JP2005022028A - Polishing pad dressing device and working device having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for evenly and stably dressing a polishing pad. <P>SOLUTION: This dressing device 30 of the polishing pad is disposed in a polishing device 10 for contacting a workpiece with the polishing pad 20 and polishing the workpiece while supplying slurry. The dressing device 30 comprises a pad dresser 32 pressed to the polishing pad 20 and a dresser supporting mechanism 38 for supporting the pad dresser. The dresser supporting mechanism is provided with a force detecting means for detecting frictional force or impact force occurring between the polishing pad 20 and the pad dresser 32. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing pad dressing apparatus and a processing apparatus having the apparatus, and more particularly to a polishing pad dressing apparatus that can be suitably used for chemical mechanical polishing (CMP) and a processing apparatus having the apparatus.
[0002]
[Prior art]
In CMP, clogging of the polishing pad causes a reduction in the polishing rate and deteriorates the uniformity of polishing. Therefore, dressing (sharpening) of the polishing pad is indispensable. The dressing of the polishing pad refers to a slurry (abrasive material) obtained by bringing a pad dresser formed with abrasive grains such as diamond into contact with the polishing pad and scraping the surface of the polishing pad or roughening the surface of the polishing pad. Is a treatment for recovering the retainability of the solution in which is dispersed and maintaining the polishing ability.
[0003]
As this pad dresser, a dresser or the like on which diamond abrasive grains are electrodeposited has been conventionally used. FIG. 6 shows a polishing apparatus 11 having a conventional pad dresser 90A. The pad dresser 90A may be composed of a diamond abrasive grain 80B electrodeposited on its lower surface or a bond layer (metal bond, vitrified bond or resin bond) in which the abrasive grain 80B is dispersed. The pad dresser 90 </ b> A is pressed against the polishing pad 20 with the force F while being rotated about the shaft 92 to dress the polishing pad 20.
[0004]
The thickness of the pad dresser 90A is generally about 10 to 30 mm, and the outer diameter is generally about 100 to 250 mm (4 to 10 inches). The base of the pad dresser 90A is generally made of metal.
[0005]
As shown in FIG. 7, the pad dresser 90A and the shaft 92 are often connected via a flexible joint (for example, a universal joint) 94. With this configuration, the surface (lower surface) of the pad dresser 90A and polishing are performed. The surface of the pad 20 is in contact with the entire surface, and the surface of the pad dresser 90A follows the surface of the polishing pad 20 even during the dressing operation.
[0006]
Various proposals have also been made for improvements related to such a conventional pad dresser (see, for example, Patent Document 1 by the present applicant), and dressing of a uniform and stable polishing pad is being sought.
[0007]
[Patent Document 1]
Japanese Patent Application No. 2001-344471
[0008]
[Problems to be solved by the invention]
However, such a conventional pad dresser 90A has the following problems. The polishing pad 20 attached to the polishing surface plate is apparently flat, but in reality, the surface is greatly wavy due to unevenness in the thickness of the polishing pad 20 surface, unevenness due to the attachment of the polishing pad 20, and the like. Is in a state. The flatness is about +/− 0.05 mm.
[0009]
Similarly, in the pad dresser 90A, even if the flatness of the pedestal (metal base material) before electrodepositing the abrasive grains is processed with high accuracy, the flatness with high precision is obtained due to variations in the size of the abrasive grains. It cannot be said that it is. This phenomenon is caused not only by the electrodeposition pad dresser, but also by a pad dresser composed of a bond layer (metal bond, vitrified bond or resin bond) in which abrasive grains are dispersed, or pellets with abrasive grains attached to the surface. This is also common to a pellet type pad dresser in which a grindstone is disposed on substantially the entire surface at a predetermined interval.
[0010]
When dressing the polishing pad using the pad dresser as described above, the pad dresser and the polishing pad seem to be in uniform contact over the entire surface. It is not in a state. Each time the polishing pad is replaced or each time the pad dresser is replaced, both contact states change greatly.
[0011]
When dressing the polishing pad while rotating the pad dresser and the polishing pad (polishing surface plate) in such a state, the contact state between the pad dresser and the polishing pad is non-uniform or the amount of protrusion of the abrasive grains varies. For example, the frictional resistance between the pad dresser and the polishing pad may be uneven. Therefore, when both the pad dresser and the polishing pad rotate, the relative position of each other changes.
[0012]
As a result, a stick-slip phenomenon (Stick Slip) occurs between the pad dresser and the polishing pad. That is, the pad dresser and the polishing pad are intermittently rubbed or caught, and a smooth mutual motion cannot be obtained.
[0013]
In addition, the frictional resistance between the pad dresser and the polishing pad periodically varies in synchronization with the rotation, and the pad dresser 90A vibrates as indicated by an arrow in FIG. 7 due to the periodic variation of the frictional resistance. It has been confirmed. The metal pedestal of the pad dresser 90A has a predetermined thickness (about 10 to 30 mm) and is hardly elastically deformed, so that it is difficult to suppress vibration even if it is supported on the shaft 92 by the flexible joint 94.
[0014]
The stick-slip phenomenon of the pad dresser 90A and the vibration of the surface of the pad dresser 90A hinder uniform dressing of the polishing pad over the entire surface. As a result, the polishing quality of the workpiece is also adversely affected.
[0015]
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a polishing pad dressing apparatus capable of uniformly and stably dressing a polishing pad, and a processing apparatus having the polishing pad dressing apparatus.
[0016]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a dressing device for a polishing pad in a processing apparatus for processing a workpiece by contacting the polishing pad while supplying slurry, and a pad dresser pressed against the polishing pad; A dresser support mechanism that supports the pad dresser, and the dresser support mechanism includes force detection means that detects a frictional force or an impact force generated between the polishing pad and the pad dresser. A polishing pad dressing apparatus is provided.
[0017]
According to the present invention, the dresser support mechanism is provided with force detection means for detecting a frictional force or an impact force generated between the polishing pad and the pad dresser, and a stick-slip phenomenon between the pad dresser and the polishing pad, Vibrations due to fluctuations in frictional resistance can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0018]
As described above, the “pad dresser” is composed of a bond layer (metal bond, vitrified bond, or resin bond) in which diamond abrasive grains are electrodeposited on the surface or diamond abrasive grains are dispersed. The surface of the polishing pad is scraped off or the surface of the polishing pad is roughened to restore the retention of the slurry and maintain the polishing ability of the polishing pad.
[0019]
Further, the present invention is a dressing device for a polishing pad in a processing apparatus for processing a workpiece while making contact with a polishing pad while supplying slurry, the pad dresser being pressed against the polishing pad, and supporting the pad dresser A dresser support mechanism, and the dresser support mechanism is provided with strain detection means for detecting a displacement amount of the dresser support mechanism or the pad dresser or a strain amount generated in the dresser support mechanism or the pad dresser. A dressing device for a polishing pad is provided.
[0020]
According to the present invention, the dresser support mechanism is provided with the strain detection means for detecting the displacement amount of the dresser support mechanism or the pad dresser or the strain amount generated in the dresser support mechanism or the pad dresser, and between the pad dresser and the polishing pad. Vibration due to stick-slip phenomenon and frictional resistance fluctuations can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0021]
Further, the present invention is a dressing device for a polishing pad in a processing apparatus for processing a workpiece while making contact with a polishing pad while supplying slurry, the pad dresser being pressed against the polishing pad, and supporting the pad dresser And a dresser support mechanism, wherein the dresser support mechanism is provided with AE detection means for detecting the acoustic emission of the dresser support mechanism or the pad dresser.
[0022]
According to the present invention, the dresser support mechanism is provided with AE detection means for detecting the acoustic emission of the dresser support mechanism or the pad dresser, which is caused by a stick-slip phenomenon between the pad dresser and the polishing pad or a variation in frictional resistance. Vibration can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0023]
Here, “acoustic emission” refers to a sound generated when a solid is deformed or destroyed. In general, it often refers to ultrasonic waves of 20 kHz or higher. Since cracks generated in the material can be detected, it is effectively used as a means for inspecting various structures and investigating the properties of the material.
[0024]
A piezoelectric element such as PZT is used to detect AE. This is polarized in the thickness direction, cut to a diameter of several millimeters, and adhered to the surface of the object to be measured, or pressed with a spring or magnet. The AE signal detected by the AE sensor is roughly classified into a continuous type and a sudden type depending on the cause of occurrence.
[0025]
In addition to inspection of structures, it is often used for process monitoring such as welding, cutting, and grinding. In grinding, it is used as a gap eliminator that detects contact between the grindstone and the workpiece or dresser, and also for monitoring the grinding wheel forming condition by dressing, monitoring the condition of the abrasive cutting edge during grinding, and detecting chatter vibration. Can also be applied (see “Cutting / Grinding / Polishing Glossary”, edited by the Japan Society for Abrasive Technology).
[0026]
Further, the present invention is a dressing device for a polishing pad in a processing apparatus for processing a workpiece while contacting a polishing pad while supplying slurry, the dressing device main body, a pad dresser pressed against the polishing pad, A dresser support mechanism that supports the pad dresser and is rotatably supported by the dressing apparatus body, and further includes a torque detection means that detects torque between the dresser support mechanism and the dressing apparatus body. A polishing pad dressing apparatus is provided.
[0027]
According to the present invention, a dressing device includes a dressing device body, a pad dresser, and a dresser support mechanism that is rotatably supported by the dressing device body, and a torque between the dresser support mechanism and the dressing device body. Torque detection means for detecting is provided. And the torque detection means can detect the vibration due to the stick-slip phenomenon between the pad dresser and the polishing pad and the frictional resistance. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0028]
In the present invention, a comparison unit that compares a detection result detected by at least one of the force detection unit, the strain detection unit, the AE detection unit, and the torque detection unit with a predetermined reference value is provided. It is preferable to provide a control means for controlling the machining apparatus based on the comparison result of the means.
[0029]
As described above, when the detected amount exceeds a predetermined reference value, this is regarded as an abnormal phenomenon such as a stick-slip phenomenon or a vibration due to a change in frictional resistance, and an appropriate control of the processing apparatus is performed. This is because such a control of the processing apparatus can easily detect the abnormality of the dressing apparatus and can be further used for uniform and stable dressing of the polishing pad. Control of the processing equipment is judged as an abnormal phenomenon that cannot be ignored, the equipment is stopped, a warning is given as an abnormal phenomenon requiring attention (buzzer sound, etc.), and the processing is judged as a phenomenon that can be ignored. For example.
[0030]
In the present invention, statistical processing using time-series data of detection results detected by at least one of the force detection means, strain detection means, AE detection means, and torque detection means is performed, and It is preferable that a statistical processing unit for comparing the statistical processing result with a predetermined reference value is provided, and a control unit for controlling the machining apparatus based on the comparison result by the statistical processing unit.
[0031]
In this way, if statistical processing is performed and the statistical processing result is compared with a predetermined reference value, abnormality detection of the dressing device can be easily performed, which can be further used for dressing of a uniform and stable polishing pad. is there. Statistical processing includes average value calculation, median value calculation, integrated value calculation, moving average value calculation, and the like. As in the case of the control of the processing device, as described above, it is determined that the abnormal phenomenon cannot be ignored, and the device is stopped. To continue the process.
[0032]
Further, in the present invention, statistical processing means for performing statistical processing using time-series data of detection results detected by at least one of the force detection means, strain detection means, AE detection means, and torque detection means. And a processing speed prediction means for predicting a processing speed of the processing apparatus based on a statistical processing result by the statistical processing means.
[0033]
In this way, if statistical processing is performed and the processing speed of the processing apparatus can be predicted based on the statistical processing result, it is convenient for the operation of the apparatus. Such a configuration is effective as preventive maintenance.
[0034]
Further, in the present invention, statistical processing means for performing statistical processing using time-series data of detection results detected by at least one of the force detection means, strain detection means, AE detection means, and torque detection means. And a pad state display means for quantitatively or stepwise indicating the surface state of the polishing pad based on a statistical processing result by the statistical processing means.
[0035]
Thus, if statistical processing is performed and the surface state of the polishing pad can be quantitatively or stepwise indicated by the statistical processing result, it is convenient for the operation of the apparatus. Such a configuration is effective as preventive maintenance.
[0036]
Further, the present invention is a processing apparatus having a polishing pad dressing device for performing polishing by contacting a polishing pad attached to a polishing surface plate rotating a workpiece while supplying slurry, and dressing the polishing pad. A processing apparatus having a polishing pad dressing device, comprising a surface plate torque detecting means for detecting a torque between a processing apparatus main body and the polishing surface plate.
[0037]
According to the present invention, the processing apparatus is provided with the surface plate torque detecting means for detecting the torque between the processing apparatus main body and the polishing surface plate. It can detect vibration caused by stick-slip phenomenon and frictional resistance. Thereby, abnormality detection of the dressing apparatus can be easily performed, and this can be used for uniform and stable dressing of the polishing pad.
[0038]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of a dressing apparatus for a polishing pad and a processing apparatus having the apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0039]
FIG. 1 is a perspective view showing an overall configuration of a polishing apparatus 10 as a processing apparatus. As shown in the figure, the polishing apparatus 10 is mainly composed of a polishing surface plate 12 and a wafer holding head 14 which is a holding head for holding a workpiece.
[0040]
The polishing surface plate 12 is formed in a disk shape, and a rotating shaft 16 is connected to the center of the lower surface thereof. The polishing surface plate 12 rotates by driving a motor 18 connected to the rotating shaft 16. Further, a polishing pad 20 is affixed to the upper surface of the polishing surface plate 12, and a slurry (a solution in which an abrasive is dispersed) is provided on the polishing pad 20 from a nozzle (not shown) and is often a mechanochemical polishing agent. Is used).
[0041]
2 to 4 show each aspect of a dressing apparatus 30 for a polishing pad according to the present invention. Referring to FIG. 2, a polishing pad dressing apparatus 30 includes a pad dresser 32 made of a flexible metal sheet (plate thickness of 2 mm or less) having abrasive grains electrodeposited thereon, a dresser support mechanism 38, and a dressing. It is composed of the apparatus main body 46 and the like. For example, a pad dresser 32 having an outer diameter of 254 mm (10 inches) can be used.
[0042]
The dresser support mechanism 38 supports the pad dresser 32 and is rotatably supported by the dressing apparatus body 46. The backup plate 34 disposed on the back surface (upper surface in FIG. 2) of the pad dresser 32, and the backup plate And a rotating shaft 36 erected on the back surface (upper surface in FIG. 2) of 34.
[0043]
The dressing apparatus main body 46 has a pressing head 40 that rotatably supports the rotary shaft 36 of the dresser support mechanism 38, and supports the pressing head 40 at one end and is rotatably supported by the swing shaft 44. The arm 42 and the swing shaft 44 are configured.
[0044]
Further, a torque detection means (not shown) for detecting the torque between the dresser support mechanism 38 and the dressing apparatus main body 46 is provided inside the pressing head 40. As this torque detection means, various known devices can be used. For example, a built-in torque meter manufactured by Ono Sokki Co., Ltd. can be used.
[0045]
FIG. 3 shows a state in which the dressing device 30 is retracted from the polishing surface plate 12 while the workpiece is being processed by the wafer holding head 14, and FIG. 4 shows that the arm 42 is swung by the arm 42 and the swing shaft 44. While the polishing pad is being dressed by the dressing device 30, the state is shown.
[0046]
The dressing device 30 is arranged beside the polishing device 10 (see FIG. 1), and the dressing of the polishing pad may be performed independently when the workpiece is not processed, or in parallel during the processing of the workpiece. Sometimes it is done. In that case, it is necessary to set the swing stroke of the arm 42 so as not to interfere with the wafer holding head 14 in FIG.
[0047]
With the above configuration, in the dressing apparatus 30, the pad dresser 32 is pressed against the polishing pad 20 with a predetermined force while being rotated by the rotating shaft 36, and dresses the polishing pad 20 while being swung by the arm 42.
[0048]
That is, the pressing head 40 is attached to the tip of a pivotable arm 42, and dressing is performed by swinging the pad dresser 32 so as to contact the entire surface of the polishing pad 20 while pivoting the arm 42. When dressing is performed between polishing operations, pure water is supplied to the polishing pad 20 while rotating both the polishing surface plate 12 (polishing pad 20) and the dressing device 30, and dressing is performed. A pressing mechanism (not shown) may be provided above the dressing device 30 at the time of dressing. In this case, the dressing device 30 is pressed against the polishing pad 20 by this.
[0049]
As an abrasive grain electrodeposited on the surface of the pad dresser 32, diamond is preferable, but other than this, for example, a CBN abrasive grain can also be used. Electrodeposition is a method of manufacturing a grinding / polishing tool using an electrolytic plating method, and nickel is generally used (see the glossary of cutting / grinding / polishing glossary: edited by the Japan Society for Abrasive Technology).
[0050]
The grain size of the abrasive grains, the density of the abrasive grains on the surface of the pad dresser 32, the material of the abrasive grains, etc. may be appropriately selected in consideration of the material of the polishing pad 20 and the like.
[0051]
In the case of an electrodeposition grindstone, the pad dresser 32 is required to be a conductive metal material based on its principle, and various materials can be used, but in terms of rust prevention, corrosion resistance, strength, etc. Stainless steel is preferred. The plate thickness of the pad dresser 32 is desirably selected in consideration of the size (outer diameter) of the dressing device 30, the pressing pressure, the material of the pad dresser 32, and the like. In addition, when the pad dresser 32 is composed of a bond layer (metal bond, vitrified bond, or resin bond) in which abrasive grains are dispersed, the pad dresser 32 is composed of each bond material.
[0052]
In addition, the structure of the dressing apparatus 30 is not limited to the example of illustration, Various well-known aspects (For example, what is shown by FIG. 6) are employable.
[0053]
Next, the operation of the embodiment of the dressing apparatus for the polishing pad and the polishing apparatus having the apparatus according to the present invention will be described. FIG. 5 is a graph showing the torque detected between the dresser support mechanism 38 and the dressing apparatus main body 46 by the torque detection means. In the graph, the vertical axis represents the detected torque, and the horizontal axis represents the passage of time.
[0054]
In the graph of FIG. 5, the detection result A is an example in which the torque fluctuation is small, and is a state in which it is estimated that the dressing is performed stably. That is, the detection result A always maintains a value much higher than the reference value, although there is some torque fluctuation.
[0055]
On the other hand, in the graph of FIG. 5, the detection result B is an example in which the torque variation is large, and it is estimated that the vibration due to the stick-slip phenomenon and the frictional resistance variation between the pad dresser and the polishing pad is generated. It is. That is, the detection result B has a large torque variation and may be a value higher than the reference value, but is often a value lower than the reference value, and vibration due to stick-slip phenomenon or frictional resistance variation. Is estimated to have occurred.
[0056]
In the graph of FIG. 5, the level at which the predetermined reference value is set may be determined by considering the safety factor based on various implementation data.
[0057]
As described above, the dressing device 30 includes the dressing device main body 46, the pad dresser 32, and the dresser support mechanism 38 that is rotatably supported by the dressing device main body 46. The dresser support mechanism 38 and the dressing device main body 46 are provided. Torque detecting means for detecting the torque between the two is provided. The torque detection means can detect a vibration caused by a stick-slip phenomenon or frictional resistance between the pad dresser 32 and the polishing pad 20. Thereby, abnormality detection of the dressing apparatus 30 can be performed easily, and it can be used for dressing the polishing pad 20 uniformly and stably.
[0058]
As mentioned above, although the example of embodiment of the dressing apparatus of the polishing pad which concerns on this invention, and the polishing apparatus which has this apparatus was demonstrated, this invention is not limited to the example of the said embodiment, Various aspects can be taken. . For example, in the example of the embodiment, torque detecting means is adopted, but instead of this, force detecting means for detecting a frictional force or impact force generated between the polishing pad 20 and the pad dresser 32, and a dresser support mechanism. 38, a displacement detecting means for detecting a displacement amount of the pad dresser 32 or a distortion amount generated in the dresser supporting mechanism 38 or the pad dresser 32, and an AE detecting means for detecting an acoustic emission of the dresser supporting mechanism 38 or the pad dresser 32. It can be taken.
[0059]
In the case of this configuration, various known detection means such as various sensors such as a load cell, a strain gauge, and an AE sensor can be employed.
[0060]
In the example of the present embodiment, the detected torque is compared with a predetermined reference value. Instead, the amount detected by the force detection unit, the strain detection unit, or the AE detection unit and the predetermined reference value are used. It is also possible to adopt a form in which the polishing apparatus is controlled based on the comparison result by comparing with the value.
[0061]
In addition, statistical processing is performed using time-series data of the amount detected by the force detection means, strain detection means, AE detection means, or torque detection means, and the statistical processing result is compared with a predetermined reference value. It is possible to adopt a mode in which the polishing apparatus is controlled based on the result.
[0062]
Further, there is a mode in which statistical processing is performed using time-series data of the amount detected by the force detection means, strain detection means, AE detection means, or torque detection means, and the polishing speed of the polishing apparatus is predicted based on the result. Can be adopted
[0063]
【The invention's effect】
According to the first aspect of the present invention, the dresser support mechanism is provided with force detection means for detecting a frictional force or an impact force generated between the polishing pad and the pad dresser, and is provided between the pad dresser and the polishing pad. Vibration due to stick-slip phenomenon and frictional resistance fluctuations can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0064]
According to the second aspect of the present invention, the dresser support mechanism is provided with strain detection means for detecting the displacement amount of the dresser support mechanism or the pad dresser or the strain amount generated in the dresser support mechanism or the pad dresser. The vibration due to the stick-slip phenomenon between the pad and the frictional resistance can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0065]
According to the third aspect of the present invention, the dresser support mechanism is provided with AE detection means for detecting the acoustic emission of the dresser support mechanism or the pad dresser, and the stick-slip phenomenon and friction between the pad dresser and the polishing pad. Vibrations due to resistance fluctuations can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0066]
According to claim 4 of the present invention, the dressing device includes a dressing device main body, a pad dresser, and a dresser support mechanism that is rotatably supported by the dressing device main body, and the dresser support mechanism, the dressing device main body, Torque detection means for detecting the torque between the two is provided. And the torque detection means can detect the vibration due to the stick-slip phenomenon between the pad dresser and the polishing pad and the frictional resistance. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[0067]
According to the tenth aspect of the present invention, the processing apparatus is provided with the surface plate torque detecting means for detecting the torque between the main body of the processing apparatus and the polishing surface plate. By the surface plate torque detecting means, the pad dresser and Vibration due to stick-slip phenomenon between the polishing pad and fluctuation of frictional resistance can be detected. As a result, abnormality detection of the dressing apparatus can be easily performed, which can be used for uniform and stable dressing of the polishing pad.
[Brief description of the drawings]
FIG. 1 is a perspective view showing the overall structure of a polishing apparatus.
FIG. 2 is a front view of an essential part showing a configuration example of a dressing apparatus.
FIG. 3 is a perspective view illustrating a configuration example of a dressing apparatus.
FIG. 4 is a perspective view showing another aspect of the configuration example of the dressing apparatus.
FIG. 5 is a graph showing torque detected by the torque detection means.
FIG. 6 is a schematic view showing the overall structure of a conventional dressing apparatus.
FIG. 7 is a front view showing a configuration of a conventional dressing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Polishing device, 20 ... Polishing pad, 30 ... Dressing device, 32 ... Pad dresser, 34 ... Backup plate, 36 ... Rotating shaft, 38 ... Dresser support mechanism, 40 ... Pressing head, 42 ... Arm, 44 ... Swing shaft 46. Dressing device body

Claims (10)

A polishing pad dressing apparatus in a processing apparatus for processing a workpiece while contacting the polishing pad while supplying slurry,
A pad dresser that is pressed against the polishing pad, and a dresser support mechanism that supports the pad dresser,
A dressing apparatus for a polishing pad, wherein the dresser support mechanism is provided with force detection means for detecting a frictional force or an impact force generated between the polishing pad and the pad dresser. A polishing pad dressing apparatus in a processing apparatus for processing a workpiece while contacting the polishing pad while supplying slurry,
A pad dresser that is pressed against the polishing pad, and a dresser support mechanism that supports the pad dresser,
The dresser support mechanism is provided with a strain detection means for detecting a displacement amount of the dresser support mechanism or the pad dresser or a strain amount generated in the dresser support mechanism or the pad dresser. Dressing equipment. A polishing pad dressing apparatus in a processing apparatus for processing a workpiece while contacting the polishing pad while supplying slurry,
A pad dresser that is pressed against the polishing pad, and a dresser support mechanism that supports the pad dresser,
A dressing apparatus for a polishing pad, wherein the dresser support mechanism is provided with AE detection means for detecting acoustic emission of the dresser support mechanism or the pad dresser. A polishing pad dressing apparatus in a processing apparatus for processing a workpiece while contacting the polishing pad while supplying slurry,
A dressing device main body, a pad dresser pressed against the polishing pad, and a dresser support mechanism that supports the pad dresser and is rotatably supported by the dressing device main body,
A polishing pad dressing device comprising torque detecting means for detecting torque between the dresser support mechanism and the dressing device body. Comparing means for comparing a detection result detected by at least one of the force detecting means, strain detecting means, AE detecting means, and torque detecting means with a predetermined reference value;
A polishing pad dressing apparatus, comprising control means for controlling the processing apparatus based on a comparison result of the comparison means. Statistical processing is performed using time-series data of detection results detected by at least one of the force detection means, strain detection means, AE detection means, and torque detection means. Provide statistical processing means to compare with the reference value,
A polishing pad dressing apparatus, comprising control means for controlling the processing apparatus based on a comparison result by the statistical processing means. Statistical processing means for performing statistical processing using time-series data of detection results detected by at least one of the force detection means, strain detection means, AE detection means, and torque detection means,
A polishing pad dressing apparatus comprising processing speed prediction means for predicting a processing speed of a processing apparatus based on a statistical processing result of the statistical processing means. Statistical processing means for performing statistical processing using time-series data of detection results detected by at least one of the force detection means, strain detection means, AE detection means, and torque detection means,
A polishing pad dressing apparatus comprising pad state display means for quantitatively or stepwise indicating a surface state of the polishing pad based on a statistical processing result by the statistical processing means. A processing apparatus comprising the polishing pad dressing apparatus according to claim 1. A processing apparatus having a polishing pad dressing device for dressing the polishing pad, while processing by contacting a polishing pad attached to a polishing surface plate rotating a workpiece while supplying slurry,
A processing apparatus having a polishing pad dressing device, comprising a surface plate torque detecting means for detecting a torque between a processing apparatus main body and the polishing surface plate.

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