JP2005050969A - Electrical circuit component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component having a three-dimensional electric circuit, and to provide its producing process. <P>SOLUTION: A first process for producing an electric circuit component comprises steps (a) for forming a nonconductive trench structure on a substrate, (b) for patterning solution containing an electroless plating medium in the trench on the substrate by ink jet technology, and (c) for depositing a conductive substance in the opening of the trench structure by electroless plating followed by or not followed by elctroplating. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component having a three-dimensional electric circuit and a method for manufacturing the same.
[0002]
[Prior art]
There is known an optical modeling method in which a three-dimensional structure is manufactured by moving a light irradiation position in a photocurable resin solution along a predetermined pattern (see Patent Document 1). In this method, a light-cured resin is cured to form a cured portion and an uncured liquid portion which are solidified by light irradiation, and the uncured liquid portion is removed to remove a three-dimensional structure. Can be obtained. Furthermore, the accuracy of the optical modeling method can be further increased by performing the two-photon absorption optical modeling method instead of the one-photon absorption optical modeling method using ultraviolet rays (see Patent Document 2).
[0003]
A method of providing an electric circuit on a three-dimensional structure obtained by such an optical shaping method is also known (see Patent Document 3). In the method of Patent Document 3, an electric circuit is formed by plating the surface of a three-dimensional structure obtained by stereolithography, applying a resist, and performing etching. However, in this method, the electrical circuit is only provided on the surface of the structure. In general, in order to form a three-dimensional electric circuit, the electric circuit must be connected in the thickness direction, and drilling and embedding metal pins in a non-conductive structure existing between the upper and lower electric circuits. This process is required.
[0004]
[Patent Document 1]
JP 56-144478 A [Patent Document 2]
Japanese Patent Publication No. 63-40650 [Patent Document 3]
Japanese Patent Laid-Open No. 10-12995
[Problems to be solved by the invention]
An object of this invention is to provide the components which have a three-dimensional electrical circuit, and its manufacturing method.
[0006]
[Means for Solving the Problems]
The present invention provides a method of manufacturing an electrical circuit component, which method comprises the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B) patterning an electroless plating catalyst-containing solution into the groove on the substrate by inkjet technology; and (c) an opening of the groove structure by electroless plating or electroplating subsequent to electroless plating. Depositing a conductive material on the substrate;
including.
[0007]
In a preferred embodiment, the step (a) includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) the groove. A step of forming the groove structure by transferring it to a curable material using a mold having a structure pattern, and (a3) a step of patterning exposure of a photocurable resin by photolithography to form the groove structure. , Selected from the group consisting of
[0008]
After applying the electroless plating catalyst solution in the step (b), in order to improve the catalytic function, the bottom surface of the groove and the substrate are exposed by drying and irradiating light or by exposing the substrate to a reducing atmosphere. A metal catalyst can be deposited on the side surface.
[0009]
In a more preferred embodiment, the method further includes a step of repeating the steps including the step (a) to the step (c) a predetermined number of times.
[0010]
The present invention also provides another method of manufacturing an electrical circuit component, which method comprises the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B1) A step of applying an electroless plating catalyst-containing solution to the entire surface of the substrate having the groove structure;
(B2) wiping the surface of the substrate to leave the electroless plating catalyst-containing solution only in the groove; and (c) the electroless plating method or the electroplating method following the electroless plating method, Depositing a conductive material in the opening of the groove structure;
including.
[0011]
In a preferred embodiment, the step (a) includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) the groove. A step of forming the groove structure by transferring it to a curable material using a mold having a structure pattern, and (a3) a step of patterning exposure of a photocurable resin by photolithography to form the groove structure. , Selected from the group consisting of
[0012]
In a more preferred embodiment, the method further includes a step of repeating the steps including the step (a) to the step (c) a predetermined number of times.
[0013]
The present invention also provides an electric circuit component manufactured by any method including the steps (a) to (c).
[0014]
The present invention further provides another method of manufacturing an electrical circuit component, which method comprises the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B ′) patterning a conductive ink in a groove on the substrate by inkjet technology; and (c ′) irradiating the conductive ink in the groove with a laser to form a conductive pattern;
including.
[0015]
In a preferred embodiment, the step (a) includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) the groove. A step of forming the groove structure by transferring it to a curable material using a mold having a structure pattern, and (a3) a step of patterning exposure of a photocurable resin by photolithography to form the groove structure. , Selected from the group consisting of
[0016]
In a more preferred embodiment, the method further includes the step of repeating the step (a) to the step (c ′) a predetermined number of times.
[0017]
The present invention also provides an electric circuit component manufactured by any method including the steps (a) to (c ′).
[0018]
DETAILED DESCRIPTION OF THE INVENTION
The first manufacturing method of the electric circuit component of the present invention includes the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B) patterning an electroless plating catalyst-containing solution into the groove on the substrate by inkjet technology; and (c) an opening of the groove structure by electroless plating or electroplating subsequent to electroless plating. Depositing a conductive material on the substrate;
including.
[0019]
First, in step (a), a non-conductive groove structure is formed on the substrate.
[0020]
In the present invention, the substrate is a member constituting an electric circuit component and means a member for forming an electric circuit on the surface thereof, and its shape is not particularly limited. A conductive material or a non-conductive material may be used, or they may be mixed. For example, an electrode or an electric circuit may be formed on the surface in advance.
[0021]
In the step (a), the groove structure may be formed by any means. Preferably, the groove structure forming step includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) a gold having a groove structure pattern. Selected from the group consisting of: forming a groove structure by transferring to a curable material using a mold; and (a3) patterning exposure of a photocurable resin by photolithography to form the groove structure. .
[0022]
The photocurable resin used in the optical shaping method in the step (a1) is not particularly limited as long as it is non-conductive. Examples thereof include AZ CTP-100 (manufactured by Clariant Japan Co., Ltd.) and ACR10 (manufactured by Toyo Gosei Co., Ltd.).
[0023]
The light irradiated to the photocurable resin in the optical modeling method is not particularly limited as long as it has a wavelength and an energy level necessary for curing the resin. Since the photocurable resin generally has a large absorption at the ultraviolet wavelength, for example, the ultraviolet ray is condensed and irradiated. In order to increase the processing accuracy of stereolithography, it is preferable to use a laser. For example, as a laser in which a curing reaction of a photocurable resin is induced by absorption of one photon, a He—Cd laser, an Ar ion laser, a YAG laser, and an excimer laser can be given. Examples of the laser in which the curing reaction of the photocurable resin is induced by the multiphoton absorption phenomenon include a femtosecond laser (for example, a Ti-doped Al ₂ O ₃ laser). It is more preferable to use a femtosecond laser in that a point smaller than the beam spot can be cured by a multiphoton process by focused irradiation.
[0024]
In the step (a1), the groove structure is formed with a photocurable resin so that the position where the electric circuit is to be formed on the substrate becomes the groove by such an optical modeling method. In the step of forming the groove structure, since the photocurable resin is cured at a desired position on the substrate, this position cannot be a groove. Therefore, the “desired position on the substrate” means a subsequent step. The part where the electric circuit is not formed is intended. When forming the groove structure, the substrate may be irradiated with light in a state of being immersed in a photocurable resin solution. Alternatively, the groove depth can be reduced by thinly coating a photocurable resin on the substrate by spin coating or the like. The depth and width of the groove are appropriately determined according to the purpose, and are usually 5 to 100 μm and 0.1 to 5 μm, respectively.
[0025]
The curable material used in the step (a2) is not particularly limited as long as it can be transferred from the mold, and a non-conductive material is used. Examples of non-conductive materials that can be used for the substrate include glass, epoxy resin, polyurethane resin, silicone resin, diallyl phthalate resin, formaldehyde resin, phenol resin, amino resin, and ceramics. A mold release agent may be included as necessary.
[0026]
A mold having a groove structure pattern is obtained by subjecting a mold material to fine mold processing to produce a mold having a predetermined pattern, or by an optical modeling method as in the above step (a1). The groove structure may be used as it is, or may be manufactured by taking a replica of the groove structure by electroforming or the like.
[0027]
Examples of the mold material include metals, ceramics, intermetallic compounds, and amorphous carbon. Examples of the metal include Fe, Ni, Cu, Ag, Au, W, Si, and alloys thereof, stainless steel, and the like. Ceramics include ceramics such as oxides, carbides, nitrides and borides. Examples of the intermetallic compound include TiAl, Ni ₃ Al, NiAl, NiTi, FeSi ₂ , and WC (Cemented Carbide). Amorphous carbon is formed by molding a resin such as phenol resin, polyimide resin, epoxy resin, polycarbodiimide resin, furan resin, furfural resin, etc. in a non-oxygen atmosphere (in a vacuum or in an inert gas atmosphere such as nitrogen or argon). ), And is obtained by firing at 500 to 3000 ° C. In order to maintain the flatness of the mold, it is preferable that the amorphous carbon content after firing is 65% by weight or more. In particular, amorphous carbon is excellent in substrate releasability.
[0028]
The fine mold processing is performed by at least one processing means selected from the group consisting of laser processing, focused ion beam (FIB) processing, cutting processing, and electric discharge processing. It is preferable to carry out an appropriate combination according to the size of the pattern to be formed. Examples of laser processing include excimer laser processing, femtosecond laser processing, a combination of photolithography processing using an Ar laser or He—Cd laser and etching processing, and anisotropic etching such as Si. Examples of the cutting process include milling and shaving. In particular, the FIB processing is particularly suitable for processing a portion that becomes a mold of a groove in which a wiring is to be formed because a pattern having a finer and sharper shape can be obtained as compared with cutting processing, electric discharge processing, laser processing, and the like. Further, after photolithography of the resist material using the laser, the resist material can be cured by heat treatment and used as a mold.
[0029]
As the FIB apparatus, for example, an FIB processing observation apparatus (for example, FB-2000A) manufactured by Hitachi High-Technologies Corporation is used. The variable apertures of these devices can be adjusted to form micrometer-sized as well as nanometer-sized patterns. For example, when a pattern is engraved using an FIB apparatus, the ceramics, intermetallic compound, and amorphous carbon are less susceptible to surface oxidation than metals such as iron, and the accuracy can be maintained. Therefore, it is preferable.
[0030]
In this way, a mold having a predetermined groove structure pattern is obtained.
[0031]
Next, the mold is transferred to form a groove structure on the substrate. The transfer may be performed by any means, but is preferably performed by embossing, compression molding, transfer molding, injection molding, or casting.
[0032]
Specifically, the above-described curable material is dissolved or dispersed in an appropriate solvent as necessary, or melted by heating, and using the mold, a method suitable for each material, for example, a solvent The method of removing, solidifying, curing, polymerizing, melting, sintering, etc. is transferred alone or in combination, and then peeled off from the mold. The material is supplied to the mold by means usually used by those skilled in the art depending on the transfer means. For example, a groove structure is formed on the substrate by inserting a thermoplastic resin previously cut into a predetermined dimension between the substrate and a mold heated to a predetermined temperature, pressurizing, and releasing.
[0033]
The photocurable resin used in the step (a3) is not particularly limited as long as it is non-conductive as in the step (a1). Examples thereof include AZ CTP-100 (manufactured by Clariant Japan Co., Ltd.) and ACR10 (manufactured by Toyo Gosei Co., Ltd.).
[0034]
In the step (a3), patterning exposure is performed by photolithography which is usually performed by those skilled in the art to form a groove structure. Specifically, a photo-curable resin solution is applied onto a substrate, and exposure (for example, ultraviolet rays) is applied through a mask having a predetermined pattern to cure the exposed resin, thereby removing the uncured liquid resin. Thus, a groove structure is formed on the substrate.
[0035]
Next, in the step (b), the electroless plating catalyst-containing solution is patterned in the groove on the substrate by an ink jet technique.
[0036]
Examples of the electroless plating catalyst-containing solution include a metal ion-containing solution and a metal complex solution, and a solution containing Pd, Pt or the like as a catalyst can be used. When light irradiation is performed after patterning, it is preferable to use a photosensitive catalyst-containing solution. When exposed to a reducing atmosphere, it is preferable to use a commercially available catalyst solution used in a one-component method.
[0037]
Since the groove in which the electroless plating catalyst-containing solution is to be patterned by an ink jet technique has a very narrow opening width, it is preferably performed using an ink jet head having a fine structure nozzle. More preferably, the amount of injection from the inkjet head is 4 pL or less, more preferably 2 pL or less.
[0038]
Then, by irradiating the substrate with light or exposing the substrate to a reducing atmosphere, the catalyst function can be improved by precipitating the metal catalyst in the electroless plating catalyst-containing solution on the bottom and side surfaces of the groove. it can. Specifically, the entire substrate on which the electroless plating catalyst-containing solution is patterned is irradiated with light, for example, ultraviolet rays, or the entire substrate is exposed to a reducing atmosphere, for example, an ammonia atmosphere. Irradiation or exposure conditions are appropriately determined according to the electroless plating catalyst-containing solution to be used.
[0039]
Next, in order to improve the deposition state of the plating in the step (c), the electroless plating catalyst-containing solution remaining in the groove after the metal catalyst deposition is removed. For example, it is removed by washing with water.
[0040]
In the step (c), a conductive substance is deposited on the opening of the groove structure at the position where the metal catalyst is deposited by an electroless plating method or an electroplating method subsequent to the electroless plating method. The electroless plating method is preferable in that there are few steps. The conductive substance to deposit is a metal, Preferably, copper, silver, gold | metal | money, platinum, nickel etc. are mentioned. The plating method is performed under the conditions normally performed by those skilled in the art. Typically, the entire substrate is immersed in a plating solution containing these metals, and the metal is deposited in the groove from the bottom to the opening.
[0041]
In this way, an electric circuit made of a conductive material is formed in the groove of the groove structure on the substrate, and an electric circuit component is obtained.
[0042]
Furthermore, a three-dimensional electric circuit can be manufactured by repeating the cycle from the steps (a) to (c). That is, when the cycle from step (a) to (c) is performed using the electric circuit component formed by the first cycle from step (a) to (c) as a substrate, the circuit is formed in the first cycle. A new electric circuit can be formed on the electric circuit. Usually, the electrical circuit is formed in a pattern different from that formed in the previous cycle. By repeating this cycle several times, an electric circuit component having an electric circuit with a three-dimensionally complicated structure can be manufactured.
[0043]
Hereinafter, the first method of the present invention will be described more specifically with reference to the drawings. However, the drawings are only examples, and the present invention is not limited to the drawings.
[0044]
As shown in FIG. 1A-1, in this example, the planar electrode 20 is provided on the substrate 10 in advance. The substrate 10 provided with the planar electrode 20 is coated with a photocurable resin solution 30 as shown in FIG. Next, the femtosecond laser 80 is condensed and irradiated through the lens 82 while being scanned in the direction of the arrow, for example, and the photocurable resin is cured at a desired position on the substrate to form the photocurable resin molded body 40. ((A) -3 in FIG. 1). Next, the uncured photocurable resin solution 30 is removed to obtain a substrate having a groove structure made of the photocurable resin molded body 40 ((a) -4 in FIG. 1). The process shown in FIG. 1 corresponds to the optical modeling process (a) in the first method of the present invention.
[0045]
Next, as shown in FIG. 2B-1, the electroless plating catalyst-containing solution 50 is patterned in the grooves on the substrate using the inkjet head 90. Next, the entire surface on which the electroless plating catalyst-containing solution 50 is patterned is irradiated with, for example, ultraviolet rays 95 to deposit the metal catalyst 60 in the plating catalyst-containing solution on the bottom and side surfaces of the groove (FIG. 2B). ) -2). After deposition of the metal catalyst 60, the electroless plating catalyst-containing solution 50 is removed to obtain a substrate having the catalyst on the bottom and side surfaces of the groove (FIG. 2 (b) -3). Next, this substrate is immersed in an electroless plating solution, and a conductive material 70 is deposited in the groove to form an electric circuit (FIG. 2C). In this way, the electric circuit component 100 in which the electric circuit made of the conductive material 70 is formed in the groove of the groove structure on the substrate 10 is obtained.
[0046]
Further, as shown in (a) ² of FIG. 3, the electric circuit component 100 (FIG. 2 (c)) obtained in the first cycle is used as a substrate, and the stereolithography of the step (a) ² is performed. A groove structure made of the photocurable resin molded body 40 is formed. Then, by patterning an electroless plating catalyst-containing solution 50 (FIG. 3 ^(b) 2 -1), the ultraviolet 95 to precipitate the metal catalyst 60 by irradiating the entire substrate surface (FIG. 3 ^(b) 2 -2) . After removal of the electroless plating catalyst-containing solution 50 was immersed in an electroless plating solution to deposit a conductive material 70, electrical circuit components 100 ² having a three-dimensional electrical circuitry is obtained (FIG. 3 (c) ² ). Similarly, a more complicated electric circuit can be formed by repeating from the stereolithography step (a) to the electroless plating step (c).
[0047]
The second manufacturing method of the electric circuit component of the present invention includes the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B1) A step of applying an electroless plating catalyst-containing solution to the entire surface of the substrate having the groove structure;
(B2) wiping the surface of the substrate to leave the electroless plating catalyst-containing solution only in the groove; and (c) the electroless plating method or the electroplating method following the electroless plating method, Depositing a conductive material in the opening of the groove structure;
including.
[0048]
In the second manufacturing method, the first manufacturing method is different from the step (b) in the following steps:
(B1) a step of applying an electroless plating catalyst-containing solution to the entire surface of the substrate having a groove structure; and (b2) a step of leaving the electroless plating catalyst-containing solution only in the groove by wiping the surface of the substrate. The other steps (a) and (c) are exactly the same. Moreover, in order to improve a catalyst function, it is the same that the process (b) -2 and (b) -3 in the said 1st manufacturing method can be performed after a process (b2).
[0049]
The electroless plating catalyst-containing solution used in the step (b1) is the same as that described for the step (b) of the first production method. In the step (b1), the electroless plating catalyst-containing solution is thinly applied to the entire substrate surface having a groove structure by means usually used in the technical field. At this time, the electroless plating catalyst-containing solution penetrates to the bottom of the groove.
[0050]
Next, in step (b2), the surface of the substrate is wiped so as to leave the electroless plating catalyst-containing solution only in the grooves. The means for wiping is a slide with a silicon rubber squeegee. This step needs to be performed with care so that the electroless plating catalyst-containing solution does not remain in a portion that is not a groove on the substrate.
[0051]
In this way, an electric circuit made of a conductive material is formed in the groove of the groove structure on the substrate, and an electric circuit component is obtained. Also in the case of the second manufacturing method, a three-dimensional electric circuit can be manufactured by repeating the cycle from the steps (a) to (c).
[0052]
The second method of the present invention will be described more specifically with reference to the drawings. However, the drawings are only examples, and the present invention is not limited to the drawings.
[0053]
Step (a) is exactly the same as the first manufacturing method described above. For example, as shown in FIG. 1, a substrate having a groove structure made of a photocurable resin molded body 40 is obtained by stereolithography.
[0054]
Next, as shown in FIG. 4B1, the electroless plating catalyst-containing solution 50 is applied to the entire surface of the substrate having the groove structure by using, for example, a spray. Next, as shown in FIG. 4 (b2), the surface of the substrate is wiped with a silicon rubber squeegee to leave the electroless plating catalyst-containing solution 50 only in the grooves. By irradiating the entire surface where the electroless plating catalyst-containing solution 50 is left only in the groove with, for example, ultraviolet rays 95, the metal catalyst 60 in the plating catalyst-containing solution is deposited on the bottom and side surfaces of the groove (FIG. 4). (B) -2). After deposition of the metal catalyst 60, the electroless plating catalyst-containing solution 50 is removed to obtain a substrate having the catalyst on the bottom and side surfaces of the groove (FIG. 4 (b) -3). Next, this substrate is immersed in an electroless plating solution, and a conductive material 70 is deposited in the groove to form an electric circuit (FIG. 4C). In this way, the electric circuit component 100 in which the electric circuit made of the conductive material 70 is formed in the groove of the groove structure on the substrate 10 is obtained. About the following repeating process, it is the same as that of the said 1st manufacturing method.
[0055]
In the second method of the present invention, instead of using the inkjet technique, the electroless plating catalyst-containing solution is simply applied and wiped, so that the step (b) can be performed more easily.
[0056]
The third manufacturing method of the electric circuit component of the present invention includes the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B ′) patterning a conductive ink in a groove on the substrate by inkjet technology; and (c ′) irradiating the conductive ink in the groove with a laser to form a conductive pattern;
including.
[0057]
Step (a) in the third method is the same as step (a) in the first method.
[0058]
In the next step (b ′), conductive ink is patterned in the groove on the substrate by an ink jet technique.
[0059]
Examples of the conductive ink used here include metal nanoparticle dispersed ink, metal complex ink, and low melting point metal. Examples of the metal contained in these include copper, silver, gold, platinum, and nickel. These are dissolved in an appropriate solvent, or in the case of a low melting point metal, melted by heating and used as a fluid for injection by an ink jet technique. Suitable solvents include butyl carbitol acetate, 3-dimethyl-2-imidazolidine, tetradecane, alcohol, water, xylene and the like.
[0060]
Since the groove to be patterned has a very narrow opening width, it is preferably performed using an inkjet head having a fine-structure nozzle. More preferably, the amount of injection from the inkjet head is 4 pL or less, more preferably 2 pL or less.
[0061]
Next, in step (c ′), the conductive ink in the groove is irradiated with a laser to form a conductive pattern. In this step, the conductive ink is baked by a laser to deposit the metal contained in the ink in the groove. Examples of the laser used for the baking include a He—Cd laser, an Ar ion laser, a YAG laser, an excimer laser, and a femtosecond laser. Laser irradiation conditions can be appropriately determined according to the conductive ink used. Moreover, you may use heat drying together.
[0062]
In this way, an electric circuit made of a conductive material is formed in the groove of the groove structure on the substrate, and an electric circuit component is obtained. Also in the case of the third manufacturing method, a three-dimensional electric circuit can be manufactured by repeating the cycle from the above steps (a) to (c ′).
[0063]
The third method of the present invention will be described more specifically with reference to the drawings. However, the drawings are only examples, and the present invention is not limited to the drawings.
[0064]
Step (a) is exactly the same as the first manufacturing method described above. For example, as shown in FIG. 1, a substrate having a groove structure made of a photocurable resin molded body 40 is obtained by stereolithography.
[0065]
Next, as shown in FIG. 5B ′, the conductive ink 55 is patterned in the groove on the substrate by using the inkjet head 90. Next, the conductive ink 55 in the groove is focused and irradiated with the femtosecond laser 80 through the lens 82, for example, in the direction of the arrow (FIG. 5 (c ′)-1) to deposit the conductive material 70. Then, a conductive pattern is formed (FIG. 5 (c ′)-2). In this way, the electric circuit component 100 in which the electric circuit made of the conductive material 70 is formed in the groove of the groove structure on the substrate 10 is obtained.
[0066]
Further, as shown in FIG. 6 (a) ² , a groove structure composed of the photocurable resin molded body 40 is formed on the substrate of the electric circuit component 100 obtained in the first cycle by the optical modeling method. . Next, the conductive ink 55 is patterned (FIG. 6 (b ′) ² ), and the femtosecond laser 80 is focused and deposited to deposit the conductive material 70 (FIG. 6 (c ′) ² −1), and three-dimensionally. electrical circuit components 100 ² is obtained with electrical circuits (FIG. ^{6 (c ') 2 -2)} . Similarly, a more complicated electric circuit can be formed by repeating steps (a) of optical modeling to steps (c ′) of laser irradiation.
[0067]
【The invention's effect】
According to the present invention, an electric circuit component having a three-dimensional complicated electric circuit can be manufactured without drilling or the like. In addition, since the width and depth of a circuit to be formed can be accurately adjusted using a laser or the like, an extremely fine three-dimensional electrical circuit can be formed. Therefore, it is possible to manufacture an electric circuit component having a high-density three-dimensional electric circuit.
[Brief description of the drawings]
BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic cross-sectional view of an electric circuit component for explaining a procedure of stereolithography, which is step (a) of the first manufacturing method of the electric circuit component of the present invention.
FIG. 2 is a schematic cross-sectional view of an electric circuit component for explaining steps (b) to (c) of the first manufacturing method of the electric circuit component of the present invention.
FIG. 3 is a schematic cross-sectional view of an electric circuit component, showing the manufacturing process of the electric circuit component by repeating steps (a) to (c) of the first manufacturing method of the present invention.
FIG. 4 is a schematic cross-sectional view of an electric circuit component for explaining steps (b1) to (c) of the second manufacturing method of the electric circuit component of the present invention.
FIG. 5 is a schematic cross-sectional view of an electric circuit component for explaining steps (b ′) to (c ′) of a third manufacturing method of the electric circuit component of the present invention.
FIG. 6 is a schematic cross-sectional view of an electric circuit component showing a process of repeatedly manufacturing the electric circuit component from steps (a) to (c ′) of the third manufacturing method of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Board | substrate 20 Planar electrode 30 Photocurable resin solution 40 Photocurable resin molding 50 Coating film 55 of plating catalyst containing solution Conductive ink 60 Metal catalyst 70 Conductive substance 80 Femtosecond laser 82 Lens 90 Inkjet nozzle 100 Formed electric circuit component 100 'Electric circuit component having a three-dimensional electric circuit

Claims (11)

An electrical circuit component manufacturing method comprising the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B) patterning an electroless plating catalyst-containing solution into the groove on the substrate by inkjet technology; and (c) an opening of the groove structure by electroless plating or electroplating subsequent to electroless plating. Depositing a conductive material on the substrate;
Including a method. The step (a) includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) a gold having a pattern of the groove structure. Selected from the group consisting of: forming the groove structure by transferring to a curable material using a mold; and (a3) patterning exposure of a photocurable resin by photolithography to form the groove structure. The method of claim 1, wherein: The method according to claim 1, further comprising a step of repeating the steps including the step (a) to the step (c) a predetermined number of times. An electrical circuit component manufacturing method comprising the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B1) A step of applying an electroless plating catalyst-containing solution to the entire surface of the substrate having the groove structure;
(B2) wiping the surface of the substrate to leave the electroless plating catalyst-containing solution only in the groove; and (c) the electroless plating method or the electroplating method following the electroless plating method, Depositing a conductive material in the opening of the groove structure;
Including a method. The step (a) includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) a gold having a pattern of the groove structure. Selected from the group consisting of: forming the groove structure by transferring to a curable material using a mold; and (a3) patterning exposure of a photocurable resin by photolithography to form the groove structure. 5. The method of claim 4, wherein: The method according to claim 4 or 5, further comprising a step of repeating the steps including the step (a) to the step (c) a predetermined number of times. An electric circuit component manufactured by the method according to claim 1. An electrical circuit component manufacturing method comprising the following steps:
(A) forming a non-conductive groove structure on the substrate;
(B ′) patterning a conductive ink in a groove on the substrate by inkjet technology; and (c ′) irradiating the conductive ink in the groove with a laser to form a conductive pattern;
Including a method. The step (a) includes (a1) a step of curing the photocurable resin at a desired position on the substrate by an optical modeling method to form the groove structure, and (a2) a gold having a pattern of the groove structure. Selected from the group consisting of: forming the groove structure by transferring to a curable material using a mold; and (a3) patterning exposure of a photocurable resin by photolithography to form the groove structure. 9. The method of claim 8, wherein: The method according to claim 8 or 9, further comprising the step of repeating the step (a) to the step (c ') a predetermined number of times. An electrical circuit component manufactured by the method according to claim 8.

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