JP2005082163A - Cover tape for packaging electronic component - Google Patents
Cover tape for packaging electronic component Download PDFInfo
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- JP2005082163A JP2005082163A JP2003313341A JP2003313341A JP2005082163A JP 2005082163 A JP2005082163 A JP 2005082163A JP 2003313341 A JP2003313341 A JP 2003313341A JP 2003313341 A JP2003313341 A JP 2003313341A JP 2005082163 A JP2005082163 A JP 2005082163A
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- Prior art keywords
- cover tape
- tape
- carrier tape
- sealing
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 13
- 239000012790 adhesive layer Substances 0.000 claims abstract description 9
- -1 polypropylene Polymers 0.000 claims abstract description 7
- 239000004743 Polypropylene Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 6
- 239000004677 Nylon Substances 0.000 claims abstract description 5
- 229920001778 nylon Polymers 0.000 claims abstract description 5
- 229920001155 polypropylene Polymers 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 238000009751 slip forming Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 abstract description 21
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000001070 adhesive effect Effects 0.000 abstract description 7
- 238000005259 measurement Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229920001684 low density polyethylene Polymers 0.000 description 2
- 239000004702 low-density polyethylene Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
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- Packages (AREA)
- Wrappers (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明はチップ型電子部品の保管、輸送、装着に際し、チップ型表面実装用電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、収納ポケットを形成したプラスチック製キャリアテープにシールされるカバーテープに関するものである。 The present invention relates to a storage pocket of a packaging body that protects chip-type surface-mounting electronic components from contamination, aligns them for mounting on an electronic circuit board, and removes them when storing, transporting, and mounting the chip-type electronic components. It is related with the cover tape sealed by the plastic carrier tape which formed.
近年、ＩＣを始めとして、トランジスター、ダイオード、コンデンサー、圧電素子レジスター、などの表面実装用電子部品は、電子部品の形状に合わせて、収納しうるエンボス成形されたポケットを連続的に形成したプラスチック製キャリアテープとキャリアテープにシールしうるカバーテープとからなる包装体に包装されて供給されている。内容物の電子部品は包装体のカバーテープを剥離した後、自動的に取り出され電子回路基板に表面実装されている。 In recent years, surface mount electronic components such as ICs, transistors, diodes, capacitors, piezoelectric element resistors, etc., are made of plastic with a continuous embossed pocket that can be accommodated according to the shape of the electronic components. It is packaged and supplied in a package comprising a carrier tape and a cover tape that can be sealed to the carrier tape. The electronic components of the contents are automatically taken out after the cover tape of the package is peeled off and mounted on the surface of the electronic circuit board.
その際、シール後の検品や、実装機装着時の取り扱いによっては、シールされた状態の包装体にねじる力がかかる場合があり、カバーテープがねじる力に耐えかねてキャリアテープから剥がれる、あるいは径時的に剥がれてしまういわゆる『テープ剥がれ』トラブルが発生していた。このトラブルが発生すると搬送中あるいは実装機に取り付ける際に梱包されている内容物がキャリアテープのエンボス部から脱落する等のトラブルが発生することがあり、生産歩留りを落とす大きな要因となっている。その対策としてカバーテープをキャリアテープへ強くシールするためにシールする際の温度や圧力を高く設定したりしていたが、これらの条件を高い値に設定するとカバーテープにダメージを与えてしまい、剥離時にテープが切れたり、接着剤がはみ出して剥離時それが糸をひくように剥れてポケット内へ混入したり、シール強度が強すぎるために電子部品の実装工程でカバーテープを剥離する際にキャリアテープが振動して電子部品がキャリアテープのエンボス部から飛び出す等の別のトラブルが発生していた。これまで、特許文献１のようにカバーテープを剥離する際にカバーテープの層構成の一部で層間剥離を生じさせる様に設計し、シール強度がキャリアテープの状態に影響されにくいような対策をとっている事例もあるが、カバーテープ自体の剛性を制御しシール後のねじる力への耐性を向上させる試みはされていない。
At that time, depending on the inspection after sealing and handling when mounting the machine, the sealed package may be twisted, and the cover tape cannot withstand the twisting force and peels off from the carrier tape. The so-called “tape peeling” trouble that would be peeled off. When this trouble occurs, troubles such as dropping of the packaged contents from the embossed part of the carrier tape during transportation or mounting on the mounting machine may occur, which is a major factor in reducing the production yield. To prevent this, the cover tape was strongly sealed to the carrier tape, and the temperature and pressure during sealing were set high. However, if these conditions were set to high values, the cover tape would be damaged and peeled off. Sometimes when the tape breaks, when the adhesive protrudes and peels off, it peels like a thread and mixes into the pocket, or when the cover tape is peeled off during the electronic component mounting process because the seal strength is too strong Another trouble has occurred, such as the carrier tape vibrating and the electronic components popping out of the embossed portion of the carrier tape. Until now, when peeling the cover tape as in
本発明は、前述のシール後の検品や、実装機装着時の取り扱いでねじる力がかかった際にカバーテープがキャリアテープから剥れてしまう様なトラブルを防止すべく、テーピング後のキャリアテープの取り扱いを原因とするテープ剥れが発生しないカバーテープを提供することにある。 The present invention is to inspect the carrier tape after taping in order to prevent troubles such that the cover tape is peeled off from the carrier tape when a twisting force is applied in the inspection after the above-described sealing or handling when the mounting machine is mounted. An object of the present invention is to provide a cover tape that does not cause tape peeling due to handling.
本発明は、
（１） 少なくとも基材層と接着層とを積層してなるカバーテープであって、ループスティフネステスタ法による初期衝撃値が０．１〜４ｃNであることを特徴とする電子部品包装用カバーテープ、
（２） 基材層が、ポリエステル、ポリプロピレン、ナイロンの内少なくとも１種である（１）項記載の電子部品包装用カバーテープ、
（３） 電子部品を収納する収納ポケットを連続的に形成したプラスチック製キャリアテープに、ヒートシールしうる（１）又は（２）項記載の電子部品包装用カバーテープ、
（４） 電子部品を収納する収納ポケットを連続的に形成したプラスチック製キャリアテープに、粘着シールしうる（１）又は（２）項記載の電子部品包装用カバーテープ、
である。
The present invention
(1) A cover tape formed by laminating at least a base material layer and an adhesive layer, wherein an initial impact value by a loop stiffness tester method is 0.1 to 4 cN,
(2) The cover tape for packaging electronic parts according to (1), wherein the base material layer is at least one of polyester, polypropylene, and nylon,
(3) A cover tape for packaging electronic parts according to (1) or (2), which can be heat-sealed on a plastic carrier tape in which storage pockets for storing electronic parts are continuously formed.
(4) A cover tape for packaging electronic parts according to (1) or (2), which can be adhesively sealed to a plastic carrier tape in which storage pockets for storing electronic parts are continuously formed.
It is.
本発明により、テーピング後のキャリアテープの取り扱いを原因とするテープ剥がれ発生問題を解決することができる。 According to the present invention, it is possible to solve the problem of tape peeling caused by handling of the carrier tape after taping.
本発明におけるカバーテープの一例を図１で説明する。基材層は、特に制限するものではないがシール時の温度において実使用上問題がなければよく、例えば、ポリエステル、ポリプロピレン、ナイロンなどがあげられる。さらにこれらのフィルムを二軸延伸したものは耐テープ切れ性、耐熱性が向上し好適に使用できる。
また、特にカバーテープに導電性が必要とされる用途においては、界面活性剤、導電性フィラー、導電性高分子などからなる導電層を基材層表面に設けても良い。
接着層は、ヒートシールあるいは粘着シールによりキャリアテープに接着可能な材料であれば特に限定されず、従来カバーテープの接着層として用いられていたエチレン系共重合体やポリエステル系樹脂、アクリル系樹脂等も使うことができる。また、特にカバーテープに導電性が必要とされる用途においては、界面活性剤、導電性フィラー、導電性高分子などからなる導電層を接着層表面に設けても良い。
基材層と接着層との他に、中間層としてポリエチレンや接着性樹脂などのポリオレフィン系樹脂からなる群の少なくとも１種を積層することができる。
An example of the cover tape in the present invention will be described with reference to FIG. The base material layer is not particularly limited, but may be any problem in practical use at the temperature at the time of sealing, and examples thereof include polyester, polypropylene, and nylon. Further, those obtained by biaxial stretching of these films can be suitably used because the tape breakage resistance and heat resistance are improved.
Further, in applications where the cover tape requires conductivity, a conductive layer made of a surfactant, a conductive filler, a conductive polymer, or the like may be provided on the surface of the base material layer.
The adhesive layer is not particularly limited as long as it is a material that can be adhered to the carrier tape by heat sealing or adhesive sealing, and an ethylene copolymer, a polyester resin, an acrylic resin, or the like that has been used as an adhesive layer of a conventional cover tape. Can also be used. In particular, in applications where the cover tape requires electrical conductivity, a conductive layer made of a surfactant, a conductive filler, a conductive polymer, or the like may be provided on the surface of the adhesive layer.
In addition to the base material layer and the adhesive layer, at least one member of the group consisting of polyolefin resins such as polyethylene and adhesive resin can be laminated as an intermediate layer.
これらの素材の選択・積層厚みは、最終的な積層体であるカバーテープのループスティフネステスタ法による初期衝撃値が０．１〜４ｃNであるように決定される。さらに好ましくは初期衝撃値が０．１２〜３cNである。初期衝撃値が下限値未満であると、ねじりテストによる剥がれは発生しないものの、剥離時にシール部に引っ張られ、剥離が出来なくなる。また、上限値を超えると、キャリアテープへシールした後にねじる力がかかった際にカバーテープ自体の剛性によって剥がれが発生する。 The selection and lamination thickness of these materials are determined so that the initial impact value of the cover tape, which is the final laminate, by the loop stiffness tester method is 0.1 to 4 cN. More preferably, the initial impact value is 0.12 to 3 cN. If the initial impact value is less than the lower limit value, peeling by the torsion test does not occur, but it is pulled to the seal part at the time of peeling, and peeling becomes impossible. When the upper limit is exceeded, peeling occurs due to the rigidity of the cover tape itself when a twisting force is applied after sealing to the carrier tape.
上記のカバーテープをキャリアテープへシールする際の手段として、カバーテープに粘着剤が塗工してあり、それを圧着し、粘着シールを行うタイプと、カバーテープにヒートシール剤が積層されており、ヒートシールを行うタイプとがあるが、いずれのシール手段を選択した場合においても上記ループスティフネステスタ法による初期衝撃値が０．１〜４ｃNの範囲内になければ、テープ剥れが生じる。 As a means to seal the above cover tape to the carrier tape, adhesive is applied to the cover tape, and the adhesive tape is applied to the cover tape to perform adhesive sealing, and the heat sealing agent is laminated to the cover tape. There is a type in which heat sealing is performed, but even when any sealing means is selected, if the initial impact value by the loop stiffness tester method is not within the range of 0.1 to 4 cN, tape peeling occurs.
本発明でいう初期衝撃値は、ループスティフネステスター（東洋精機（株）製）を用いてフィルム製膜時の流れ方向で巾２５ｍｍ、ループ長さ６２ｍｍに設定した試料を５ｍｍ押し込んだ時から径時的にスティフネス強度を測定し、その間における最大スティフネス強度を初期衝撃値とした。 The initial impact value referred to in the present invention is the time from when a sample set to a width of 25 mm and a loop length of 62 mm is pushed in by 5 mm in a flow direction during film formation using a loop stiffness tester (manufactured by Toyo Seiki Co., Ltd.). Stiffness strength was measured, and the maximum stiffness strength in the meantime was taken as the initial impact value.
本発明の実施例を以下に示すがこれらの実施例によって本発明は何ら限定されるものではない。膜厚１０〜１２０μｍの基材に対して１０μｍを接着層とともに共押出し法により製膜し、図１に示した層構成のカバーテープを得た。得られたカバーテープを５．５ｍｍ幅にスリット後、８ｍｍ幅のＰＳ製キャリアテープとヒートシールを行い、ピールオフ強度測定、ループスティフネステスト及びねじりテストを実施した。その特性評価結果を実施例については表１に、比較例については表２に示した。表中の（層構成）内の数値は各層の厚み（μｍ）を示す。 Examples of the present invention are shown below, but the present invention is not limited to these examples. 10 μm of the base material having a film thickness of 10 to 120 μm was formed by coextrusion together with the adhesive layer to obtain a cover tape having a layer structure shown in FIG. After slitting the obtained cover tape to a width of 5.5 mm, it was heat-sealed with a PS carrier tape having a width of 8 mm, and a peel-off strength measurement, a loop stiffness test and a torsion test were performed. The characteristic evaluation results are shown in Table 1 for the examples and Table 2 for the comparative examples. The numerical value in (layer structure) in the table indicates the thickness (μm) of each layer.
表中の記号は以下の通りである。
ＰＥＴ ：ポリエチレンテレフタレート
ＰＰ ：ポリプロピレン
Ｎｙ ：ナイロン
ＬＤＰＥ ：低密度ポリエチレン
ＥＶＡ ：エチレンー酢酸ビニル共重合体
ＥＡＡ ：エチレンーアクリル酸共重合体（粘着剤）
ＥＥＡ ：エチレンーエチルアクリレート共重合体
ＥＭＭＡ ：エチレンーメチルメタクリレート共重合体
ＡＤ ：接着性樹脂（ポリエチレン酸変性物）
The symbols in the table are as follows.
PET: Polyethylene terephthalate PP: Polypropylene Ny: Nylon LDPE: Low density polyethylene EVA: Ethylene-vinyl acetate copolymer EAA: Ethylene-acrylic acid copolymer (adhesive)
EEA: ethylene-ethyl acrylate copolymer EMMA: ethylene-methyl methacrylate copolymer AD: adhesive resin (polyethylene acid-modified product)
作成したカバーテープそれぞれについて、測定したピールオフ強度、ループスティフネステストの初期衝撃値、ねじりテストは下記条件にて実施し、評価した。
＜ピールオフ強度測定＞
（シール条件）
シール機 ＮＥＴ−３０００ （日東工業（株）社製）
シールコテサイズ ０．５ｍｍ×１６ｍｍ ２列
シール温度 剥離強度が４０ｃN前後になる温度（但し、実施例２、比較例２にあるような粘着シール時は加温しない）
シール時間 ０．２sec
シール圧力 ９．８Ｎ
キャリアテープ ポリスチレン製キャリアテープ
（ピール条件）
測定器 ＧＰＤ８５６Ｖ （ＧＰＤ社製）
ピール速度 ３００ｍｍ/min
剥離角度 １８０°
＜ループスティフネステスト＞
測定器：ループスティフネステスター （東洋精機（株）社製）
測定条件：試験片サイズ ２５ｍｍ×１１０ｍｍ（製膜時の流れ方向）
ループ長さ ６２ｍｍ
押し込み量 ５ｍｍ
（評価）
・上記条件で径時的にスティフネス強度を測定し、その間における最大スティフネス強度を初期衝撃値とした。
＜ねじりテスト＞
（シール条件）
・上記ピールオフ強度測定時と同様とした。
（ねじり条件）
・ 上記条件でシールしたサンプル２０ｃｍを手で持ち１８０℃ねじりを１０往復行った。
（評価）
・ 上記条件の負荷を加えた際のシール部について、目視により剥れの有無を観察した。
・ 剥がれなしを〇（良）とし、剥がれ発生を×（不良）とした。
For each of the produced cover tapes, the measured peel-off strength, the initial impact value of the loop stiffness test, and the torsion test were evaluated under the following conditions.
<Peel-off strength measurement>
(Sealing conditions)
Sealing machine NET-3000 (manufactured by Nitto Kogyo Co., Ltd.)
Sealing iron size 0.5 mm x 16 mm Double row sealing temperature Temperature at which the peel strength becomes around 40 cN (however, it is not heated during adhesive sealing as in Example 2 and Comparative Example 2)
Sealing time 0.2sec
Sealing pressure 9.8N
Carrier tape Polystyrene carrier tape (peel condition)
Measuring instrument GPD856V (made by GPD)
Peel speed 300mm / min
Peel angle 180 °
<Loop stiffness test>
Measuring instrument: Loop stiffness tester (Toyo Seiki Co., Ltd.)
Measurement conditions: Specimen size 25 mm x 110 mm (flow direction during film formation)
Loop length 62mm
Push-in amount 5mm
(Evaluation)
-Stiffness strength was measured temporally under the above conditions, and the maximum stiffness strength in the meantime was taken as the initial impact value.
<Torsion test>
(Sealing conditions)
・ Same as the above peel off strength measurement.
(Torsion condition)
-A sample 20 cm sealed under the above conditions was held by hand and 180 ° C. twisting was performed 10 times.
(Evaluation)
-About the seal part at the time of applying the load of the said conditions, the presence or absence of peeling was observed visually.
-No peeling was defined as ◯ (good), and peeling occurred as x (defective).
本発明は電子部品の保管、輸送、装着に際し、電子部品を汚染から保護し、電子回路基板に実装するために整列させ、取り出せる機能を有する包装体のうち、収納ポケットを形成したプラスチック製キャリアテープにシールすることができ、テーピング後のキャリアテープの取り扱いを原因とするテープ剥がれ発生を防止しうるカバーテープを提供する。 The present invention relates to a plastic carrier tape in which a storage pocket is formed in a package having a function of protecting electronic components from contamination, arranging them for mounting on an electronic circuit board, and taking them out during storage, transportation and mounting of the electronic components. It is possible to provide a cover tape that can be prevented from peeling off due to handling of the carrier tape after taping.
１ カバーテープ
２ 基材層
３ 接着層
４ シール部
５ キャリアテープ
1 Cover
3
5 Carrier tape
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003313341A JP2005082163A (en) | 2003-09-05 | 2003-09-05 | Cover tape for packaging electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003313341A JP2005082163A (en) | 2003-09-05 | 2003-09-05 | Cover tape for packaging electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2005082163A true JP2005082163A (en) | 2005-03-31 |
Family
ID=34414288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003313341A Pending JP2005082163A (en) | 2003-09-05 | 2003-09-05 | Cover tape for packaging electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005082163A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016140810A (en) * | 2015-01-30 | 2016-08-08 | 上野製薬株式会社 | Oxygen absorbent |
| JP2023070266A (en) * | 2021-11-09 | 2023-05-19 | 大日本印刷株式会社 | Cover tape for electronic component packaging, set for package and package |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752338A (en) * | 1993-08-19 | 1995-02-28 | Sumitomo Bakelite Co Ltd | Cover tape for packing chip type electronic component |
| JPH0994905A (en) * | 1995-09-28 | 1997-04-08 | Dainippon Printing Co Ltd | Laminated body and lid material using the same |
| JPH09267450A (en) * | 1996-01-29 | 1997-10-14 | Dainippon Printing Co Ltd | Cover tape |
| JP2002362622A (en) * | 2001-06-08 | 2002-12-18 | Toppan Printing Co Ltd | Pressure-sensitive cover tape |
| JP2003141935A (en) * | 2001-10-31 | 2003-05-16 | Toppan Printing Co Ltd | Transparent conductive cover tape |
-
2003
- 2003-09-05 JP JP2003313341A patent/JP2005082163A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752338A (en) * | 1993-08-19 | 1995-02-28 | Sumitomo Bakelite Co Ltd | Cover tape for packing chip type electronic component |
| JPH0994905A (en) * | 1995-09-28 | 1997-04-08 | Dainippon Printing Co Ltd | Laminated body and lid material using the same |
| JPH09267450A (en) * | 1996-01-29 | 1997-10-14 | Dainippon Printing Co Ltd | Cover tape |
| JP2002362622A (en) * | 2001-06-08 | 2002-12-18 | Toppan Printing Co Ltd | Pressure-sensitive cover tape |
| JP2003141935A (en) * | 2001-10-31 | 2003-05-16 | Toppan Printing Co Ltd | Transparent conductive cover tape |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016140810A (en) * | 2015-01-30 | 2016-08-08 | 上野製薬株式会社 | Oxygen absorbent |
| JP2023070266A (en) * | 2021-11-09 | 2023-05-19 | 大日本印刷株式会社 | Cover tape for electronic component packaging, set for package and package |
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