JP2005079884A - Demultiplexing circuit board using surface acoustic wave filter, high-frequency module including the same, and wireless communication apparatus - Google Patents

Abstract

A small-sized and low-loss demultiplexing circuit board suitable for single-band and dual-band mobile radio terminals is provided.
Multilayer substrates 103, 104, 106, 110, surface acoustic wave filters 101, 102 having different passbands on the transmission side and the reception side, a matching circuit 105 formed on the multilayer substrate 104, a matching circuit 105, and surface acoustic wave filters 101, 102 are provided. The matching conductor 105 is formed in a curved shape at least at the lower part of the mounting surface of the surface acoustic wave filters 101 and 102.
[Selection] Figure 4

Description

  The present invention relates to a demultiplexing circuit board suitably used for a single-band or dual-band mobile radio terminal, and a high-frequency module and a radio communication apparatus constituted by the demultiplexing circuit board.

2. Description of the Related Art In recent years, many demultiplexing circuit boards used for mobile radio terminals and the like that selectively separate frequencies of transmission and reception signals employ a surface acoustic wave (SAW) filter. When the SAW filter is used, it is possible to realize a smaller size than a branching circuit board using a conventional dielectric resonator, which is one factor that can realize higher functionality of the mobile radio terminal.
Furthermore, a mobile radio terminal adopting a dual band system (for example, 800 MHz band and 1900 MHz band) is proposed for a mobile radio terminal of a single band system employing a transmission / reception system of one frequency band (for example, 800 MHz band). Yes.

This dual-band mobile radio terminal is equipped with two transmission / reception systems in one mobile radio terminal, and can select and transmit a transmission / reception system that suits the locality and purpose of use. It is expected as a highly convenient device.
In such a mobile radio terminal, it is desired to reduce the size of each component. In particular, a surface acoustic wave element and an FBAR (Film Bulk Acoustic Resonator) are being adopted in a demultiplexing circuit board that selects each frequency of an antenna transmission / reception system. These are relatively small resonators, and a plurality of resonators are used to form a filter that passes a desired frequency. When used as a demultiplexing circuit board, two or more filters are used and connected to an antenna through a matching circuit for preventing interference between a reception signal and a transmission signal.

As for the matching circuit, for example, Japanese Patent Laid-Open No. 2001-320260 discloses an example in which the matching circuit is formed by being divided over a plurality of inner layers of a multilayer package. The matching circuit is arranged in two different layers, and the matching circuit line formed in the two layers has a different shape for each layer.
The lines constituting such a matching circuit tend to be relatively long, and if formed linearly, the branch circuit board becomes large. In addition, the matching circuit can be formed using a lumped constant element such as a chip inductor or a chip capacitor. However, in this case, there is a drawback that transmission loss increases.
Japanese Patent Laid-Open No. 2001-320260

  The demultiplexing circuit board including the matching circuit is formed inside the package as described in the above-mentioned JP-A-2001-320260. Of course, there are means for forming the matching circuit in a meander shape and means for forming the matching circuit with chip parts as means for preventing the enlargement, but there is a disadvantage that transmission loss increases.

The present invention has been made to solve such a problem. A matching circuit is formed on the lower substrate of the surface acoustic wave filter, and the inductor line is curved to increase the size of the demultiplexing circuit substrate. An object of the present invention is to provide a demultiplexing circuit board capable of relatively reducing transmission loss.
Furthermore, the present invention is capable of integrating and miniaturizing circuit elements constituting from a demultiplexing circuit board to at least a power amplifier that divide a plurality of transmission / reception systems having different pass bands into respective transmission / reception systems, An object is to provide a wireless communication device.

  A demultiplexing circuit board according to the present invention includes a transmission surface acoustic wave filter and a reception surface acoustic wave filter mounted on a multilayer substrate, and a matching circuit interposed between the antenna terminal and the reception surface acoustic wave filter. The matching circuit is configured by an inductor line formed in a curved shape in a substrate region including a lower portion of the mounting surface of the surface acoustic wave filter for transmission or reception.

  FIGS. 1A and 1B show S11 (reflection) characteristics (700 MHz to 960 MHz) viewed from the antenna terminals of the surface acoustic wave filters for transmission and reception, respectively. As shown in FIG. 1A, the transmission surface acoustic wave filter has a stop band of about 881.5 MHz and a pass band of about 836.5 MHz. As shown in FIG. 1B, the surface acoustic wave filter for reception has a stop band of about 836.5 MHz and a pass band of about 881.5 MHz.

At this time, in order to make the phase angle in the stopband (around 836.5 MHz) of the surface acoustic wave filter for reception the relationship between the phase angle in the stopband (around 881.5 MHz) of the surface acoustic wave filter for transmission and the complex conjugate The matching circuit rotates the stop band phase angle of the surface acoustic wave filter for transmission to the phase angle that is the real axis object of the Smith chart (see FIG. 1C).
Although the matching circuit is long in the case of a linear shape, in the present invention, a small and low-loss matching circuit is realized by forming a curved shape in the inner layer of the multilayer substrate.

The transmitting surface acoustic wave filter and the receiving surface acoustic wave filter may be mounted on the multilayer substrate in a state of being accommodated in a package, respectively. You may be comprised by the surface acoustic wave element.
Further, the matching circuit may be formed in at least one layer in the multilayer substrate, or may be formed across two or more layers. In the latter case, it is necessary to connect matching circuits of each layer by interlayer via conductors.

The inductor line constituting the matching circuit may be formed in a curved shape. An example of the shape of the inductor line is shown in FIG. The hatched area indicates the matching circuit formation area.
FIG. 2A shows a spiral inductor line 1 formed on one layer of a multilayer substrate. The end points of the black circles are connected to the surface acoustic wave filter for transmission or reception through the interlayer via conductors (hereinafter the same in other FIG. 2).

FIG. 2B shows a sinusoidal inductor line 1. FIG. 2C shows the inductor line 1 having a square spiral shape. FIG. 2D shows a case where the matching circuit formation region is surrounded by a part of the inductor line 1. FIG. 2E shows a complicated shape of the inductor line 1 close to the embodiment.
FIG. 2 (f) shows a shape in which the inductor line 1 is wound like a solenoid over a multilayer substrate, and FIG. 2 (g) shows a shape configured in a meander shape over the multilayer substrate. The merit of FIG. 2 (f) is that the area of the matching circuit can be reduced as compared with (a) and (c). The advantage of FIG. 2G is that the area of the matching circuit can be reduced as compared with FIG.

2A, 2C, and 2E, the periphery of the matching circuit formation region is surrounded by a part of the inductor line that constitutes the matching circuit. In FIG. 2D, a part of the matching circuit forming region is surrounded by a part of the inductor line constituting the matching circuit.
The matching circuit may be configured by an inductor line as illustrated in FIG. 2 and a chip capacitor component mounted on a multilayer substrate. In this case, by using the capacitor, the inductor line can be shortened, and the area of the matching circuit formed in the multilayer substrate can be reduced.

The high-frequency module of the present invention includes an amplifier circuit in addition to the matching circuit described above, and the amplifier circuit is mounted on the surface or inside of the multilayer substrate. In addition to the amplifier circuit, a directional coupler (coupler) may be mounted.
In this manner, in addition to the matching circuit, a small high-frequency module can be realized by mounting an amplifier circuit, a directional coupler, or the like on the same multilayer substrate or by using an inner layer.

Furthermore, a dual-band high-frequency module having an amplifier circuit and a directional coupler can be realized using two sets of branching circuit boards having different bands.
It is also possible to arrange a second transmission surface acoustic wave filter in the previous stage of the amplifier circuit and mount the second transmission surface acoustic wave filter on a multilayer substrate to form a high-frequency module.
A wireless communication apparatus such as a portable terminal can be configured by using any one of the branch circuit boards or using any one of the high-frequency modules.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 3 is a block diagram of the high-frequency module A of the present invention in a mobile radio terminal. The broken line in the figure shows the branch circuit board B according to the present invention. The demultiplexing circuit board B is a circuit including a reception SAW filter 101, a transmission SAW filter 102, and a matching circuit 105. The receiving output terminal of the branching circuit board B is represented by P4, the transmitting input terminal is represented by P3, and the antenna terminal is represented by P1.

  In FIG. 3, the received signal received from the antenna ANT passes through the antenna terminal P1 and the matching circuit 105, enters the reception SAW filter 101 through the reception input terminal P2, is filtered, and then received. The signal is output to the reception signal terminal R via the terminal P4. The reception signal output from the reception signal terminal R is input to the low noise amplifier (not shown) through the matching circuit 123 of the reception system.

  On the other hand, the transmission signal input from the transmission signal terminal T passes through the second transmission SAW filter 124, is amplified by the amplifier circuit 122, passes through the directional coupler 121, and passes through the transmission input terminal P3. The signal enters the transmission SAW filter 102, passes through the antenna terminal P1, and is transmitted from the antenna ANT. The second transmission SAW filter 124 is not necessarily indispensable, but is preferably used for function assistance of the transmission SAW filter 102, noise removal of the transmission signal, and waveform shaping.

FIG. 4 is an exploded perspective view showing the substrate configuration of the branching circuit board B. FIG. The demultiplexing circuit board B is composed of a dielectric multilayer board including a first layer 103, a second layer 104, a third layer 106, and a fourth layer 110 from the top.
101 is a surface acoustic wave filter for reception, and 102 is a surface acoustic wave filter for transmission. These are mounted on the first layer 103 of the multilayer substrate. A total of eight terminals for connecting the surface acoustic wave filters 101 and 102 are provided on the first layer 103, four each. Among these, the terminals connected to the surface acoustic wave filter 101 are the reception input terminal P2, the reception output terminal P4, and the ground terminal shown in FIG. The terminals connected to the surface acoustic wave filter 102 are the transmission input terminal P3, the antenna terminal P1, and the ground terminal shown in FIG. Reference sign G represents a ground terminal.

  The second layer 104 is formed with a matching circuit 105 that connects the antenna terminal P1 and the reception input terminal P2 of the surface acoustic wave filter 101 from the first layer 103 through vias. The matching circuit 105 is composed of a conductor line (strip line) pattern formed by bending on a dielectric substrate. Due to this bent shape, the matching circuit 105 can be made compact. The transmission input terminal P3 and the reception output terminal P4 are relayed to the third layer 106 via the vias of the first layer 103 and the vias of the second layer 104.

The third layer 106 includes via lands 108, 109, and 107, which are connected to the antenna terminal P1, the transmission input terminal P3, and the reception output terminal P4 through the vias of the second layer 104.
These via lands 108, 109, and 107 are connected to the back surface pattern 110 through the vias of the third layer 106. The fourth layer 110 has an antenna terminal P1, a reception output terminal P4, an external terminal connected to the transmission input terminal P3, and a ground conductor through the first layer 103 to the third layer 106 vias. .

  Here, a method for manufacturing the multilayer substrate will be briefly described. The multilayer substrate is formed by forming a dielectric substrate formed by laminating a plurality of dielectric layers and a wiring conductor layer made of a conductor on the surface or inside thereof. For example, a wiring conductor layer is formed with a conductor such as copper foil on an organic dielectric substrate such as a glass epoxy resin and fired at the same time, or various wiring conductors are applied to an inorganic dielectric substrate such as a ceramic material. The layer is fired at the same time as the dielectric substrate.

Examples of the ceramic material include (1) a ceramic material whose main component is Al ₂ O ₃ , AlN, Si ₃ N ₄ , SiC, etc., and a firing temperature of 1100 ° C. or higher, and (2) 1100 ° C. made of a mixture of metal oxides. Hereinafter, particularly a low-temperature fired ceramic material fired at 1050 ° C. or lower, (3) a low-temperature fired ceramic material fired at 1100 ° C. or lower, particularly 1050 ° C. or lower, composed of glass powder or a mixture of glass powder and ceramic filler powder At least one selected from the group is selected.

As the mixture (2), ceramic materials such as BaO—TiO ₂ , Ca—TiO ₂ , and MgO—TiO ₂ are used. A material obtained by appropriately adding an auxiliary agent such as SiO ₂ , Bi ₂ O ₃ , CuO, Li ₂ O, or B ₂ O _{3 to} these ceramic materials is also used. The glass composition (3) contains at least SiO ₂ and contains at least one of Al ₂ O ₃ , B ₂ O ₃ , ZnO, PbO, alkaline earth metal oxide, and alkali metal oxide. Specifically, the SiO ₂ —B ₂ O ₃ —RO system, SiO ₂ —BaO—Al ₂ O ₃ —RO system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —RO Examples include systems, SiO ₂ —Al ₂ O ₃ —RO systems, and compositions in which ZnO, PbO, Pb, ZrO ₂ , TiO _{2, and the} like are blended with these systems.

In addition, the glass of the above (3) may be an amorphous glass by firing, or an alkali metal silicate, quartz, cristobalite, cordierite, mullite, enstatite, anorthite, serdian, spinel, by firing. Crystallized glass that precipitates at least one crystal of garnite, diopside, ilmenite, willemite, dolomite, petalite, and substituted derivatives thereof is used. Further, as the ceramic filler in (3), Al ₂ O ₃ , SiO ₂ (quartz, cristobalite), forsterite, cordierite, mullite, ZrO ₂ , mullite, forsterite, enstatite, spinel, magnesia, AlN, Examples include at least one selected from the group consisting of titanates such as Si ₃ N ₄ , SiC, MgTiO ₃ , and CaTiO ₃ , and glass 20 to 80% by mass and filler 20 to 80% by mass. desirable.

  On the other hand, since the wiring conductor layer is formed by simultaneous firing with the dielectric substrate, various combinations are made according to the firing temperature of the ceramic material forming the dielectric substrate. For example, when the ceramic material is (1), a conductor material mainly containing at least one selected from the group consisting of tungsten, molybdenum, manganese, and copper is preferably used. Moreover, it is good also as a mixture with copper etc. for resistance reduction. When the ceramic material is the low-temperature fired ceramic material of (2) or (3) above, a low-resistance conductor material mainly containing at least one selected from the group consisting of copper, silver, gold, and aluminum is used.

Since the dielectric substrate can obtain a sufficient capacitance even in a small area by increasing the dielectric constant, the strip line length can be shortened and the entire structure can be miniaturized. Further, since the wiring, the line, and the like can be formed of a low-resistance low-resistance conductor, it is desirable that the wiring is formed of the low-temperature fired ceramic material (1) or (2).
FIG. 5 is a frequency characteristic diagram of the S (transmission) parameter S21 of the surface acoustic wave filter for reception 101 without the matching circuit 105, and FIG. 6 shows the surface acoustic wave filter for reception 101 with the matching circuit 105 added. FIG. In the measurement of FIG. 5, the measurement was performed by placing a probe between the terminal P <b> 2 of the first layer 103 and the terminal P <b> 4 of the fourth layer 110. In the measurement of FIG. 6, the measurement was performed by placing a probe between the terminals P <b> 1 and P <b> 4 of the fourth layer 110.

It can be seen that when the matching circuit 105 of FIG. 6 is added, the transmission loss does not increase as compared with FIG. 5, and good characteristics are obtained.
FIG. 7 is an exploded perspective view showing a substrate configuration of a branching circuit board B according to another embodiment of the present invention.
In the embodiment of FIG. 7, it is assumed that the surface acoustic wave element alone is mounted on a multilayer substrate without using a package as the reception SAW filter and the transmission SAW filter.

Reference numeral 111 denotes a surface acoustic wave element for reception, and 112 denotes a surface acoustic wave element for transmission, which are mounted on the first layer 103 of the multilayer substrate. The surface acoustic wave elements 111 and 112 and the electrode patterns P1 to P4 of the first layer 103 are connected by wire bonding.
The second layer 104 is formed with a matching circuit 105 that connects the antenna terminal P1 and the reception input terminal P2 of the surface acoustic wave filter 101 from the first layer 103 through vias. Similar to FIG. 4, the matching circuit 105 is also composed of a conductor line pattern formed by bending on a dielectric substrate. The transmission input terminal P3 and the reception output terminal P4 are relayed to the third layer 106 via the via of the first layer 103 and the via of the second layer 104.

  The third layer 106 includes via lands 108, 109, and 107, which are connected to the antenna terminal P1, the transmission input terminal P3, and the reception output terminal P4 through the vias of the second layer 104. These via lands 108, 109, and 107 are connected to the back surface pattern of the fourth layer 110 through the vias of the third layer 106. The fourth layer 110 has an antenna terminal P1, a reception output terminal P4, an external terminal connected to the transmission input terminal P3, and a ground conductor through the first layer 103 to the third layer 106 vias. .

The embodiment of FIG. 7 differs from the embodiment of FIG. 4 in that a surface acoustic wave element is mounted on a multilayer substrate without using a package as a reception SAW filter and a transmission SAW filter. Similar to the embodiment of FIG. 4, the same applies to the case where the matching circuit 105 composed of a conductor line pattern formed by bending on a dielectric substrate is used.
FIG. 8 is an exploded perspective view showing a substrate configuration of a branching circuit board B according to another embodiment of the present invention.

The embodiment of FIG. 8 is characterized in that a matching circuit is formed by strip lines and chip capacitor components. On the other hand, in the embodiment of FIG. 4, a matching circuit 105 formed of a strip line is used.
The substrate configuration of the branching circuit board B of FIG. 8 will be described. The surface acoustic wave filters 101 and 102 for reception and transmission are mounted on the first layer 103 of the multilayer substrate. A chip capacitor 115 is mounted between the input terminal P2 of the surface acoustic wave filter 101 for reception and the GND pattern 114, and the output terminal (that is, antenna terminal) P1 of the surface acoustic wave filter 102 for transmission and the GND pattern 116 A chip capacitor 117 is mounted between them. In the second layer 103 and the third layer 106 of the multilayer substrate, inductor lines 118 and 119 having substantially spiral shapes are formed, respectively. Both inductor lines 118 and 119 are connected to each other through the via P5 of the second layer 103. One end P2 of the inductor line 119 is connected to the input end P2 of the surface acoustic wave filter 101 for reception through the vias of the second layer 103 and the first layer 103. The other end P1 of the inductor line 118 is connected to the output end P1 of the surface acoustic wave filter 102 for transmission through the via of the first layer 103.

  With the configuration described above, a matching circuit in which inductor lines 118 and 119 are connected in series and chip capacitors 115 and 117 are connected in parallel between the antenna terminal P1 and the input terminal P2 of the surface acoustic wave filter 101 for reception. It is formed. Since the chip capacitors 115 and 117 are used, the inductance of the inductor lines 118 and 119 may be set small. Therefore, the length of the inductor lines 118 and 119 in FIG. 8 is shorter than that in FIGS. 4 and 7, and the shape thereof is simpler. Therefore, the volume of the matching circuit in the multilayer substrate can be reduced.

FIG. 9 is an equivalent circuit diagram showing the matching circuit formed by the inductor lines 118 and 119 and the chip capacitor parts 116 and 115 as described above.
Incidentally, even in the demultiplexing circuit board B in which the single surface acoustic wave elements 111 and 112 shown in FIG. 7 are mounted on the multilayer board, a matching circuit composed of strip lines and chip parts as shown in FIG. 9 may be adopted. good.

  FIG. 10 is an exploded perspective view showing the board configuration of the high-frequency module including the branching circuit board B described above. The branching circuit board B described above is formed on the right half of the multilayer board. A power amplifier 120 is mounted on the left side of the first layer 103 of the multilayer substrate. The second layer 104 includes a matching circuit 105 and a directional coupler main line 121, and the third layer 106 includes a directional coupler sub-line 122, which are connected via vias. A two-dot broken line in FIG. 3 is the high-frequency module of the present embodiment. As described above, the matching circuit 105 and other circuit components are provided in the multilayer substrate, and a small high-frequency module can be realized.

  Although the embodiments of the present invention have been described above, the embodiments of the present invention are not limited to the above-described embodiments. For example, in FIG. 4 or the like, the second transmission SAW filter 124 may be placed on the first layer 103. In FIG. 10, the chip-like surface acoustic wave filters 101, 102, and 124 can be constituted by a single surface acoustic wave element as shown in FIG. 7, and the matching circuit 105 is striplined as shown in FIG. It is also possible to form a composite of chip capacitor parts. In addition, various modifications can be made within the scope of the present invention.

It is a Smith chart which shows S11 (reflection) characteristic seen from the antenna terminal of the surface acoustic wave filter for transmission and reception. (A) is a transmission filter, (b) is a reception filter, and (c) is a characteristic diagram of a reception filter to which a matching circuit is attached. It is a top view (a)-(e) which shows the example of a shape of an inductor line, and a perspective view (f) (g). It is a block diagram which shows the circuit structure of the high frequency module A of this invention used for a mobile radio | wireless terminal etc. FIG. It is a disassembled perspective view which shows the board | substrate structure of the branching circuit board B which concerns on the 1st Embodiment of this invention. FIG. 10 is an S21 (transmission) characteristic diagram of the surface acoustic wave filter for reception 101 when the matching circuit 105 is not added. FIG. 10 is a S21 (transmission) characteristic diagram of the surface acoustic wave filter for reception 101 when a matching circuit 105 is added. It is a disassembled perspective view which shows the board | substrate structure of the branching circuit board B at the time of mounting the single-piece | unit surface acoustic wave element based on other embodiment of this invention on a multilayer substrate. It is a disassembled perspective view which shows the board | substrate structure of the branching circuit board B at the time of forming a matching circuit by the stripline and chip capacitor component based on other embodiment of this invention. It is an equivalent circuit diagram of the matching circuit formed by the strip line and the chip capacitor component. 2 is an exploded perspective view showing a substrate configuration of a high-frequency module A including a branching circuit substrate B. FIG.

Explanation of symbols

101 reception SAW filter
102 SAW filter for transmission
105 matching circuit
122 amplifier circuit
121 Directional coupler
First layer of 103 multilayer board
104 second layer
106 3rd layer
110 4th layer
107,108,109 Beerland
118,119 inductor line
116,115 Chip capacitor parts
120 power amplifier A high frequency module B branching circuit board P1 antenna terminal P2 reception input terminal P3 transmission input terminal P4 reception output terminal R reception signal terminal

Claims (18)

A substrate mounted with a demultiplexing circuit connected to an antenna terminal and demultiplexing a transmission signal output to the antenna terminal and a reception signal input from the antenna terminal,
The demultiplexing circuit includes a transmission surface acoustic wave filter and a reception surface acoustic wave filter mounted on a multilayer substrate, and a matching circuit interposed between the antenna terminal and the reception surface acoustic wave filter. ,
The branching circuit board according to claim 1, wherein the matching circuit includes an inductor line formed in a curved shape in a board region including a lower part of a mounting surface of the surface acoustic wave filter for transmission or reception.   2. The branching circuit board according to claim 1, wherein the transmitting surface acoustic wave filter and the receiving surface acoustic wave filter are respectively mounted on the multilayer substrate in a state of being housed in a package.   2. The branching circuit board according to claim 1, wherein the transmission and reception surface acoustic wave filters are each constituted by a single surface acoustic wave element mounted on a multilayer substrate without being housed in a package.   2. The branching circuit board according to claim 1, wherein the matching circuit is formed in at least one layer in the multilayer board or in a form extending over more layers.   The branching circuit board according to claim 1, wherein a periphery of the matching circuit forming region is surrounded by a part of an inductor line constituting the matching circuit.   The branching circuit board according to claim 1, wherein a part of the matching circuit forming region is surrounded by a part of an inductor line constituting the matching circuit.   2. The branching circuit board according to claim 1, wherein the matching circuit is formed by an inductor line formed in at least one layer of the multilayer board and a chip capacitor component mounted on the multilayer board. . A high-frequency module that is connected to an antenna terminal and includes a demultiplexing circuit that demultiplexes a transmission signal output to the antenna terminal and a reception signal input from the antenna terminal, and an amplification circuit that amplifies the transmission signal on a multilayer substrate. ,
The demultiplexing circuit includes a transmission surface acoustic wave filter and a reception surface acoustic wave filter mounted on a multilayer substrate, and a matching circuit interposed between the antenna terminal and the reception surface acoustic wave filter. ,
The matching circuit includes an inductor line formed in a curved shape in a substrate region including a lower portion of a mounting surface of the transmitting or receiving surface acoustic wave filter, and the amplifier circuit is formed on the surface or inside of the multilayer substrate. A high-frequency module characterized by being mounted on.   The high-frequency module according to claim 8, wherein the directional coupler is mounted on the surface or inside of the multilayer substrate.   9. The high-frequency module according to claim 8, wherein the transmitting and receiving surface acoustic wave filters are mounted on the multilayer substrate in a state of being housed in a package.   9. The high-frequency module according to claim 8, wherein the transmitting surface acoustic wave filter and the receiving surface acoustic wave filter are each constituted by a single surface acoustic wave element mounted on a multilayer substrate without being housed in a package.   The high-frequency module according to claim 8, wherein the matching circuit is formed in at least one layer in a multilayer substrate or across more layers.   The high-frequency module according to claim 8, wherein a periphery of the matching circuit forming region is surrounded by a part of an inductor line constituting the matching circuit.   9. The high frequency module according to claim 8, wherein a part of the matching circuit forming region is surrounded by a part of an inductor line constituting the matching circuit.   The high-frequency module according to claim 8, wherein the matching circuit is formed of an inductor line formed in at least one layer in the multilayer substrate and a chip capacitor component mounted on the multilayer substrate.   9. The high frequency module according to claim 8, wherein a second surface acoustic wave filter for transmission is disposed in a front stage of the amplifier circuit, and the second surface acoustic wave filter for transmission is mounted on a multilayer substrate.   8. A wireless communication device such as a portable terminal, comprising the branch circuit board according to claim 1.   A wireless communication device such as a portable terminal, wherein the high-frequency module according to any one of claims 8 to 16 is mounted.

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