JP2004303860A - Heat dissipation structure of electronic components - Google Patents

Abstract

An object of the present invention is to provide a heat dissipation structure of an electronic component having a high heat dissipation effect.
A heat radiation structure of an electronic component housed in an electronic device housing while being mounted on a two-layer board. A heat radiating plate installed for heat radiation of the electronic component is connected to the electronic device housing. A ground layer is formed on the surface of the two-layer substrate opposite to the surface on which the electronic components are mounted, and a heat sink is arranged so as to face the ground layer. Here, a protrusion is formed on the heat sink at a position corresponding to a through hole for connecting the ground terminal of the electronic component and the ground layer between layers, and is connected to the two-layer board 2. Alternatively, the heat sink is provided on the side of the two-layer board on which the electronic component is mounted, in contact with the electronic component.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat dissipation structure for preventing overheating of electronic components, and more particularly, to a heat dissipation structure effective for heat dissipation of electronic components mounted on a multilayer board.
[0002]
[Prior art]
2. Description of the Related Art In electronic components, such as a CPU and various ICs, which are concerned about heat generation, a heat dissipation structure is employed to radiate heat to the outside and prevent overheating. As a heat radiation structure, a heat radiation plate is typically attached to a heat generating element (electronic component) to obtain a heat radiation effect. In addition, a ground (GND) layer of a substrate on which the electronic component is mounted is used, and its area is increased. Is also known to obtain a heat dissipation effect by increasing the value of.
[Patent Document]
JP 2001-257489 A
[Problems to be solved by the invention]
However, with the miniaturization of electronic equipment, the integration of electronic components mounted on the board tends to be more and more increased, and since the electronic components are densely mounted, a heat sink is directly bonded to the electronic components. Attempting to do so has a lot of restrictions, so that a sufficient heat radiation effect cannot be obtained.
[0004]
On the other hand, in the heat dissipation structure that dissipates heat using the ground layer of the substrate, the substrate is being multi-layered (for example, two layers) for the purpose of cost reduction and the like, and the ground layer is divided or thinned by circuit wiring. Therefore, a sufficient heat radiation effect cannot be obtained.
[0005]
The present invention has been proposed in view of such a conventional situation, and has as its object to provide a heat dissipation structure of an electronic component having a high heat dissipation effect.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a heat dissipation structure of an electronic component according to the present invention is provided in a heat dissipation structure of an electronic component housed in an electronic device housing while being mounted on a two-layer board. The radiator plate to be installed is connected to the electronic device housing.
[0007]
Furthermore, a ground layer is formed on the surface of the two-layer board opposite to the surface on which the electronic components are mounted, and the radiator plate is disposed so as to face the ground layer. A projection is formed at a position corresponding to a through hole for connecting a ground terminal of the electronic component to the ground layer. Alternatively, the heat radiating plate is provided in contact with an electronic component.
[0008]
By connecting the heat radiating plate to the electronic device housing, a high heat radiating effect is realized. This heat radiation effect can be obtained by providing a protrusion at a position corresponding to the through hole of the heat sink and making the protrusion contact the ground layer or the through hole, or by providing the heat sink in contact with the electronic component, It is further improved and a sufficient heat radiation effect can be obtained.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a heat dissipation structure of an electronic component to which the present invention is applied will be described in detail with reference to the drawings.
(1st Embodiment)
In the present embodiment, the heat radiation of the electronic components mounted on the two-layer board is performed via a heat radiating plate grounded on the back side of the two-layer board.
[0010]
FIG. 1 shows a heat dissipation structure of the present embodiment. An electronic component 1 is mounted on a two-layer substrate 2, and the two-layer substrate 2 is attached to the electronic device housing 3. Is housed inside. The electronic component 1 is an IC such as a CPU, for example, and its heat generation is a problem.
[0011]
The two-layer board 2 has, for example, circuit wiring formed on both sides. In this example, a ground layer (GND layer) 4 is formed on the back side (the side opposite to the side on which the electronic component 1 is mounted). Have been.
[0012]
The two-layer board 2 is provided with a through hole 5 connecting between circuit wirings on both surfaces. For example, the ground terminal (GND terminal) of the electronic component 1 is connected to the ground layer 4 on the rear surface through the through hole 5. Is electrically connected to
[0013]
A radiator plate 6 is arranged on the back side of the two-layer board 2, and has a structure in which heat of the electronic component 1 is radiated through the radiator plate 6.
[0014]
Specifically, the heat sink 6 is made of, for example, a copper plate or the like, and is arranged to face the two-layer substrate 2 at a predetermined interval. The two end portions 6a and 6b are attached so as to be in contact with the metal electronic device housing 3, respectively. This attachment is performed by, for example, soldering.
[0015]
Further, a plurality of projections 6c are formed at positions corresponding to the through holes 5 of the heat sink 6, and the tips thereof are in contact with the through holes 5 (or the ground layer 4). The projection 6 is also formed by processing a copper plate, and is connected to the through hole 5 (or the ground layer 4) by soldering.
[0016]
In the heat dissipation structure of the electronic component having such a configuration, the heat of the electronic component 1 is transmitted from the ground terminal to the back surface of the two-layer substrate 2 through the through hole 5. Then, the light is transmitted to the heat radiating plate 6 via the protrusion 6c, further transmitted from the heat radiating plate 6 to the electronic device housing 3, and radiated to the outside.
[0017]
According to the heat dissipation structure having the above configuration, the ground terminal of the electronic component 1 is connected to the through hole 5 in consideration of the effect of heat dissipation, and heat is radiated from here. can do. That is, the ground terminal of the electronic component 1 is wired to the ground layer 4 of the two-layer board 2 through the through hole 5, and the projection 6c of the heat radiating plate 6 is connected thereto. Since it is connected to the body 3, it is possible to compensate for insufficient heat dissipation by the ground layer 4, and to effectively dissipate heat. The heat of the electronic component 1 is transmitted from the ground terminal to the back surface of the two-layer substrate 2 via the through hole 5, and is radiated to the outside via the protrusion 6 c, the heat radiating plate 6, and the electronic device housing 3.
[0018]
Further, since the heat radiating plate 6 and the protruding portion 6c are connected to the two-layer board 2 and the electronic device housing 3 by soldering, there is also an advantage that thermal efficiency is better than that of a structure by pressure contact, for example. In the pressure contact structure, it is necessary to use an auxiliary material in the contact portion in order to increase the efficiency. However, in the structure of the present embodiment, it is possible to increase the thermal efficiency only by the solder connection necessary for fixing the heat sink 6. Yes, it is cost effective.
(Second embodiment)
In the present embodiment, heat is radiated from an electronic component mounted on a two-layer board via a heat radiating plate arranged to be in contact with the electronic component.
[0019]
FIG. 2 shows a heat radiation structure of the present embodiment. As in the case of the previous embodiment, the electronic component 1 is mounted on a two-layer board 2, and this two-layer board 2 is mounted on an electronic device housing 3. By being attached, it is stored in the electronic device housing 3.
[0020]
The two-layer board 2 has, for example, circuit wiring formed on both sides, and a ground layer (GND layer) 4 is formed on the back side (the side opposite to the side on which the electronic component 1 is mounted). A through-hole 5 connecting between circuit wirings on both sides is formed, and a ground terminal (GND terminal) of the electronic component 1 is electrically connected to the ground layer 4 on the back surface via the through-hole 5.
[0021]
In the present embodiment, the heat sink 6 is arranged on the side of the two-layer board 2 on which the electronic component 1 is mounted, and is bent so as to be in contact with the electronic component 1. For example, the electronic component 1 is mounted on the two-layer board 2 while being housed in a component case or the like. In that case, the heat radiating plate 6 is attached in contact with the component case.
[0022]
In the heat dissipation structure of the present embodiment having such a configuration, heat dissipation by the ground layer 4 on the back surface side of the two-layer board 2 and heat dissipation through the heat dissipation plate 6 and the electronic device housing 3 are performed, which is more effective. Heat dissipation is realized. At this time, the ground terminal of the electronic component 1 is connected to the ground layer 4 on the back surface of the two-layer substrate 2 through the through hole 5, so that efficient heat radiation can be realized also in this regard. it can.
[0023]
【The invention's effect】
As described above in detail, according to the heat radiating structure for electronic components according to the present invention, efficient heat radiation can be realized, and for example, electronic components are densely mounted in response to miniaturization of electronic devices. In this case, the heat of the electronic component can be effectively dissipated even if the ground layer is divided or thinned by the circuit wiring.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view illustrating a heat dissipation structure of an electronic component according to a first embodiment.
FIG. 2 is a schematic cross-sectional view illustrating a heat dissipation structure of an electronic component according to a second embodiment.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 electronic component 2 two-layer board 3 electronic equipment housing 4 ground layer 5 through hole 6 heat sink 6 c protrusion

Claims (4)

In a heat dissipation structure of an electronic component housed in an electronic device housing while being mounted on a two-layer board,
A heat radiating structure for an electronic component, wherein a heat radiating plate installed for heat radiation of the electronic component is connected to the electronic device housing. A ground layer is formed on the surface of the two-layer substrate opposite to the surface on which the electronic components are mounted, and the heat sink is disposed so as to face the ground layer,
2. The heat radiation of an electronic component according to claim 1, wherein a protrusion is formed on the heat sink at a position corresponding to a through hole for connecting a ground terminal of the electronic component to the ground layer. Construction. The heat radiating structure for an electronic component according to claim 1, wherein the heat radiating plate is provided in contact with the electronic component. 4. The heat radiating structure for an electronic component according to claim 3, wherein the electronic component is housed in a component case, and the radiator plate is provided in contact with the component case.

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