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JP2005049320A - Acceleration sensor - Google Patents

Acceleration sensor Download PDF

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JP2005049320A
JP2005049320A JP2003309388A JP2003309388A JP2005049320A JP 2005049320 A JP2005049320 A JP 2005049320A JP 2003309388 A JP2003309388 A JP 2003309388A JP 2003309388 A JP2003309388 A JP 2003309388A JP 2005049320 A JP2005049320 A JP 2005049320A
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mass
acceleration sensor
beams
frame
acceleration
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Toshiyuki Toriyama
寿之 鳥山
Viet Dzung Dao
ベト ズン ダオ
Susumu Sugiyama
進 杉山
Yoshiya Okada
恵也 岡田
Takeshi Nishizawa
健 西澤
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Ritsumeikan Trust
Microstone Corp
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Ritsumeikan Trust
Microstone Corp
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Abstract

【課題】 加速度センサ内の無効スペースを無くし、質量を大きくかつビーム長を長くして検出感度を向上させあるいは小型化が可能な加速度センサの構造を提供すること。
【解決手段】 枠部の内部に配した可動の質量の重心を含まない平面上に配置され質量と枠部とを連結する複数のビー厶と、それらの表面に設けた複数の抵抗素子を備え、加速度により質量に生成する慣性力による質量の変位に比例した電気的変化を抵抗素子の抵抗変化によって計測するように構成された加速度センサ構造体において、枠部の内周はほぼ正方形をなし、かつ各ビームの中心軸はほぼ直線的であって、枠部の内周の正方形の各辺に平行して配置されたこと。また更に質量の外周部の辺が各ビームと平行すること。また4本のビームは「卍」字型に配置されていること。あるいは4本のビームは両端が前記枠に固着され、中央部が前記質量に固着されていること。
【選択図】 図1
PROBLEM TO BE SOLVED: To provide a structure of an acceleration sensor that eliminates an ineffective space in the acceleration sensor, increases the mass, lengthens the beam length, improves the detection sensitivity, or can be downsized.
SOLUTION: A plurality of bead rods arranged on a plane that does not include the center of gravity of a movable mass disposed inside a frame portion and that connects the mass and the frame portion, and a plurality of resistance elements provided on the surfaces thereof In the acceleration sensor structure configured to measure the electrical change in proportion to the displacement of the mass due to the inertial force generated in the mass by the acceleration by the resistance change of the resistance element, the inner periphery of the frame portion is substantially square, In addition, the central axis of each beam is substantially linear and is arranged in parallel with each side of the square on the inner periphery of the frame. Furthermore, the sides of the outer periphery of the mass should be parallel to each beam. The four beams should be arranged in a “卍” shape. Alternatively, the four beams have both ends fixed to the frame and the center is fixed to the mass.
[Selection] Figure 1

Description

本発明は加速度センサに関する。更に詳しくは、ピエゾ抵抗効果によって可動質量の変位にほぼ比例した電気的変化を出力する構成の加速度センサに関する。  The present invention relates to an acceleration sensor. More specifically, the present invention relates to an acceleration sensor configured to output an electrical change substantially proportional to the displacement of a movable mass by a piezoresistive effect.

加速度センサは近年小型化が進み、微細加工技術を駆使して、1次元のみならず2次元あるいは3次元方向の加速度を検出することが可能な小型化したセンサ構造体が提案されている。ピエゾ抵抗効果を利用した、加速度センサの一従来例の構造を、図8(平面図)および図9(中央C−C断面図)に示す。また方向を定義するため直交座標軸も各図内に示した。  In recent years, the acceleration sensor has been miniaturized, and a miniaturized sensor structure has been proposed that can detect not only a one-dimensional but also a two-dimensional or three-dimensional acceleration by utilizing a fine processing technique. FIG. 8 (plan view) and FIG. 9 (center CC cross-sectional view) show the structure of a conventional example of an acceleration sensor using the piezoresistive effect. Also, Cartesian coordinate axes are shown in each figure to define the direction.

センサ構造体の従来例を示す両図において、構成材料はSOI(Silicon On Insulator)基板、即ち数百μmの厚さのSi基板の上面から数μm〜数十μmの深さの位置に薄い埋込SiO2層1を有する材料を用い、これにエッチング加工や薄膜形成技術より成る微細加工プロセスを適用して多数個のセンサを同時に成形する。単体のセンサは図示のように立方体を薄くしたような外形を呈する。  In both figures showing a conventional example of a sensor structure, the constituent material is thinly embedded at a depth of several μm to several tens of μm from the upper surface of an SOI (Silicon On Insulator) substrate, that is, a Si substrate having a thickness of several hundred μm. A material having the embedded SiO2 layer 1 is used, and a number of sensors are simultaneously formed by applying a microfabrication process including etching and thin film formation techniques to the material. The single sensor has an external shape that is a thin cube as shown.

外側は正方形の枠部2(その下面は図示しないセンサ支持体の表面に固着されて使用される)、中心部には質量3を有し、両者は4本の直線的で同形のビーム5、6、7、8で連結される。各ビームの厚さはSOI基板の埋込SiO2層1より上側のSi層の厚さであってセンサの総厚(SOI基板の厚さであり、枠部2の厚さでもある)よりかなり薄くして容易に撓みうるようにされている。  The outer side is a square frame 2 (the lower surface is used by being fixed to the surface of a sensor support not shown), the center has a mass 3, both of which are four linear and identical beams 5, It is connected at 6, 7, and 8. The thickness of each beam is the thickness of the Si layer above the buried SiO2 layer 1 of the SOI substrate, which is considerably smaller than the total thickness of the sensor (the thickness of the SOI substrate and also the thickness of the frame 2). Therefore, it can be easily bent.

枠部2の内部には4個の「く」の字型をした透孔10があるが、これはSOI基板の上面から透孔10の位置のSiをエッチングし、また下面から透孔10の位置およびビーム5、6、7、8の下面のSiを深堀りエッチングで除去し、最後に露出した埋込SiO2層1をエッチングして除去することによって形成する。質量3の下面からも若干のSi層を除去して質量3の可動スペースを作る。  Inside the frame portion 2, there are four “<”-shaped through holes 10, which are formed by etching Si at the position of the through holes 10 from the upper surface of the SOI substrate and from the lower surface of the through holes 10. The position and the lower surface of the beams 5, 6, 7, 8 are removed by deep etching, and finally the buried SiO 2 layer 1 exposed is removed by etching. A slight Si layer is also removed from the lower surface of mass 3 to create a movable space of mass 3.

質量3およびビーム5、6、7、8はこうして形成される。なお、これらの工程に先立って、各ビームの上面の必要位置には、ボロン等をドープしたP型Siの薄層より成り実質部分が短冊状をなしピエゾ抵抗効果を有する抵抗素子9が複数個設けられる。また各抵抗素子9に付随して、絶縁層や外部へのリード線となるアルミニウム配線パターンも設けられるが図示はしていない。  Mass 3 and beams 5, 6, 7, 8 are thus formed. Prior to these steps, a plurality of resistance elements 9 having a piezoresistive effect in which a substantial part is formed of a thin layer of P-type Si doped with boron or the like and is substantially strip-shaped at a necessary position on the upper surface of each beam. Provided. In addition, an aluminum wiring pattern serving as an insulating layer and a lead wire to the outside is also provided along with each resistance element 9, but it is not shown.

質量3は4本の細く薄いビーム5、6、7、8で弾性的に吊られ、質量3の厚さは枠部2の厚さより僅かに薄くして枠部2の内部で可動の余地を残している。各ビー厶の上面の各抵抗素子9はホイートストンブリッジ回路に組み込まれ、静止時にはブリッジ回路をバランスさせてある。センサ支持体(図示せず)を通じてセンサすなわち枠部2に加速度が印加されると、質量3の重心Gにはセンサから見て加速度とは逆向きの慣性力が発生し、ビームの弾性支持力に抗して枠内で僅かに変位する。この変位によりビームが変形し、抵抗素子9の抵抗値が変化し、結局ブリッジ回路からは印加加速度にほぼ比例した非平衡出力が得られる。  The mass 3 is elastically suspended by four thin and thin beams 5, 6, 7, and 8. The thickness of the mass 3 is slightly thinner than the thickness of the frame portion 2 so that there is room for movement inside the frame portion 2. I'm leaving. Each resistance element 9 on the upper surface of each beaker is incorporated in a Wheatstone bridge circuit, and the bridge circuit is balanced when stationary. When acceleration is applied to the sensor, that is, the frame portion 2 through a sensor support (not shown), an inertial force opposite to the acceleration as viewed from the sensor is generated at the center of gravity G of the mass 3, and the elastic support force of the beam It is displaced slightly in the frame against Due to this displacement, the beam is deformed, and the resistance value of the resistance element 9 is changed. As a result, a non-equilibrium output almost proportional to the applied acceleration can be obtained from the bridge circuit.

質量3の重心Gが上下(Z方向)に動くときは質量3は平行移動し、各ビームが同様な波形(あるいはゆるやかな段差型というべきか)の屈曲変形をなす。重心Gはビー厶5、6、7、8の厚さ中央に位置する平面よりかなり下方にずれた位置にあるため、重心GがXまたはY方向に変位すると慣性力のモーメントによって各ビームはそれぞれ異なる波形の変形をなす。加速度の方向によってビームの変形態様が異なるので、例えば3種類のブリッジ回路を用意しておけば直交3方向の加速度成分に比例する出力を別個に得ることができる。  When the center of gravity G of the mass 3 moves up and down (Z direction), the mass 3 moves in parallel, and each beam is bent and deformed in a similar waveform (or should be a gentle step type). Since the center of gravity G is located at a position considerably below the plane located at the center of the thickness of the beak bowls 5, 6, 7 and 8, when the center of gravity G is displaced in the X or Y direction, each beam is caused by the moment of inertia. Make different waveform deformations. Since the beam deformation mode varies depending on the direction of acceleration, for example, if three types of bridge circuits are prepared, outputs proportional to acceleration components in three orthogonal directions can be obtained separately.

上述の従来例の加速度センサには次のような問題点がある。
(1)4か所の太い「く」の字型の透孔10が有効に活かされないデッドスペースになっていて、センサの小型化を妨げている。
(2)ビーム5、6、7、8がセンサの直径方向に向かうため、その長さが十分に取れず検出感度が低い。ビームが短いと撓みの剛性が高くなり変形し難くなるし、それを避けようと薄くすれば脆弱になり破損しやすい。また形成可能な抵抗素子も短くならざるを得ず、検出感度である質量の変位に対する抵抗変化量も十分に得られない。
(3)また必要なビーム長を確保しようとして質量3の大型化を妨げている。
The conventional acceleration sensor described above has the following problems.
(1) The four thick “く” -shaped through holes 10 are dead spaces that are not effectively utilized, and hinder the downsizing of the sensor.
(2) Since the beams 5, 6, 7, and 8 are directed in the diameter direction of the sensor, the length thereof cannot be sufficiently obtained and the detection sensitivity is low. If the beam is short, the bending rigidity becomes high and it becomes difficult to deform, and if it is made thin to avoid it, it becomes brittle and easily broken. Moreover, the resistive element that can be formed must be shortened, and the amount of resistance change with respect to the mass displacement, which is the detection sensitivity, cannot be sufficiently obtained.
(3) Further, an attempt to secure the necessary beam length prevents the mass 3 from being enlarged.

本発明はこれら問題点を解決すべくなされたもので、その目的は、加速度センサ内の無効スペースをほぼ無くして質量を大きくすると共に、ビームを極力長くして加速度の検出感度を向上させることができ、あるいは小型化が可能な加速度センサの構造を提供することである。  The present invention has been made to solve these problems, and its purpose is to eliminate the ineffective space in the acceleration sensor to increase the mass and to lengthen the beam as much as possible to improve the acceleration detection sensitivity. An object of the present invention is to provide a structure of an acceleration sensor that can be made or can be miniaturized.

上記目的を実現するため、本発明の加速度センサは次の特徴を有する。
(1)外周を囲む枠部と、該枠部の内部に配置した可動の質量と、該質量の重心を含まない平面上に配置され前記質量と前記枠部とを連結する複数のビー厶と、該複数のビームの表面の所定位置に設けた複数の抵抗素子を備え、加速度により前記質量に生成する慣性力による前記質量の変位にほぼ比例した電気的変化を、前記ビームの変形を介して前記抵抗素子の抵抗変化によって計測するように構成された、加速度検出作用を有するセンサ構造体において、前記枠部の内周はほぼ正方形をなし、かつ前記複数のビームの中心軸はほぼ直線的であって、前記枠部の前記正方形の各辺に平行して配置されたこと。
In order to achieve the above object, the acceleration sensor of the present invention has the following characteristics.
(1) A frame portion that surrounds the outer periphery, a movable mass disposed inside the frame portion, and a plurality of bees that are disposed on a plane not including the center of gravity of the mass and connect the mass and the frame portion. A plurality of resistance elements provided at predetermined positions on the surfaces of the plurality of beams, and an electrical change substantially proportional to the displacement of the mass due to an inertial force generated in the mass due to acceleration through the deformation of the beam In a sensor structure having an acceleration detection function configured to measure by a resistance change of the resistance element, an inner circumference of the frame portion is substantially square, and central axes of the plurality of beams are substantially linear. And arranged in parallel with each side of the square of the frame.

また本発明の加速度センサは、次(2)〜(4)の特徴のどれか少なくとも一つを更に有することがある。
(2)前記質量の外周部は、前記枠部の内周の正方形の各辺、および前記複数のビームの中心軸とほぼ平行する複数の辺を備えたこと。
The acceleration sensor of the present invention may further have at least one of the following features (2) to (4).
(2) The outer peripheral portion of the mass includes each side of the square on the inner periphery of the frame portion and a plurality of sides substantially parallel to the central axes of the plurality of beams.

(3)前記ビームは4本あり、各ビームは一端が前記枠に固着され、他端が前記質量に固着され、かつ前記各ビームは前記質量の周囲に、ほぼ「卍」字型をなすように配置されていること。(3) There are four beams, one end of each beam is fixed to the frame, the other end is fixed to the mass, and each beam has a substantially “卍” shape around the mass. Be placed in.

(4)前記ビー厶は4本あり、各ビームは両端が前記枠に固着され、中央部が前記質量に固着されていること。(4) There are four bees, and both ends of each beam are fixed to the frame, and the center is fixed to the mass.

本発明においては、ビームを枠部の内周に沿わせて配置したのでビームの長さを長くすることができ、質量の変位に対する抵抗変化の感度を増すことができる。同時に個々のビームの強度も増すことができる。また更に質量の外周もビームの側面に接近させることによって質量の平面面積も大きくすることができるので、質量の値自体が増加し同じ加速度に対する質量の変位を増し、やはり加速度の検出感度を増すことができる。そしてセンサ平面の全面積を有効に利用することができるので、加速度センサの小型化にも寄与することができる。  In the present invention, since the beam is arranged along the inner periphery of the frame portion, the length of the beam can be increased, and the sensitivity of resistance change to mass displacement can be increased. At the same time, the intensity of the individual beams can be increased. Furthermore, since the mass plane area can be increased by bringing the outer circumference of the mass closer to the side surface of the beam, the mass value itself increases, increasing the mass displacement for the same acceleration, and also increasing the acceleration detection sensitivity. Can do. And since the whole area of a sensor plane can be used effectively, it can also contribute to size reduction of an acceleration sensor.

本発明の加速度センサ構造においては、ピエゾ抵抗効果を有する抵抗素子を設ける4本のビームを枠部の内周、およびその内部の質量の外周の各辺に沿うように配置している。以下にその2つの実施例について述べる。それらの構造を示す図面において、従来例と対応し機能を等しくする部分には同じ符号を付し、それらについては改めて説明はせず反復を避けることとする。またいずれの実施例も、基本的には既に述べた従来例に準じた微細加工プロセスによって製造されるので、その詳細や改善された加工法の適用については自由とし、特に問わないものとする。  In the acceleration sensor structure of the present invention, four beams provided with resistance elements having a piezoresistive effect are arranged along the inner circumference of the frame portion and the respective sides of the inner circumference of the mass. Two examples are described below. In the drawings showing these structures, parts corresponding to those of the conventional example and having the same functions are denoted by the same reference numerals, and will not be repeated without being described again. Each of the embodiments is basically manufactured by a microfabrication process according to the above-described conventional example. Therefore, the details and application of the improved processing method are free, and there is no particular limitation.

図1は本発明の3次元加速度センサの第1の実施例の平面図、図2はそのA−A断面図である。本実施例では時1に表れたセンサ平面をSi単結晶の(100)面に、X軸を<110>方向に、Y軸を<1−10>方向に取ってある。これはピエゾ抵抗効果の異方性や対称性を考慮した結果である。ビー厶5、6、7、8は、平面形状が正方形である質量3の各辺の中央に設けた凸部4の側面と、枠部2の内部の各辺の端に近い部分とを連結するように、センサの上面側に形成される。(枠部2や質量3の平面形状は正方形であることが設計の素直さやX、Y感度の均等化等の理由で好ましいが、これらの形状を矩形としてもセンサは実現可能である。各ビームの長さも形や必ずしも同一でなくてもよい。)  FIG. 1 is a plan view of a first embodiment of the three-dimensional acceleration sensor of the present invention, and FIG. In this example, the sensor plane appearing at time 1 is taken as the (100) plane of the Si single crystal, the X axis is taken in the <110> direction, and the Y axis is taken in the <1-10> direction. This is a result of considering the anisotropy and symmetry of the piezoresistive effect. The beak bowls 5, 6, 7, and 8 connect the side surface of the convex portion 4 provided at the center of each side of the mass 3 having a square planar shape and the portion close to the end of each side inside the frame portion 2. Thus, it is formed on the upper surface side of the sensor. (The planar shape of the frame 2 and the mass 3 is preferably a square because of the simplicity of the design and the equalization of X and Y sensitivities, but the sensor can be realized even if these shapes are rectangular. The length of and does not necessarily have the same shape or shape.)

故に各ビームの平面的な配置は中心の質量3の周囲に、あたかも[卍」字型をなすように配置される。もとよりそれらビームの向きは時計回りでも反時計回りでもよい。このような配置により、各ビームの長さはかなり長く改善される。また質量3の平面的な外形は各ビームの側面に近接できるので(4か所の透孔10の幅を極力狭くすることによる)その質量の値もかなり大きく設定することができる。なお4個の凸部4の質量値も質量3のそれと一体となって加算される。  Therefore, the planar arrangement of each beam is arranged around the center mass 3 so as to form a “卍” shape. Of course, the direction of these beams may be clockwise or counterclockwise. Such an arrangement improves the length of each beam considerably longer. Further, since the planar outer shape of the mass 3 can be close to the side surface of each beam (by reducing the width of the four through holes 10 as much as possible), the value of the mass can be set to be considerably large. The mass values of the four convex portions 4 are also added together with that of the mass 3.

ビーム5、6、7、8の長大化に伴うメリットについて述べる。まず長さ増大によって曲げ剛性が低下し、同じ質量と同じ加速度に対して大きな変形が得られる。またビーム上で同じ歪みを生ずる表面が増すので、その上に形成される抵抗素子9の長さや大きさを増すことができ、特性・感度・加工精度を改善し得る。また同じ曲げ剛性を与えるビーム厚さを厚くでき、ビームの中立面から表面までの距離(厚さの半分)は大となり、中立面が同じ曲率で曲がっても、その表面の伸縮歪みは大きくなり、ピエゾ抵抗効果の増大に寄与する。また質量3が衝撃などで激しく動いた場合、その運動エネルギは各ビームに吸収されるが、ビームが破損に至るまでに吸収し得るエネルギはビームの体積に比例するので、ビームの長大化によってセンサの耐破壊強度は改善されることにもなる。  The advantages associated with the lengthening of the beams 5, 6, 7, and 8 will be described. First, the bending rigidity is reduced by increasing the length, and a large deformation is obtained for the same mass and the same acceleration. Moreover, since the surface which produces the same distortion on a beam increases, the length and magnitude | size of the resistive element 9 formed on it can be increased, and a characteristic, a sensitivity, and a processing precision can be improved. Also, the beam thickness that gives the same bending rigidity can be increased, the distance from the neutral surface to the surface (half the thickness) becomes large, and even if the neutral surface bends with the same curvature, the expansion and contraction of the surface is Increases and contributes to an increase in the piezoresistive effect. When the mass 3 moves violently due to impact or the like, its kinetic energy is absorbed by each beam, but the energy that can be absorbed until the beam is broken is proportional to the volume of the beam. This also improves the fracture strength of the steel.

ピエゾ抵抗効果を有する抵抗素子9であるRx1〜Rx4、Ry1〜Ry4、Rz1〜Rz4は、それぞれX、Y、Z方向の加速度成分を個別に測定するため、ビー厶5〜8の表面に大略図1に示す位置に形成される。これらはXまたはY方向加速度が印加されたときは質量3の所定方向の傾斜変位による、Z方向加速度の場合は質量3の上下平行移動によるビームの変形を分離して検出できるように配置される。  Rx1 to Rx4, Ry1 to Ry4, and Rz1 to Rz4, which are resistive elements 9 having a piezoresistive effect, are schematically illustrated on the surfaces of the beads 5 to 8 in order to individually measure acceleration components in the X, Y, and Z directions. 1 is formed. These are arranged so that the deformation of the beam due to the tilt displacement of the mass 3 in a predetermined direction when the acceleration in the X or Y direction is applied, and the deformation of the beam due to the vertical translation of the mass 3 can be detected separately in the case of the Z direction acceleration. .

各抵抗素子は加速度検出回路の要部である3個のホイートストンブリッジ回路に図3(a)、(b)、(c)に示すように組み込まれている。長方形の枠は各抵抗素子9の抵抗値を示す。各ブリッジ回路は図面の垂直方向にGNDとの間に定電圧入力Vinが供給され、静止時には各辺の抵抗はバランスするように調整される。そして印加加速度に基づくビームの歪みにより抵抗のバランスが崩れる。図中各抵抗に付した矢印は、座標軸の方向に作用した加速度に対する抵抗変化の向きを表している。水平方向に設けた各検出端子間より、X、Y、Z方向の加速度成分に比例した電圧出力である、VoutAx、VoutAy、VoutAzがそれぞれ得られる。  Each resistance element is incorporated in three Wheatstone bridge circuits, which are the main parts of the acceleration detection circuit, as shown in FIGS. 3 (a), 3 (b), and 3 (c). A rectangular frame indicates the resistance value of each resistance element 9. Each bridge circuit is supplied with a constant voltage input Vin between itself and GND in the vertical direction of the drawing, and the resistance of each side is adjusted so as to balance when stationary. The resistance balance is lost due to the distortion of the beam based on the applied acceleration. In the figure, the arrow attached to each resistance represents the direction of resistance change with respect to acceleration acting in the direction of the coordinate axis. VoutAx, VoutAy, and VoutAz, which are voltage outputs proportional to the acceleration components in the X, Y, and Z directions, are obtained from the detection terminals provided in the horizontal direction.

第1実施例の変形例について述べる。図1では各透孔10の一部にまだ幅の広い部分がある。このスペースを活用して質量3を増すため、点線で輪郭を示したように4個の付加質量3aを質量3と一体に設けることができる。また他のスペース活用法として、ビーム5、6、7、8の質量3側の固定端である凸部4のそれぞれの位置を、質量3の辺上で、各ビー厶の枠部2側の固定端より遠い方向にずらすことにより、各ビームの長さを更に長く(ほぼ質量3の辺長近くまで)伸長させることもできる。また、各抵抗素子9の位置は、必ずしも図示位置(ビームの端部)のみが最良であるとは限らない。たとえばその幾つかはビームの中央部付近にあってもよいであろう。もちろんそれと共にブリッジ回路の構成も変化する。  A modification of the first embodiment will be described. In FIG. 1, there is still a wide portion in a part of each through hole 10. In order to increase the mass 3 by utilizing this space, the four additional masses 3a can be provided integrally with the mass 3 as indicated by the dotted line. As another space utilization method, the positions of the convex portions 4 that are fixed ends on the mass 3 side of the beams 5, 6, 7, and 8 are set on the sides of the mass 3 on the frame portion 2 side of each beak bowl. By shifting in a direction farther from the fixed end, the length of each beam can be further extended (to nearly the side length of mass 3). In addition, the position of each resistance element 9 is not necessarily the best in the illustrated position (the end of the beam). For example, some may be near the center of the beam. Of course, the configuration of the bridge circuit changes with it.

その他にも種々の変形があり得るであろう。例えば、本実施例の構造では質量3の変位の状況によっては、いくつかのビームに僅かなねじれが発生することがあり得る。このねじれによるピエゾ抵抗効果が存在して、ビームの屈曲に基づくピエゾ抵抗効果に加算されると、ある方向の検出出力に対しては他軸感度となり、センサの検出精度や感度が影響を受ける可能性がある。p型Siのピエゾ抵抗効果には異方性があるので、曲げ変形ではピエゾ抵抗効果があるが、ねじれ変形ではピエゾ抵抗効果が0になるような結晶面や方位を利用し、センサの切り出し方位を傾斜させてねじりに不感であるようなセンサ構成を得ることも可能である。  There may be various other modifications. For example, in the structure of the present embodiment, a slight twist may occur in some beams depending on the state of displacement of the mass 3. If there is a piezoresistive effect due to this torsion and it is added to the piezoresistive effect based on the bending of the beam, it will become the sensitivity of other axes for the detection output in a certain direction, and the detection accuracy and sensitivity of the sensor may be affected. There is sex. Since the piezoresistance effect of p-type Si has anisotropy, there is a piezoresistance effect in bending deformation, but in the case of torsional deformation, a crystal plane or orientation that makes the piezoresistance effect zero is used to cut out the sensor orientation. It is also possible to obtain a sensor configuration that is insensitive to torsion by tilting.

図4は本発明の3次元加速度センサの第2の実施例の平面図、図5はそのB−B断面図である。本実施例では、平面形状が正方形である質量3の各辺の中央に設けた凸部4の両側面から各辺に平行に沿うように、ビーム(部分ビームと考えてよい)5、5a、6、6a、7、7a、8、8aを固定的に設け、それらの他端は枠部2に固着された形となる。故に一直線上にあって対をなすビーム(例えば5と5a等)を1本のビームとみなすと、質量3は4本の両持ちの4本のビームのそれぞれ中央部に固定され支持されていると言うことができる。第2実施例の長所は既述の第1実施例の長所をほぼ受け継いでいるが、更に対称性が増したためにねじれの効果が無視できるほど小さいことが期待される。  FIG. 4 is a plan view of a second embodiment of the three-dimensional acceleration sensor of the present invention, and FIG. In the present embodiment, the beams (which may be considered partial beams) 5, 5 a are arranged so as to be parallel to each side from both side surfaces of the convex portion 4 provided at the center of each side of the mass 3 having a square planar shape. 6, 6 a, 7, 7 a, 8, 8 a are fixedly provided, and the other end thereof is fixed to the frame portion 2. Therefore, if a pair of beams (for example, 5 and 5a) that are in a straight line is regarded as one beam, the mass 3 is fixed and supported at the center of each of the four beams that are both supported by the four ends. Can be said. The advantages of the second embodiment are almost inherited from the advantages of the first embodiment described above, but it is expected that the effect of twisting is negligible because the symmetry is further increased.

本実施例における抵抗素子9はビームの両側部分に設けたため数が多くなり、R’z1〜R’z4が増えており、図4のように配置されている。これらは図6(a)、(b)、(c)に示すホイートストン・ブリッジ回路に組み込まれている。ブリッジ回路の検出作用や諸効果も第1実施例と本質的に同様である。本例もまた、例えば抵抗素子の位置や質量の形状やビーム長さやその他の種々の変形が可能であろう。  Since the resistance elements 9 in this embodiment are provided on both side portions of the beam, the number thereof increases, R′z1 to R′z4 increase, and they are arranged as shown in FIG. These are incorporated in the Wheatstone bridge circuit shown in FIGS. 6 (a), 6 (b) and 6 (c). The detection operation and various effects of the bridge circuit are essentially the same as in the first embodiment. In this example, for example, the position of the resistance element, the shape of the mass, the beam length, and other various modifications may be possible.

図7は本発明の第2実施例の変形例の平面図である。本変形例と図4の基本形とは、各抵抗素子9の配置が異なることである。センサの断面形状は図5と同一でよく、また検出用のブリッジ回路も図6と同じ回路が使用できるので、変形例の平面図のみを示している。図4の基本形ではX方向検出用抵抗素子であるRx1〜Rx4や、Y方向検出用抵抗素子であるRy1〜Ry4をそれぞれ一直線をなす同じビーム上に配列したが、図7の変形例ではX方向検出用抵抗素子9の1対づつ(Rx1とRx2、Rx3とRx4)、およびY方向検出用抵抗素子9の1対づつ(Ry1とRy2、Ry3とRy4)を、異なる(対辺上の)ビー厶上に配置した。動作シミュレーションによるとこの配置の方が高いX、Y検出感度が得られる。  FIG. 7 is a plan view of a modification of the second embodiment of the present invention. This modified example is different from the basic shape of FIG. 4 in the arrangement of the resistance elements 9. The cross-sectional shape of the sensor may be the same as in FIG. 5, and the same bridge circuit for detection as in FIG. 6 can be used, so only a plan view of a modification is shown. In the basic form of FIG. 4, Rx1 to Rx4 that are X direction detection resistance elements and Ry1 to Ry4 that are Y direction detection resistance elements are arranged on the same straight line, but in the modified example of FIG. One pair of detection resistive elements 9 (Rx1 and Rx2, Rx3 and Rx4) and one pair of Y direction detection resistive elements 9 (Ry1 and Ry2, Ry3 and Ry4) are different (on the opposite side). Placed on top. According to the operation simulation, this arrangement can provide higher X and Y detection sensitivity.

本発明の第3実施例について、図面を使用しないで説明する。本例は第1実施例と第2実施例をミックスしたような部分的構造を持つ。すなわち、図8から例えばビー厶(部分ビーム)5a、6、7a、8を取り除いた平面形状を有する。換言すれば、第1実施例のビーム6とビーム8の延びる方向を逆にしたとも言える。この構成でも3次元加速度の検出は可能であり諸特徴は第1実施例に近くなる。ただし、各抵抗素子9のブリッジ回路上の位置は図3とは異なり得る。本例にも変形例はもちろん種々あり得る。  A third embodiment of the present invention will be described without using the drawings. This example has a partial structure that is a mixture of the first and second embodiments. That is, it has a planar shape obtained by removing, for example, the beak bowls (partial beams) 5a, 6, 7a, and 8 from FIG. In other words, it can be said that the extending directions of the beam 6 and the beam 8 of the first embodiment are reversed. Even in this configuration, the three-dimensional acceleration can be detected, and various features are close to those of the first embodiment. However, the position of each resistance element 9 on the bridge circuit may be different from that in FIG. There can be various modifications of this example as well.

本発明によって、加速度センサの感度の向上あるいはより小型化(例えば1mm×1mm×0.5mm程度)が図れるので、加速度の検出精度の向上や検出回路の構成の簡素化や省電力化が達成あるいは期待でき、またセンサを封入するパッケージも小型化され、更に加速度センサが組み込まれる機器自体にも、省スペースによる部品配置の合理化やそれに伴う小型化が期待できる。  According to the present invention, the sensitivity of the acceleration sensor can be improved or downsized (for example, about 1 mm × 1 mm × 0.5 mm), so that the acceleration detection accuracy can be improved, the configuration of the detection circuit can be simplified, and the power can be saved. The package that encloses the sensor can be expected to be downsized, and the device itself in which the acceleration sensor is incorporated can be expected to rationalize the component arrangement and save the space.

本発明の加速度センサの第1の実施例の平面図である。  It is a top view of the 1st example of the acceleration sensor of the present invention. 本発明の加速度センサの第1の実施例のA−A断面図である。  It is AA sectional drawing of the 1st Example of the acceleration sensor of this invention. (a)、(b)、(c)の各図はそれぞれ、本発明の加速度センサの第1の実施例における検出回路の要部の回路図である。  Each of (a), (b), and (c) is a circuit diagram of the main part of the detection circuit in the first embodiment of the acceleration sensor of the present invention. 本発明の加速度センサの第2の実施例の平面図である。  It is a top view of the 2nd example of the acceleration sensor of the present invention. 本発明の加速度センサの第2の実施例のB−B断面図である。  It is BB sectional drawing of the 2nd Example of the acceleration sensor of this invention. (a)、(b)、(c)の各図はそれぞれ、本発明の加速度センサの第2の実施例における検出回路の要部の回路図である。  Each of (a), (b), and (c) is a circuit diagram of the main part of the detection circuit in the second embodiment of the acceleration sensor of the present invention. 本発明の加速度センサの第2の実施例の変形例の平面図である。  It is a top view of the modification of the 2nd Example of the acceleration sensor of this invention. 加速度センサの従来例の平面図である。  It is a top view of the prior art example of an acceleration sensor. 加速度センサの従来例のC−C断面図である。  It is CC sectional drawing of the prior art example of an acceleration sensor.

符号の説明Explanation of symbols

1 埋込SiO2層
2 枠部
3 質量
3a 追加質量
4 凸部
5、5a、6、6a、7、7a、8、8a ビーム
9 抵抗素子
10 透孔
Ax、Ay、Az 加速度成分
G 重心
GND 接地端子
Vin 電源入力端子
Vout 加速度出力
X、Y、Z 座標軸
DESCRIPTION OF SYMBOLS 1 Embedded SiO2 layer 2 Frame part 3 Mass 3a Additional mass 4 Convex part 5, 5a, 6, 6a, 7, 7a, 8, 8a Beam 9 Resistance element 10 Through-hole Ax, Ay, Az Acceleration component G Gravity center GND Grounding terminal Vin Power input terminal Vout Acceleration output X, Y, Z Coordinate axis

Claims (4)

外周を囲む枠部と、該枠部の内部に配置した可動の質量と、該質量の重心を含まない平面上に配置され前記質量と前記枠部とを連結する複数のビームと、該複数のビー厶の表面の所定位置に設けた複数の抵抗素子を備え、加速度により前記質量に生成する慣性力による前記質量の変位にほぼ比例した電気的変化を、前記ビームの変形を介して前記抵抗素子の抵抗変化によって計測するように構成された、加速度検出作用を有するセンサ構造体において、前記枠部の内周はほぼ正方形をなし、かつ前記複数のビームの中心軸はほぼ直線的であって、前記枠部の前記正方形の各辺に平行して配置されたことを特徴とする加速度センサ。  A frame surrounding the outer periphery, a movable mass disposed inside the frame, a plurality of beams disposed on a plane not including the center of gravity of the mass, and connecting the mass and the frame; and the plurality of beams A plurality of resistance elements provided at predetermined positions on the surface of the beet bowl, and the resistance elements undergo an electrical change substantially proportional to the displacement of the mass due to an inertial force generated in the mass by acceleration through deformation of the beam. In the sensor structure having an acceleration detecting action, which is configured to measure by a resistance change, the inner circumference of the frame portion is substantially square, and the central axes of the plurality of beams are substantially linear, An acceleration sensor, wherein the acceleration sensor is arranged in parallel with each side of the square of the frame portion. 前記質量の外周部は、前記枠部の内周の正方形の各辺、および前記複数のビームの中心軸とほぼ平行する複数の辺を備えたことを特徴とする請求項1の加速度センサ。  2. The acceleration sensor according to claim 1, wherein an outer peripheral portion of the mass includes each side of a square of an inner periphery of the frame portion and a plurality of sides substantially parallel to central axes of the plurality of beams. 前記ビームは4本あり、各ビー厶は一端が前記枠に固着され、他端が前記質量に固着され、かつ前記各ビームは前記質量の周囲に、ほぼ「卍」字型をなすように配置されていることを特徴とする請求項1あるいは2の加速度センサ。  There are four beams, one end of each beam is fixed to the frame, the other end is fixed to the mass, and the beams are arranged in a substantially “卍” shape around the mass. The acceleration sensor according to claim 1, wherein the acceleration sensor is provided. 前記ビー厶は4本あり、各ビームは両端が前記枠に固着され、中央部が前記質量に固着されていることを特徴とする請求項1あるいは2の加速度センサ。  The acceleration sensor according to claim 1 or 2, wherein the number of the beaks is four, and each beam is fixed to the frame at both ends and the center is fixed to the mass.
JP2003309388A 2003-07-30 2003-07-30 Acceleration sensor Pending JP2005049320A (en)

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JP2007132814A (en) * 2005-11-10 2007-05-31 Nippon Ceramic Co Ltd MEMS structure for gas sensor
JP2007298471A (en) * 2006-05-02 2007-11-15 Honda Motor Co Ltd Force sensor chip
JP2007333665A (en) * 2006-06-19 2007-12-27 Ritsumeikan Acceleration sensor and method of manufacturing acceleration sensor
JP2010078500A (en) * 2008-09-26 2010-04-08 Toshiba Corp Inertial sensor
JP2010164569A (en) * 2010-02-15 2010-07-29 Panasonic Corp Multiaxial acceleration sensor
KR101451697B1 (en) * 2010-05-24 2014-10-16 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 Surface stress sensor
CN107271721A (en) * 2016-03-31 2017-10-20 意法半导体股份有限公司 MEMS Accelerometer Sensor with High Accuracy and Low Sensitivity to Temperature and Aging
CN109596859A (en) * 2019-01-18 2019-04-09 中国电子科技集团公司第十三研究所 Piezoresistance type acceleration sensor
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Publication number Priority date Publication date Assignee Title
JP2007132814A (en) * 2005-11-10 2007-05-31 Nippon Ceramic Co Ltd MEMS structure for gas sensor
JP2007298471A (en) * 2006-05-02 2007-11-15 Honda Motor Co Ltd Force sensor chip
JP2007333665A (en) * 2006-06-19 2007-12-27 Ritsumeikan Acceleration sensor and method of manufacturing acceleration sensor
JP2010078500A (en) * 2008-09-26 2010-04-08 Toshiba Corp Inertial sensor
JP2010164569A (en) * 2010-02-15 2010-07-29 Panasonic Corp Multiaxial acceleration sensor
KR101451697B1 (en) * 2010-05-24 2014-10-16 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 Surface stress sensor
CN107271721A (en) * 2016-03-31 2017-10-20 意法半导体股份有限公司 MEMS Accelerometer Sensor with High Accuracy and Low Sensitivity to Temperature and Aging
CN107271721B (en) * 2016-03-31 2020-10-27 意法半导体股份有限公司 High accuracy MEMS accelerometer with low sensitivity to temperature and aging
CN109596859A (en) * 2019-01-18 2019-04-09 中国电子科技集团公司第十三研究所 Piezoresistance type acceleration sensor
CN109596859B (en) * 2019-01-18 2021-08-31 中国电子科技集团公司第十三研究所 Piezoresistive Accelerometer
EP4008998B1 (en) * 2020-12-03 2024-07-31 Murata Manufacturing Co., Ltd. Piezoelectric frequency-modulated gyroscope
CN112462092A (en) * 2020-12-04 2021-03-09 中国电子科技集团公司第五十四研究所 MEMS capacitive acceleration sensor with spiral beam structure and manufacturing method thereof
CN117686737A (en) * 2023-10-26 2024-03-12 武汉杰开科技有限公司 Acceleration sensor
WO2025086768A1 (en) * 2023-10-26 2025-05-01 武汉杰开科技有限公司 Acceleration sensor

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