JP2005171115A - Adhesive composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composition which can be cured at an ordinary temperature and has excellent adhesive strength, heat resistance and weather resistance. <P>SOLUTION: The adhesive composition comprises 100 pts. wt. of a polymer (A) having a crosslinkable functional group and 1-200 pts. wt. of a vinyl polymer (B) which is different from (A) and has a glass transition temperature of higher than -10°C and a weight average molecular weight of 500-20,000. Wherein the polymer (A) may be of that containing as the principal component a polyoxyalkylene having an alkoxysilyl group and the vinyl polymer (B) may be that obtained by continuously polymerizing a vinyl monomer at a temperature of 150-350°C. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to an adhesive composition that can be cured at room temperature and has excellent adhesive strength, heat resistance, and weather resistance.

A mixture of a polyoxyalkylene polymer having an alkoxysilyl group or a polyoxyalkylene polymer having an alkoxysilyl group and a (meth) acrylic acid ester polymer having an alkoxysilyl group can be used alone or in combination with an epoxy compound. It is used as a base polymer of an adhesive composition (see Patent Documents 1 and 2). However, this elastic adhesive has insufficient weather resistance, adhesive strength, and heat resistance depending on use conditions. In addition, a curable composition having excellent weather resistance and heat resistance in which a polymer mainly composed of an acrylate unit is added as a plasticizer is also known (see Patent Document 3). In some cases, the adhesive strength was insufficient.

JP-A-61-247723 Japanese Patent Laid-Open No. 7-242737 JP 2003-226854 A

An object of the present invention is to provide an adhesive composition that can be cured at room temperature and has excellent adhesive strength, heat resistance, and weather resistance.

In order to solve the above-mentioned problem, the adhesive composition of the invention according to claim 1 is characterized in that 100 parts by mass of the polymer (A) having a crosslinkable functional group and a glass transition temperature of more than -10 ° C and a weight average molecular weight. It is 500 to 20000 and contains 1 to 200 parts by mass of the vinyl polymer (B) different from (A).
The adhesive composition according to claim 2 is the invention according to claim 1, wherein the polymer (A) having a crosslinkable functional group is mainly composed of polyoxyalkylene having an alkoxysilyl group. It is characterized by.
The adhesive composition of the invention according to claim 3 is the invention according to claim 1, wherein the polymer (A) having a crosslinkable functional group has a polyoxyalkylene having an alkoxysilyl group and an alkoxysilyl group. A (meth) acrylic polymer is the main component.
The adhesive composition of the invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the vinyl polymer (B) is a (meth) acrylic polymer. It is.
The adhesive composition of the invention described in claim 5 is characterized in that, in the invention described in any of claims 1 to 4, the vinyl polymer (B) has a hydrolyzable silyl group. is there.
The adhesive composition of the invention according to claim 6 is the invention according to any one of claims 1 to 5, wherein the vinyl polymer (B) is obtained by continuously polymerizing a vinyl monomer at a temperature of 150 to 350 ° C. It is characterized by being obtained.

An adhesive composition that can be cured at room temperature and has excellent adhesive strength, heat resistance, and weather resistance was obtained.

In this specification, acrylic and methacryl are collectively referred to as (meth) acrylic.
The polymer (A) having a crosslinkable functional group is a component necessary mainly for improving the adhesive strength and heat resistance. Examples of the polymer (A) having a crosslinkable functional group include acrylic, silicone, modified silicone, polysulfide, acrylurethane, polyurethane, polyisobutylene, fluorine and modified polysulfide types having a crosslinkable functional group. The modified silicone resin is preferable. The effects of the present invention can be exhibited by either one-component type or two-component type.

  Examples of the modified silicone resin herein include polyoxyalkylene polymers having one or more alkoxysilyl groups per polymer molecule, polyoxyalkylene polymers having alkoxysilyl groups, and alkoxysilyl groups (meta ) Mixtures of acrylic ester polymers are exemplified. Mixture of polyoxyalkylene polymer having alkoxysilyl group and (meth) acrylic acid ester polymer having alkoxysilyl group is a mixture of polyoxyalkylene polymer having alkoxysilyl group and (meth) acrylic acid ester having alkoxysilyl group A polymer may be mixed, or a polymer obtained by polymerizing a vinyl monomer having an alkoxysilyl group in the presence of a polyoxyalkylene polymer having an alkoxysilyl group may be used. Specific examples include Silyl SAT010, SAT030, SAT200, ESX250, SAT350, SAX710, SAX770, MA440 manufactured by Kaneka Chemical Industry, Exstar ES-S2410, ES-S2420, ES-S3430, ES-S3630, etc. manufactured by Asahi Glass. Illustrated.

  The vinyl polymer (B) has a weight average molecular weight of 500 to 20000, preferably 1000 to 15000, and particularly preferably 1500 to 13000. From the viewpoint of weather resistance and heat resistance, it is preferable that the weight average molecular weight is as high as possible. However, if it exceeds 20000, the viscosity of the blend increases and the workability is remarkably lowered. On the other hand, when it is less than 500, heat resistance and adhesive strength are reduced.

  The vinyl polymer (B) has a glass transition temperature exceeding −10 ° C., preferably 0 ° C. or higher, and more preferably 10 ° C. or higher. If the glass transition temperature is lower than −10 ° C., the adhesive strength may be insufficient. The upper limit of the glass transition temperature is preferably 150 ° C, more preferably 100 ° C. If the glass transition temperature is too high, the composition has a remarkably large viscosity and workability may be reduced.

  There is no restriction | limiting in particular as a vinyl monomer which can be used when manufacturing a vinyl polymer (B), (meth) acrylic acid ester, (meth) acrylic acid, styrene, (alpha) -methylstyrene, acrylonitrile, vinyl acetate, etc. (Meth) acrylic acid esters are preferred because of their excellent copolymerization and weather resistance and water resistance of the resulting vinyl polymer, especially those having 1 to 20 carbon atoms in the ester alcohol residue. Is preferred. Examples of (meth) acrylic acid esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, (meth) acrylic Isobutyl acid, s-butyl (meth) acrylate, t-butyl (meth) acrylate, neopentyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate (Meth) acrylates such as tridecyl (meth) acrylate and stearyl (meth) acrylate, (meth) acrylate cyclohexyl, (meth) acrylate isobornyl and (meth) acrylate tricyclodecynyl (meth) ) Acrylic alicyclic alkyl, (meth) acrylic acid 2-methoxy ester And (meth) acrylic acid esters such as dimethylaminoethyl (meth) acrylate, chloroethyl (meth) acrylate, trifluoroethyl (meth) acrylate and tetrahydrofurfuryl (meth) acrylate. .

  In addition, when a polyoxyalkylene having an alkoxysilyl group is used as the polymer (A) having a crosslinkable functional group, it is preferable to include a methacrylic acid ester unit because of excellent compatibility with the polyoxyalkylene. . Two or more of these vinyl monomers can be used.

  The vinyl polymer (B) may contain a monomer unit having an isocyanate group, a hydrolyzable silyl group, and an epoxy group. A monomer containing an isocyanate group, a hydrolyzable silyl group or an epoxy group is not essential and is preferably 30% by mass or less, more preferably 20% by mass or less based on the vinyl polymer (B). preferable. When it contains the monomer which has these functional groups exceeding 30 mass%, the storage stability of the adhesive composition obtained may become inadequate.

  When a polymer having an alkoxysilyl group is used as the polymer having a crosslinkable functional group (A), the vinyl polymer (B) contains a monomer unit having a hydroxyl group. Since the hydroxyl group contained in B) reacts with the alkoxysilyl group contained in the polymer (A) and may reduce the reactivity of the polymer (A), it is not preferable.

  Examples of the monomer having an isocyanate group include (meth) acryloxyethyl isocyanate, methacrylic isocyanate, and dimethylmetaisopropenylbenzyl isocyanate.

The monomer having a hydrolyzable silyl group is a compound containing a silyl group represented by the following formula (1).
-Si (R1) aX1 ( _3- a) (1)
(Wherein R1 represents a hydrogen atom or an alkyl group, an aryl group or an aralkyl group, X1 represents a halogen atom, an alkoxy group, an acyloxy group, a phenoxy group, a mercapto group, an amino group, an iminooxy group or an alkenyloxy group; Is 1 or 2.)
As the hydrolyzable silyl group, an alkoxy group is preferable. That is, X1 in formula (1) is preferably an alkoxy group.

  Examples of the monomer having an alkoxysilyl group include vinylsilanes such as vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldimethoxysilane, vinylmethoxydimethylsilane and vinyltrichlorosilane, trimethoxysilylpropyl (meth) acrylate, ( Silyl group-containing (meth) acrylic esters such as (meth) acrylic acid triethoxysilylpropyl and (meth) acrylic acid methyldimethoxysilylpropyl, silyl group-containing vinyl ethers such as trimethoxysilylpropyl vinyl ether, vinyl trimethoxysilylundecanoate Examples thereof include silyl group-containing vinyl esters. Among these, a silyl group-containing (meth) acrylic acid ester having a methoxy group or an ethoxy group is preferable from the viewpoint of copolymerization with (meth) acrylic acid ester and heat resistance of the copolymer. These monomers having hydrolyzable silyl groups can also be used alone or in combination of two or more.

  Examples of the monomer having an epoxy group include glycidyl (meth) acrylate, cyclohexane epoxy (meth) acrylate, allyl glycidyl ether, and vinyl glycidyl ether.

  The vinyl polymer (B) can be obtained by polymerizing a vinyl monomer selected according to the purpose by a known method. Any of solution polymerization, bulk polymerization, emulsion polymerization, suspension polymerization and the like may be used. When adopting solution polymerization, the organic solvent may be one usually used as a solvent, for example, cyclic ethers such as tetrahydrofuran and dioxane, aromatic hydrocarbon compounds such as benzene, toluene and xylene, ethyl acetate and butyl acetate, etc. Esters, ketones such as acetone, methyl ethyl ketone and cyclohexanone, alcohols such as methanol, ethanol and isopropanol, and the like, and one or more of these can be used.

  In the production of the vinyl polymer (B), a radical polymerization initiator may be used. Examples of the radical polymerization initiator include diisopropyl peroxydicarbonate, tertiary butyl peroxypivalate, benzoyl peroxide, lauroyl peroxide. In addition, peroxides such as ditertiary butyl peroxide, azo compounds such as azobisisobutyronitrile and azobisisovaleronitrile, and inorganic peroxides such as ammonium persulfate and potassium persulfate can be used. A chain transfer agent such as an alcohol or a mercaptan compound may also be used, but it is preferably not used because it leads to a decrease in weather resistance.

  The vinyl polymer (B) obtained by polymerizing a vinyl monomer at a temperature of 150 to 350 ° C. is likely to be excellent in weather resistance even if it has a relatively low molecular weight of 500 to 4000. Is preferable. The polymerization temperature is more preferably 180 to 320 ° C, and further preferably 200 to 300 ° C. Any of batch polymerization, semi-continuous polymerization, continuous polymerization and the like can be adopted, but continuous polymerization using a stirred tank reactor is particularly preferable because of excellent productivity. Such high-temperature continuous polymerization is known (Japanese Patent Publication No. 57-502171, Japanese Patent Publication No. 59-6207, Japanese Patent Publication No. 60-511992).

  The adhesive composition of the present invention comprises a polymer (A) having a crosslinkable functional group (100 parts by mass) and a glass transition temperature of more than −10 ° C. and a weight average molecular weight of 500 to 20000, which is different from that of (A). It contains 1 to 200 parts by mass of the combined body (B). The proportion of the vinyl polymer (B) is preferably 20 to 200 parts by mass. When it exceeds 200 mass parts, adhesive strength will fall.

  In order to cure the adhesive composition into a three-dimensionally crosslinked solid having rubber-like elasticity, a conventionally known curing accelerator can be used depending on the type of the crosslinkable reactive group. Specific examples include titanates such as tetrabutyl titanate and tetrapropyl titanate, dibutyltin dilaurate, dibutyltin maleate, dibutyltin diacetate, dibutyltin diacetoacetonate, tin octylate, tin naphthenate, lauric acid Tin carboxylates such as tin and ferrous acid, reaction products of dibutyltin oxide and phthalate, organoaluminum compounds such as aluminum trisacetylacetonate, aluminum trisethylacetoacetate and diisopropoxyaluminum ethylacetoacetate , Chelate compounds such as zirconium tetraacetylacetonate and titanium tetraacetylacetonate, lead octylate, iron naphthenate, bismuth-tris (neode Noate), bismuth compounds such as bismuth-tris (2-ethylhexoate) and bismuth octylate, butylamine, octylamine, dibutylamine, monoethanolamine, diethanolamine, triethanolamine, triethylamine, diethylenetriamine, triethylenetetramine, oleylamine , Cyclohexylamine, benzylamine, diethylaminopropylamine, xylylenediamine, triethylenediamine, guanidine, diphenylguanidine, 2,4,6-tris (dimethylaminomethyl) phenol, morpholine, N-methylmorpholine, 2-ethyl-4- Methylimidazole, 1,4-diazabicyclo [2,2,2] octane (DABCO) and 1,8-diazabicyclo [5,4,0] undecene Amine compounds such as (DBU), salts of these amine compounds with carboxylic acids, low molecular weight polyamide resins obtained from excess polyamines and polybasic acids, reaction products of excess polyamines and epoxy compounds, etc. And known silanol condensation catalysts such as other acidic catalysts and basic catalysts. These catalysts may be used alone or in combination of two or more. Preferred examples of the curing accelerator include tin carboxylates because the curing rate can be easily adjusted. The amount used varies depending on the type, but is preferably 0.1 ppm to 10% based on the total polymer mass of the present invention (the total mass of the polymer (A) and the polymer (B)), More preferably, it is 0.01% to 3%.

  The adhesive composition may be one to which an epoxy resin is added. Examples of such epoxy resins include epichlorohydrin-bisphenol A type epoxy resins, epichlorohydrin-bisphenol F type epoxy resins, flame retardant epoxy resins such as tetrabromobisphenol A glycidyl ether, novolac type epoxy resins, hydrogenated bisphenol A type epoxy resins. Glycidyl ether type epoxy resin of bisphenol A propylene oxide adduct, p-oxybenzoic acid glycidyl ether ester type epoxy resin, m-aminophenol type epoxy resin, diaminodiphenylmethane type epoxy resin, urethane-modified epoxy resin, various alicyclic epoxies Resin, N, N-diglycidylaniline, N, N-diglycidyl-o-toluidine, triglycidyl isocyanurate, polyalkylene glycol diglycol Examples include glycidyl ethers of polyhydric alcohols such as dil ether and glycerin, epoxidized products of unsaturated polymers such as hydantoin type epoxy resins and petroleum resins, but are not limited to these and are generally used. Epoxy resins can be used. Of these epoxy resins, those containing at least two epoxy groups in the molecule are particularly preferred because they are highly reactive during curing and the cured product easily forms a three-dimensional network. Among these, bisphenol A type epoxy resins or novolac type epoxy resins are more preferable.

  The epoxy resin is preferably blended and used so as to be 10 to 100 parts by mass based on 100 parts by mass of the total polymer of the present invention (total mass of the polymer (A) and the polymer (B)). . If the epoxy resin exceeds 100 parts by mass, the weather resistance may decrease. Moreover, when using an epoxy resin, it is preferable to use together the hardening | curing agent of an epoxy resin.

Epoxy resin curing agents include ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, hexamethylenediamine, diethylaminopropylamine, N-aminoethylpiperazine, isophoronediamine, diaminodicyclohexylmethane, m-xylenediamine, m-phenylene. Primary amines such as diamine, diaminodiphenylmethane, and diaminodiphenylsulfone, linear diamines represented by (CH ₃ ) ₂ N (CH ₂ ) n N (CH ₃ ) ₂ (where n is an integer of 1 to 10), _{CH 3) 2 -N (CH 2} ) nCH 3 ( linear tertiary amine wherein n indicated an integer) of 0, _{tetramethylguanidine, n {(CH 2) nCH} 3} 3 ( Wherein n is an integer of 1 to 10) alkyl tertiary monoamine, trieta Amine, piperidine, N, N′-dimethylpiperazine, triethylenediamine, pyridine, picoline, diazabicycloundecene, benzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) Secondary or tertiary amines such as phenol, BASF Ramilon C-260, CIBA Araldit HY-964, and Rohm and Haas Mensendiamine, 1,2-ethylenebis (isopentylideneimine), 1,2-hexylenebis (isopentylidenimine), 1,2-propylenebis (isopentylidenimine), p, p'-biphenylenebis (isopentylidenimine), 1,2-ethylenebis (isopropylideneimine) 1,3-propylenebis (isopropylideneimine), p-fu Ketimines such as enylene bis (isopentylidenimine), acid anhydrides such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, various polyamide resins, dicyandiamide and its derivatives, and various imidazoles Illustrated.

  When the adhesive composition contains both a polymer having a hydrolyzable silyl group and an epoxy resin, it was cured by adding a compound having a group capable of reacting to both the hydrolyzable silyl group and the epoxy group. This is preferable because the strength of the adhesive composition is further improved. Examples of the compound having a group capable of reacting with both a hydrolyzable silyl group and an epoxy group include N- (β-aminoethyl) -γ-aminopropyltrimethoxysilane and N- (β-aminoethyl) -γ-. Examples include aminopropylmethyldimethoxysilane, N- (β-aminoethyl) -γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, and γ-aminopropyltriethoxysilane.

  The adhesive composition may have a filler added to adjust the mechanical properties. Fillers include silica, silicic acid, diatomaceous earth, calcium carbonate, magnesium carbonate, carbon black, clay, talc, bentonite, titanium oxide, iron oxide, zinc oxide, zinc white, shirasu balloon, asbestos, glass fiber, filament, etc. Is exemplified. For increasing the strength, silica, silicic acids, carbon black, clay, ultrafine calcium carbonate, zinc white, etc. are suitable. When elasticity is important, titanium oxide, calcium carbonate, magnesium carbonate, talc, oxidized oxide Ferric iron, zinc oxide, shirasu balloon and the like are suitable. The preferred amount used is 1 to 200 parts by weight per 100 parts by weight of the total polymer of the present invention. These fillers may be used alone or in combination of two or more.

  The adhesive composition may be one to which a physical property adjusting agent is added in order to control physical properties such as adjusting the hardness when the adhesive composition is cured. Examples of the physical property modifier include alkyl alkoxysilanes such as methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane and n-propyltrimethoxysilane; dimethyldiisopropenoxysilane, methyltriisopropenoxysilane and γ-glycol. Alkylisopropenoxysilanes such as Sidoxypropylmethyldiisopropenoxysilane; Various silane coupling agents such as vinyltrimethoxysilane, vinyltriethoxysilane, and vinylmethyldimethoxysilane; Silicone varnishes; Polysiloxanes are required Depending on the addition. It is preferable to add in 0-20 mass parts with respect to 100 mass parts of all the polymers of this invention.

  The adhesive composition may be added with a dehydrating agent. Examples of dehydrating agents include orthoesters such as methyl orthoformate and methyl orthoacetate; compounds having hydrolyzable silyl groups such as tetraethoxysilane, methyltrimethoxysilane, vinyltrimethoxysilane, and γ-methacryloxypropyltrimethoxysilane Etc. It is preferable to add in 0-20 mass parts with respect to 100 mass parts of all the polymers of this invention.

  Other adhesive compositions include various solvents such as toluene and methyl ethyl ketone; surface properties and / or weather resistance improvers such as ultraviolet curable resins and oxygen curable resins; colorants such as pigments and dyes, anti-aging agents, ultraviolet rays An additive such as an absorbent, a light stabilizer, a flame retardant and the like may be blended.

The adhesive composition can be prepared as a one-pack type that is cured by pre-blending and storing all the blended components in advance and absorbing moisture in the air after construction. It is also possible to prepare as a two-component type of an adhesive hardener mainly composed of a copolymer and optionally an epoxy resin, and an adhesive hardener mainly composed of a curing catalyst and optionally an epoxy resin hardener. .

<Synthesis Example 1>
A pressure stirred tank reactor having a capacity of 1000 ml equipped with an electric heater was kept at 200 ° C. Next, while maintaining the reactor pressure constant, a mixture comprising 100 parts of the monomer mixture shown in Table 1, 10 parts of MEK, and 1 part of ditertiary butyl peroxide as a polymerization initiator was supplied at a constant feed rate (80 g / Minutes and residence time: 12 minutes), continuous supply from the raw material tank to the reactor was started, and a reaction liquid corresponding to the supply amount of the monomer mixture was continuously withdrawn from the outlet. Immediately after the start of the reaction, the reaction temperature once decreased, and then a temperature increase due to the heat of polymerization was observed. However, the reaction temperature was maintained at 250 to 251 ° C. by controlling the heater. The time when the temperature became stable from the start of the supply of the monomer mixture was taken as the collection start point of the reaction solution, and the reaction was continued for 25 minutes. As a result, 2 kg of the monomer mixture was supplied and 1.9 kg of the reaction solution was added. It was collected. Thereafter, the reaction solution was introduced into a thin film evaporator to separate volatile components such as unreacted monomers to obtain a concentrated solution. From the gas chromatographic analysis, no unreacted monomer was present in the concentrate. Tetrahydrofuran was used as a solvent, and the weight average molecular weight in terms of polystyrene (hereinafter referred to as Mw) measured by gel permeation chromatography (hereinafter referred to as GPC) was 8,700. The copolymer obtained by the reaction is referred to as “polymer 1”.

<Synthesis Examples 2-4>
Polymerization and treatment were performed in the same manner as in Synthesis Example 1 except that the conditions were changed as shown in Table 1, and a polymer was synthesized. The obtained polymers are referred to as polymers 2 to 4, respectively. The results of these analyzes are shown in Table 1.

1) Abbreviations for composition are as follows.
MMA: methyl methacrylate BA: butyl acrylate GMA: glycidyl methacrylate MSi: trimethoxysilylpropyl methacrylate

<Examples 1-6, Comparative Examples 1-3>
Polymers 1 to 4, Silyl SAT200 (manufactured by Kaneka Chemical Co., Ltd.), or Silyl MA440 (manufactured by Kaneka Chemical Co., Ltd.), epoxy resin (Epicoat 828 made of oiled shell epoxy), epoxy curing agent (Epicure H30 made of oiled shell epoxy) ), Aminosilane (Nippon Unicar A1120), dehydrating agent (Nippon Unicar A171), curing catalyst (dibutyltin dilaurate), calcium carbonate (white glazed CCR made of Shiroishi calcium), titanium oxide (Ishihara Sangyo Taipaque R820), aging An inhibitor (Chibin Specialty Binum B75) was mixed in parts by mass shown in Table 2. About these, the sheet | seat of thickness 3m was produced, and curing was performed for 2 days at normal temperature, and 3 days at 50 degreeC then. A No. 3 dumbbell specimen was punched from the cured sheet, a tensile test was performed based on JISK6301, and the strength and elongation at break were measured (tensile properties). Further, for measurement of tensile shear strength, it was applied and bonded to aluminum (A1050P material) based on JISK6850, and allowed to stand at 23 ° C. 53% RH × 7 days, and then a tensile shear test was performed (normal adhesiveness). The criteria for destruction are shown below.
Fracture criteria ○: Cohesive failure or base material failure △: Cohesive failure and interface failure mixed ×: Interface failure

Further, the test piece by the above curing was heated at 80 ° C. for 2 weeks and then returned to room temperature, and a tensile shear test (heat resistance) was performed to examine the retention rate of the shear tensile strength in a normal state. Further, after coating the mortar piece to 40 mm × 40 mm, a metalling weather meter test was performed, and visually observed after 100 hours and 300 hours (weather resistance). The evaluation criteria of the weather resistance visual observation are as follows.
○: No change in appearance Δ: Small cracks occurred ×: Deep cracks occurred These results are shown in Table 2.

  It is useful as a normal temperature curable adhesive having excellent adhesive strength, heat resistance, and weather resistance.

Claims (6)

100 parts by mass of the polymer (A) having a crosslinkable functional group and a glass transition temperature exceeding -10 ° C and a weight average molecular weight of 500 to 20000, and a vinyl polymer (B) of 1 to 200 masses different from (A) An adhesive composition containing parts. The adhesive composition according to claim 1, wherein the polymer (A) having a crosslinkable functional group is mainly composed of a polyoxyalkylene having an alkoxysilyl group. The adhesive composition according to claim 1, wherein the polymer (A) having a crosslinkable functional group is mainly composed of a polyoxyalkylene having an alkoxysilyl group and a (meth) acrylic polymer having an alkoxysilyl group. Stuff. The adhesive composition according to claim 1, wherein the vinyl polymer (B) is a (meth) acrylic polymer. The adhesive composition according to claim 1, wherein the vinyl polymer (B) has a hydrolyzable silyl group. The adhesive composition according to claim 1, wherein the vinyl polymer (B) is obtained by continuously polymerizing a vinyl monomer at a temperature of 150 to 350 ° C.