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JP2004322649A - Composite material structure provided with high heat conduction and electromagnetic shielding function - Google Patents

Composite material structure provided with high heat conduction and electromagnetic shielding function Download PDF

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JP2004322649A
JP2004322649A JP2004128828A JP2004128828A JP2004322649A JP 2004322649 A JP2004322649 A JP 2004322649A JP 2004128828 A JP2004128828 A JP 2004128828A JP 2004128828 A JP2004128828 A JP 2004128828A JP 2004322649 A JP2004322649 A JP 2004322649A
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electromagnetic shielding
high heat
layer
heat conduction
composite material
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Ching-Lung Yang
チン−ラン・ヤン
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Cateron Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3976—Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3976—Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]
    • Y10T442/3984—Strand is other than glass and is heat or fire resistant

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite material structure which is simultaneously provided with high heat conduction and an electromagnetic shielding mechanism including at least a first high heat conductive layer and a first electromagnetic shielding layer. <P>SOLUTION: The composite material is composed by pasting the first high heat conductive layer and the first electromagnetic shielding layer by vertically laminating them. The first electromagnetic shielding layer is formed into a lattice shape formed in grids. The first electromagnetic shielding layer is composed by installing electromagnetic shielding materials with a space on the high heat conductive layer. The electromagnetic shielding material is made of an electromagnetic wave absorbent material. The composite material may further include the high heat conductive layer and the electromagnetic shielding layer pasted by integrally laminating them slightly with a slight gap. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、一種の複合材構造に関し、特に、一種同時に高導熱及び電磁遮蔽機能を備えた複合材構造に関する。   The present invention relates to a composite material structure, and more particularly, to a composite material structure having high heat conduction and electromagnetic shielding at the same time.

電気機器は、特にハイパワー状態において運転される電気機器の殆どは、放熱の問題を解決することが必要である。従来、より大きい電気器具を使用する場合、放熱装置、例えば一つ、または複数のファンを組合せてなる強制的対流システムを取付けることを採用する方式がある。   Most of the electric devices operated in the high power state need to solve the problem of heat radiation. Conventionally, when a larger appliance is used, there is a method that employs the installation of a heat dissipation device, for example, a forced convection system formed by combining one or more fans.

しかし、密集状態（例えば集積回路基板に用いる）に用いられた小形、またはマイクロ型電子部材（例えばＣＰＵ）から言えば、その放熱問題を解決するためには、前記強制的対流放熱システムを使用するだけでは、十分とは言えない。その理由は、このような密集的なシステムに放熱面積が十分に備えていないため、通常、ＣＰＵの放熱面上に、より大きい放熱面積を提供するために、高導熱性材料からなる多数の放熱フィンを備えたラジエータを、さらに取付けなければならない。しかし、従来、前記の多数の放熱フィンを備えたラジエータは、金属材（例えばアルミ合金）からなっているので、ＣＰＵとの接触表面には、必ず細かい間隙を有する、熱に対する不良導体−空気が存在しているため、全放熱システムの機能に悪い影響が大きく与える。そのため、業界は、ＣＰＵとラジエータとの間に、一種柔らかく、熱に良い導体が介在することが期待されている。そして、このような電子部材を使用するに際しても、高周波運転による周りのその他の電子部材に対する電磁干渉を解消する措置を取らなければ、全回路基板が正常に運転できない。したがって、業界は一種同時に放熱または電磁干渉を妨げる機能を有する装置の採用を考慮している。   However, in order to solve the heat dissipation problem in the case of a small-sized or micro-type electronic member (eg, CPU) used in a dense state (for example, used for an integrated circuit board), the forced convection heat dissipation system is used. Alone is not enough. The reason for this is that such a dense system does not have enough heat dissipation area, so that a large number of heat dissipation materials made of highly heat conductive material are usually provided on the heat dissipation surface of the CPU to provide a larger heat dissipation area. Radiators with fins must also be installed. However, conventionally, the radiator provided with a large number of radiating fins is made of a metal material (for example, an aluminum alloy). Its presence has a significant adverse effect on the function of the total heat dissipation system. Therefore, the industry is expected to provide a kind of soft and heat-resistant conductor between the CPU and the radiator. Even when such electronic members are used, all the circuit boards cannot operate normally unless measures are taken to eliminate electromagnetic interference with other surrounding electronic members due to high-frequency operation. Accordingly, the industry is considering the use of devices that simultaneously have the ability to block heat dissipation or electromagnetic interference.

例えば、２０００年３月１５日付公告された特許文献１において、一種回路基板に用いる電磁遮蔽装置が開示され、このような電磁遮蔽装置は、導熱材からなるシールドケースである。しかし、前記シールドケースは、回路基板上のアースに合わせて使用しなければ、その導熱または電磁干渉の解消を機能させることができないので、回路基板上にそれに対応する設計が必要とすることで、このような設計が複雑にならざるを得ずに、便利な操作が行うことができない。そのため、業界は、さらに一種導熱性または電磁遮蔽機能を同時に備える特殊材料を用いることを考慮し、例えば特許文献２は、このような高熱伝導性を備えた複合磁性体材料を採用している。前記の複合磁性体材料は、有機接着剤中に軟磁性体粉末および熱伝導性粉末（例えばＡ１２０３）を分散させてなるものであるが、当該有機接着剤に浸透させる軟磁性体粉末および熱伝導性粉末量の合計は、ある最大量に限られる問題が存在されているので、軟磁性体粉末、または熱伝導性粉末の何れの一つのみが含まれた元の接着剤に比べて、その導熱または電磁干渉の遮蔽機能の何れも理想的ではない。また、従来技術は樹脂を基材として、アルミナ粉末（例えばＡ１２０３）とシリコン粉末（Silicone）とを浸透させ、一種の材料が得られる。このような材料は柔らかく、かつ高導熱性の特点を有しているが、電磁干渉を遮蔽する能力が備えられていない。なお、塑性基材中に軟磁性粉末のみを添加してなる電磁波吸収材を採用している。しかし、このように得られた電磁波吸収材は良い電磁遮蔽性能を有しているが、熱に対して良い導体ではない。従って、実用上では、業者は、前記のような伝統的電磁波吸収材をコンピュータチップＣＰＵに応用される方式は、多くの電磁波吸収材を中空の方形または円形に加工して、ＣＰＵチップの上表面に貼り付けてから、その中空部に導熱片を貼り付けると共に、その上方には放熱片または小形ファンを接着することによって、その熱伝導性を補強させる。しかし、電磁波の吸収効果が低下され、そして導熱面の接着面積が小さくなり、理想的な放熱効果が得られない。
中国特許公報第９１１０１９４７．２号 台湾特許公報第３４５６６７号 For example, Patent Document 1 published on March 15, 2000 discloses an electromagnetic shielding device used for a kind of circuit board, and such an electromagnetic shielding device is a shield case made of a heat conductive material. However, if the shield case is not used in accordance with the ground on the circuit board, the heat conduction or the elimination of electromagnetic interference cannot be functioned, so a corresponding design on the circuit board is required, Such a design must be complicated, and a convenient operation cannot be performed. Therefore, the industry further considers using a kind of special material having both a heat conductive property and an electromagnetic shielding function. For example, Patent Document 2 employs a composite magnetic material having such a high thermal conductivity. The composite magnetic material is obtained by dispersing a soft magnetic powder and a heat conductive powder (for example, A1203) in an organic adhesive. There is a problem that the total amount of the conductive powder is limited to a certain maximum amount, so that compared to the original adhesive containing only one of the soft magnetic powder or the thermally conductive powder, Neither heat conduction nor electromagnetic interference shielding is ideal. In the prior art, a kind of material is obtained by infiltrating alumina powder (for example, A1203) and silicon powder (Silicone) using a resin as a base material. Such materials have the features of being soft and having high heat conductivity, but do not have the ability to shield electromagnetic interference. Note that an electromagnetic wave absorbing material obtained by adding only a soft magnetic powder to a plastic substrate is employed. However, although the obtained electromagnetic wave absorbing material has good electromagnetic shielding performance, it is not a good conductor against heat. Therefore, in practice, the traders who apply the traditional electromagnetic wave absorbing material to the computer chip CPU as described above process many electromagnetic wave absorbing materials into a hollow square or circular shape, and form the upper surface of the CPU chip. Then, a heat conducting piece is adhered to the hollow portion, and a heat radiating piece or a small fan is adhered above the hollow to reinforce the thermal conductivity. However, the electromagnetic wave absorption effect is reduced, and the bonding area of the heat conducting surface is reduced, so that an ideal heat radiation effect cannot be obtained.
Chinese Patent Publication No. 911101947.2 Taiwan Patent Publication No. 345667

本発明が解決しようとする問題は、前記従来技術の不足を克服し、良い高導熱および電磁遮蔽機能を共に有する複合材料を提供する。   The problem to be solved by the present invention overcomes the deficiencies of the prior art and provides a composite material having both good high heat conduction and electromagnetic shielding.

前記にかかる複合材料は、さらに複数の介在積層どうしを貼り合せて一体になる高導熱層および電磁遮蔽層が含まれる。高導熱層および電磁遮蔽層の数は必要に応じて設定でき、また各高導熱層および電磁遮蔽層の厚さも必要に応じて確定することができる。   The above composite material further includes a high heat conducting layer and an electromagnetic shielding layer which are integrated by laminating a plurality of intervening laminates. The number of the high heat conducting layers and the electromagnetic shielding layers can be set as needed, and the thickness of each high heat conducting layer and the electromagnetic shielding layers can be determined as needed.

前記第１高導熱層と第１電磁遮蔽層は、上、下に積層して張り合わせたものであって、さらに前記第１電磁遮蔽層は囲碁形格子状に形成され、電磁遮蔽材を互いに間隔して次高導熱層に設置して形成されたものである。また前記の電磁遮蔽材は、電磁波吸収材である。接着結合方式、リソグラフ方式またはインサート成形(insert-molding)方式で当該次高導熱層と一体に結合される。   The first high heat conducting layer and the first electromagnetic shielding layer are laminated on top and bottom and bonded to each other, and the first electromagnetic shielding layer is formed in a grid pattern, and the electromagnetic shielding materials are spaced from each other. And formed on the next higher heat conducting layer. Further, the electromagnetic shielding material is an electromagnetic wave absorbing material. Adhesive bonding, lithography, or insert-molding is used to integrally bond with the next higher heat conducting layer.

本発明の複合材は、さらに第２高導熱層を含み、第１高導熱層に離れた第１電磁遮蔽層の一方に積層して貼り付けてなる。この複合材は、さらに第２電磁遮蔽層が含まれ、第１電磁遮蔽層に離れた第２高導熱層の一方に積層して貼り付けてなるものである。第２電磁遮蔽層は、第１電磁遮蔽層と同一構成であるが、その電磁遮蔽材と第１電磁遮蔽層に対応する電磁遮蔽材とは、恰も上、下位置ずれ状態になっている。   The composite material of the present invention further includes a second high heat conducting layer, and is laminated and attached to one of the first electromagnetic shielding layers separated from the first high heat conducting layer. The composite material further includes a second electromagnetic shielding layer, and is laminated and attached to one of the second high heat conducting layers separated from the first electromagnetic shielding layer. The second electromagnetic shielding layer has the same configuration as the first electromagnetic shielding layer, but the electromagnetic shielding material and the electromagnetic shielding material corresponding to the first electromagnetic shielding layer are displaced upward and downward.

本発明の複合材は、ある間隔を以って積層して一体に貼り付けた高導熱層と電磁遮蔽層の設計に用いられるものである。   The composite material of the present invention is used for designing a high heat conducting layer and an electromagnetic shielding layer which are laminated at a certain interval and adhered together.

前記各電磁遮蔽層は、高導熱次層上に囲碁形格子状に形成され、その間に電磁波吸収材を設け、さらに各電磁遮蔽層の間に対応した電磁波吸収材の位置は、互いにずれて設けられたものであるため、互いにずれて湾曲に延伸した連続の熱伝導経路で、かつ各電磁遮蔽層の上、下両面のいずれも完全的な高導熱層が形成されるので、より優れた高導熱性能を備えることができる。そして、囲碁形格子状分布した電磁波吸収材から構成された電磁遮蔽層は、互いに隔てて上、下積層して設置することによって、完全な電磁波吸収マスクを形成することによって、本発明に優れた電磁波遮蔽性能が得られる。   Each of the electromagnetic shielding layers is formed in a grid pattern on the next layer having a high thermal conductivity, and an electromagnetic wave absorbing material is provided therebetween, and the positions of the electromagnetic wave absorbing materials corresponding to between the electromagnetic shielding layers are provided to be shifted from each other. Because it is a continuous heat conduction path extending in a curved manner while being shifted from each other, and a complete high heat conduction layer is formed on both the upper and lower surfaces of each electromagnetic shielding layer, a more excellent high heat conduction layer is formed. Heat conduction performance can be provided. The electromagnetic shielding layer composed of the electromagnetic wave absorbing materials distributed in a grid pattern in the form of a go has a superior electromagnetic shielding layer according to the present invention by forming a complete electromagnetic wave absorbing mask by laying the upper and lower layers apart from each other. Electromagnetic wave shielding performance is obtained.

また、本発明は、必要に応じて各形状に作成でき、回路基板は余計な設計をせずに、それに対応した電子部材上に直接に設置することができるので、使用便利で、または信頼性を有する利点がさらに得られる。   In addition, the present invention can be formed into various shapes as needed, and the circuit board can be directly installed on the corresponding electronic member without any extra design, so that it is convenient to use or reliable. Is further obtained.

明細書の図面を参照しながら、本発明における高導熱性及び電磁シールドケース機能を備えた複合材構造を、より詳しく説明する。
図１は、本発明の複合材の縦方向の断面見取図を示す。この複合材は、第１高導熱１、第１電磁遮蔽層２、第２高導熱層３、第２電磁遮蔽層４および第３高導熱層５からなるものである。 With reference to the drawings of the specification, a composite material structure having high heat conductivity and an electromagnetic shielding case function in the present invention will be described in more detail.
FIG. 1 shows a sketch of a longitudinal section of a composite according to the invention. This composite material includes a first high heat conducting layer 1, a first electromagnetic shielding layer 2, a second high heat conducting layer 3, a second electromagnetic shielding layer 4, and a third high heat conducting layer 5.

前記第２導熱層３は、第１高導熱層に離れた第１電磁遮蔽層２の一方に積層して貼り付け、第２電磁遮蔽層４は、第２高導熱層３に離れた第１電磁遮蔽層２の一方に積層して貼り付けてなる。   The second heat conductive layer 3 is laminated and attached to one of the first electromagnetic shielding layers 2 separated from the first high heat conductive layer, and the second electromagnetic shielding layer 4 is separated from the first electromagnetic shield layer 2 separated from the second high heat conductive layer 3. It is laminated and attached to one of the electromagnetic shielding layers 2.

第１、第２電磁遮蔽層２、４は、高導熱次層２３、４３に電磁遮蔽材２２、４２が互いに位置ずれで設置して形成される。第２電磁遮蔽層４の構成は第１電磁遮蔽層２と同一であるが、電磁遮蔽材４２および第１電磁遮蔽層２に対応する電磁遮蔽材２２の上、下の位置は、恰もずれて配置されたものである。   The first and second electromagnetic shielding layers 2 and 4 are formed by disposing the electromagnetic shielding members 22 and 42 on the high heat conduction sub-layers 23 and 43 with a positional deviation from each other. The configuration of the second electromagnetic shielding layer 4 is the same as that of the first electromagnetic shielding layer 2, but the positions of the electromagnetic shielding material 42 and the electromagnetic shielding material 22 corresponding to the first electromagnetic shielding layer 2 are shifted from each other. It has been arranged.

図２に示すように、前記第１、第２電磁遮蔽層２、４は囲碁形格子状で形成され、前記電磁遮蔽材２２、４２は電磁波吸収材であって、互いに位置ずれにして高導熱次層２３、４３に設置されている。さらに、電磁遮蔽材２２、４２は、接着結合方式、リソグラフ方式またはインサート成形(insert-molding)方式により当該高導熱次層２３、４３と一体に結合される。   As shown in FIG. 2, the first and second electromagnetic shielding layers 2 and 4 are formed in a grid pattern, and the electromagnetic shielding members 22 and 42 are electromagnetic wave absorbing materials. It is installed on the next layer 23, 43. Further, the electromagnetic shielding members 22 and 42 are integrally bonded to the high heat conductive sublayers 23 and 43 by an adhesive bonding method, a lithographic method, or an insert-molding method.

本発明は、さらに複数の互いに位置ずれで、積層して貼り付けた一体の高導熱層（１、３、５）および電磁遮蔽層（２、４）を含む。高導熱層および電磁遮蔽層の数は必要に応じて設定でき、また各高導熱層および電磁遮蔽層の厚さも必要に応じて確定することができる。   The present invention further includes a plurality of integral high heat-conducting layers (1, 3, 5) and electromagnetic shielding layers (2, 4) that are stacked and affixed to each other with misalignment. The number of the high heat conducting layers and the electromagnetic shielding layers can be set as needed, and the thickness of each high heat conducting layer and the electromagnetic shielding layers can be determined as needed.

以下、本発明の高導熱及び電磁遮蔽機能を有する複合材の製造プロセスについて簡単に説明する。
ステップ１は、耐熱塑性材（例えばＳｉＣ）を基材として、Ａ１２０３の粉末を入れ第１高導熱層１を形成する。 Hereinafter, the manufacturing process of the composite material having high heat conduction and electromagnetic shielding functions of the present invention will be briefly described.
Step 1 is to form a first high heat conducting layer 1 by using a heat-resistant plastic material (for example, SiC) as a base material and adding A1203 powder.

ステップ２は、この第１高導熱層１上に囲碁形格子状の高導熱次層２３を形成し、この高導熱次層２３上に互いに隔てて位置ずれ配置された空格子を備えている（図示しない）。さらに、電磁遮蔽材２２が高導熱次層２３の空格子内に設置され、第１電磁遮蔽層２を形成する。   Step 2 is to form a go-lattice-shaped high heat conduction sublayer 23 on the first high heat conduction layer 1, and to provide empty lattices which are misaligned on the high heat conduction sublayer 23 so as to be spaced apart from each other ( Not shown). Further, the electromagnetic shielding member 22 is provided in the vacancy of the high heat conduction sublayer 23 to form the first electromagnetic shielding layer 2.

ステップ３は、第１電磁遮蔽層２上に、耐熱塑性材（例えばＳｉＣ）を基材として、Ａ１２０３の粉末を入れ第２高導熱層３を形成する。   Step 3 is to form a second high heat conduction layer 3 on the first electromagnetic shielding layer 2 by using a heat-resistant plastic material (for example, SiC) as a base material and adding A1203 powder.

ステップ４は、この第２高導熱層３上に囲碁形格子状の高導熱次層４３を形成し、この高導熱次層４３上に互いに隔てて位置ずれ配置された空格子を備えている（図示しない）。さらに、電磁遮蔽材４２が高導熱次層４３の空格子内に設置され、第１電磁遮蔽層４を形成する。その電磁遮蔽材４２と第１電磁遮蔽層２に相応した電磁遮蔽材２２の上、下位置は、恰も互いに位置ずれ配置される。   Step 4 is to form a Go-shaped high heat conduction sub-layer 43 on the second high heat conduction layer 3, and to provide an empty lattice that is displaced and arranged on the high heat conduction next layer 43 so as to be spaced apart from each other ( Not shown). Further, an electromagnetic shielding material 42 is provided in the vacancy of the high heat conduction sublayer 43 to form the first electromagnetic shielding layer 4. The upper and lower positions of the electromagnetic shielding member 42 and the electromagnetic shielding member 22 corresponding to the first electromagnetic shielding layer 2 are displaced from each other.

ステップ５は、第１２磁遮蔽層４上に、耐熱塑性材（例えばＳｉＣ）を基材として、Ａ１２０３の粉末を入れ第３高導熱層５を形成する。   Step 5 is to form a third high heat conduction layer 5 on the twelfth magnetic shielding layer 4 by using a heat-resistant plastic material (for example, SiC) as a base material and adding A1203 powder.

前記のように繰り返して、必要に応じて若干間隔、積層して一体に貼り付けられた高導熱層（１、３、５）と電磁遮蔽層（２、４）を有する複合材が作成される。   By repeating as described above, a composite material having the high heat conducting layers (1, 3, 5) and the electromagnetic shielding layers (2, 4) which are laminated and stuck together at a slight interval as necessary is produced. .

本発明の複合材は、若干間隔、積層して一体に貼り付けられた高導熱層（１、３、５）と電磁遮蔽層（２、４）の設計を採用する。前記各電磁遮蔽層（２、４）は、高導熱次層（２３、４３）上に呈された囲碁形格子状、かつ隔てて設置された電磁吸収材から形成され、各電磁遮蔽層（２、４）の間に対応した電磁波吸収材の位置は、互いに位置ずれ設置されているので、互いに交互して湾曲に延伸し、連続した熱伝送経路が形成され、かつ各電磁遮蔽層（２、４）の上、下両面には何れも完全なる高導熱層（１、３、５）であるため、良い高導熱性能を有している。そして、前記囲碁形格子状に分布された電磁吸収材からなる電磁遮蔽層は、互いに間隔をもって上、下に積層して設けられているので、完全な電磁吸収マスクを形成することによって、本発明の複合材は、良い電磁波遮蔽性能を有することになる。   The composite material of the present invention employs a design of the high heat conducting layers (1, 3, 5) and the electromagnetic shielding layers (2, 4), which are laminated at a slight interval and integrally attached. Each of the electromagnetic shielding layers (2, 4) is formed of an electromagnetic absorbing material provided on the next layer of high thermal conductivity (23, 43) in a grid pattern and spaced apart from each other. 4), the positions of the electromagnetic wave absorbing materials corresponding to each other are displaced from each other, so that they alternately extend in a curved manner, form a continuous heat transmission path, and form each electromagnetic shielding layer (2, 2). 4) Since both upper and lower surfaces are complete high heat conducting layers (1, 3, 5), they have good high heat conducting performance. Since the electromagnetic shielding layers made of the electromagnetic absorbing materials distributed in a go-like lattice form are stacked one above the other with an interval therebetween, the present invention is realized by forming a complete electromagnetic absorption mask. Will have good electromagnetic wave shielding performance.

さらに、本発明の複合材の構造は、必要に応じて各形状、または寸法を作成し、回路基板に余計な設計をせずに、それに相応した電子部材に直接に設置することで、使用便利、信頼性を有する利点をさらに有する。   Furthermore, the structure of the composite material of the present invention can be conveniently used by creating each shape or dimension as necessary and installing it directly on the corresponding electronic member without extra design on the circuit board. It also has the advantage of having reliability.

本発明の縦断面見取図を示す。1 shows a sketch of a longitudinal section of the present invention. 本発明の電磁遮蔽層の平面見取図を示す。1 shows a plan view of an electromagnetic shielding layer of the present invention.

符号の説明Explanation of reference numerals

１ 第１高導熱層
２ 第１電磁遮蔽層
３ 第２高導熱層
４ 第２電磁遮蔽層
５ 第３高導熱層
２３、４３ 高導熱層次層
２２、４２ 電磁遮蔽材

REFERENCE SIGNS LIST 1 first high heat conducting layer 2 first electromagnetic shielding layer 3 second high heat conducting layer 4 second electromagnetic shielding layer 5 third high heat conducting layer 23, 43 high heat conducting layer next layer 22, 42 electromagnetic shielding material

Claims (10)

高導熱及び電磁遮蔽機能を備えた複合材構造であって、この複合材構造は、少なくとも一体に積層して設置された第１高導熱層及び第１電磁遮蔽層を含み、第１高導熱層の材料は、互いに中断されずに接続しており、また第１電磁遮蔽層の材料は、所定位置に特定の隔離を有していることを特徴とする高導熱及び電磁遮蔽機能を備えた複合材構造。   A composite material structure having a high heat conduction and electromagnetic shielding function, wherein the composite material structure includes at least a first high heat conduction layer and a first electromagnetic shielding layer that are integrally laminated and installed, and wherein the first high heat conduction layer Are connected uninterrupted to each other, and the material of the first electromagnetic shielding layer is characterized by having a specific isolation at a predetermined position. Material structure. 前記複合材構造は、若干互いに隔てて一体に積層して貼り付けられた高導熱層と電磁遮蔽層とを含むことを特徴とする請求項１に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   The composite with high heat conduction and electromagnetic shielding function according to claim 1, wherein the composite material structure includes a high heat conduction layer and an electromagnetic shielding layer that are laminated and bonded together with a slight distance therebetween. Material structure. 前記第１高導熱層及び第１電磁遮蔽層は、上、下に積層してなるものであることを特徴とする請求項１に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   The composite material structure with high heat conduction and electromagnetic shielding function according to claim 1, wherein the first high heat conduction layer and the first electromagnetic shielding layer are laminated on top and bottom. 前記第１電磁遮蔽層は、囲碁形格子状に形成されたことを特徴とする請求項２または請求項３に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   The composite material structure according to claim 2, wherein the first electromagnetic shielding layer is formed in a go-like lattice. 5. 前記第１電磁遮蔽層は、電磁遮蔽材を互いに隔てて高導熱次層に設置してなることを特徴とする請求項４に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   5. The composite material structure having high heat conduction and electromagnetic shielding function according to claim 4, wherein the first electromagnetic shielding layer comprises an electromagnetic shielding material disposed on a high heat conduction sublayer separated from each other. 6. 前記電磁遮蔽材は、電磁波吸収材であって、接着結合方式、リソグラフ方式またはインサート成形方式を用いて前記高導熱次層と一体に結合されることを特徴とする請求項５に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   The high heat conducting material according to claim 5, wherein the electromagnetic shielding material is an electromagnetic wave absorbing material, and is integrally connected to the high heat conducting sublayer using an adhesive bonding method, a lithographic method, or an insert molding method. And a composite material structure with an electromagnetic shielding function. 前記複合材構造は、さらに第２高導熱層を含み、前記第１高導熱層に離れた第１電磁遮蔽層の一方に積層して貼り付けてなることを特徴とする請求項６に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   7. The composite material structure according to claim 6, wherein the composite material structure further includes a second high heat conduction layer, and is laminated and attached to one of the first electromagnetic shielding layers separated from the first high heat conduction layer. Composite structure with high heat conduction and electromagnetic shielding. 前記複合材構造は、さらに第２電磁遮蔽層を含み、前記第１電磁遮蔽層に離れた第２電磁遮蔽層の一方に積層して貼り付けてなることを特徴とする請求項７に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   The composite material structure according to claim 7, wherein the composite material structure further includes a second electromagnetic shielding layer, and is laminated and attached to one of the second electromagnetic shielding layers separated from the first electromagnetic shielding layer. Composite structure with high heat conduction and electromagnetic shielding. 前記第２電磁遮蔽層における電磁遮蔽材は、前記第１電磁遮蔽層に対応した電磁遮蔽材の上、下位置と互いにずれて配置されることを特徴とする請求項６に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。   The electromagnetic shielding material of the second electromagnetic shielding layer is disposed above and below the electromagnetic shielding material corresponding to the first electromagnetic shielding layer so as to be displaced from each other. Composite material structure with electromagnetic shielding function. 前記複合材構造は、さらに第３導熱層を含み、前記第２高導熱層に離れた第２電磁遮蔽層の一方に積層して貼り付けてなることを特徴とする請求項１または請求項２に記載の高導熱及び電磁遮蔽機能を備えた複合材構造。

The composite material structure further includes a third heat conductive layer, and is laminated and attached to one of the second electromagnetic shielding layers separated from the second high heat conductive layer. A composite material structure having a high heat conduction and electromagnetic shielding function according to item 1.

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