JP2004311920A - Light emitting element storage package and light emitting device - Google Patents

Abstract

An object of the present invention is to be able to satisfactorily reflect light from a light emitting element and uniformly and efficiently radiate the light to the outside.
The light emitting element housing package has a concave portion for accommodating the light emitting device on an upper surface of an insulating base, a mounting portion on which the light emitting element is mounted on a bottom surface of the concave portion, and a light emitting device. The recess 4 is formed by a metal frame 8 having an arc-shaped cross section of the inner peripheral surface bulging toward the light emitting element 3 side. It is fitted.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light emitting element housing package for housing a light emitting element and a light emitting device used for a backlight or the like of a liquid crystal display device using a light emitting element such as a light emitting diode.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a ceramic package has been used as a light emitting element housing package (hereinafter, also referred to as a package) for housing a light emitting element such as a light emitting diode, and an example thereof is shown in FIG. Reference 1). As shown in FIG. 1, the conventional package is formed by laminating a plurality of ceramic layers and has a concave portion 14 formed on the upper surface. A base 11 provided with a mounting portion conductor layer (hereinafter, also referred to as a mounting portion) 12 formed of a conductor layer, and a pair of wiring layers 15 formed on the lower surface of the base 11 from the mounting portion 12 of the base 11 and its periphery. It is mainly composed.
[0003]
The light emitting element 13 is mounted and fixed on the mounting portion 12 to which one end of the one wiring layer 15 is electrically connected via a conductive adhesive, solder or the like, and the electrode of the light emitting element 13 is connected to the other wiring. The light emitting device is manufactured by electrically connecting the conductor 15 with the bonding wire 16 and then filling the concave portion 14 of the base 11 with a transparent resin (not shown) and sealing the light emitting element 13. .
[0004]
In order to reflect the light of the light emitting element 13 on the inner peripheral surface of the concave portion 14 and emit the light above the package, a nickel (Ni) plating layer or a gold (Au) plating layer is provided on the inner peripheral surface of the concave portion 14. The metal layer 17 made of a metallized layer on the surface may be applied.
[0005]
The above package is manufactured by the ceramic green sheet laminating method as follows. First, a ceramic green sheet (hereinafter, also referred to as a green sheet) for forming the mounting portion 12 (below the mounting portion) of the base 11 and a green sheet for forming the concave portion 14 of the base 11 are prepared. In these green sheets, through holes for leading out the wiring conductors 15 and through holes serving as the concave portions 14 are formed by a punching method.
[0006]
Next, a conductor paste for forming a wiring layer 15 made of a metallized layer is printed and applied by a screen printing method or the like on the through-holes and predetermined portions of the laminate A of the green sheets for forming the mounting portion 12, and the concave portions are formed. When a metallized layer is applied to the inner peripheral surface of the metal layer 14, a conductive paste for forming the metal layer 17 is printed and applied to the inner surface of the through hole of the green sheet laminate B for forming the concave portion 14 by a screen printing method or the like.
[0007]
Next, the laminates A and B are overlapped and bonded to form a laminate for forming the base 11, which is cut into a predetermined size to form a molded body, fired at a high temperature (about 1600 ° C.) and sintered. Make up with the body. Thereafter, a package is manufactured by applying a plating metal layer made of a metal such as nickel, gold, palladium, or platinum on the exposed surfaces of the wiring layer 15 and the metal layer 17 by an electroless plating method or an electrolytic plating method.
[0008]
[Patent Document 1]
JP-A-2002-232017
[Problems to be solved by the invention]
However, in the above-mentioned conventional package, the conductive paste is printed and applied to the inner peripheral surface of the concave portion 14 by a screen printing method to form the metal layer 17. There is a problem that the thickness and the surface roughness of the metal layer 17 formed on the peripheral surface are apt to vary, and the light emitted by the light emitting element 13 is efficiently reflected, and it is difficult to uniformly radiate the light to the outside.
[0010]
Further, since the inclination angle of the inner peripheral surface of the concave portion 14 is constant, when the light is diffused and radiated uniformly and efficiently to the outside of the wide area as in a backlight of a liquid crystal display device or the like, the light Are converged in a certain direction, and light cannot be diffused uniformly and efficiently.
[0011]
Further, when the inclination angle of the inner peripheral surface of the concave portion 14 is increased to radiate the light to the outside of the wide area, there is a problem that the size of the package is increased.
[0012]
Therefore, the present invention has been completed in view of the above-mentioned problems of the related art, and an object of the present invention is to efficiently reflect light emitted from a light emitting element housed in a concave portion and uniformly and outside the wide area. An object of the present invention is to provide a small light emitting element housing package and a light emitting device that can efficiently emit light.
[0013]
[Means for Solving the Problems]
In the light emitting element housing package of the present invention, a concave portion for housing the light emitting element is provided on the upper surface of the insulating base, and the mounting portion on which the light emitting element is mounted and the electrode of the light emitting element are connected to the bottom surface of the concave portion. A light emitting element housing package having a wiring layer formed thereon, wherein the concave portion is fitted with a metal frame whose cross-sectional shape of an inner peripheral surface is an arc shape bulging toward the light emitting element side. It is characterized by having.
[0014]
In the light-emitting element housing package of the present invention, the concave portion is fitted with a metal frame whose inner peripheral surface has an arc-shaped cross-sectional shape bulging toward the light-emitting element side. The light emitted by the light emitting element can be efficiently reflected by the inner peripheral surface of the metal frame without being affected by the state, and can be uniformly and efficiently diffused and radiated outside the wide area.
[0015]
In the light-emitting element housing package according to the present invention, preferably, the frame is made of any one of aluminum, silver, gold, palladium and platinum.
[0016]
In the light-emitting element housing package of the present invention, since the frame is preferably made of any one of aluminum, silver, gold, palladium and platinum, the light of the light-emitting element can be reflected more favorably by the frame. , Can be diffused and radiated more uniformly and efficiently outside the wide area.
[0017]
In the light-emitting element housing package according to the present invention, preferably, the frame has a metal layer made of any one of aluminum, silver, gold, palladium and platinum adhered to the surface.
[0018]
In the light-emitting element housing package according to the present invention, preferably, the frame has a surface coated with a metal layer made of any of aluminum, silver, gold, palladium, and platinum. Since the reflection can be made better by the applied metal layer, it can be more uniformly and efficiently diffused and emitted outside the wide area.
[0019]
A light emitting device of the present invention includes the light emitting element housing package of the present invention, a light emitting element mounted on the mounting portion and electrically connected to the wiring layer, and a transparent resin covering the light emitting element. It is characterized by having.
[0020]
The light-emitting device of the present invention has a high-performance light-emitting device with high luminous efficiency, which can reflect light from a light-emitting element well and radiate uniformly and efficiently outside a wide area by the above structure. It is suitable for a backlight or the like.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
The light emitting element housing package of the present invention will be described in detail below. FIG. 1 is a sectional view showing an example of a package according to an embodiment of the present invention, and FIG. 2 is a plan view of the package shown in FIG. In these drawings, reference numeral 1 denotes an insulating base, 2 denotes a conductor layer (hereinafter also referred to as a mounting portion) of a light-emitting element 3, 3 denotes a light-emitting element, and 4 denotes a recess for accommodating the light-emitting element 3.
[0022]
In the package of the present invention, a concave portion 4 for accommodating the light emitting element 3 is provided on the upper surface of the insulating base 1, and the mounting portion 2 on which the light emitting element 3 is mounted and the electrode of the light emitting element 3 are connected on the bottom surface of the concave portion 4. The recessed portion 4 is fitted with a metal frame 8 having a longitudinal cross-sectional shape of the inner peripheral surface in an arc shape bulging toward the light emitting element 3 side. Have been.
[0023]
The insulating substrate 1 according to the present invention is made of a ceramic or a resin, and when made of a ceramic, for example, an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body It has a rectangular parallelepiped box shape formed by laminating a plurality of insulating layers made of ceramic such as ceramics, and has a concave portion 4 for accommodating the light emitting element 3 in the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, or the like is mixed with a suitable organic binder, a solvent, or the like to form a slurry. A green sheet (ceramic green sheet) is obtained by forming the sheet into a sheet shape by a conventionally known doctor blade method, calender roll method, or the like. Thereafter, a through hole for the recess 4 is formed in the green sheet by punching, and the light emitting element is formed. 3 and a plurality of green sheets for the concave portion 4 are laminated, fired at a high temperature (about 1600 ° C.) and integrated.
[0024]
A mounting portion 2 for mounting the light emitting element 3 is formed on the bottom surface of the concave portion 4, and the mounting portion 2 is made of tungsten (W), molybdenum (Mo), copper (Cu), silver (Ag), or the like. Consists of a metallized layer of metal powder.
[0025]
Further, the insulating base 1 is provided with wiring layers 5a and 5b formed on the lower surface of the insulating base 1 from the mounting portion 2 and the periphery thereof. The wiring layers 5a and 5b are formed of a metallized layer of a metal powder such as W or Mo, and are conductive paths for electrically connecting the light emitting element 3 housed in the recess 4 to the outside. A light emitting element 3 such as a light emitting diode (LED) or a semiconductor laser (LD) is fixed to the mounting portion 2 by a conductive bonding material such as a gold (Au) -silicon (Si) alloy or an Ag-epoxy resin. The electrode of the light emitting element 3 is electrically connected to the wiring layer 5b via the bonding wire 6. Then, the wiring layers 5 a and 5 b on the lower surface of the base 1 are electrically connected to the respective electrodes of the light emitting element 3 by being connected to the wiring conductors of the external electric circuit board, and power and a driving signal are supplied to the light emitting element 3. . Further, the light emitting element 3 may be connected to the mounting section 2 and the wiring layer 5b by flip chip mounting.
[0026]
The wiring layers 5a and 5b are formed by applying a metal paste obtained by adding and mixing an appropriate organic solvent and a solvent to a metal powder such as W or Mo onto a green sheet serving as the substrate 1 in a predetermined pattern by a screen printing method in advance. By doing so, it is formed at a predetermined position on the base 1.
[0027]
It is preferable that a metal having excellent corrosion resistance, such as nickel (Ni), gold (Au), or Ag, be applied to the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2 in a thickness of about 1 to 20 μm. In addition, it is possible to effectively prevent the wiring layers 5a and 5b and the mounting portion 2 from being oxidized and corroded, to fix the mounting portion 2 to the light emitting element 3 and to join the wiring layer 5b and the bonding wire 6 to the wiring layers 5a and 5b. And the connection with the wiring conductor of the external electric circuit board can be strengthened. Therefore, on the exposed surfaces of the wiring layers 5a and 5b and the mounting portion 2, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer or an Ag plating layer having a thickness of about 0.1 to 3 μm are formed by an electrolytic plating method. More preferably, they are sequentially applied by an electroless plating method.
[0028]
In the present invention, the concave portion 4 is fitted with a metal frame 8 whose inner peripheral surface has a vertical cross-sectional shape that is bulged toward the light emitting element 3. Thereby, the light of the light emitting element 3 can be reflected well on the inner peripheral surface of the frame 8 without being affected by the surface condition of the inner peripheral surface of the concave portion 4, and can be uniformly and efficiently radiated to the outside of the wide area. Can be. The frame 8 may be fitted to the recess 4 with a resin adhesive, or a metallized layer for bonding may be formed on the inner peripheral surface of the recess 4 and brazed by Ag brazing or the like. Is also good. Further, after the light emitting element 3 is accommodated in the concave portion 4 and the electrical connection is made via the bonding wire 6 or the like, the inner peripheral surface of the frame 8 is covered together with the light emitting element 3 by the transparent resin sealed in the concave portion 4. And the frame 8 may be fitted in the recess 4.
[0029]
The arithmetic mean roughness Ra of the inner peripheral surface of the through hole of the frame 8 is preferably 1 to 3 μm. When the thickness is less than 1 μm, it is difficult to uniformly reflect the light of the light emitting element 3 accommodated in the recess 4, and the intensity of the reflected light tends to be uneven. If it exceeds 3 μm, the light of the light emitting element 3 housed in the concave portion 4 is scattered, and it becomes difficult to uniformly radiate the reflected light with high reflectance to the outside.
[0030]
Also, as shown in the cross-sectional view of the package of FIG. 3, the inner peripheral surface of the concave portion 4 and the outer peripheral surface of the frame body 8 are extended from the bottom surface of the concave portion 4 toward the upper surface of the insulating base 1 by 5 to 15. It is preferable to incline so as to have a slight angle of about ° (θ ₂ : about 85 to 95 °). In this case, a shape abnormality such as slight deformation or warpage occurs on the inner peripheral surface or the upper end of the concave portion 4. Even if this is done, the frame 8 can be easily inserted into the recess 4 without being affected so much by this deformation, warping or the like.
[0031]
Further, as shown in the cross-sectional view of the package in FIG. 4, an extended portion may be formed at the upper end of the frame 8 so as to be bent outward so as to extend to the upper surface of the insulating base 1. In this case, The position where the frame body 8 is fitted into the concave portion 4 in the vertical direction can be accurately positioned. In this case, a gap can be formed between the lower surface of the frame body 8 and the bottom surface of the concave portion 4, and the frame body 8 comes into contact with the mounting portion 2 and the wiring layers 5a and 5b, thereby causing a short circuit or the like. Can be prevented from occurring. Also, by forming the mounting portion 2 and the wiring layers 5a and 5b on the bottom surface of the concave portion 4 at the gap, the area where these portions are formed can be widened. Further, the transparent resin covering the light emitting element 3 enters the gap, so that the transparent resin can be firmly adhered to the recess 4.
[0032]
Further, as shown in the cross-sectional view of the package of FIG. 5, a portion lower than the light emitting portion of the light emitting element 3 on the inner peripheral surface of the frame 8 may be formed so as to be orthogonal to the upper surface of the insulating base 1. In this case, the area of the bottom surface of the concave portion 4 increases, and the occurrence of a short circuit or the like due to the contact between the frame 8 and the mounting portion 2 and the wiring layer 5b can be prevented.
[0033]
In addition, a step is formed at the lower end of the inner peripheral surface of the concave portion 4 and is thicker than the thickness of the mounting portion 2 and the wiring layer 5b and protrudes toward the light emitting element 3, and the frame 8 is placed on the bottom surface of the step. You may do so. In this case, since the lower surface of the frame 8 is located higher than the mounting portion 2 and the wiring layer 5b formed on the bottom surface of the concave portion 4, the frame 8 contacts the mounting portion 2 and the wiring layer 5b and short-circuits. Can be prevented, and the bottom surface of the stepped portion of the concave portion 4 is also joined to the lower surface of the frame body 8, so that the frame body 8 can be firmly fitted. Further, as shown in the cross-sectional view of the package in FIG. 6, the width of the step at the lower end of the inner peripheral surface of the recess 4 may be smaller than the width of the lower surface of the frame 8. The transparent resin covering the light emitting element 3 enters into the gap between the transparent resin and the transparent resin in the recess 4.
[0034]
In the package of the present invention, the cross-sectional shape of the through hole of the frame body 8 may be various shapes such as a circular shape, an elliptical shape, an elliptical shape, a square shape, and a polygonal shape. The light of the light emitting element 3 housed in the recess 4 can be uniformly reflected by the inner peripheral surface of the frame 8 and radiated uniformly and efficiently outside the wide area.
[0035]
In FIG. 2, a frame 8 having a circular cross-sectional shape of a through hole is fitted to the inner peripheral surface of the concave portion 4 having a circular cross-sectional shape. The cross-sectional shapes of the through holes of the frame 8 may be different. For example, as shown in the plan view of the package in FIG. 7, a frame 8 having a circular cross-sectional shape of a through hole may be fitted into the concave portion 4 having a rectangular cross-sectional shape. As shown in the figure, a frame 8 having a rectangular cross-sectional shape of the through hole may be fitted into the concave portion 4 having a rectangular cross-sectional shape.
[0036]
The frame 8 has an arc shape whose inner peripheral surface has a vertical cross-sectional shape bulging toward the light emitting element 3. However, the overall angle of the inner peripheral surface of the frame 8, that is, the upper end and the lower end of the inner peripheral surface are different from each other. the angle theta ₁ between the straight line and the bottom surface of the recess 4 when connecting with a straight line is preferably a 35 to 70 °. If it exceeds 70 °, it tends to be difficult to reflect the light of the light emitting element 3 housed in the concave portion 4 to the outside of the wide area well, and if it is less than 35 °, the size of the frame 8 increases. However, the size of the package increases.
[0037]
The upper end of the frame 8 has the same upper end portion as the tangential direction at the upper end portion of the light beam directly emitted from the light emitting portion of the light emitting element 3, or the upper end portion is inclined outward from the inclination angle. Is preferred. In this case, the light of the light emitting element 3 is most diffused to the outside of the light emitting device and emitted.
[0038]
Further, since the frame 8 is preferably made of any of aluminum, silver, gold, palladium, and platinum, the light of the light emitting element 3 can be reflected more favorably by the frame 8, so that the outside of the wide area is reduced. It is possible to radiate more uniformly and efficiently. In particular, the frame body 8 is preferably made of aluminum. In this case, the frame body 8 is hardly oxidized and corroded, and the fluctuation of the light reflectance due to the fluctuation of the light wavelength of the light emitting element 3 is reduced. Can be used.
[0039]
Further, as the frame 8, aluminum (coefficient of thermal expansion of about 23.5 × 10 ⁻⁶ / ° C.), silver (coefficient of thermal expansion of about 19.1 × 10 ⁻⁶ / ° C.), gold (coefficient of thermal expansion of about 14 .1 × 10 ⁻⁶ / ° C.), palladium (coefficient of thermal expansion of about 11.8 × 10 ⁻⁶ / ° C.) or platinum (coefficient of thermal expansion of about 8.8 × 10 ⁻⁶ / ° C.) A metal plate having a coefficient of thermal expansion between the insulating base 1 and the frame 8 may be interposed between the insulating base 1 and the frame 8. For example, when the insulating base 1 is made of alumina ceramics (coefficient of thermal expansion of about 7 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / ° C.) or the like, it is generated due to a difference in the thermal expansion coefficient between the insulating base 1 and the frame 8. Fe-Ni-Co alloy (coefficient of thermal expansion of about 6 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / ° C.) between the insulating substrate 1 and the frame 8 to reduce the thermal stress (Thermal coefficient of thermal expansion is about 6 × 10 ^{−6 to} 11 × 10 ⁻⁶ / ° C.). Accordingly, thermal stress generated due to a difference in thermal expansion coefficient between the insulating base 1 and the frame 8 can be reduced, and peeling of the frame 8 can be effectively prevented.
[0040]
The frame 8 may be an alloy containing aluminum, silver, gold, palladium or platinum as a main component.
[0041]
Further, the frame 8 in the present invention preferably has a metal layer made of any of aluminum, silver, gold, palladium and platinum adhered on the surface, and the light of the light emitting element 3 is adhered to the frame 8. The reflected light can be satisfactorily reflected by the metal layer and emitted more uniformly and efficiently to the outside of the wide area. As shown in FIG. 9, such a frame 8 has a metal layer 8a made of any of aluminum, silver, gold, palladium or platinum adhered to the inner peripheral surface of the frame 8. In particular, the metal layer 8a is preferably made of aluminum, which is unlikely to cause inconveniences such as oxidation corrosion and migration, and has a small change in light reflectance due to a change in light wavelength of the light emitting element 3, so that it can be used for a wide range of applications. Can be used.
[0042]
Further, it is preferable that the frame 8 be made of a material having a thermal expansion coefficient close to that of the insulating base 1. For example, the insulating base 1 is made of alumina ceramics (coefficient of thermal expansion of about 7 × 10 ⁻⁶ to 8 × 10 ⁻⁶ / ° C.), and the frame 8 is made of Fe—Ni having a thermal expansion coefficient close to that of the insulating base 1. If a -Co alloy (coefficient of thermal expansion of about 6 × 10 ⁻⁶ to 10 × 10 ⁻⁶ / ° C.) or the like is used, peeling of the frame body 8 can be effectively prevented. When the metal layer 8a is attached to such a frame body 8, the frame body 8 can be firmly fitted to the insulating base 1, and the light-emitting element 3 can have high light reflectance.
[0043]
Further, the metal layer 8a may be applied only to the surface (inner peripheral surface) of the frame 8 on the light emitting element 3 side, or may be applied to the entire surface of the frame 8.
[0044]
Note that the metal layer 8a may be an alloy layer containing any of aluminum, silver, gold, palladium, and platinum as a main component.
[0045]
The light emitting device of the present invention includes the package of the present invention, a light emitting element 3 mounted on the mounting portion 2 and electrically connected to the wiring layer 5b, and a transparent resin such as a silicone resin covering the light emitting element 3. are doing. As a result, the light from the light emitting element 3 can be reflected well, and can be radiated uniformly and efficiently to the outside of a wide area. It will be. The transparent resin covering the light emitting element 3 may cover only the light emitting element 3 and its surroundings, or may be filled in the recess 4 to cover the light emitting element 3.
[0046]
Note that the present invention is not limited to the above-described embodiment, and various changes may be made without departing from the scope of the present invention. For example, as shown in the cross-sectional view of the package in FIG. 11, the light emitting element 3 is directly mounted on the bottom surface of the concave portion 4 without forming the mounting portion 2 as a conductor layer, and the electrodes of the light emitting element 3 are electrically connected to the periphery thereof. May be formed. In this case, the light emitting element 3 is mounted on the mounting section 2, and the electrodes of the light emitting element 3 and the wiring layers 5a, 5b are electrically connected via the bonding wires 6a, 6b. Further, a plurality of light emitting elements 3 may be mounted, or a plurality of wiring layers may be formed.
[0047]
【The invention's effect】
In the light-emitting element housing package of the present invention, the concave portion is fitted with a metal frame whose inner peripheral surface has an arc-shaped cross-sectional shape bulging toward the light-emitting element side. The light of the light emitting element can be efficiently reflected by the inner peripheral surface of the metal frame without being affected by the state, and can be uniformly and efficiently diffused and radiated outside the wide area.
[0048]
In the light-emitting element housing package of the present invention, since the frame is preferably made of any one of aluminum, silver, gold, palladium and platinum, the light of the light-emitting element can be reflected more favorably by the frame. , Can be diffused and radiated more uniformly and efficiently outside the wide area.
[0049]
Further, in the light-emitting element housing package of the present invention, the frame preferably has a surface coated with a metal layer made of any of aluminum, silver, gold, palladium or platinum. Can be better reflected by the metal layer deposited on the surface of the substrate, and can be diffused and radiated more uniformly and efficiently outside the wide area.
[0050]
A light-emitting device of the present invention includes the light-emitting element housing package of the present invention, a light-emitting element mounted on a mounting portion and electrically connected to a wiring layer, and a transparent resin covering the light-emitting element. Thereby, the light of the light emitting element can be reflected well, and can be uniformly and efficiently radiated to the outside of a wide area. Become.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view illustrating an example of an embodiment of a light emitting element housing package of the present invention.
FIG. 2 is a plan view of the light emitting element housing package of FIG. 1;
FIG. 3 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 4 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 5 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 6 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 7 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 8 is a plan view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 9 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
FIG. 10 is a cross-sectional view of a conventional light emitting element storage package.
FIG. 11 is a cross-sectional view showing another example of the embodiment of the light emitting element housing package of the present invention.
[Explanation of symbols]
1: Insulating substrate 2: Mounting part 3: Light emitting element 4: Depressions 5a, 5b: Wiring layer 8: Frame

Claims (4)

A light-emitting device in which a concave portion for accommodating a light-emitting element is provided on an upper surface of an insulating base, and a mounting portion on which the light-emitting element is mounted and a wiring layer to which electrodes of the light-emitting element are connected are formed on the bottom surface of the concave portion. An element storage package, wherein the recess is fitted with a metal frame whose inner peripheral surface has an arc-shaped cross section bulging toward the light emitting element side. package. The light emitting element storage package according to claim 1, wherein the frame is made of one of aluminum, silver, gold, palladium, and platinum. 2. The package for housing a light-emitting element according to claim 1, wherein a metal layer made of any one of aluminum, silver, gold, palladium and platinum is applied to a surface of the frame. A light-emitting element storage package according to any one of claims 1 to 3, a light-emitting element mounted on the mounting portion and electrically connected to the wiring layer, and a transparent resin covering the light-emitting element. A light-emitting device comprising:

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