JP2005172464A - Inspection equipment for semiconductor devices - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce an inductance component in a conventional contact while using the conventional contact, and to sufficiently cope with inspection for a high-frequency characteristic. <P>SOLUTION: In this inspection apparatus for a semiconductor device with the plurality of contacts 15 contacting with external electrodes 12 of an inspected IC 11 stored in contact storage holes 18 of a socket housing 14 comprising an insulating material, so as to make an inspected circuit board 16 of a semiconductor testing device conductive electrically with the inspected IC 11, the plurality of contacts 15 opposed to the adjacent prescribed electrodes 13 out of the external electrodes 12 are brought into electrical continuity by providing metal plated layers 19 on a surface of the socket housing 14 and an inner face of the each contact storage hole 18. The inductance component in the contact 15 is reduced thereby even when a length of the contact 15 is long, and the high-frequency characteristic is inspected accurately. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection apparatus for a semiconductor device such as an IC socket having a structure for connecting a semiconductor IC and an inspection circuit board of the semiconductor test apparatus so as to cause electrical continuity.

  In the process of manufacturing a semiconductor IC, it is necessary to electrically connect the semiconductor IC and the inspection circuit board when inspecting the electrical characteristics of the semiconductor IC.

  Therefore, a pogo pin contact is generally used as a contact method for electrically connecting the inspection circuit board to the external electrode of the semiconductor IC.

  In the inspection of high frequency characteristics, a pogo pin type contact is generally used, and there is one shown in Patent Document 1 as the same type.

  FIG. 5 is a cross-sectional side view schematically showing the configuration of the pogo-pin contact.

The conventional pogo pin type contact shown in FIG. 5 is provided with a coiled compression spring (not shown), an upper plunger 20 and a lower plunger 22 inside a barrel 21, and the upper end of the upper plunger 20 is outward from the barrel 21. It protrudes elastically. Then, the upper plunger 20 is pressed against the external electrode 12 of the semiconductor IC by expansion and contraction of the compression spring, whereby the external electrode 12 is electrically connected to the inspection circuit board via the upper plunger 20, the barrel 21 and the lower plunger 22. Is done.
JP 08-227770 A

  However, the conventional pogo-pin contact has a long line length, so that there is a problem that the inductance component of the contact is increased, the frequency characteristic is deteriorated, and it is difficult to accurately inspect the high frequency characteristic. Further, there is a physical limit to further shortening the length of the contact, and there is a problem that it cannot cope with the increase in the speed of the IC under test.

  Accordingly, an object of the present invention is to solve the above-mentioned problems, and while using a conventional contact, it is possible to reduce the inductance component of the conventional contact and to sufficiently cope with the inspection of the high frequency characteristics It is to provide an inspection apparatus.

  In order to achieve the above object, an inspection apparatus for a semiconductor device according to claim 1 of the present invention is arranged so that the inspection circuit board of the semiconductor test apparatus and the IC to be inspected are electrically connected to each other. An inspection apparatus for a semiconductor device, wherein a plurality of contacts in contact with an electrode are housed in a contact housing hole of a socket housing made of an insulating material, the plurality of contacts facing a predetermined adjacent electrode among the external electrodes The child is electrically connected by providing a metal plating layer on the surface of the socket housing and the inner surface of the contact housing hole.

  According to the semiconductor device inspection apparatus of the first aspect of the present invention, the plurality of contacts facing the predetermined electrodes adjacent to each other among the external electrodes are plated with metal on the surface of the socket housing and the inner surface of the contact housing hole. Since the layers are provided for electrical conduction, the inductance component of the contact can be reduced even when the length of the contact is long, and high-frequency characteristics can be accurately inspected.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing an IC socket and an IC to be inspected according to an embodiment of the present invention. Note that the same members as those in FIG.

  First, an inspected (semiconductor) IC to be inspected with the IC socket of this embodiment will be described. As shown in FIG. 1, the IC to be inspected used in this embodiment is a CSP (Chip Size Package) package 11 having solder balls as external electrodes. Of the plurality of external electrodes 12, two are grounding electrodes 13, and the others are signal electrodes and power supply electrodes. Two grounding electrodes 13 are arranged in parallel.

  Next, the IC socket of this embodiment will be described. As shown in FIG. 1, the IC socket according to the present embodiment includes a socket housing 14 made of an insulating material, a plurality of contacts 15 accommodated in the contact housing holes 18 in the socket housing 14, and a lower portion of the socket housing 14. A test circuit board 16 provided and a connection terminal 17 provided on the upper surface of the test circuit board 16 and facing the contact 15 are provided. Although not shown, the plurality of connection terminals 17 formed on the inspection circuit board 16 are electrically connected to the semiconductor tester by wiring connected to the inspection circuit board 16, and the inspection target IC is inspected. In this configuration, a plurality of contacts 15 that face adjacent predetermined electrodes among the external electrodes 12 are electrically connected by providing a metal plating layer 19 on the surface of the socket housing 14 and the inner surface of the contact receiving hole 18. I am letting.

  Next, a mechanism for electrically connecting a plurality of adjacent contacts of the IC socket of this embodiment will be described in detail. FIG. 2 is an enlarged cross-sectional view of a portion where a plating layer is applied to the contact hole of the IC socket of this embodiment. FIG. 3 is a plan view showing the IC socket of this embodiment.

  In the IC socket of this embodiment, in order to obtain electrical continuity between two contactors 15 facing two grounding electrodes 13 in parallel, as shown in FIG. A plating layer 19 is applied to the inside of the contact housing hole 18 in which is stored. As shown in FIG. 3, a metal plating layer 19 wiring is also provided on the surface of the socket housing 14 and connected to the inside of the contact housing hole 18.

  Therefore, in the high frequency characteristic inspection of the IC to be inspected, when the grounding electrode 13 of the IC to be inspected is grounded to the connection terminal 17 of the inspection circuit board 16 via the contact 15, the current is distributed to the two contacts 15. It is possible to reduce the inductance component of the contact 15 and suppress the loss.

  When there are three or more grounding electrodes 13, three or more contactor receiving holes 18 facing each other may be connected by a plating layer.

  The plating layer 19 of the contact housing hole 18 is preferably gold plating. Further, the plating thickness of the plating layer 19 is preferably about 2 to 3 μm in consideration of wear due to sliding of the contact 15.

  Further, in order to manufacture the wiring of the plating layer 19 that connects the surface of the socket housing 14 and the contact housing hole 18, after plating the entire socket housing 14, only the necessary portion is cut by cutting the surface of the socket housing 14. Try to leave.

  Next, how much the inductance component of the contact 15 is reduced according to the embodiment of the present invention was evaluated.

  FIG. 4 is an equivalent circuit used for the evaluation, FIG. 4A is an example in the case of the conventional IC socket, and FIG. 4B is an example in the case of the IC socket of the embodiment of the present invention. is there.

  The inductance component of the contact 15 can be divided into an inductance component La31 of the upper plunger 20, an inductance component Lb32 of the barrel 21 and spring, and an inductance component Lc33 of the lower plunger 22.

  In the case of the conventional IC socket, a high-frequency current flows through only one contact 15, so that the inductance component per contact at that time can be expressed as La + Lb + Lc.

  In the case of the IC socket of this embodiment, since the high frequency current flows separately from the base of the upper plunger 20 via the two contacts 15, the inductance component per contact at that time is La +. It can be expressed as (Lb / 2) + (Lc / 2).

  Therefore, when the IC socket of this embodiment is used, the difference between the inductance component of the conventional IC socket and the inductance component of the IC socket of this embodiment, that is, the inductance by (Lb / 2) + (Lc / 2). Ingredients can be reduced.

  As described above, the IC socket according to the present embodiment has the inductance component of the contact 15 by electrically connecting the two contacts 15 facing the two grounding electrodes 13 in parallel. Can be reduced, loss can be suppressed, and grounding can be reliably performed. Thus, by electrically connecting a plurality of adjacent contacts, a good grounding state can be obtained, and an accurate high-frequency characteristic inspection can be performed.

  The inspection apparatus for a semiconductor device according to the present invention can reduce the inductance component of the contact, and can accurately inspect the high-frequency characteristics. It is useful as an IC socket or the like having a structure for connecting to each other so as to cause electrical conduction.

It is sectional drawing which shows IC socket and to-be-inspected IC of embodiment of this invention. It is sectional drawing to which the part to which the plating layer was given to the contactor accommodation hole of the IC socket of embodiment of this invention was expanded. It is a top view which shows IC socket of embodiment of this invention. It is the equivalent circuit schematic used for IC socket evaluation of embodiment of this invention. It is principal part sectional drawing which shows the structure of the conventional pogo pin-type contactor typically.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 CSP package 12 External electrode 13 Ground electrode 14 Socket housing 15 Contact 16 Test circuit board 17 Connection terminal 18 Contact accommodation hole 19 Plating layer 20 Upper plunger 21 Barrel 22 Lower plunger 31 Inductance component La
32 Inductance component Lb
33 Inductance component Lc

Claims (1)

  A plurality of contacts in contact with the external electrodes of the IC to be inspected are accommodated in the contact housing holes of the socket housing made of an insulating material so that the test circuit board of the semiconductor test apparatus and the IC to be inspected are electrically connected. A plurality of contacts facing a predetermined adjacent electrode among the external electrodes, and a metal plating layer is provided on a surface of the socket housing and an inner surface of the contact housing hole. And a semiconductor device inspection device characterized by being electrically connected.

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