JP2005181291A - Pressure sensor and pressure sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor having superior reliability by protecting a sensor and an oscillator from the external environment, and being capable of reducing a size thereof, and a pressure sensor module. <P>SOLUTION: A sensor substrate 10 for detecting a pressure by the deformation of the sensor 11 is mounted on a support substrate 20 via a sealant 40 surrounding the sensor 11; and an electronic component element 30, constituting an oscillator 60 that oscillates an electrical signal of a predetermined frequency, based on the pressure information form the sensor 11 in a sealing region 41 surrounded by the sensor substrate 10, the support substrate 20, and the sealant 40, is arranged. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a pressure sensor that detects a change in pressure and oscillates a predetermined electric signal, and a pressure sensor module using the pressure sensor.

  2. Description of the Related Art Conventionally, pressure sensors that detect fluctuations in pressure applied to a sensor unit as changes in oscillation frequency are known as pressure sensors that detect fluctuations in pressure of gas or liquid.

  As such a conventional pressure sensor 100, for example, as shown in FIG. 10, a surface acoustic wave element 103 formed on a thin portion 102 of a sensor substrate 101 is known (see, for example, Patent Document 1).

In such a pressure sensor 100, the surface acoustic wave element 103 constituting the sensor unit is formed in the thin part 102 of the sensor substrate 101. When the pressure is received, the thin part 102 is distorted, and the elastic constant of the part is generated. The propagation speed of the surface acoustic wave changes due to the change of, and the distance between the electrodes 104 of the surface acoustic wave element 103 changes. The resonance frequency of the surface acoustic wave element 103 is changed by each action, and thereby the oscillation frequency of the oscillation circuit composed of the surface acoustic wave element 103 and an amplifier circuit connected to the surface acoustic wave element 103 is changed. . The pressure is detected by monitoring the oscillation frequency thus obtained.
Japanese Patent Publication No. 5-82537

  However, in the conventional pressure sensor 100 described above, the surface acoustic wave element 103 formed on the sensor substrate 101 is exposed on the surface of the sensor substrate 101, and there is nothing to protect it. Therefore, the electrode 104 of the surface acoustic wave element 103 is exposed to the outside air, particularly a gas containing moisture, etc., which induces corrosion, alteration, etc. of the electrode 104, and its electrical characteristics change significantly. There was an inconvenience of doing.

  Further, in the conventional pressure sensor described above, there is a possibility that foreign matter or the like may adhere to the electrode 104 of the surface acoustic wave element 103 exposed to the outside air. In this case, normal resonance characteristics cannot be obtained, and as a pressure sensor, It also induces a defect that makes it impossible to function normally.

  Furthermore, in the above-described conventional pressure sensor, the amplifier circuit connected to the surface acoustic wave element 103 is arranged in a form separated from the sensor substrate 101. Therefore, the overall structure of the pressure sensor 100 can be reduced in size. In addition to the difficulty, the wiring connecting the surface acoustic wave element 103 and the amplifier circuit is easily affected by electromagnetic noise, and as a result, it has a drawback of causing malfunctions and a decrease in measurement accuracy.

  The present invention has been devised in view of the above-described drawbacks, and the object thereof is to protect the oscillation unit composed of the sensor unit and the sensor unit and the amplifier circuit from the external environment, thereby being excellent in reliability and small in size. An object of the present invention is to provide a pressure sensor and a pressure sensor module that can be used in the process.

  The pressure sensor of the present invention has a sensor portion on the lower surface, and a sensor substrate that detects pressure fluctuations by deformation of the sensor portion is placed on a support substrate via a sealing material that surrounds the sensor portion. An electronic component having a part of an oscillation circuit that oscillates an electrical signal of a predetermined frequency based on pressure information from the sensor unit in a sealing region surrounded by the sensor substrate, the support substrate, and the sealing material An element is arranged.

  In the pressure sensor of the present invention, the electronic component element is mounted on the upper surface of the support substrate.

  Furthermore, the pressure sensor of the present invention is provided with an electrode pad electrically connected to the sensor portion on the lower surface of the sensor substrate and inside the sealing material, and on the upper surface of the support substrate, the sealing material. A connection pad that is electrically connected to the electrode pad via a conductive bonding material is provided on the inner side of the electrode pad.

  Furthermore, the pressure sensor of the present invention is characterized in that the sensor section is formed of a surface acoustic wave element including a piezoelectric body and an interdigital transducer.

  Furthermore, the pressure sensor of the present invention is characterized in that the sensor substrate is made of a piezoelectric material, and the piezoelectric body is formed by a part of the sensor substrate.

  Furthermore, the pressure sensor of the present invention is characterized in that the sealing material is made of a conductive material, and the sealing material is electrically connected to a ground terminal on the lower surface of the support substrate.

  The pressure sensor module of the present invention is characterized in that an antenna element electrically connected to the electronic component element is mounted on the support substrate upper surface and / or the sensor substrate lower surface of the pressure sensor described above. .

  The pressure sensor module of the present invention is characterized in that the antenna element is mounted outside a sealing region by the sealing material.

  Furthermore, the pressure sensor module of the present invention is characterized in that a pattern antenna electrically connected to the electronic component element is attached to the upper surface and / or the lower surface of the sensor substrate of the pressure sensor described above. It is.

  Furthermore, the pressure sensor module of the present invention is characterized in that the pattern antenna is mounted outside a sealing region by the sealing material.

  According to the pressure sensor of the present invention, the sensor substrate is placed on the support substrate via the sealing material that surrounds the sensor unit, and within the sealing region surrounded by the sensor substrate, the support substrate, and the sealing material. The electronic component element having a part of the oscillation circuit is arranged. As a result, the sensor unit is hermetically sealed, and the sensor unit is shut off from the outside air containing moisture, so that it is possible to effectively prevent a change in electrical characteristics due to corrosion or alteration of the electrode.

  Further, according to the pressure sensor of the present invention, as described above, the sensor part is well shielded from the outside air, and foreign matter or the like hardly adheres to the electrode of the sensor part, so that the desired resonance characteristics can always be obtained. Thus, the pressure sensor can function normally over a long period of time.

  Therefore, the reliability of the pressure sensor can be dramatically improved.

  Furthermore, according to the pressure sensor of the present invention, the electronic component element having a part of the oscillation circuit is also arranged in the above-described sealing region. It is protected from the external environment and the electrical characteristics are maintained well. In this case, the sensor part and the electronic component element are arranged close to each other to shorten the wiring part that connects them. Therefore, the influence of electromagnetic noise can be eliminated as much as possible, and the occurrence of malfunctions such as malfunctions and reduction in measurement accuracy can be effectively prevented. At the same time, the electronic component element having a part of the oscillation circuit is also arranged in the above-described sealing region, so that it is not necessary to separately secure a space for mounting the electronic component element outside the sealing region. The overall structure of the pressure sensor can be reduced in size.

  Furthermore, according to the pressure sensor of the present invention, if the electronic component element is mounted on the upper surface of the support substrate, the mounting surface is hardly deformed by pressure fluctuation from the outside, and is mounted in an extremely stable state. I can leave.

  Furthermore, according to the pressure sensor of the present invention, an electrode pad electrically connected to the sensor portion is provided on the inner surface of the sealing material on the lower surface of the sensor substrate, and the inner surface of the sealing material on the upper surface of the support substrate. By providing a connection pad to be connected to the electrode pad, the connection between the sensor unit and the electronic component element can be better protected from the external environment, and the sensor unit and the electronic component element can be securely connected. It is possible to keep.

  Furthermore, according to the pressure sensor of the present invention, the sealing material is formed of a conductive material, and the sealing material is electrically connected to the ground terminal on the lower surface of the support substrate, whereby the sealing material is shielded. As a result, the sensor part and the electronic component element inside the sealing region are hardly affected by external noise and can be operated stably.

  According to the pressure sensor module of the present invention, the antenna element that is electrically connected to the electronic component element is mounted on the support substrate upper surface and / or the sensor substrate lower surface of the pressure sensor described above. An oscillation signal output from an oscillation circuit composed of an element and a sensor unit can be wirelessly transmitted to another device having a reception circuit, and pressure information can be obtained even at a location away from the pressure sensor.

  Further, according to the pressure sensor module of the present invention, the pressure sensor module can be obtained by attaching the pattern antenna electrically connected to the electronic component element on the upper surface and / or lower surface of the sensor substrate of the pressure sensor described above. The thickness of the pressure sensor module can be reduced, the number of parts can be reduced, and the pressure sensor module can be reduced in size and cost.

  Further, according to the pressure sensor module of the present invention, the antenna element and the pattern antenna are mounted or attached outside the sealing region by the sealing material, thereby being configured by the electronic component element and the sensor unit. There is also an advantage that the electric signal output from the oscillation circuit can be transmitted wirelessly with almost no attenuation.

  Hereinafter, the pressure sensor of the present invention will be described in detail with reference to the drawings. In the embodiment described below, a pressure sensor having a sensor unit using a surface acoustic wave element will be described as an example.

  1 is a cross-sectional view of a pressure sensor according to an embodiment of the present invention, FIG. 2 is a plan view showing a lower surface of a sensor substrate used in the pressure sensor of FIG. 1, and FIG. 3 is a support substrate used in the pressure sensor of FIG. FIG. 4 is a circuit diagram showing the electrical configuration of the pressure sensor of FIG.

  The pressure sensor 1 shown in the figure is generally composed of a sensor substrate 10, a support substrate 20, an electronic component element 30, a sealing material 40, and a conductive bonding material 50.

  In the sensor substrate 10, the sensor unit 11 is deformed according to the pressure applied to the sensor substrate 10 to detect pressure fluctuation. On the lower surface of the sensor substrate 10, a sensor unit 11, an electrode pad 12, an extraction electrode 13 that connects both of them are formed. A sensor substrate sealing portion 14 is provided around the sensor portion 11, the electrode pad 12, and the extraction electrode 13 so as to surround them, and a sealing material 40 is provided on the sensor substrate sealing portion 14. Be joined. Therefore, the inside of the sensor substrate sealing portion 14 becomes the sealing region 41.

  The sensor substrate 10 is preferably made of a material that can be formed integrally with the sensor unit 11 and that can be deformed relatively easily when subjected to external pressure (pressure from above in FIG. 1). For example, piezoelectric materials such as quartz, lithium niobate, and lithium tantalate are preferably used. The sensor unit 11 includes a surface acoustic wave element 17 on both sides of the piezoelectric body 15, an interdigital transducer (hereinafter abbreviated as IDT electrode) 16 and the surface acoustic wave propagation direction of the IDT electrode 16. A surface acoustic wave resonator including a pair of formed reflector electrodes 18 is formed. Further, the electrode pad 12 is connected to the IDT electrode 16 through the extraction electrode 13.

  As the material of the piezoelectric body 15, for example, the same material as the sensor substrate 10, that is, a piezoelectric material such as quartz, lithium niobate, lithium tantalate, or the like is used. The IDT electrode 16 is formed by forming a metal material such as aluminum or gold using a conventionally known thin film forming technique such as sputtering or vapor deposition, a photolithography technique, or the like, and forming a pattern with a thickness of about 2000 mm.

  Similarly to the IDT electrode 16 described above, the electrode pad 12 and the extraction electrode 13 can be obtained by patterning a metal material such as aluminum or gold by a thin film forming technique or a photolithography technique. The electrode pad 12 is preferably formed to have a large film thickness in order to improve the adhesion strength to the base, and the conductive bonding material 50 can be formed by plating the surface of the electrode pad 12 with Cr, Ni, Au or the like. It is possible to make the bonding property to the good.

  On the other hand, as the characteristics required for the support substrate 20, it is important that the support substrate 20 is hardly deformed by an external pressure and has sufficient strength. A multilayer circuit board using a ceramic material such as a material is used.

  On the upper surface of the support substrate 20, an electronic component element 30 is mounted, and a connection pad 21 connected to the electrode pad 12 through a conductive bonding agent 50 is provided. A part of the connection pad 21 is also electrically connected to the electronic component element 30 by the internal wiring pattern 24 formed on the surface or inside of the support substrate 20, and thus the surface acoustic wave element 17 and the electronic component are thus connected. The element 30 is electrically connected.

  A support substrate sealing portion 22 is provided around the electronic component element 30 and the connection pad 21 so as to face the sensor substrate sealing portion 14 described above. The sealing material 40 is joined to the material 22. Therefore, the inside of the support substrate sealing part 22 becomes the sealing region 41.

  Further, a plurality of external terminal electrodes 23 are formed on the lower surface of the support substrate 20, and these external terminal electrodes 23 are formed on the upper surface of the support substrate via the internal wiring patterns 24, via-hole conductors 25, etc. of the support substrate 20. It is electrically connected to the electronic component element 30, the connection pad 21, and the like.

  Such a support substrate 20 is printed and coated with, for example, a conventionally known green sheet laminating method, specifically, a conductive paste that becomes connection pads 21, external terminal electrodes 23, internal wiring patterns 24, and via-hole conductors 25. It is manufactured by laminating and pressing a plurality of green sheets and firing them together. In addition, the surface of the connection pad 21 and the external terminal electrode 23 is plated with Cr, Ni, Sn, Au or the like as necessary, and when the conductive bonding material 50 or the pressure sensor 1 is mounted on a circuit board or the like. Make good bondability with bonding materials such as solder.

  The electronic component element 30 is, for example, an active component such as an IC or a transistor, a passive component such as a resistor or a capacitor, or a combination thereof, and an amplifier circuit is configured as a whole. The oscillation circuit 60 is configured by being electrically connected to the surface acoustic wave element 17. FIG. 4 is a circuit diagram showing an example of the oscillation circuit 60. In this oscillation circuit, transistors, resistors, coils, capacitors, surface acoustic wave elements 17 and the like are appropriately selected and arranged according to conditions such as the oscillation frequency. The By applying a predetermined power supply voltage from Vcc to such an oscillation circuit, a predetermined oscillation frequency is output from fosc.

  The sealing material 40 interposed between the sensor substrate 10 and the support substrate 20 described above is made of, for example, a resin or a metal material so as to surround the surface acoustic wave element 17 and the electrical component element 30. By joining the sensor substrate sealing portion 14 of the sensor substrate 10 and the support substrate sealing portion 22 of the support substrate 20, the inner side, specifically, the sensor substrate 10, the support substrate 20, and the sealing material 40 The sensor unit 11 and the electronic component element 30 are hermetically sealed in the enclosed sealing region 41. The inside of the sealing region 41 is filled with an inert gas such as nitrogen gas or argon gas, thereby oxidizing the IDT electrode 16 and the electronic component element 30 disposed in the sealing region 41. Corrosion and the like are effectively prevented.

  In the case where a conductive material such as solder is used as the sealing material 40, an annular sealing electrode (see FIG. 5) is formed on the sensor substrate sealing portion 14 and the support substrate sealing portion 22 to which the sealing material 40 is bonded. Not shown). The material and manufacturing method of the sealing electrode formed on the sensor substrate sealing portion 14 are the same as those of the electrode pad 12, and the material and manufacturing method of the sealing electrode formed on the support substrate sealing portion 22 are the same as those of the connection pad 21. Is done. Further, the sealing electrode formed on the support substrate sealing portion 22 is electrically connected to the ground terminal on the lower surface of the support substrate (the external terminal electrode 23 connected to the ground potential terminal of the circuit board on which the pressure sensor 1 is mounted). If the pressure sensor 1 is used, since the sealing material 40 is held at the ground potential when the pressure sensor 1 is used, a shielding effect by the sealing material 40 can be expected, and unnecessary noise from the outside is sealed. It can reduce favorably with the stopper 40. Similarly, when a conductive resin is used as the sealing material 40, a shielding effect can be expected by maintaining the ground potential.

  The conductive bonding material 50 is made of, for example, solder, conductive paste, or the like, and connects the electrode pads 12 of the sensor substrate 10 and the connection pads 21 of the support substrate 20, so that the IDT electrodes of the surface acoustic wave element 17 are connected. 16 and the electronic component element 30 are electrically connected.

  In the pressure sensor 1 of the present embodiment as described above, the sensor unit 11, that is, the surface acoustic wave element 17 is deformed by an external pressure applied to the sensor substrate 10. As a result, the elastic constant of the piezoelectric body in the portion where the distortion occurs changes, the propagation speed of the surface acoustic wave changes, and the electrode finger interval d shown in FIG. 5 changes in the IDT electrode 16 of the surface acoustic wave element 17. Thus, the resonance frequency of the surface acoustic wave element 17 is changed by each action. As a result, the oscillation frequency fosc of the oscillation circuit 60 composed of the surface acoustic wave element 17 and the electronic component element 30 constituting the amplifier circuit also changes, so that the pressure fluctuation applied to the sensor substrate 10 is finally oscillated by the oscillation circuit 60. It is detected as a change in the frequency fosc. Here, in the pressure sensor 1 of the present embodiment, as described above, the sensor unit 11 and the electronic component element 30 are arranged in the sealing region 41 surrounded by the sensor substrate 10, the support substrate 20, and the sealing material 40. Therefore, it is hardly affected by the external environment, and the reliability can be improved.

  Further, in this case, since it is not necessary to separately secure a space for mounting the electronic component element 30 outside the sealing region 41, the entire structure of the pressure sensor 1 can be reduced in size, and high-density mounting and cost can be achieved. Can also be used for down.

  Next, a pressure sensor module using the pressure sensor 1 described above will be described with reference to FIGS. 6 and 7A and 7B.

  FIG. 6 is a cross-sectional view taken along the center line of the pressure sensor module according to one embodiment of the present invention, and FIGS. 7A and 7B are circuit diagrams showing the electrical configuration of the pressure sensor module shown in FIG.

  The pressure sensor module 80 shown in the figure has an antenna element 81 mounted on the support substrate 20 of the pressure sensor 1 described above. The antenna element 81 wirelessly transmits an electrical signal having a predetermined frequency output from the oscillation circuit 60 including the surface wave element 17 and the electronic component element 30 constituting the amplifier circuit to another device having a receiving circuit. Is possible. As the antenna element 81, for example, a surface mount type chip antenna using a dielectric ceramic or the like is used. The antenna element 81 is mounted on the support substrate 20 by soldering or the like and is electrically connected to the electronic component element 30. The

  In this case, as shown in FIG. 6, the antenna element 81 is preferably arranged outside the sealing region 41 by the sealing material 40, whereby the surface wave element 17 and the electrons constituting the amplifier circuit are arranged. An electric signal having a predetermined frequency output from the oscillation circuit 60 including the component element 30 can be wirelessly transmitted with almost no attenuation.

  The electrical configuration of the pressure sensor module 80 is obtained by adding an antenna 62 (antenna element 81) to the output end 61 of the oscillation circuit 60 of the pressure sensor 1, as shown in FIG. The antenna 62 may be connected directly to the output terminal 61 of the first oscillation circuit 60, or the output terminal 61 of the oscillation circuit 60 of the pressure sensor 1 and the antenna as shown in FIG. An amplifier 63 may be disposed between the first and second amplifiers 62.

  Thus, according to the pressure sensor module 80 of the present embodiment as described above, the surface acoustic wave element 17 constituting the sensor unit 11 and the electronic component element 30 constituting the oscillation circuit 60 together with the surface acoustic wave element 17 are protected from the external environment. Thus, the reliability can be improved and the entire structure can be downsized.

  Next, a pressure sensor according to another embodiment of the present invention will be described with reference to FIG. In the present embodiment, only differences from the above-described embodiment will be described, and the same components will be denoted by the same reference numerals, and redundant description will be omitted.

  FIG. 8 is a plan view showing the lower surface of the sensor substrate 10 used in the pressure sensor of this embodiment.

  The pressure sensor of the present embodiment is different from the pressure sensor described above in that the surface acoustic wave element 90 constituting the sensor unit 11 is different from the pair of IDT electrodes 16 arranged on the lower surface of the sensor substrate 10 with a gap. The surface acoustic wave delay line is composed of the surface acoustic wave propagation path 91 between them. The surface acoustic wave is attenuated on both sides of the surface acoustic wave element 90 constituting the sensor unit 11 on the lower surface of the sensor substrate 10, specifically, on both sides in the propagation direction of the surface acoustic wave. In order to prevent the surface acoustic wave from being reflected at the end portion of the, a damping material 92 made of silicon resin or the like is formed.

  When such a surface acoustic wave delay line is connected to an amplifier circuit, an oscillation circuit that oscillates at a frequency corresponding to the delay time of an electric signal generated by the surface acoustic wave delay line can be configured. Then, when external pressure is applied to the sensor substrate 10 from above and stress is applied to the surface acoustic wave propagation path 91 of the surface acoustic wave element 90 constituting the sensor unit 11, the propagation path 91 is distorted and The propagation speed of the surface acoustic wave changes due to the change in the elastic constant of the portion, and the length of the propagation path 91 of the surface acoustic wave changes. The delay time of the electric signal is changed by each action, and thereby the oscillation frequency of the oscillation circuit composed of the surface acoustic wave element 90 and the amplifier circuit connected thereto is changed. Therefore, the surface acoustic wave element 90 constituting the sensor unit 11 in the present embodiment also functions as a pressure detection element in the same manner as the surface acoustic wave element 17 constituting the sensor unit 11 in the above-described embodiment.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible in the range which does not deviate from the summary of this invention.

  For example, a cavity having a concave cross section is formed on the upper surface of the support substrate 20 in accordance with the size of the electronic component element 30, and a part or the whole of the electronic component element 30 is embedded in the cavity. 30 may be mounted.

  Further, as shown in FIG. 9, instead of the antenna element 81, a pattern antenna 82 constituted by, for example, a meandering conductor pattern may be formed. In this case, the number of parts can be reduced and the external dimensions can be reduced. Even when such a pattern antenna 82 is used, the pattern antenna 82 is preferably disposed outside the sealing region 41 by the sealing material 40 in order to prevent attenuation of radio transmission.

  Further, in the embodiment of FIGS. 6 and 9, the antenna element 81 and the pattern antenna 82 are arranged on the support substrate 20 side, but it goes without saying that these antennas may be arranged on the sensor substrate 10 side. .

It is sectional drawing of the pressure sensor concerning one Embodiment of this invention. It is a top view of the sensor board | substrate used for the pressure sensor of FIG. It is a top view of the support substrate used for the pressure sensor of FIG. It is a circuit diagram which shows the electrical structure of the pressure sensor of FIG. It is an enlarged view of the IDT electrode formed in the sensor board | substrate of the pressure sensor of FIG. It is sectional drawing of the pressure sensor module concerning one Embodiment of this invention. FIG. 7 is a circuit diagram of the pressure sensor module of FIG. 6, (a) is a diagram showing a circuit configured without arranging an amplifier between the antenna and the oscillation circuit, and (b) is an arrangement of the amplifier between the antenna and the oscillation circuit. It is a figure which shows the comprised circuit. It is a top view of a sensor board used for a pressure sensor concerning other embodiments of the present invention. It is an external appearance perspective view of the pressure sensor module concerning other embodiment of this invention. It is explanatory drawing which shows the conventional pressure sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Pressure sensor 10 ... Sensor substrate 11 ... Sensor part 12 ... Electrode pad 13 ... Extraction electrode 14 ... Sensor substrate sealing part 15 ... Piezoelectric body 16 ... IDT Electrode 17 ... Surface acoustic wave element 18 ... Reflector electrode 20 ... Support substrate 21 ... Connection pad 22 ... Support substrate sealing part 23 ... External terminal electrode 24 ... Internal wiring Pattern 25 ... Via-hole conductor 30 ... Electronic component element 40 ... Sealing material 41 ... Sealing region 50 ... Conductive bonding material 60 ... Oscillation circuit 80 ... Pressure sensor module 81 ... Antenna element 82 ... Pattern antenna 90 ... Surface acoustic wave element 91 ... Surface of propagation of surface acoustic wave 92 ... Damping material

Claims (10)

A sensor substrate having a sensor portion on the lower surface and detecting pressure fluctuations by deformation of the sensor portion is placed on a support substrate via a sealing material surrounding the sensor portion, and the sensor substrate, the support A pressure formed by disposing an electronic component element having a part of an oscillation circuit that oscillates an electric signal of a predetermined frequency based on pressure information from the sensor unit in a sealing region surrounded by a substrate and the sealing material. Sensor. The pressure sensor according to claim 1, wherein the electronic component element is mounted on an upper surface of the support substrate. On the lower surface of the sensor substrate, an electrode pad electrically connected to the sensor portion is provided inside the sealing material,
The connection pad that is electrically connected to the electrode pad via a conductive bonding material is provided inside the sealing material on the upper surface of the support substrate. 2. The pressure sensor according to 2. The pressure sensor according to any one of claims 1 to 3, wherein the sensor unit includes a surface acoustic wave element including a piezoelectric body and an interdigital transducer. The pressure sensor according to claim 4, wherein the sensor substrate is made of a piezoelectric material, and the piezoelectric body is formed by a part of the sensor substrate. 6. The pressure sensor according to claim 1, wherein the sealing material is made of a conductive material, and the sealing material is electrically connected to a ground terminal on a lower surface of the support substrate. . The pressure sensor according to any one of claims 1 to 6, wherein an antenna element that is electrically connected to the electronic component element is mounted on an upper surface and / or a lower surface of the support substrate of the pressure sensor. Sensor module. The pressure sensor module according to claim 7, wherein the antenna element is mounted outside a sealing region by the sealing material. A pattern antenna that is electrically connected to the electronic component element is attached to the upper surface and / or the lower surface of the sensor substrate of the pressure sensor according to any one of claims 1 to 6. Pressure sensor module. The pressure sensor module according to claim 9, wherein the pattern antenna is mounted outside a sealing region of the sealing material.

Images