JP2005111617A - Cutting tool, cutting device, and manufacturing method for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting tool for processing an electronic component, a cutting device, and a manufacturing method for the electronic component that can simultaneously perform cutting and grinding, reduce cost by composition of processing procedure, reduce processing time, improve processing accuracy, and grind a complex shape simultaneously with the cutting. <P>SOLUTION: The cutting tool comprises a plurality of cutting blades and a rotary shaft. The plurality of cutting blades 1 and 2 are rotary cutting blades that are formed in a disk shape and perform the cutting on the circumference, and the center is combined with the rotary shaft on the same axis. At least one cutting blade 1 of the plurality of cutting blades is formed to have a diameter larger than the other cutting blade. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a cutting tool, a cutting device, and an electronic component manufacturing method suitable for use in cutting such as cutting, polishing, and grinding of electronic components.

  In the manufacture of electronic components, a method of obtaining individual electronic components by cutting and separating an electronic component assembly comprising a large number of electronic components on a single sheet or substrate has been frequently used. Various shapes are required for the outer shape including the cut surface. For example, in a piezoelectric vibrator, a crystal vibrator, etc., an inclined surface is provided at the end of the element or a step is formed in order to obtain necessary characteristics.

  Techniques for forming an inclined surface on an electronic component are disclosed in, for example, Patent Document 1 and Patent Document 2. Patent Document 1 is a polishing method for forming a bevel surface as an inclined surface on an electronic component element, and corresponds to a target bevel surface inclination angle with respect to a main surface on which the bevel surface is to be formed. A method is disclosed in which a grindstone or an electronic component element is relatively moved so as to form an angle and the surface is polished.

  Further, Patent Document 2 prepares a mother substrate made of a piezoelectric material as a technique for forming an inclined surface on a piezoelectric element, and moves a first rotating grindstone having a V-shaped cross section relative to the mother substrate. A technique for cutting a mother substrate at the center of the V-groove by processing a V-groove on the surface of the mother substrate and relatively moving a flat second rotating grindstone along the center of the V-groove of the mother substrate is disclosed.

The technique disclosed in Patent Document 1 requires a separate cutting process for electronic component elements, so that the process becomes complicated, the processing cost is high, and the processing position accuracy is poor. In addition, the technique disclosed in Patent Document 2 can continuously process the inclined surface processing step and the cutting step, but in order to form the inclined surface, a step of processing a V-groove on the surface of the mother substrate; After that, since the two steps of cutting the mother substrate at the center of the V-groove are included, the same problem as the technique disclosed in Patent Document 1 is included.
JP 2001-38590 A JP 2003-11041 A

  An object of the present invention is to manufacture an electronic component processing cutting tool, a cutting apparatus, and an electronic component that can perform cutting and grinding simultaneously, and can reduce costs, reduce processing time, and improve processing accuracy by combining processing steps. Is to provide a method.

  Another object of the present invention is to provide an electronic component machining cutting tool, a cutting apparatus, and an electronic component manufacturing method that can perform grinding of a complicated shape simultaneously with cutting.

  In order to solve the above-described problems, the present invention discloses a cutting tool for processing an electronic component, a cutting apparatus, and a method for manufacturing an electronic component using the same.

1. Cutting Tool The cutting tool for processing an electronic component according to the present invention includes a plurality of cutting blades and a rotating shaft. The plurality of cutting blades are rotary cutting blades that are formed in a disc shape and perform cutting on a circumference, and are combined coaxially with the rotation shaft. At least one of the plurality of cutting blades has a larger diameter than the other cutting blades.

  In the cutting tool described above, the plurality of cutting blades are rotary cutting blades that are formed in a disk shape and perform cutting on the circumference, and are combined coaxially with the rotation axis. At least one of the plurality of cutting blades is formed with a larger diameter than the other cutting blades, so if the cutting blade formed with a large diameter penetrates the electronic component assembly in the thickness direction, An electronic component assembly that is a component assembly can be cut. That is, the cutting blade formed with a large diameter can function as a cutting blade for cutting.

  Since the other cutting blade has a smaller diameter than the cutting blade formed to have a large diameter, the electronic component assembly is ground from the surface. That is, the other cutting blade can function as a cutting blade for grinding. In addition, by combining cutting blades with various different diameters and thicknesses, it is possible to grind complex shapes. The plurality of cutting blades are rotary cutting blades that are formed in a disk shape and perform cutting on the circumference, and are combined coaxially with the rotation shaft, so that the electronic component assembly can be cut and ground simultaneously.

  Therefore, according to the cutting tool for electronic component processing according to the present invention, it is possible to simultaneously perform cutting and grinding processing, it is possible to reduce costs, reduce processing time and improve processing accuracy by combining processing steps, Complex shape grinding can be performed simultaneously with cutting.

2. Cutting device The cutting device according to the present invention includes a cutting tool, a processing table, and a drive device. The cutting tool is the cutting tool according to the present invention described above. The processing table includes a fixing means for fixing the electronic component assembly. The drive device includes a rotation drive unit and a transfer unit. The rotational driving means rotationally drives the cutting tool via the rotational shaft. The transfer means relatively moves the cutting tool and the processing table.

  In the above-described cutting apparatus, the processing table includes fixing means for fixing the electronic component assembly, so that the electronic component assembly can be fixed to the processing table. The drive device includes a rotation drive means and a transfer means. The rotational drive means rotationally drives the cutting tool via the rotational shaft. Since the transfer means relatively moves the cutting tool and the processing table, the electronic component assembly fixed to the processing table can be cut.

  Since the cutting tool according to the present invention described above is used as the cutting tool, the effects of the cutting tool according to the present invention can be obtained as they are.

3. Manufacturing method of electronic component The manufacturing method of an electronic component according to the present invention is a manufacturing method of an electronic component including a processing step of cutting and grinding an electronic component assembly, and using the above-described cutting apparatus according to the present invention. Is included.

  The electronic component assembly is obtained by arranging a large number of individual electronic components in a matrix on a single substrate. The processing step includes a fixing step of the electronic component assembly, a row direction cutting step, and a column direction cutting step. The fixing step of the electronic component assembly includes a step of fixing the electronic component assembly as an electronic component assembly to the processing table. At least one of the row direction cutting process and the column direction cutting process includes the grinding process. In the processing step including the grinding step, the cutting tool and the processing table are relatively moved while the cutting tool is driven to rotate, and the cutting tool is fixed to the processing table with the cutting blade formed in the large diameter. Simultaneously with cutting the electronic component assembly, the upper surface of the electronic component assembly is ground with the other cutting blade.

  In the electronic component manufacturing method according to the present invention described above, when both the row direction cutting step and the column direction cutting step include a grinding step, both the row direction cutting step and the column direction cutting step are cutting tools. While rotating the tool, the cutting tool and the processing table are moved relative to each other, and the electronic component assembly fixed to the processing table is cut with a cutting blade formed with a large diameter. Grind the top surface of the assembly.

  When either one of the row direction cutting process and the column direction cutting process includes a grinding process, the cutting tool and the processing table are relatively moved while rotating the cutting tool in the processing process including the grinding process. The electronic component assembly fixed to the processing table is cut with a cutting blade having a large diameter, and the upper surface of the electronic component assembly is ground with another cutting blade. The cutting process which does not include a grinding process can be cut with a general one-blade cutting blade.

  As described above, the method of manufacturing an electronic component according to the present invention can simultaneously cut and grind the electronic component assembly that requires grinding to obtain individual electronic components separated from the electronic component assembly. Since the manufacturing method of the electronic component according to the present invention uses the above-described cutting apparatus according to the present invention, the effects of the cutting apparatus according to the present invention can be obtained as they are.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. However, the attached drawings are merely examples.

  As described above, according to the present invention, the following effects can be obtained.

  (A) A cutting tool for electronic component processing, a cutting device, and a method for manufacturing an electronic component capable of simultaneously cutting and grinding, reducing costs by combining processing steps, reducing processing time, and improving processing accuracy. can do.

  (B) It is possible to provide a cutting tool for machining an electronic component, a cutting device, and a method for producing an electronic component, which can perform grinding with a complicated shape simultaneously with cutting.

1. FIG. 1 is a perspective view showing an embodiment of a cutting tool for processing electronic parts according to the present invention, FIG. 2 is a front view of the cutting tool shown in FIG. 1, and FIG. 3 is shown in FIG. It is an exploded view of a cutting tool. The cutting tool of the illustrated embodiment includes cutting blades 1 and 2 and a rotating shaft 6.

  The cutting blades 1 and 2 are rotary cutting blades that are formed in a disk shape and perform cutting on the circumferential surfaces 10 and 20. At least one of the cutting blades 1 and 2 has a larger diameter than the other cutting blades. In this embodiment, two cutting blades 1 and 2 are included, and the cutting blade 1 is formed with a larger diameter than the cutting blade 2. The cutting blade 1 formed with a large diameter has a thin circumferential surface 10 and functions as a cutting blade for cutting. The cutting blade 2 has one surface 21 with a large diameter and the other surface 22 with a small diameter. The cutting blade 2 has a relatively thick circumferential surface 20 in comparison with the cutting blade 1 and has an inclined surface in the thickness direction, and the cutting blade for beveling is mainly ground on the circumferential surface 20. Function as.

  The centers of the cutting blades 1 and 2 are combined coaxially with the rotary shaft 6 and fixed by a flange 7. Specifically, one surface 21 of the cutting blade 2 is combined in contact with one surface of the cutting blade 1 having a large diameter.

  Next, a processing method using the electronic component processing cutting tool according to the present invention will be described with reference to FIGS. 4 is a front view showing a machining state using the cutting tool shown in FIGS. 1 to 3, FIG. 5 is a perspective view showing a state after machining, and FIG. 6 is a perspective view showing separated electronic components.

  First, referring to FIG. 4, the cutting tool 100 shown in FIGS. 1 to 3 is rotated in the direction indicated by the arrow F1, and a large number of electronic component elements 80 are arranged in a matrix on the same piezoelectric ceramic substrate. The assembled electronic component assembly 8 is cut between adjacent electronic component elements 80. The electronic component assembly 8 is fixed on the processing table 94 using an adhesive sheet 93 or the like. Cutting with the cutting tool 100 is first performed along one of the row and column directions, for example, the column direction.

  The cutting tool 100 includes a cutting blade 1 having a large diameter that functions as a cutting blade for cutting, and a cutting blade 2 that functions as a cutting blade for bevel processing. The cutting blade 2 has one surface 21 with a large diameter, the other surface 22 with a small diameter, a relatively thick circumferential surface 20, and an inclined surface in the thickness direction. One surface 21 of the cutting blade 2 is in contact with one surface of the cutting blade 1 having a large diameter, and the centers of the cutting blades 1 and 2 are combined coaxially with the rotary shaft 6.

  For this reason, the circumferential surface 10 of the cutting blade 1 formed with a large diameter reaches the adhesive sheet 93, and the electronic component assembly 8 is cut in the row direction. The cutting blade 2 grinds the upper surface of the electronic component element 80 included in the electronic component assembly 8 with the outer peripheral surface 20 on one side of the cutting groove 95. Therefore, as shown in FIG. 4, the electronic component element 80 has a bevel surface 81 formed in the column direction. The cutting of the electronic component element 80 and the formation of the bevel surface 81 are performed simultaneously.

  Thereafter, by cutting in the row direction, as shown in FIGS. 5 and 6, a seven-sided electronic component 80 in which a bevel surface 81 is provided on one side of the rectangular body is obtained. The cutting of the electronic component element 80 in the row direction can be performed by using a general cutting blade having a single structure when bevel grinding is not required.

  As described above, according to the cutting tool 100 according to the present invention, cutting and grinding can be performed at the same time, cost can be reduced by combining processing steps, processing time can be shortened, and processing accuracy can be improved. Can be performed simultaneously with cutting.

  In the present invention, the material of the electronic component assembly to be cut is not particularly limited. As the material of the cutting blades 1 and 2, a material suitable for the electronic component assembly can be selected and used from various conventionally known materials. For example, for substrates made of alumina, other ceramics, or metal or resin, which are materials for electronic components, diamond abrasive grains hardened with resin on the circumferential surfaces 10 and 20 of the cutting blades 1 and 2 are used. A fixed grindstone is suitable.

  The surface roughness of the cutting blades 1 and 2 may be different from each other. By setting the surface roughness of the cutting blades 1 and 2 independently, the surface roughness of each processed surface of the electronic component assembly can be arbitrarily set. The surface roughness of the cutting blades 1 and 2 can be arbitrarily set according to the grain size of the abrasive grains. Moreover, you may comprise as a cutter which formed the circumferential surface 10 of the cutting blade 1 for cutting sharply with respect to a comparatively soft electronic component assembly like the ceramic green sheet before baking.

  FIG. 7 is a view showing another embodiment of the cutting tool according to the present invention. In the figure, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals. The cutting tool shown in FIG. 7 has cutting blades 2 for beveling combined with both side surfaces of a cutting blade 1 having a large diameter, and cuts the electronic component assembly 8 in, for example, the row direction.

  FIG. 8 is a diagram showing a machining method using the cutting tool shown in FIG. 7, and FIG. 9 is a diagram showing a state obtained through the machining process of FIG. Since the cutting tool illustrated in FIG. 7 is combined with the cutting blades 2 for beveling on both side surfaces of the cutting blade 1 formed to have a large diameter, the cutting tool 100 is used to assemble the electronic component assembly 8. For example, when cutting in the row direction, bevel surfaces 81 can be simultaneously provided on both sides of the cutting groove 95 as shown in FIG. As a result, as shown in FIG. 9, each electronic component element 80 has bevel surfaces 81 on opposite sides. Thereafter, a desired individual electronic component is obtained by cutting in the row direction Y1-Y1.

  FIG. 10 is a view showing another embodiment of the cutting tool according to the present invention and a processing method using the same, and FIG. 11 is a view showing a state obtained through the processing steps of FIG. The cutting tool 100 illustrated in FIG. 10 includes a cutting blade 1 having a large diameter and a cutting blade 2 for bevel processing, and further, a second bevel processing tool different from the cutting blade 2 for bevel processing. A cutting blade 3 is included. Each of the cutting blades 2 and 3 for bevel processing has inclined surfaces with different angles on the circumferential surfaces 20 and 30. One surface of the second beveling cutting blade 3 is combined with the other surface of the beveling cutting blade 2 in contact with the same diameter. The other surface of the second bevel processing cutting blade 3 is formed to have a smaller diameter than the one surface.

  The cutting tool illustrated in FIG. 10 includes a cutting blade 1 having a large diameter and a beveling cutting blade 2, and further, a second beveling cutting blade different from the beveling cutting blade 2. 3, for example, when the electronic component assembly 8 is cut in the row direction using the cutting tool 100, as shown in FIG. Different bevel surfaces 81 can be provided. As a result, as shown in FIG. 11, each electronic component element 80 has bevel surfaces 81 whose inclination angles are different in the middle on opposite sides. Thereafter, a desired individual electronic component is obtained by cutting in the row direction Y1-Y1.

  FIG. 12 is a view showing still another embodiment of the cutting tool according to the present invention and a processing method using the same, and FIG. 13 is a view showing a state obtained through the processing steps of FIG. The cutting tool illustrated in FIG. 12 includes a cutting blade 1 formed to have a large diameter, and further includes a set of four step processing cutting blades 41, 42, 43, 44 on both sides of the cutting blade 1. Yes. Each of the step machining cutting blades 41 to 44 is configured with a different diameter, and each of the circumferential surfaces 410 to 440 does not have an inclination. The step machining cutting blades 41 to 44 are sequentially combined in descending order of the diameter with the cutting blade 1 as a reference.

  According to the cutting tool shown in FIG. 12 and a processing method using the same, cutting having four steps 82 on both sides of the cutting groove 95 can be performed as shown in FIG. The number of step cutting blades is not limited to four, and any number can be used depending on the number of steps to be formed. Further, the step machining cutting blade and the bevel machining cutting blade can be combined.

  FIG. 14 is a view showing still another embodiment of the cutting tool according to the present invention and a processing method using the same, and FIG. 15 is a view showing a state obtained through the processing steps of FIG. The cutting tool illustrated in FIG. 14 includes a cutting blade 1 formed to have a large diameter, and further includes a step processing cutting blade 41 and a slit processing cutting blade 5 on both sides of the cutting blade 1. The slit cutting blade 5 is formed so that its diameter is smaller than the diameter of the cutting blade 1 formed in a large diameter and larger than the diameter of the step processing cutting blade 41, and the thickness thereof is that of the step processing cutting blade 41. It is formed thinner than the thickness. The step machining cutting blades 41 are combined in contact with both surfaces of the cutting blade 1 having one surface formed in a large diameter. The slit cutting blade 5 is combined such that one surface thereof is in contact with the other surface of the step machining cutting blade 41.

  According to the cutting tool and the processing method illustrated in FIG. 14, as illustrated in FIG. 15, the cutting process having the step 82 and the slit 83 on both sides of the cutting groove 95 can be performed.

  The cutting tool shown in FIGS. 7 to 14 can perform cutting and grinding simultaneously at the same time as the cutting tool shown in FIGS. 1 to 3, and the cost can be reduced due to the ease of exchanging cutting blades and the combination of processing steps. In addition, the processing time can be shortened and the processing accuracy can be improved, and the grinding of a complicated shape can be performed simultaneously with the cutting. Moreover, the material of the electronic component assembly to be cut and the material of the cutting blade are not particularly limited, and the surface roughness of each cutting blade can be arbitrarily set.

2. Cutting Device FIG. 16 is a diagram showing a cutting device according to the present invention and a usage state thereof, and FIG. 17 is a partially enlarged view of the cutting device shown in FIG. In the figure, the same reference numerals as those in FIGS. 1 to 15 denote the same components.

  The cutting device 9 according to the present embodiment includes a cutting tool 100, a processing table 94, and a driving device. The cutting tool 100 can use all of those described so far. The cutting tool 100 in the illustrated embodiment is the cutting tool 100 illustrated in FIG. 7, and bevel processing cutting blades 2 are combined on both side surfaces of the cutting blade 1 formed in a large diameter.

  The processing table 94 includes fixing means for fixing the electronic component assembly 8. As the fixing means, vacuum suction or other fixing means can be adopted, and the single-sided adhesive sheet 93 for securing the cutting allowance of the cutting blade 1 can be replaced with a double-sided adhesive sheet.

  The drive device includes a rotation drive means 96 and a transfer means 97. The rotation driving means 96 rotates the cutting tool 100 via the rotation shaft 6. The transfer means 97 moves the cutting tool 100 and the processing table 94 relatively.

  In the above-described cutting apparatus, the processing table 94 includes fixing means for fixing the electronic component assembly 8, so that the electronic component assembly 8 can be fixed to the processing table 94 via the adhesive sheet 93.

  The drive device includes a rotation drive means 96 and a transfer means 97. The rotation driving means 96 rotates the cutting tool 100 via the rotation shaft 6. Since the transfer means 97 relatively moves the cutting tool 100 and the processing table 94, the electronic component assembly 8 fixed to the processing table 94 can be cut. Since the cutting tool 100 shown in FIG. 7 is used as the cutting tool 100, as shown in FIG. 8, a cutting process having bevel surfaces 81 on both sides of the cutting groove 95 can be performed.

  Since the cutting apparatus 9 according to the present embodiment uses the cutting tool 100 according to the present invention, the effects of the cutting tool according to the present invention can be obtained as they are.

3. Next, a method for manufacturing an electronic component according to the present invention will be described with reference to FIGS. This manufacturing method is executed using the cutting apparatus shown in FIGS. FIG. 18 is a front view showing the electronic component assembly 8 before cutting, and a single-sided adhesive sheet 93 is attached thereto. FIG. 19 is a front view showing the cutting device 9 before cutting, and also shows the electronic component assembly 8 to be processed. FIG. 20 is a front view showing the electronic component assembly 8 after cutting. FIG. 21 is a front view showing the separated individual electronic components.

  The method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component including a cutting process for cutting and grinding the electronic component assembly 8, and includes the step of using the above-described cutting apparatus 9 according to the present invention. It is out.

  The electronic component assembly 8 includes an upper surface and a lower surface. Like the piezoelectric ceramic substrate, the electronic component assembly 8 provides a large number of piezoelectric ceramic elements by being cut and separated in a matrix in the plane direction, or an electronic component assembly substrate. In addition, a large number of individual electronic components may be integrated and arranged in a matrix in the plane direction, and the type is not particularly limited.

  The cutting process includes a fixing process of the electronic component assembly 8, a subsequent row direction cutting process, a subsequent column direction cutting process, and a grinding process.

  In the fixing process of the electronic component assembly 8, first, as shown in FIG. 18, the single-sided adhesive sheet 93 is attached to the lower surface of the electronic component assembly 8. The single-sided pressure-sensitive adhesive sheet 93 secures a cutting allowance for the cutting blade 1 and integrally holds the electronic component assembly 8 after cutting. As shown in FIG. 19, the electronic component assembly 8 to which the adhesive sheet 93 is attached is placed on the processing table 94 in contact with the adhesive sheet 93 side. Since the processing table 94 includes vacuum suction or the like as fixing means for fixing the electronic component assembly 8, the electronic component assembly 8 can be fixed to the processing table 94. In the subsequent row-direction cutting process, as shown in FIG. 17, the cutting blade 1 of the processing tool 100 is lowered to a processing position that reaches the adhesive sheet 93.

  Next, as shown in FIG. 16, while the cutting tool 100 is rotationally driven by the rotating means 96, the processing table 94 is horizontally moved in the direction of the arrow F2 by the transfer means 97, and the cutting tool 100 and the processing table 94 are moved. The electronic component assembly 8 moves relatively in the row direction. By the horizontal movement of the processing table 94, the electronic component assembly 8 is cut in the row direction by the cutting blade 1, and at the same time, the upper surface thereof is ground by the beveling cutting blade 2. That is, the row-direction cutting process includes a grinding process, and both are executed simultaneously.

  After the processing tool 100 reaches the end of the electronic component assembly 8 in the row direction, the processing tool 100 is raised to the upper standby position. At this point, the first cutting and grinding in the row direction are completed. Thereafter, the machining table 94 moves horizontally in the direction opposite to the arrow F2, the cutting tool 100 moves to the next row direction cutting position, and the process proceeds to the next row direction cutting step. When the above operation is repeated and the row direction cutting process is completed, the process proceeds to the column direction cutting process.

  The column direction cutting process is performed in the same manner as the row direction cutting process after the processing table 94 is rotated 90 degrees. The row-direction cutting process also includes a grinding process, and both are executed simultaneously. As shown in FIG. 20, the electronic component assembly 8 that has been cut in the matrix direction has a cutting portion in the matrix direction, and bevel surfaces 81 are formed on both sides thereof, and is separated from the electronic component assembly 8. As a result, a 10-sided individual electronic component 80 in which beveled surfaces 81 are formed in the four directions of the upper surface of the rectangular body as shown in FIG. 21 is obtained.

  Since the method for manufacturing an electronic component according to the present invention uses the cutting apparatus according to the present invention, the effects of the cutting apparatus according to the present invention can be obtained as they are.

  The present invention has been described in detail with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made by those skilled in the art based on the basic technical idea and teachings. It is self-evident that

It is a perspective view which shows one Example of the cutting tool for electronic component processing which concerns on this invention. FIG. 2 is a front view of the electronic component machining cutting tool illustrated in FIG. 1. FIG. 2 is an exploded view of the electronic component machining cutting tool illustrated in FIG. 1. It is a front view which shows the state at the time of the cutting process using the electronic component processing cutting tool shown in FIG. It is a perspective view which shows the state after cutting. It is a perspective view which shows the separated separate electronic component. It is a figure which shows the other Example of the cutting tool for electronic component processing which concerns on this invention. It is a figure which shows the process using the cutting tool for electronic component processing shown in FIG. It is a perspective view which shows the state of the electronic component aggregate | assembly which passed through the manufacturing process shown in FIG. It is a figure which shows the other Example of the cutting tool for electronic component processing which concerns on this invention, and a process using the same. It is a perspective view which shows the state of the electronic component aggregate | assembly after passing through the manufacturing process shown in FIG. It is a figure which shows the other Example of the cutting tool for electronic component processing which concerns on this invention, and a process using the same. It is a perspective view which shows the state of the electronic component aggregate | assembly which passed through the manufacturing process shown in FIG. It is a figure which shows the other Example of the cutting tool for electronic component processing which concerns on this invention, and a process using the same. It is a perspective view which shows the state of the electronic component aggregate | assembly which passed through the manufacturing process shown in FIG. It is a front view at the time of the cutting which used one Example of the cutting device which concerns on this invention. It is a partially expanded view of the cutting apparatus shown in FIG. It is a front view which shows the electronic component aggregate | assembly before cutting. It is a front view which shows the cutting apparatus before cutting. It is a front view which shows the state of the electronic component aggregate | assembly after cutting. It is a front view which shows the isolate | separated individual electronic component.

Explanation of symbols

1, 2, 3, 41-44, 5 Cutting blade
6 Rotating shaft
8 Electronic component assembly
80 Individual electronic components
9 Cutting equipment
91 Machining table
96 Rotation drive means
97 Transport means
100 cutting tool

Claims (11)

A cutting tool for processing electronic parts including a plurality of cutting blades and a rotating shaft,
The plurality of cutting blades are rotary cutting blades that are formed in a disk shape and perform cutting on the circumference, and the centers are combined coaxially with the rotation axis,
A cutting tool in which at least one of the plurality of cutting blades is formed to have a larger diameter than the other cutting blades.   The cutting tool according to claim 1, wherein the cutting blade formed to have a large diameter is a cutting blade for cutting.   The cutting tool according to claim 1 or 2, wherein another cutting blade is combined with both side surfaces of the cutting blade having a large diameter. The cutting tool according to any one of claims 1 to 3,
The other cutting blade includes a bevel cutting blade,
The bevel processing cutting blade has one surface formed in a large diameter, the other surface formed in a small diameter, a circumferential surface having an inclined surface in the thickness direction, and the one surface formed in the large diameter. Cutting tool that is combined in contact with the cutting blade. The cutting tool according to claim 4, wherein
The other cutting blade further includes a second beveling cutting blade,
Each of the beveling cutting blades has inclined surfaces with different angles on the circumferential surface,
One surface of the second beveling cutting blade is formed to have the same diameter as the other surface of the beveling cutting blade,
A cutting tool combined in contact with the other surface of the cutting blade for bevel processing. The cutting tool according to any one of claims 1 to 3,
The other cutting blade includes a step cutting cutting blade,
The cutting tool for level difference machining is a cutting tool in which both surfaces have the same diameter, a circumferential surface is formed flat in the thickness direction, and one surface is combined in contact with the cutting blade formed in the large diameter.   The cutting tool according to claim 6, wherein the cutting tool includes a plurality of the step machining cutting blades, each of the step machining cutting blades having a different diameter, and one surface is in contact with the cutting blade having a large diameter. Cutting tools that are combined sequentially. The cutting tool according to claim 6,
The other cutting blade further includes a slit cutting blade,
The slit cutting blade has a diameter smaller than that of the large cutting blade and larger than that of the step machining cutting blade. A cutting tool that is formed thinner than the thickness, and one surface is combined in contact with the step-cutting cutting blade.   The cutting tool according to claim 1, wherein the cutting blades have different surface roughness. A cutting device including a cutting tool, a processing table, and a drive device,
The cutting tool is described in any one of claims 1 to 9,
The processing table includes a fixing means for fixing the electronic component assembly,
The drive device includes a rotation drive means and a transfer means,
The rotational drive means rotationally drives the cutting tool via the rotational shaft,
The transfer device is a cutting device that relatively moves the cutting tool and the processing table. An electronic component manufacturing method including a processing step of cutting and grinding an electronic component assembly,
A cutting device according to claim 10,
The electronic component assembly is a plurality of individual electronic components arranged in a matrix on a single substrate,
The processing step includes a fixing step of the electronic component assembly, a row direction cutting step, and a column direction cutting step,
The step of fixing the electronic component assembly includes a step of fixing the electronic component assembly to the processing table,
At least one of the row direction cutting step and the column direction cutting step includes the grinding step, and the processing step including the grinding step includes rotating the cutting tool while driving the cutting tool and the processing table. The electronic component assembly fixed to the processing table is cut with the cutting blade formed with a large diameter, and the upper surface of the electronic component assembly is ground with the other cutting blade. A method of manufacturing an electronic component including steps.

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