JP2005045755A - Imaging device and portable terminal equipped with the imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the thickness of an imaging device in an optical axis direction of an imaging device capable of moving the imaging optical system in correspondence with thinning of the imaging device, in particular, a plurality of imaging optical systems corresponding to high image quality and macro photography. An imaging device that can be reduced in thickness and capable of being thinned and a portable terminal including the same are obtained.
A substrate, an imaging device mounted on the substrate, a leg portion that contacts the imaging device, an imaging optical system that guides subject light to an imaging region of the imaging device, and a biasing of the imaging optical system An imaging apparatus having an elastic member and a cam member for displacing the imaging optical system, wherein infrared light is transmitted through the imaging apparatus or optical member in which at least one surface of the imaging optical system is coated with infrared light cut coating An imaging device formed using a material that is not allowed to be used.
[Selection] Figure 3

Description

  The present invention relates to an imaging apparatus, and more particularly to a small and thin imaging apparatus built in a portable terminal.

  Smaller and thinner imaging devices than ever before are now mounted on portable terminals, which are small and thin electronic devices such as mobile phones and PDAs (Personal Digital Assistants). Information can also be transmitted between each other.

  As an image pickup element used in these image pickup apparatuses, a solid-state image pickup element such as a CCD (Charge Coupled Device) type image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) type image sensor is used.

  Since these solid-state imaging devices have spectral sensitivity up to the infrared light region as they are, the infrared light region is blocked (also referred to as infrared light cut) before the subject light reaches the imaging device. It is.

  Regarding this infrared light cut, an infrared light cut filter arranged in front of the imaging optical system is disclosed (for example, see Patent Document 1).

  In addition, these imaging devices aim for further enhancement of functions, enabling not only pan focus shooting using a deep depth of field by fixing the imaging optical system, but also macro shooting by moving the imaging optical system. Are also commercially available.

As an imaging device that enables macro photography, the projection lens and the cylindrical holder are formed with protrusions and inclined grooves, and the photographing lens is rotated to move the photographing lens in the optical axis direction for assembly. There is disclosed an apparatus that adjusts the focus of time and enables close-up photography using this inclined groove (see, for example, Patent Document 2).
JP 2003-37758 A JP 2002-82271 A

  The imaging devices built in these portable terminals are required to be as thin as possible as the equipment to be mounted is made thinner.

  On the other hand, imaging devices mounted on portable terminals and the like are also demanded to have higher image quality and more functions as the penetration rate increases, so that imaging with a high pixel count and close-up (macro) shooting is possible. An apparatus is desired.

  With regard to the above-described improvement in image quality, an image pickup device having a high pixel count in which light receiving pixels are arranged at a finer pitch is used, and in order to achieve this, there are a plurality of optical members in order to make the image pickup optical system have higher resolution. In addition, since macro imaging is performed by moving the imaging optical system in a direction away from the imaging element, it is necessary to secure a space for moving the imaging optical system. There is a problem that the dimension in the optical axis direction increases.

  On the other hand, the imaging apparatus described in Patent Document 1 described above has an infrared light cut filter disposed in front of the imaging optical system, and an infrared light cut filter and a clearance are added to the entire length of the imaging optical system. There is a problem that the thickness of the imaging device increases. Further, with such a configuration, if the imaging optical system is moved for multiple optical members or macro photography, the imaging optical system is moved inside the infrared light cut filter in front of the imaging optical system. Space is required, and there is a problem that the imaging device becomes thicker.

  Moreover, the imaging apparatus described in Patent Document 2 has no description regarding a method of cutting infrared light, and it is unclear what means is used to block infrared light.

  In view of the above-described problems, the present invention provides a light imaging device that can move the imaging optical system in response to thinning of the imaging device, in particular, a plurality of imaging optical systems corresponding to high image quality and macro photography. An object of the present invention is to obtain an imaging device that can suppress a thickness increase in the axial direction and can be thinned, and a portable terminal equipped with the imaging device.

  The above-described problem can be solved as follows.

  1) a substrate, an imaging device mounted on the substrate, an imaging optical system that forms a leg that contacts the imaging device and guides subject light to an imaging region of the imaging device; and In an imaging apparatus comprising: an elastic member that biases in the direction of the imaging element; and a cam member that displaces the imaging optical system in the optical axis direction against the elastic member, at least one surface constituting the imaging optical system An imaging device characterized in that an infrared light cut coating is applied to.

  2) The image pickup apparatus according to 1), wherein the infrared light cut coating is applied to an optical member closest to the image pickup element among optical members constituting the image pickup optical system.

  3) An imaging element that photoelectrically converts subject light, an imaging optical system that guides the subject light to the imaging area of the imaging element, an elastic member that urges the imaging optical system in the direction of the imaging element, and an resistance against the elastic member And a cam member that displaces the imaging optical system in the optical axis direction, wherein a part of the optical member that constitutes the imaging optical system is formed using a material that does not transmit infrared light. An imaging apparatus characterized by the above.

  4) The imaging optical system includes any one of 1) to 3) including a first abutting portion that abuts on the imaging element at a portion other than the optically effective surface and a second abutting portion that abuts on the cam member. Imaging device.

  5) The imaging device according to 4), wherein the first contact portion is in contact with the imaging element when the second contact portion is not in contact with the cam member.

  6) When the second contact portion and the cam member are in contact with each other, and the first contact portion is not in contact with the imaging element, the imaging optical system is set to a close-up shooting position 4) Or the imaging device of 5).

  7) The imaging apparatus according to any one of 1) to 6), further including an outer frame member that includes the imaging optical system and the elastic member, wherein the cam member is disposed outside the outer frame member.

  8) An imaging device that photoelectrically converts subject light, a pedestal that is formed with a leg portion that contacts the imaging device and has a subject light transmitting portion, and an abutting portion that contacts the pedestal, and the imaging device An imaging optical system that guides subject light to the imaging region, and an infrared light cut coating is applied to the subject light transmitting portion of the pedestal.

  9) An imaging device that photoelectrically converts subject light, a pedestal that is formed with a leg portion that contacts the imaging device and has a subject light transmission portion, and an abutting portion that contacts the pedestal, and the imaging device An imaging optical system that guides subject light to the imaging region, and the pedestal is formed using a material that does not transmit infrared light.

  10) The imaging device according to 8) or 9), wherein the pedestal has a cam surface, and a contact portion of the imaging optical system is in contact with the cam surface.

  11) The imaging device according to any one of 8) to 10), wherein at least one surface of the subject light transmitting portion is a curved surface.

  12) The imaging apparatus according to any one of 1) to 11), wherein the imaging optical system includes a plurality of optical members, and the optical members are in contact with each other.

  13) A portable terminal including the imaging device according to any one of 1) to 12).

  An image pickup optical system of the present invention, an image pickup device mounted on the substrate, a leg portion that contacts the image pickup device and guiding subject light to the image pickup region of the image pickup device, and the image pickup optical system in the image pickup device direction In an imaging apparatus having an elastic member that urges the lens and a cam member that displaces the imaging optical system in the optical axis direction against the elastic member, an infrared light cut coating is applied to at least one surface constituting the imaging optical system By adopting an imaging device that has been subjected to, an infrared light cut filter disposed in front of the imaging optical system can be dispensed with, thereby reducing the number of imaging optical systems corresponding to a reduction in thickness, particularly high image quality. In addition, it is possible to obtain a thin imaging device that suppresses an increase in thickness in the optical axis direction of an imaging device built in a portable terminal that can move the imaging optical system in response to macro photography.

  In addition, this infrared light cut coating is preferably applied to the optical member closest to the imaging element among the optical members constituting the imaging optical system, and the spectral transmittance by the infrared light cut coating is not dependent on the image height. Can be almost even.

  In accordance with the present invention, an imaging device that photoelectrically converts subject light, an imaging optical system that guides subject light to an imaging region of the imaging device, an elastic member that biases the imaging optical system toward the imaging device, and an elastic member An imaging apparatus having a cam member that displaces the imaging optical system in the optical axis direction, wherein an optical device that forms part of the imaging optical system is formed using a material that does not transmit infrared light. This eliminates the need for the infrared light cut filter that was placed in front of the imaging optical system, which enables imaging with multiple imaging optical systems and macro photography that can be made thinner and particularly high image quality. It is possible to obtain a thin imaging device in which an increase in thickness in the optical axis direction of an imaging device incorporated in a portable terminal that enables movement of the optical system is suppressed.

  The imaging optical system has a first contact portion that contacts the imaging element at a portion other than the optically effective surface, and a second contact portion that contacts the cam member, and the second contact portion is a cam. When not in contact with the member, the first contact portion is configured to contact the imaging element, thereby positioning the imaging element and the imaging optical system in the optical axis direction without using any intervening parts. It is possible to minimize errors and individual differences in the focusing position on the far side. On the other hand, when the second contact portion and the cam member are in contact with each other and the first contact portion is not in contact with the image sensor, the image pickup optical system can be set to the close-up shooting position to perform close-up shooting. It can be.

  The imaging optical system and the outer frame member are movable in the optical axis direction by having an outer frame member that includes the imaging optical system and the elastic member, and the cam member is disposed outside the outer frame member. So that external dust can pass between the imaging optical system and the outer frame member and can be prevented from entering the space where the imaging device is located.

  The imaging device of the present invention for photoelectrically converting subject light, a pedestal formed with a leg portion that contacts the imaging device and a subject light transmitting portion, and a contact portion that contacts the pedestal are formed to form the imaging device. And an imaging optical system that guides subject light to the imaging region, and an imaging device in which an infrared light cut coating is applied to the subject light transmission portion of the pedestal, so that the red arranged in front of the imaging optical system An external light cut filter can be dispensed with, and this suppresses an increase in thickness in the optical axis direction of an imaging device built in a portable terminal that supports a plurality of imaging optical systems that are thinner and particularly have higher image quality. A thin imaging device can be obtained.

  The imaging device of the present invention for photoelectrically converting subject light, a pedestal formed with a leg portion that contacts the imaging device and a subject light transmitting portion, and a contact portion that contacts the pedestal are formed to form the imaging device. And an imaging optical system that guides subject light to the imaging area, and the pedestal is an imaging device formed using a material that does not transmit infrared light. A member such as an external light cut filter can be dispensed with, thereby reducing the thickness in the optical axis direction of the imaging device built in the portable terminal corresponding to the thinning, especially the imaging optical system corresponding to the high image quality. It is possible to obtain a thin imaging device that suppresses the increase.

  Further, the pedestal has a cam surface and is configured such that the abutting portion of the imaging optical system abuts on the cam surface, and has an infrared light cut function and an imaging optical system moving function by the cam as one part. In particular, the thickness of the imaging device built in the portable terminal that can move the imaging optical system corresponding to a plurality of imaging optical systems corresponding to high image quality and macro photography can be reduced. It is possible to obtain an imaging device that is suppressed in size and reduced in size and size at low cost.

  In addition, by making at least one surface of the subject light transmitting portion formed on the pedestal a curved surface, taking part of the refractive power of the imaging optical system, and making it a part of the optical member of the imaging optical system, the pedestal is Built-in portable terminal that can move the imaging optical system in response to multiple imaging optical systems and macro shooting, especially for high image quality by taking care of infrared light cut function and lens function Therefore, an increase in thickness in the optical axis direction of the image pickup apparatus can be suppressed, and an image pickup apparatus that is reduced in size and thickness can be obtained at low cost.

  Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.

  FIG. 1 is an external view of a mobile phone T which is an example of a mobile terminal provided with the imaging device of the present invention.

  In the mobile phone T shown in the figure, an upper casing 71 as a case having a display screen D and a lower casing 72 having an operation button P are connected via a hinge 73. The imaging device S is built below the display screen D in the upper casing 71, and is arranged so that the imaging device S can capture light from the outer surface side of the upper casing 71.

  Below the display screen D of the upper casing 71, an arcuate opening 74 and the operation member 15 are disposed so as to be exposed from the opening 74. By moving the operation member 15 upward in the drawing within the opening 74, the focus position at the time of macro photography is set.

  Note that the position of the imaging device may be arranged above or on the side of the display screen D in the upper casing 71, and the same applies to the position of the operation member 15. Of course, the mobile phone is not limited to a folding type.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described.

  FIG. 2 is a perspective view of the imaging apparatus 100 according to the present invention. This imaging device 100 corresponds to the imaging device S shown in FIG.

  As shown in the figure, the outer surface of the image pickup apparatus 100 includes a printed circuit board 11 on which an image sensor is mounted, a connect board 17 for connection to another control board of the mobile terminal, and the printed board 11 and the connect board 17. A flexible print FPC for connecting the outer frame member 12, a cover member 13 incorporated in the upper surface of the outer frame member 12, a cam member 14 incorporated in the outer periphery of the cylindrical portion of the outer frame member 12, and the outer frame member 12. The operation member 15 is rotatably assembled on the formed boss 12b, and the stepped screw 16 is configured to fix the operation member 15 to be rotatable. This operation member 15 is the operation member 15 exposed from the opening 74 of the portable terminal T shown in FIG. 1 and is a part operated by the user.

  FIG. 3 is a cross-sectional view of the imaging device 100 taken along line FF shown in FIG.

  In the figure, the outer frame member 12 and the lid member 13 are provided with a first lens 1 from the object side, an aperture stop 4 that determines the aperture F value of the imaging optical system, a second lens 2, and a fixed aperture for blocking unnecessary light. 5, the imaging optical system 50 comprised by the 3rd lens 3, the imaging element 8 mounted on the printed circuit board 11, and the compression coil spring 9 which is an elastic member. Further, as described with reference to FIG. 2, the exterior includes a cam member 14, an operation member 15, and a stepped screw 16. The periphery of the outer frame member 12 and the printed board 11 is sealed with an adhesive B.

  As shown in the figure, the imaging optical system 50 is a unit in which the first lens 1, the second lens 2, and the third lens 3 are brought into contact with each other at a flange portion other than the optically effective surface and are fixed to each other with an adhesive or the like. By constructing it without using other members, the distance between the lenses can be assembled without error.

  An infrared light cut coating is applied to the surface 3a on the imaging element side of the third lens 3 constituting the imaging optical system. By this infrared light cut coating, the light in the infrared light region included in the subject light is blocked before reaching the image sensor 8. For example, a dielectric multilayer coating can be applied to the infrared light cut coating.

  This infrared light cut coating is desirably applied to the optical member closest to the image pickup device 8 in the image pickup optical system 50. This is because the incident angle to the microlens formed on the image sensor is limited, and the light beam emitted from the final surface of the imaging optical system is designed to be emitted at an angle that is relatively parallel to the optical axis. For this reason, the spectral transmittance can be made uniform regardless of the image height by applying the infrared light cut coating to the optical member closest to the imaging element among the optical members constituting the imaging optical system. In addition, it is desirable to apply the infrared light cut coating only to the optically effective surface by masking.

  Alternatively, the third lens 3 may be formed using a material that does not transmit infrared light, and the third lens 3 may be configured to block infrared light. For example, Lumicle UCF-MS (Kureha Chemical Industry Co., Ltd.) or the like is applicable as a material that does not transmit infrared light, and is formed by molding.

  Further, in the same figure, the third lens 3 constituting the imaging optical system 50 is formed with an abutting portion 3 d that abuts on the imaging element 8. Further, as shown in the figure, an arm portion 3s is integrally formed on the side surface, and a contact portion 3t that contacts the cam member 14 is formed on the arm portion 3s. The arm portions 3s and the contact portions 3t are formed at intervals of approximately 120 degrees. As shown in the figure, when the contact portion 3d is in contact with the image sensor 8, the contact portion 3t of the arm portion 3s is set to be separated from the cam member 14.

  In the state in which the contact portion 3d is in contact with the image sensor 8, the height of the contact portion 3d is set so that the imaging optical system 50 is in focus on the far side such as infinity or hyperfocal distance. Has been.

  That is, the first contact portion according to the present invention corresponds to the contact portion 3d, and the second contact portion corresponds to the contact portion 3t.

  Further, the outer periphery 3r of the third lens 3 and the inner periphery 12r of the outer frame member 12 corresponding to the third lens 3 are fitted, and a lubricant is thinly applied to the outer periphery 3r and the inner periphery 12r. The space on the 8 side is in a substantially sealed state.

  Further, the third lens 3 has a hole 3p as a gas flow path, and a dustproof filter 3g is disposed in the hole 3p, and the image pickup device 8 is sealed by movement of the image pickup optical system 50 in the optical axis direction. Corresponding to the change in the volume of the space on the side, gas can flow into and out of the image sensor 8 through the hole 3p. At least one such hole 3 p is formed in the third lens 3.

  The imaging optical system 50 configured as described above is urged toward the imaging element 8 by the compression coil spring 9, and the abutting portion 3 d is brought into contact with the imaging element 8 by this urging force.

  On the other hand, the cam member 14 disposed on the outer periphery of the cylindrical portion of the outer frame member 12 is rotatable along the outer periphery of the cylindrical portion of the outer frame member 12. A gear portion 14 g is formed on at least a part of the outer periphery of the cam member 14, and meshed with the gear portion 15 g formed on the operation member 15.

  The cam member 14 has a cam shape at a position corresponding to the abutting portion 3t of the arm portion 3s of the third lens 3, and the abutting portion 3t and the cam member 14 are separated from the illustrated state of the outer frame member 12. It rotates along the outer periphery of the cylindrical portion, and is configured to move the imaging optical system 50 in a direction away from the imaging element 8 against the urging force of the elastic member 9 by contacting the contact portion 3t.

  FIG. 4 is a perspective view showing the shape of the cam member 14 used in the imaging apparatus 100.

  As shown in the figure, the cam member 14 is formed with a gear portion 14g that meshes with a gear portion 15g (see FIG. 3) of the operation member 15 in a part of the outer periphery, and three flat portions A having a low height, Three flat portions M having a high height and three inclined portions B that smoothly connect the flat portions A and M are formed at intervals of approximately 120 degrees.

  Among these cam shapes, the flat part A having a low height is set to a height that does not contact the contact part 3t of the arm part 3s of the third lens 3 when the flat part A is incorporated in the imaging device 100. The flat portion M having a high height is set to a height that abuts against the abutting portion 3t and moves the abutting portion 3t against the urging force of the elastic member 9.

  The height of the flat portion M is set such that the imaging optical system 50 is positioned on the optical axis that enables desired close-up photographing by moving the contact portion 3t.

  Returning to FIG. 3, in the imaging apparatus 100 configured as described above, by operating the operation member 15, the operation member 15 rotates around the stepped screw 16 and is engaged with the gear portions 15 g and 14 g. The member 14 is rotated. At this time, the inclined portion B of the cam member 14 and the abutting portion 3t first come into contact with each other, and the abutting portion 3t is moved along the inclined portion B against the urging force of the elastic member 9 in the optical axis direction. The flat portion M (see FIG. 4) having a high height of the member 14 comes into contact with the contact portion 3t. As a result, the imaging optical system 50 configured integrally with the third lens 3 can move in the direction away from the imaging element 8 in the optical axis direction.

  FIG. 5 is a cross-sectional view showing the positional relationship between the cam member 14 and the imaging optical system 50 of the imaging apparatus 100. The figure shows a state where the right side is in focus at a long distance with the optical axis O as a boundary, and the left side shows a state during close-up photography.

  In the state in which the focus is adjusted to a long distance on the right side of the figure, the contact portion 3d contacts the image sensor 8, and the contact portion 3t is separated from the low flat portion A of the cam member 14. On the other hand, when the cam member 14 is rotated and the high flat portion M and the contact portion 3t come into contact with each other, the contact portion 3d is separated from the image sensor 8. As a result, the imaging optical system of the imaging apparatus 100 moves to the object side and becomes a close-up shooting setting position, thereby enabling close-up shooting.

  In this way, at least one surface constituting the imaging optical system is subjected to infrared light cut coating, or a part of the optical member constituting the imaging optical system is formed using a material that does not transmit infrared light. This eliminates the need for a member for cutting infrared light, which makes it possible to move the imaging optical system in response to a reduction in thickness, especially in multiple imaging optical systems that support high image quality and macro photography. It is possible to obtain a thin imaging device by suppressing an increase in thickness in the optical axis direction of the imaging device incorporated in the portable terminal.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described.

  FIG. 6 is a perspective view of an imaging apparatus 200 according to the second embodiment of the present invention. This imaging device 200 corresponds to the imaging device S shown in FIG. 1, but in the case of this embodiment, the opening 74 and the operation member 15 of the portable terminal T shown in FIG. Hereinafter, for simplification of description, the same function members are given the same reference numerals.

  As shown in the figure, the outer surface of the image pickup apparatus 200 includes a printed circuit board 11 on which an image sensor is mounted, a connect board 17 for connection to another control board of the mobile terminal, and the printed circuit board 11 and the connect board 17. A flexible printed circuit board FPC to be connected, an outer frame member 12, and a lid member 13 incorporated on the upper surface of the outer frame member 12.

  FIG. 7 is a cross-sectional view of the imaging device 200 taken along the line GG shown in FIG.

  In the figure, the inside of the outer frame member 12 includes an imaging optical system 50 assembled in the same manner as in FIG. 3, a pedestal 6, an imaging element 8 mounted on the printed board 11, a compression coil spring 9 as an elastic member, A lid member 13 is used. As shown in the figure, the pedestal 6 has leg portions 6d that are in contact with the image sensor 8 at least at three locations on the image plane side. In addition, on the image plane side of the flange portion of the third lens 3 constituting the imaging optical system 50, contact portions 3b with the pedestal 6 are formed in at least three places.

  A compression coil spring 9 is incorporated between the lid member 13 and the flange portion of the third lens 3 on the subject side of the flange portion of the third lens 3. The compression coil spring 9 urges the imaging optical system 50 and the base 6 in the direction of the imaging element 8 while abutting.

  Further, the pedestal 6 is formed using a light-transmitting material, and parallel planes 6a and 6b are integrally formed as a subject light transmission portion.

  Any one of the planes 6a and 6b of the subject light transmitting portion is provided with an infrared light cut coating. By this infrared light cut coating, the light in the infrared light region included in the subject light is blocked before reaching the image sensor 8. For this infrared light cut coating, a dielectric multilayer coating or the like can be applied as described above. In addition, infrared light cut coating may be performed using both sides instead of one side. This infrared light cut coating is desirably applied only to the object light transmitting portion by masking.

  Or you may comprise so that infrared light may be interrupted | blocked by forming this base 6 using the material which does not permeate | transmit infrared light. As the material that does not transmit infrared light, for example, the above-described Lumicle UCF-MS (Kureha Chemical Industry Co., Ltd.) or the like can be applied and formed by molding.

  This pedestal 6 is fitted and incorporated into the outer frame member 12 in a state where the positioning around the optical axis is performed by a positioning portion (not shown). Thereafter, as shown in the drawing, the flange portion 6j as an adhesive portion and the inner peripheral surface of the outer frame member 12 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). Further, the outer frame member 12 is first bonded and sealed to the printed circuit board 11 with an adhesive A on the outer periphery thereof, and then bonded and fixed with an adhesive B (for example, a rubber-based adhesive). In this case, the adhesive B is for reinforcement and may be omitted.

  In this way, the pedestal 6 is disposed between the imaging optical system 50 and the imaging element 8, and a subject light transmitting portion is formed on the pedestal 6, and an infrared light cut coating is applied to the subject light transmitting portion, or this By forming the pedestal 6 using a material that does not transmit infrared light, there is no need for a member for cutting infrared light, which makes it possible to reduce the thickness of the imaging optical system, especially for high image quality. It is possible to obtain a thin imaging device by suppressing an increase in thickness in the optical axis direction of an imaging device built in a portable terminal that supports the above.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described.

  FIG. 8 is a perspective view of an imaging apparatus 300 according to the third embodiment of the present invention. This imaging device 300 corresponds to the imaging device S shown in FIG. Hereinafter, for simplification of description, the same function members are given the same reference numerals.

  As shown in FIG. 8, the outer surface of the image pickup apparatus 300 includes a printed circuit board 11 on which an image sensor is mounted, a connect board 17 for connection to another control board of the mobile terminal, and the printed board 11 and the connect board 17. A flexible print FPC to be connected, an outer frame member 12, a lid member 13 incorporated in the upper surface of the outer frame member 12, an operation member 15 rotatably attached to a boss 12b formed integrally with the outer frame member 12, It comprises a stepped screw 16 for fixing the operation member 15 so as to be rotatable. A boss 15 b is formed on the operation member 15, and this boss 15 b is engaged with a bifurcated portion 3 f formed on the imaging optical system protruding from the outer frame member 12. This operation member 15 is the operation member 15 exposed from the opening 74 of the portable terminal T shown in FIG. 1 and is a part operated by the user.

  FIG. 9 is a cross-sectional view of the imaging apparatus 300 taken along line FF shown in FIG.

  In the figure, the inside of the outer frame member 12 is constituted by a first lens 1, an aperture stop 4, a second lens 2, fixed stops 5 a and 5 b, and a third lens 3, and is assembled in the same manner as in FIG. 3. The system 50 includes a pedestal 6, an image sensor 8 mounted on the printed circuit board 11, a compression coil spring 9 that is an elastic member, and a lid member 13. The pedestal 6 has at least three leg portions 6d in contact with the image sensor 8 on the image plane side, and parallel planes 6a and 6b are integrally formed as subject light transmitting portions.

  FIG. 10 is a perspective view showing the shape of the pedestal 6 used in the imaging apparatus 300. FIG. This figure is a view seen from the imaging optical system 50 side.

  As shown in FIG. 10, the pedestal 6 is formed of a translucent material, and on the imaging optical system 50 side, a low-level horizontal plane D, a high-level horizontal plane E, and an inclination that continuously connects the horizontal planes. Surfaces F are formed at approximately 120 ° intervals (hereinafter referred to as cam surfaces). Furthermore, it is composed of a plane 6a (see FIG. 9) of the subject light transmitting portion and a frame portion 6h formed in a rectangular box shape.

  Any one of the planes 6a and 6b (see FIG. 9) of the subject light transmitting portion is provided with an infrared light cut coating. By this infrared light cut coating, the light in the infrared light region included in the subject light is blocked before reaching the image sensor 8. For this infrared light cut coating, a dielectric multilayer coating or the like can be applied as described above. In addition, infrared light cut coating may be performed using both sides instead of one side. This infrared light cut coating is desirably applied only to the object light transmitting portion by masking.

  Or you may comprise so that infrared light may be interrupted | blocked by forming this base 6 using the material which does not permeate | transmit infrared light. As the material that does not transmit infrared light, for example, the above-described Lumicle UCF-MS (Kureha Chemical Industry Co., Ltd.) or the like can be applied and formed by molding.

  Returning to FIG. 9, the pedestal 6 is incorporated so as to surround the periphery of the image sensor 8 with the frame 6 h, and the leg 6 d is in a state where the leg 6 d is in contact with the image sensor 8 as illustrated. The frame portion 6h, which is an adhesive portion at a different position, and the printed board 11 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). That is, the pedestal 6 seals the space C on the photoelectric conversion surface side of the image sensor 8 to be an isolated space, and can prevent dust from entering the space.

  In addition, since the adhesive portion between the leg portion 6d and the frame portion 6h is a different surface, the adhesive A does not enter under the leg portion 6d, and there is no deviation in the optical axis direction of the imaging optical system. .

  Furthermore, the outer frame member 12 is bonded and fixed to the printed circuit board 11 and an adhesive B (for example, a rubber-based adhesive) on the outer periphery thereof.

  On the imaging surface side of the third lens 3 constituting the imaging optical system 50, projections 3b are formed at an interval of approximately 120 °, and are arranged corresponding to the cam surface formed on the pedestal 6, and this projection 3b It is in contact with the cam surface of the base 6. Further, a compression coil spring 9 is incorporated between the lid member 13 and the flange portion of the third lens 3 on the subject side of the flange portion of the third lens 3. The imaging optical system 50 and the pedestal 6 are urged toward the imaging element 8 by the compression coil spring 9.

  In the imaging apparatus 300 configured as described above, the bifurcated portion 3 f formed on the third lens 3 engaged with the boss 15 b is also rotated by the rotation operation of the operation member 15, and is formed on the third lens 3. The projected protrusion 3b moves from the low horizontal surface D of the cam surface formed on the pedestal 6 to the high horizontal surface E (see FIG. 10) via the inclined surface F, whereby the imaging optical system 50 is moved along the optical axis. Will move to the subject side. This makes it possible to switch between long-distance shooting and short-distance shooting.

  FIG. 11 is a cross-sectional view of an imaging apparatus 350 which is another example of the third embodiment according to the present invention. A perspective view of the imaging device 350 is the same as that in FIG. The cross section shown in FIG. 11 is obtained by cutting the imaging device 350 along the line FF shown in FIG.

  In the figure, the inside of the outer frame member 12 includes an imaging optical system 50 similar to that in FIG. 9, a pedestal 6, an imaging element 8 mounted on the printed board 11, a compression coil spring 9 that is an elastic member, and a lid member 13. It is configured. As shown in the figure, the pedestal 6 has at least three leg portions 6d that contact the image sensor 8 on the image plane side, and parallel planes 6a and 6b are integrally formed as subject light transmitting portions. .

  FIG. 12 is a perspective view showing the shape of the pedestal 6 used in the imaging device 350. This figure is a view seen from the imaging optical system 50 side.

  As shown in FIG. 12, the pedestal 6 is formed of a light-transmitting material, and the horizontal plane D having a low height and the horizontal plane E having a high height are continuously formed on the imaging optical system 50 side as in FIG. Inclined surfaces F that are connected to each other are formed at intervals of approximately 120 ° (hereinafter referred to as cam surfaces). Furthermore, it is composed of parallel planes 6a and 6b (see FIG. 11) that are subject light transmitting portions, a flange portion 6j, and positioning protrusions 6k.

  Infrared light cut coating is applied to either one of the planes 6a and 6b of the subject light transmitting portion. By this infrared light cut coating, the light in the infrared light region included in the subject light is blocked before reaching the image sensor 8. For this infrared light cut coating, a dielectric multilayer coating or the like can be applied as described above. In addition, infrared light cut coating may be performed using both sides instead of one side. This infrared light cut coating is desirably applied only to the object light transmitting portion by masking.

  Or you may comprise so that infrared light may be interrupted | blocked by forming this base 6 using the material which does not permeate | transmit infrared light. As the material that does not transmit infrared light, for example, the above-described Lumicle UCF-MS (Kureha Chemical Industry Co., Ltd.) or the like can be applied and formed by molding.

  Returning to FIG. 11, this pedestal 6 is assembled by aligning a notch portion (not shown) formed on the outer frame member 12 and a positioning projection 6 k, and as shown in FIG. The inscribed surfaces of the positioning projection 6k and the outer frame member 12 are bonded and sealed with an adhesive A (for example, an ultraviolet curable adhesive). Further, the outer frame member 12 is first bonded and sealed to the printed circuit board 11 with an adhesive A on the outer periphery thereof, and then bonded and fixed with an adhesive B (for example, a rubber-based adhesive). In this case, the adhesive B is for reinforcement and may be omitted.

  The imaging apparatus 350 configured as described above can operate in the same manner as described in FIG. 9, and the imaging optical system 50 can move to the subject side along the optical axis. Can be switched.

  In this way, the pedestal 6 is disposed between the imaging optical system 50 and the imaging element 8, and a subject light transmitting portion is formed on the pedestal 6, and an infrared light cut coating is applied to the subject light transmitting portion, or this By forming the pedestal 6 using a material that does not transmit infrared light, a member for cutting infrared light is unnecessary, and by further forming a cam surface integrally with the pedestal 6, Incorporating an infrared light cut function and an imaging optical system moving function with a cam enables the imaging optical system to move in response to multiple imaging optical systems and macro photography, especially for high image quality. An increase in thickness in the optical axis direction of the imaging device built in the portable terminal can be suppressed, and an imaging device that is reduced in cost, size, and thickness can be obtained.

  The subject light transmitting portion formed on the pedestal 6 has been described as a parallel plane. However, at least one surface of the subject light transmitting portion is formed in a curved surface and takes part of the refractive power of the imaging optical system. Of course, such a configuration may be adopted.

  In addition, although the explanation has been made by using a compression coil spring as the elastic member, it is needless to say that a leaf spring, a sponge-like member, or the like may be used.

It is an external view of the mobile telephone T which is an example of the portable terminal provided with the imaging device of this invention. 1 is a perspective view of an imaging apparatus 100 according to the present invention. FIG. 3 is a cross-sectional view of the imaging apparatus 100 taken along line FF shown in FIG. 2. 3 is a perspective view showing the shape of a cam member used in the imaging apparatus 100. FIG. 3 is a cross-sectional view illustrating a positional relationship between a cam member of the imaging apparatus 100 and an imaging optical system. FIG. It is a perspective view of imaging device 200 of a 2nd embodiment concerning the present invention. It is sectional drawing which cut | disconnected the imaging device 200 by the GG line shown in FIG. It is a perspective view of imaging device 300 of a 3rd embodiment concerning the present invention. It is sectional drawing which cut | disconnected the imaging device 300 by the FF line shown in FIG. 4 is a perspective view showing a pedestal shape used for the imaging apparatus 300. FIG. It is sectional drawing of the imaging device 350 which is another example of the 3rd Embodiment which concerns on this invention. 6 is a perspective view showing the shape of a pedestal used for the imaging apparatus 350. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st lens 2 2nd lens 3 3rd lens 6 Base 8 Image pick-up element 9 Elastic member 11 Printed circuit board 12 Outer frame member 13 Cover member 14 Cam member 15 Operation member 16 Stepped screw 17 Connect substrate 50 Imaging optical system 100 Imaging device (First embodiment)
200 Imaging device (second embodiment)
300 Imaging Device (Third Embodiment)
350 imaging device (third embodiment)
FPC flexible printed circuit board

Claims (13)

A substrate, an image sensor mounted on the substrate, an imaging optical system that forms leg portions that contact the image sensor and guides subject light to an imaging region of the image sensor, and the imaging optical system as the image sensor In an imaging apparatus comprising: an elastic member that biases in the direction; and a cam member that displaces the imaging optical system in the optical axis direction against the elastic member.
An imaging apparatus, wherein an infrared light cut coating is applied to at least one surface constituting the imaging optical system. The imaging apparatus according to claim 1, wherein the infrared light cut coating is applied to an optical member closest to the imaging element among optical members constituting the imaging optical system. An imaging device that photoelectrically converts subject light, an imaging optical system that guides the subject light to an imaging region of the imaging device, an elastic member that biases the imaging optical system toward the imaging device, and against the elastic member In the imaging apparatus having a cam member that displaces the imaging optical system in the optical axis direction,
An imaging apparatus, wherein a part of an optical member constituting the imaging optical system is formed using a material that does not transmit infrared light. The imaging optical system includes a first contact portion that contacts the imaging element at a portion other than an optically effective surface, and a second contact portion that contacts the cam member. 4. The imaging device according to any one of 3. The imaging apparatus according to claim 4, wherein when the second contact portion is not in contact with the cam member, the first contact portion is in contact with the imaging element. When the second contact portion and the cam member are in contact with each other, and the first contact portion is not in contact with the imaging element, the imaging optical system is set to a close-up shooting position. The imaging device according to claim 4 or 5. 7. The apparatus according to claim 1, further comprising an outer frame member that encloses the imaging optical system and the elastic member, wherein the cam member is disposed outside the outer frame member. Imaging device. An imaging device that photoelectrically converts subject light, a pedestal that is formed with a leg portion that is in contact with the imaging device and has a subject light transmission portion, and an abutting portion that is in contact with the pedestal are formed, and imaging of the imaging device An imaging optical system that guides subject light to the area;
An imaging device, wherein an infrared light cut coating is applied to a subject light transmitting portion of the pedestal. An imaging device that photoelectrically converts subject light, a pedestal that is formed with a leg portion that is in contact with the imaging device and has a subject light transmission portion, and an abutting portion that is in contact with the pedestal are formed, and imaging of the imaging device An imaging optical system that guides subject light to the area;
An imaging apparatus, wherein the pedestal is formed using a material that does not transmit infrared light. The imaging device according to claim 8 or 9, wherein the pedestal has a cam surface, and a contact portion of the imaging optical system is in contact with the cam surface. The imaging apparatus according to claim 8, wherein at least one surface of the subject light transmission portion is a curved surface. The imaging apparatus according to claim 1, wherein the imaging optical system includes a plurality of optical members, and the optical members are in contact with each other. A portable terminal comprising the imaging device according to claim 1.

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