JP2005153369A

JP2005153369A - Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head

Info

Publication number: JP2005153369A
Application number: JP2003396479A
Authority: JP
Inventors: Tetsuji Takahashi; 哲司高橋; Takashi Nakamura; 隆志中村; Toshinao Shinpo; 俊尚新保; Isao Takimoto; 勲瀧本
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2003-11-27
Filing date: 2003-11-27
Publication date: 2005-06-16

Abstract

【課題】ノズル詰まり等の吐出不良を確実に防止することができる液体噴射ヘッド及び液体噴射装置並びに液体噴射ヘッドの製造方法を提供する。
【解決手段】液体を噴射するノズル開口２１に連通する圧力発生室１２が形成される流路形成基板１０と、流路形成基板１０の一方面側に振動板を介して圧力発生室１２内に圧力変化を生じさせる圧電素子３００とを具備する液体噴射ヘッドにおいて、流路形成基板１０には、圧力発生室１２の長手方向一端部に連通する連通部１３が設けられ、流路形成基板１０の圧電素子３００側の面には、連通部１３に連通するリザーバ部３１を有するリザーバ形成基板３０が接合されており、リザーバ部３１と連通部１３との境界に対応する領域には、少なくとも振動板を貫通する貫通部１１０が設けられ、貫通部１１０の内側の縁面を流路形成基板１０とリザーバ形成基板３０とを接合する接合部材３５（３５ａ）によって覆うようにする。
【選択図】図２
PROBLEM TO BE SOLVED: To provide a liquid ejecting head, a liquid ejecting apparatus, and a liquid ejecting head manufacturing method capable of reliably preventing ejection failure such as nozzle clogging.
SOLUTION: A flow path forming substrate 10 in which a pressure generating chamber 12 communicating with a nozzle opening 21 for ejecting liquid is formed, and one side of the flow path forming substrate 10 in the pressure generating chamber 12 via a vibration plate. In the liquid jet head including the piezoelectric element 300 that causes a pressure change, the flow path forming substrate 10 is provided with a communication portion 13 that communicates with one end in the longitudinal direction of the pressure generating chamber 12. A reservoir forming substrate 30 having a reservoir portion 31 communicating with the communicating portion 13 is joined to the surface on the piezoelectric element 300 side, and at least a diaphragm is provided in a region corresponding to the boundary between the reservoir portion 31 and the communicating portion 13. A penetrating portion 110 penetrating the substrate 110 is provided, and an inner edge surface of the penetrating portion 110 is covered with a joining member 35 (35a) for joining the flow path forming substrate 10 and the reservoir forming substrate 30.
[Selection] Figure 2

Description

本発明は、液体を噴射する液体噴射ヘッド及び液体噴射装置並びに液体噴射ヘッドの製造方法に関し、特に、インク滴を吐出するノズル開口と連通する圧力発生室に供給されたインクを圧電素子によって加圧することにより、ノズル開口からインク滴を吐出させるインクジェット式記録ヘッド及びインクジェット式記録装置並びにインクジェット式記録ヘッドの製造方法に関する。 The present invention relates to a liquid ejecting head that ejects liquid, a liquid ejecting apparatus, and a method for manufacturing a liquid ejecting head, and in particular, pressurizes ink supplied to a pressure generating chamber that communicates with a nozzle opening that ejects ink droplets using a piezoelectric element. The present invention relates to an ink jet recording head, an ink jet recording apparatus, and an ink jet recording head manufacturing method for ejecting ink droplets from nozzle openings.

液体噴射装置としては、例えば、圧電素子や発熱素子によりインク滴吐出のための圧力を発生させる複数の圧力発生室と、各圧力発生室にインクを供給する共通のリザーバと、各圧力発生室に連通するノズル開口とを備えたインクジェット式記録ヘッドを具備するインクジェット式記録装置があり、このインクジェット式記録装置では、印字信号に対応するノズル開口と連通した圧力発生室のインクに吐出エネルギを印加してノズル開口からインク滴を吐出させる。 As the liquid ejecting apparatus, for example, a plurality of pressure generating chambers that generate pressure for ejecting ink droplets by piezoelectric elements or heat generating elements, a common reservoir that supplies ink to each pressure generating chamber, and each pressure generating chamber There is an ink jet recording apparatus that includes an ink jet recording head having a nozzle opening that communicates with the ink jet recording apparatus. The ink jet recording apparatus applies ejection energy to ink in a pressure generating chamber that communicates with a nozzle opening corresponding to a print signal. Ink droplets are ejected from the nozzle openings.

インク滴を吐出するノズル開口と連通する圧力発生室の一部を振動板で構成し、この振動板を圧電素子により変形させて圧力発生室のインクを加圧してノズル開口からインク滴を吐出させるインクジェット式記録ヘッドには、圧電素子の軸方向に伸長、収縮する縦振動モードの圧電アクチュエータを使用したものと、たわみ振動モードの圧電アクチュエータを使用したものの２種類が実用化されている。 A part of the pressure generation chamber communicating with the nozzle opening for discharging ink droplets is constituted by a vibration plate, and the vibration plate is deformed by a piezoelectric element to pressurize the ink in the pressure generation chamber to discharge ink droplets from the nozzle opening. Two types of ink jet recording heads have been put into practical use: those using a longitudinal vibration mode piezoelectric actuator that extends and contracts in the axial direction of the piezoelectric element, and those using a flexural vibration mode piezoelectric actuator.

前者は圧電素子の端面を振動板に当接させることにより圧力発生室の容積を変化させることができて、高密度印刷に適したヘッドの製作が可能である反面、圧電素子をノズル開口の配列ピッチに一致させて櫛歯状に切り分けるという困難な工程や、切り分けられた圧電素子を圧力発生室に位置決めして固定する作業が必要となり、製造工程が複雑であるという問題がある。 The former can change the volume of the pressure generation chamber by bringing the end face of the piezoelectric element into contact with the vibration plate, and it is possible to manufacture a head suitable for high-density printing, while the piezoelectric element is arranged in an array of nozzle openings. There is a problem that the manufacturing process is complicated because a difficult process of matching the pitch into a comb-like shape and an operation of positioning and fixing the cut piezoelectric element in the pressure generating chamber are necessary.

これに対して後者は、圧電材料のグリーンシートを圧力発生室の形状に合わせて貼付し、これを焼成するという比較的簡単な工程で振動板に圧電素子を作り付けることができるものの、たわみ振動を利用する関係上、ある程度の面積が必要となり、高密度配列が困難であるという問題がある。 On the other hand, the latter can flexibly vibrate, although a piezoelectric element can be built on the diaphragm by a relatively simple process of sticking a green sheet of piezoelectric material according to the shape of the pressure generation chamber and firing it. There is a problem that a certain amount of area is required for the use of, and high-density arrangement is difficult.

一方、後者の記録ヘッドの不都合を解消すべく、振動板の表面全体に亙って成膜技術により均一な圧電材料層を形成し、この圧電材料層をリソグラフィ法により圧力発生室に対応する形状に切り分けて各圧力発生室毎に独立するように圧電素子を形成することで高密度配列を実現したものがある。 On the other hand, in order to eliminate the disadvantages of the latter recording head, a uniform piezoelectric material layer is formed over the entire surface of the diaphragm by a film forming technique, and this piezoelectric material layer is shaped to correspond to the pressure generating chamber by lithography. In some cases, a high-density array is realized by forming piezoelectric elements so that each pressure generating chamber is independent.

また、このようなインクジェット式記録ヘッドとしては、ノズル開口に連通する圧力発生室が形成される流路形成基板の圧電素子側にリザーバの一部を構成するリザーバ部を有するリザーバ形成基板を設け、振動板に形成された貫通部を介してリザーバ部と圧力発生室とを連通した構造が提案されている（例えば、特許文献１参照）。 Further, as such an ink jet recording head, a reservoir forming substrate having a reservoir portion constituting a part of the reservoir is provided on the piezoelectric element side of the flow path forming substrate in which a pressure generating chamber communicating with the nozzle opening is formed, There has been proposed a structure in which a reservoir portion and a pressure generation chamber are communicated with each other through a penetrating portion formed in a diaphragm (see, for example, Patent Document 1).

しかしながら、このようなインクジェット式記録ヘッドでは、貫通部は振動板を機械的に加工することによって形成されている。このような機械的な加工では、加工カスが圧力発生室などの流路形成基板内から排除し難く、流路形成基板内に残留した加工カスによってノズル開口が塞がれて吐出不良が発生してしまうという問題がある。また、貫通部を機械的に加工することにより形成すると、貫通部の周囲に亀裂等が発生するという問題がある。この亀裂が発生した状態でインクを充填して吐出させると、振動板の亀裂等が生じている部分から破片が脱落し、この破片によってノズル開口が塞がれて吐出不良が発生するという問題がある。 However, in such an ink jet recording head, the through portion is formed by mechanically processing the diaphragm. In such mechanical processing, it is difficult to remove the processing residue from the inside of the flow path forming substrate such as the pressure generating chamber, and the nozzle opening is blocked by the processing residue remaining in the flow path forming substrate, resulting in a discharge failure. There is a problem that it ends up. In addition, when the through part is formed by mechanical processing, there is a problem that a crack or the like is generated around the through part. When ink is filled and discharged in the state where this crack has occurred, there is a problem in that debris will fall off from the cracked portion of the diaphragm and the nozzle opening will be blocked by this fragment, resulting in ejection failure. is there.

そこで、このような問題を解決するために、積層膜を機械的な加工によって貫通して形成された貫通部の周囲を保護膜によって覆うようにした構造が提案されている（例えば、特許文献２参照）。この構造によれば、貫通部の周囲がインクに曝されることがないため、その貫通部の周囲の亀裂等から発生した破片によってノズル開口が塞がれて吐出不良となるのを防止することができる。しかしながら、貫通部は振動板を機械的に加工することにより形成されることから、加工時の加工カスが流路形成基板内に残留するのを防止することはできない。したがって、加工カスによってノズル開口が塞がれて吐出不良が発生してしまうことまでは防止できない。また、積層膜の貫通部の周縁部はリザーバ内に残って突出しており、また、この貫通部は流路形成基板とリザーバ形成基板とを接合した後に形成する関係上、その後に貫通部の周縁部を保護膜で完全に覆うのは非常に困難であるという問題がある。また、このようにリザーバ内に積層膜が突出していると、リザーバ部から連通部へのインクの流れが妨げられ、インク供給不良となるという問題もある。なお、このような問題は、インクを吐出するインクジェット式記録ヘッドだけでなく、勿論、インク以外の液体を吐出する他の液体噴射ヘッドの製造方法においても、同様に存在する。 Therefore, in order to solve such a problem, a structure has been proposed in which the periphery of a penetrating portion formed by penetrating the laminated film by mechanical processing is covered with a protective film (for example, Patent Document 2). reference). According to this structure, since the periphery of the through portion is not exposed to ink, the nozzle opening is blocked by a fragment generated from a crack or the like around the through portion, thereby preventing ejection failure. Can do. However, since the penetrating portion is formed by mechanically processing the diaphragm, it is impossible to prevent the machining residue during processing from remaining in the flow path forming substrate. Therefore, it cannot be prevented that the nozzle opening is blocked by the machining residue and a discharge failure occurs. Further, the peripheral portion of the penetration portion of the laminated film remains in the reservoir and protrudes, and this penetration portion is formed after the flow path forming substrate and the reservoir formation substrate are joined. There is a problem that it is very difficult to completely cover the portion with a protective film. Further, when the laminated film protrudes into the reservoir as described above, there is a problem that the ink flow from the reservoir portion to the communication portion is hindered, resulting in an ink supply failure. Such a problem exists not only in an ink jet recording head that ejects ink, but also in a method of manufacturing another liquid ejecting head that ejects liquid other than ink.

特開２０００−２９６６１６号公報（第８−９頁、第１−２図）JP 2000-296616 A (page 8-9, FIG. 1-2) 特開２００３−１５９８０１号公報（第７−８頁、第８図）JP 2003-159801 A (pages 7-8, FIG. 8)

本発明は、このような事情に鑑み、ノズル詰まり等の吐出不良を確実に防止することができる液体噴射ヘッド及び液体噴射装置並びに液体噴射ヘッドの製造方法を提供することを課題とする。 In view of such circumstances, it is an object of the present invention to provide a liquid ejecting head, a liquid ejecting apparatus, and a method for manufacturing the liquid ejecting head that can reliably prevent ejection failure such as nozzle clogging.

上記課題を解決する本発明の第１の態様は、液体を噴射するノズル開口に連通する圧力発生室が形成される流路形成基板と、該流路形成基板の一方面側に振動板を介して前記圧力発生室内に圧力変化を生じさせる圧電素子とを具備する液体噴射ヘッドにおいて、前記流路形成基板には、前記圧力発生室の長手方向一端部に連通する連通部が設けられ、当該流路形成基板の前記圧電素子側の面には、前記連通部に連通するリザーバ部を有するリザーバ形成基板が接合されており、前記リザーバ部と前記連通部との境界に対応する領域には、少なくとも前記振動板を貫通する貫通部が設けられ、当該貫通部の内側の縁面が前記流路形成基板と前記リザーバ形成基板とを接合する接合部材により覆われていることを特徴とする液体噴射ヘッドにある。
かかる第１の態様では、貫通部の内側の縁面が接合部材によって覆われるため、その貫通部の縁面からその内部に液体が浸漬することがない。このため、液体の浸漬による膜剥がれ等が防止され、膜剥がれ等によって異物が発生することがなく、異物によるノズル詰まり等の吐出不良が確実に防止される。 According to a first aspect of the present invention for solving the above problem, a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening for ejecting liquid is formed, and a diaphragm is provided on one surface side of the flow path forming substrate. In the liquid jet head including a piezoelectric element that causes a pressure change in the pressure generation chamber, the flow path forming substrate is provided with a communication portion that communicates with one end portion in the longitudinal direction of the pressure generation chamber. A reservoir forming substrate having a reservoir portion communicating with the communicating portion is joined to the surface of the path forming substrate on the piezoelectric element side, and an area corresponding to a boundary between the reservoir portion and the communicating portion includes at least A liquid ejecting head, wherein a penetrating portion that penetrates the diaphragm is provided, and an inner edge surface of the penetrating portion is covered with a joining member that joins the flow path forming substrate and the reservoir forming substrate. It is in
In the first aspect, since the inner edge surface of the penetrating portion is covered with the joining member, the liquid is not immersed in the inside from the edge surface of the penetrating portion. For this reason, film peeling or the like due to liquid immersion is prevented, foreign matter is not generated due to film peeling or the like, and ejection failure such as nozzle clogging due to foreign matter is reliably prevented.

本発明の第２の態様は、第１の態様において、前記貫通部の前記連通部側の開口領域が前記連通部の前記振動板側の開口領域よりも大きく形成されていることを特徴とする液体噴射ヘッドにある。
かかる第２の態様では、振動板がリザーバ内に突出しないため、リザーバ部内から連通部に供給される液体の流れを妨げることがなく、液体の供給不良が防止される。 According to a second aspect of the present invention, in the first aspect, an opening area of the penetrating portion on the side of the communicating portion is formed larger than an opening area of the communicating portion on the diaphragm side. Located in the liquid jet head.
In the second aspect, since the diaphragm does not protrude into the reservoir, the flow of the liquid supplied from the reservoir portion to the communicating portion is not hindered, and liquid supply failure is prevented.

本発明の第３の態様は、第１又は２の態様において、前記貫通部の前記リザーバ部側の開口領域が前記リザーバ部の前記貫通部側の開口領域よりも大きく形成されていることを特徴とする液体噴射ヘッドにある。
かかる第３の態様では、接合部材のはみ出しによって貫通部の内側の縁面が確実に覆われる。 According to a third aspect of the present invention, in the first or second aspect, an opening area of the penetrating part on the reservoir part side is formed larger than an opening area of the reservoir part on the penetrating part side. It is in the liquid jet head.
In the third aspect, the inner edge surface of the penetrating portion is reliably covered by the protrusion of the joining member.

本発明の第４の態様は、第１〜３の何れかの態様において、前記貫通部の前記連通部側の開口領域よりも前記リザーバ部側の開口領域が大きく形成されていることを特徴とする液体噴射ヘッドにある。
かかる第４の態様では、貫通部の内側の縁面の表面積が大きくなるため、流路形成基板とリザーバ形成基板との接合領域が大きくなり、ヘッドの剛性が高められる。 According to a fourth aspect of the present invention, in any one of the first to third aspects, an opening region on the reservoir portion side is formed larger than an opening region on the communication portion side of the penetrating portion. In the liquid jet head.
In the fourth aspect, since the surface area of the inner edge surface of the penetrating portion is increased, the bonding area between the flow path forming substrate and the reservoir forming substrate is increased, and the rigidity of the head is increased.

本発明の第５の態様は、第４の態様において、前記貫通部は前記振動板をエッチングにより貫通して形成されたものであり、且つ当該貫通部の内側の縁面は、前記連通部側の開口領域及び前記リザーバ部側の開口領域の大小により前記リザーバ部側に向かって階段状に漸大した形状となっていることを特徴とする液体噴射ヘッドにある。
かかる第５の態様では、貫通部の内側の縁面の表面積が大きくなるため、流路形成基板とリザーバ形成基板との接合領域が大きくなり、ヘッドの剛性が高められる。 According to a fifth aspect of the present invention, in the fourth aspect, the penetrating portion is formed by etching through the diaphragm, and an inner edge surface of the penetrating portion is on the side of the communicating portion. According to another aspect of the invention, the liquid ejecting head has a stepped shape toward the reservoir portion side depending on the size of the opening region and the opening region on the reservoir portion side.
In the fifth aspect, since the surface area of the inner edge surface of the penetrating portion is increased, the bonding area between the flow path forming substrate and the reservoir forming substrate is increased, and the rigidity of the head is increased.

本発明の第６の態様は、第１〜５の何れかの態様の液体噴射ヘッドを具備することを特徴とする液体噴射装置にある。
かかる第６の態様では、信頼性を向上した液体噴射装置が比較的容易に実現される。 According to a sixth aspect of the invention, there is provided a liquid ejecting apparatus including the liquid ejecting head according to any one of the first to fifth aspects.
In the sixth aspect, the liquid ejecting apparatus with improved reliability can be realized relatively easily.

本発明の第７の態様は、液体を噴射するノズル開口に連通する圧力発生室が形成される流路形成基板と、該流路形成基板の一方面側に振動板を介して前記圧力発生室内に圧力変化を生じさせる圧電素子と、前記流路形成基板の前記圧電素子側の面に接合されて各圧力発生室の共通の液体室であるリザーバの一部を構成するリザーバ部が設けられたリザーバ形成基板とを具備する液体噴射ヘッドの製造方法において、前記流路形成基板の一方面側に前記振動板及び前記圧電素子を形成する工程と、前記流路形成基板の前記圧力発生室の長手方向一端部に連通する連通部を形成する領域に対向する部分の少なくとも前記振動板を厚さ方向に貫通して貫通部を形成する工程と、前記流路形成基板と前記リザーバ形成基板とを接合する接合部材により前記貫通部の内側の縁面を覆うと共に前記流路形成基板の前記圧電素子側の面上に前記リザーバ形成基板を接合する工程と、前記流路形成基板の他方面側からのエッチングにより前記貫通部を介して前記リザーバ部に連通する前記連通部及び前記圧力発生室を形成する工程とを具備することを特徴とする液体噴射ヘッドの製造方法にある。
かかる第７の態様では、振動板及び圧電素子を形成する際に貫通部をエッチングにより形成するため、従来の連通部を形成した後の機械的な加工による膜破り工程を省略でき、製造工程が簡略化される。また、貫通部をエッチングにより形成するため、ヘッド製造時に異物の発生がなく、異物によるヘッドの組み立て不良が低減される。さらに、貫通部の内側の縁面が接合部材によって覆われるため、貫通部の縁面からその内部に液体が浸漬することがない。このため、液体の浸漬による膜剥がれ等が防止され、膜剥がれ等によって異物が発生することがなく、異物によるノズル詰まり等の吐出不良が確実に防止される。 According to a seventh aspect of the present invention, there is provided a flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening for ejecting liquid is formed, and the pressure generating chamber via a diaphragm on one surface side of the flow path forming substrate. A piezoelectric element that causes a pressure change in the substrate, and a reservoir part that is bonded to the surface of the flow path forming substrate on the piezoelectric element side and forms a part of a reservoir that is a common liquid chamber of each pressure generating chamber. In the method of manufacturing a liquid jet head including a reservoir forming substrate, the step of forming the diaphragm and the piezoelectric element on one surface side of the flow path forming substrate, and the length of the pressure generating chamber of the flow path forming substrate Forming a penetrating portion by penetrating at least the diaphragm in the thickness direction at a portion facing a region forming a communicating portion that communicates with one end in the direction, and joining the flow path forming substrate and the reservoir forming substrate Depending on the joining member The step of covering the inner edge surface of the penetrating portion and bonding the reservoir forming substrate on the surface of the flow path forming substrate on the piezoelectric element side, and the penetration by etching from the other surface side of the flow path forming substrate And a step of forming the communicating portion and the pressure generating chamber communicating with the reservoir portion via a portion.
In the seventh aspect, since the penetrating part is formed by etching when forming the diaphragm and the piezoelectric element, the film breaking process by mechanical processing after forming the conventional communicating part can be omitted, and the manufacturing process can be omitted. Simplified. In addition, since the penetrating portion is formed by etching, no foreign matter is generated when the head is manufactured, and the assembly failure of the head due to the foreign matter is reduced. Furthermore, since the inner edge surface of the penetrating portion is covered with the joining member, the liquid is not immersed in the inside from the edge surface of the penetrating portion. For this reason, film peeling or the like due to liquid immersion is prevented, foreign matter is not generated due to film peeling or the like, and ejection failure such as nozzle clogging due to foreign matter is reliably prevented.

本発明の第８の態様は、第７の態様において、前記リザーバ形成基板を接合する工程では、少なくとも前記振動板の面上と前記リザーバ部の前記流路形成基板側の開口縁部とを前記接合部材によって接合すると共に当該接合部材を前記振動板の面上から前記貫通部の内側の縁面に達するまではみ出させることを特徴とする液体噴射ヘッドの製造方法にある。
かかる第８の態様では、貫通部の内側の縁面がはみ出した接合部材によって比較的容易に覆われる。 According to an eighth aspect of the present invention, in the seventh aspect, in the step of joining the reservoir forming substrate, at least the surface of the diaphragm and the opening edge of the reservoir portion on the flow path forming substrate side are In the method of manufacturing a liquid ejecting head, the joining member is joined by the joining member and protrudes from the surface of the diaphragm until reaching the inner edge surface of the through portion.
In the eighth aspect, the inner edge surface of the penetrating portion is relatively easily covered with the protruding joining member.

本発明の第９の態様は、第７又は８の態様において、前記連通部及び前記圧力発生室を形成する工程では、前記流路形成基板の他方面側をエッチングして前記連通部の前記振動板側の開口領域を前記貫通部の前記連通部側の開口領域よりも小さく形成することを特徴とする液体噴射ヘッドの製造方法にある。
かかる第９の態様では、振動板がリザーバ内に突出して形成されることがないため、リザーバ部内から連通部に供給される液体の流れを妨げることがなく、液体の供給不良が防止される。 According to a ninth aspect of the present invention, in the seventh or eighth aspect, in the step of forming the communication portion and the pressure generating chamber, the other surface side of the flow path forming substrate is etched to cause the vibration of the communication portion. In the method of manufacturing a liquid jet head, the opening area on the plate side is formed to be smaller than the opening area on the side of the communicating portion of the penetrating portion.
In the ninth aspect, since the diaphragm does not protrude from the reservoir, the flow of the liquid supplied from the reservoir to the communicating portion is not hindered, and liquid supply failure is prevented.

本発明の第１０の態様は、第９の態様において、前記連通部を形成する工程では、少なくとも前記リザーバ部の内面を耐エッチング性の材料からなる保護膜で覆った状態で行うことを特徴とする液体噴射ヘッドの製造方法にある。
かかる第１０の態様では、リザーバ部の内面が保護膜で覆われるためエッチング液に曝されることがなく、保護膜によってリザーバ部が確実に保護される。 According to a tenth aspect of the present invention, in the ninth aspect, the step of forming the communicating portion is performed with at least the inner surface of the reservoir portion covered with a protective film made of an etching resistant material. A method of manufacturing a liquid jet head.
In the tenth aspect, since the inner surface of the reservoir portion is covered with the protective film, it is not exposed to the etching solution, and the reservoir portion is reliably protected by the protective film.

以下に本発明を実施形態に基づいて詳細に説明する。
（実施形態１）
図１は、本発明の実施形態１に係るインクジェット式記録ヘッドを示す分解斜視図であり、図２は、図１の平面図及び断面図である。図示するように、流路形成基板１０は、本実施形態では面方位（１１０）のシリコン単結晶基板からなり、その一方の面には予め熱酸化によって二酸化シリコンからなる厚さ１〜２μｍの弾性膜５０が形成されている。流路形成基板１０には、複数の圧力発生室１２がその幅方向に並設されている。また、流路形成基板１０の圧力発生室１２の長手方向外側の領域には連通部１３が形成され、連通部１３と各圧力発生室１２とが、各圧力発生室１２毎に設けられたインク供給路１４を介して連通されている。なお、連通部１３は、後述するリザーバ形成基板３０のリザーバ部３１と連通して各圧力発生室１２の共通のインク室となるリザーバ１００の一部を構成する。インク供給路１４は、圧力発生室１２よりも狭い幅で形成されており、連通部１３から圧力発生室１２に流入するインクの流路抵抗を一定に保持している。 Hereinafter, the present invention will be described in detail based on embodiments.
(Embodiment 1)
FIG. 1 is an exploded perspective view showing an ink jet recording head according to Embodiment 1 of the present invention, and FIG. 2 is a plan view and a cross-sectional view of FIG. As shown in the figure, the flow path forming substrate 10 is formed of a silicon single crystal substrate having a plane orientation (110) in this embodiment, and one surface thereof is previously formed of silicon dioxide by thermal oxidation and has a thickness of 1 to 2 μm. A film 50 is formed. A plurality of pressure generating chambers 12 are arranged in parallel in the width direction of the flow path forming substrate 10. In addition, a communication portion 13 is formed in a region outside the longitudinal direction of the pressure generation chamber 12 of the flow path forming substrate 10, and the communication portion 13 and each pressure generation chamber 12 are provided for each pressure generation chamber 12. Communication is made via a supply path 14. The communication unit 13 constitutes a part of the reservoir 100 that communicates with a reservoir unit 31 of the reservoir forming substrate 30 described later and serves as a common ink chamber for the pressure generation chambers 12. The ink supply path 14 is formed with a narrower width than the pressure generation chamber 12, and maintains a constant flow path resistance of ink flowing into the pressure generation chamber 12 from the communication portion 13.

また、流路形成基板１０の開口面側には、圧力発生室１２を形成する際のマスクとして用いられた絶縁膜５１を介して、各圧力発生室１２のインク供給路１４とは反対側の端部近傍に連通するノズル開口２１が穿設されたノズルプレート２０が接着剤や熱溶着フィルム等を介して固着されている。なお、ノズルプレート２０は、厚さが例えば、０．０１〜１ｍｍで、線膨張係数が３００℃以下で、例えば２．５〜４．５［×１０^-6／℃］であるガラスセラミックス、シリコン単結晶基板又は不錆鋼などからなる。 Further, on the opening surface side of the flow path forming substrate 10, an insulating film 51 used as a mask when forming the pressure generating chambers 12 is interposed on the side opposite to the ink supply path 14 of each pressure generating chamber 12. A nozzle plate 20 having a nozzle opening 21 communicating in the vicinity of the end is fixed through an adhesive, a heat-welded film, or the like. The nozzle plate 20 has a thickness of, for example, 0.01 to 1 mm, a linear expansion coefficient of 300 ° C. or less, for example, 2.5 to 4.5 [× 10 ⁻⁶ / ° C.], glass ceramics, silicon It consists of a single crystal substrate or non-rust steel.

一方、このような流路形成基板１０の開口面とは反対側には、上述したように、厚さが例えば約１．０μｍの弾性膜５０が形成され、この弾性膜５０上には、厚さが例えば、約０．４μｍの絶縁体膜５５が形成されている。さらに、この絶縁体膜５５上には、厚さが例えば、約０．２μｍの下電極膜６０と、厚さが例えば、約１．０μｍの圧電体層７０と、厚さが例えば、約０．０５μｍの上電極膜８０とが、後述するプロセスで積層形成されて、圧電素子３００を構成している。ここで、圧電素子３００は、下電極膜６０、圧電体層７０及び上電極膜８０を含む部分をいう。一般的には、圧電素子３００の何れか一方の電極を共通電極とし、他方の電極及び圧電体層７０を各圧力発生室１２毎にパターニングして構成する。そして、ここではパターニングされた何れか一方の電極及び圧電体層７０から構成され、両電極への電圧の印加により圧電歪みが生じる部分を圧電体能動部という。本実施形態では、下電極膜６０を圧電素子３００の共通電極とし、上電極膜８０を圧電素子３００の個別電極としているが、駆動回路や配線の都合でこれを逆にしても支障はない。何れの場合においても、各圧力発生室毎に圧電体能動部が形成されていることになる。また、ここでは、圧電素子３００と当該圧電素子３００の駆動により変位が生じる振動板とを合わせて圧電アクチュエータと称する。上述した例では、弾性膜５０及び絶縁体膜５５が振動板として作用するが、この絶縁体膜５５上に形成された下電極膜６０も振動板としての役割を果たす。 On the other hand, as described above, the elastic film 50 having a thickness of, for example, about 1.0 μm is formed on the side opposite to the opening surface of the flow path forming substrate 10. For example, an insulator film 55 having a thickness of about 0.4 μm is formed. Further, on the insulator film 55, a lower electrode film 60 having a thickness of, for example, about 0.2 μm, a piezoelectric layer 70 having a thickness of, for example, about 1.0 μm, and a thickness of, for example, about 0 The upper electrode film 80 having a thickness of 0.05 μm is laminated by a process described later to constitute the piezoelectric element 300. Here, the piezoelectric element 300 refers to a portion including the lower electrode film 60, the piezoelectric layer 70, and the upper electrode film 80. In general, one electrode of the piezoelectric element 300 is used as a common electrode, and the other electrode and the piezoelectric layer 70 are patterned for each pressure generating chamber 12. In addition, here, a portion that is configured by any one of the patterned electrodes and the piezoelectric layer 70 and in which piezoelectric distortion is generated by applying a voltage to both electrodes is referred to as a piezoelectric active portion. In the present embodiment, the lower electrode film 60 is used as a common electrode of the piezoelectric element 300 and the upper electrode film 80 is used as an individual electrode of the piezoelectric element 300. However, there is no problem even if this is reversed for convenience of a drive circuit and wiring. In either case, a piezoelectric active part is formed for each pressure generating chamber. Further, here, the piezoelectric element 300 and the vibration plate that is displaced by driving the piezoelectric element 300 are collectively referred to as a piezoelectric actuator. In the example described above, the elastic film 50 and the insulator film 55 act as a diaphragm, but the lower electrode film 60 formed on the insulator film 55 also serves as a diaphragm.

例えば、本実施形態では、下電極膜６０は、圧力発生室１２の長手方向では、圧力発生室１２に対向する領域の内側でパターニングされ、複数の圧力発生室１２に対応する領域に連続的に設けられている。また、下電極膜６０は、圧力発生室１２の列の外側の領域で流路形成基板１０の端部近傍まで延設され、その先端部が後述する駆動ＩＣ１２０から延設された接続配線１３０が接続される接続部６０ａとなっている。圧電体層７０及び上電極膜８０は、基本的には圧力発生室１２に対向する領域内に設けられているが、圧力発生室１２の長手方向では、圧力発生室１２に対向する領域よりも外側まで延設されており、下電極膜６０の一方の端面は圧電体層７０によって覆われている。また、上電極膜８０の一端部近傍にはリード電極９０が接続されている。このリード電極９０は、流路形成基板１０の端部近傍まで延設されており、その先端部は、下電極膜６０の接続部６０ａと同様に、接続配線１３０が接続される接続部９０ａとなっている。 For example, in the present embodiment, the lower electrode film 60 is patterned inside a region facing the pressure generation chamber 12 in the longitudinal direction of the pressure generation chamber 12, and continuously in regions corresponding to the plurality of pressure generation chambers 12. Is provided. Further, the lower electrode film 60 extends to the vicinity of the end of the flow path forming substrate 10 in a region outside the row of the pressure generating chambers 12, and a connection wiring 130 whose tip is extended from a driving IC 120 described later is provided. The connecting portion 60a is connected. The piezoelectric layer 70 and the upper electrode film 80 are basically provided in a region facing the pressure generation chamber 12, but in the longitudinal direction of the pressure generation chamber 12, the region is larger than the region facing the pressure generation chamber 12. It extends to the outside, and one end surface of the lower electrode film 60 is covered with the piezoelectric layer 70. A lead electrode 90 is connected to the vicinity of one end of the upper electrode film 80. The lead electrode 90 extends to the vicinity of the end portion of the flow path forming substrate 10, and the tip portion thereof is connected to the connection portion 90 a to which the connection wiring 130 is connected, similarly to the connection portion 60 a of the lower electrode film 60. It has become.

また、流路形成基板１０上の圧電素子３００側の面には、リザーバ１００の少なくとも一部を構成するリザーバ部３１を有するリザーバ形成基板３０が接合部材、例えば、本実施形態では、エポキシ系の接着剤３５ａにより形成された接着剤層３５を介して接着されている。このリザーバ部３１は、本実施形態では、リザーバ形成基板３０を厚さ方向に貫通して圧力発生室１２の幅方向に亘って形成されており、上述のように流路形成基板１０の連通部１３と連通されて各圧力発生室１２の共通のインク室となるリザーバ１００を構成している。なお、本実施形態では、流路形成基板１０とリザーバ形成基板３０とをエポキシ系の接着剤３５ａからなる接着剤層３５により接着しているが、勿論これに限定されず、両基板を密着性金属等により接合（金属接合）してもよい。 In addition, on the surface of the flow path forming substrate 10 on the piezoelectric element 300 side, a reservoir forming substrate 30 having a reservoir portion 31 constituting at least a part of the reservoir 100 is a bonding member, for example, an epoxy-based material in this embodiment. It adhere | attaches through the adhesive bond layer 35 formed of the adhesive agent 35a. In this embodiment, the reservoir portion 31 is formed across the reservoir forming substrate 30 in the thickness direction and across the width direction of the pressure generating chamber 12, and as described above, the communication portion of the flow path forming substrate 10 is formed. The reservoir 100 is connected to the pressure generation chamber 12 and serves as a common ink chamber for the pressure generation chambers 12. In this embodiment, the flow path forming substrate 10 and the reservoir forming substrate 30 are bonded by the adhesive layer 35 made of the epoxy adhesive 35a. However, the present invention is not limited to this, and both substrates are adhered. You may join by metal etc. (metal joining).

さらに、本実施形態では、連通部１３とリザーバ部３１とを連通する貫通部１１０のリザーバ部３１側の開口周縁部には、リザーバ形成基板３０のリザーバ部３１の開口周縁部が接着剤３５ａにより形成された接着剤層３５によって接着され、詳細は後述するが、この接着剤層３５によって貫通部１１０の内側の縁面（内面）は完全に覆われている。この貫通部１１０は、連通部１３に対向する領域の弾性膜５０、絶縁体膜５５及び下電極膜６０を厚さ方向に貫通することで設けられている。例えば、本実施形態では、貫通部１１０は、弾性膜５０を貫通することで設けられた第１の貫通孔１１１と、絶縁体膜５５を貫通することで設けられた第２の貫通孔１１２と、下電極膜６０を貫通することで設けられた第３の貫通孔１１３とからなる。そして、リザーバ部３１内のインクは、これら第１〜第３の貫通孔１１１，１１２，１１３からなる貫通部１１０を介して連通部１３に供給されるようになっている。 Further, in the present embodiment, the opening peripheral portion of the reservoir portion 31 of the reservoir forming substrate 30 is formed by the adhesive 35a on the opening peripheral portion on the reservoir portion 31 side of the penetrating portion 110 that communicates the communication portion 13 and the reservoir portion 31. The adhesive layer 35 is bonded, and the details will be described later, but the inner edge surface (inner surface) of the penetrating portion 110 is completely covered by the adhesive layer 35. The penetrating portion 110 is provided by penetrating the elastic film 50, the insulator film 55, and the lower electrode film 60 in the region facing the communicating portion 13 in the thickness direction. For example, in the present embodiment, the penetrating portion 110 includes a first through hole 111 provided by penetrating the elastic film 50 and a second through hole 112 provided by penetrating the insulator film 55. The third through hole 113 is provided by penetrating the lower electrode film 60. The ink in the reservoir unit 31 is supplied to the communication unit 13 through the through part 110 including the first to third through holes 111, 112, and 113.

ここで、このような貫通部１１０の連通部１３側の開口領域は、連通部１３の振動板（弾性膜５０）側の開口領域よりも大きく形成されているのが好ましい。本実施形態では、第１の貫通孔１１１の開口領域を連通部１３の弾性膜５０側の開口領域よりも大きくした。これにより、少なくとも弾性膜５０が連通部１３の開口領域内に突出することがないため、リザーバ１００内のインクの流れを妨げることを防止できる。 Here, it is preferable that the opening area of the penetrating part 110 on the communication part 13 side is formed larger than the opening area of the communication part 13 on the diaphragm (elastic film 50) side. In the present embodiment, the opening area of the first through hole 111 is made larger than the opening area on the elastic film 50 side of the communication portion 13. Accordingly, at least the elastic film 50 does not protrude into the opening region of the communication portion 13, and therefore it is possible to prevent the ink flow in the reservoir 100 from being hindered.

また、このような貫通部１１０の内側の縁面は、連通部１３側の開口領域及びリザーバ部３１側の開口領域の大小によりリザーバ部３１側に向かって階段状に漸大した形状となっていることが好ましい。本実施形態では、第２の貫通孔１１２の開口領域を第１の貫通孔１１１の開口領域よりも大きくし、第３の貫通孔１１３の開口領域を第２の貫通孔１１２の開口領域よりも大きくした。すなわち、本実施形態の貫通部１１０は、第１〜３の貫通孔１１１，１１２，１１３の開口領域の大小によって連通部１３側からリザーバ部３１側に向かって階段状に漸大した形状となっている。このように、貫通部１１０の内側の縁面を階段状に形成することにより、流路形成基板１０とリザーバ形成基板３０との接着領域、具体的には、貫通部１１０の開口周縁部とリザーバ部３１の開口周縁部との接着領域が大きくなり、ヘッドの剛性を高めることができる。また、このように貫通部１１０の内側の縁面を階段状とすることで、弾性膜５０、絶縁体膜５５及び下電極膜６０の各膜が少なくとも連通部１３の開口領域内に突出して形成されることはない。これにより、リザーバ１００内のインクの流れが妨げられることはなく、インクの供給不良を防止することができ、インクの吐出特性を向上することができる。なお、このような貫通部１１０は、詳しくは後述するが、連通部１３に対向する領域の振動板をエッチングにより除去することによって形成されている。このため、貫通部１１０を機械的な加工により形成する場合と異なり、貫通部１１０の形成時に加工カスが発生することはない。したがって、加工カスによってノズル開口２１が塞がれてインク吐出不良が発生するのを確実に防止することができる。 Further, the inner edge surface of the penetrating portion 110 has a stepped shape toward the reservoir portion 31 side depending on the size of the opening region on the communication portion 13 side and the opening region on the reservoir portion 31 side. Preferably it is. In the present embodiment, the opening area of the second through hole 112 is made larger than the opening area of the first through hole 111, and the opening area of the third through hole 113 is made larger than the opening area of the second through hole 112. Increased. That is, the penetrating portion 110 of the present embodiment has a stepped shape from the communicating portion 13 side toward the reservoir portion 31 side depending on the size of the opening regions of the first to third through holes 111, 112, and 113. ing. In this way, by forming the inner edge surface of the through portion 110 in a stepped manner, the adhesion region between the flow path forming substrate 10 and the reservoir forming substrate 30, specifically, the opening peripheral portion of the through portion 110 and the reservoir The adhesion area | region with the opening peripheral part of the part 31 becomes large, and the rigidity of a head can be improved. Further, by forming the inner edge surface of the penetrating portion 110 in a stepped shape in this way, the elastic film 50, the insulator film 55, and the lower electrode film 60 are formed so as to protrude into at least the opening region of the communicating portion 13. It will never be done. Thus, the flow of ink in the reservoir 100 is not hindered, ink supply failure can be prevented, and ink ejection characteristics can be improved. In addition, although mentioned later in detail, such a penetration part 110 is formed by removing the diaphragm of the area | region facing the communication part 13 by an etching. For this reason, unlike the case where the penetrating part 110 is formed by mechanical machining, no machining residue is generated when the penetrating part 110 is formed. Therefore, it is possible to reliably prevent the nozzle opening 21 from being blocked by the processing residue and causing an ink discharge failure.

さらに、貫通部１１０のリザーバ部３１側の開口領域は、リザーバ部３１の貫通部１１０側の開口領域よりも大きく形成されているのが好ましい。本実施形態では、第３の貫通孔１１３の開口領域をリザーバ部３１の開口領域よりも大きくし、また、第１及び第２の貫通孔１１１，１１２の開口領域をリザーバ部３１の開口領域よりも大きくした。これにより、リザーバ部３１の開口縁部と貫通部１１０の開口縁部との接着領域が大きくなり、ヘッドの剛性を高めることができる。また、貫通部１１０の内側の縁面を接着剤層３５によって確実に且つ比較的容易に覆うことができる。 Furthermore, it is preferable that the opening area of the penetrating part 110 on the reservoir part 31 side is formed larger than the opening area of the reservoir part 31 on the penetrating part 110 side. In the present embodiment, the opening area of the third through hole 113 is made larger than the opening area of the reservoir portion 31, and the opening areas of the first and second through holes 111 and 112 are made larger than the opening area of the reservoir portion 31. Was also bigger. Thereby, the adhesion area | region of the opening edge part of the reservoir | reserver part 31 and the opening edge part of the penetration part 110 becomes large, and the rigidity of a head can be improved. In addition, the inner edge surface of the penetrating portion 110 can be reliably and relatively easily covered with the adhesive layer 35.

そして、このような貫通部１１０の内側の縁面は、流路形成基板１０とリザーバ形成基板３０とを接着する接着剤３５ａにより一体的に形成された接着剤層３５によって覆われている。具体的には、リザーバ部３１の開口周縁部と貫通部１１０の開口周縁部とが接着剤層３５を介して接着され、この接着剤層３５は、下電極膜６０の面上から第１の貫通孔１１１内に露出した流路形成基板１０の面上に達するまで一体的に形成されている。そして、この接着剤層３５によって貫通部１１０の内側の縁面、すなわち、第１〜第３の貫通孔１１１，１１２，１１３の内側の端面が完全に覆われている。例えば、本実施形態では、詳細は後述するが、流路形成基板１０とリザーバ形成基板３０とを接着する際に接着剤３５ａをはみ出させ、貫通部１１０の内側の縁面をそのはみ出させた接着剤３５ａからなる接着剤層３５によって覆うようにした。 The inner edge surface of the penetrating portion 110 is covered with an adhesive layer 35 that is integrally formed with an adhesive 35 a that adheres the flow path forming substrate 10 and the reservoir forming substrate 30. Specifically, the opening peripheral edge of the reservoir portion 31 and the opening peripheral edge of the penetrating portion 110 are bonded via the adhesive layer 35, and the adhesive layer 35 is formed on the surface of the lower electrode film 60 from the first surface. It is integrally formed until reaching the surface of the flow path forming substrate 10 exposed in the through hole 111. The adhesive layer 35 completely covers the inner edge surface of the through portion 110, that is, the inner end surfaces of the first to third through holes 111, 112, and 113. For example, in the present embodiment, although details will be described later, the adhesive 35a is protruded when the flow path forming substrate 10 and the reservoir forming substrate 30 are bonded, and the inner edge surface of the penetrating portion 110 is protruded. It was made to cover with the adhesive layer 35 which consists of the agent 35a.

また、貫通部１１０の内側の縁面を覆う接着剤層３５は、連通部１３の開口領域内に突出して形成されていないのが好ましい。接着剤層３５がリザーバ部３１内から連通部１３に供給されるインクの流れを妨げるからである。本実施形態では、接着剤層３５の連通部１３側の縁部と連通部１３の開口縁部とが略一致するようにした。これにより、リザーバ１００内のインクの流れが妨げられることはないので、インクの供給不良を確実に防止することができ、インクの吐出特性を向上することができる。なお、接着剤３５ａとしては、例えば、本実施形態では、エポキシ系樹脂を用いているが、耐インク性及び耐エッチング性を有する材料からなるものであれば限定されない。 Moreover, it is preferable that the adhesive layer 35 covering the inner edge surface of the through portion 110 is not formed so as to protrude into the opening region of the communication portion 13. This is because the adhesive layer 35 hinders the flow of ink supplied from the reservoir portion 31 to the communication portion 13. In the present embodiment, the edge of the adhesive layer 35 on the side of the communication portion 13 and the opening edge of the communication portion 13 are substantially matched. Thereby, since the flow of ink in the reservoir 100 is not hindered, ink supply failure can be reliably prevented, and ink ejection characteristics can be improved. As the adhesive 35a, for example, an epoxy resin is used in this embodiment, but it is not limited as long as it is made of a material having ink resistance and etching resistance.

以上説明したように、本実施形態では、貫通部１１０の内側の縁面を流路形成基板１０とリザーバ形成基板３０とを接着する接着剤３５ａにより一体的に形成された接着剤層３５によって覆うようにしたので、リザーバ１００内にインクを充填しても、貫通部１１０の内側の縁面からその内部、すなわち、弾性膜５０と絶縁体膜５５、及び絶縁体膜５５と下電極膜６０との各膜の間からインクが浸漬して膜剥がれ等が発生することがない。このため、このような膜剥がれ等による異物の発生を防止することができる。したがって、異物等によってノズル開口が塞がれてインク吐出不良が発生するのを確実に防止することができ、ヘッドの信頼性を向上することができる。 As described above, in the present embodiment, the inner edge surface of the penetrating portion 110 is covered with the adhesive layer 35 formed integrally with the adhesive 35 a that adheres the flow path forming substrate 10 and the reservoir forming substrate 30. As a result, even if the reservoir 100 is filled with ink, the elastic film 50 and the insulator film 55, and the insulator film 55 and the lower electrode film 60 are formed from the inner edge surface of the penetrating portion 110. The ink does not immerse from between the films, and film peeling does not occur. For this reason, generation | occurrence | production of the foreign material by such film | membrane peeling etc. can be prevented. Accordingly, it is possible to reliably prevent the nozzle opening from being blocked by a foreign substance or the like and cause an ink discharge failure, and the reliability of the head can be improved.

なお、リザーバ形成基板３０の圧電素子３００に対向する領域には、圧電素子３００の運動を阻害しない程度の空間を確保可能な圧電素子保持部３２が設けられている。圧電素子３００は、この圧電素子保持部３２内に形成されているため、外部環境の影響を殆ど受けない状態で保護されている。なお、このようなリザーバ形成基板３０の材料としては、例えば、ガラス、セラミックス材料、金属、樹脂等が挙げられるが、流路形成基板１０の熱膨張率と略同一の材料で形成されていることがより好ましく、本実施形態では、流路形成基板１０と同一材料のシリコン単結晶基板を用いて形成した。 In the region facing the piezoelectric element 300 of the reservoir forming substrate 30, a piezoelectric element holding portion 32 that can secure a space that does not hinder the movement of the piezoelectric element 300 is provided. Since the piezoelectric element 300 is formed in the piezoelectric element holding portion 32, the piezoelectric element 300 is protected in a state hardly affected by the external environment. Examples of the material of the reservoir forming substrate 30 include glass, ceramic material, metal, resin, and the like, and the reservoir forming substrate 30 is formed of substantially the same material as the thermal expansion coefficient of the flow path forming substrate 10. In this embodiment, the silicon single crystal substrate made of the same material as the flow path forming substrate 10 is used.

また、圧力発生室１２の列の外側の領域の下電極膜６０、及びリード電極９０は、上述したように流路形成基板１０の端部近傍まで延設され、下電極膜６０の接続部６０ａ及びリード電極９０の接続部９０ａは圧電素子保持部３２の外側に設けられている。そして、これら下電極膜６０の接続部６０ａ及びリード電極９０の接続部９０ａに、リザーバ形成基板３０上に実装された駆動ＩＣ１２０から延設される接続配線１３０の一端が接続されている。 Further, the lower electrode film 60 and the lead electrode 90 in the region outside the row of the pressure generating chambers 12 are extended to the vicinity of the end portion of the flow path forming substrate 10 as described above, and the connecting portion 60a of the lower electrode film 60 is provided. The connecting portion 90 a of the lead electrode 90 is provided outside the piezoelectric element holding portion 32. One end of a connection wiring 130 extending from the drive IC 120 mounted on the reservoir forming substrate 30 is connected to the connection portion 60 a of the lower electrode film 60 and the connection portion 90 a of the lead electrode 90.

さらに、リザーバ形成基板３０上には、封止膜４１及び固定板４２とからなるコンプライアンス基板４０が接合されている。封止膜４１は、剛性が低く可撓性を有する材料（例えば、厚さが６μｍのポリフェニレンサルファイド（ＰＰＳ）フィルム）からなり、この封止膜４１によってリザーバ部３１の一方面が封止されている。また、固定板４２は、金属等の硬質の材料（例えば、厚さが３０μｍのステンレス鋼（ＳＵＳ）等）で形成される。この固定板４２のリザーバ１００に対向する領域は、厚さ方向に完全に除去された開口部４３となっているため、リザーバ１００の一方面は可撓性を有する封止膜４１のみで封止されている。 Further, a compliance substrate 40 including a sealing film 41 and a fixing plate 42 is bonded onto the reservoir forming substrate 30. The sealing film 41 is made of a material having low rigidity and flexibility (for example, a polyphenylene sulfide (PPS) film having a thickness of 6 μm). Yes. The fixing plate 42 is made of a hard material such as metal (for example, stainless steel (SUS) having a thickness of 30 μm). Since the region of the fixing plate 42 facing the reservoir 100 is an opening 43 that is completely removed in the thickness direction, one surface of the reservoir 100 is sealed only with a flexible sealing film 41. Has been.

このような本実施形態のインクジェット式記録ヘッドでは、図示しない外部インク供給手段からインクを取り込み、リザーバ１００からノズル開口２１に至るまで内部をインクで満たした後、駆動ＩＣ１２０からの記録信号に従い、圧力発生室１２に対応するそれぞれの下電極膜６０と上電極膜８０との間に電圧を印加し、弾性膜５０、絶縁体膜５５、下電極膜６０及び圧電体層７０をたわみ変形させることにより、各圧力発生室１２内の圧力が高まりノズル開口２１からインク滴が吐出する。 In the ink jet recording head of this embodiment, after taking ink from an external ink supply means (not shown) and filling the interior from the reservoir 100 to the nozzle opening 21, the pressure is applied according to the recording signal from the drive IC 120. By applying a voltage between each of the lower electrode film 60 and the upper electrode film 80 corresponding to the generation chamber 12, the elastic film 50, the insulator film 55, the lower electrode film 60, and the piezoelectric layer 70 are bent and deformed. The pressure in each pressure generating chamber 12 is increased, and ink droplets are ejected from the nozzle openings 21.

ここで、このようなインクジェット式記録ヘッドの製造方法について、図３〜図５を参照して説明する。なお、図３〜図５は、圧力発生室１２の長手方向の断面図である。まず、図３（ａ）に示すように、シリコン単結晶基板である流路形成基板１０を約１１００℃の拡散炉で熱酸化し、流路形成基板１０の表面に弾性膜５０及びマスク膜５１を構成する二酸化シリコン膜５２を形成する。次いで、図３（ｂ）に示すように、弾性膜５０（二酸化シリコン膜５２）上に、ジルコニウム（Ｚｒ）層を形成後、例えば、５００〜１２００℃の拡散炉で熱酸化して酸化ジルコニウム（ＺｒＯ_２）からなる絶縁体膜５５を形成する。次いで、図３（ｃ）に示すように、例えば、白金とイリジウムとを絶縁体膜５５上に積層することにより下電極膜６０を形成後、この下電極膜６０を所定形状にパターニングする。この際、本実施形態では、連通部１３が形成される領域に対向する部分の下電極膜６０を除去して第３の貫通孔１１３を形成しておく。次に、図３（ｄ）に示すように、例えば、チタン酸ジルコン酸鉛（ＰＺＴ）等からなる圧電体層７０と、例えば、イリジウムからなる上電極膜８０とを流路形成基板１０の全面に形成する。次いで、図３（ｅ）に示すように、圧電体層７０及び上電極膜８０を、各圧力発生室１２に対向する領域にパターニングして圧電素子３００を形成する。 Here, a method of manufacturing such an ink jet recording head will be described with reference to FIGS. 3 to 5 are cross-sectional views of the pressure generating chamber 12 in the longitudinal direction. First, as shown in FIG. 3A, the flow path forming substrate 10 which is a silicon single crystal substrate is thermally oxidized in a diffusion furnace at about 1100 ° C., and an elastic film 50 and a mask film 51 are formed on the surface of the flow path forming substrate 10. A silicon dioxide film 52 is formed. Next, as shown in FIG. 3B, a zirconium (Zr) layer is formed on the elastic film 50 (silicon dioxide film 52), and then thermally oxidized in, for example, a diffusion furnace at 500 to 1200 ° C. to form zirconium oxide ( An insulator film 55 made of ZrO ₂ ) is formed. Next, as shown in FIG. 3C, for example, after the lower electrode film 60 is formed by laminating platinum and iridium on the insulator film 55, the lower electrode film 60 is patterned into a predetermined shape. At this time, in the present embodiment, the third through hole 113 is formed by removing the portion of the lower electrode film 60 facing the region where the communication portion 13 is formed. Next, as shown in FIG. 3D, for example, a piezoelectric layer 70 made of, for example, lead zirconate titanate (PZT) and an upper electrode film 80 made of, for example, iridium are formed on the entire surface of the flow path forming substrate 10. To form. Next, as shown in FIG. 3E, the piezoelectric layer 300 and the upper electrode film 80 are patterned in a region facing each pressure generating chamber 12 to form the piezoelectric element 300.

次に、リード電極９０を形成する。具体的には、図４（ａ）に示すように、流路形成基板１０の全面に亘って、例えば、チタンタングステン（ＴｉＷ）、ニッケルクロム（ＮｉＣｒ）等の密着性金属からなる密着層９１を形成し、この密着層９１上の全面に、例えば、金（Ａｕ）等からなる金属層９２を形成する。その後、例えば、レジスト等からなるマスクパターン（図示なし）を介して金属層９２を各圧電素子３００毎にパターニングし、さらに密着層９１をエッチングによりパターニングすることで、図４（ｂ）に示すようなリード電極９０が形成される。 Next, the lead electrode 90 is formed. Specifically, as shown in FIG. 4A, an adhesive layer 91 made of an adhesive metal such as titanium tungsten (TiW) or nickel chrome (NiCr) is formed over the entire surface of the flow path forming substrate 10. Then, a metal layer 92 made of, for example, gold (Au) or the like is formed on the entire surface of the adhesion layer 91. Thereafter, for example, the metal layer 92 is patterned for each piezoelectric element 300 through a mask pattern (not shown) made of resist or the like, and the adhesion layer 91 is patterned by etching, as shown in FIG. 4B. A lead electrode 90 is formed.

次いで、貫通孔１１０を形成する。具体的には、図４（ｃ）に示すように、まず、連通部１３が形成される領域に対向する部分、すなわち、第３の貫通孔１１３内に露出した絶縁体膜５５を、マスク（図示しない）を介してエッチングにより除去して第２の貫通孔１１２を形成する。この第２の貫通孔１１２の開口領域は、第３の貫通孔１１３の開口領域より小さく形成した。次に、この第２の貫通孔１１２内に露出した弾性膜５０を、マスク（図示しない）を介してエッチングにより除去して第１の貫通孔１１１を形成する。この第１の貫通孔１１１の開口領域は、第２の貫通孔１１２の開口領域より小さく形成した。これにより、第１〜第３の貫通孔１１１，１１２，１１３からなる階段状の縁面を有する貫通部１１０が形成される。 Next, the through hole 110 is formed. Specifically, as shown in FIG. 4C, first, a portion facing the region where the communication portion 13 is formed, that is, the insulator film 55 exposed in the third through hole 113 is masked ( The second through hole 112 is formed by etching through a not-shown). The opening area of the second through hole 112 was formed smaller than the opening area of the third through hole 113. Next, the elastic film 50 exposed in the second through hole 112 is removed by etching through a mask (not shown) to form the first through hole 111. The opening area of the first through hole 111 was formed smaller than the opening area of the second through hole 112. Thereby, the penetration part 110 which has the step-shaped edge surface which consists of the 1st-3rd through-holes 111,112,113 is formed.

次に、図５（ａ）に示すように、流路形成基板１０の圧電素子３００側の面にリザーバ形成基板３０をエポキシ系樹脂からなる接着剤３５ａによって接着する。この際、リザーバ形成基板３０のリザーバ部３１の開口周縁と下電極膜６０の第３の貫通孔１１３の開口周縁とを接着する接着剤３５ａを貫通部１１０の内側の縁面を覆うようにはみ出させる。これにより、貫通部１１０の内側の縁面が接着剤３５ａからなる接着剤層３５によって完全に覆われた状態で、流路形成基板１０とリザーバ形成基板３０とが接着剤層３５を介して接着される。なお、このリザーバ形成基板３０の全面には、耐エッチング性の材料、例えば、二酸化シリコンからなる保護膜３０ａが予め形成されている。また、リザーバ形成基板３０としては、リザーバ部３１の流路形成基板１０側の開口領域が振動板に形成した貫通部１１０（第３の貫通孔１１３）の開口領域より小さいものを接着する。 Next, as shown in FIG. 5A, the reservoir forming substrate 30 is bonded to the surface of the flow path forming substrate 10 on the piezoelectric element 300 side by an adhesive 35a made of an epoxy resin. At this time, the adhesive 35a that bonds the opening periphery of the reservoir portion 31 of the reservoir forming substrate 30 and the opening periphery of the third through hole 113 of the lower electrode film 60 protrudes so as to cover the inner edge surface of the through portion 110. Let Thus, the flow path forming substrate 10 and the reservoir forming substrate 30 are bonded via the adhesive layer 35 in a state where the inner edge surface of the through portion 110 is completely covered by the adhesive layer 35 made of the adhesive 35a. Is done. A protective film 30a made of an etching-resistant material, for example, silicon dioxide, is formed on the entire surface of the reservoir forming substrate 30 in advance. In addition, as the reservoir forming substrate 30, a substrate having an opening region on the flow path forming substrate 10 side of the reservoir portion 31 smaller than the opening region of the through portion 110 (third through hole 113) formed in the vibration plate is bonded.

そして、次に、図５（ｂ）に示すように、所定形状にパターニングしたマスク膜５１を介して流路形成基板１０を異方性エッチングすることにより圧力発生室１２、インク供給路１４及び連通部１３等を形成する。具体的には、流路形成基板１０のリザーバ形成基板３０が接着された側とは反対側から厚さ方向に異方性エッチングすることにより、圧力発生室１２等を形成する。また、振動板の連通部１３に対向する領域には、貫通部１１０が設けられているため、この異方性エッチングにより連通部１３が形成されると、貫通部１１０を介して連通部１３とリザーバ部３１とが連通し、リザーバ１００が形成される。このように異方性エッチングにより圧力発生室１２等を形成する際には、本実施形態では、少なくともリザーバ部３１の内面が保護膜３０ａによって覆われているため、エッチング液によってリザーバ部３１の内面がエッチングされることはない。また、流路形成基板１０をエッチングする際、リザーバ形成基板３０の表面は、エッチング溶液が接触しないようにＰＰＳ等の樹脂フィルムで覆うことによって保護しておく。さらに、リザーバ部３１の連通部１３側とは反対側の開口は、リザーバ部３１を介してリザーバ形成基板３０の表面側にエッチング溶液が接触しないように、例えば、樹脂材料等で予め封止しておく。なお、実際には、上述した一連の膜形成及び異方性エッチングによって一枚のウェハ上に多数のチップを同時に形成し、プロセス終了後、図１に示すような一つのチップサイズの流路形成基板１０毎に分割する。 Then, as shown in FIG. 5B, the pressure generating chamber 12, the ink supply path 14, and the communication are performed by anisotropically etching the flow path forming substrate 10 through a mask film 51 patterned in a predetermined shape. Part 13 etc. are formed. Specifically, the pressure generating chamber 12 and the like are formed by performing anisotropic etching in the thickness direction from the opposite side of the flow path forming substrate 10 to the side where the reservoir forming substrate 30 is bonded. In addition, since the penetrating portion 110 is provided in a region facing the communicating portion 13 of the diaphragm, when the communicating portion 13 is formed by this anisotropic etching, the communicating portion 13 and the communicating portion 13 are connected via the penetrating portion 110. A reservoir 100 is formed by communicating with the reservoir 31. Thus, when forming the pressure generating chambers 12 and the like by anisotropic etching, in this embodiment, since at least the inner surface of the reservoir unit 31 is covered with the protective film 30a, the inner surface of the reservoir unit 31 is covered with the etching solution. Will not be etched. Further, when the flow path forming substrate 10 is etched, the surface of the reservoir forming substrate 30 is protected by being covered with a resin film such as PPS so that the etching solution does not come into contact therewith. Further, the opening of the reservoir portion 31 opposite to the communication portion 13 side is previously sealed with, for example, a resin material so that the etching solution does not contact the surface side of the reservoir forming substrate 30 via the reservoir portion 31. Keep it. In practice, a large number of chips are simultaneously formed on a single wafer by the above-described series of film formation and anisotropic etching, and after the process is completed, a single chip-sized flow path is formed as shown in FIG. Divide each substrate 10.

その後は、流路形成基板１０にマスク膜５１を介してノズルプレート２０を接合し、リザーバ形成基板３０上に駆動ＩＣ１２０を実装すると共にコンプライアンス基板４０を接合する。さらに、ワイヤボンディングすることによって、駆動ＩＣ１２０と下電極膜６０及びリード電極９０の接続部６０ａ，９０ａとの間に接続配線１３０を形成することにより本実施形態のインクジェット式記録ヘッドとなる。 Thereafter, the nozzle plate 20 is bonded to the flow path forming substrate 10 via the mask film 51, the driving IC 120 is mounted on the reservoir forming substrate 30, and the compliance substrate 40 is bonded. Furthermore, by forming the connection wiring 130 between the drive IC 120 and the connection portions 60a and 90a of the lower electrode film 60 and the lead electrode 90 by wire bonding, the ink jet recording head of this embodiment is obtained.

以上説明したように、本実施形態では、圧電素子３００及び振動板を形成した後に、貫通部１１０を形成し、その後、リザーバ部３１に貫通孔１１０を介して連通する連通部１３を形成して、リザーバ部３１と連通部１３とから構成されるリザーバ１００を形成するようにしたので、流路形成基板１０とリザーバ形成基板３０とを接着した後に、機械的な加工により貫通部を形成する工程を省略できる。このため、加工カス等の異物が発生することはなく、ヘッドの製造工程において、異物による組み立て不良が発生するのを確実に防止することができる。また、機械的な加工によって貫通部を形成する工程を省略できるため、製造プロセスを簡略化することができる。さらに、貫通部１１０を連通部１３側の開口領域よりもリザーバ部３１側の開口領域を大きく形成することにより、リザーバ１００内に弾性膜５０、絶縁体膜５５及び下電極膜６０の一部が突出して形成されるのを防止できる。これにより、リザーバ部３１内から連通部１３に供給されるインクの流れを妨げることがないため、インクの供給不良を確実に防止できる。さらには、流路形成基板１０とリザーバ形成基板３０とを接着する際に、接着剤３５ａのはみ出しにより一体的に形成された接着剤層３５によって貫通部１１０の内側の縁面を比較的容易に且つ確実に覆うことができる。なお、このように接着剤３５ａのはみ出しにより貫通部１１０の内側の縁面を確実に覆うことができるため、リザーバ形成基板を流路形成基板に接着した後の別工程において貫通部の内側の縁面を保護膜で覆う作業を省略でき、製造プロセスを簡略化できるという効果も奏する。 As described above, in this embodiment, after the piezoelectric element 300 and the diaphragm are formed, the through portion 110 is formed, and then the communication portion 13 that communicates with the reservoir portion 31 via the through hole 110 is formed. Since the reservoir 100 composed of the reservoir portion 31 and the communication portion 13 is formed, the step of forming the penetration portion by mechanical processing after bonding the flow path forming substrate 10 and the reservoir forming substrate 30 to each other. Can be omitted. For this reason, foreign matter such as machining residue is not generated, and it is possible to reliably prevent assembly failure due to foreign matter in the head manufacturing process. In addition, since the step of forming the penetrating portion by mechanical processing can be omitted, the manufacturing process can be simplified. Furthermore, by forming the penetrating part 110 so that the opening area on the reservoir part 31 side is larger than the opening area on the communication part 13 side, the elastic film 50, the insulator film 55 and a part of the lower electrode film 60 are contained in the reservoir 100. Protruding can be prevented. Accordingly, the flow of ink supplied from the reservoir 31 to the communication unit 13 is not hindered, and ink supply failure can be reliably prevented. Furthermore, when the flow path forming substrate 10 and the reservoir forming substrate 30 are bonded, the inner edge surface of the through-hole 110 is relatively easily formed by the adhesive layer 35 integrally formed by the protrusion of the adhesive 35a. And it can cover reliably. In addition, since the inner edge surface of the penetrating portion 110 can be reliably covered by the protrusion of the adhesive 35a in this way, the inner edge of the penetrating portion in another process after the reservoir forming substrate is bonded to the flow path forming substrate. The operation of covering the surface with a protective film can be omitted, and the manufacturing process can be simplified.

（他の実施形態）
以上、本発明の各実施形態を説明したが、本発明は、上述した実施形態に限定されるものではない。例えば、上述した実施形態では、貫通部１１０の内側の縁面を各貫通孔１１１，１１２，１１３の開口領域の大小によって階段状に形成したが、これに限定されず、各貫通孔の開口領域を同じ大きさとし、リザーバ部側から連通部側に亘って貫通部の開口領域を同一形状に形成してもよい。この場合には、貫通部の開口領域をリザーバ部及び連通部の開口領域よりも大きくするのが好ましい。これにより、接着剤のはみ出しにより一体的に形成された接着剤層によって貫通部の内側の縁面を確実に覆うことができる。また、接着剤層が連通部の開口領域内に突出して形成されるのを防止できるため、インクの供給不良を防止できる。 (Other embodiments)
As mentioned above, although each embodiment of this invention was described, this invention is not limited to embodiment mentioned above. For example, in the above-described embodiment, the inner edge surface of the through-hole 110 is formed in a stepped shape depending on the size of the opening area of each through-hole 111, 112, 113. May be the same size, and the opening area of the penetrating part may be formed in the same shape from the reservoir part side to the communication part side. In this case, it is preferable that the opening area of the penetrating part is larger than the opening areas of the reservoir part and the communication part. Thereby, the edge surface inside a penetration part can be reliably covered with the adhesive bond layer formed integrally by the protrusion of the adhesive. In addition, since it is possible to prevent the adhesive layer from being formed to protrude into the opening region of the communication portion, it is possible to prevent ink supply failure.

また、上述した実施形態では、振動板を弾性膜５０、絶縁体膜５５及び下電極膜６０によって構成し、これら各膜に設けられた各貫通孔１１１，１１２，１１３によって貫通部１１０を構成するようにしたが、これに限定されず、例えば、連通部に対向する領域には弾性膜だけを設けるようにし、この弾性膜をエッチングにより貫通して貫通孔を設け、これを貫通部としてもよい。
なお、上述した実施形態では、下電極膜６０をパターニングする際に第３の貫通孔１１３を形成した後に、圧電素子３００を形成し、その後に第１の貫通孔１１１及び第２の貫通孔１１２を形成したが、これに限定されず、圧電素子を形成する前に、第１の貫通孔及び第２の貫通孔を形成するようにしてもよい。 In the above-described embodiment, the diaphragm is constituted by the elastic film 50, the insulator film 55, and the lower electrode film 60, and the through-hole 110 is constituted by the through-holes 111, 112, and 113 provided in these films. However, the present invention is not limited to this, and for example, only an elastic film may be provided in a region facing the communication part, and a through hole may be provided by penetrating the elastic film by etching. .
In the embodiment described above, the piezoelectric element 300 is formed after the third through hole 113 is formed when the lower electrode film 60 is patterned, and then the first through hole 111 and the second through hole 112 are formed. However, the present invention is not limited to this, and the first through hole and the second through hole may be formed before the piezoelectric element is formed.

さらに、上述した実施形態のインクジェット式記録ヘッドは、インクカートリッジ等と連通するインク流路を具備する記録ヘッドユニットの一部を構成して、インクジェット式記録装置に搭載される。図６は、そのインクジェット式記録装置の一例を示す概略図である。図６に示すように、インクジェット式記録ヘッドを有する記録ヘッドユニット１Ａ及び１Ｂは、インク供給手段を構成するカートリッジ２Ａ及び２Ｂが着脱可能に設けられ、この記録ヘッドユニット１Ａ及び１Ｂを搭載したキャリッジ３は、装置本体４に取り付けられたキャリッジ軸５に軸方向移動自在に設けられている。この記録ヘッドユニット１Ａ及び１Ｂは、例えば、それぞれブラックインク組成物及びカラーインク組成物を吐出するものとしている。そして、駆動モータ６の駆動力が図示しない複数の歯車およびタイミングベルト７を介してキャリッジ３に伝達されることで、記録ヘッドユニット１Ａ及び１Ｂを搭載したキャリッジ３はキャリッジ軸５に沿って移動される。一方、装置本体４にはキャリッジ軸５に沿ってプラテン８が設けられており、図示しない給紙ローラなどにより給紙された紙等の記録媒体である記録シートＳがプラテン８上を搬送されるようになっている。 Furthermore, the ink jet recording head of the above-described embodiment constitutes a part of a recording head unit including an ink flow path communicating with an ink cartridge or the like, and is mounted on the ink jet recording apparatus. FIG. 6 is a schematic view showing an example of the ink jet recording apparatus. As shown in FIG. 6, in the recording head units 1A and 1B having the ink jet recording head, cartridges 2A and 2B constituting ink supply means are detachably provided, and a carriage 3 on which the recording head units 1A and 1B are mounted. Is provided on a carriage shaft 5 attached to the apparatus body 4 so as to be movable in the axial direction. The recording head units 1A and 1B, for example, are configured to eject a black ink composition and a color ink composition, respectively. The driving force of the driving motor 6 is transmitted to the carriage 3 via a plurality of gears and timing belt 7 (not shown), so that the carriage 3 on which the recording head units 1A and 1B are mounted is moved along the carriage shaft 5. The On the other hand, the apparatus body 4 is provided with a platen 8 along the carriage shaft 5, and a recording sheet S, which is a recording medium such as paper fed by a paper feed roller (not shown), is conveyed on the platen 8. It is like that.

なお、上述した実施形態においては、本発明の液体噴射ヘッドの一例としてインクジェット式記録ヘッドを説明したが、液体噴射ヘッドの基本的構成は上述したものに限定されるものではない。本発明は、広く液体噴射ヘッドの全般を対象としたものであり、インク以外の液体を噴射するものにも勿論適用することができる。その他の液体噴射ヘッドとしては、例えば、プリンタ等の画像記録装置に用いられる各種の記録ヘッド、液晶ディスプレー等のカラーフィルタの製造に用いられる色材噴射ヘッド、有機ＥＬディスプレー、ＦＥＤ（面発光ディスプレー）等の電極形成に用いられる電極材料噴射ヘッド、バイオｃｈｉｐ製造に用いられる生体有機物噴射ヘッド等が挙げられる。 In the above-described embodiment, the ink jet recording head has been described as an example of the liquid ejecting head of the present invention. However, the basic configuration of the liquid ejecting head is not limited to the above-described configuration. The present invention covers a wide range of liquid ejecting heads, and can naturally be applied to those ejecting liquids other than ink. Other liquid ejecting heads include, for example, various recording heads used in image recording apparatuses such as printers, color material ejecting heads used in the manufacture of color filters such as liquid crystal displays, organic EL displays, and FEDs (surface emitting displays). Examples thereof include an electrode material ejection head used for electrode formation, a bioorganic matter ejection head used for biochip production, and the like.

実施形態１に係る記録ヘッドの分解斜視図である。FIG. 3 is an exploded perspective view of the recording head according to the first embodiment. 実施形態１に係る記録ヘッドの平面図及び断面図である。2A and 2B are a plan view and a cross-sectional view of the recording head according to the first embodiment. 実施形態１に係る記録ヘッドの製造工程を示す断面図である。5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 実施形態１に係る記録ヘッドの製造工程を示す断面図である。5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 実施形態１に係る記録ヘッドの製造工程を示す断面図である。5 is a cross-sectional view illustrating a manufacturing process of the recording head according to Embodiment 1. FIG. 一実施形態に係る記録装置の概略図である。1 is a schematic diagram of a recording apparatus according to an embodiment.

Explanation of symbols

１０流路形成基板、１２圧力発生室、２０ノズルプレート、２１ノズル開口、３０リザーバ形成基板、３１リザーバ部、３２圧電素子保持部、３５接着剤層、４０コンプライアンス基板、５０弾性膜、５５絶縁体膜、６０下電極膜、７０圧電体層、８０上電極膜、１００リザーバ、１１０貫通部、１２０駆動ＩＣ、１３０接続配線、３００圧電素子
DESCRIPTION OF SYMBOLS 10 Flow path formation board | substrate, 12 Pressure generation chamber, 20 Nozzle plate, 21 Nozzle opening, 30 Reservoir formation board | substrate, 31 Reservoir part, 32 Piezoelectric element holding | maintenance part, 35 Adhesive layer, 40 Compliance board | substrate, 50 Elastic film, 55 Insulator Film, 60 lower electrode film, 70 piezoelectric layer, 80 upper electrode film, 100 reservoir, 110 penetrating portion, 120 driving IC, 130 connection wiring, 300 piezoelectric element

Claims

A flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening for injecting liquid is formed, and a piezoelectric element for causing a pressure change in the pressure generating chamber via a vibration plate on one surface side of the flow path forming substrate; In a liquid jet head comprising:
The flow path forming substrate is provided with a communicating portion that communicates with one end in the longitudinal direction of the pressure generating chamber, and a reservoir portion that communicates with the communicating portion is provided on the surface of the flow path forming substrate on the piezoelectric element side. A reservoir forming substrate having a through-hole penetrating at least the diaphragm is provided in a region corresponding to a boundary between the reservoir portion and the communication portion, and an inner edge surface of the through-portion A liquid ejecting head, wherein the liquid ejecting head is covered with a joining member that joins the flow path forming substrate and the reservoir forming substrate.

The liquid ejecting head according to claim 1, wherein an opening area of the penetrating portion on the side of the communicating portion is formed larger than an opening area of the communicating portion on the diaphragm side.

3. The liquid ejecting head according to claim 1, wherein an opening region of the penetrating portion on the reservoir portion side is formed larger than an opening region of the reservoir portion on the penetrating portion side.

The liquid ejecting head according to claim 1, wherein an opening region on the reservoir portion side is formed larger than an opening region on the communication portion side of the penetrating portion.

5. The penetrating portion according to claim 4, wherein the penetrating portion is formed by etching through the diaphragm, and an inner edge surface of the penetrating portion includes an opening region on the communicating portion side and an opening on the reservoir portion side. A liquid ejecting head, wherein the liquid ejecting head has a stepped shape gradually increasing toward the reservoir portion depending on the size of the region.

A liquid ejecting apparatus comprising the liquid ejecting head according to claim 1.

A flow path forming substrate in which a pressure generating chamber communicating with a nozzle opening for injecting liquid is formed, and a piezoelectric element for causing a pressure change in the pressure generating chamber via a vibration plate on one surface side of the flow path forming substrate; And a reservoir forming substrate provided with a reservoir portion that is bonded to a surface of the flow path forming substrate on the piezoelectric element side and that constitutes a part of a reservoir that is a common liquid chamber of each pressure generating chamber. In the head manufacturing method,
The step of forming the diaphragm and the piezoelectric element on one surface side of the flow path forming substrate, and a region forming a communication portion that communicates with one longitudinal end of the pressure generating chamber of the flow path forming substrate. A step of forming a through portion by penetrating at least part of the diaphragm in the thickness direction, and covering an inner edge surface of the through portion with a joining member for joining the flow path forming substrate and the reservoir forming substrate. The step of joining the reservoir forming substrate on the surface of the flow path forming substrate on the piezoelectric element side, and the communicating with the reservoir portion through the through portion by etching from the other surface side of the flow path forming substrate. And a step of forming the communication portion and the pressure generating chamber.

8. The step of bonding the reservoir forming substrate according to claim 7, wherein at least the surface of the diaphragm and the opening edge of the reservoir portion on the flow path forming substrate side are bonded by the bonding member and the bonding member is bonded. A liquid ejecting head manufacturing method, wherein the liquid ejecting head protrudes from the surface of the diaphragm until reaching an inner edge surface of the penetrating portion.

9. The step of forming the communication portion and the pressure generation chamber according to claim 7 or 8, wherein the other surface side of the flow path forming substrate is etched to open an opening region on the diaphragm side of the communication portion. A method of manufacturing a liquid ejecting head, wherein the liquid ejecting head is formed to be smaller than an opening region on the side of the communicating portion.

10. The method of manufacturing a liquid jet head according to claim 9, wherein the step of forming the communication portion is performed in a state where at least the inner surface of the reservoir portion is covered with a protective film made of an etching resistant material.