JP2005100968A - Anisotropic conductive sheet, manufacturing method thereof, and circuit board inspection apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive sheet capable of maintaining required conductivity for a long period of time even when the thickness is repeatedly used, and thus obtaining a long service life with a high resolution, a method for producing the same, and the difference. A circuit board inspection apparatus including a conductive sheet is provided.
An anisotropic conductive sheet of the present invention is contained in a base material made of an insulating elastic polymer substance in a state where conductive particles exhibiting magnetism are oriented in the thickness direction to form a chain, The base material contains an insulating reinforcing material made of mesh. The method for producing an anisotropic conductive sheet of the present invention is a method of preparing a molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer material, and reinforcing the mesh. A molding material layer containing the material immersed in the molding material is formed, and a magnetic field is applied to the molding material layer in the thickness direction or is applied, and then the molding material layer is cured.
[Selection] Figure 1

Description

  The present invention relates to an anisotropic conductive sheet preferably used as a connector in an electrical connection between circuit devices such as electronic components and a circuit board inspection device such as a printed circuit board, a manufacturing method thereof, and the anisotropic conductivity. The present invention relates to an inspection apparatus for a circuit board having a sheet.

  An anisotropic conductive sheet is one that exhibits conductivity only in the thickness direction, or has a pressure-conductive conductive portion that exhibits conductivity only in the thickness direction when pressed in the thickness direction. Because it has features such as being able to achieve a compact electrical connection without using means such as mechanical fitting, and being able to make a soft connection by absorbing mechanical shocks and strains. Using such features, in the field of electronic computers, electronic digital watches, electronic cameras, computer keyboards, etc., circuit devices such as printed circuit boards and leadless chip carriers, liquid crystal panels, etc. Widely used as a connector to achieve electrical connection.

  In an electrical inspection of a circuit board such as a printed circuit board, an electrical connection between an electrode to be inspected formed on one surface of the circuit board to be inspected and an inspection electrode formed on the surface of the circuit board for inspection In order to achieve easy connection, an anisotropic conductive sheet is interposed between the inspection electrode region of the circuit board and the inspection electrode region of the inspection circuit board.

Conventionally, as such an anisotropic conductive sheet, those having various structures are known. For example, Patent Document 1 discloses an anisotropic conductive sheet obtained by uniformly dispersing metal particles in an elastomer. (Hereinafter, also referred to as “dispersed anisotropic conductive sheet”) is disclosed, and Patent Document 2 and the like disclose that the conductive magnetic particles are distributed non-uniformly in the elastomer, thereby increasing the thickness direction. An anisotropic conductive sheet (hereinafter, also referred to as “unevenly anisotropic conductive sheet”) is disclosed, in which a large number of conductive path forming portions extending in the direction and insulating portions that insulate them from each other are formed. Furthermore, Patent Document 3 and the like disclose an unevenly distributed anisotropic conductive sheet in which a step is formed between the surface of the conductive path forming portion and the insulating portion.
These anisotropic conductive sheets are required by, for example, injecting a molding material containing conductive particles exhibiting magnetism into a polymer material that is cured to become an elastic polymer material into a mold. A molding material layer having a thickness of 1 mm is formed, a magnetic field is applied to the molding material layer in the thickness direction, and the molding material layer is cured. In such an anisotropic conductive sheet, conductive particles are contained in a base material made of an elastic polymer substance so as to be aligned in the thickness direction, and a conductive path is formed by a chain of a large number of conductive particles. The

Among such anisotropic conductive sheets, the dispersed anisotropic conductive sheet is advantageous in the following points as compared to the uneven distribution type anisotropic conductive sheet.
(1) An unevenly distributed anisotropic conductive sheet needs to be manufactured using a special and expensive mold, whereas a distributed anisotropic conductive sheet uses such a mold. It can be manufactured at a low cost.
(2) The unevenly distributed anisotropic conductive sheet needs to form a conductive path forming portion according to a pattern corresponding to the pattern of the electrode to be inspected, for example, and is individually manufactured according to the circuit board to be inspected In contrast, the dispersed anisotropic conductive sheet can be used regardless of the pattern of the electrode to be inspected, and has versatility.
(3) Since the unevenly distributed anisotropic conductive sheet exhibits conductivity in the thickness direction in the conductive path forming portion and does not exhibit conductivity in the insulating portion, the unevenly distributed anisotropic conductive sheet is used. In contrast, the conductive path forming portion needs to be aligned with the electrode to be inspected, whereas the dispersive anisotropic conductive sheet exhibits conductivity in the thickness direction over the entire surface. There is no need to align the path forming part and the electrical connection work is easy.

  On the other hand, since the unevenly anisotropic anisotropic conductive sheet is formed with an insulating portion that insulates them from each other between adjacent conductive path forming portions, the circuit board in which the electrodes to be inspected are arranged at a small pitch is also adjacent. In a state where necessary insulation is ensured between the electrodes to be inspected, it is possible to achieve electrical connection to each of the electrodes to be inspected with high reliability, i.e., high resolution. This is advantageous as compared to a conductive sheet.

Thus, in order to improve the resolution of the dispersed anisotropic conductive sheet, it is important to reduce the thickness of the dispersed anisotropic conductive sheet.
However, in anisotropic conductive sheets with a small thickness, permanent deformation due to pressure contact and deformation due to wear are likely to occur when used repeatedly, and as a result, the conductivity deteriorates early, resulting in a long service life. It is difficult to obtain. Therefore, when such an anisotropic conductive sheet is used to inspect a large number of circuit boards, the frequency of exchanging the anisotropic conductive sheet with a new one increases, so that the inspection efficiency decreases. There is a problem that inspection costs increase.

JP 51-93393 A Japanese Patent Laid-Open No. 53-147772 JP-A-61-250906

The present invention has been made on the basis of the circumstances as described above. The first object of the present invention is to maintain required conductivity over a long period of time even when the thickness is small. Accordingly, it is an object of the present invention to provide an anisotropic conductive sheet having a high resolution and a long service life.
The second object of the present invention is to maintain the required conductivity over a long period of time even when the thickness is small, so that a high resolution and a long service life can be obtained. It is providing the method which can manufacture an anisotropic conductive sheet.
A third object of the present invention is to provide a circuit board inspection apparatus including the anisotropic conductive sheet as described above.

The anisotropic conductive sheet of the present invention comprises a base material made of an insulating elastic polymer substance and contains a plurality of conductive particles exhibiting magnetism oriented in the thickness direction to form a chain. In the conductive sheet,
The base material contains an insulating reinforcing material made of mesh.

In the anisotropic conductive sheet of this invention, it is preferable that the mesh which comprises a reinforcing material is formed with the organic fiber.
Moreover, it is preferable that the chain | strand by electroconductive particle is formed in the state disperse | distributed to the surface direction.
Moreover, it is preferable that thickness is 20-500 micrometers.
Moreover, it is preferable that ratio of the thickness of the reinforcing material with respect to the thickness of an anisotropic conductive sheet is 0.1-1.
Moreover, it is preferable that the average opening diameter of the mesh which comprises a reinforcing material is 10-800 micrometers.
Further, when the number average particle diameter of the conductive particles is r and the average opening diameter of the mesh is R, the ratio r / R is preferably 0.01 to 0.9.

The method for producing an anisotropic conductive sheet of the present invention comprises preparing a fluid molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer material,
Forming a molding material layer containing a reinforcing material made of mesh immersed in the molding material;
It is characterized by having a step of curing the molding material layer with or without applying a magnetic field to the molding material layer in the thickness direction.

  A circuit board inspection apparatus according to the present invention comprises the above anisotropic conductive sheet.

  According to the anisotropic conductive sheet according to the present invention, since an insulating reinforcing material made of mesh is contained, even if the thickness is small, permanent deformation due to press contact and deformation due to wear are suppressed. Can do. Therefore, even when the anisotropic conductive sheet is used repeatedly, the required conductivity can be maintained over a long period of time, and a long service life can be obtained. Moreover, since the thickness can be reduced, an anisotropic conductive sheet having high resolution can be obtained.

  According to the method for manufacturing an anisotropic conductive sheet according to the present invention, even when the thickness is small, the required conductivity can be maintained over a long period of time when repeatedly used, and therefore the resolution is high. An anisotropic conductive sheet that can provide a long service life can be produced.

  According to the circuit board inspection apparatus of the present invention, since the anisotropic conductive sheet is provided, a highly reliable inspection can be performed over a long period of time, and the electrodes to be inspected are minute, and these The required electrical connection can be reliably achieved even for circuit boards to be inspected that are arranged at a small pitch. Further, when inspecting a large number of circuit boards, an anisotropic conductive sheet is newly added. As a result, the inspection efficiency can be improved and the inspection cost can be reduced.

Hereinafter, embodiments of the present invention will be described in detail.
<Anisotropic conductive sheet>
FIG. 1 is a cross-sectional view for explaining the structure of an example of the anisotropic conductive sheet according to the present invention, and FIG. 2 is a cross-sectional view for explaining an enlarged main portion of the anisotropic conductive sheet shown in FIG. is there. In this anisotropic conductive sheet 10, a large number of conductive particles P exhibiting magnetism are contained in a base material 11 made of an insulating elastic polymer substance, and an insulating reinforcing material 12 made of a mesh. Is contained. The conductive particles P contained in the substrate 11 are oriented so as to be aligned in the thickness direction of the anisotropic conductive sheet 10, thereby forming a chain of a plurality of conductive particles P extending in the thickness direction. ing. Further, the chain of conductive particles P is formed in a state of being dispersed in the surface direction of the anisotropic conductive sheet 10.

  The thickness of the anisotropic conductive sheet 10 is preferably 20 to 500 μm, more preferably 50 to 200 μm. When the thickness is less than 20 μm, the anisotropic conductive sheet 10 has a small amount of elastic deformation in the thickness direction and tends to have a low stress absorption capability, and is liable to damage the connection object. On the other hand, if the thickness exceeds 500 μm, the electrical resistance in the thickness direction tends to be large, and high resolution may not be obtained.

As the elastic polymer material that constitutes the base material 11 from the anisotropic conductive sheet 10, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer material that can be used to obtain a crosslinked polymer material. Specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene rubber, styrene- Conjugated diene rubbers such as butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, block copolymers such as styrene-butadiene-diene block copolymer rubber and styrene-isoprene block copolymer Examples thereof include rubber and hydrogenated products thereof, chloroprene rubber, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber.
In the above, when weather resistance is required for the anisotropically conductive sheet 10 to be obtained, it is preferable to use a material other than the conjugated diene rubber, and in particular, from the viewpoint of molding processability and electrical characteristics, silicone rubber is preferably used. It is preferable to use it.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.

Among these, liquid silicone rubber containing vinyl groups (vinyl group-containing polydimethylsiloxane) usually hydrolyzes dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylvinylchlorosilane or dimethylvinylalkoxysilane. And a condensation reaction, for example, followed by fractionation by repeated dissolution-precipitation.
In addition, the liquid silicone rubber containing vinyl groups at both ends is obtained by anionic polymerization of a cyclic siloxane such as octamethylcyclotetrasiloxane in the presence of a catalyst, using, for example, dimethyldivinylsiloxane as a polymerization terminator, and other reaction conditions. It can be obtained by appropriately selecting (for example, the amount of cyclic siloxane and the amount of polymerization terminator). Here, as the catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or silanolate solution thereof can be used, and the reaction temperature is, for example, 80 to 130 ° C.

On the other hand, a liquid silicone rubber containing hydroxyl groups (hydroxyl group-containing polydimethylsiloxane) usually undergoes hydrolysis and condensation reaction of dimethyldichlorosilane or dimethyldialkoxysilane in the presence of dimethylhydrochlorosilane or dimethylhydroalkoxysilane. For example, and fractionation by repeated dissolution-precipitation.
In addition, cyclic siloxane is anionically polymerized in the presence of a catalyst, and dimethylhydrochlorosilane, methyldihydrochlorosilane or dimethylhydroalkoxysilane is used as a polymerization terminator, and other reaction conditions (for example, the amount of cyclic siloxane and polymerization termination) It can also be obtained by appropriately selecting the amount of the agent. Here, as the catalyst for anionic polymerization, alkali such as tetramethylammonium hydroxide and n-butylphosphonium hydroxide or silanolate solution thereof can be used, and the reaction temperature is, for example, 80 to 130 ° C.

As the liquid silicone rubber, it is preferable to use a cured product whose compression set at 150 ° C. is 35% or less, and more preferably 20% or less. When the compression set is 35% or less, the anisotropic conductive sheet 10 is preferable because it has good durability when compressed repeatedly in the thickness direction.
As the liquid silicone rubber, it is preferable to use a cured product having a tear strength at 23 ° C. of 7 kN / m or more, more preferably 10 kN / m or more. When the tear strength is 7 kN / m or more, the anisotropic conductive sheet 10 is preferable because it has good durability when repeatedly compressed in the thickness direction.
Here, the compression set and tear strength of the liquid silicone rubber cured product can be measured by a method based on JIS K 6249.

  Such an elastic polymer substance preferably has a molecular weight Mw (referred to as a standard polystyrene equivalent weight average molecular weight) of 10,000 to 40,000. Further, from the viewpoint of heat resistance of the anisotropically conductive sheet 10 to be obtained, the molecular weight distribution index (refers to the value of the ratio Mw / Mn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn) is 2. The following are preferred.

In the above, the polymer material can contain a curing catalyst for curing the polymer material. As such a curing catalyst, an organic peroxide, a fatty acid azo compound, a hydrosilylation catalyst, or the like can be used.
Specific examples of the organic peroxide used as the curing catalyst include benzoyl peroxide, bisdicyclobenzoyl peroxide, dicumyl peroxide and ditertiary butyl peroxide.
Specific examples of the fatty acid azo compound used as the curing catalyst include azobisisobutyronitrile.
Specific examples of what can be used as a catalyst for the hydrosilylation reaction include chloroplatinic acid and salts thereof, platinum-unsaturated siloxane complex, vinylsiloxane and platinum complex, platinum and 1,3-divinyltetramethyldisiloxane. And the like, a complex of triorganophosphine or phosphite and platinum, an acetyl acetate platinum chelate, a complex of cyclic diene and platinum, and the like.
The amount of the curing catalyst used is appropriately selected in consideration of the type of polymer substance material, the type of curing catalyst, and other curing treatment conditions, and is usually 3 to 100 parts by weight of the polymer substance material. 15 parts by weight.

Further, the elastic polymer substance can contain an inorganic filler such as ordinary silica powder, colloidal silica, airgel silica, alumina, etc., if necessary. By including such an inorganic filler, the thixotropic property of the molding material for obtaining the anisotropic conductive sheet 10 is ensured, the viscosity thereof is increased, and the dispersion stability of the conductive particles is improved. At the same time, the strength of the anisotropically conductive sheet 10 obtained is increased.
The amount of such inorganic filler used is not particularly limited, but if it is used in a large amount, it is not preferable because the orientation of the conductive particles by the magnetic field cannot be sufficiently achieved.
The viscosity of the sheet molding material is preferably in the range of 100,000 to 1,000,000 cp at a temperature of 25 ° C.

As the conductive particles P contained in the base material 11, conductive particles exhibiting magnetism are used from the viewpoint that they can be easily aligned in the thickness direction of the anisotropic conductive sheet 10 by applying a magnetic field. It is preferable to use it. Specific examples of such conductive particles P include magnetic particles such as nickel, iron and cobalt, particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles, The surface of the core particles is plated with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles or inorganic particles such as glass beads or polymer particles as core particles. Examples include those obtained by plating the surface of the core particles with a conductive magnetic material such as nickel or cobalt, or those obtained by coating the core particles with both a conductive magnetic material and a metal having good conductivity.
Among these, it is preferable to use particles made of a ferromagnetic material, for example, nickel particles as core particles and the surfaces thereof plated with a metal having good conductivity, particularly gold.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and can be performed by, for example, chemical plating or electrolytic plating.

In the case of using the conductive particles P in which the surface of the core particles is coated with a conductive metal, from the viewpoint of obtaining good conductivity, the coverage of the conductive metal on the particle surface (surface area of the core particles). The ratio of the covering area of the conductive metal with respect to is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
The coating amount of the conductive metal is preferably 0.5 to 50% by weight of the core particle, more preferably 1 to 30% by weight, still more preferably 3 to 25% by weight, and particularly preferably 4 to 20%. % By weight. When the conductive metal to be coated is gold, the coating amount is preferably 2 to 30% by weight of the core particles, more preferably 3 to 20% by weight, and further preferably 3.5 to 17%. % By weight.

Moreover, it is preferable that the number average particle diameter of the electroconductive particle P is 1-200 micrometers, More preferably, it is 5-50 micrometers, Most preferably, it is 8-30 micrometers. When this number average particle diameter is too small, it may be difficult to obtain an anisotropic conductive sheet having a low electrical resistance value. On the other hand, when the number average particle diameter is excessive, it may be difficult to obtain an anisotropic conductive sheet with high resolution.
Further, the shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or agglomerated particles 2 can be easily dispersed in the polymer substance-forming material. It is preferable that it is a lump with secondary particles.

  The water content of the conductive particles P is preferably 5% or less, more preferably 3% or less, still more preferably 2% or less, and particularly preferably 1% or less. By using conductive particles satisfying such conditions, bubbles are prevented or suppressed from occurring when the polymer material is cured.

Moreover, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent can be used as appropriate. By treating the surface of the conductive particles with the coupling agent, the adhesion between the conductive particles and the elastic polymer substance is increased, and as a result, the anisotropic conductive sheet 10 obtained can be used repeatedly. High durability.
The amount of the coupling agent used is appropriately selected within a range that does not affect the conductivity of the conductive particles P, but the coupling agent coverage on the surface of the conductive particles (coupling agent relative to the surface area of the conductive core particles). Is preferably an amount such that the coverage ratio is 5% or more, more preferably 7 to 100%, further preferably 10 to 100%, particularly preferably 20 to 100%. is there.

  It is preferable that the anisotropic conductive sheet 10 contains conductive particles P in a volume fraction of 5 to 30%, preferably 7 to 27%, particularly preferably 10 to 25%. If this ratio is 5% or more, a conductive path having a sufficiently small electric resistance value is formed in the thickness direction, which is preferable. On the other hand, if this ratio is 30% or less, the anisotropic conductive sheet 10 to be obtained is preferable because it has necessary elasticity.

  In the anisotropic conductive sheet 10, the number of conductive particles P arranged in the thickness direction (the number of conductive particles P for forming a conductive path in the thickness direction. Hereinafter, the “number of conductive path forming particles” is also referred to. Is preferably 3-20, more preferably 5-15. If the number of particles forming the conductive path is 3 or more, the variation in the resistance value of the anisotropic conductive sheet 10 is preferably reduced. On the other hand, when the number of conductive path forming particles is 20 or less, deformation of the conductive path due to the chain of conductive particles P does not increase when the anisotropic conductive sheet 10 is compressed, and the resistance value is rarely increased. preferable.

As the insulating mesh constituting the reinforcing material 12 contained in the base material 11, those formed of organic fibers can be preferably used.
Examples of such organic fibers include fluorine resin fibers such as polytetrafluoroethylene resin, aramid fibers, polyethylene fibers, polyarylate fibers, nylon fibers, and polyester fibers.
Moreover, as an organic fiber, the linear thermal expansion coefficient is equal to or close to the linear thermal expansion coefficient of the material forming the connection object, for example, the circuit board, specifically, the linear thermal expansion coefficient is 30 × 10 ^{−6 to} −−. Since the thermal expansion of the anisotropic conductive sheet 10 is suppressed by using 5 × 10 ⁻⁶ / K, particularly 10 × 10 ⁻⁶ to −3 × 10 ⁻⁶ / K, due to temperature change Even when the thermal history is received, a good electrical connection state to the circuit board can be stably maintained.

The thickness of the reinforcing material 12 is preferably 10 to 300 μm, more preferably 20 to 100 μm.
When this thickness is too small, it may be difficult to obtain the anisotropic conductive sheet 10 having high durability. On the other hand, when this thickness is excessive, the thickness of the entire anisotropic conductive sheet becomes large, so that it becomes difficult to obtain the anisotropic conductive sheet 10 having high resolution.
Moreover, it is preferable that the diameter of the organic fiber which forms the reinforcing material 12 is 5-200 micrometers, More preferably, it is 10-100 micrometers.
Moreover, it is preferable that ratio of the thickness of the reinforcing material 12 with respect to the thickness of the anisotropic conductive sheet 10 is 0.1-1, More preferably, it is 0.2-0.8. When this ratio is too small, it may be difficult to obtain the anisotropic conductive sheet 10 having high durability. On the other hand, when this ratio is excessive, it may be difficult to obtain the anisotropic conductive sheet 10 having sufficient elasticity.

Moreover, it is preferable that the average opening diameter of the mesh which comprises the reinforcing material 12 is 10-800 micrometers, More preferably, it is 20-400 micrometers.
The ratio r / R is preferably 0.01 to 0.9, more preferably 0.1 to 0.9, where r is the number average particle diameter of the conductive particles and R is the average opening diameter of the mesh. 0.8.
When the average opening diameter of the mesh is too small, the orientation of the conductive particles may be hindered in the production method described later. On the other hand, when the average opening diameter of the mesh is excessive, it may be difficult to obtain the anisotropic conductive sheet 10 having high durability.

In the present invention, an antistatic agent can be contained in the base material 11 forming the anisotropic conductive sheet 10 as long as the insulating property of the elastic polymer substance is not impaired.
Examples of such antistatic agents include N, N-bis (2-hydroxyethyl) alkylamine, polyoxyethylene alkylamine, polyoxyethylene alkylamine fatty acid ester, glycerin fatty acid ester, sorbitan fatty acid ester, and polyoxyethylene sorbitan fatty acid ester. Nonionic antistatic agents such as polyoxyethylene fatty alcohol ethers, polyoxyethylene alkylphenyl ethers, polyethylene glycol fatty acid esters;
Anionic antistatic agents such as alkyl sulfonates, alkyl benzene sulfonates, alkyl sulfates, alkyl phosphates;
Cationic antistatic agents such as tetraalkylammonium salts and trialkylbenzylammonium salts;
Amphoteric antistatic agents such as alkyl petines and imidazoline type amphoteric compounds can be used.

By containing such an antistatic agent in the anisotropic conductive sheet 10, it is prevented or suppressed that charges are accumulated on the surface of the anisotropic conductive sheet 10, for example, the anisotropic conductive sheet. Can be used for electrical inspection of a circuit board, it is possible to prevent problems caused by electric charges being discharged from the anisotropic conductive sheet 10 at the time of inspection, and to obtain good conductivity with a smaller applied pressure. Can do.
In order to reliably exhibit the above effects, the volume resistivity of the base material made of the elastic polymer material forming the anisotropic conductive sheet 10 is 1 × 10 ⁹ to 1 × 10 ¹³ Ω · cm. Thus, it is preferable to contain an antistatic agent.

The anisotropic conductive sheet 10 of the present invention can be manufactured as follows, for example.
First, as shown in FIG. 3, each of the sheet-like one side molding member 14 and the other side molding member 15 has an opening 16 </ b> K having a shape that matches the planar shape of the target anisotropic conductive sheet 10. A frame-shaped spacer 16 having a thickness corresponding to the thickness of the anisotropic conductive sheet 10 is prepared. In addition, a fluid molding material is prepared in which conductive particles exhibiting magnetism are dispersed in a liquid polymer material that is cured to become an elastic polymer material. Then, as shown in FIG. 4, the spacer 16 is arranged on the molding surface (the upper surface in FIG. 4) of the other surface side molding member 15, and in the opening 16 </ b> K of the spacer 16 on the molding surface of the other surface side molding member 15. The prepared molding material 10B is applied, and the reinforcing material 12 made of mesh is immersed in the molding material 10B, and the molding surface (the lower surface in FIG. 4) of the one-side molding member 14 is molded on the molding material 10B. It arrange | positions so that the material 10B may be contact | connected.

In the above, as the one side molding member 14 and the other side molding member 15, resin sheets made of polyimide resin, polyester resin, acrylic resin, or the like can be used. Thus, by using a resin sheet as the one-surface-side molded member 14 and the other-surface-side molded member 15, it is possible to reduce the manufacturing cost as compared with the case where an expensive molded member such as a mold is used. .
Moreover, it is preferable that the thickness of the resin sheet which comprises the one surface side molded member 14 and the other surface side molded member 15 is 50-500 micrometers, More preferably, it is 75-300 micrometers. If this thickness is less than 50 μm, the strength required for the molded member may not be obtained. On the other hand, when the thickness exceeds 500 μm, it may be difficult to apply a magnetic field having a required strength to the molding material layer 10A.

Next, as shown in FIG. 5, by using a pressure roll device 19 including a pressure roll 17 and a support roll 18, the molding material is clamped by the one-surface-side molding member 14 and the other-surface-side molding member 15, thereby the one surface. A molding material layer 10 </ b> A having a required thickness is formed between the side molding member 14 and the other surface side molding member 15. In the molding material layer 10A, as shown in an enlarged view in FIG. 6, the conductive particles P are contained in a uniformly dispersed state, and the reinforcing material 12 is contained in a state immersed in the molding material. Yes.
After that, as shown in FIG. 7, for example, a pair of electromagnets M is arranged on the back surface (upper surface in the drawing) of the one-surface side molding member 14 and the back surface (lower surface in the diagram) of the other-surface molding member 15. By operating, a parallel magnetic field is applied in the thickness direction of the molding material layer 10A. As a result, in the molding material layer 10A, the conductive particles P dispersed in the molding material layer 10A are arranged in the thickness direction while maintaining the state of being dispersed in the surface direction as shown in FIG. Thus, a chain of a plurality of conductive particles P that are oriented and extend in the thickness direction is formed in a state of being dispersed in the plane direction.
In this state, the molding material layer 10A is cured to disperse the conductive particles P in the planar direction in the base material 11 made of an elastic polymer substance so that the conductive particles P are aligned in the thickness direction. An anisotropic conductive sheet 10 which is contained in a state and further contains a reinforcing material 12 is manufactured.

In the above, the curing treatment of the molding material layer 10A can be performed while the parallel magnetic field is applied, but can also be performed after the parallel magnetic field is stopped.
The intensity of the parallel magnetic field applied to the molding material 10A is preferably such that the average is 0.02 to 2.0 Tesla.
As a means for applying a parallel magnetic field to the molding material layer 10A, a permanent magnet can be used instead of an electromagnet. The permanent magnet is preferably made of alnico (Fe—Al—Ni—Co alloy), ferrite, or the like in that a parallel magnetic field strength in the above range can be obtained.
The curing treatment of the molding material layer 10A is appropriately selected depending on the material used, but is usually performed by heat treatment. The specific heating temperature and heating time are appropriately selected in consideration of the type of the polymer material constituting the molding material layer 10A, the time required for the movement of the conductive particles P, and the like.

  According to the anisotropic conductive sheet 10 described above, since the insulating reinforcing material 12 made of mesh is contained, permanent deformation due to press contact and deformation due to wear are suppressed even if the thickness is small. be able to. Therefore, even when the anisotropic conductive sheet 10 is used repeatedly, the required conductivity can be maintained over a long period of time, and a long service life can be obtained. Moreover, since the thickness can be reduced, an anisotropic conductive sheet having high resolution can be obtained.

<Circuit board inspection device>
FIG. 9 is an explanatory view showing a configuration of an example of the circuit board inspection apparatus according to the present invention, and FIG. 10 is an explanatory view showing an enlarged main part of the circuit board inspection apparatus shown in FIG. The circuit board inspection apparatus performs an open / short test on a circuit board having electrodes to be inspected on both sides.
In this circuit board inspection apparatus, an upper inspection jig 20 is provided above an inspection execution region T in which a circuit board (hereinafter referred to as “circuit board to be inspected”) 1 to be inspected is horizontally arranged. On the other hand, below the inspection execution region T, a lower side inspection jig 40 is provided. The upper side inspection jig 20 is supported by the upper side jig support mechanism 35, and the lower side inspection jig 40 is supported by the lower side jig support mechanism 55, whereby the upper side inspection jig 20 is supported. The lower-side inspection jig 40 is disposed so as to face each other in the vertical direction.

  The upper side inspection jig 20 includes an upper side electrode plate device 25, an anisotropic conductive sheet 21 disposed on the surface (lower surface in FIGS. 9 and 10) of the upper side electrode plate device 25, It is comprised by the upper side adapter 30 arrange | positioned at the surface (lower surface in FIG. 9 and FIG. 10) of the direction conductive sheet 21. FIG.

The upper electrode plate device 25 is composed of a large number of inspection electrode pins 26 arranged in accordance with a standard grid point arrangement, and a plate-like electrode pin support member 27 that vertically supports these inspection electrode pins 26. Yes. Here, the arrangement pitch of the inspection electrode pins 26 is 0.2 mm, 0.3 mm, 0.45 mm, 0.5 mm, 0.75 mm, 0.8 mm, 1.06 mm, 1.27 mm, 1.5 mm, and 1. It is 8 mm or 2.54 mm.
Each of the inspection electrode pins 26 has a cylindrical body portion 26A as shown in an enlarged view in FIG. 11, and a circle having a diameter smaller than the diameter of the body portion 26A is provided at the tip of the body portion 26A. A columnar electrode portion 26B is formed integrally with the body portion 26A, and a disc ring-shaped flange portion 26C is formed integrally with the body portion 26A at a central position in the longitudinal direction of the body portion 26A.
Each of the inspection electrode pins 26 is electrically connected to a connector (not shown) provided in the upper jig support mechanism 35 by an electric wire W connected to the base end thereof. Is electrically connected to a tester inspection circuit (not shown).

The electrode pin support member 27 includes a base end side support plate 28 that supports a base end portion of the body portion 26A of the inspection electrode pin 26 (refers to a portion on the base end side from the flange portion 26C), and the inspection electrode pin 26. A front end side support plate 29 that supports a front end portion of the body portion 26A (refers to a front end side portion from the flange portion 26C) is stacked.
A large number of through holes 28H each having an inner diameter matching the diameter of the body portion 26A of the inspection electrode pin 26 are formed in the base end side support plate 28 according to a pattern corresponding to the arrangement pattern of the inspection electrode pins 26. Yes. A base end portion of the body portion 26A of the inspection electrode pin 26 is inserted into each of the through holes 28H.
A large number of through holes 29H are formed in the distal end side support plate 29 in accordance with a pattern corresponding to the arrangement pattern of the inspection electrode pins 26. Each of these through-holes 29H has an inner diameter that matches the outer diameter of the flange portion 26C of the inspection electrode pin 26 formed on the back surface side (the upper surface side in FIGS. 10 and 11) of the distal end side support body 29. A large-diameter region G having a small-diameter region S that extends from the large-diameter region G continuously to the surface of the distal support plate 29 and has an inner diameter that matches the outer diameter of the body 26A of the inspection electrode pin 26. Thus, a step portion D between the small diameter region S and the large diameter region G is formed. Then, the distal end portion of the body portion 26A of the inspection electrode pin 26 is inserted into the small diameter region S of each through hole 29H, and the flange portion 26C of the inspection electrode pin 26 is accommodated in the large diameter region G so that the step portion D is formed. , The electrode portion 26B of the inspection electrode pin 26 is fixed in a state of protruding from the surface (the lower surface in FIGS. 10 and 11) of the distal end side support plate 29.

In the upper electrode plate device 25, it is preferable to use a flexible member as the electrode pin support member 27. Specifically, the electrode pin support member 27 is bent by being pressurized at a pressure of 50 kgf in a state where the electrode pin support member 27 is disposed at a predetermined position in the inspection apparatus. It is preferable that it has the flexibility which does not generate | occur | produce.
The material constituting the base end side support plate 28 and the front end side support plate 29 in the electrode pin support member 27 is an insulating material having a specific resistance of 1 × 10 ¹⁰ Ω · cm or more, such as a polyimide resin, a polyester resin, or a polyamide resin. , Phenol resin, polyacetal resin, polybutylene terephthalate resin, polyethylene terephthalate resin, syndiotactic polystyrene resin, polyphenylene sulfide resin, polyether ethyl ketone resin, fluorine resin, polyether nitrile resin, polyether sulfone resin, polyarylate Resin, resin material with high mechanical strength such as polyamideimide resin, glass fiber reinforced epoxy resin, glass fiber reinforced polyester resin, glass fiber reinforced polyimide resin, glass fiber reinforced phenol resin, glass fiber reinforced Glass fiber type composite resin materials such as fluororesin, carbon fiber reinforced epoxy resin, carbon fiber reinforced polyester resin, carbon fiber reinforced polyimide resin, carbon fiber reinforced phenolic resin, carbon fiber reinforced fluorocarbon resin and other carbon fiber types A composite resin material obtained by filling a composite resin, an epoxy resin, a phenol resin, or the like with an inorganic material such as silica, alumina, or boron nitride, or a composite resin material containing a mesh in an epoxy resin, a phenol resin, or the like can be used. Among these, glass fiber reinforced epoxy resins are preferable. Moreover, as the base end side support plate 28 and the front end side support plate 29, a composite plate material formed by laminating a plurality of plate materials made of the above materials can be used.
Although the thickness of the base end side support plate 28 is suitably selected according to the kind of material which comprises the said base end side support plate 28, it is 1-10 mm, for example.
A preferable specific example of the base end side support plate 28 is made of a glass fiber reinforced epoxy resin and has a thickness of 2 to 5 mm.
Moreover, the thickness of the whole electrode pin support member 27 is 5-15 mm, for example.

The upper adapter 30 includes a connection circuit board 31 and an anisotropic conductive sheet 10 having the structure shown in FIG. 1 and disposed on the surface (the lower surface in FIGS. 9 and 10) of the connection circuit board 31. Has been.
A plurality of connection electrodes 32 are formed on the surface of the connection circuit board 31 according to a pattern corresponding to the pattern of the upper surface side inspection target electrode 2 of the circuit board 1 to be inspected. A plurality of terminal electrodes 33 are formed according to a pattern corresponding to the arrangement pattern of the inspection electrode pins 26 in the upper electrode plate device 25, and each of the connection electrodes 32 is an appropriate terminal electrode 33 via an internal wiring 34. Is electrically connected.

  The anisotropic conductive sheet 21 is not particularly limited as long as the required electrical connection state between the inspection electrode pin 26 and the terminal electrode 33 of the connection circuit board 31 is achieved. Either an anisotropic conductive sheet or an unevenly distributed anisotropic conductive sheet may be used. In addition, as the dispersive anisotropic conductive sheet, one having the configuration shown in FIG. 1 can be used.

  The lower-side inspection jig 40 includes a lower-side electrode plate device 45, an anisotropic conductive sheet 41 disposed on the surface of the lower-side electrode plate device 45 (upper surface in FIGS. 9 and 10), It is comprised by the lower side adapter 50 arrange | positioned on the surface (upper surface in FIG. 9 and FIG. 10) of the direction conductive sheet 41. FIG.

The lower electrode plate device 45 includes a large number of inspection electrode pins 46 arranged in accordance with a standard grid point arrangement, and a plate-like electrode pin support member 47 that vertically supports these inspection electrode pins 46. Yes. Here, the pitch of the inspection electrode pins 46 is 0.2 mm, 0.3 mm, 0.45 mm, 0.5 mm, 0.75 mm, 0.8 mm, 1.06 mm, 1.27 mm, 1.5 mm, 1.8 mm. Or it is 2.54 mm.
Each of the inspection electrode pins 46 has a cylindrical body portion 46A as shown in an enlarged view in FIG. 12, and has a diameter smaller than the diameter of the body portion 46A at the tip of the body portion 46A. A cylindrical electrode portion 46B is formed integrally with the body portion 46A, and a flange portion 46C having an outer shape of a disc ring is formed integrally with the body portion 46A at a central position in the longitudinal direction of the body portion 46A. Yes.
Each of the inspection electrode pins 46 is electrically connected to a connector (not shown) provided on the lower inspection jig support mechanism 55 by an electric wire W connected to the base end thereof. It is electrically connected to a tester inspection circuit (not shown) via a connector.

The electrode pin support member 47 includes a base end side support plate 48 that supports a base end portion of the body portion 46A of the inspection electrode pin 46 (refers to a portion on the base end side from the flange portion 46C), and the inspection electrode pin 46. A front end side support plate 49 that supports a front end portion of the body portion 46A (referring to the front end side from the flange portion 46C) is stacked.
A large number of through holes 48H each having an inner diameter that matches the diameter of the body 46A of the inspection electrode pin 46 are formed in the proximal support plate 48 according to a pattern corresponding to the arrangement pattern of the inspection electrode pins 46. Yes. In each of the through holes 48H, the base end portion of the body portion 46A of the inspection electrode pin 46 is inserted, and the flange portion 46C of the inspection electrode pin 46 is engaged with the surface of the base end side support plate 48. Are combined. Further, as shown in FIG. 13, a substantially rectangular protruding portion 48 </ b> A is formed on the surface of the base end side support plate 48 in the entire region where the inspection electrode pins 46 are arranged.
A large number of through holes 49H are formed in the distal end side support plate 49 according to a pattern corresponding to the arrangement pattern of the inspection electrode pins 46. Each of these through holes 49H conforms to the outer diameter of the flange portion 46C of the inspection electrode pin 46 formed on the back surface side (the lower surface side in FIGS. 10 and 12) of the distal end side support plate 49. A large-diameter region G having an inner diameter, and a small-diameter region S having an inner diameter that conforms to the outer diameter of the body 46A of the inspection electrode pin 46 that extends continuously from the large-diameter region G to the surface of the tip support plate 49. Thus, a step portion D is formed between the small diameter region S and the large diameter region G. Then, the distal end portion of the body 46A of the inspection electrode pin 46 is inserted into the small diameter region S of each through hole 49H, and the flange portion 46C of the inspection electrode pin 46 is accommodated in the large diameter region G. The electrode portion 46B of the inspection electrode pin 46 is fixed in a state of protruding from the surface (upper surface in FIGS. 10 and 12) of the distal end side support plate 49.

In the lower electrode plate device 45, the electrode pin support member 47 is preferably a flexible one. Specifically, the electrode pin support member 47 is bent by being pressurized at a pressure of 50 kgf in a state where the electrode pin support member 47 is disposed at a predetermined position in the inspection apparatus. It is preferable that it has the flexibility which does not generate | occur | produce.
The material constituting the proximal end side support plate 48 and the distal end side support plate 49 in the electrode pin support member 47 is the same as the material constituting the proximal end side support plate 28 and the distal end side support plate 29 in the electrode pin support member 27. Things can be used.
Although the thickness of the base end side support plate 48 is suitably selected according to the kind of material which comprises the said base end side support plate 48, it is 1-10 mm, for example. Here, the thickness of the base end side support plate 48 in the lower electrode plate device 45 indicates the thickness of the portion where the protrusion 48A is formed. The protrusion height of the protrusion 48A of the base end side support plate 48 is preferably 0.5 to 5 mm.
A preferable specific example of the base end side support plate 48 is made of a glass fiber reinforced epoxy resin and has a thickness of 2 to 5 mm.
Moreover, the thickness of the whole electrode pin support member 47 is 5-15 mm, for example.

The lower-side adapter 50 includes a connection circuit board 51 and an anisotropic conductive sheet 10 having the structure shown in FIG. 1 disposed on the surface of the connection circuit board 51 (upper surface in FIGS. 9 and 10). Has been.
A plurality of connection electrodes 52 are formed on the surface of the connection circuit board 51 according to a pattern corresponding to the pattern of the lower surface side inspection target electrode 3 of the circuit board 1 to be inspected. A plurality of terminal electrodes 53 are formed according to a pattern corresponding to the arrangement pattern of the inspection electrode pins 46 in the lower electrode plate device 45, and each of the connection electrodes 52 is connected to an appropriate terminal electrode 53 via an internal wiring 54. Is electrically connected.

  The anisotropic conductive sheet 41 is not particularly limited as long as the required electrical connection state between the inspection electrode pin 46 and the terminal electrode 53 of the connection circuit board 51 is achieved. Either an anisotropic conductive sheet or an unevenly distributed anisotropic conductive sheet may be used. In addition, as the dispersive anisotropic conductive sheet, one having the configuration shown in FIG. 1 can be used.

In the illustrated example, the lower inspection jig 40 is provided with a circuit board holding mechanism 60 for holding the circuit board 1 to be inspected in the inspection execution region T. The circuit board holding mechanism 60 has a plurality of positioning pins 61 for arranging the circuit board 1 to be inspected at a predetermined position in the inspection execution region T. These positioning pins 61 are fixed to the alignment movable plate 62. In addition, the positioning pin through hole 48K formed in the base end side support plate 48 of the electrode pin support member 47 and the positioning pin through hole 49K formed in the distal end side support plate 49 are inserted.
The alignment movable plate 62 has a thickness that matches the protruding height of the protruding portion 48A of the base end side support plate 48 of the electrode pin support member 47, and is supported by the movable plate support 63. The plate support 63 is provided on the lower jig support plate 56 of the lower jig support mechanism 55 described later so as to be movable in the surface direction. Further, as shown in FIG. 13, the alignment movable plate 62 has a substantially rectangular movable hole 62 </ b> H having a dimension larger than the plane dimension of the protruding portion 48 </ b> A of the proximal support plate 48 in the electrode pin support member 47. The protruding portion 48A of the base end side support plate 48 is arranged to be inserted into the movable hole 62H.

The upper side jig support mechanism 35 includes a horizontally arranged flat upper side jig support plate 36 and a plurality of upper side jig support columns extending downward from the lower surface of the upper side jig support plate 36. 37.
In the illustrated example, the upper jig post 37 includes a columnar base end portion 37A fixed to the upper jig support plate 36, and the base end portion 37A continuously formed on the base end portion 37A. The upper end support point 37 </ b> S is formed by the front end surface of the upper jig post 37, which has a cylindrical tip end portion 37 </ b> B having an outer diameter smaller than the outer diameter of the end portion 37 </ b> A.
The upper-side electrode plate device 25 is supported by the distal end surfaces of the upper-side jig support columns 37. Specifically, on the back surface of the upper electrode plate device 25, that is, on the back surface of the base end side support plate 27, the outer diameter of the tip end portion of the upper side jig support column 37 is set at each position of the upper side support point 37 </ b> S. A concave portion (not shown) having a matching inner diameter is formed, and the upper end electrode plate device 25 is supported by inserting and fixing the tip end portion of the upper jig post 37 to the concave portion. Has been.

The lower-side jig support mechanism 55 includes a horizontally disposed flat lower-side jig support plate 56 and a plurality of lower-side jig support columns extending downward from the lower surface of the lower-side jig support plate 56. 57.
In the illustrated example, the lower jig post 57 includes a columnar base end portion 57A fixed to the lower jig support plate 56, and the base end portion 57A continuously formed on the base end portion 57A. The lower end support point 57 </ b> S is formed by the front end surface of the lower jig support column 57.
The lower electrode plate device 45 is supported by the respective tip surfaces of the lower jig post 57. Specifically, on the back surface of the lower electrode plate device 45, that is, on the back surface of the base end side support plate 47, the outer diameter of the distal end portion of the lower side jig support column 57 is set at each position of the lower side support point 57 </ b> S. A recess (not shown) having a matching inner diameter is formed, and the lower electrode plate device 45 is supported by inserting and fixing the tip of the lower jig support column 57 in this recess. Has been.

In the above, as the upper side jig support plate 36 and the lower side jig support plate 56, for example, a phenol resin laminate containing a fine yarn cloth (trade name “Sumilite” manufactured by Sumitomo Bakelite Co., Ltd.) is used. it can.
As materials of the upper jig post 37 and the lower jig post 57, for example, brass, aluminum, titanium, stainless steel, copper, iron, and alloys thereof can be used. The total length of the upper jig post 37 and the lower jig post 57 is preferably 10 to 100 mm.
Further, the outer diameter of each of the tip portions of the upper jig post 37 and the lower jig post 57 is preferably 1 to 10 mm, and further, the outer diameter of the upper jig post 37 is outside the tip portion. The diameter and the outer diameter of the tip of the lower jig post 57 are preferably the same.

Each of the upper jig post 37 and the lower jig post 57 includes, as shown in FIG. 14, each of the upper support points 37 </ b> S and the lower jig for the upper jig post 37. Each of the lower support points 57S related to the support column 57 is on a projection plane (hereinafter referred to as “specific projection plane”) M1 as seen through the upper side inspection jig 20 and the lower side inspection jig 40 in the thickness direction. Are arranged so as not to overlap each other.
In the illustrated example, each of the upper jig post 37 and the lower jig post 57 are arranged at lattice point positions having the same pitch and are adjacent to each other on the specific projection plane M1. One lower support point 57S is located at and adjacent to each central position of a rectangular upper unit region R1 (indicated by a two-dot chain line in the figure) defined by four upper support points 37S. Arrangement is made so that one upper support point 37S is positioned at the center position of a rectangular lower unit region R2 (indicated by a one-dot chain line in the figure) defined by four lower support points 57S.
Here, the distance between the centers of the upper support points 37A adjacent to each other and the distance between the centers of the lower support points 57S adjacent to each other are preferably 10 to 100 mm, more preferably 12 to 70 mm. Preferably it is 15-50 mm.

In the inspection apparatus configured as described above, an electrical inspection of the circuit board 1 to be inspected is performed as follows.
First, the circuit board 1 to be inspected is set on the circuit board holding mechanism 60, and the circuit board holding mechanism 60 aligns the circuit board 1 to be inspected. Here, as the circuit board 1 to be inspected, circuit boards having various configurations can be applied. In the inspection apparatus of this example, the inspection apparatus presses with a pressure of 50 kgf to cause bending, and 500 kgf. Even if it pressurizes with this pressure, what has the flexibility of the grade which does not produce destruction and a permanent deformation is preferable.

  Next, one or both of the upper-side jig holding mechanism 35 and the lower-side jig holding mechanism 55 move in a direction in which the upper side jig holding mechanism 35 and the lower side jig holding mechanism 55 approach each other. It is clamped by the lower side inspection jig 40. As a result, in the upper side inspection jig 20, a conductive path is formed in the thickness direction in each of the anisotropic conductive sheet 21 and the anisotropic conductive sheet 10 in the upper side adapter 30, whereby the inspection electrode pin 26 and the terminal electrode 33 in the connection circuit board 31 are achieved, and the connection between the connection electrode 32 in the connection circuit board 31 and the upper surface side electrode 2 to be inspected 2 in the circuit board 1 to be inspected. Is achieved. On the other hand, in the lower-side inspection jig 40, the conductive path is formed in the thickness direction in each of the anisotropic conductive sheet 41 and the anisotropic conductive sheet 10 in the lower-side adapter 50, whereby the inspection electrode pin 46 is formed. And the terminal electrode 53 on the connection circuit board 51 are achieved, and the electrical connection between the connection electrode 52 on the connection circuit board 51 and the lower surface side test electrode 3 on the circuit board 1 to be inspected is achieved. Achieved. This state is a measurement state.

  In this way, each of the upper surface side inspection electrodes 2 of the circuit board 1 to be inspected is electrically connected to each of the inspection electrode pins 26 via the upper side adapter 30 and the anisotropic conductive sheet 21, Each of the lower-surface-side inspected electrodes 3 of the circuit board 1 to be inspected is electrically connected to each of the inspection electrode pins 46 via the lower-side adapter 50 and the anisotropic conductive sheet 41, whereby the circuit board to be inspected. The measurement state in which each circuit in 1 is electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state.

In the above measurement state, as schematically shown in FIG. 15, the level at which the tip surface of the upper jig post 37 is positioned (hereinafter referred to as “upper support point level”) and the lower jig. The gap (hereinafter referred to as “the gap between the support points”) with the level at which the front end surface of the support post 57 is located (hereinafter also referred to as “lower support point level”) and the upper inspection jig 20 The total thickness of the composite stack F composed of the inspection circuit board 1 and the lower inspection jig 40 is smaller than the total thickness of the composite stack F. Therefore, the composite stack F is applied with pressure at the upper support point 47S and the lower support point 57S. It is in a state of being deformed into a regular wave shape.
In such a state, since the composite stack F is forcibly deformed into a regular wave shape, the pressure applied by the upper jig post 37 and the lower jig post 57 is reduced. Concentrating and acting on a part of the inspection circuit board 1 is suppressed, and as a result, the circuit board 1 to be inspected is sandwiched with a uniform pressure over the entire surface.

In the above description, the deflection amount b generated in the composite stack F by the pressurization by the upper jig post 37 and the lower jig post 57 is diagonal to each other in the upper unit region R1 on the specific projection surface M1, for example. It is preferably 1 to 0.02%, more preferably 0.5 to 0.04%, of the center-to-center distance a (see FIG. 14) of the two upper support points 37S located at the apex position.
Further, the pressing force on the entire circuit board 1 to be inspected in the measurement state is, for example, 110 to 250 kgf.

According to such a circuit board inspection apparatus, the anisotropic conductive sheet 10 in the upper adapter 30 and the lower adapter 50 maintains the required conductivity even when used repeatedly. A highly reliable inspection can be performed over a long period of time.
Further, by using the anisotropic conductive sheet 10 having a small thickness, the upper surface side inspected electrode 2 and the lower surface side inspected electrode 3 are minute ones, and these are arranged at a small pitch. The required electrical connection can be reliably achieved even with respect to 1.
In addition, since the anisotropic conductive sheet 10 has a long service life, when inspecting a large number of circuit boards, the frequency of replacing the anisotropic conductive sheet 10 with a new one becomes low. As a result, the inspection cost can be reduced.

  Further, the upper inspection jig support 37 of the upper inspection jig holding mechanism 35 and the lower inspection jig support 57 of the lower inspection jig holding mechanism 55 are provided on each of the upper support points 37S and the lower support. Since each of the points 57S is arranged so as not to overlap with each other on the specific projection plane M1, the circuit board 1 to be inspected is clamped with a uniform pressure over the entire surface, so that a relatively small pressure is applied. Thus, stable electrical connection to the circuit board 1 to be inspected can be achieved, and as a result, deterioration of the anisotropic conductive sheet 10 due to repeated pressurization can be suppressed. Therefore, when many circuit boards are inspected, the frequency of replacing the anisotropic conductive sheet 10 with a new one is further reduced.

FIG. 16 is an explanatory view showing a configuration in another example of the circuit board inspection apparatus of the present invention, and FIG. 17 is an explanatory view showing an enlarged main part of the circuit board inspection apparatus shown in FIG. The circuit board inspection apparatus performs an electrical resistance measurement test for each wiring pattern on a circuit board having electrodes to be inspected on both sides.
In this circuit board inspection apparatus, an upper side inspection jig 20 is provided above an inspection execution region T in which the circuit board 1 to be inspected is horizontally arranged, while on the other hand, below the inspection execution region T, A lower side inspection jig 40 is provided. The upper side inspection jig 20 is supported by the upper side jig support mechanism 35, and the lower side inspection jig 40 is supported by the lower side jig support mechanism 55, whereby the upper side inspection jig 20 is supported. The lower-side inspection jig 40 is disposed so as to face each other in the vertical direction. The upper-side jig support mechanism 35 and the lower-side jig support mechanism 55 have basically the same configurations as the upper-side jig support mechanism 35 and the lower-side jig support mechanism 55 in the inspection apparatus shown in FIG. Moreover, the arrangement state of the upper jig post 37 in the upper support mechanism 35 and the lower jig post 57 in the lower support mechanism 55 is the same as that of the inspection apparatus shown in FIG. 9 (see FIG. 14).

The upper side inspection jig 20 includes an upper side electrode plate device 25, an anisotropic conductive sheet 21 disposed on the surface (lower surface in FIGS. 16 and 17) of the upper side electrode plate device 25, It is comprised with the upper side adapter 30 arrange | positioned at the surface (lower surface in FIG. 16 and FIG. 17) of the direction conductive sheet 21. FIG. The upper electrode plate device 25 and the anisotropic conductive sheet 21 have basically the same configuration as the upper electrode plate device 25 and the anisotropic conductive sheet 21 in the inspection apparatus shown in FIGS. 9 and 10.
The upper adapter 30 includes a connection circuit board 31A and an anisotropic conductive sheet 10 having the structure shown in FIG. 1 arranged on the surface (the lower surface in FIGS. 16 and 17) of the connection circuit board 31A. Has been.
As shown also in FIG. 18, on the surface of the connection circuit board 31A, connection electrodes (hereinafter referred to as current supply electrodes) that are electrically spaced apart from each other and are electrically connected to the same upper-surface-side inspected electrode 2, respectively. , Also referred to as “current supply electrode”) 32A and a plurality of connection electrode pairs 32C comprising voltage measurement connection electrodes (hereinafter also referred to as “voltage measurement electrodes”) 32B. Are formed according to a pattern corresponding to the pattern of the upper-surface-side inspected electrode 2, and a plurality of patterns are formed on the back surface of the connection circuit board 31 A according to the pattern corresponding to the arrangement pattern of the inspection electrode pins 26 in the upper-side electrode plate device 25 A terminal electrode 33A is formed, and each of the current supply electrode 32A and the voltage measurement electrode 32B is electrically connected to an appropriate terminal electrode 33A via an internal wiring 34A. .

The lower-side inspection jig 40 includes a lower-side electrode plate device 45, an anisotropic conductive sheet 41 disposed on the surface (the upper surface in FIGS. 16 and 17) of the lower-side electrode plate device 45, The lower-side adapter 50 disposed on the surface (the upper surface in FIGS. 16 and 17) of the direction conductive sheet 41 and the circuit board holding mechanism 60 are configured. The lower electrode plate device 45, the anisotropic conductive sheet 41 and the circuit board holding mechanism 60 are the same as the lower electrode plate device 45, the anisotropic conductive sheet 41 and the circuit board holding mechanism 60 in the inspection apparatus shown in FIGS. Basically the same configuration.
The lower-side adapter 50 includes a connection circuit board 51A and an anisotropic conductive sheet 10 having the structure shown in FIG. 1 arranged on the surface (the upper surface in FIGS. 16 and 17) of the connection circuit board 51A. Has been.
On the surface of the connection circuit board 51A, a plurality of connection electrodes each consisting of a current supply electrode 52A and a voltage measurement electrode 52B that are electrically connected to the same lower surface side test electrode 3 and are spaced apart from each other. The electrode pair 52C is formed in accordance with a pattern corresponding to the pattern of the lower surface side inspection target electrode 3 of the circuit board 1 to be inspected, and the inspection electrode pins 46 in the lower side electrode plate device 45 are formed on the rear surface of the connection circuit board 51A. A plurality of terminal electrodes 53A are formed according to a pattern corresponding to the array pattern, and each of the current supply electrode 52A and the voltage measurement electrode 52B is electrically connected to an appropriate terminal electrode 53A via an internal wiring 54A. Has been.

In the inspection apparatus configured as described above, an electrical inspection of the circuit board 1 to be inspected is performed as follows.
First, the circuit board 1 to be inspected is set on the circuit board holding mechanism 60, and the circuit board holding mechanism 60 aligns the circuit board 1 to be inspected.
Next, one or both of the upper-side jig holding mechanism 35 and the lower-side jig holding mechanism 55 move in a direction in which the upper side jig holding mechanism 35 and the lower side jig holding mechanism 55 approach each other. It is clamped by the lower side inspection jig 40. As a result, in the upper side inspection jig 20, a conductive path is formed in the thickness direction in each of the anisotropic conductive sheet 21 and the anisotropic conductive sheet 10 in the upper side adapter 30, whereby the inspection electrode pin 26 and the terminal electrode 33A in the connection circuit board 31A are achieved, and each of the current supply electrode 32A and the voltage measurement electrode 32B in the connection electrode pair 32C of the connection circuit board 31A is inspected. Electrical connection with the upper surface side inspection electrode 2 in the circuit board 1 is achieved. On the other hand, in the lower-side inspection jig 40, the conductive path is formed in the thickness direction in each of the anisotropic conductive sheet 41 and the anisotropic conductive sheet 10 in the lower-side adapter 50, whereby the inspection electrode pin 46 is formed. And the terminal electrode 53A in the connection circuit board 51A are achieved, and each of the current supply electrode 52A and the voltage measurement electrode 52B in the connection electrode pair 52C of the connection circuit board 51A and the circuit to be inspected Electrical connection with the lower surface side electrode 3 on the substrate 1 is achieved. This state is a measurement state.

  In this way, each of the upper surface side inspection electrodes 2 of the circuit board 1 to be inspected is electrically connected to each of the inspection electrode pins 26 via the upper side adapter 30 and the anisotropic conductive sheet 21, Each of the lower-surface-side inspected electrodes 3 of the circuit board 1 to be inspected is electrically connected to each of the inspection electrode pins 46 via the lower-side adapter 50 and the anisotropic conductive sheet 41, whereby the circuit board to be inspected. The measurement state in which each circuit in 1 is electrically connected to the test circuit of the tester is achieved, and the required electrical test is performed in this state. Specifically, a constant value of current is supplied between the current supply electrode 32A in the upper adapter 30 and the current supply electrode 52A in the lower adapter 50, and a plurality of voltage measurements in the upper adapter 30 are performed. One of the electrodes 32B is designated, and the designated one voltage measuring electrode 32B and the lower surface side covered electrode corresponding to the upper surface side inspected electrode 2 electrically connected to the voltage measuring electrode 32B are designated. The voltage between the voltage measuring electrode 52B in the lower adapter 50 electrically connected to the inspection electrode 3 is measured, and based on the obtained voltage value, the specified one voltage measuring electrode 32B. The electrical resistance value of the wiring pattern formed between the upper surface side inspected electrode 2 electrically connected to the lower surface side inspected electrode 52B corresponding thereto is acquired. Then, the electrical resistance of all the wiring patterns is measured by sequentially changing the designated voltage measuring electrode 32B.

According to such a circuit board inspection apparatus, the anisotropic conductive sheet 10 in the upper adapter 30 and the lower adapter 50 maintains the required conductivity even when used repeatedly. A highly reliable inspection can be performed over a long period of time.
Further, by using the anisotropic conductive sheet 10 having a small thickness, the upper surface side inspected electrode 2 and the lower surface side inspected electrode 3 are minute ones, and these are arranged at a small pitch. The required electrical connection can be reliably achieved even with respect to 1.
In addition, since the anisotropic conductive sheet 10 has a long service life, when inspecting a large number of circuit boards, the frequency of replacing the anisotropic conductive sheet 10 with a new one becomes low. As a result, the inspection cost can be reduced.

  Further, the upper inspection jig support 37 of the upper inspection jig holding mechanism 35 and the lower inspection jig support 57 of the lower inspection jig holding mechanism 55 are provided on each of the upper support points 37S and the lower support. Since each of the points 57S is arranged so as not to overlap each other on the specific projection plane M1 (see FIG. 14), the circuit board 1 to be inspected is clamped with a uniform pressure over the entire surface. A stable electrical connection to the circuit board 1 to be inspected can be achieved with a relatively small pressure, and as a result, deterioration of the anisotropic conductive sheet 10 due to repeated pressurization can be suppressed. Therefore, when many circuit boards are inspected, the frequency of replacing the anisotropic conductive sheet 10 with a new one is further reduced.

The present invention is not limited to the above embodiment, and various modifications can be made.
For example, in the anisotropic conductive sheet, a nonwoven fabric can be used as a reinforcing material instead of a mesh. As this nonwoven fabric, those having a large number of openings of 10 to 800 μm, particularly 20 to 400 μm are preferable. As means for forming the opening in the nonwoven fabric, drilling, punching, laser processing or the like can be used.
Further, the circuit board inspection apparatus is not limited to the one shown in FIG. 9 and the one shown in FIG. 16 as long as it has the anisotropic conductive sheet according to the present invention, and various configurations can be adopted. .

  Hereinafter, specific examples of the present invention will be described, but the present invention is not limited thereto.

<Example 1>
[Preparation of molding material]
The liquid A and the liquid B of the two-pack type addition type liquid silicone rubber were mixed at an equal ratio. After adding and mixing 18 parts by weight of conductive particles having an average particle diameter of 15 μm to 100 parts by weight of this mixture, a molding material was prepared by performing a defoaming treatment under reduced pressure.
In the above, as addition type liquid silicone rubber, the viscosity of liquid A and liquid B is 2500 P, respectively, and the compression set at 150 ° C. of the cured product (measurement method based on JIS K 6249) is 6% at 23 ° C. A tear strength (measurement method based on JIS K 6249) of 30 kN / m was used.
As the conductive particles, nickel particles were used as core particles, and the core particles were subjected to electroless gold plating (average coating amount: an amount that is 2% by weight of the weight of the core particles).

[Manufacture of anisotropic conductive sheet]
One side molding member and other side molding member each made of a polyester resin sheet having a thickness of 0.1 mm were prepared.
Next, a frame-shaped spacer having a rectangular opening of 150 mm × 150 mm and a thickness of 60 μm is arranged on the molding surface of the other-surface-side molded member, and then the prepared molding material is applied into the spacer opening. Then, a reinforcing material made of mesh was immersed in the molding material, and then the one-surface-side molded member was arranged on the molding material so that the molding surface was in contact with the molding material. Here, the mesh constituting the reinforcing material is formed of polyarylate fibers having a fiber diameter of 23 μm, and has dimensions of 150 mm × 150 mm × 42 μm, a numerical aperture of 130 / cm, and an opening diameter of 54 μm.
Thereafter, by using a pressure roll device composed of a pressure roll and a support roll, the molding material is clamped by the one-surface-side molded member and the other-surface-side molded member, whereby the one-surface-side molded member and the other-surface-side molded member are A molding material layer having a thickness of 60 μm was formed therebetween.
Then, an electromagnet is disposed on the back surface of each of the one-surface-side molded member and the other-surface-side molded member, and a condition of 100 ° C. for one hour is applied to the molding material layer while applying a 1.5 T parallel magnetic field in the thickness direction. A rectangular anisotropic conductive sheet having a thickness of 60 μm was manufactured by curing the molding material layer. This anisotropic conductive sheet is referred to as “anisotropic conductive sheet (a)”.
In this anisotropic conductive sheet (a), the ratio of the thickness of the reinforcing material to the thickness of the anisotropic conductive sheet (a) is 0.7, and the conductivity with respect to the average opening diameter R of the mesh constituting the reinforcing material. The ratio r / R of the number average particle diameter r of the particles is 0.28.

[Production of inspection equipment]
According to the configuration of FIG. 9, a circuit board inspection apparatus suitable for the inspection section of the rail transport type automatic circuit board inspection machine “STARCREC V5” (manufactured by Nidec Reed) was produced under the following conditions.

[Inspection electrode plate device (25)]
The inspection electrode pin (26) is made of brass plated with gold, and its total length (the length from the base end surface of the body portion (26A) to the front end surface of the electrode portion (26B)) is 5 mm. The specific dimensions of each part are as follows: the outer diameter of the electrode part (26B) is 0.35 mm, the length of the electrode part (26B) is 0.1 mm, the outer diameter of the body part (26A) is 0.48 mm, 26A) has a length of 4.9 mm, the outer diameter of the collar part (26C) is 0.55 mm, the thickness of the collar part (26C) is 0.1 mm, and the base part of the trunk part (26A) extends from the proximal end to the collar part (26C). The length to the base end side end surface (the length of the base end portion of the body portion (26A)) is 3 mm, and the length from the front end of the body portion (26A) to the front end side end surface of the collar portion (26C) (body portion ( 26A) is 1.8 mm, and the arrangement pitch of the inspection electrode pins (26) is 0.75 mm.
The electrode pin support member (27) is made of a glass fiber reinforced epoxy resin, and the base end side support plate (28) has a size of 200 mm × 346 mm × 4.0 mm, and the front end side support plate (29) has a size of 200 mm × It is 346 mm x 1.9 mm.

[Upper adapter (30)]
The connection circuit board (31) has 5844 rectangular connection electrodes (32) and 5844 circular terminal electrodes (33), and the dimension of the minimum connection electrode (32) is 60 μm × The minimum pitch of the connection electrodes (32) is 200 μm, the diameter of the terminal electrodes (33) is 0.4 mm, and the pitch of the terminal electrodes (33) is 750 μm.
An anisotropic conductive sheet (10) is said anisotropic conductive sheet (a).

[Anisotropic conductive sheet (21)]
A dispersion-type anisotropic conductive sheet comprising nickel particles (average particle diameter: 35 μm) subjected to gold plating in a proportion of 13% in volume fraction in silicone rubber having a hardness of 30 Is 100 mm × 110 mm × 0.25 mm.

[Lower side electrode plate device (45)]
The inspection electrode pin (46) is made of brass plated with gold, and its total length (the length from the base end surface of the body portion (46A) to the front end surface of the electrode portion (46B)) is 5 mm. The specific dimensions of each part are as follows: the outer diameter of the electrode part (46B) is 0.35 mm, the length of the electrode part (46B) is 0.1 mm, the outer diameter of the body part (46A) is 0.48 mm, 46A) has a length of 4.9 mm, an outer diameter of the flange part (46C) of 0.55 mm, and a thickness of 0.1 mm. From the proximal end of the body part (46A) to the proximal end surface of the flange part (46C) Length (the length of the base end portion of the body portion (46A)) is 3 mm, and the length from the front end of the body portion (46A) to the front end side end surface of the flange portion (46C) (the front end of the body portion (46A)) The length of the portion) is 1.8 mm, and the arrangement pitch of the inspection electrode pins (46) is 0.75 mm.
The electrode pin support member (47) is made of a glass fiber reinforced epoxy resin, the base end side support plate (48) has a size of 200 mm × 346 mm × 4.0 mm, and the protruding portion (48A) has a protruding height of 3.0 mm. And the dimension of the front end side support plate (49) is 200 mm × 346 mm × 1.9 mm.

[Lower adapter (50)]
The connection circuit board (51) has 4362 rectangular connection electrodes (52) and 4362 circular terminal electrodes (53), and the dimension of the minimum connection electrode (52) is 60 μm × The minimum pitch of the connection electrodes (52) is 200 μm, the diameter of the terminal electrodes (53) is 0.4 mm, and the pitch of the terminal electrodes (33) is 750 μm.
An anisotropic conductive sheet (10) is said anisotropic conductive sheet (a).

[Anisotropic conductive sheet (41)]
A dispersion-type anisotropic conductive sheet comprising nickel particles (average particle diameter: 35 μm) subjected to gold plating in a proportion of 13% in volume fraction in silicone rubber having a hardness of 30 Is 100 mm × 110 mm × 0.25 mm.

[Circuit board holding mechanism (60)]
It has an alignment movable plate having dimensions of 200 mm × 346 mm × 2.95 mm.

[Upper jig support mechanism (35)]
The upper jig post (37) is made of brass and has an outer diameter of 4 mm at the tip and a total length of 67 mm. The distance between the centers of the adjacent upper-side jig posts (37) is 32.25 mm in the horizontal direction (left-right direction in FIG. 9), and 24.75 mm in the vertical direction (direction perpendicular to the paper surface in FIG. 1).
[Lower side jig support mechanism (55)]
The lower-side jig post (57) is made of brass, has an outer diameter of 4 mm at the tip, and a total length of 67 mm. The center-to-center distance between the adjacent upper jig columns (57) is 32.25 mm in the horizontal direction (left-right direction in FIG. 9) and 24.75 mm in the vertical direction (direction perpendicular to the paper surface in FIG. 1).

The positional relationship between the upper support point related to the upper jig post (37) and the lower support point related to the lower jig post (57) is as follows.
Referring to FIG. 14, on the specific projection plane M1, one lower support point 57S is positioned at the center position of a rectangular upper unit region R1 defined by four adjacent upper support points 37S. In addition, one upper support point 37S is positioned at the center position of the rectangular lower unit region R2 defined by four adjacent lower support points 57S.
Further, the center-to-center distance a between the two upper support points 37S positioned at the mutually opposite vertex positions in the upper unit region R1 is 41 mm.

[Evaluation of anisotropic conductive sheet]
About said test | inspection apparatus, the durability test of the anisotropic conductive sheet (a) in an upper side adapter and a lower side adapter was done with the following method using the circuit board for evaluation of the following specifications. The results are shown in Table 1.

[Evaluation circuit board specifications]
The overall dimensions of the evaluation circuit board are 100 mm × 100 mm × 0.8 mm, the total number of the upper surface side electrodes to be inspected is 5844, the diameter of the smallest upper surface side electrode to be inspected is 0.1 mm, and the minimum pitch 0.24 mm, the total number of lower surface side electrodes to be inspected is 4362, the minimum diameter of the lower surface side electrodes to be inspected is 0.1 mm, and the minimum pitch is 0.2 mm.

[Durability test]
The inspection apparatus was mounted on an inspection section of a rail conveyance type automatic circuit board inspection machine ("STARREC V5" manufactured by Nidec Reed), and an evaluation circuit board was set on the circuit board holding mechanism of the inspection apparatus. Next, after a predetermined number of pressurization operations are performed on the evaluation circuit board under the condition where the press pressure is 180 kgf, the connection circuit in the upper adapter is pressed with respect to the evaluation circuit board under the condition where the press pressure is 180 kgf. The electric resistance value was measured 10 times when a current of 1 milliampere was applied between the connection electrode of the substrate and the connection electrode of the connection circuit board in the lower adapter. An inspection point having a measured electrical resistance value of 100Ω or more (hereinafter referred to as “NG inspection point”) is determined as a continuity failure, and a ratio of NG inspection points to the total inspection points (hereinafter referred to as “NG inspection point ratio”). Calculated).
Further, the NG inspection point ratio was calculated in the same manner as described above except that the anisotropic conductive sheet in the inspection apparatus was replaced with a new one and the press pressure condition in the pressurization operation and the electric resistance measurement operation was changed to 200 kgf. .
In the actual circuit board inspection, the NG inspection point ratio is required to be 0.01% or less. When the NG inspection point ratio exceeds 0.01%, a non-defective circuit board to be inspected is required. Therefore, it is difficult to perform electrical inspection of a highly reliable circuit board.

<Comparative example 1>
An anisotropic conductive sheet was produced in the same manner as in Example 1 except that the reinforcing material was not used. The obtained anisotropic conductive sheet is referred to as “anisotropic conductive sheet (b)”. Next, an inspection apparatus was prepared in the same manner as in Example 1 except that the anisotropic conductive sheet (b) was used instead of the anisotropic conductive sheet (a), and the durability test of the anisotropic conductive sheet was performed. went. The results are shown in Table 1.

  As is apparent from the results in Table 1, the anisotropic conductive sheet according to the present invention stably maintains the required conductivity over a long period of time even when it is used repeatedly many times, and has a long service life. It was confirmed that it has.

It is sectional drawing for description which shows the structure in an example of the anisotropically conductive sheet which concerns on this invention. It is sectional drawing for description which expands and shows a part of anisotropic conductive sheet shown in FIG. It is sectional drawing for description which shows the one surface side shaping | molding member, the other surface side shaping | molding member, and spacer for manufacturing the anisotropically conductive sheet which concerns on this invention. It is sectional drawing for description which shows the state by which the 1st surface side molded member was piled up on the molding material apply | coated to the molding surface of the other surface side molded member. It is sectional drawing for description which shows the state by which the required thickness molding material layer was formed between the one surface side molded member and the other surface side molded member. It is sectional drawing for description which shows the distribution state of the electroconductive particle in a molding material layer. It is sectional drawing for description which shows the apparatus for manufacturing the anisotropically conductive sheet shown in FIG. It is explanatory sectional drawing which shows the state in which the magnetic field was made to act in the thickness direction of a molding material layer, and the chain | strand was formed. It is explanatory drawing which shows the structure of an example of the inspection apparatus of the circuit board which concerns on this invention. It is explanatory drawing which expands and shows the principal part of the inspection apparatus of the circuit board shown in FIG. It is explanatory drawing which expands and shows the principal part of the upper side electrode plate apparatus in the inspection apparatus of the circuit board shown in FIG. It is explanatory drawing which expands and shows the principal part of the lower side electrode plate apparatus in the inspection apparatus of the circuit board shown in FIG. It is explanatory drawing which shows the positional relationship of the base end side support plate in a lower side electrode plate apparatus, and the alignment movable plate in a circuit board holding | maintenance mechanism, (a) is a top view, (b) is side sectional drawing. In the circuit board inspection apparatus shown in FIG. 9, the explanatory view showing the positional relationship between the upper support point and the lower support point on the projection plane seen through the upper inspection jig and the lower inspection jig in the thickness direction It is. It is explanatory drawing which shows typically the measurement state in the inspection apparatus of the circuit board shown in FIG. It is explanatory drawing which shows the structure of the other example of the inspection apparatus of the circuit board which concerns on this invention. It is explanatory drawing which expands and shows the principal part of the inspection apparatus of the circuit board shown in FIG. It is explanatory drawing which expands and shows the upper side adapter in the inspection apparatus of the circuit board shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board to be inspected 2 Upper surface inspected electrode 3 Lower surface inspected electrode 10 Anisotropic conductive sheet 10A Molding material layer 10B Molding material 11 Base material 12 Reinforcement material 14 One side molding member 15 Other side molding member 16 Spacer 16K Opening Reference Signs List 17 pressure roll 18 support roll 19 pressure roll device 20 upper side inspection jig 21 anisotropic conductive sheet 25 upper side electrode plate device 26 inspection electrode pin 26A trunk portion 26B electrode portion 26C collar portion 27 electrode pin support member 28 Base end side support plate 28H Through hole 29 Tip side support plate 29H Through hole 30 Upper side adapter 31, 31A Connection circuit board 32 Connection electrode 32A Current supply electrode 32B Voltage measurement electrode 32C Connection electrode pair 33, 33A Terminal electrodes 34, 34A Internal wiring 35 Upper jig support mechanism 36 Upper jig support plate 37 Upper jig support 37A Base end portion 37B Tip end portion 37S Upper side support point 40 Lower side inspection jig 41 Anisotropic conductive sheet 45 Lower side electrode plate device 46 Inspection electrode pin 46A Body portion 46B Electrode portion 46C Gutter portion 47 Electrode pin support member 48 Base end side support plate 48A Protruding part 48H Through hole 48K, 49K Positioning pin through hole 49 Tip side support plate 49H Through hole 50 Lower side adapter 51, 51A Connection circuit board 52 Connection electrode 52A Current supply electrode 52B Voltage Measuring electrode 52C Connecting electrode pair 53, 53A Terminal electrode 54, 54A Internal wiring 55 Lower side jig support mechanism 56 Lower side jig support plate 57 Lower side jig support column 57A Base end portion 57B Tip portion 57S Lower side Supporting point 60 Circuit board holding mechanism 61 Positioning pin 62 Alignment movable plate 62H Movable hole 63 Movable plate column D Step G Large diameter area M Electromagnet P Conductive particle S Small diameter area T Inspection execution area W Electric wire

Claims (9)

In an anisotropic conductive sheet comprising a base material made of an insulating elastic polymer substance, a plurality of conductive particles exhibiting magnetism are aligned in the thickness direction to form a chain,
An anisotropic conductive sheet comprising an insulating reinforcing material made of mesh in the base material.   The anisotropic conductive sheet according to claim 1, wherein the mesh constituting the reinforcing material is formed of an organic fiber.   The anisotropic conductive sheet according to claim 1 or 2, wherein a chain of conductive particles is formed in a state of being dispersed in a plane direction.   The anisotropic conductive sheet according to any one of claims 1 to 3, wherein the thickness is 20 to 500 µm.   The anisotropic conductive sheet according to any one of claims 1 to 4, wherein the ratio of the thickness of the reinforcing material to the thickness of the anisotropic conductive sheet is 0.1 to 1.   The anisotropic conductive sheet according to any one of claims 1 to 5, wherein an average opening diameter of a mesh constituting the reinforcing material is 10 to 800 µm.   The anisotropic as claimed in claim 6, wherein the ratio r / R is 0.01 to 0.9, where r is the number average particle diameter of the conductive particles and R is the average opening diameter of the mesh. Conductive sheet. Prepare a flowable molding material containing conductive particles exhibiting magnetism in a polymer material that is cured to become an elastic polymer material,
Forming a molding material layer containing a reinforcing material made of mesh immersed in the molding material;
A method for producing an anisotropic conductive sheet, comprising: a step of curing the molding material layer while applying or applying a magnetic field to the molding material layer in the thickness direction. A circuit board inspection apparatus comprising the anisotropic conductive sheet according to any one of claims 1 to 7.

Images