JP2005172999A - Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optical device, a method of manufacturing an electro-optical device, and an electronic apparatus that are less likely to cause short-circuit between adjacent electrode patterns due to aggregation of conductive particles contained in a sealing material.
An electro-optic comprising: a first substrate and a second substrate arranged to face each other with a sealant interposed therebetween; and an electro-optic material sandwiched between the first substrate and the second substrate. In the apparatus, the first substrate has a first electrode pattern on the surface, the second substrate has a second electrode pattern on the surface, electrical wiring, and an external connection terminal on at least one side. The sealing material includes an insulating adhesive as a base material, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting the cell gap. .
[Selection] Figure 8

Description

The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus including the electro-optical device.
In particular, even when a pair of substrates are bonded via an anisotropically conductive sealing material, an electro-optical device, a method for manufacturing the electro-optical device, and a method for manufacturing such an electro-optical device, in which the occurrence of short-circuits between adjacent electrode patterns is small. The present invention relates to an electronic apparatus including an electro-optical device.

Conventionally, pixels are formed by crossing a scan electrode formed on one of a pair of substrates opposed to each other and a data electrode formed on the other substrate at a plurality of points in a dot matrix shape, and these pixels A liquid crystal display device that displays an image such as a character by modulating light passing through a liquid crystal substance included in the pixel by selectively changing a voltage applied to the pixel is widely used.
Such a liquid crystal display device usually has a first substrate having a first electrode pattern (scanning electrode), a second substrate having a second electrode pattern (data electrode) and an external connection terminal, and the first substrate. Arranged along the outer peripheral surfaces of the first substrate and the second substrate, and sealed between the first substrate and the second substrate, and a sealing material for bonding the first substrate and the second substrate together Liquid crystal. Moreover, as a sealing material used for such a liquid crystal display device, an anisotropic conductive sealing material comprising conductive particles in an insulating adhesive is generally used. And the electrical wiring on the 2nd board | substrate and the 1st electrode pattern on the 1st board | substrate are electrically connected by this sealing material.
However, the conductive particles contained in the sealing material are likely to aggregate, and depending on the number of aggregates and the distance between adjacent electrode patterns, the electrode patterns may be electrically connected. Therefore, a short circuit occurs and image defects may be seen.

Thus, in order to solve such problems, an anisotropic conductive film in which conductive particles are dispersed in an insulating binder has been proposed, although it is different from a sealing material. More specifically, as shown in FIG. 18, the conductive fine particles and the insulating fine particles having a diameter smaller than the diameter are mixed in the insulating binder, and the conductive fine particles are concentrated. This is an anisotropic conductive film in which a region and a region where insulating fine particles are concentrated are formed (see, for example, Patent Document 1).
JP 2002-75488 A (Claims)

However, it is difficult for the anisotropic conductive film described in Patent Document 1 to stably create a region where conductive fine particles are concentrated and a region where insulating fine particles are concentrated. There was a problem that the yield was low. In addition, since the insulating fine particles having a diameter smaller than the diameter of the conductive fine particles are used, the cell gap varies in a region where the conductive fine particles are not present, and aggregated particles are easily formed. There was a problem. Furthermore, there is no method for quantitatively determining the dispersibility of the conductive fine particles, and there has been a problem that the inspection method cannot be established in the production of an industrial-scale electro-optical device or the like.
Therefore, even if the anisotropic conductive film described in Patent Document 1 is applied to an anisotropic conductive sealing material as it is, there still remains a problem that a short circuit occurs and an image defect is likely to occur.

Accordingly, the inventors of the present invention have made diligent efforts and included a sealing material used in an electro-optical device, including dispersible particles for dispersing conductive particles and a spacer for adjusting a cell gap. The inventors have found that the dispersibility of the conductive particles contained in the sealing material can be quantitatively controlled by using the configuration, and the present invention has been completed.
That is, the present invention controls the dispersibility of the conductive particles contained in the sealing material in the electro-optical device, effectively suppresses the generation of aggregated particles, and effectively prevents the occurrence of shorts between adjacent electrode patterns. It is an object of the present invention to provide an electro-optical device that can be prevented. Another object of the present invention is to provide an efficient manufacturing method of such an electro-optical device and to provide an electronic apparatus including such an electro-optical device.

According to the present invention, the first substrate and the second substrate that are arranged to face each other via the anisotropic conductive sealing material, and the electro-optic sandwiched between the first substrate and the second substrate. An electro-optic device comprising a substance,
The first substrate comprises a first electrode pattern on the surface,
The second substrate includes a second electrode pattern on the surface, electrical wiring, and an external connection terminal on at least one side,
The sealing material is provided with an electro-optical device including an insulating adhesive, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting a cell gap. The problem can be solved.
That is, the dispersible particles contained in the sealing material inhibit the contact between the conductive particles, and the spacers control the lateral spread of the conductive particles, thereby controlling the dispersibility of the conductive particles. Thus, the generation of aggregated particles can be efficiently suppressed, and the occurrence of short circuits between adjacent electrode patterns can be effectively prevented.

  Further, in configuring the electro-optical device of the present invention, the sealing material is an index indicating the dispersibility of the conductive particles, and the dispersibility index (P1) represented by the following formula (1) is a value of 2 or more. It is preferable to do.

e: Natural log base A1: In aggregated particles made of conductive particles contained in the sealing material, the maximum number of conductive particles arranged in one direction per unit area B1: Number of aggregated particles having the maximum number A1 N _B1 : Factorial of B1 However, if there is no maximum number of aggregated particles, the value of e ^{− [1 / (A1-1)]} / N _B1 corresponding to the maximum number is 0 in the cumulative calculation (Hereinafter the same).

  Further, in configuring the electro-optical device of the present invention, when the average particle size of the conductive particles contained in the sealing material is s (μm), the average particle size of the dispersible particles contained in the sealing material is 0. A value in the range of 3 s to 0.9 s (μm) is preferable.

  Further, in configuring the electro-optical device of the present invention, when the average particle diameter of the conductive particles contained in the sealing material is s (μm), the first electrode pattern or the second electrode pattern is adjacent. It is preferable to set the distance between the electrode patterns to a value in the range of 2.5 s to 5 s (μm).

  In configuring the electro-optical device of the present invention, it is preferable to set the aspect ratio of the spacer included in the sealing material to a value in the range of 1: 2 to 1: 6.

  Further, in configuring the electro-optical device of the present invention, when the addition amount of the conductive particles contained in the sealing material is 100% by weight, the addition amount of the dispersible particles contained in the sealing material is 50 to 300% by weight. It is preferable to set the added amount of the spacer to a value within the range of 3 to 30% by weight.

  In constructing the electro-optical device of the present invention, the external connection terminal is electrically connected to at least the connection substrate through the anisotropic conductive film, and the anisotropic conductive film is insulatively bonded. A dispersibility index (P2) represented by the following formula (2) is set to a value of 2 or more, including an agent, conductive particles, and dispersible particles for dispersing the conductive particles. preferable.

e: base of natural logarithm A2: maximum number of conductive particles arranged in one direction in aggregated particles made of conductive particles contained in anisotropic conductive film B2: maximum number of conductive particles arranged in one direction is A2 A certain number of aggregated particles N _B2 : factorial of B2 However, if there is no maximum number of aggregated particles, e ^{− [1 / (A2-1)]} / N corresponding to the maximum number in the cumulative calculation The value of _B2 is set to 0 (the same applies hereinafter).

  Further, in constituting the electro-optical device of the present invention, when the average particle diameter of the conductive particles contained in the anisotropic conductive film is t (μm), the dispersive particles contained in the anisotropic conductive film The average particle diameter is preferably set to a value within the range of 0.3 t to 0.9 t (μm).

  Further, in constituting the electro-optical device of the present invention, when the addition amount of the conductive particles contained in the anisotropic conductive film is 100% by weight, the addition amount of the dispersible particles contained in the anisotropic conductive film Is preferably set to a value within the range of 50 to 300% by weight.

In another aspect of the present invention, the first substrate and the second substrate, which are opposed to each other with an anisotropic conductive sealant interposed therebetween, are sandwiched between the first substrate and the second substrate. The first substrate includes a first electrode pattern on the surface, and the second substrate includes at least one side of the second electrode pattern, the electric wiring, and the second electrode pattern on the surface. A method for manufacturing an electro-optical device having an external connection terminal on the side,
Using a sealing material including an insulating adhesive, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting a cell gap, the first substrate and the first substrate 2 is a method of manufacturing an electro-optical device for bonding two substrates.

  In carrying out the method for manufacturing the electro-optical device of the present invention, the sealing material is an index indicating the dispersibility of the conductive particles, and the dispersibility index (P1) represented by the following formula (1) is 2 or more. It is preferable to use a sealing material having a value of.

e: Natural log base A1: In aggregated particles made of conductive particles contained in the sealing material, the maximum number of conductive particles arranged in one direction per unit area B1: Number of aggregated particles having the maximum number A1 N _B1 : B1 factorial

  In carrying out the method of manufacturing the electro-optical device of the present invention, the method includes the step of electrically connecting the external connection terminal to at least the connection substrate through the anisotropic conductive film, And an insulating adhesive, conductive particles, and dispersible particles for dispersing the conductive particles, and the dispersibility index (P2) of the conductive particles represented by the following formula (2) Is preferably a value of 2 or more.

e: base of natural logarithm A2: maximum number of conductive particles arranged in one direction in aggregated particles made of conductive particles contained in anisotropic conductive film B2: maximum number of conductive particles arranged in one direction is A2 A certain aggregate particle number N _B2 : Factorial of B2

  According to still another aspect of the invention, there is provided an electronic apparatus including any one of the electro-optical devices described above.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments relating to an electro-optical device, an electro-optical device manufacturing method, and an electronic apparatus including the electro-optical device according to the invention will be specifically described below with reference to the drawings.
However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.

[First Embodiment]
1st Embodiment contains the 1st board | substrate and 2nd board | substrate which are opposingly arranged through a sealing material, and the electro-optical material pinched | interposed between the said 1st board | substrate and 2nd board | substrate. An electro-optical device.
In such an electro-optical device,
The first substrate comprises a first electrode pattern on the surface,
The second substrate includes a second electrode pattern on the surface, electrical wiring, and an external connection terminal on at least one side,
The sealing material includes an insulating adhesive, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting a cell gap.
Hereinafter, a liquid crystal display using a color filter substrate (first substrate) and an element substrate (second substrate) for the electro-optical device according to the first embodiment of the present invention with reference to FIGS. The apparatus 10 will be described as an example.

1. Basic Structure of Liquid Crystal Display Device First, referring to FIGS. 1 to 2, the basic structure of a liquid crystal display device as an electro-optical device according to the first embodiment of the present invention, that is, a cell structure, wiring, or a retardation plate The polarizing plate will be specifically described. 1 is a schematic perspective view showing a liquid crystal panel 200 constituting the liquid crystal display device according to the first embodiment of the present invention, and FIG. 2 is a schematic schematic cross-sectional view of the liquid crystal panel 200.
Further, the liquid crystal panel 200 shown in FIG. 1 is a liquid crystal panel 200 having a passive matrix structure, and an illuminating device such as a backlight or a front light, a case body, etc., which are not shown, are appropriately attached as necessary. As a result, a liquid crystal display device is obtained.
In this embodiment, a liquid crystal panel having a passive matrix structure will be described as an example. However, the liquid crystal panel has an active matrix structure using a nonlinear element such as a TFD element (Thin Film Diode) or a TFT element (Thin Film Transistor). It may be a liquid crystal panel.

(1) Cell structure As shown in FIG. 1, a liquid crystal panel 200 includes a first substrate (color filter substrate) 12 having a glass plate or a synthetic resin plate as a base, and a glass plate or A second substrate (element substrate) 14 having a synthetic resin plate or the like as a base is bonded through a sealing material 230. The liquid crystal is injected into the space formed by the color filter substrate 12 and the element substrate 14 into the inner portion of the sealing material 230 through the opening 230a, and then sealed with the sealing material 231. It is preferable to have a cell structure.
That is, as shown in FIG. 2, the liquid crystal 232 is preferably filled between the color filter substrate 12 and the element substrate 14.

(2) Wiring As shown in FIG. 1, a plurality of stripe-shaped data electrodes (second electrode patterns) 26 are formed on the inner surface of the second substrate 14 (the surface facing the first substrate 12). A plurality of stripe-shaped scanning electrodes (first electrode patterns) 19 are preferably formed on the inner surface of the first substrate 12 (the surface facing the second substrate 14). Further, the data electrode 26 is preferably connected to the electric wiring 29 in the display area harm. Furthermore, it is preferable that the other scanning electrode 19 is conductively connected to the electric wiring 28 on the second substrate 14 through a sealing material 230 containing conductive particles.
And the intersection area | region of a data electrode and a scanning electrode comprises many pixels arranged in matrix form, and the arrangement | sequence of these many pixels comprises the liquid crystal display area A as a whole.
In the following description, the second electrode pattern includes data electrodes and electrical wiring.

Further, as shown in FIG. 1, the second substrate 14 has a substrate overhanging portion 14T that protrudes outward from the outer shape of the first substrate 12, and on the substrate overhanging portion 14T, data It is preferable that an input terminal portion (external connection terminal) 219 including an electrode 26, electrical wirings 28 and 29, and a plurality of wiring patterns formed independently is formed.
Further, in order to electrically connect the data electrode 26, the electric wirings 28 and 29, and the input terminal portion (external connection terminal) 219 on the substrate overhanging portion 14T, for example, as shown in FIG. It is preferable to mount a semiconductor element (IC) 261 incorporating a liquid crystal driving circuit or the like through the anisotropic conductive film 80.
Further, an end of the substrate overhanging portion 14T is electrically connected to an input terminal portion (external connection terminal) 219 via, for example, an anisotropic conductive film 80 as shown in FIG. The flexible wiring board 110 is preferably mounted.

Here, as shown in FIGS. 3A and 3B, the external connection terminal 219 is electrically connected to the semiconductor element (IC) 261 and the flexible wiring board 110 through the anisotropic conductive film 80. The anisotropic conductive film 80 includes an insulating adhesive 81, conductive particles 83, and dispersible particles 85 for dispersing the conductive particles 83, and the following formula (2) It is preferable that the dispersibility index (P2) of the conductive particles 83 represented by is a value of 2 or more.
The reason for this is that if the dispersibility index (P2) is a value of 2 or more, the number of aggregated particles is suppressed, and it is possible to effectively prevent the occurrence of short circuits between adjacent electrode patterns in the external connection terminals. This is because it can.

e: base of natural logarithm A2: maximum number of conductive particles arranged in one direction in aggregated particles made of conductive particles contained in anisotropic conductive film B2: maximum number of conductive particles arranged in one direction is A2 A certain aggregate particle number N _B2 : Factorial of B2

(3) Retardation Plate and Polarizing Plate In the liquid crystal panel 200 shown in FIG. 1, as shown in FIG. 2, a retardation plate (in order to recognize a clear image display at a predetermined position of the first substrate 12). 1/4 wavelength plate) 250 and polarizing plate 251 are preferably disposed.
Further, it is preferable that a retardation plate (¼ wavelength plate) 240 and a polarizing plate 241 are also disposed on the outer surface of the second substrate 14.

2. Color filter substrate (first substrate)
(1) Basic Configuration As shown in FIG. 2, the color filter substrate 12 is basically composed of a base 13 made of a glass plate, a synthetic resin plate, or the like, a colored layer 16, a light shielding layer 18, and a first electrode. A pattern (scanning electrode) 19 is preferable.
When the color filter substrate 12 requires a reflection function, for example, in a transflective liquid crystal display device used for a mobile phone or the like, a first glass substrate (base body) 13, a colored layer 16, As shown in FIG. 2, it is preferable to provide a reflective layer (semi-transmissive reflective plate) 212 therebetween.
Further, in the color filter substrate 12, as shown in FIG. 2, a colored layer 16 is formed for each pixel, and a planarizing layer (surface protective layer or overcoat layer) made of a transparent resin such as an acrylic resin or an epoxy resin is formed thereon. ) 215. In this way, a color filter is formed by the colored layer 16 and the planarization layer (surface protective layer) 215. It is also preferable to provide an insulating layer (not shown) for improving electrical insulation.

(2) Colored layer In addition, the colored layer 16 shown in FIG. 2 is usually made to exhibit a predetermined color tone by dispersing a colorant such as a pigment or a dye in a transparent resin. An example of the color tone of the colored layer is a primary color filter composed of a combination of three colors R (red), G (green), and B (blue), but is not limited to this. ), M (magenta), C (cyan), and other various color tones.
Such a colored layer usually has a predetermined color by applying a colored resist made of a photosensitive resin containing a coloring material such as a pigment or a dye on the surface of the substrate, and removing unnecessary portions by a photolithography technique (etching method). A colored layer having a pattern can be formed. And when forming the colored layer of a some color tone, the said process is repeated.
In addition, a stripe arrangement is often used as the arrangement pattern of the colored layers, but various pattern shapes such as an oblique mosaic arrangement and a delta arrangement can be adopted in addition to the stripe arrangement.

(3) Light Shielding Layer Further, as shown in FIG. 2, a light shielding layer (sometimes referred to as a black matrix or a black mask) 18 is formed in an inter-pixel region between the colored layers 16 formed for each pixel. It is preferable to do.
Examples of such a black matrix 18 include those in which three colorants of R (red), G (green), and B (blue) are dispersed in a resin or other base material, or black pigments or dyes. A material in which a coloring material such as a resin is dispersed in a resin or other base material can be used. In addition, since an excellent shielding effect can be obtained without using a black material such as carbon, an R (red) layer, a G (green) layer, and a B (blue) layer can be obtained using an additive color method. A layer structure is also preferable.

(4) Reflective Layer As shown in FIG. 2, it is preferable that a reflective layer 212 is formed on the surface of the first glass substrate 13. The reflective layer 212 is preferably composed of a metal thin film made of aluminum, aluminum alloy, chromium, chromium alloy, silver, silver alloy, or the like. The reflective layer 212 is preferably provided with a reflective portion 212r having a reflective surface and an opening 212a for each pixel.

(5) First electrode pattern (scanning electrode)
(5) -1 Arrangement As shown in FIG. 2, it is preferable to form a scanning electrode (first electrode) 19 made of a transparent conductor such as ITO (indium tin oxide) on the planarization layer 215. . The scanning electrode 19 as the first electrode pattern is preferably configured in a stripe shape in which a plurality of transparent electrodes are arranged in parallel.

(5) -2 End Position The end position of the first electrode pattern on the color filter substrate (first substrate) is preferably present inside the outer edge of the sealing material. That is, as shown in FIG. 4A, when the liquid crystal display device is seen through in plan view, the first electrode pattern 19 is disposed so as not to exist outside the outer edge 230a of the sealing material 230. Is preferred.
This is because the first electrode pattern is not exposed to the outside after the color filter substrate and the element substrate are bonded to each other through the sealing material. Therefore, it is possible to effectively prevent the occurrence of a short circuit or corrosion due to contact of a metal frame or a foreign object.
However, the first electrode pattern on the color filter substrate (first substrate) usually needs to be electrically connected to the electrical wiring on the element substrate through a sealing material containing conductive particles. Therefore, as shown in FIG. 4A, the end position of the first electrode pattern 19 is preferably present outside the inner edge of the sealing material 230. With this configuration, the first electrode pattern and the electric wiring on the element substrate are electrically connected, and occurrence of a short circuit or corrosion can be reliably prevented.
As will be described later, when forming the electrode pattern, it is possible to prevent static electricity from staying in the electrode pattern at the manufacturing stage by providing an exposure process twice, so that the electrode pattern is provided outside the sealing material. It has also been found that there is no need to place and remove such static electricity.

Further, it is preferable that the end positions of the plurality of first electrode patterns existing on each side of the color filter substrate 12 are uniform. That is, as shown to Fig.4 (a), the edge part 19a of the some 1st electrode pattern 19 which exists in the one side of the edge part 13a of the 1st glass substrate 13, and the said 1st glass substrate 13 It is preferable that the distance to the edge portion 13a is substantially equal.
This is because the contact area between each electrode pattern and the sealing material is made uniform by configuring in this way. Accordingly, the conduction characteristics between each electrode pattern and the electric wiring on the element substrate are kept good, and an excellent image display can be realized. In addition, with this configuration, the cell gap of the electro-optical device can be made uniform.

(5) -3 Distance between First Electrode Patterns As shown in FIG. 5, the distance between adjacent first electrode patterns 19 is preferably set to a value in the range of 20 to 50 μm. That is, as will be described later, it is preferable to determine the distance between the adjacent first electrode patterns 19 in consideration that the particle diameter of the conductive particles contained in the sealing material is usually about 10 μm.
This is because if the distance is less than 20 μm, a short circuit may occur between the adjacent first electrode patterns, and an image defect or the like may occur. On the other hand, when the distance exceeds 50 μm, the area other than the pixel region becomes large, and it may be difficult to display a high-definition image.
Accordingly, the distance between the adjacent first electrode patterns is more preferably in the range of 22 to 45 μm, and further preferably in the range of 25 to 40 μm.

(5) -4 Height (thickness)
The height (thickness) of the first electrode pattern is preferably set to a value in the range of 1 to 20 μm, and more preferably set to a value in the range of 2 to 15 μm.
This is because when the height (thickness) of the first electrode pattern is less than 1 μm, the electrical resistance value may become excessively large. On the other hand, if the height (thickness) of the first electrode pattern exceeds 20 μm, the cell gap may vary or it may be difficult to reduce the thickness of the electro-optical device.

(6) Alignment film (first alignment film)
As shown in FIG. 2, it is preferable that a first alignment film 217 made of polyimide resin or the like is formed on the first electrode pattern (scanning electrode) 19.
The reason for this is that by providing the alignment film 217 as described above, when the color filter substrate 12 is used in a liquid crystal display device or the like, the alignment drive of the electro-optical material (liquid crystal) can be easily performed by voltage application. Because.

3. Element substrate (second substrate)
(1) Basic Structure As shown in FIGS. 1 and 2, the other element substrate (second substrate) 14 facing the color filter substrate 12 is basically a substrate made of a glass plate, a synthetic resin plate, or the like. 27 is preferably composed of a data electrode 26 and electrical wirings 28 and 29.
As shown in FIG. 2, a second alignment film 224 made of the same polyimide resin or the like as the first alignment film on the first substrate 12 is preferably formed on the data electrode 26.
In the example of the liquid crystal display device of the first embodiment, the colored layer is provided on the first substrate 12, but it is also preferable to provide the colored layer on the element substrate 14. Further, in the case of an electro-optical device using an active matrix type liquid crystal panel, a pixel electrode made of a transparent conductor such as ITO (indium tin oxide) is further provided on the element substrate, and TFD (Thin Film) It is preferably connected to the data electrode via a non-linear element such as a diode or TFT (Thin Film Transistor).

(2) Second Electrode Pattern (2) -1 Data Electrode Further, as shown in FIG. 4B, the data electrode 26 that is one of the second electrode patterns is preferably provided on the element substrate. . As shown in FIG. 4B, the data electrode 26 is preferably formed in a stripe shape in which a plurality of transparent electrodes are arranged in parallel.
In addition, as shown in FIG. 4B, the data electrode is connected to the electrical wiring 29 that has one end side serving as the external connection terminal 219, and is outside the sealing material 230 and on the second glass substrate 27. It is preferable to extend to the substrate overhanging portion 14T.
Note that the distance between adjacent data electrodes and the height of the data electrodes are preferably the same as those in the first electrode pattern described above.

(2) -2 Electrical Wiring Further, as shown in FIG. 4B, electrical wirings 28 and 29, which are one of the second electrode patterns, are preferably provided on the element substrate. The electrical wiring 28 is also preferably configured in a stripe shape in which a plurality of metal films are arranged in parallel.
In addition, it is preferable that the electrical wiring extends outside the sealing material 230 to the substrate overhanging portion 14T of the second substrate 14 and has one end side as an external connection terminal 219. As shown in FIGS. 6A to 6C, among the ends of the electrical wiring 28, the end 28 a opposite to the end serving as the external connection terminal 219 is interposed via the sealing material 230. It is preferable that the scanning electrode (first electrode pattern) 19 on the color filter substrate (first substrate) 12 is electrically connected.
6A and 6B show scanning electrodes on the color filter substrate 12 by arranging the electrical wiring 28 up to two sides of the element substrate 14 perpendicular to the location where the external connection terminals 28a exist. 19 shows an example in which electrical continuity is established. FIG. 6C shows a portion of the element substrate 14 where the external connection terminal 28a is present, and the portion where the electrical wiring 29 is not present is used for electrical connection with the scanning electrode 19 on the color filter substrate 12. An example is shown.
Further, in the case of a liquid crystal panel having an active matrix type structure such as TFD or TFT, as shown in FIG. 7, an electrical wiring 29 is extended in the facing direction from the external input terminal portion 219 to form a data line. In addition, the pixel electrode 20 is connected via the nonlinear element 31.

(2) -3 End Position Further, in the liquid crystal display device according to the first embodiment, as shown in FIGS. 4B and 6A to 6C, external connection on the second substrate 14 is performed. The ends 26a, 28a of the second electrode pattern (including the data electrode 26 and the electrical wiring 28; the same applies hereinafter) on the side where the terminal 219 is not provided are the ends of the first electrode pattern on the color filter substrate described above. It is preferable that it exists inside the outer edge 230a of the sealing material 230 similarly to a part. The reason for this is that by configuring in this way, it is possible to prevent the occurrence of a short circuit or corrosion due to contact of a metal frame or foreign matter.
The distance between the edge of the second electrode pattern and the outer edge of the sealing material and the edge of the glass substrate, and the distance and height between adjacent data electrodes, etc. The same can be done. Therefore, the description here is omitted.

4). Sealing material (1) Basic configuration The sealing material is formed by bonding a first substrate (color filter substrate) and a second substrate (element substrate), a second electrode pattern on the element substrate, and a color filter. It is a member for conducting the first electrode pattern (scanning electrode) on the substrate.
As shown in FIG. 8, the sealing material used in the electro-optical device of the first embodiment is an insulating adhesive 61, conductive particles 63, and dispersibility for dispersing the conductive particles 63. It is characterized by including particles 65 and a spacer 67 for adjusting the cell gap. That is, by cooperating with the dispersible particles 65 and the spacers 67 in the sealing material, the aggregation of the conductive particles is prevented, the dispersibility of the conductive particles is controlled, and a short circuit between adjacent electrode patterns is prevented. Occurrence can be effectively prevented.

(2) Insulating adhesive As the type of insulating adhesive, a photocurable resin, a thermosetting resin, or the like can be used. More specifically, epoxy resin, acrylic resin, urethane resin, amide resin, imide Resin or the like can be used. However, it is preferable to use an epoxy resin because it is excellent in heat resistance, moisture resistance, and transparency.
Further, regarding the addition amount of the insulating adhesive, when the total amount of the sealing material is 100% by weight, the addition amount of the insulating adhesive is preferably set to a value within the range of 50 to 98% by weight.
This is because the adhesiveness of the sealing material may be reduced when the amount added is less than 50% by weight. On the other hand, if the added amount exceeds 98% by weight, conductivity may not be ensured.
Therefore, when the total amount of the sealing material is 100% by weight, the amount of the insulating adhesive added is more preferably in the range of 55 to 93% by weight, and in the range of 60 to 88% by weight. More preferably, it is a value.

(3) Conductive particles Conductive particles are contained in an insulating adhesive as a base material, and are in contact with both the electrical wiring on the element substrate and the scanning electrode on the color filter substrate, thereby conducting between them. Is a material to take. As the kind of the conductive particles, metal particles such as Ni, Ag, Au, and Pd, or those obtained by metal plating with Au or the like on the surface of plastic particles can be preferably used.
Moreover, it is preferable to make the average particle diameter of electroconductive particle into the value within the range of 1-10 micrometers.
This is because, when the average particle size of the conductive particles is less than 1 μm, it may be difficult to ensure the electrical connection between the electric wiring on the element substrate and the scan electrode on the color filter substrate. . On the other hand, if the average particle size of the conductive particles exceeds 10 μm, the cell gap becomes large, making it difficult to reduce the thickness of the liquid crystal panel, and it is easy to cause a short circuit between adjacent electrode patterns. It is because there is a case where it is.
Therefore, the average particle size of the conductive particles is more preferably set to a value within the range of 2 to 9 μm, and further preferably set to a value within the range of 3 to 8 μm.

Moreover, regarding the addition amount of electroconductive particle, when the whole quantity of a sealing material is 100 weight%, it is preferable to make the addition amount of electroconductive particle into the value within the range of 1-50 weight%.
The reason for this is that if the amount added is less than 1% by weight, it may be difficult to ensure the electrical connection between the electrical wiring on the element substrate and the scan electrode on the color filter substrate. On the other hand, if the amount added exceeds 50% by weight, the adhesiveness of the sealing material may be lowered.
Accordingly, when the total amount of the sealing material is 100% by weight, it is more preferable that the amount of the conductive particles added is in the range of 5 to 45% by weight, and the value in the range of 10 to 40% by weight. More preferably.

(4) Dispersible particles Dispersible particles are interposed between the above-described conductive particles to effectively prevent the conductive particles from coming into contact with each other and to disperse the conductive particles in the sealing material. It is a material for controlling sex. That is, conversely, when no dispersible particles are added, for example, a plurality of conductive particles are combined and aggregated, so that adjacent scanning electrodes on the element substrate are electrically connected to each other, and a short circuit occurs. This is because it becomes easier.
Here, the constituent material of such dispersible particles includes silica, epoxy resin, polyester resin, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, and hydride thereof (SEBS), ethylene-acrylate ester copolymer. A polymer etc. can be used conveniently. Among them, it is preferable to use silica because of its high hardness and compression characteristics and excellent transparency.

Regarding the average particle size of the dispersible particles, the average particle size of the dispersible particles is in the range of 0.3 s to 0.9 s (μm), where s (μm) is the average particle size of the conductive particles described above. It is preferable to set the value within the range.
This is because, when the average particle size of the dispersible particles is less than 0.3 s (μm), it is difficult to uniformly disperse the conductive particles, and the conductive particles may aggregate. It is. On the other hand, when the average particle size of the dispersible particles exceeds 0.9 s (μm), it is difficult to bring the conductive particles into contact with both the electrical wiring on the element substrate and the scanning electrode on the color filter substrate. This is because the conductivity may be lowered.
Therefore, when the average particle size of the conductive particles is s (μm), the average particle size of the dispersible particles is more preferably set to a value within the range of 0.4 s to 0.85 s (μm). More preferably, the value is in the range of 5 s to 0.8 s (μm).
More specifically, the average particle diameter of the dispersible particles is preferably set to a value within the range of 1 to 7 μm.

Further, regarding the addition amount of the dispersible particles, when the above-described addition amount of the conductive particles is 100% by weight, the addition amount of the dispersible particles is preferably set to a value within the range of 50 to 300% by weight.
This is because when the amount of the dispersible particles added is less than 50% by weight, it is difficult to uniformly disperse the conductive particles, and the conductive particles may aggregate. On the other hand, when the added amount of the dispersible particles exceeds 300% by weight, the dispersibility of the conductive particles varies and the conductivity may be lowered.
Therefore, when the addition amount of the conductive particles is 100% by weight, the addition amount of the dispersible particles is more preferably set to a value within the range of 60 to 250% by weight, and within the range of 70 to 200% by weight. More preferably, it is a value.

(5) Spacer The spacer is included in the sealing material and is a member for adjusting the cell gap. That is, by including such a spacer, the cell gap in the entire adhesion region of the sealing material can be uniformly maintained.
As a material for the spacer, plastic fiber, glass fiber, silica particles and the like can be suitably used, but plastic fiber is used because it is relatively light and easy to disperse and has excellent compression characteristics. It is preferable.

As the spacer, a particulate material can be used, but it is also preferable to use a rod-shaped material having a major axis and a minor axis. In that case, it is preferable that the aspect ratio (major axis: minor axis) of the spacer is in the range of 1: 2 to 1: 6.
The reason for this is that when the aspect ratio is less than 1: 2, the gripping force is reduced, and it is easy to move, and it may be difficult to uniformly disperse, while the aspect ratio is 1. If it exceeds 6, the strength against the pressure from the long axis direction of the spacer decreases, and it may be difficult to keep the cell gap uniform.
Accordingly, the spacer aspect ratio is more preferably set to a value within the range of 1: 2 to 1: 5, and further preferably set to a value within the range of 1: 2 to 1: 3.
In addition, when using a particulate matter as a spacer, when the average particle diameter of a dispersible particle is 100% as a difference from the dispersible particle | grains mentioned above, the average particle diameter of the said spacer is 105-200. It is preferable to set the value within the range of%.

Further, regarding the added amount of the spacer, when the total amount of the sealing material is 100% by weight, the added amount of the spacer is preferably set to a value within the range of 1 to 30% by weight.
This is because when the added amount of the spacer is less than 3% by weight, the cell gap may vary. On the other hand, if the added amount of the spacer exceeds 30% by weight, the adhesiveness of the sealing material may be lowered.
Therefore, when the total amount of the sealing material is 100% by weight, it is more preferable that the added amount of the spacer is within the range of 1.5 to 25% by weight, and within the range of 2.5 to 20% by weight. More preferably, the value of

(6) Dispersibility index The dispersibility index (P1) is an index indicating the degree of dispersion of the conductive particles in the sealing material. That is, it is an index indicating that the conductive particles contained in the sealing material are uniformly dispersed without being excessively bonded and aggregated. Therefore, it is shown that the larger the dispersibility index, the fewer the aggregated particles and the more uniformly the conductive particles are present in the sealing material.
Here, the aggregated particles are defined as particles formed by combining a plurality of conductive particles (hereinafter the same). The dispersibility index (P1) of the conductive particles is determined by observing a 10 mm square sealing material as a unit area with a microscope or the like, and the maximum number of conductive particles arranged in one direction in the aggregated particles and the aggregated particles. Can be calculated by the following formula (1).

e: Natural log base A1: In aggregated particles made of conductive particles contained in the sealing material, the maximum number of conductive particles arranged in one direction per unit area B1: Number of aggregated particles having the maximum number A1 N _B1 : B1 factorial

Here, the maximum number (A1) of conductive particles arranged in one direction means the maximum number of conductive particles arranged in several directions in one aggregated particle composed of a plurality of conductive particles. . For example, in the case of aggregated particles as shown in FIG. 9 (e), three conductive particles are arranged in the X direction and two conductive particles are arranged in the Y direction, and the maximum number (A1) is in the X direction. The number of conductive particles arranged is 3. Similarly, in the case of other aggregated particles shown in FIG. 9, the maximum number of conductive particles arranged in several directions is shown in the drawing. That is, the maximum number (A1) of conductive particles arranged in one direction is a combination of numbers between 2 and n (n is a natural number, usually about 6 at the maximum). There are three types of 2, 3, and 4.
In addition, the number of aggregated particles having the maximum number A1 (B1) is, for example, when two types of two aggregated particles as shown in FIGS. 9A to 9C exist, respectively. B1 that is the maximum number 2 is 6, and when there are two four kinds of three aggregated particles as shown in FIGS. 9D to 9G, B1 that is the maximum number 3 is 8, In the case where there are two types of four aggregated particles as shown in the figure (h), the maximum number B1 is 2.
N _B1 means the factorial of B1. For example, when B1, which is the maximum number 2, is 6, N _B1 is 720 (= 6 × 5 × 4 × 3 × 2 × 1). If the the maximum number 3 B1 is 8, its N _B1 is, 40320 (= 8 × 7 × 6 × 5 × 4 × 3 × 2 × 1) , and when B1 is 2 is the maximum number 4, the N _B1 is 2 (= 2 × 1).

Table 1 shows an index table in which the value of e ^{− [1 / (A1-1)]} / N _B1 is specifically calculated.

Therefore, when there are as many aggregated particles as shown in FIGS. 9A to 9H as described above, the dispersibility index (P1) is 0.701164 (= 0.0038 + 4e ⁻⁵ +0.6978). It becomes.
And it is preferable to make the dispersibility index of the conductive particles contained in the sealing material used in the electro-optical device according to the first embodiment a value of 2 or more.
The reason for this is that when the dispersibility index is less than 2, the aggregated particles are present in a biased manner in the sealing material. In a region where the presence ratio is high, adjacent electrode patterns are electrically connected via the aggregated particles. This is because there is a case where the connection is made. On the other hand, this is because in a region where the proportion of conductive particles is low, conduction between the scan electrode on the element substrate and the electric wiring on the color filter substrate may be insufficient.
However, excessively increasing the value of the dispersibility index may be difficult for the control.
Therefore, the dispersibility index of the conductive particles contained in the sealing material is more preferably set to a value within the range of 2.2 to 5, and further preferably set to a value within the range of 2.5 to 4.

Next, the relationship between the dispersibility index (P1) of the conductive particles contained in the sealing material and the average particle diameter and addition ratio of the dispersible particles will be described.
First, the relationship between the dispersibility index and the average particle diameter of the dispersible particles will be described with reference to FIG. In FIG. 10, the vertical axis indicates the dispersibility index, and the horizontal axis indicates the average particle diameter of the dispersible particles when the average particle diameter of the conductive particles is 1 (μm). As is apparent from FIG. 10, in order to set the dispersibility index of the conductive particles contained in the sealing material to a value of 2 or more, the dispersion is performed when the average particle diameter of the conductive particles is 1 (μm). It is understood that it is effective to set the average particle size of the active particles to a value of 0.3 (μm) or more.
Next, with reference to FIG. 11, the dispersibility index and the amount of dispersible particles added when the amount of conductive particles added is 100% by weight are shown. As is apparent from FIG. 11, in order to set the dispersibility index of the conductive particles contained in the sealing material to a value of 2 or more, when the addition amount of the conductive particles is 100% by weight, the dispersible particles It is understood that it is effective to make the amount of addition in the range of 50 to 300% by weight.
In addition, although the dispersibility index (P1) of the electroconductive particle contained in a sealing material was explained in full detail, the relationship shown in FIG. 10 also exists about the dispersibility index (P2) of the electroconductive particle contained in an anisotropic conductive film. It has been found that it can be obtained.

[Second Embodiment]
According to a second embodiment of the present invention, a first substrate and a second substrate that are arranged to face each other with a sealant interposed therebetween, and an electro-optical material sandwiched between the first substrate and the second substrate The first substrate has a first electrode pattern on a first glass substrate as a substrate, and the second substrate has a second electrode on a second glass substrate as a substrate. This is a method of manufacturing an electro-optical device having a pattern and an external connection terminal.
And, using a sealing material including an insulating adhesive as a base material, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting the cell gap, This is a method of manufacturing an electro-optical device that joins a first substrate and a second substrate.
Hereinafter, an embodiment of a method for manufacturing an electro-optical device according to the present invention will be described in detail with reference to FIGS. 12 to 16 taking a method for manufacturing a liquid crystal display device having a passive matrix structure as an example.

1. A liquid crystal display device using a color filter substrate (first substrate) and an element substrate (second substrate) as an opposite substrate as an electro-optical device to be manufactured will be described as an example. Since the configuration of the substrate is the same as that of the first embodiment, a description thereof is omitted here.

(1) Manufacture of color filter substrate (first substrate) (1) -1 Formation of color filter As shown in FIG. 12 (a), on the first glass substrate, a portion corresponding to an image display area is provided. The reflective layer 212, the colored layer 16, and the light shielding layer 18 are preferably formed sequentially.
Here, the reflective layer 212 having the opening 212a is formed by depositing a metal material or the like on the first glass substrate 13 by vapor deposition or sputtering, and then patterning using a photolithography technique. Is done.
The colored layer 16 is formed by applying a photosensitive resin made of a transparent resin or the like in which a coloring material such as a pigment or a dye is dispersed on the reflective layer 212 and the like, and sequentially performing pattern exposure and development processing thereon. Can also be formed. In addition, when forming the colored layer 16 of several colors in an array, the said process is repeated for every color.
Moreover, it is preferable to form the light shielding layer 18 by superimposing the colored layers 16. Alternatively, it is also preferable to form the light shielding layer 18 using a black material such as carbon.

(1) -2 Formation of Protective Film Next, as shown in FIG. 12B, a light transmissive protective layer 215 </ b> X is formed on the entire surface of the first substrate 12. This translucent protective layer 215X can be made of, for example, an acrylic resin, an epoxy resin, an imide resin, a fluorine resin, or the like. These resins are applied onto a substrate in an uncured state having fluidity, and are cured by appropriate means such as drying, photocuring, and thermosetting. As a coating method, a spin coating method, a printing method, or the like can be used.
Next, the light transmissive protective layer 215X is patterned by using a photolithography technique to form a protective film 215 limited to the image display region as shown in FIG. Through this step, it is preferable that the translucent material is omitted from the translucent protective layer 215X from the area other than the image display area, that is, from the substantially same area as the area disposed outside the sealant 230 shown in FIG. . This is because the cell gap can be made uniform by carrying out in this way.

(1) -3 Formation of Scan Electrode (First Electrode Pattern) Next, as shown in FIG. 12D, a transparent conductor material such as ITO (indium tin oxide) is entirely formed on the protective film 215. It is preferable to form a transparent conductive layer 19X made of The transparent conductive layer 19X can be formed by sputtering, for example. Then, it is preferable to pattern the transparent conductive layer 19X using a photolithography technique to form the scanning electrode (first electrode pattern) 19 as shown in FIG.
More specifically, first, as shown in FIGS. 13A to 13B, a transparent conductive layer 19X made of a transparent conductive material is formed on the entire first glass substrate 13 including the protective film 215. . Here, as shown in FIG. 13B, it is also preferable to form a base layer 81 made of Ta ₂ O ₅ , SiO ₂ or the like in advance when the transparent conductive layer 19X is laminated. This is because the crystallinity and the like of the formed transparent conductive layer 19X can be made uniform, and the adhesion of the transparent conductive layer to the protective film and the glass substrate can be improved.
Next, as shown in FIG. 13C, after applying a predetermined resist material 86 'on the transparent conductive layer 19X, as shown in FIG. 13D, a predetermined mask pattern 87 is applied and exposed. Then, by developing (S7), as shown in FIG. 13E, a resist material 86 is applied and then patterned into a predetermined shape. Then, as shown in FIG. 13 (f), the transparent conductive material 19 </ b> X is subjected to an etching process, and then exposed and developed again to peel off the resist material.
In this way, it is preferable to form the scanning electrode (first electrode pattern) 19 having a predetermined pattern (not shown) as shown in FIGS. 13 (g) and 12 (d). This is because the scan electrode (first electrode pattern) formed in this way has been found to generate less static electricity. In addition, FIG.12 (d) has shown the figure which looked at the XX cross section of FIG.13 (g) in the arrow direction.

(2) Manufacture of element substrate (second substrate) (2) -1 Formation of electrical wiring Electrical wiring is formed on a second substrate by a conductive metal material, for example, chromium, aluminum, by sputtering or the like. Titanium, molybdenum, or the like is generally formed to a thickness of 50 to 300 nm, and then patterned by using a photolithography technique or an etching method. It is preferable to form wiring.
Details will be described below. First, as shown in FIG. 14 (a), a conductive metal film material 28 'is laminated on the entire surface of the glass substrate 27 by sputtering or the like, and from above, as shown in FIG. 14 (b). A resist material 82 is applied over the entire surface. Next, as shown in FIG. 14C, light is irradiated, for example, only to a position corresponding to the opening 83b through a photomask 83 having an opening 83b, and after pattern exposure, FIG. Development is performed to leave a resist 82 'only at a location corresponding to the opening 83b of the mask.

Next, as shown in FIG. 15A, after removing the conductive metal film material 28 ′ in the portion not covered with the resist 25 ′ by etching, as shown in FIG. 15B, The resist 25 'is removed to form a patterned electrical wiring 28.
Thereafter, as shown in FIG. 15C, it is preferable to form the oxide film 23 by oxidizing the surface of the electric wiring 28 by an anodic oxidation method. More specifically, after immersing the glass substrate 27 on which the electrical wiring 28 is formed in an electrolytic solution such as a citric acid solution, a predetermined voltage is applied between the electrolytic solution and the electrical wiring 28, It is preferable to oxidize the surface of the electrical wiring 28.

(2) -2 Formation of Data Electrode Next, although not shown, a transparent conductive material made of a transparent conductive material such as ITO (indium tin oxide, etc.) is formed by sputtering or the like in the same manner as the first electrode pattern forming method. After the layer is formed, it is preferable to form a data electrode as one of the second electrode patterns by patterning using a photolithography technique.

(3) Bonding Step (3) -1 Printing of Sealing Material As shown in FIG. 16 (a), on the color filter substrate, an insulating adhesive as a base material, conductive particles, and the conductive particles. It is preferable to form a sealant 230 containing dispersible particles for dispersing the liquid and spacers for adjusting the cell gap by patterning so as to surround the display region by screen printing or a dispenser. The reason for this is that, by carrying out in this way, adjacent electrode patterns are electrically connected to each other, and while effectively preventing disconnection or short-circuiting, the scanning electrode on the element substrate and the color filter substrate This is because electrical connection with the upper electrical wiring can be ensured. Since the sealing material that can be used at this time can be the same as the sealing material described in the first embodiment, description thereof is omitted here.
Further, regarding the printing position of the sealing material, as shown in FIG. 16A, the outer edge 230a of the sealing material 230 and the end portion 19a of the first electrode pattern 19 may be printed so as to substantially coincide with each other. preferable. This is because the end of the first electrode pattern can be used as a guide for alignment by printing the sealing material at such a position, so that the printing material can be easily positioned. . In addition, when the color filter substrate and the element substrate are bonded to each other through a pre-bake process, which will be described later, it is easy to prevent the sealing material from flowing toward the outside of the substrate by the dummy electrode. Therefore, a relatively large contact area between the sealing material and the first electrode pattern can be ensured. Therefore, the first electrode pattern and the scanning electrode on the color filter substrate can be reliably connected to each other, and the occurrence of short circuit and corrosion due to the contact of the metal frame and the foreign matter can be effectively prevented.
In this embodiment, the sealing material is formed on the color filter substrate, but it is also preferable to print on the element substrate.

(3) -2 Pressure bonding Next, the color filter substrate is overlapped and bonded to the element substrate on which the sealing material is laminated, and then the pressure filter is held while heating to bond the color filter substrate and the element substrate. It is preferable to combine them. At this time, as shown in FIG. 16C, the sealing material 230 is bonded so that the outer edge 230a is outside the predetermined end positions of the scanning electrode 19, the data electrode 26, and the electric wiring 28. preferable.
In this way, when the color filter substrate and the element substrate are bonded together, the scanning electrode on the color filter substrate, the data electrode other than the portion serving as the external connection terminal on the element substrate, and the electrical wiring should not be exposed to the outside. Is possible. Therefore, it is possible to obtain an electro-optical device that can effectively prevent the occurrence of short circuit and corrosion due to contact of a metal frame or a foreign object.

(4) Injection of liquid crystal and arrangement of polarizing plate Next, after the electro-optic material (liquid crystal) is injected into the space formed by the color filter substrate and the element substrate and into the inner portion of the sealing material, the sealing material It is preferable to seal with etc. For example, a normally black mode liquid crystal display device can be obtained by disposing polarizing plates on the outer surfaces of the first substrate and the second substrate and controlling the alignment direction of the liquid crystal molecules. .

[Third Embodiment]
As a third embodiment according to the present invention, an electronic apparatus including the liquid crystal display device according to the first embodiment will be specifically described.
FIG. 17 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. This electronic apparatus includes a liquid crystal panel 200 and a control unit 1200 for controlling the liquid crystal panel 200. In FIG. 17, the liquid crystal panel 200 is conceptually divided into a panel structure 200 </ b> A and a drive circuit 200 </ b> B composed of a semiconductor element (IC) or the like. The control unit 1200 preferably includes a display information output source 1210, a display processing circuit 1220, a power supply circuit 1230, and a timing generator 1240.
The display information output source 1210 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning unit that tunes and outputs digital image signals. It is preferable that the display information is supplied to the display information processing circuit 1220 in the form of an image signal of a predetermined format based on various clock signals generated by the timing generator 1240.

The display information processing circuit 1220 includes various known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information. It is preferable to supply the image information to the driving circuit 200B together with the clock signal CLK. Further, the driving circuit 200B preferably includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 1230 has a function of supplying a predetermined voltage to each of the above-described components.
And if it is the electronic device of this embodiment, the liquid crystal display device in which the electroconductive particle contained in a sealing material does not aggregate too much, and exists moderately is used. Therefore, the electrode pattern is not broken or short-circuited, and an electronic device having excellent reliability can be obtained.

  According to the present invention, it is possible to improve the dispersibility of the conductive particles contained in the sealing material and prevent the occurrence of a short circuit between adjacent electrode patterns, and electro-optical using liquid crystal molecules as an electro-optical material. Devices and electronic devices such as mobile phones and personal computers, liquid crystal televisions, viewfinder type / monitor direct view type video tape recorders, car navigation devices, pagers, electrophoresis devices, electronic notebooks, calculators, word processors, work Used for stations, videophones, POS terminals, electronic devices equipped with touch panels, devices using electron-emitting devices (FED: Field Emission Display or SCEED: Surface-Conduction Electron-Emitter Display), inorganic or organic electroluminescence devices, etc. be able to.

Furthermore, the electro-optical device and the electronic apparatus of the present invention are not limited to the illustrated examples described above, and can be used with various modifications without departing from the gist of the present invention. For example, the liquid crystal panel described in each of the above embodiments has a passive matrix structure, but an active matrix type electro-optical device using an active element (active element) such as a TFT (thin film transistor) or a TFD (thin film diode). It can also be applied to.
Further, the liquid crystal panel of the above embodiment has a so-called COG type structure, but a flexible wiring board or a TAB board is connected to a liquid crystal panel that is not a structure in which a semiconductor element (IC chip) is directly mounted, for example, a liquid crystal panel. It may be configured as described above.

1 is a schematic perspective view showing an external appearance of a liquid crystal panel constituting an electro-optical device according to a first embodiment of the invention. It is a schematic sectional drawing which shows a liquid crystal panel typically. (A)-(b) is a figure provided in order to demonstrate the anisotropic electrically conductive film used for the electro-optical apparatus of 1st Embodiment which concerns on this invention. (A) is a partial schematic plan view of a color filter substrate used in the electro-optical device of the first embodiment according to the present invention, and (b) is used in the electro-optical device of the first embodiment according to the present invention. It is a partial schematic plan view of an element substrate. It is a figure provided in order to demonstrate the edge part position of a scanning electrode. (A)-(c) is a figure provided in order to demonstrate the conduction | electrical_connection position of the electrical wiring on an element board | substrate, and the scanning electrode on a color filter board | substrate, respectively. It is a figure provided in order to demonstrate the example of wiring of the element substrate used for the electro-optical apparatus of an active matrix type structure. It is a figure provided in order to demonstrate the sealing material used for the electro-optical apparatus of 1st Embodiment which concerns on this invention. (A)-(h) is a figure provided in order to demonstrate the maximum number of the electroconductive particle arranged in one direction in an aggregated particle. It is a figure which shows the relationship between a dispersibility index and the average particle diameter of a dispersible particle. It is a figure which shows the relationship between a dispersibility index and the addition amount of a dispersible particle. (A)-(d) is sectional drawing which shows the manufacturing process for forming a color filter substrate (the 1). (A)-(g) is sectional drawing which shows the manufacturing process for forming a color filter substrate (the 2). (A)-(c) is sectional drawing which shows the manufacturing process for forming an element substrate (the 1). (A)-(c) is sectional drawing which shows the manufacturing process for forming an element substrate (the 2). (A)-(c) is a top view which shows the manufacturing process of an electro-optical apparatus. It is a block diagram which shows schematic structure of embodiment of the electronic device which concerns on this invention. It is sectional drawing which shows the anisotropic conductive film used for the conventional electro-optical apparatus.

Explanation of symbols

10: electro-optical device (liquid crystal display device), 12: color filter substrate (first substrate), 13: first glass substrate, 13a: edge of substrate, 14: element substrate (second substrate), 27 : Second glass substrate, 19: scan electrode (first electrode pattern), 19a: end of scan electrode, 26: data electrode (second electrode pattern), 26a: end of data electrode, 28, 29 : Electrical wiring, 28a: end of electrical wiring, 31: two-terminal nonlinear element (TFD element), 60: sealing material, 61: insulating adhesive, 63: conductive particles, 65: dispersible particles, 67: Spacer, 80: anisotropic conductive film, 81: insulating adhesive, 83: conductive particles, 85: dispersible particles, 200: liquid crystal panel, 230: sealing material, 230a: outer edge of sealing material

Claims (13)

Electricity including a first substrate and a second substrate that are arranged to face each other with an anisotropic conductive sealing material, and an electro-optical material sandwiched between the first substrate and the second substrate In an optical device,
The first substrate comprises a first electrode pattern on the surface,
The second substrate includes a second electrode pattern on the surface, electrical wiring, and an external connection terminal on at least one side,
The sealing material includes an insulating adhesive, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting a cell gap. . 2. The electro-optical device according to claim 1, wherein the sealing material has a dispersibility index (P1) of conductive particles represented by the following formula (1) of 2 or more.

e: Natural logarithm base A1: In aggregated particles made of conductive particles contained in the sealing material, the maximum number of conductive particles arranged in one direction B1: The maximum number contained per unit area of the sealing material is A1. Number of agglomerated particles N _B1 : Factorial of B1   When the average particle size of the conductive particles contained in the sealing material is s (μm), the average particle size of the dispersible particles contained in the sealing material is in the range of 0.3 s to 0.9 s (μm). The electro-optical device according to claim 1, wherein   When the average particle diameter of the conductive particles contained in the sealing material is s (μm), the distance between adjacent electrode patterns in the first electrode pattern or the second electrode pattern is 2.5 s to 5 s. The electro-optical device according to claim 1, wherein the value is within a range of (μm).   The electro-optical device according to claim 1, wherein an aspect ratio of the spacer included in the sealing material is set to a value in a range of 1: 2 to 1: 6.   When the addition amount of the conductive particles contained in the sealing material is 100% by weight, the addition amount of the dispersible particles contained in the sealing material is set to a value within the range of 50 to 300% by weight, and the spacer 6. The electro-optical device according to claim 1, wherein the additive amount is set to a value within a range of 3 to 30% by weight. The external connection terminal is electrically connected to at least a connection substrate through an anisotropic conductive film, and the anisotropic conductive film includes an insulating adhesive, conductive particles, and conductive particles. And a dispersibility index (P2) of the conductive particles represented by the following formula (2) is set to a value of 2 or more. The electro-optical device according to any one of the above.

e: natural logarithm base A2: in aggregated particles composed of conductive particles contained in anisotropic conductive film, maximum number of conductive particles arranged in one direction B2: included per unit area of anisotropic conductive film, Number of aggregated particles with maximum number A1 N _B2 : Factorial of B2   When the average particle diameter of the conductive particles contained in the anisotropic conductive film is t (μm), the average particle diameter of the dispersible particles contained in the anisotropic conductive film is 0.3 t to 0.9 t. The electro-optical device according to claim 1, wherein the electro-optical device has a value in a range of (μm).   When the addition amount of the conductive particles contained in the anisotropic conductive film is 100% by weight, the addition amount of the dispersible particles contained in the anisotropic conductive film is a value within the range of 50 to 300% by weight. The electro-optical device according to claim 1, wherein And a first substrate and a second substrate that are disposed opposite to each other with an anisotropic conductive sealing material, and an electro-optical material sandwiched between the first substrate and the second substrate. The first substrate has a first electrode pattern on the surface, the second substrate has a second electrode pattern on the surface, electrical wiring, and an external connection terminal on at least one side. In a method for manufacturing an electro-optical device comprising:
Using a sealing material including an insulating adhesive, conductive particles, dispersible particles for dispersing the conductive particles, and a spacer for adjusting a cell gap, the first substrate and A method of manufacturing an electro-optical device, comprising bonding a second substrate. 11. The electro-optical device according to claim 10, wherein a sealing material having a dispersibility index (P1) of conductive particles represented by the following formula (1) of 2 or more is used as the sealing material. Production method.

e: Natural logarithm base A1: In aggregated particles made of conductive particles contained in the sealing material, the maximum number of conductive particles arranged in one direction B1: The maximum number contained per unit area of the sealing material is A1. Number of agglomerated particles N _B1 : Factorial of B1 Including a step of electrically connecting the external connection terminal to at least a connection substrate through an anisotropic conductive film, the anisotropic conductive film comprising an insulating adhesive, conductive particles, and the conductive The dispersibility index (P2) of the electroconductive particle shown by following formula (2) is 2 or more values while containing the dispersible particle for disperse | distributing particle | grains. Or a method of manufacturing the electro-optical device according to 11.

e: natural logarithm base A2: in aggregated particles composed of conductive particles contained in anisotropic conductive film, maximum number of conductive particles arranged in one direction B2: included per unit area of anisotropic conductive film, Number of aggregated particles whose maximum number is A2 N _B2 : Factorial of B2   An electronic apparatus comprising the electro-optical device according to claim 1.

Images