JP2005158944A - Manufacturing method of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the accuracy of screening of external terminals and reliably prevent outflow of defective products to a subsequent process due to external terminal non-joining.
A solder ball 5 as an external terminal is joined to a bump land of a tape substrate 3 of a semiconductor device body 1a, and then an adhesive such as an adhesive roller or an adhesive tape 21 is brought into contact with the solder ball 5 and then moved. Thus, the unbonded solder balls 5b in the solder balls 5 are removed, and the solder balls 5 are screened. Alternatively, the fluid ejected from the nozzle is caused to collide with the solder ball 5 to remove the unbonded solder ball 5b from the solder ball 5, and the solder ball 5 is screened.
[Selection] FIG.

Description

  The present invention relates to a manufacturing technique of a semiconductor device, and more particularly to a technique effective when applied to a manufacturing technique of a semiconductor device having a structure in which external terminals such as ball electrodes are joined.

  A semiconductor device having a semiconductor chip on which a semiconductor integrated circuit is formed includes a ball electrode (solder ball) made of solder or the like as an external terminal, and a chip support substrate (for example, a tape substrate) that supports the semiconductor chip. As an example, a small semiconductor package called a CSP (Chip Size Package) or a size slightly larger than a semiconductor chip is known.

  The main assembly process of the CSP includes a die bonding process for mounting a semiconductor chip (pellet) on a tape substrate, a wire bonding process for connecting a surface electrode of the semiconductor chip and a connection terminal of the tape substrate, and resin-sealing the semiconductor chip. A molding process, a ball attaching process in which solder balls as external terminals are arranged and arranged at predetermined locations on a tape substrate, a reflow process in which solder balls are connected to bump lands of the tape substrate, and a tape for cutting a multi-piece substrate into individual pieces Such as a cutting process.

  In the assembly of the CSP of the above-described technology, when a foreign matter enters between the bump land and the solder ball when the solder ball is connected to the bump land of the tape substrate in the reflow process, an alloy of the solder and the bump land. Layer formation is hindered, and as a result, such solder balls are not bonded to the bump lands. As a result, when a non-bonded state flows to the post-process, the solder ball is lost during the post-process, and as a result, a defect due to the solder ball non-bonding being found in the post-process becomes a problem. That is, if a defective product due to solder ball non-joining flows out to the post-process, there is a problem that work efficiency in the post-process decreases. Furthermore, a defective product due to solder ball non-bonding may flow out to the customer, resulting in a problem that the reliability of the product is lowered. For this reason, it is desired to prevent outflow of defective products due to unbonded ball electrodes to the subsequent process and to improve product reliability.

In Japanese Patent Laid-Open No. 2001-358163, a plurality of solder balls are provided on a tape substrate of a CSP main body by reflow, and thereafter, unjoined solder balls that are not bonded to the tape substrate can be moved among the solder balls. A ball is formed by using a conductive elastic sheet member made of a material softer than solder and imparting a force, bringing the elastic sheet member into contact with each solder ball and applying the moving force to remove unbonded solder balls. A technique for preventing a defective product from flowing out into a subsequent process due to electrode non-bonding is described (see Patent Document 1).
JP 2001-358163 A

  According to the study of the present inventor, the following has been found.

  For example, when a solder ball is screened by applying a lateral shearing force (moving force) to the solder ball using an elastic sheet such as a rubber sheet, the shearing force (moving force) acting on each solder ball is There is a possibility that a part of the unbonded solder ball is not removed after the screening process and remains on the bump land of the tape substrate without being uniform. This can reduce the accuracy of solder ball screening. For this reason, it is desirable to further improve the accuracy of solder ball screening and more reliably prevent the outflow of defective products due to unbonded solder balls to the subsequent process.

  An object of the present invention is to provide a technique capable of improving the accuracy of screening of external terminals and reliably preventing outflow of defective products to a subsequent process due to unbonded external terminals of a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The present invention moves the adhesive after bringing the adhesive into contact with the external terminal bonded to the semiconductor device body, and removes the unbonded external terminal that is not bonded to the semiconductor device body from the external terminals. Screening.

  The present invention also screens external terminals by causing fluid to collide with external terminals bonded to the semiconductor device body and removing unbonded external terminals that are not bonded to the semiconductor device body among the external terminals. It is.

  Further, the present invention applies an external force by bringing a plurality of members corresponding to a plurality of external terminals bonded to the semiconductor device body into contact with each other, and unbonded external terminals that are not bonded to the semiconductor device body among the external terminals. The external terminals are screened by removing them.

  The present invention also screens external terminals joined to the semiconductor device body while adsorbing the semiconductor device body.

  The present invention also screens external terminals joined to the semiconductor device body while heating the semiconductor device body.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  Screening of external terminals is performed by moving the adhesive after the adhesive is brought into contact with the external terminals bonded to the semiconductor device body, and removing unbonded external terminals that are not bonded to the semiconductor device main body from the external terminals. As a result, the accuracy of screening of the external terminals can be improved. Further, it is possible to reliably prevent outflow of defective products to the subsequent process due to external terminal non-joining.

  In addition, the external terminals are screened by causing the fluid to collide with the external terminals joined to the semiconductor device body, removing the unjoined external terminals that are not joined to the semiconductor device body, and screening the external terminals. The accuracy of screening can be improved. Further, it is possible to reliably prevent outflow of defective products to the subsequent process due to external terminal non-joining.

  Further, by applying an external force by contacting a plurality of members corresponding to a plurality of external terminals bonded to the semiconductor device body, removing unbonded external terminals not bonded to the semiconductor device body among the external terminals, By screening the external terminals, it is possible to improve the accuracy of the external terminal screening. Further, it is possible to reliably prevent outflow of defective products to the subsequent process due to external terminal non-joining.

  Further, by screening the external terminals joined to the semiconductor device body while adsorbing the semiconductor device body, it is possible to improve the accuracy of the screening of the external terminals. Further, it is possible to reliably prevent outflow of defective products to the subsequent process due to external terminal non-joining.

  Further, by screening the external terminals joined to the semiconductor device body while heating the semiconductor device body, the accuracy of the external terminal screening can be improved. Further, it is possible to reliably prevent outflow of defective products to the subsequent process due to external terminal non-joining.

  In the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections. However, unless otherwise specified, they are not irrelevant to each other, and one is a part of the other or All the modifications, details, supplementary explanations, and the like are related. Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number. Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say. Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted. In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  In the drawings used in the embodiments, hatching may be omitted even in a cross-sectional view so as to make the drawings easy to see. Further, even a plan view may be hatched to make the drawing easy to see.

(Embodiment 1)
A method for manufacturing the semiconductor device of the present embodiment will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view showing the structure of a CSP (Chip Size Package) semiconductor device, which is an example of a semiconductor device manufactured according to the semiconductor device manufacturing method of the present embodiment. FIG. 2 is a manufacturing process flow chart showing an example of a manufacturing process (manufacturing method) of the semiconductor device of the present embodiment. FIGS. 3 to 9 are manufacturing processes (manufacturing method) of the semiconductor device of the present embodiment. It is sectional drawing (main part sectional drawing) which shows this. 3 to 9 are cross-sectional views corresponding to the respective steps of the manufacturing process flow diagram of FIG.

  The method for manufacturing a semiconductor device according to the present embodiment relates to the assembly of a semiconductor device having a structure in which external terminals such as ball electrodes (solder balls) are joined. In the present embodiment, the case where the present invention is applied to a CSP type semiconductor device 1 which is a small semiconductor package having a chip size or slightly larger than the semiconductor chip 2 as shown in FIG. To do.

  First, the structure of the semiconductor device 1 shown in FIG. 1 will be described. A semiconductor device 1 shown in FIG. 1 includes a semiconductor chip 2, a tape substrate 3 that is a chip support substrate that supports the semiconductor chip 2, a plurality of electrodes (bonding pads, pad electrodes) 2a on the surface of the semiconductor chip 2, and the same. The bonding wires 4 that electrically connect the connection terminals 3c of the tape substrate 3 corresponding to the above and the surface opposite to the chip support surface 3a of the tape substrate 3 (hereinafter, this surface is referred to as the back surface 3b) as an external terminal area A plurality of solder balls (ball electrodes) 5 provided in an array arrangement, a die bond material (bonding material) 6 arranged between the tape substrate 3 and the semiconductor chip 1, a semiconductor chip 2 and a bonding wire 4 are sealed with resin. And a sealing portion 7 formed to stop.

  The semiconductor chip 2 is formed by forming various semiconductor elements or semiconductor integrated circuits on a semiconductor substrate (semiconductor wafer) made of, for example, single crystal silicon, and then grinding the back surface of the semiconductor substrate as necessary, followed by dicing or the like. The semiconductor substrate is separated into each semiconductor chip 2. The semiconductor chip 2 is disposed on the chip support surface 3a of the tape substrate 3 so that the surface (main surface on the semiconductor element forming side) 2b faces upward, and the back surface of the semiconductor chip 2 (what is the surface on the semiconductor element forming side) The main surface 2c on the opposite side is bonded and fixed to the chip support surface 3a of the tape substrate 3 via the die bond material 6. The die bond material 6 that fixes the semiconductor chip 2 to the tape substrate 3 is, for example, an insulating adhesive layer, but a conductive paste material or the like may be used. A plurality of electrodes 2a are formed on the surface 2b of the semiconductor chip 2, and the electrodes 2a are electrically connected to a semiconductor element or a semiconductor integrated circuit formed in the semiconductor chip 2 or on the surface layer portion.

  The tape substrate 3 is provided with bump lands 3g, wiring leads 3e, and connection terminals 3c formed of a copper foil material on a tape base material 3f made of polyimide or the like, for example, the connection terminals 3c being bonding wires. The bump land 3g and the wiring lead 3e are covered with a resist film 3d which is an insulating film.

  The electrode 2a of the semiconductor chip 2 is electrically connected to a connection terminal 3c formed on the chip support surface 3a of the tape substrate 3 via a bonding wire 4 made of, for example, a fine metal wire such as a gold (Au) wire, In the tape substrate 3, the connection terminals 3c and the bump lands 3g on which the solder balls 5 as external terminals are mounted are connected by wiring leads 3e.

  The sealing portion 7 is made of, for example, a resin material such as a thermosetting resin material, and can include a filler. For example, the sealing portion 7 can be formed using an epoxy resin containing a filler. The semiconductor chip 2 and the bonding wire 4 are sealed and protected by the sealing portion 7.

  Next, a method for manufacturing the semiconductor device of the present embodiment will be described with reference to a manufacturing process flow chart shown in FIG. 2 and cross-sectional views shown in FIGS. In the present embodiment, a case will be described in which individual semiconductor devices 1 are manufactured using a multiple tape-shaped multi-piece substrate 13 formed by connecting a plurality of tape substrates 3 together.

  A semiconductor chip 2 having a main surface on which a desired semiconductor element or semiconductor integrated circuit is formed is prepared, and a plurality of tape substrates 3 each having a chip support surface 3a capable of supporting the semiconductor chip 2 are formed. A series of tape-shaped multi-piece substrate 13 is prepared.

  Next, as shown in FIG. 3, the semiconductor chip 2 is bonded (chip mount, die bonding) to the chip support surface 3a of the tape substrate 3 via the die bonding material 6 (step S1). For example, a die bonding material 6 is applied to the substantially central portion of the chip support surface 3a of the tape substrate 3 to form an adhesive layer for fixing the chip, the semiconductor chip 2 is placed on the die bonding material 6, and heated. The die bond material 6 and the back surface 2c of the semiconductor chip 2 are joined.

  Next, as shown in FIG. 4, a wire bonding step is performed to electrically connect each electrode 2 a of the semiconductor chip 2 and the corresponding connection terminal 3 c formed on the tape substrate 3 through the bonding wire 4. (Step S2).

  Next, as shown in FIG. 5, resin sealing is performed by a molding process (for example, transfer molding process) to form the sealing portion 7, and the semiconductor chip 2 and the bonding wire 4 are sealed by the sealing portion 7. (Step S3). The sealing portion 7 is made of, for example, a resin material such as a thermosetting resin material, and can include a filler. For example, the sealing portion 7 can be formed using an epoxy resin containing a filler.

  Next, as shown in FIG. 6, marking is performed and a mark 17 such as a product number is attached to the surface of the sealing portion 7 (step S4).

  Next, as shown in FIG. 7, a plurality of solder balls 5 as external terminals are arranged on the tape substrate 3 of the semiconductor device body (CSP body) 1 a having the semiconductor chip 2. Here, the back surface 3b of the tape substrate 3 of the multi-chip substrate 13 is directed upward, and the solder balls 5 are supplied thereto to perform ball attachment (step S5). At that time, a plurality of solder balls 5 are arranged at predetermined positions on the back surface 3b of the tape substrate 3 using a mask member or the like in which a plurality of through holes are formed in a matrix at predetermined positions.

  A flux is applied to each solder ball 5, and the solder ball 5 is temporarily fixed (transferred) by this flux. Here, the flux removes the oxide film of the solder and prevents reoxidation to keep the surface clean.

  Next, as shown in FIG. 8, a reflow process for providing a plurality of solder balls 5 on the tape substrate 3 of the semiconductor device body 1a is performed (step S6). Here, a plurality of tape-shaped multi-chip substrate 13 in which each solder ball 5 is temporarily fixed by a flux is passed through a reflow furnace or the like (not shown), thereby melting the solder and solder ball 5 and bump land 3g. And join. In this way, the solder balls 5 as external terminals are joined to the semiconductor device body 1a.

  Next, flux cleaning is performed to clean each solder ball 5 provided on the back surface 3b of the tape substrate 3, thereby removing the flux attached to the surface of the solder ball 5 (step S7).

  Next, the solder balls 5 that are external terminals are screened (step S8). That is, the bump land of the tape substrate 3 among the solder balls 5 bonded (provided) to the semiconductor device main body 1a on the multi-chip substrate 13 that has undergone the reflow process of step S6 and the flux cleaning process of step S7. Unbonded solder balls not bonded to 3g (unbonded external terminals, corresponding to unbonded solder balls 5b described later) are removed by screening.

  The unbonded solder ball (unbonded solder ball 5b), for example, when soldering is performed by reflow, if foreign matter or the like enters between the bump land 3g of the tape substrate 3 and the solder ball 5, the solder and bump As a result, the formation of an alloy layer with the land 3g is hindered, and as a result, it is not properly bonded but is not bonded (this state is apparently disposed on the bump land 3g, but is disposed so as to move by a very small load). It is a solder ball that has become a state of being applied. In the screening step shown in step S8, a moving force (which can move (miss)) unbonded solder balls that are not bonded to the semiconductor device body 1a (the bump lands 3g of the tape substrate 3) of the solder balls 5 ( Using a moving force applying means (for example, an adhesive tape 21 or an adhesive roller 22 described later) for applying an external force, the moving force applying means applies a moving force (external force) to the solder balls 5 to remove unbonded solder balls. As a result, unbonded solder balls can be screened.

  Next, as shown in FIG. 9, each semiconductor device region (CSP region) is cut in the multiple tape-like multi-piece substrate 13 to form individual (separated) semiconductor device main bodies 1 a, That is, a tape cut to be cut and separated into the semiconductor device (CSP) 1 is performed (step S9). That is, the semiconductor device 1 as shown in FIG. 1 can be manufactured by cutting and dividing.

  Next, the screening process of step S8 in the semiconductor device manufacturing process of the present embodiment will be described in more detail. 10-12 is explanatory drawing of the screening process in this Embodiment.

  In this embodiment, after bonding the solder ball 5 as an external terminal to the semiconductor device main body 1a (the bump land 3g of the tape substrate 3) in step S5 and step S6, an adhesive is removed in the screening step shown in step S8. The solder ball 5b is moved after being brought into contact with the solder ball 5, whereby the unbonded solder ball 5b in the solder ball 5 is removed. For example, as shown in FIG. 10, the tape substrate 3 (multiple substrate 13) is arranged on a stage (mounting table) 20 so that the solder balls 5 face upward, and an adhesive is applied to the surface thereof. Then, an adhesive tape (adhesive tape material) 21 having an adhesive surface (adhesive surface) 21a is prepared, and the adhesive surface 21a of the adhesive tape 21 is pasted on the back surface 3b of the tape substrate 3 (multiple substrate 13). In addition, after the adhesive surface 21a of the adhesive tape 21 is brought into contact with all the solder balls 5, the adhesive tape 21 is peeled off (moved) as shown in FIG. That is, the adhesive tape 21 is moved after the adhesive surface 21 a of the adhesive tape 21 is brought into contact with the solder ball 5.

  In addition, as shown in FIG. 12, the tape substrate 3 (multiple substrate 13) is arranged on the stage 20 so that the solder balls 5 face upward, and an adhesive material is placed on the surface instead of the adhesive tape 21. A pressure-sensitive adhesive roller 22 having a pressure-sensitive adhesive surface (adhesive surface) 22 a is prepared, and the pressure-sensitive adhesive roller 22 is in contact with all the solder balls 5. 22 is rolled on the back surface 3b of the tape substrate 3 (multiple substrate 13). That is, the adhesive surface 22a of the adhesive roller 22 is brought into contact with the solder ball 5, and the adhesive roller 22 is moved while rotating.

  In this way, the adhesive material such as the adhesive tape 21 or the adhesive roller 22 is brought into contact with all the solder balls 5 provided on the back surface 3b of the tape substrate 3 and moved so that the solder ball 5 has an adhesive material. The external force (moving force) pulled by the force acts, so that the unbonded solder ball 5b of the solder balls 5 can be attached to the adhesive and moved (removed) from each semiconductor device body 1a.

  That is, if the solder ball 5 in contact with the adhesive tape 21 or the adhesive roller 22 is the unbonded solder ball 5b as described above, the unbonded solder ball 5b is bonded to the adhesive tape by the adhesive force of the adhesive tape 21 or the adhesive roller 22. The adhesive surface 21b of the adhesive 21 or the adhesive surface 22a of the adhesive roller 22 moves together with the adhesive tape 21 or the adhesive roller 22, and moves away from the bump land 3g of the tape substrate 3. As a result, unbonded solder balls 5b can be removed from each semiconductor device body 1a as shown in FIGS.

  In addition, the solder balls 5 in contact with the adhesive tape 21 or the adhesive roller 22 are appropriately attached (bonded) to the bump lands 3g of the tape substrate 3 by reflowing (good solder balls 5a (good ball electrodes, good external terminals). ), Since the connection strength by solder bonding is high, even if the adhesive force by the adhesive tape 21 or the adhesive roller 22 acts as shown in FIGS. 11 and 12, it does not leave the bump land 3g of the tape substrate 3. It is not removed (lost) from the semiconductor device body 1a.

  In this way, only the unbonded solder balls 5b among the solder balls 5 can be removed in the screening step of Step S8. As a result, defective products due to unbonded solder balls can be converged in the self-process (solder ball mounting process including screening), and as a result, outflow of defective products due to unbonded solder balls can be prevented. it can. Further, since it is possible to prevent the defective product from flowing out to the subsequent process due to the solder ball not being joined, the solder ball 5 is not lost during the subsequent process, and as a result, the defective product due to the solder ball not joining to the customer is prevented. The outflow can be prevented. Therefore, the reliability of the product (semiconductor device 1) can be improved.

  Unlike the present embodiment, the solder ball 5 was screened by applying a lateral shearing force (moving force) to the solder ball 5 using, for example, an elastic sheet such as a non-adhesive rubber sheet. In this case, the shearing force (moving force) acting on each solder ball 5 is not uniform, and a part of the unbonded solder ball 5b remains on the bump land 3g of the tape substrate 3 without being removed after the screening process. There is a possibility that. This may reduce the accuracy of screening of the solder balls 5.

  In the present embodiment, the solder balls 5 are screened using an adhesive such as the adhesive tape 21 or the adhesive roller 22. It is possible to easily realize that the adhesive material is brought into contact with all the solder balls 5 to apply the adhesive force, and the uniform adhesive force can be applied to each solder ball 5 and the uniform moving force can be applied. For this reason, the unbonded solder ball 5b can be accurately removed from the solder balls 5, and the unbonded solder ball 5b remains on the bump land 3g of the tape substrate 3 without being removed after the screening process. Can be prevented.

  In the present embodiment, wear management and replacement of an adhesive such as the adhesive tape 21 and the adhesive roller 22 are easy. Also, each time screening is performed, the adhesive tape 21 is replaced with a new one, and the adhesive surface having a uniform and accurate adhesive force is always brought into contact with the solder ball 5 in each screening process, so that the unbonded solder ball 5b is formed. Can be removed. Also, every time screening is performed, the adhesive roller 22 is cleaned, or the adhesive tape wound around the adhesive roller 22 is peeled off to expose a new adhesive surface. The unbonded solder ball 5b can be removed by bringing the pressure-sensitive adhesive surface into contact with the solder ball 5. For this reason, unbonded solder balls 5b in the solder balls 5 can be accurately removed in each screening step.

  Thus, in this embodiment, the accuracy of screening of the solder balls 5 can be improved and the unbonded solder balls 5b of the solder balls 5 can be accurately removed. It is possible to accurately prevent the outflow of defective products to the subsequent process due to unbonding. In addition, it is possible to accurately prevent the external terminals such as the solder balls 5 from being lost during the subsequent process. As a result, it is possible to prevent the defective product from flowing out to the customer due to the non-bonding of the external terminals, thereby improving the reliability of the product. It can be improved accurately.

  Further, a height control means (shaft) for changing the height of the adhesive tape 21 and the adhesive roller 22 is provided, and the height of the adhesive tape 21 and the adhesive roller 22 can be controlled (height control) manually or automatically. . Further, the load when the adhesive tape 21 or the adhesive roller 22 is brought into contact with the back surface 3b of the tape substrate 3 can be automatically sensed and controlled (load control) so as to be a constant (predetermined) load. Moreover, the speed at which the adhesive tape 21 and the adhesive roller 22 are moved can be made variable and controlled to a predetermined value (speed control). These can be adjusted according to the diameter, pitch, etc. of the solder balls 5, and the solder balls 5 can be screened under conditions that allow the unbonded solder balls 5b to be accurately removed.

  In the present embodiment, the tape cutting process of step S9 is performed after the screening process of step S8. However, the cleaning of the tape substrate 3 is performed after the screening process of step S8 and before the tape cutting process of step S9. And inspection of the solder ball 5 is preferably performed. FIG. 13 is a process flow diagram from the screening process of step S8 to the tape cutting process of step S9.

  As described above, the screening process of Step S8 is performed to remove (miss) the unbonded solder balls 5b, and then the tape substrate 3 is cleaned (Step S10). For example, the rotating brush is brought into contact with the back surface 3b of the tape substrate 3 (multiple substrate 13) to clean the back surface 3b of the tape substrate 3 to which the solder balls 5 are connected, and is removed or missing in the screening process of step S8. The unbonded solder balls 5b thus formed are completely removed from the back surface 3b of the tape substrate 3.

  Next, it is inspected whether the solder ball 5 is connected to each bump land 3g of the tape substrate 3 (multiple substrate 13) (step S11). For example, an image test or an electrical test using a tester is performed to check whether the solder balls 5 are connected to the bump lands 3g of the tape substrate 3. If the solder balls 5 are connected to all of the bump lands 3g to which the solder balls 5 are to be connected, they are sent as non-defective products to the tape cutting process in step S9 and divided into individual semiconductor devices 1 as described above. Will be shipped as. If the unbonded solder balls 5b are removed by the screening process in step S8, and there are places where the solder balls 5 are not connected to the bump lands 3g to which the solder balls 5 are connected, the number of the solder balls 5 is determined. The semiconductor device main body 1a lacking is selected as a defective product and is removed when it is divided into individual pieces in the tape cutting process of step S9. Alternatively, if the unbonded solder ball 5b is removed by the screening process in step S8, and there is a portion where the solder ball 5 is not connected to the bump land 3g to which the solder ball 5 is to be connected, the solder ball 5 is It is also possible to reconnect the solder balls 5 only to the missing bump lands 3g and then divide them into individual semiconductor devices 1 in the tape cutting process of step S9 and ship them as products.

  In the present embodiment, as described above, the tape cutting process of step S9 is performed after the screening process of step S8. However, as another form, the screening process of step S9 is performed before the screening process of step S8. It is also possible to perform the tape cutting process to divide the semiconductor device 1 into pieces, and then screen each of the semiconductor devices 1 for the solder balls 5 corresponding to the screening process in step S8. Since the solder balls 5 are screened after being divided into individual semiconductor devices 1, warping of the semiconductor device 1 during screening can be suppressed or prevented, and the load (movement) applied to each solder ball 5 during the screening of the solder balls 5. Force, external force) can be made more uniform. For this reason, the unjoined solder ball 5b can be removed more accurately.

(Embodiment 2)
FIG. 14 is an explanatory diagram of the screening step (step S8) in another embodiment of the present invention, and corresponds to FIGS. 10 to 13 in the first embodiment.

  The present embodiment is the same as the first embodiment except for the screening process of step S8 (the screening process of the solder balls 5) in the structure of the semiconductor device and the manufacturing process of the semiconductor device. Is omitted.

  In the present embodiment, after the solder ball 5 as an external terminal is joined to the semiconductor device main body 1a (the bump land 3g of the tape substrate 3) in Step S5 and Step S6, fluid is used in the screening process shown in Step S8. (By applying an external force to the solder ball 5 by causing the fluid to collide with the solder ball 5), the unbonded solder ball 5b of the solder ball 5 is removed. For example, as shown in FIG. 14, a tape substrate 3 (multiple substrate 13) is arranged on a stage 20 so that the solder balls 5 face upward, and a nozzle (fluid ejecting means) that can discharge or eject a fluid 31. ) 32 is prepared, and the fluid 31 is discharged or discharged from the nozzle 32 to the back surface 3b of the tape substrate 3 (multiple substrate 13). The fluid 31 discharged from the nozzle 32 collides with the solder ball 5 on the back surface 3 b of the tape substrate 3. The nozzle 32 moves in the horizontal direction above the back surface 3b of the tape substrate 3 (the direction horizontal to the back surface 3b of the tape substrate 3), and all the fluid 31 discharged from the nozzle 32 is provided on the back surface 3b of the tape substrate 3. The solder balls 5 are evenly applied (supplied, made to collide). In this way, an external force (moving force) acts on the solder ball 5 due to the pressure of the fluid 31, and the unbonded solder ball 5b in the solder ball 5 is removed (missed). As the fluid 31, gas or liquid can be used, for example, air (air), water, cleaning liquid, or the like can be used.

  That is, if the solder ball 5 collided with the fluid 31 discharged from the nozzle 32 is an unbonded solder ball 5b, the unbonded solder ball 5b is separated from the bump land 3g of the tape substrate 3 by the pressure of the fluid 31. Thereby, the unbonded solder ball 5b can be removed (missed) from each semiconductor device body 1a.

  In addition, the solder balls 5 with which the fluid 31 discharged from the nozzles 32 collides are appropriately attached (bonded) to the bump lands 3g of the tape substrate 3 by reflowing (good ball electrodes, good external terminals). ) 5a, since the connection strength by solder bonding is high, even if the pressure of the fluid 31 is applied, it does not leave the bump land 3g of the tape substrate 3 and is not removed (missed).

  In this way, only the unbonded solder balls 5b among the solder balls 5 can be removed in the screening step of Step S8.

  Unlike the present embodiment, for example, when the solder ball 5 is screened by applying a shearing force (moving force) to the solder ball 5 using an elastic sheet such as a rubber sheet, the elastic sheet Since it wears out, it needs to be replaced regularly. In addition, if the elastic sheet is used for screening while being worn, there is a possibility that the shearing force (moving force) acting on the solder ball 5 may fluctuate for each screening process. This may reduce the accuracy of screening of the solder balls 5.

  In this embodiment, since the solder balls 5 are screened using the fluid 31 discharged from the nozzles 32, the nozzles 32 need not be periodically replaced even if the screening process is repeated. Further, when a liquid is used as the fluid 31, it can be circulated and reused. In addition, it is easy to realize the same screening conditions for each screening process when the screening process is repeatedly performed without causing deterioration or wear, and the fluid 31 always applies a uniform pressure to the solder balls 5. As a result, the external force (moving force) acting on each solder ball 5 can be made uniform. That is, the pressure of the fluid 31 acting on the solder ball does not fluctuate for each screening process, and the pressure of the fluid 31 acting on each solder ball 5 can be made uniform. For this reason, the unbonded solder ball 5b can be accurately removed from the solder balls 5, and the unbonded solder ball 5b remains on the bump land 3g of the tape substrate 3 without being removed after the screening process. Can be prevented.

  Thus, in this embodiment, the accuracy of screening of the solder balls 5 is improved, and the unbonded solder balls 5b of the solder balls 5 can be accurately removed in the screening process. It is possible to prevent the outflow of defective products to the subsequent process due to unjoined external terminals. In addition, it is possible to accurately prevent the external terminals such as the solder balls 5 from being lost during the subsequent process. As a result, it is possible to prevent the defective product from flowing out to the customer due to the non-bonding of the external terminals, thereby improving the reliability of the product. It can be improved accurately.

  In addition, when a liquid such as water or a cleaning liquid is used for the fluid 31, a bead material can be contained in the fluid 31. For example, resin beads having a diameter of about 0.1 to 0.2 mm can be used as the bead material. Thereby, when the fluid 31 discharged from the nozzle 32 collides with the solder ball 5, the pressure (impact) applied to the solder ball 5 can be increased. For this reason, the unjoined solder ball 5b can be removed more accurately.

  Further, when a liquid such as water or a cleaning liquid is used for the fluid 31, ultrasonic vibration can be applied to the solder ball 5 from the nozzle 32 through the fluid 31. By applying or applying ultrasonic waves, the unbonded solder ball 5b is easily moved (can be easily removed), and the unbonded solder ball 5b is moved and removed by the pressure of the fluid 31, so that the unbonded solder ball 5b is more accurately unbonded. The solder ball 5b can be removed.

  Also, a liquid or a cleaning liquid (for example, an alkaline cleaning liquid) that can dissolve the flux in the fluid 31 can be used. Since the unbonded solder ball 5b is attached to the bump land 3g of the tape substrate 3 by the flux, the flux is dissolved by supplying a cleaning liquid (fluid 31) capable of dissolving the flux to the solder ball 5, and the unbonded solder The ball 5b can be moved easily, and the unbonded solder ball 5b can be moved and removed by the pressure of the fluid 31. Thereby, the unjoined solder ball 5b can be removed more accurately.

  In addition, when a gas such as air (air) is used for the fluid 31, a heated gas such as hot air (heated air) can also be used. Since the unbonded solder balls 5b are attached to the bump lands 3g of the tape substrate 3 by flux, the fluid 31 made of a heated gas such as hot air is discharged from the nozzle 32 and applied to the solder balls 5 to thereby apply the flux. The unbonded solder ball 5b can be easily moved by melting by heating (or reducing the viscosity), and the unbonded solder ball 5b can be moved and removed by the pressure of hot air (fluid 31). Thereby, the unjoined solder ball 5b can be removed more accurately. At this time, the temperature of the hot air (fluid 31) is adjusted so that the solder material itself of the solder balls 5 is not melted and the temperature of the flux decreases. If air (air) or hot air (heated air) is used as the fluid 31, the manufacturing cost of the semiconductor device can be reduced.

  Instead of using a heated gas such as hot air for the fluid 31, a heating device such as a heater is built in the stage 20, and the semiconductor device main body 1a disposed on the stage 20 is heated while air (air) is used. A fluid 31 made of a gas can be discharged from the nozzle 32 and applied to the solder ball 5. Thereby, the flux is heated and melted (or the viscosity is lowered) to make the unbonded solder ball 5b easy to move, and the unbonded solder ball 5b can be moved and removed by the pressure of the fluid 31. The unbonded solder ball 5b can be removed accurately. When the stage 20 is heated, the temperature of the stage 20 is adjusted so that the solder material itself of the solder balls 5 is not melted and the viscosity of the flux is lowered.

  Further, a height control means (shaft) for changing the height of the nozzle 32 is provided, and the height of the nozzle 32 can be controlled (height control) manually or automatically. Also, the speed at which the nozzle 32 is moved can be made variable and controlled to a predetermined value (speed control). Further, the angle of the nozzle 32 is made variable by providing a member that makes the nozzle angle variable at the attachment portion of the nozzle 32, and the angle of the fluid 31 supplied to the back surface 3b of the tape substrate 3 is set to a predetermined value. It can be controlled (angle control). These can be adjusted according to the diameter, pitch, etc. of the solder balls 5, and the solder balls 5 can be screened under conditions that allow the unbonded solder balls 5b to be accurately removed.

(Embodiment 3)
FIGS. 15 and 16 are explanatory views (side views of essential parts) of the screening step (step S8) in another embodiment of the present invention, and are partially enlarged views of FIGS. 10 to 12 in the first embodiment. Correspond.

  The present embodiment is the same as the first embodiment except for the screening process of step S8 (the screening process of the solder balls 5) in the structure of the semiconductor device and the manufacturing process of the semiconductor device. Is omitted.

  In this embodiment, after joining the solder ball 5 as an external terminal to the semiconductor device main body 1a (the bump land 3g of the tape substrate 3) in step S5 and step S6, one member is used in the screening process shown in step S8. The external force (moving force) is not sequentially applied to the plurality of solder balls 5 by using the plurality of solder balls 5, but a plurality of members respectively corresponding to the plurality of solder balls 5 are used to apply a plurality of solder balls 5 to the solder balls 5 at a time. Then, an external force (moving force) is applied to remove the unbonded solder balls 5b from the solder balls 5. For example, as shown in FIG. 15, the tape substrate 3 (multiple substrate 13) is arranged on the stage 20 so that the solder balls 5 face upward, and the socket terminals 41 correspond to the pitch of the solder balls 5. The provided support plate (support member) 42 is prepared, the support plate 42 is brought close to, and the solder balls 5 are sandwiched between the socket terminals 41. An external force (moving force) from the side is applied to the solder balls 5 sandwiched between the socket terminals 41 by the socket terminals 41.

  At this time, if the solder ball 5 that is about to be sandwiched in contact with the socket terminal 41 is an unbonded solder ball 5b, the unbonded solder ball 5b is applied to the tape substrate 3 by an external force applied by the socket terminal 41. The bump land 3g is separated, whereby the unbonded solder ball 5b can be removed (can be omitted). Further, if the solder ball 5 that is about to be sandwiched in contact with the socket terminal 41 is a non-defective solder ball 5a that is appropriately attached (joined) to the bump land 3g of the tape substrate 3 by reflow, solder bonding 5 Since the connection strength is high, even if an external force is applied by the socket terminal 41, it is not separated from the bump land 3 g of the tape substrate 3 and is not removed (not missing).

  Then, as shown in FIG. 16, when the support plate 42 is moved upward and separated from the tape substrate 3 (multiple substrate 13), the socket terminal 41 is also moved upward together with the support plate 42, and each solder ball 5, each socket terminal 41 is separated. At this time, if the solder ball 5 sandwiched between the socket terminals 41 is a good solder ball 5a appropriately attached (joined) to the bump land 3g of the tape substrate 3, the connection strength by solder joining is high. Even if the terminal 41 moves upward, it does not leave the bump land 3g of the tape substrate 3.

  In this manner, the socket terminals 41 corresponding to the solder balls 5 are allowed to act on the solder balls 5 so that the unbonded solder balls 5b of the solder balls 5 can be removed (missed) from the semiconductor device body 1a.

  Unlike the present embodiment, for example, when the solder ball 5 is screened by applying a shearing force (moving force) to the solder ball 5 using an elastic sheet such as a rubber sheet, the elastic sheet The elastic sheet does not come into good contact with some of the solder balls 5 due to wear or the like, and the solder balls 5 to which no external force is applied are generated, and a part of the unbonded solder balls 5b is not removed after the screening process. 3 may remain on the bump land 3g.

  In the present embodiment, a plurality of socket terminals 41 are provided corresponding to the plurality of solder balls 5, and the socket terminals 41 are simultaneously brought into contact with the solder balls 5 to apply an external force. For this reason, an external force can be applied to all the solder balls 5 by the socket terminals 41, and it is possible to prevent the solder balls 5 from being applied with no external force. Therefore, an external force can be applied to all the unbonded solder balls 5b to accurately remove them. Thereby, the precision of the screening of the solder ball 5 can be improved.

  In addition, the screening process of the solder ball 5 in step S8 can be performed while performing a cleaning process using a cleaning solution (for example, an alkaline cleaning solution) that can dissolve the flux. Since the unbonded solder balls 5b are attached to the bump lands 3g of the tape substrate 3 by the flux, by supplying a cleaning solution capable of dissolving the flux to the solder balls 5, the flux is dissolved and the unbonded solder balls 5b move. In a state in which the solder ball 5 is easily formed, the solder balls 5 are screened as described above, and the unbonded solder balls 5b can be moved and removed. Thereby, the unjoined solder ball 5b can be removed more accurately.

(Embodiment 4)
FIG. 17 is an explanatory diagram of the screening step (step S8) in another embodiment of the present invention, and corresponds to FIGS. 10 to 12 in the first embodiment.

  The present embodiment is the same as the first embodiment except for the screening process of step S8 (the screening process of the solder balls 5) in the structure of the semiconductor device and the manufacturing process of the semiconductor device. Is omitted. In the first embodiment, the region of each tape substrate 3 of the multi-chip substrate 13 is resin-sealed in the resin sealing step of step S3, and the sealing portion 7 is provided for each tape substrate 3, that is, a semiconductor device. Although the case where each main body 1a is formed individually has been described, in the present embodiment, as shown in FIG. 17, the whole area of the plurality of tape substrates 3 constituting the multi-chip substrate 13 is collectively covered. Resin sealing is performed to form a sealing portion 7 collectively for a plurality of tape substrates 3, that is, a plurality of semiconductor device main bodies 1a. For this reason, in the tape cut process of step S9, the sealing part 7 is cut into each semiconductor device region (CSP region) together with the multi-chip substrate 13, and is cut and separated into individual semiconductor device bodies 1a, that is, the semiconductor devices 1. The

  In this embodiment, after the solder ball 5 as an external terminal is joined to the semiconductor device main body 1a (the bump land 3g of the tape substrate 3) in step S5 and step S6, the tape substrate 3 in the screening process shown in step S8. The (multiple substrate 13) is arranged on a stage (mounting table) 50 so that the solder balls 5 face upward. As shown in FIG. 17, the stage 50 has a suction hole 50a for vacuum suction. Is formed. The tape substrate 3 is disposed on the stage 50, and the sealing portion 7 and the tape substrate 3 (that is, the semiconductor device main body 1a) are fixed by sucking the sealing portion 7 by suction from the suction holes 50a. Then, the solder balls 5 are screened in a state where the semiconductor device body 1a is adsorbed and fixed.

  The solder ball 5 can be screened in the same manner as in the first to third embodiments except that the solder ball 5 is screened in a state where the semiconductor device body 1a (sealing portion 7) is adsorbed and fixed. For example, as a screening member, an adhesive such as the adhesive tape 21 and the adhesive roller 22 can be used as in the first embodiment, and the fluid 31 discharged from the nozzle 32 as in the second embodiment. Or a plurality of socket terminals 41 provided corresponding to the solder balls 5 as in the third embodiment, but detailed description thereof is omitted here.

  If the sealing portion 7 is warped during the screening of the solder balls 5, the tape substrate 3 is also warped, and the load (moving force) applied to each solder ball 5 may be non-uniform. For this reason, there is a possibility that a part of the unbonded solder ball 5b is not removed after the screening process and remains on the bump land 3g of the tape substrate 3. In this embodiment, since the solder balls 5 are screened while the sealing portions 7 are vacuum-adsorbed, the sealing portions 7 and the tape substrate 3 (that is, the semiconductor device main body 1a) warp when the solder balls 5 are screened. Can be prevented. For this reason, the load (moving force) applied to each solder ball 5 during screening of the solder balls 5 can be made more uniform, and the unbonded solder balls 5b can be more accurately removed. Therefore, the accuracy of screening of the solder balls 5 can be improved.

  In addition, when manufacturing a semiconductor device having a large planar size of the sealing portion 7, the sealing portion 7 is likely to warp, and thus it is more preferable to apply this embodiment. In addition, since the semiconductor device in the MAP (Mold Array Package) form has a large planar dimension of the sealing part (sealing resin part) before cutting, it tends to warp. If this embodiment is applied and the solder ball is screened while adsorbing the sealing portion after the solder ball is formed and before the sealing portion is cut, the effect is particularly great.

  In addition, a heating device such as a heater can be incorporated in the stage 50, and the solder balls 5 can be screened while heating the semiconductor device body 1a. Since the unbonded solder balls 5b are attached to the bump lands 3g of the tape substrate 3 by flux, the flux attached to the semiconductor device body 1a disposed on the stage 50 is heated by heating the stage 50. It can melt | dissolve (or reduce a viscosity) and can be in the state which the unjoined solder ball 5b tends to move. By screening the solder balls 5 in such a state, the unbonded solder balls 5b can be more accurately removed. Therefore, the accuracy of screening of the solder balls 5 can be improved. When the stage 50 is heated, the temperature of the stage 50 is adjusted so that the solder material itself of the solder balls 5 is not melted and the viscosity of the flux is lowered.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  In the above embodiment, the case where the present invention is applied to a CSP type semiconductor device has been described. However, the present invention is not limited to this, and any semiconductor device having a structure in which external terminals are joined may be used. It can be applied to semiconductor devices in various semiconductor package forms such as a ball grid array) or a wafer level package manufactured by dicing after forming rewiring in a semiconductor wafer state and providing ball electrodes.

  In the above embodiment, the case where the solder ball 5 is used as the external terminal of the semiconductor device has been described. However, a ball electrode other than the solder ball, for example, a ball electrode such as gold or copper is used as the external terminal of the semiconductor device. In addition, the present invention can also be applied to the case where an electrode or a terminal other than the ball electrode, such as a lead terminal, is used as the external terminal.

  In the embodiment, the case where the chip support substrate used in the semiconductor device is a thin film tape substrate 3 made of polyimide tape or the like has been described. However, the chip support substrate is a substrate formed of glass-filled epoxy resin or the like. Various substrates can be used.

  In the above embodiment, the case where individual semiconductor devices are manufactured from the multiple tape-shaped multiple substrate 13 having a plurality of tape substrates 3 has been described. The substrate 13 is not necessarily used. A tape substrate 3 that has been cut and separated into one semiconductor device 1 is prepared in advance, the tape substrate 3 is used, and the solder balls 5 are screened to obtain a semiconductor. The device 1 can also be manufactured.

  The present invention is effective when applied to a semiconductor device having a structure in which external terminals such as ball electrodes are joined.

It is sectional drawing which shows the structure of the semiconductor device manufactured according to the manufacturing method of the semiconductor device which is one embodiment of this invention. It is a manufacturing process flowchart which shows an example of the manufacturing process of the semiconductor device which is one embodiment of this invention. It is sectional drawing in the manufacturing process of the semiconductor device which is one embodiment of this invention. FIG. 4 is a cross-sectional view of the semiconductor device during a manufacturing step following that of FIG. 3; FIG. 5 is a cross-sectional view of the semiconductor device during a manufacturing step following that of FIG. 4; FIG. 6 is a cross-sectional view of the semiconductor device during a manufacturing step following that of FIG. 5; FIG. 7 is a cross-sectional view of the semiconductor device during a manufacturing step following that of FIG. 6; FIG. 8 is a cross-sectional view of the semiconductor device during a manufacturing step following that of FIG. 7; FIG. 9 is a cross-sectional view of the semiconductor device during a manufacturing step following that of FIG. 8; It is explanatory drawing of a screening process. It is explanatory drawing of a screening process. It is explanatory drawing of a screening process. It is a process flow figure from a screening process to a tape cut process. It is explanatory drawing of the screening process in other embodiment of this invention. It is explanatory drawing of the screening process in other embodiment of this invention. It is explanatory drawing of the screening process in other embodiment of this invention. It is explanatory drawing of the screening process in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 1a Semiconductor device main body 2 Semiconductor chip 2a Electrode 2b Front surface 2c Back surface 3 Tape substrate 3a Chip support surface 3b Back surface 3c Connection terminal 3d Resist film 3e Wiring lead 3f Tape base material 3g Bump land 4 Bonding wire 5 Solder ball 5a Good product solder Ball 5b Unbonded solder ball 6 Die bond material 7 Sealing part 13 Multiple substrate 17 Mark 20 Stage 21 Adhesive tape 21a Surface 22 Adhesive roller 22a Surface 31 Fluid 32 Nozzle 41 Socket terminal 42 Support plate 50 Stage 50a Adsorption hole

Claims (5)

Bonding a plurality of external terminals to a semiconductor device body having a semiconductor chip;
Removing the unjoined external terminals that are not joined to the semiconductor device body from among the external terminals by moving the sticky substance after bringing the sticky substance into contact with the plurality of external terminals;
A method for manufacturing a semiconductor device, comprising: Bonding a plurality of external terminals to a semiconductor device body having a semiconductor chip;
A step of causing a fluid to collide with the plurality of external terminals and removing unjoined external terminals that are not joined to the semiconductor device body among the external terminals;
A method for manufacturing a semiconductor device, comprising: Bonding a plurality of external terminals to a semiconductor device body having a semiconductor chip;
A plurality of members respectively corresponding to the plurality of external terminals are prepared, an external force is applied by bringing the plurality of members into contact with the corresponding external terminals, and the external terminals are not joined to the semiconductor device body. Removing unbonded external terminals;
A method for manufacturing a semiconductor device, comprising: Bonding a plurality of external terminals to a semiconductor device body having a semiconductor chip;
Applying an external force to the plurality of external terminals while adsorbing the semiconductor device body, and removing unbonded external terminals not bonded to the semiconductor device body among the external terminals;
A method for manufacturing a semiconductor device, comprising: Bonding a plurality of external terminals to a semiconductor device body having a semiconductor chip;
Applying an external force to the plurality of external terminals while heating to remove unbonded external terminals that are not bonded to the semiconductor device body among the external terminals;
A method for manufacturing a semiconductor device, comprising:

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