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JP2004500488A - 含浸ガラス繊維ストランドおよび同ストランドを含む製品 - Google Patents

含浸ガラス繊維ストランドおよび同ストランドを含む製品 Download PDF

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Publication number
JP2004500488A
JP2004500488A JP2001514030A JP2001514030A JP2004500488A JP 2004500488 A JP2004500488 A JP 2004500488A JP 2001514030 A JP2001514030 A JP 2001514030A JP 2001514030 A JP2001514030 A JP 2001514030A JP 2004500488 A JP2004500488 A JP 2004500488A
Authority
JP
Japan
Prior art keywords
fabric
particles
coating composition
fibers
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001514030A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004500488A5 (es
Inventor
ノビッチ,ブルース イー.
レイモン−ヒリンスキ,カミ
ロバートソン,ウォルター ジェイ.
ウー,シャン
ベルパリ,ベダギリ
ロートン,アーネスト エル.
ライス,ウィリアム ビー.
Original Assignee
ピーピージー インダストリーズ オハイオ, インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US1999/021443 external-priority patent/WO2000021900A1/en
Priority claimed from PCT/US1999/021442 external-priority patent/WO2000021899A1/en
Application filed by ピーピージー インダストリーズ オハイオ, インコーポレイテッド filed Critical ピーピージー インダストリーズ オハイオ, インコーポレイテッド
Publication of JP2004500488A publication Critical patent/JP2004500488A/ja
Publication of JP2004500488A5 publication Critical patent/JP2004500488A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • C08J5/08Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • C03C25/465Coatings containing composite materials
    • C03C25/47Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10Coating
    • C03C25/48Coating with two or more coatings having different compositions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0166Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0175Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0212Resin particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0239Coupling agent for particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/0245Flakes, flat particles or lamellar particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/0254Microballoons or hollow filler particles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275Fibers and reinforcement materials
    • H05K2201/029Woven fibrous reinforcement or textile
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/127Lubricants, e.g. during drilling of holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Reinforced Plastic Materials (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2001514030A 1999-07-30 2000-07-28 含浸ガラス繊維ストランドおよび同ストランドを含む製品 Withdrawn JP2004500488A (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US14660599P 1999-07-30 1999-07-30
US14633799P 1999-07-30 1999-07-30
US14686299P 1999-08-03 1999-08-03
PCT/US1999/021443 WO2000021900A1 (en) 1998-10-13 1999-10-08 Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
PCT/US1999/021442 WO2000021899A1 (en) 1998-10-13 1999-10-08 Impregnated glass fiber strands and products including the same
US18356200P 2000-02-18 2000-02-18
US52703400A 2000-03-16 2000-03-16
US54837900A 2000-04-12 2000-04-12
US56891600A 2000-05-11 2000-05-11
US62052500A 2000-07-20 2000-07-20
PCT/US2000/020539 WO2001009226A1 (en) 1999-07-30 2000-07-28 Impregnated glass fiber strands and products including the same

Publications (2)

Publication Number Publication Date
JP2004500488A true JP2004500488A (ja) 2004-01-08
JP2004500488A5 JP2004500488A5 (es) 2004-12-24

Family

ID=27574951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001514030A Withdrawn JP2004500488A (ja) 1999-07-30 2000-07-28 含浸ガラス繊維ストランドおよび同ストランドを含む製品

Country Status (7)

Country Link
EP (1) EP1204698A1 (es)
JP (1) JP2004500488A (es)
KR (1) KR20020026957A (es)
AU (1) AU6386200A (es)
HK (1) HK1046702A1 (es)
MX (1) MXPA02001090A (es)
WO (1) WO2001009226A1 (es)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007524774A (ja) * 2004-02-11 2007-08-30 ピーピージー インダストリーズ オハイオ, インコーポレイテッド 被覆剤の摩擦およびフィラメント間の結合を調節するための粒子によりコーティングされた繊維製品
JP2008516101A (ja) * 2004-10-12 2008-05-15 ピーピージー インダストリーズ オハイオ, インコーポレイテッド 樹脂相溶性ヤーンバインダーおよびそれらの使用
KR20220037515A (ko) * 2019-12-16 2022-03-24 아사히 가세이 가부시키가이샤 유리 클로스, 프리프레그 및 프린트 배선판

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102173026B (zh) * 2010-12-16 2015-01-14 施汉林 一种新型导热复合材料与led壳体的复合注塑工艺
CN102219399B (zh) * 2011-03-31 2012-11-14 山东玻纤复合材料有限公司 单丝涂塑用纱专用浸润剂及其配制方法
CN105355616B (zh) * 2015-11-20 2017-12-19 广东梅雁吉祥实业投资股份有限公司 一种抗氧化金属制品
WO2019202151A1 (en) * 2018-04-20 2019-10-24 Mermet Composite yarn, manufacturing process and textile surface comprising such a yarn
FR3080387B1 (fr) 2018-04-20 2020-11-13 Mermet Fil composite renforce, procede de preparation et textile comprenant un tel fil

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
JP2545957B2 (ja) * 1988-12-15 1996-10-23 日東紡績株式会社 プリント配線基板及び同基板用織物
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
JPH0977937A (ja) * 1995-09-12 1997-03-25 Idemitsu Petrochem Co Ltd プリント配線板用プリプレグ及びプリント配線用基板
JP3151397B2 (ja) * 1995-10-26 2001-04-03 松下電工株式会社 プリプレグ及び金属箔張り積層板
CN1291963A (zh) * 1998-03-03 2001-04-18 Ppg工业俄亥俄公司 玻璃纤维补强的层压件、电路板以及装配织物的方法
WO2000021900A1 (en) * 1998-10-13 2000-04-20 Ppg Industries Ohio, Inc. Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric
JP2002505388A (ja) * 1998-03-03 2002-02-19 ピーピージー インダストリーズ オハイオ, インコーポレイテッド ガラス繊維ストランドの摩損の抑制方法
CN1155531C (zh) * 1998-03-03 2004-06-30 Ppg工业俄亥俄公司 无机颗粒涂覆的玻璃纤维束以及包括它的产品
CA2346027A1 (en) * 1998-10-13 2000-04-20 Ernest L. Lawton Impregnated glass fiber strands and products including the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007524774A (ja) * 2004-02-11 2007-08-30 ピーピージー インダストリーズ オハイオ, インコーポレイテッド 被覆剤の摩擦およびフィラメント間の結合を調節するための粒子によりコーティングされた繊維製品
JP2011219912A (ja) * 2004-02-11 2011-11-04 Ppg Industries Ohio Inc 被覆剤の摩擦およびフィラメント間の結合を調節するための粒子によりコーティングされた繊維製品
JP2008516101A (ja) * 2004-10-12 2008-05-15 ピーピージー インダストリーズ オハイオ, インコーポレイテッド 樹脂相溶性ヤーンバインダーおよびそれらの使用
JP4914363B2 (ja) * 2004-10-12 2012-04-11 ピーピージー インダストリーズ オハイオ,インコーポレイテッド 樹脂相溶性ヤーンバインダーおよびそれらの使用
KR20220037515A (ko) * 2019-12-16 2022-03-24 아사히 가세이 가부시키가이샤 유리 클로스, 프리프레그 및 프린트 배선판
KR102633930B1 (ko) 2019-12-16 2024-02-07 아사히 가세이 가부시키가이샤 유리 클로스, 프리프레그 및 프린트 배선판

Also Published As

Publication number Publication date
EP1204698A1 (en) 2002-05-15
MXPA02001090A (es) 2003-07-21
KR20020026957A (ko) 2002-04-12
WO2001009226A1 (en) 2001-02-08
HK1046702A1 (zh) 2003-01-24
AU6386200A (en) 2001-02-19

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A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20071002