of yellow, magenta, and cyan was formed. It is sectional drawing which shows the ink flow path formed by welding the flow-path formation member to the tank holder. It is a typical perspective view which shows an example of a laser irradiation apparatus. It is explanatory drawing for demonstrating the process of joining resin using the conventional laser beam. FIG. 6 is a side sectional view of an example of a conventional recording head cartridge with an ink tank attached. FIG. 26 is an exploded perspective view of the recording head cartridge shown in FIG. 25. FIG. 26 is an exploded perspective view of the recording head cartridge shown in FIG. 25 as viewed from the flow path forming member side. FIG. 26 is an external perspective view of the recording head cartridge shown in FIG. 25 as viewed from the flow path forming member side. It is explanatory drawing for demonstrating the process of welding the laser transmission plastic which has produced the level | step difference in the part in which thickness changes to laser absorption plastic. It is the figure which expanded the A section of FIG.29 (b). It is explanatory drawing for demonstrating the process of laser welding the conventional flow-path formation member to a tank holder. It is the figure which expanded the A section of FIG.31 (b).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser beam 2 Laser transmissive plastic 2a Base 2b Convex part 2c Inclined surface 2d Joint surface 2e Thick step part 3 Laser absorption plastic 3b Joint surface 4 Welding surface 10 Galvano mirror 11 Flat field lens 15 Moving stage 54 About P Unwelded part P ₁ the laser beam unreached regions θ tilt angle

Claims (23)

A transparent resin material that has at least one thick part and transmits a laser beam, and an absorbent resin material that absorbs a laser beam, the surface of the transparent resin material on which the thick part is not formed are In the bonding method of the resin material, which is overlapped so as to be in contact with the absorbent resin material and bonded by irradiating a laser beam from the thick part side of the transparent resin material,
A method for joining resin materials, comprising a step of making an optical axis of a laser beam substantially parallel to a side surface of the thick portion.   The method for joining resin materials according to claim 1, comprising a step of making an optical axis of a laser beam passing through the vicinity of the side surface substantially parallel to the side surface.   The resin material joining method according to claim 1, further comprising a step of making the optical axis of a laser beam incident on the thick portion near the side surface substantially parallel to the side surface.   4. The method according to claim 1, further comprising the step of preparing the transparent resin material formed so that the side surface is substantially parallel to an optical axis of a laser beam incident on the thick portion near the side surface. The joining method of the resin material of any one of Claims 1.   The resin material joining method according to any one of claims 1 to 4, wherein each of the two or more thick portions is sequentially irradiated with a laser beam.   The resin material joining method according to any one of claims 1 to 5, wherein the laser beam is irradiated by a galvanometer. In the transmissive resin material having at least one thick part that is bonded to the absorbent resin material that absorbs the laser beam by the irradiation of the laser beam, and that transmits the laser beam,
A transparent resin material, characterized in that a side surface of the thick part is formed so as to be substantially parallel to an optical axis of an irradiated laser beam.   The transparent resin material according to claim 7, wherein the side surface is formed so as to be substantially parallel to an optical axis of a laser beam passing through the vicinity of the side surface.   The transparent resin material according to claim 7 or 8, wherein the side surface is formed so as to be substantially parallel to an optical axis of a laser beam incident on the thick portion in the vicinity of the side surface. A tank holder made of an absorbing resin material that absorbs a laser beam for holding the ink tank, and a transparent resin material that transmits the laser beam for forming an ink flow path, having at least one thick portion. The ink flow path member made of the ink flow path member is overlapped so that the surface of the ink flow path member on which the thick part is not formed is in contact with the tank holder, and from the thick part side of the ink flow path member In the method of manufacturing an inkjet head that is bonded by irradiating a laser beam,
A method of manufacturing an ink jet head, comprising a step of making an optical axis of a laser beam substantially parallel to a side surface of the thick portion.   The method of manufacturing an ink jet head according to claim 10, comprising a step of making an optical axis of a laser beam passing near the side surface substantially parallel to the side surface.   The method of manufacturing an ink jet head according to claim 10, comprising a step of making an optical axis of a laser beam incident on the thick portion near the side surface substantially parallel to the side surface.   13. The method includes the step of preparing the ink flow path member formed so that the side surface is substantially parallel to an optical axis of a laser beam incident on the thick portion near the side surface. The manufacturing method of the inkjet head of any one of these.   The method for manufacturing an ink jet head according to claim 10, wherein each of the two or more thick portions is sequentially irradiated with a laser beam.   The method of manufacturing an ink jet head according to claim 10, wherein the laser beam is irradiated by a galvanometer. The groove formed on the surface of the tank holder that is joined to the ink flow path member corresponds to the groove formed on the surface of the ink flow path member that is joined to the tank holder. Contacting the tank holder and the ink flow path member;
The method for manufacturing an ink jet head according to claim 10, comprising a step of joining the periphery of the groove by irradiating a laser beam. In an ink flow path member made of a transparent resin material that transmits a laser beam, which is joined to the tank holder made of an absorbent resin material that absorbs the laser beam by irradiation of the laser beam,
An ink flow path member having at least one thick part, wherein a side surface of the thick part is formed so as to be substantially parallel to an optical axis of an irradiated laser beam.   The ink flow path member according to claim 17, wherein the side surface is formed so as to be substantially parallel to an optical axis of a laser beam passing near the side surface.   The ink flow path member according to claim 17 or 18, wherein the side surface is formed so as to be substantially parallel to an optical axis of a laser beam incident on the thick portion near the side surface.   The groove | channel corresponding to the groove | channel currently formed in the surface joined to the said ink flow path member of the said tank holder is formed in the surface joined to the said tank holder of the said ink flow path member. The ink flow path member according to any one of 17 to 19.   21. The ink supply port according to any one of claims 17 to 20, wherein an ink supply port communicating with a groove formed on a surface of the ink flow path member joined to the tank holder is formed in the thick portion. The ink flow path member according to the description.   A transporting means for transporting a recording medium, an ink jet head manufactured by the ink jet head according to any one of claims 10 to 16, wherein ink is ejected and recording is performed on the recording medium, and An ink jet recording apparatus comprising: a holding unit that reciprocates in a direction intersecting a transport direction of the recording medium.   A conveying means for conveying the recording medium, an ink jet member that discharges ink and has the ink flow path member according to any one of claims 17 to 21, holds an inkjet head that performs recording on the recording medium, and An ink jet recording apparatus comprising: a holding unit that reciprocates in a direction intersecting a transport direction of the recording medium.

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