JP2005060793A - Resin deposition unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin vapor deposition unit capable of improving the resin distribution uniformity relatively easily and ensuring the distribution over a long period of time.
In a resin vapor deposition unit that forms a film on a cylindrical surface of a rotating drum-shaped can roll, a structure in which resin vapor guided by the inner wall is exhausted to another unit in the circumferential direction or a main exhaust system is used for film formation. This problem can be solved by having an effective exhaust speed that is greater than the amount of surplus resin vapor that does not contribute. With the configuration described above, the speed of the resin vapor can be improved and maintained, and variations in the film formation rate can be reduced.
[Selection] Figure 1

Description

  The present invention relates to a resin vapor deposition unit for manufacturing a capacitor, a rectifier and the like.

  The vapor deposition technique is a technique for evaporating the object to be heated in a vacuum using a hot plate, an electron beam or the like and depositing a film on the substrate. In the production of capacitors and the like, this deposition technique is often used to form a laminated film of a dielectric and an electrode, and the thickness of the resin, that is, the dielectric has a large effect on the capacity and withstand voltage. The film thickness is desirably uniform. Therefore, in the prior art, before the resin vapor reaches the substrate surface, a shower plate with a large number of holes is installed, or the shape of the nozzle opening is adjusted according to the film thickness distribution. A method of correcting the film thickness attached to the substrate has been taken.

  A conventional drum rotating type capacitor manufacturing apparatus will be described below with reference to FIGS.

  FIG. 3 shows an overall view of a drum rotating type capacitor manufacturing apparatus.

  In FIG. 3, a rotatable drum 2 and each unit 3 (resin vapor deposition unit 3A, oil masking unit 3B, resin curing unit 3C, and aluminum vapor deposition unit 3D) arranged in the order of steps are arranged in the chamber 1 in the chamber 1. Has been. An exhaust system 4 is connected to the chamber 1.

  In addition, an inclined plate 5 that can be heated by a heater or the like is disposed in the resin vapor deposition unit 3A. A supply unit 7 for continuously feeding the resin 6 is provided above the inclined plate 5, and a gate valve 8 is attached between the inclined plate 5 and the drum 2. While exhausting the chamber 1 to a predetermined degree of vacuum by the exhaust system 4, the inclined plate 5 starts to be heated and the resin vapor deposition unit 3A is started up. Since the evaporation is unstable and the film quality is not good during heating, the gate valve 8 that performs operations such as rotation and swinging is closed so that the film does not adhere to the drum 2. After the evaporation state is stabilized, the gate valve 8 is opened to form a film on the surface of the drum 2. A product is manufactured by performing this process in a predetermined order up to a predetermined number of layers. Thereafter, the chamber 1 is opened to the atmosphere, and the completed product is taken out, and finally subjected to processes such as pressing and electrode formation to become a product.

  FIG. 4 shows a state diagram of the resin vapor deposition unit, FIG. 4 (a) shows a standby state, and FIG. 4 (b) shows a film forming state.

  The resin vapor deposition unit 3 </ b> A has a roughly double-pipe structure including a normal temperature outer wall 9 and a heated inner wall 10 for an operator to perform work. The resin vapor deposition unit 3 </ b> A includes an evaporation section A chamber 14 and a guide section B chamber 15. Both the A chamber 14 and the B chamber 15 are divided by the inner wall 10 into regions of an inner side 16 and an outer side 17. The vapor generated from the inclined plate 5 is guided to the substrate surface through the inner side 16 in order to prevent the vapor from flowing to other units. The region on the inner side 16 is further divided into three regions: a running portion (steam rectifying section) 18, a valve portion 19, and an exhaust portion 20. The heated valve 21 is disposed in the valve portion 19 and slides by the cylinder 13 in parallel to the steam flow direction. An O-ring 22 is attached to the valve and seals steam by being pressed against the sealing surfaces 23 on both sides of the valve. That is, when the valve 21 is provided on the seal surface 23 on the side of the running portion 18, the A chamber 14 and the B chamber 15 are blocked and no film is formed on the drum 2. When the valve 21 is on the exhaust unit 20 side in the standby state, the A chamber 14 and the B chamber 15 are connected, and film formation is performed on the drum 2 (film formation state).

The film thickness distribution is corrected by the resin vapor passing through the nozzle 24 (compensation means such as opening adjustment) in the section of the run-up section 18 after the valve section 19 in the film formation state.
JP 2002-285324 A

  However, resin deposition differs from vapor deposition of aluminum and the like, and the vaporized resin does not move linearly but behaves like a gas that wraps around anywhere. Therefore, while the resin vapor is guided between the heated inner walls, thermal energy is given to the resin vapor from the inner wall, and there is a difference in density distribution that the vapor is thin near the wall and thick near the center, The ambient temperature around the steam greatly affects the steam density distribution, that is, the film thickness distribution.

  This resin nozzle is guided to the vicinity of the can roll in order to prevent the flow rate to other units and improve the adhesion efficiency. Residual resin that has not adhered to the can roll is exhausted between the resin nozzle and the can roll by main exhaust or the like. Therefore, the end of the nozzle tends to be slightly thinner than the center. Thus, the flow of resin simultaneously with heat greatly affects the film thickness distribution and the state of adhesion.

  In the process of forming a film such that a film is deposited on the can roll, the conductance changes between the can roll and the nozzle as the film formation proceeds, and the exhaust performance from the resin nozzle changes. In general, the can surface (deposited film surface) and the nozzle approach each other, so that the resin vapor is difficult to be exhausted and the internal pressure of the nozzle rises. If the internal pressure rises, the vapor of the resin is less likely to vaporize at the same temperature, and the mean free path is shortened and the flow velocity is lowered. (Image of spraying on the wall surface) For these reasons, the amount of resin adhering to the surface of the can roll decreases as the internal pressure increases.

  For this reason, the film pressure distribution is changed during film formation, and the operation rate is lowered because the equipment is periodically stopped to perform film pressure compensation.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object thereof is to provide a vapor deposition unit capable of improving the resin distribution uniformity relatively easily and ensuring the distribution over a long period of time.

  A resin vapor deposition unit according to the present invention is a resin vapor deposition unit that forms a film on a cylindrical surface of a drum-shaped can roll, and the resin vapor deposition unit includes an evaporation section and a guide chamber, and the guide is provided by adjusting a valve. When the resin vapor released from the chamber is vapor-deposited on the cylindrical surface of the can roll, the flow rate exhausted by the exhaust system disposed in the circumferential direction of the can roll is greater than the excess resin vapor amount not caused by film formation. Has a large exhaust characteristic. Thereby, the uniformity of the resin distribution is improved, and it is possible to ensure a long-term distribution.

  As described above, since the speed of the resin vapor with respect to the can can be improved and maintained, variations in the film forming rate can be reduced. Furthermore, since the thickness of each laminated layer can be made constant, the capacitor capacity system is improved and the performance of the product can be improved.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 shows a configuration in which an exhaust path is provided around the nozzle of the resin vapor deposition unit. There are two types of exhaust passages on the surface of the can roll film, roughly divided in the circumferential direction of the can and the axial direction. When adopting the configuration of the facility according to the present embodiment, the other units have an optimum pressure different from that of the resin unit, and in order to prevent contamination, the independence is increased as much as possible to prevent the inflow of resin vapor. desirable. Therefore, an adhesion preventing plate is provided in the circumferential direction to reduce the conductance in consideration of the thickness of the laminated body.

  In other words, it is desirable to reduce the conductance in the circumferential direction and take a large conductance in the axial direction. In this equipment, the exhaust in the axial direction is arranged on the side of the can by the number of units directly connected to the main exhaust, and adjusted to the optimum pressure for each unit by closing or closing the pockets according to the required degree of vacuum.

  As described above, the resin nozzle is made as close to the can surface as possible in order to increase the utilization efficiency and reduce the contamination. At this time, depending on the conductance and pressure difference of the nozzle, it is possible that excess resin vapor that does not contribute to film formation from the nozzle cannot be exhausted, and the internal pressure of the resin nozzle may gradually increase. The adverse effects caused by this pressure increase are as described above. Therefore, the following formulas (1) to (4) are introduced in order to avoid an increase in pressure in the resin nozzle.

  That is, it is necessary that Q ≦ Se.

  As a result, the increase in the internal pressure of the resin nozzle can be prevented, and the collision of the resin vapor collides at a faster speed by the can roll, so that the collision establishment increases. The required speed varies depending on the process and material, but this tendency does not basically change in the case of vapor deposition of a resin material. Therefore, since the internal pressure does not increase, the film formation of the resin can be performed stably over a long period of time.

  The side exhaust pocket and the conductance in the circumferential direction have a cylinder and a valve body with a motor, and feed back a change in internal pressure to move to an optimal position to keep the internal pressure constant. For example, a means of changing the hole diameter of the pocket or changing the gap between the can and the deposition preventing plate can be considered.

  Further, the collision probability is further increased by applying resin vapor vertically by a can roll. Holes and grooves are provided on the surface of the can roll, and main exhaust is performed from here.

  The resin vapor deposition unit of the present invention can also be applied to use for producing electronic components such as capacitors.

The inclination figure of the resin vapor deposition nozzle which concerns on embodiment of this invention The schematic diagram which shows the effect of embodiment of this invention Front view of vapor deposition unit in conventional film deposition system Schematic diagram showing standby and film formation status in conventional film deposition equipment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chamber 2 Drum 3A Dielectric vapor deposition unit 3B Oil masking unit 3C Resin hardening unit 3D Aluminum vapor deposition unit 5 Inclined plate 8 Gate valve 9 Inner wall 10 Outer wall 11 Fixed nozzle 12 Movable nozzle 14 A chamber 15 B chamber 16 Inner 17 Outer 18 Advancing part 19 Valve part 20 Exhaust part 21 Valve 23 Sealing surface 27 Pipe

Claims (1)

A resin vapor deposition unit for forming a film on a cylindrical surface of a drum-shaped can roll, the resin vapor deposition unit having an evaporation unit and a guide chamber, and adjusting the valve to release the resin vapor released from the guide chamber When vapor-depositing on the cylindrical surface of the can roll, the flow rate exhausted by the exhaust system arranged in the circumferential direction of the can roll has an exhaust characteristic that is larger than the surplus resin vapor amount not caused by film formation. Resin vapor deposition unit.

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