JP2005181005A - Display board manufacturing method, display board, and timing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method capable of producing a high-quality display panel having a high design property in a method for manufacturing a display panel having a resin film on a base material without reducing the manufacturing efficiency.
A method of manufacturing a display panel 100 according to the present invention includes a masking step (a) for forming a mask 110 having an opening 110a that constitutes an exposed region in a part of a plate-like base material 101, and masking. A resin film disposing step (b) for disposing the resin film 102 in the exposed region of the base material; and resin film forming steps (c) and (d) for forming the surface of the resin film. To do.
[Selection] Figure 1

Description

  The present invention relates to a method of manufacturing a display board, a display board, and a timing device, and more particularly to a manufacturing technique suitable for manufacturing a display board having a light-transmitting resin film on a substrate.

In general, in a timing device such as a wristwatch, since the appearance design is an important point of a product, various design attempts have been made. In particular, the design of the dial that always receives a line of sight among the external appearance designs of the timing device is extremely important, and various ideas have been made on the appearance of the dial. For example, in a dial, various decorations are applied to the surface of a base material such as metal or plastic by plating, printing, engraving, typesetting, etc. In order to make these decorations three-dimensional and deep A transparent resin film (clear coating film) is formed on a substrate (see, for example, Patent Document 1 below). Specifically, a liquid resin is applied on a substrate by a spray method or the like, cured by a drying process or a heat process, and then the surface of the resin film is smoothed by polishing or the like.
JP 2001-13267 A

  By the way, generally, a sub display area called a sub dial may be provided inside the dial. This sub display area is used as a part for displaying timer time, day of the week, date, temperature, and the like. In such a case, there is a problem that sufficient design is not obtained simply by forming a uniform resin film on the surface of the dial, and the design of the dial cannot be enhanced. For example, depending on the dial, it may not be possible to obtain a sufficient appearance by simply polishing the surface of the resin film, so if there are various variations in the surface shape of the resin film, the design can be further improved. Although it is considered possible, this is not possible with the conventional method.

  In general, the resin film has a sufficient film thickness of 50 to 200 μm or more to enhance the visual effect of the resin film and give the surface of the dial a glossy and deep feel. In addition, it is necessary to make the surface of the resin film sufficiently smooth. However, in order to form a thick resin film, it is necessary to use a paint having a high viscosity or to perform repeated coating over and over, resulting in a decrease in production efficiency. In addition, unevenness and undulation are easily generated on the surface of the resin film due to the surface tension of the resin material and uneven coating, etc. In order to smooth this by polishing, the polishing margin is set to about half of the resin applied There is a problem that a very long polishing time is required.

  Therefore, the present invention solves the above-mentioned problems, and the subject is a method for producing a display panel having a resin film on a substrate, and a method that does not reduce the production efficiency and has a high design property. Another object of the present invention is to provide a method capable of producing a high-quality display panel.

  The display plate manufacturing method of the present invention includes a masking step of forming a mask having an opening that constitutes an exposed region in a part of a plate-like substrate, and a resin film on the exposed region of the masked substrate. And a resin film forming step for forming the surface of the resin film.

  According to this invention, by arranging the resin film in the exposed region of the base material subjected to masking, it becomes possible to form the resin film only in a partial region on the base material, and the resin already formed Because it is possible to form another resin film on a part of the surface of the film, the design of the flat pattern is added to the gloss and depth of the resin film, so variations in the appearance design of the display panel The design can be improved and a high-quality appearance design can be realized.

  In the present invention, it is preferable to repeat at least the masking step and the resin film arranging step a plurality of times for the plurality of exposed regions. According to this, since resin films can be formed in a plurality of exposed regions, it is possible to further increase the variation in the appearance design of the display panel and improve the design. In addition, since the masking step and the resin film placement step are repeated a plurality of times for a plurality of exposed regions, it is possible to easily form a resin film for each exposed region regardless of the positional relationship between the exposed regions. Can do.

  In the present invention, it is preferable that a plurality of the exposed regions are provided in the masking step, and the resin films are respectively disposed in the plurality of exposed regions in the resin film arranging step. According to this, since a plurality of exposed regions are set at a time and the resin film is arranged on each, it is possible to efficiently manufacture.

  In the present invention, the resin film arranging step preferably includes a step of expanding the liquid resin arranged on the base material by a centrifugal force generated by rotation about a rotation axis set in the exposed region. . The resin film can be arranged in various ways such as spraying, roll coating, printing, dispensing by a dispenser, coating by ejecting droplets from a nozzle, and vapor deposition such as CVD (chemical vapor deposition). It can be realized by the method. In particular, a resin film having a certain thickness can be efficiently formed by using the spin coating method as described above. Further, when arranging the resin film for each of the plurality of exposed regions, after spreading the liquid resin by centrifugal force in the above step for one exposed region, the liquid resin is cured to form a resin film, and then Other exposed regions can also be formed by a method in which the liquid resin is expanded by centrifugal force in the above-described step, and the liquid resin is further cured to form another resin film.

  In this invention, it is preferable that the said resin film formation process includes the cutting process step which cuts the surface of the said resin film. By providing a cutting step for cutting the surface of the resin film arranged on the substrate, the surface of the resin film can be flattened or the surface of the resin film can be processed into an appropriate shape. Variations in the appearance design of the display board can be increased. Moreover, by shaping the surface shape of the resin film in advance by cutting, the polishing time of the subsequent polishing step can be reduced and the surface accuracy of the surface of the resin film can be increased. .

  In the present invention, in the cutting step, cutting is performed by applying a cutting tool in a state in which the base material is rotated around its normal line, and scanning the cutting tool in the rotational radius direction of the base material. Is preferred. Any cutting method may be used as long as it cuts the surface of the resin film using a cutting tool, but the cutting tool is operated with the substrate rotated as described above. It is preferable to use the lathe turning performed. As a result, the cutting efficiency can be increased, and the entire resin film can be efficiently cut in a short time. In particular, it is desirable to scan the cutting tool from the center of rotation toward the outer periphery. If it does in this way, since it can comprise easily so that the chip generated from a resin film may be discharged to the perimeter side in an unprocessed state, it can prevent that a cutting finish is damaged by a chip. Therefore, a higher quality cutting surface can be obtained.

  In the present invention, the cutting edge of the cutting tool preferably has a round corner shape. Since the cutting edge is a corner (a corner between the cutting edge and the cutting edge (intersection point)), a fine shape can be easily formed. Further, since the shape is a round corner, the surface roughness after cutting can be reduced.

  In this case, it is preferable that the corner radius (nose radius) of the cutting edge is in the range of 5 to 50 μm. A corner radius within this range can ensure a balance between cutting efficiency, surface accuracy, and surface roughness. For example, below the above range, sufficient smoothness cannot be obtained when the feed rate along the surface of the resin film is increased. In other words, in order to obtain a certain level of smoothness, it is necessary to reduce the feed rate and a long processing time is required. On the other hand, if the above range is exceeded, unless the depth of cut (depth) is reduced, the deformation due to the processing pressure of the resin film increases, and the surface accuracy decreases. In particular, by setting the corner radius (nose radius) within the range of 10 to 20 μm, it is possible to secure a balance between the machining efficiency, the accuracy of the cutting shape, and the surface roughness after the cutting. The polishing allowance for obtaining smoothness can be reduced by the polishing step.

  In the present invention, it is desirable that the resin film forming step includes a polishing step for polishing the surface of the resin film after the cutting step. By providing this polishing step, the surface of the resin film can be given sufficient gloss, and when the resin film is formed of a light-transmitting material, sufficient transparency can be obtained. .

  In this invention, it is preferable that the said resin film has the light transmittance which can permeate | transmit visible light. The optical properties of the resin film of the present invention are not limited in any way, but in particular, by having a light transmission property capable of transmitting visible light, it is possible to give the appearance of the display board a three-dimensional effect and a sense of depth, It is possible to show a sense of quality.

  In this invention, it is preferable that the thickness of the said resin film exists in the range of 50-200 micrometers. When a relatively thick resin film is formed in this way, the display panel can have a three-dimensional feeling and a depth feeling. Among the above ranges, it is particularly desirable to be within the range of 100 to 200 μm.

  In the present invention, the polishing allowance in the polishing step is preferably in the range of 0.5 to 5.0 μm. If the polishing allowance is less than this range, it will be difficult to sufficiently reduce the surface roughness of the resin film. If the polishing allowance is more than the above range, surface waviness due to polishing is likely to occur, and the surface of the resin film Accuracy deteriorates.

  In the present invention, the display plate is preferably a timepiece dial. When configuring the dial, a pattern by typesetting or printing may be formed on the resin film, or a pattern by typesetting or printing may be formed under the resin film. Timekeeping devices (watches, table clocks, wall clocks, stopwatches, diving computers, etc.) equipped with display panels as described above will have a high-quality exterior design, and the variations in the surface design of display panels will be greatly expanded. It becomes possible.

  In addition, the display board of the present invention is configured by any one of the above manufacturing methods. According to this display board, it is possible to realize an external appearance with gloss and depth, and it is possible to display a high-quality display, and it is possible to configure an external design with high design properties.

  Furthermore, a timing device provided with the display board of the present invention is characterized by including the display board. As a result, a high-quality appearance of the timing device is realized. Examples of the timing device include a display board provided with a dial for analog display, a display frame for digital display, and the like.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1A to 1D are schematic process cross-sectional views (a) to (d) illustrating a method for manufacturing a display panel of the present embodiment. The display board manufacturing method of the present embodiment includes, for example, a display board of a timing device such as a dial of an analog clock or a display frame of a digital clock (a board covering a display screen of a display body such as a liquid crystal panel), The present invention can be applied to the manufacture of various display boards such as a mobile phone operation panel, a display screen frame, an electronic device operation panel, and a display panel frame.

  In this embodiment, as the plate-like substrate 101 shown in FIG. 1A, various metals such as brass, brass, stainless steel, aluminum, aluminum alloy, titanium, titanium alloy, magnesium alloy; polycarbonate, polyethylene, polyester It can be composed of various materials such as various resins such as acrylic, various ceramics such as alumina, semiconductors such as silicon, other inorganic materials such as quartz and glass, and two or more kinds of the above various materials. It can also be composed of a combination (stacked or mixed).

  Further, on the surface of the base material 101, mechanical processing such as streak processing and blast processing, chemical processing such as etching processing and oxidation processing, parts, etc., before the masking step and the resin film placement step are performed. Surface treatments such as mounting, pattern printing, plating, and deposition film deposition can also be performed. Further, it is possible to attach a foot material (positioning protrusion for fixing to the movement) protruding from the back surface of the base material 101, or to adhere and fix a solar cell substrate or the like.

  In this embodiment, first, as shown in FIG. 1A, the base material 101 is masked with a mask 110 (masking step). The mask 110 has an opening 110a so that a part of the surface of the substrate 101 becomes an exposed region. The mask 110 can be made of various materials such as synthetic resin, paper, metal, ceramics, and glass. In particular, it is preferable to use a polyolefin resin (film) such as polyethylene or polypropylene. This is because it is chemically stable and is not easily attacked by organic solvents contained in the following liquid resins. In addition, there is an advantage that it has flexibility and is easily peeled off. Further, the mask 110 may be formed of a material that can be easily patterned and can be easily removed even after patterning, such as a photosensitive resin.

  The thickness of the mask 110 is not particularly limited, but in the case of a resin film, the thickness can be about 0.03 to 0.1 mm. Usually, it is preferable to have a thickness substantially the same as the thickness of the resin film described below.

  Various masking methods that can be used in this embodiment are conceivable. For example, there is a method in which a tape-like or sheet-like mask material is attached by a machine or hand work, and is peeled after performing a required processing. In addition, an adhesive, a temporary adhesive, or the like can be used as a substitute for the mask material. These adhesives and temporary adhesives are applied by a printing method such as spraying or screen printing, brushing, or the like. Here, the temporary adhesive is an adhesive that temporarily fixes the workpiece when processing such as dicing or polishing, and is an organic adhesive that can be removed cleanly after the processing is completed. . Examples of the temporary adhesive include an epoxy adhesive and an acrylic adhesive. In general, there are materials that are soluble in water, soluble in alcohol, and soluble in organic solvents. Some materials are known to be easily peeled off by being immersed in warm water or set to a predetermined temperature. For example, some solidify at about 10 ° C. and can be easily peeled off at room temperature of 20-30 ° C. In any case, it is desirable to be able to withstand the drying temperature (about 150 ° C.) without being affected by the resin used. Further, a thin plate (a plate material made of metal or resin, etc., preferably having a thickness of about 0.1 to 1.0 mm is preferable in consideration of workability) with the above-described adhesive, temporary adhesive, or the like is used as a mask. It may be bonded and fixed.

  Next, as shown in FIG.1 (b), the resin film 102 is arrange | positioned on said base material 101 (resin film arrangement | positioning process). The resin film 102 is made of polypropylene, ABS resin (a copolymer containing tolyl / butadiene / styrene in acrylic), a thermoplastic resin such as an acrylic resin, or a thermosetting resin such as a melamine resin or a phenol resin. Can be formed. Various radiation curable resins such as an ultraviolet curable resin and an electron beam curable resin can also be used.

  This resin film arranging step is usually preferably performed by applying an uncured liquid resin on the substrate 101. The uncured liquid resin refers to a resin liquefied with a solvent or the like, a resin mainly composed of a polymer precursor such as a monomer, and other liquid (including a solid-liquid mixed state) resin. As a coating method, a spray method, a roll coating method, a printing method, a spin coating method, or the like can be used. In particular, in order to form the relatively thick resin film 102, it is desirable to use a spin coating method described in detail later. The liquid resin applied by these various methods is cured by drying, heating, light or other radiation irradiation.

  In the resin film arranging step, the already cured resin film 102 may be bonded onto the base material 101. For example, the resin film 102 can be welded to the surface of the substrate 101. Examples of the resin material that can be welded include polyolefin resins such as polyethylene and polypropylene. Further, in the resin film arranging step, the resin film 102 may be formed directly on the substrate 101 by using a film forming method such as a CVD (chemical vapor deposition) method.

  As the resin film 102, a resin film having a light transmitting property capable of transmitting at least part of visible light is preferable. The resin film 102 is preferably made of a transparent material having high light transmittance and low wavelength dispersion, but can also be made of a translucent material or a colored material having light transmittance. In this case, the light transmittance is preferably 30% or more, and more preferably 60% or more, in the visible light region.

  Next, the surface 102a of the resin film 102 is molded (resin film molding process). In this step, the surface 102a of the resin film is subjected to surface treatment to improve the flatness and smoothness of the surface or to form a predetermined surface shape on the surface. In this step, for example, only the polishing process may be performed, but in this embodiment, the cutting process is performed first and then the polishing process is performed.

  In the first cutting step, a cut surface 102b is formed by cutting as shown in FIG. This cutting process may be performed on only a part of the surface of the resin film 102 or may be performed on the entire surface. In the illustrated example, an example of cutting the entire surface 102a of the resin film 102 is shown. Further, the cutting may be performed such that the cut surface 102b of the resin film 102 is flat, or is processed so that the cut surface 102b is provided with unevenness or a taper. May be. In the illustrated example, the entire surface of the resin film 102 is processed almost flatly.

  Cutting generally involves cutting a work material using a blade, and the shape of the blade and the cutting method are not limited. Not limited to the turning described in detail later, for example, it may be one that performs two-dimensional cutting using a flat blade (similar to the wood cutting mode of wood by Kanna).

  Although the total cutting amount (cutting allowance) of the cutting process is arbitrary, an appropriate cutting amount of about 1 μm to 1000 μm can be normally set. From the viewpoint of surely cutting the surface 102a of the resin film 102 formed in the resin film arranging step to form a good finished surface 102b, the incision (depth) is preferably 10 μm or more, and 50 μm More preferably, it is more than that. Further, in order to reduce distortion (deformation) of the resin film 102 due to stress at the time of cutting, the cut is preferably 600 μm or less, and more preferably 300 μm or less. Further, in order to shorten the processing time, it is preferable to complete the cutting process by cutting the cutting surface 102b once. However, in order to reduce the surface roughness due to the shape of the cutting edge of the cutting tool, it is desirable to configure the cut surface by a plurality of times of blade scanning.

  Next, as shown in FIG. 1D, the resin film 102 is polished (polishing step). In this polishing process step, a part of the surface of the resin film 102 may be polished, or the entire surface of the resin film 102 may be polished. In the illustrated example, an example is shown in which, of the surface of the resin film 102, the entire cut surface 102b that has been cut in the previous cutting step is subjected to polishing.

  This polishing process may generally be performed using fixed abrasive grains or loose abrasive grains, or may be performed using an abrasive other than abrasive grains such as buffs. In particular, it is preferable to use a polishing process in which polishing is performed by bringing a buff or the like into contact with a polishing liquid such as a slurry liquid containing free abrasive grains or an etching liquid (a liquid having solubility in the resin film 102).

  However, this polishing process is excellent in that the polishing surface 102c of the resin film 102 can be formed smoothly, but in terms of maintaining the surface accuracy of the polishing surface 102c and ensuring the accuracy of the polishing amount. Not necessarily excellent. This is because it is difficult to ensure sufficient in-plane uniformity and reproducibility because the polishing amount is greatly affected by the composition and amount of the polishing liquid and the new and old polishing cloth (buff). Therefore, it is preferable to reduce the polishing allowance in this resin film polishing step as much as possible. For example, the polishing allowance in this step is preferably in the range of 0.5 μm to 5.0 μm. When the polishing allowance is less than 0.5 μm, the cut surface of the cut finish surface 102b cannot be sufficiently removed, and the polished surface 102c of the resin film 102 is inferior in smoothness. On the other hand, when the polishing allowance exceeds 5 μm, the reproducibility of the film thickness of the resin film 102 accompanying the polishing is lowered and the film thickness variation increases, or the surface waviness caused by the polishing occurs. In particular, from the same viewpoint as described above, the polishing allowance is more preferably in the range of 1.0 to 3.0 μm.

  The final film thickness of the resin film 102 after the resin film polishing step depends on the light refractive index and light transmittance of the material constituting the resin film, but is usually in the range of 50 to 200 μm. preferable. When the film thickness is less than 50 μm, it is difficult to sufficiently exhibit the gloss and depth feeling due to the resin film 102. If the film thickness exceeds 200 μm, it becomes difficult to apply and form a liquid resin in the resin film arranging step. In particular, it is preferably within the range of 100 to 200 μm.

  In the present embodiment, since the resin film forming process is performed with the mask 110 left, the mask 110 is removed by peeling or etching after the resin film forming process is completed. As described above, the advantage of leaving the mask 110 in the resin film forming step is that the surface portion of the base material 101 covered with the mask 110 can be prevented from being affected by physical or chemical damage caused by the forming process. In the point. However, the mask 110 may be removed after the resin film arranging step, and then the resin film forming step may be performed, or the mask 110 may be removed after the first cutting step of the resin film forming step, A polishing step may be performed.

  FIG. 2 shows examples (a) to (d) of the planar shape of the substrate 101 used in the above manufacturing process. In the example shown in FIG. 2A, a planned product area 100A to be a display board is formed on a substantially rectangular base material 101 (a square having chamfered corners in the illustrated example). A plurality (two in the illustrated example) of guide holes 101H for positioning are provided on the outer peripheral edge portion. The planned product area 100A has a planar circular shape in the illustrated example. Further, in the example shown in FIG. 2B, a slit 101S is formed between the planned product area 100A and the peripheral portion, and a plurality of (four in the illustrated example) connections connecting the planned product region 100A and the peripheral portion. Part 101T is provided.

  In the example shown in FIG. 2C, the base material 101 is formed in a tape shape, and a plurality of planned product areas 100 </ b> A are arranged in the extending direction of the base material 101. In this case, it is preferable to provide a positioning guide hole 101H for each planned product area 100A. The plurality of planned product areas 100A provided on the base material 101 are preferably subjected to processing sequentially or collectively for each of the above steps.

  Further, in the example shown in FIG. 2D, a plurality of positioning notches 101 </ b> L are provided on the outer edge of the base material 101. Further, the center hole 101a may be formed in advance in the planned product area 100A. When the display board manufactured in this embodiment is a dial of a wristwatch, the center hole 101a is an insertion hole for a pointer. As will be described later, when a dial having a structure having a plurality of pointer shafts (multi-axis structure) is formed, a plurality of holes corresponding to the structure may be formed in advance.

  In any of the above examples, the display plate is finally completed by removing the peripheral portion of the base material 101 by pressing or cutting. In this way, by using the base material 101 having a peripheral portion on the outside of the resin film 102, the handling property of the base material 101 is improved in each of the manufacturing steps described above, and the treatment can be performed without touching the surface of the resin film 102. Can be easily advanced.

  FIG. 3 is a schematic configuration diagram showing a schematic configuration of the spin coating apparatus 10 that can be used in the resin film arranging step. The spin coating apparatus 10 includes a resin coating head 11 configured by a precision dispenser, a resin supply unit 12 that sends a liquid resin to the resin coating head 11, a rotating jig 13 that rotates while holding and fixing the base material 101, And a motor 14 for rotationally driving the rotary jig 13. Further, the rotary jig 13 is provided with a base material holding means 15 composed of a vacuum suction structure for holding the base material 101 by suction, an electrostatic chuck or the like, and for operating the base material holding means 15. A holding control unit 16 such as a vacuum generation source or a power feeding circuit is installed. Further, the rotary jig 13 is provided with a position adjusting means 17 including an XY table for adjusting the planar position of the base material 101. The resin supply unit 12, the motor 14, and the holding control unit 16 are controlled by the control unit 18. The cover 19 is for preventing the liquid resin from scattering during spin coating.

  When the base material 101 is set on the rotary jig 13 and the base material holding means 15 is operated, the base material 101 is fixed to the rotary jig 13. Then, after the position adjustment means 17 adjusts the position of the base material 101 as necessary, the liquid resin is supplied from the resin supply section 12 and the liquid resin is discharged from the resin application section 11 under the control of the control means 18. And applied onto the substrate 101. Thereafter, when the motor 14 is operated and the rotary jig 13 is rotated, the liquid resin is diffused on the substrate 101 by centrifugal force and spreads in a film shape. Here, it is preferable that the position of the substrate 101 is adjusted by the position adjusting means 17 so that the rotation axis passes through the exposed area, that is, the opening 110 a of the mask 110. If it does in this way, it can apply so that liquid resin may be spread over the whole exposed field which is not covered with mask 110. In particular, it is desirable to rotate the substrate 101 around the center (center of gravity) position of the exposed area, that is, the center (center of gravity) position of the opening 110a.

  The rotational speed of the rotary jig 13 is preferably in the range of 300 to 800 rpm. Further, it is desirable that the liquid resin is dropped on the central portion of the resin film forming region of the base material 101. The viscosity of the liquid resin is preferably 0.5 to 1.2 Pa · s, and particularly preferably about 0.5 Pa · s.

  Furthermore, in the case of a dial for a wristwatch (diameter of about 20 to 30 mm), it is preferable that the dropping amount of the liquid resin is about 0.5 to 2.0 g. For example, when the dropping amount of the liquid resin is 0.5 g, 1.0 g, and 2.0 g, a film thickness in the range of 50 to 200 μm is obtained regardless of the rotation time when the rotation speed is 300 rpm. . When the rotational speed was 350 rpm, a film thickness of about 50 to 80 μm was obtained regardless of the rotation time when the dropping amount was 0.5 g.

  FIG. 4 is a schematic side view (a) and a plan view (b) showing the state of the cutting step of the resin film forming step of the present embodiment, and the cutting edge shape of the cutting tool (bite) used in this step is enlarged. It is an enlarged partial side view shown. In this step, the base material 101 covered with the resin film 102 formed in the resin film placement step is fixed to a spindle of a known lathe (in the illustrated example, a horizontal lathe or a vertical lathe may be used), and the base material 101 is fixed. Set so that the normal of is the axis of rotation. Then, cutting is performed by applying the cutting tool 3 while rotating the substrate 101. At this time, the surface of the resin film 102 can be cut by scanning the cutting edge 3a of the cutting tool 3 in the rotation radius direction centering on the rotation axis.

  In the present embodiment, the cutting edge 3a is scanned in the upper side of the side view (a) of FIG. 4 and on the front side of the plan view (b). In this case, by scanning the cutting edge 3a from the center of the rotation axis toward the outer periphery, setting is made so that the machining progresses while the chips are discharged to the outer peripheral side, that is, the side of the unprocessed part. As a result, there is an advantage that damage to the cut surface due to cutting chips is prevented.

  FIG.4 (c) expands and shows the blade edge | tip 3a in Fig.4 (a). The cutting edge 3a has a shape having a corner (nose) 3z where the cutting edges 3x and 3y intersect. The corner 3z is a round corner, and its corner radius (nose radius) R is preferably 5 to 50 μm, more preferably about 10 to 20 μm. In this embodiment, it is about 15 μm. If the corner radius R is smaller than the above range, the surface roughness of the cut surface 102b increases unless the cutting speed (feeding speed) is reduced, and the polishing time in the resin film polishing step becomes longer. On the other hand, if the corner radius R is larger than the above range, the machining deformation is increased and the machining accuracy is lowered unless the cut is made small, and it is difficult to form a fine surface uneven shape in the scanning direction of the blade edge 3a.

  In particular, in this embodiment, since the work material is a resin film that is softer than metal, increasing the depth of cut (depth) decreases the processing accuracy due to increased deformation of the work, so it is necessary to reduce the depth of cut. is there. Therefore, it is effective to set the corner radius within the above range in order to maintain the surface accuracy of the cut surface while reducing the machining efficiency and to reduce the surface roughness.

  As cutting conditions, the resin film 102 is formed by setting the rotation speed of the substrate 101 to 500 to 3000 rpm, the feed speed in the rotation radius direction to 0.5 to 2.0 mm / s, and the cutting to about 50 to 100 μm. It can be easily cut.

  The display plate (dial plate) 100 manufactured according to the present embodiment described above has, for example, a planar shape shown in FIG. 5A and a cross-sectional structure shown in FIG. In the display panel 100, as shown in FIG. 1D, after the polishing process of the resin film 102 is completed, a component 103 formed by electroforming or the like is bonded and fixed, and the peripheral portion of the substrate 101 is attached as necessary. By removing, it is formed as shown in FIGS. The component 103 may be configured to represent various characters, numbers, figures, patterns, and the like. Further, a printed layer may be formed instead of the component 103.

  The display board 100 shown in FIG. 5 is an example which comprises a multi-axis dial. In the display plate 100, sub display areas 100S1, 100S2, and 100S3 are provided on the surface of the substrate 101, and a resin film 102 is formed in each of the sub display areas. Further, the resin film 102 is not formed in display areas other than these sub display areas. Thus, by forming the resin film 102 only in the sub display area, the design of the display panel 100 is enhanced, and the sub display areas 100S1, 100S2, and 100S3 are emphasized, and the visibility is improved.

  When manufacturing the display panel 100, the mask 110 having the opening 101a corresponding to the sub display areas 100S1, 100S2, and 100S3 is used, and the resin film 102 is disposed (applied) only in these sub display areas. At this time, it is assumed that the mask 110 is formed with only an opening corresponding to one sub-display region, and the liquid resin is applied to the opening using the spin coating apparatus 10 or the like, and the center of the opening is formed. By rotating around the axis of rotation that passes, the resin film is spread out and cured. The above structure can be formed by repeating this procedure a plurality of times using a mask having openings at different positions. Further, a plurality of openings corresponding to a plurality of sub-display areas are formed in the mask 110, and a liquid resin is applied to each opening by applying a liquid resin and rotating around a rotation axis passing through the center position of the opening. It is also possible to perform a procedure of sequentially performing the diffusion and curing processes, and repeat this procedure for different openings of the same mask 110 as described above.

  In order to increase the manufacturing efficiency, it is preferable that the resin film forming step in manufacturing the display panel 100 is performed at once on the plurality of sub display areas. In the resin film forming process, as described above, the cutting process step and the polishing process step can be sequentially performed. At this time, cutting is sequentially performed on the plurality of sub-display areas in the cutting step, and then, the process proceeds to the polishing step, and the polishing process is simultaneously performed on the plurality of sub-display areas. It is preferable.

  In the manufacturing method of this embodiment, there exists an advantage that the shape of the cutting finished surface 102c of the resin film 102 can be set arbitrarily by said cutting process step. That is, not only can the cut surface 102c of the resin film 102 be made flat as shown in FIG. 1, but the surface of the resin film 102 can be made into a convex curved surface as shown in FIG. 5B. Of course, the surface shape of the resin film 102 is not limited to the convex curved surface shape as shown in the figure, and an arbitrary surface shape such as a conical shape, a pyramidal shape, or a polyhedral shape can be formed. Such a surface shape is configured to be smooth while maintaining high surface accuracy by, for example, forming a rough shape by cutting in the above-described cutting step and removing the cut skin in the subsequent polishing step. it can.

  In this example, the component 103 is directly fixed on the surface of the substrate 101. However, when components are also arranged in the sub display area, they may be arranged below the resin film 102 or on the surface of the resin film 102. Further, instead of arranging (fixing) the component 103, a printed layer or the like may be formed.

  5C, the resin film 202 is formed on the entire surface of the base material 201, but only the sub-display areas 200S1 and 200S3 have a different surface shape from the other areas (see FIG. 5C). It is also possible to constitute a convex curved surface portion in the example shown. In this case, a resin film to be a first layer is disposed (applied) on the surface of the substrate 201, and the surface of the resin film is flattened as necessary, and then the sub display area is set as the exposed area. A mask 110 is formed, and a resin film to be a second layer is disposed (applied) in the sub display area. As a result, the resin film 202 is formed. After that, a step of molding the resin film 202 is performed. Finally, the sub display regions 200S1 and 200S3 are different from the surface shapes 202c of the other regions, and the surface shape 202c. It is configured to have surface shapes 202c1 and 202c3 that are more projecting (thick).

  As shown in FIG. 5C, the resin film forming step can be performed in the same manner as described above for the resin film 202 having an uneven surface shape. For example, the cutting step can be performed without hindrance by controlling the position of the cutting tool. In addition, the polishing step can polish the cut surface in the same manner as described above by using a polishing method (buff polishing or the like) in which the polishing action is obtained over a wide range in the film thickness direction. It is possible to form a surface composed of a curved surface. In the display board shown in FIG. 5C, the component 203 is disposed on the surface of the resin film 202. In this way, the component 203, the printed layer, and the like may be formed on the surface of the base material 201, but for example, formed on the surface of the base material 201 in the same manner as the display panel 100 shown in FIG. (That is, disposed below the resin film 202) or embedded in the resin film 202.

  Also in this display board 200, the appearance can be made different between the sub display area and the other areas due to the difference in the surface shape of the resin film, so that the design can be improved, and the visibility of the sub display area can be improved. It is also possible to improve the performance.

  In the display board 300 shown in FIG. 6A, on the surface of the base material 301, the resin film 302 is formed in the other areas without forming the resin film in the sub display areas 300S1 and 300S3. In this case, the mask 110 is arranged in the sub display areas 300S1 and 300S3 so that no mask is formed in other areas. Thus, the resin film 302 can be formed only in a region other than the sub display region by the above-described spin coating method or the like. Thereby, since the display modes having different appearances can be realized in the sub display area and the other areas, the design of the display panel 300 can be improved, and the visibility of the sub display area can be improved. The component 303 is disposed on the surface of the resin film 302.

  6B is formed on the surface of the base material 401 in the surface shape of the resin films 404 and 405 formed in the sub display areas 400S1 and 400S3 and in other areas. The surface shape of the resin film 402 is different. For example, in the illustrated example, the surface shape of the sub display area is a convex curved surface, while the surface shapes of the other surface areas are configured to be flat. Further, the resin film 402 and the resin films 404 and 405 may be made of different resin materials, in particular, resin materials having different appearances such as different light refractive index and light transmittance. The component 403 is disposed below the resin film 402. In this configuration example, the resin film 402 is formed using a mask that covers the sub display area, the resin films 404 and 405 are formed using a mask that covers an area other than the sub display area and exposes the sub display area. As a result, the design of the display panel 400 can be improved in the same manner as described above, and the visibility of the sub display area can be improved.

  In addition, in this embodiment, it has the advantage that the surface shape of a resin film can be comprised by arbitrary surface shapes by cutting. Therefore, the present invention is not limited to the above embodiment, and it is also possible to form fine irregularities such as radiating lines and streaks on the surface of the resin film, or to engrave a pattern by cutting.

  FIG.6 (c) is sectional drawing which shows the structural example of the base material 501 which comprises a display board. The base member 501 includes a front plate 501A having openings 501Ah in the sub display areas 500S1 and 500S3, and a back plate 501B disposed on the back side thereof. The front surface plate 501A and the back surface plate 501B may be bonded to each other, or simply overlapped. Further, a portion corresponding to the front plate 501A and a portion corresponding to the back plate 501B may be integrally formed. That is, a concave portion (recess) may be formed on the surface of the integral base material 501. If it does in this way, since the surface height of the base material 501 in sub display area 500S1 and 500S3 will differ from another area | region, a feeling of depth appears in the external appearance design of a display board. Then, on the surface of the base 501, as described above, a resin film is formed on one side and a resin film is not formed on the other side, or the thickness of the resin film. It is possible to further improve the design by changing the shape of the resin film, changing the surface shape of the resin film, or changing the material of the resin film.

  In the present embodiment, the cutting step may be performed using the spin coating apparatus 10 shown in FIG. For example, a tool holder (not shown) is disposed in place of the resin coating head 11 of the spin coating apparatus 10, a cutting tool is attached to the tool holder, and the resin film 102 on the substrate 101 fixed on the rotary jig 13 is cut. You may comprise. In this case, the tool holder is configured to be able to move precisely with respect to the rotary jig 13. In this way, the resin film 102 formed on the substrate 101 can be turned as it is. Also, the surface shape of the resin film as shown in FIGS. 5B and 5C and FIG. 6B is easily processed by aligning the rotation axis with the sub display area using the position adjusting means 17. be able to.

  In addition, the manufacturing method of the display board of this invention is not limited only to the above-mentioned illustration example, Of course, various changes can be added within the range which does not deviate from the summary of this invention.

Process sectional drawing (a)-(d) which shows embodiment of the manufacturing method of the display board which concerns on this invention. The top view (a)-(d) which shows the example of the planar shape in the manufacture process of the display board of the embodiment. The schematic block diagram of the spin coating apparatus used for the resin film arrangement | positioning process of the embodiment. The schematic side view (a) of the resin film cutting process of the embodiment, a schematic plan view (b), and the expanded partial sectional view (c) of the blade edge of a cutting tool. The top view (a) and sectional drawing (b) which show the structural example of the display board manufactured by the same embodiment, and sectional drawing (c) of a different display board. Sectional drawing (a) which shows another structural example of the display board manufactured by the embodiment, (b), and sectional drawing (c) which shows the different structural example of the base material which comprises a display board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Display board (character board), 101 ... Base material, 102 ... Resin film, 103 ... Parts, 10 ... Spin coating apparatus, 3 ... Cutting tool, 3a ... Cutting edge, 3x, 3y ... Cutting blade, 3z ... Corner, 100S1 ~ 100S3 ... Sub display area

Claims (10)

  A masking step of forming a mask having an opening that constitutes an exposed region in a part of a plate-like base material; a resin film arranging step of arranging a resin film in the exposed region of the masked base material; And a resin film forming step for forming the surface of the resin film.   The method for manufacturing a display panel according to claim 1, wherein at least the masking step and the resin film arranging step are repeated a plurality of times for the plurality of exposed regions.   The method for manufacturing a display panel according to claim 1, wherein a plurality of the exposed regions are provided in the masking step, and the resin films are respectively disposed in the plurality of exposed regions in the resin film arranging step.   The step of arranging the resin film includes a step of spreading the liquid resin arranged on the base material by a centrifugal force generated by rotation about a rotation axis set in the exposed region. The manufacturing method of the display board as described in any one of 1-3.   5. The display plate manufacturing method according to claim 1, wherein the resin film forming step includes a cutting step of cutting a surface of the resin film. 6.   In the cutting step, the cutting tool is applied in a state where the base material is rotated around the normal line, and the cutting is performed by scanning the cutting tool in the rotational radius direction of the base material. The manufacturing method of the display board of Claim 5.   The method for manufacturing a display plate according to claim 5, wherein the resin film forming step includes a polishing step of polishing a surface of the resin film after the cutting step.   The method for manufacturing a display panel according to claim 1, wherein the resin film has a light-transmitting property capable of transmitting visible light.   A display board manufactured by the method for manufacturing a display board according to claim 1. A time measuring device comprising the display panel according to claim 9.

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