JP2005268274A - Rotary table mechanism - Google Patents

Abstract

An object of the present invention is to provide a rotary table mechanism capable of easily and interchangeably mounting a plurality of types of table members.
In a rotary table mechanism (4) for rotating a table member (6) holding a wafer sheet by an expanding ring (7) in a horizontal plane in a die bonding apparatus, a plurality of rolling support members (12) and a rotation guide member (13) are provided on the lower surface of the table member (6). And the rolling support member 12 is brought into contact with the table holding surface 5 a to support the table member 6, and the rotary guide member 13 is brought into contact with the circumferential guide surface provided on the guide ring 11. The member 6 is guided to be rotatable with respect to the center of rotation. Thereby, the table member 6 can be easily removed from the base member 5, and a plurality of types of table members can be easily and interchangeably mounted.
[Selection] Figure 2

Description

  The present invention relates to a rotary table mechanism that rotates a component holding unit that holds a wafer sheet or the like to which a semiconductor chip is attached.

  In the manufacturing process of a semiconductor device, a semiconductor chip is cut out from a wafer composed of a large number of chips, and the chip is cut out with the semiconductor wafer attached to a wafer sheet. The cut individual chips are peeled off from the adhesive sheet by a pickup head, picked up, and bonded to a substrate such as a lead frame.

The component supply unit of this bonding apparatus requires a moving mechanism for horizontally moving the wafer ring holding the wafer sheet in order to align the semiconductor wafer to be picked up at the pick-up position. A linear movement mechanism that moves the holding table in the XY direction and a rotary table mechanism that rotates the holding table in the θ direction are combined (for example, see Patent Document 1).
JP-A-5-299448

  In recent years, in the semiconductor manufacturing process, a wafer size has been increased due to a demand for improvement in productivity, and a variety of products tends to be required. For this reason, there is an urgent need to target a plurality of types of semiconductor wafers including large-diameter wafers in the die bonding apparatus. There is a need for a rotating table mechanism. However, the conventional rotary table mechanism employs a configuration in which the outer peripheral side of the holding table is held by a bearing mechanism such as a cross roller bearing, so that it is difficult to easily replace the holding table.

  Therefore, an object of the present invention is to provide a rotary table mechanism capable of easily and interchangeably mounting a plurality of types of table members.

  The rotary table mechanism of the present invention is a rotary table mechanism that rotates a component holding unit that holds an electronic component within a component holding plane, and rotates in a plane that is mounted with the component holding unit and substantially parallel to the component holding plane. A free table member, a base member formed with a table holding surface for holding the table member substantially parallel to the component holding plane, and a rotation holding mechanism for holding the table member rotatably with respect to the base member; And a rotation driving means for rotating the table member, and the rotation holding mechanism is formed on the upper surface side of the base member and a support means for supporting the table member so as to be movable relative to the base member. The abutting guide member coupled to the lower surface of the table member is brought into contact with the circumferential guide surface, whereby the table member is brought into contact with the circumferential guide surface. And a rotation guide means for rotatably guiding with respect to the center point of the surface.

According to the present invention, the rotation holding mechanism that rotatably holds the table member with respect to the base member provided with the table holding surface, the support means that supports the table member so as to be relatively movable with respect to the base member, and the table The rotating guide means is configured so that the abutting guide member is brought into contact with the circumferential guide surface formed on the holding surface and the table member is rotatably guided with respect to the center point of the circumferential guide surface. Thus, the table member can be easily detached from the base member, and a plurality of types of table members can be easily and interchangeably mounted.

  Next, embodiments of the present invention will be described with reference to the drawings. 1A is a perspective view of a rotary table mechanism according to an embodiment of the present invention, FIG. 1B is a partial cross-sectional view of the rotary table mechanism according to an embodiment of the present invention, and FIG. FIG. 3A is a plan view of the rotary table mechanism according to the embodiment of the present invention, and FIG. 3B is a perspective view of the rotary table mechanism according to the embodiment of the present invention. FIG. 4 is a side sectional view, FIG. 4 is a plan sectional view of a rotary table mechanism according to an embodiment of the present invention, and FIGS. 5A and 5B are partial sectional views of the rotary table mechanism according to an embodiment of the present invention. .

  First, the overall structure of the component table 1 will be described with reference to FIG. The component table 1 is disposed in a component supply unit that supplies an electronic component to a transfer head in an electronic component mounting apparatus that mounts the electronic component on a substrate, such as a die bonding apparatus, and aligns the electronic component with the transfer head. It is used for. In FIG. 1A, a rotary table mechanism 4 is mounted on a XY table 2 having a configuration in which an X table 2X and a Y table 2Y are stacked via a coupling bracket 3. The rotary table mechanism 4 has a structure in which an annular table member 6 is rotatably disposed on a top surface side of a flat base member 5 by a rotary drive mechanism 8.

  A cylindrical expanding ring 7 is fixed to the upper surface side of the table member 6 along a circular opening 6a. When supplying the components in the die bonding apparatus, the wafer ring 9 held by the wafer holder (not shown) is lowered from above with respect to the expand ring 7 and mounted on the wafer ring 9 as shown in FIG. The lower surface of the wafer sheet 9a is pressed against the top of the expanding ring 7, and the wafer sheet 9a is stretched.

  Thereby, the semiconductor chips 10 which are electronic components stuck and held on the wafer sheet 9a while being separated by dicing are separated from each other, and the semiconductor chip 10 can be taken out for each piece by the transfer head. Become. In this state, the semiconductor chip 10 is held by the expanding ring 7 via the wafer sheet 9a. Therefore, the expand ring 7 is a component holding portion that holds the semiconductor chip 10 that is an electronic component. At this time, the semiconductor chip 10 is held in a component holding plane H formed by a plane in contact with the top of the expand ring 7, and by rotating the table member 6 by driving the rotation driving mechanism 8 in this state, The semiconductor chip 10 is rotated in the component holding plane H by the rotary table mechanism 4.

  Next, the detailed structure of the rotary table mechanism 4 will be described with reference to FIGS. FIG. 2 shows the table member 6 and the expand ring 7 partially cut away, and the table member 6 with the expand ring 7 mounted on the upper surface is rotatable in a plane parallel to the component holding plane H. It has become. The upper surface of the base member 5 is set parallel to the component holding plane H, and the table member 6 is held by the upper surface of the base member 5. That is, the base member 5 is formed with a table holding surface 5 a that holds the table member 6 substantially parallel to the component holding plane H.

  Next, a rotation holding mechanism that rotatably holds the table member 6 with respect to the base member 5 and a rotation drive mechanism 8 that rotates the table member 6 will be described. As shown in FIG. 2, the base member 5 is provided with a circular opening 5 b concentrically with the opening 6 a of the table member 6. A guide ring 11 is provided at the edge of the opening 5b. The guide ring 11 is provided with a flange 11a projecting outward from the upper end. On the outer periphery of the guide ring 11, there is provided a circumferential guide surface 11c with which a contact guide member 13 described later contacts. A circumferential guide surface 11 c may be provided on the inner periphery of the guide ring 11. Moreover, the collar part 11a is not essential.

  On the lower surface of the table member 6, rolling support members 12 are provided so as to protrude downward at four equal positions. As shown in FIG. 5A, the rolling support member 12 includes a ball holding portion 12a on which a ball 12b is rotatably mounted at a lower end portion. The upper portion of the ball holding portion 12a is a screw portion 12d that is screwed into a fastening hole 6b provided in the table member 6. By tightening the lock nut 12c by screwing the screw portion 12d into the fastening hole 6b, The rolling support member 12 is fixed to the table member 6.

  The lower end surface of the ball 12b mounted on the four rolling support members 12 contacts the table holding surface 5a, and the ball 12b rolls on the table holding surface 5a, so that the table member 6 is moved by the table holding surface 5a. It is held movably in the horizontal direction via the rolling support member 12. Therefore, the rolling support member 12 serves as a support means for supporting the table member 6 so as to be movable relative to the base member 5. In this embodiment, the support means is coupled to the lower surface of the table member 6. It has a configuration.

  As shown in FIG. 2, contact guide members 13 are provided on the lower surface of the table member 6 so as to protrude downward at four locations located on the outer peripheral side of the guide ring 11. As shown in FIG. 5B, the abutting guide member 13 includes a shaft member 13a having a roller 13b mounted on its outer periphery using a ball bearing or the like, and a bolt 13d in a mounting hole 6c provided in the table member 6. It has a fixed configuration, and the vertical position of the roller 13b is held by the lower end portion of the shaft member 13a and the collar member 13c.

  In a state where the table member 6 is held by the base member 5, the rollers 13 b of the four contact guide members 13 are in contact with the circumferential guide surface 11 c of the guide ring 11. As a result, the table member 6 is held rotatably with respect to the center point of the guide ring 11. In this state, the collar 11a prevents the roller 13b from being detached upward. The guide ring 11 and the contact guide member 13 are formed at a predetermined angle (in the present embodiment, perpendicular to the table holding surface 5a, but not limited to this) with respect to the table holding surface 5a. By abutting the abutting guide member 13 against the circumferential guide surface 11c, a rotating guide means for guiding the table member 6 rotatably with respect to the center point of the circumferential guide surface 11c is constituted.

  In setting the positions of the four contact guide members 13, the fitting between the circumferential surface formed by the inner circumferential side of the four rollers 13b and the circumferential guide surface 11c is a clearance, that is, Some clearance is generated between each roller 13b and the circumferential guide surface 11c. As a result, as will be described later, the table member 6 can be easily attached and detached during assembly and maintenance, and the table member 6 can be smoothly driven without causing galling. .

  As shown in FIG. 4, the guide ring 11 is provided with four notches 11b that allow the abutment guide member 13 to pass in the vertical direction by partially cutting the flange 11a. ing. The arrangement phase of the notches 11b corresponds to the arrangement phase of the abutment guide members 13 in the table member 6. By rotating the table member 6, all the abutment guide members 13 are brought to the positions of the notches 11b. The contact guide member 13 can be moved up and down through the notch portion 11b.

As a result, when the table member 6 is mounted on the base member 5, the attaching / detaching operation can be performed while the contact guide member 13 remains coupled to the lower surface of the table member 6. Even when it is necessary to use a plurality of types of table members 6 according to the size, the table member 6 can be easily replaced. In addition, in the rotation range of the table member 6 during normal operation of the apparatus, the arrangement is determined so that the positions of the contact guide member 13 and the notch portion 11b do not coincide with each other, and the table member 6 is detached in the apparatus operation state. There is nothing.

  Next, the rotation drive mechanism 8 will be described. In FIG. 2, guide rails 15 are disposed on the upper surface of the base member 5 along both sides of the notch 5 c provided in the base member 5. The slider 16 slidably attached to the guide rail 15 is fixed to the lower surface of the moving plate 17, and the moving plate 17 is urged by a spring 18 in the direction of the arrow shown in FIG. Has been.

  A driven gear 21 (first gear) having a shape obtained by partially cutting out a large-diameter spur gear is coupled to the lower surface of the table member 6 at a position facing the moving plate 17. A motor 19 is mounted on the lower surface side of the moving plate 17 with a rotating shaft protruding on the moving plate 17, and a driving gear 20 (second gear) meshes with the driven gear 21 on the rotating shaft of the motor 19. Combined where possible.

  By rotating the motor 19 in a state where the drive gear 20 is engaged with the driven gear 21, the table member 6 is rotated via the drive gear 20 and the driven gear 21. In the conduction of rotation to the driven gear 21 by the driving gear 20, the driving gear 20 is pressed against the driven gear 21 by the urging force of the spring 18. In other words, the rotation drive mechanism 8 includes a driven gear 21 coupled to the table member 6, a drive gear 20 that meshes with the driven gear 21, and a motor 19 that rotationally drives the drive gear 20. The spring 18 serves as a pressing unit that presses the drive gear 20 against the substantially central direction of the driven gear 21.

  By adopting such a structure, when the table member 6 is rotationally driven by the motor 19, there is no play between the drive gear 20 and the driven gear 21, and the entire table member 6 is unidirectionally passed through the driven gear 21. Pressed against. As a result, when the contact guide member 13 contacts the guide ring 11 and the rotation of the table member 6 is guided, the contact guide member 13 is smooth without causing play or noise due to the gap between the roller 13b and the guide ring 11. Operation is ensured. Further, when the table member 6 is attached or detached, the driving gear 20 and the driven gear 21 can be pulled apart by pulling the moving plate 17 outward from the center of rotation against the urging force of the spring 18, so that the attaching and detaching work is easy. It is possible to do it.

  As described above, the rotary table mechanism according to the present invention includes the rotary holding mechanism that rotatably holds the table member 6 with respect to the base member 5 provided with the table holding surface 5a, and the table member 6 as the base member 6. On the other hand, the table member 6 is supported on the circumferential guide surface 11c by abutting the abutting guide member 13 against a supporting means for supporting relative movement and a circumferential guide surface 11c formed on the table holding surface 5a. A rotation guide means for guiding the center point in a freely rotatable manner is used.

  Thereby, compared with the structure which hold | maintains the outer peripheral side of a table member with bearing mechanisms, such as a cross roller bearing, it becomes possible to remove a table member from a base member easily. Therefore, in the case where a plurality of types of semiconductor wafers including a large-diameter wafer are targeted, a plurality of table members having different sizes can be detachably and easily replaceable.

The rotary table mechanism of the present invention has an effect that a plurality of types of table members can be easily and interchangeably mounted, such as a wafer sheet on which a semiconductor chip is attached in a component supply unit of an electronic component mounting apparatus. It can be used as a rotary table mechanism that rotates a component holding unit to be held.

(A) Perspective view of a rotary table mechanism according to an embodiment of the present invention (b) Partial sectional view of the rotary table mechanism according to an embodiment of the present invention The perspective view of the rotary table mechanism of one embodiment of this invention (A) Top view of the rotary table mechanism of one embodiment of the present invention (b) Side sectional view of the rotary table mechanism of one embodiment of the present invention Plan sectional drawing of the rotary table mechanism of one embodiment of the present invention (A) Partial sectional view of a rotary table mechanism according to an embodiment of the present invention (b) Partial sectional view of a rotary table mechanism according to an embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 XY table 4 Rotating table mechanism 5 Base member 5a Table holding surface 6 Table member 7 Expanding ring 8 Rotation drive mechanism 9 Wafer ring 10 Semiconductor chip 11 Guide ring 11a Eave part 11b Notch part 12 Rolling support member 13 Contact guide member 18 Spring 19 Motor 20 Drive gear 21 Driven gear

Claims (4)

  A rotary table mechanism for rotating a component holding unit for holding an electronic component in a component holding plane, the table member mounted with the component holding unit and rotatable in a plane substantially parallel to the component holding plane, and the table A base member formed with a table holding surface for holding the member substantially parallel to the component holding plane, a rotation holding mechanism for holding the table member rotatably with respect to the base member, and rotating the table member A rotation driving means, wherein the rotation holding mechanism supports a support means for supporting the table member relative to the base member, and a circumferential guide surface formed on the upper surface side of the base member. The table member can be rotated with respect to the center point of the circumferential guide surface by contacting the contact guide member coupled to the lower surface of the table member. Rotating table mechanism which comprises a rotation guide means for guiding.   The rotary table mechanism according to claim 1, wherein the support means is coupled to a lower surface of the table member.   The rotary table mechanism according to claim 1, wherein the circumferential guide surface is provided on an outer periphery of a cylindrical member, and a flange portion is provided on an upper end portion of the cylindrical member. The rotary table mechanism according to claim 3, wherein the flange portion is provided with a notch portion through which the contact guide member can pass in the vertical direction.

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