JP2005094340A - Imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus provided with a means with which man-hours of positioning can be decreased and highly accurate positioning can be carried out. <P>SOLUTION: The imaging apparatus is principally characterized in that it includes: a support mechanism 20 for supporting an optical system 10 for forming an image; at least one of positioning projections 21, 22 being parts of the support mechanism 20 and projected in parallel with an optical axis AX of the optical system 10; a transparent board 30 with holes 31, 32 through which the projections 21, 22 are penetrated, and mounted on a face of the support mechanism 20 orthogonal to the optical axis AX by penetrating the projections 21, 22 through the holes 31, 32; an imaging element mount electrode 40 formed on the front face of the board 30; and an imaging element chip 50 the peripheral part of which is caused to abut on side faces of the projections 21, 22 projected to the front face side of the transparent board 30 through the holes 31, 32 to match a prescribed position of a light receiving face 50a with the optical axis AX of the optical system 10 thereby being mounted onto the electrode 40 (41, 42...). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an image pickup apparatus including an image pickup device such as a CCD image pickup device or a MOS type sensor, and more particularly to a composite product including a digital camera and a digital camera (for example, a mobile phone with a camera, a mobile information terminal with a camera, an in-vehicle camera, a surveillance camera). And the like.

As means for reducing the thickness of the image pickup apparatus, means for flip-chip mounting an image pickup element chip on one surface of a translucent substrate having an infrared cut function on which a wiring pattern is formed is known (see Patent Document 1). This document also describes the background of technological development of the above means and the merits of this means.
JP 2001-203913 (paragraphs [0004] to [0007])

  In implementing the technical means described in Patent Documents 1 and 2, positioning between the optical axis of the optical system and the center of the image receiving surface of the image sensor chip becomes a problem. The positioning method disclosed in Patent Document 1 is a method of positioning using a positioning mark provided on a light-transmitting substrate (see paragraph [0033]). However, this method requires a relatively large number of man-hours for positioning between the optical axis of the optical system and the center of the image receiving surface of the image sensor chip, and the positioning operation takes time. In addition, it is difficult to perform positioning with high accuracy.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an imaging apparatus including means capable of reducing the number of man-hours required for positioning and positioning with high accuracy. is there.

  In order to achieve the above object, the imaging apparatus of the present invention has the following characteristic configuration. In addition, about the characteristic structure of this invention except the following, it clarifies in embodiment.

  An imaging apparatus according to the present invention includes an optical system for forming an image, a holding mechanism for holding the optical system, a part of the holding mechanism, and at least protruding parallel to the optical axis of the optical system. One positioning protrusion and a hole through which the positioning protrusion penetrates. By attaching the positioning protrusion to the hole, the positioning protrusion is mounted in a direction perpendicular to the optical axis. A translucent substrate, an image sensor mounting electrode formed on the surface of the translucent substrate opposite to the surface on which the holding mechanism is mounted, and a hole in the translucent substrate. By bringing a peripheral portion into contact with the side surface of the positioning protruding portion protruding from the surface opposite to the surface on which the holding mechanism of the optical substrate is mounted, the predetermined position of the light receiving surface is set on the optical system. Match the optical axis to the electrode for mounting the image sensor Receiving surface is characterized in that and an image sensor chip mounted in a direction opposite to the optical system.

  According to the present invention, a structure capable of mechanically positioning the optical axis of the optical system and the image sensor chip is added. For this reason, it is possible to provide an imaging apparatus that can reduce the number of man-hours required for positioning, can be positioned with high accuracy, and can reduce manufacturing costs.

(First embodiment)
1A and 1B are diagrams showing a configuration of an imaging module IM of an imaging apparatus according to a first embodiment of the present invention. FIG. 1A is a longitudinal sectional view, and FIG. 1B is a bottom view when a sealing member 70 is removed. FIG. FIG. 2 is an exploded perspective view of the imaging module IM. The holding mechanism 20 shown in FIGS. 1A and 1B and FIG. 2 is a part generally called a lens frame, and is integrally formed in a cylindrical shape with a synthetic resin or the like. An optical system 10 including a lens 12 for forming an image based on light from a subject incident through the opening 11 is accommodated and held in the hollow axial portion.

  At least one (two in this embodiment) positioning projections 21 and 22 projecting parallel to the optical axis AX of the optical system 10 are provided in a part of the holding mechanism 20, that is, the rear end opening. Yes. In addition to the positioning protrusions 21 and 22, at least one (two in this embodiment) reinforcing protrusions 23 and 24 are provided on the other part of the holding mechanism 20.

  The translucent substrate 30 is, for example, a glass substrate having an infrared cut function, and a wiring pattern 30a is formed on one surface thereof. The translucent substrate 30 is provided with holes 31 and 32 through which the positioning protrusions 21 and 22 pass and holes 33 and 34 through which the reinforcing protrusions 23 and 24 pass. Thus, the translucent substrate 30 allows the positioning protrusions 21 and 22 to pass through the holes 31 and 32 and the reinforcing protrusions 23 and 24 to pass through the holes 33 and 34, thereby It is attached to the rear end surface orthogonal to the optical axis AX. An imaging element mounting electrode 40 (41, 42,...) Is formed on a surface of the translucent substrate 30, that is, a predetermined region on one surface where the wiring pattern 30a is formed.

  The predetermined region is a region corresponding to the peripheral portion of the rear end opening of the holding mechanism 20 and is a rectangular closed loop located closer to the center of the rear end opening than the positioning protrusions 21 and 22. A region E (illustrated by a two-dot chain line).

  The imaging element chip 50 is an element for converting an image formed by the optical system 10 into an electrical signal. The imaging element chip 50 is positioned with respect to the translucent substrate 30 mainly by the following assembly process.

  First, as shown in FIG. 3, the imaging element chip 50 is positioned with respect to the translucent substrate 30 and flip-chip mounted. That is, the bumps 60 for electrical connection are mounted on the electrodes 40 on the translucent substrate 30. In this state, a recognition mark (not shown) provided on the surface of the translucent substrate 30 is recognized by a TV camera (not shown) or the like so that the circuit surface of the image pickup device chip 50, that is, the light receiving surface 50a faces downward. Thus, the image pickup device chip 50 is mounted on the translucent substrate 30 as indicated by a thick arrow while aligning the position of the image pickup device chip 50 with high accuracy.

  Next, as shown in FIG. 4, it presses with the predetermined pressure P from the upper part. By doing so, the bump 60 is deformed and the electrical connection between the electrode (not shown) provided on the imaging element chip 50 and the electrode 40 on the translucent substrate 30 is reliably performed.

  In this state, as shown in FIG. 5, the main part of the image sensor chip 50 is temporarily bonded to the light-transmitting substrate 30 with the adhesive A. By doing so, the position of the image pickup device chip 50 is prevented from being shifted with respect to the translucent substrate 30. In addition, the said important point points out the location corresponding to the place where the said protrusions 21 and 22 for positioning do not protrude.

  Next, as shown in FIG. 6, the positioning protrusions 21 and 22 and the reinforcing protrusions 23 and 24 are passed through holes 31, 32, 33, and 34, respectively, of the translucent substrate 30. It protrudes to the surface side of the substrate 30. As shown in FIG. 7, two sides of the imaging element chip 50 that are not opposed to each other, that is, two adjacent sides, with respect to the side surfaces of the projecting portions of the positioning projecting portions 21 and 22 projecting to the surface side of the translucent substrate 30 51 and 52 are made to contact. By doing so, the center portion O (see FIG. 1), which is a predetermined position of the light receiving surface 50a of the imaging element chip 50, exactly coincides with the optical axis AX of the optical system 10.

  By the way, the holes 31 and 32 through which the positioning protrusions 21 and 22 opened in the light transmitting substrate 30 and the holes 33 and 34 through which the reinforcing protrusions 23 and 24 pass are respectively formed in the light transmitting substrate. The image sensor chip 50 mounted on the board 30 is disposed in the vicinity of a different side. The holes 33 and 34 are disposed at positions slightly apart from the two different sides 53 and 54 of the image sensor chip 50. Thus, the reinforcing protrusions 23 and 24 penetrating the holes 33 and 34 do not interfere with the positioning operation of the imaging element chip 50 by the positioning protrusions 21 and 22.

  The entire periphery of the imaging element chip 50 positioned as described above is sealed by a sealing member 70 that also serves as an adhesive. At this time, also in the gap portions of the holes 31, 32, 33, 34 of the translucent substrate 30 through which the protruding portions 21.22.23.24 existing in the peripheral portion of the imaging element chip 50 pass, The sealing member 70 also serving as the adhesive is filled. For this reason, each penetration part of the said protrusion part and a hole is also sealingly fixed by the sealing member 70. FIG.

  Thereby, not only the holding mechanism 20 is fixed to the translucent substrate 30 but also dust or the like entering the light receiving surface of the image sensor from the through holes 31 to 34 provided in the translucent substrate 30 can be eliminated. it can.

  In the imaging apparatus of the present embodiment, the optical axis AX of the optical system 10 and the imaging element chip 50 are simply applied to the side surfaces of the positioning protrusions 21 and 22 by simply applying the two sides 51 and 52 of the imaging element chip 50. The center portion O of the light receiving surface 50a can be easily and accurately positioned.

(Second embodiment)
FIG. 8 is a perspective view showing the configuration of the imaging module IM of the imaging apparatus according to the second embodiment of the present invention. The second embodiment is different from the first embodiment in that the positioning protrusions 21 and 22 and the reinforcing protrusions 23 and 24 are configured by cylindrical pins 81 to 84, and correspondingly translucent. The holes 31 to 34 in the substrate 30 are also relatively small oval holes 91 to 94. Even with such a configuration, the same effects as those of the first embodiment can be exhibited.

(Third embodiment)
FIG. 9 is a perspective view showing the configuration of the imaging module IM of the imaging apparatus according to the third embodiment of the present invention. The third embodiment differs from the second embodiment in that the reinforcing protrusions 83 and 84 provided in the holding mechanism 20 are omitted. In the third embodiment, the coupling force between the holding mechanism 20 and the translucent substrate 30 is slightly inferior to that of the third embodiment. However, since the configuration is simplified, there is an advantage that the manufacture is facilitated.

  In the first to third embodiments, the positioning protrusions 21 and 22 are applied to the two sides of the image pickup device chip 50, whereby the position of the image pickup device in the XY direction (XY orthogonal to the optical axis AX). (Position on the plane) is positioned, but it may be applied to only a single surface of the image pickup device chip 50 to perform positioning in only one of the XY directions. In this case, the other positioning requires positioning by another method according to the prior art.

In the first to third embodiments, the center portion O of the light receiving surface of the image sensor chip 50 is aligned with the position of the optical axis AX. However, the present invention is not limited to this, and the predetermined portion is not the center portion of the light receiving surface. The position and the optical axis AX may be positioned. For example, when it is known that the center of the subject to be photographed is above the center of the photographing range, the optical axis AX is aligned slightly above the center of the photographing range, and the descriptiveness of this portion is improved. You may make it the best. (Descriptability right under the optical axis is the best, and as the distance from the optical axis increases, descriptiveness decreases.)
(Feature points in the embodiment)
[1] The imaging device shown in the embodiment
An optical system 10 (including a lens 12 and the like) for forming an image;
A holding mechanism 20 for holding the optical system 10;
A part of the holding mechanism 20, and at least one positioning protrusions 21 and 22 that protrude parallel to the optical axis AX of the optical system 10;
The positioning protrusions 21, 22 have holes 31, 32 through which the positioning protrusions 21, 22 pass through the holes 31, 32, whereby the optical axis AX with respect to the holding mechanism 20. A translucent substrate 30 mounted in a direction orthogonal to
An imaging element mounting electrode 40 (41, 42...) Formed on the surface of the translucent substrate 30 opposite to the surface on which the holding mechanism 20 is mounted;
Through the holes 31, 32 of the translucent substrate 30, the side surfaces of the positioning projections 21, 22 projecting to the surface of the translucent substrate 30 opposite to the surface on which the holding mechanism 20 is mounted, By bringing the peripheral portion into contact with each other, the predetermined position of the light receiving surface 50a coincides with the optical axis AX of the optical system 10 so that the light receiving surface 50a corresponds to the electrode 40 (41, 42...) For mounting the image sensor. An image sensor chip 50 mounted in a direction facing the optical system 10;
It is provided with.

  In the image pickup apparatus, the optical axis AX of the optical system 10 and the light receiving surface 50a of the image pickup element chip 50 are predetermined by simply applying the peripheral portion of the image pickup element chip 50 to the side surfaces of the positioning protrusions 21 and 22. The position can be easily and accurately determined. In other words, since it can be mechanically positioned, the number of man-hours for positioning can be greatly reduced, and highly accurate positioning can be performed.

[2] The imaging device described in the embodiment is the imaging device according to [1],
The peripheral portion of the image sensor chip 50 is two sides 51 and 55 that are not opposed to each other in parallel with the image sensor chip 50.

  In the imaging apparatus, two sides to be applied to the side surfaces of the positioning protrusions 21 and 22 are adjacent to each other with one corner interposed therebetween. For this reason, positioning workability is extremely excellent. Accordingly, a quick and accurate positioning operation can be performed.

[3] The imaging device shown in the embodiment is the imaging device according to [1],
A part of the holding mechanism 20 is provided separately from the positioning protrusions 21 and 22 and passes through holes 33 and 34 provided separately in the translucent substrate 30 (in this embodiment, Two) the reinforcing protrusions 23 and 24 are further provided.

  In the imaging apparatus, the fixing force at the penetrating portion between the positioning protrusions 21 and 22 and the holes 31 and 32 and the fixing force at the penetrating portion between the reinforcing protrusions 23 and 24 and the holes 33 and 34 are comprehensive. To work. For this reason, the fixing strength between the holding mechanism 20 and the translucent substrate 39 can be significantly increased.

[4] The imaging device described in the embodiment is the imaging device according to [3],
The holes 31 and 32 through which the positioning protrusions 21 and 22 opened in the light transmitting substrate 30 and the holes 33 and 34 through which the reinforcing protrusions 23 and 24 pass are respectively formed in the light transmitting substrate 30. The image pickup device chip 50 is mounted in the vicinity of different sides.

  In the imaging apparatus, the fixing force of the sealing member in the through portion between the protruding portion and the hole works substantially uniformly and in a balanced manner with respect to each peripheral portion of the imaging element chip 50. Therefore, the fixing strength between the holding mechanism 20 and the translucent substrate 39 can be efficiently increased.

[5] The imaging device shown in the embodiment is the imaging device according to any one of [1] to [4],
A sealing member 70 for sealing the peripheral portion over the entire area is further provided in the peripheral portion of the imaging element chip 50.

  In the imaging apparatus, the imaging element chip 50 can be sealed from the outside. As a result, the moisture resistance, dustproofness, etc. of the light receiving surface 50a of the imaging element chip 50 can be improved, and a good imaging function can be maintained over a long period of time.

(Modification)
The imaging device shown in the embodiment includes the following modifications.

(1) Instead of the two positioning protrusions 21 and 22, a single L-shaped protrusion that extends from one side of the rear end opening of the holding mechanism 20 to another adjacent side is used. The substrate 30 is formed with a single L-shaped hole that engages with the L-shaped protrusion.

  Using this device, digital cameras and composite products including digital cameras that are strongly required to be thin and reduce manufacturing costs (for example, mobile phones with cameras, portable information terminals with cameras, in-vehicle cameras, surveillance cameras, etc.) Can be supplied stably.

2A and 2B are diagrams illustrating a configuration of an imaging module of the imaging apparatus according to the first embodiment of the present invention, in which FIG. 1A is a longitudinal sectional view, and FIG. 2B is a plan view viewed from the bottom side with the sealing member 70 removed. is there. It is a disassembled perspective view which shows the structure of the imaging module of the imaging device which concerns on 1st Embodiment of this invention. It is a perspective view which shows the 1st assembly process of the imaging module of the imaging device which concerns on 1st Embodiment of this invention. It is a perspective view which shows the 2nd assembly process of the imaging module of the imaging device which concerns on 1st Embodiment of this invention. It is a perspective view which shows the 3rd assembly process of the imaging module of the imaging device which concerns on 1st Embodiment of this invention. It is a perspective view which shows the 4th assembly process of the imaging module of the imaging device which concerns on 1st Embodiment of this invention. It is a perspective view which shows the 5th assembly process of the imaging module of the imaging device which concerns on 1st Embodiment of this invention. It is a disassembled perspective view which shows the structure of the imaging module of the imaging device which concerns on 2nd Embodiment of this invention. It is a principal part perspective view which shows the structure of the imaging module of the imaging device which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Optical system, 12 ... Lens, 20 ... Holding mechanism, 21, 22 ... Projection part for positioning, 23, 24 ... Protrusion part for reinforcement, 30 ... Translucent substrate, 30a ... Wiring pattern, 31, 32 ... For positioning , 33, 34: holes for reinforcement, 40 (41, 42-) ... electrode, 50 ... imaging element chip, 51, 52 ... two adjacent sides of the imaging element chip, 60 ... bumpo, 70 ... sealing member .

Claims (5)

An optical system for forming an image;
A holding mechanism for holding the optical system;
A part of this holding mechanism, and at least one positioning protrusion protruding parallel to the optical axis of the optical system;
A translucent substrate mounted in a direction perpendicular to the optical axis with respect to the holding mechanism by having a hole through which the positioning protrusion passes, and by passing the positioning protrusion through the hole;
An electrode for mounting an image sensor formed on the surface opposite to the surface on which the holding mechanism of the translucent substrate is mounted;
By bringing a peripheral portion into contact with the side surface of the positioning protrusion protruding from the surface opposite to the surface on which the holding mechanism of the light transmitting substrate is mounted through the hole of the light transmitting substrate, An image pickup device chip that is mounted in a direction in which the light receiving surface faces the optical system with respect to the electrode for mounting the image pickup device by matching a predetermined position of the light receiving surface with the optical axis of the optical system;
An imaging apparatus comprising:   The imaging apparatus according to claim 1, wherein the periphery of the imaging element chip is two sides that are not opposed to each other in parallel with the imaging element chip.   A part of the holding mechanism further includes at least one reinforcing protrusion that is provided separately from the positioning protrusion and penetrates through a hole provided separately in the translucent substrate. The imaging device according to claim 1.   The holes through which the positioning protrusions and the reinforcing protrusions that are opened in the translucent substrate pass respectively correspond to the vicinity of different sides of the imaging element chip mounted on the translucent substrate. The imaging apparatus according to claim 3, wherein the imaging apparatus is arranged.   5. The imaging apparatus according to claim 1, further comprising a sealing member that seals the peripheral portion over the entire area around the imaging element chip.

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