JP2004290968A - Microchannel structure, member for manufacturing the same, and manufacturing method - Google Patents

Abstract

A recess corresponding to a microchannel for flowing a fluid and a through hole for introducing or discharging a fluid are formed by one molding, and the recess corresponding to the microchannel communicates with the through hole. To provide a method for manufacturing a microchannel substrate and a microchannel substrate obtained by the method.
A microchannel having a microchannel substrate provided with a microchannel and a through hole for flowing a fluid, wherein the microchannel and the through hole communicate with each other at a communication portion. A flow path structure, a mold having a pin for forming a through hole in a micro flow path substrate for manufacturing the same, a mold capable of arbitrarily changing the position of the pin and the number of pins, and a method using a mold. A method is used in which a through hole is formed at a predetermined position and a concave portion corresponding to a minute flow channel by multiple moldings.
[Selection diagram] None

Description

  The present invention provides a microchannel substrate for generating microparticles such as chemical reaction, chemical synthesis, analysis, separation, extraction and other chemical physical operations, or chromatographic packing material, microcapsules, etc. in a microchannel. , A member for manufacturing the same, and a manufacturing method.

  In recent years, a microchannel structure having a microchannel with a length of about several cm, a width and a depth of sub μm to several hundred μm on a glass substrate of several cm square has been used. Attention has been focused on research that performs chemical and physical operations such as reaction, chemical synthesis, analysis, separation, and extraction (for example, see Non-Patent Document 1) and manufactures fine particles such as packing materials for chromatography and microcapsules. (For example, see Patent Document 1). Here, the microchannel means a space having a width of 500 μm or less and a depth of 100 μm or less.

  Further, studies have been conducted on stacking microchannel structures in order to apply the microchannel structures to industrial mass production (for example, see Patent Document 2). In the example described above, the fluid introduction portions and the reaction product solution discharge portions (that is, the reaction product solution discharge portions) of the reaction raw material liquids (A) and (B) are formed on a flat glass substrate such as Pyrex (registered trademark) glass. And a predetermined number of microchannel substrates each having a microchannel as a reaction area having a width of several tens to several hundreds of micrometers communicating with the holes formed therethrough. This enables mass production. Further, by integrating a predetermined number of the laminated and integrated microchannel substrate laminates in parallel, more industrial mass production is possible.

  Known means and methods such as wet etching are usually used for forming the microchannels having a width of several tens to several hundreds of micrometers provided in the microchannel substrate. The formation of the fluid introduction part and the fluid discharge part employs general machining means and methods. However, these known methods are not simple methods, and the microchannel is formed through a plurality of steps such as exposure, development, and wet etching. Further, through holes corresponding to the fluid introduction part and the fluid discharge part are also formed through a plurality of steps such as sticking, processing, and peeling.

  As described above, by laminating and integrating a plurality of microchannel substrates, and further by laminating and integrating a plurality of the microchannel substrates, mass production of chromatography fillers, microcapsules, and the like can be performed. Although it is possible, there is a problem in that the production of a large number of microchannel substrates requires time and cost. Further, for example, when microchannels are integrated at a high density such as 100 to 200 microchannels on one microchannel substrate, through holes corresponding to a fluid introduction portion or a fluid discharge portion increase, Therefore, a further increase in cost becomes a problem.

  In order to reduce costs, attempts have been made to form a microchannel structure having a microchannel using a resin. This is achieved by changing a glass substrate such as Pyrex (registered trademark) glass in the above example to a resin substrate. A resin substrate provided with a microchannel can be manufactured by using a known technique such as a molding method. Further, if continuous molding is performed by injection molding or the like, further cost reduction is expected.

  In order to form the through-hole corresponding to the fluid introduction portion or the fluid discharge portion of such a resin-made microchannel substrate, a general machining process can be used similarly to a glass material such as Pyrex (registered trademark) glass. Good. As described above, mass production is possible by laminating and integrating a plurality of microchannel substrates and then paralleling a plurality of the laminated and integrated microchannel substrates for mass production for industrial use. However, it takes time and cost to manufacture a large number of microchannel substrates. For example, when a single microchannel substrate is formed by integrating microchannels at a high density, such as 100 to 200 microchannels, fluid introduction is difficult. The number of through holes corresponding to the part or the fluid discharge part increases. For this reason, a further increase in cost becomes a problem, and as a result, the cost reduction effect of changing the material of the microchannel substrate from a glass material such as Pyrex (registered trademark) glass to a resin material is halved or offset. There was a problem.

  Generally, the through-holes of the microchannel substrate are formed by mechanical processing means such as drilling, blasting, and ultrasonic drilling. However, burrs and the like are generated on the opening portion and the inner wall of the hole, and good surface roughness cannot be obtained. In such a case, for example, when microparticles having a size of about several nm to 1 μm are generated in the microchannel and discharged from the holes, the shape of the microparticles is deformed, And the clogged pores cause the problem that the generated fine particles cannot be discharged.

H. Hisamoto et. al. (H. Hisamoto et al.) "Fast and high conversion phase-transfer synthesis exploiting the liquid-liquid interface formed in a microchannel chip.," Commun. , 2001, pp.2662-2663.

International Publication WO02 / 068104 pamphlet JP-A-2002-292275

  The object of the present invention has been proposed in view of such a conventional situation. That is, a recess corresponding to a microchannel for flowing a fluid and a through-hole for introducing or discharging a fluid were formed by one molding, and the recess corresponding to the microchannel and the through-hole were connected. An object of the present invention is to provide a method for manufacturing a microchannel substrate and a microchannel structure obtained by the method.

  As a means for solving the above-mentioned problems, the present invention includes a microchannel and a through-hole on a microchannel substrate, wherein the microchannel and the through-hole communicate with each other at a communication portion, and further, the fluid is closed. It is a microchannel structure having a structure that flows without performing. Further, when particles such as droplets and solids are generated in a microchannel by two or more fluids, the cross-sectional area of the communicating portion is set to a maximum with respect to the flow direction of the particles such as solids or droplets contained in the fluid. It is larger than the cross-sectional area (for example, the maximum value of the cross-sectional area when a particle such as a droplet is cut perpendicularly to the long axis direction of the flow path). A microchannel substrate wherein at least one, preferably all, of the inner walls of the through holes have a roughness of Ra <10 nm, more preferably 0.2 nm <Ra <8 nm, particularly preferably 0.2 nm <Ra <2 nm Is a microchannel structure having In the present invention, the measurement of the surface roughness and the measurement conditions are based on the dynamic mode of the atomic force microscope. Further, the present invention provides an excellent mold which is a member for forming a microchannel substrate and a microchannel structure, and an excellent manufacturing method for forming a microchannel and a through hole by one molding using the same. As a result, the above-described problem of the related art can be solved, and the present invention has been finally completed. Hereinafter, the present invention will be described in detail.

  The present invention provides a microchannel structure having a microchannel substrate having a microchannel and a through hole for flowing a fluid, and wherein the microchannel and the through hole communicate with each other at a communication portion. is there. The communication portion has a structure in which the fluid flows without blocking. More preferably, there is provided a microchannel structure in which the surface roughness of the microchannel substrate such as the substrate surface of the microchannel, the inner wall of the microchannel, and the inner wall of the through-hole is Ra <10 nm. With such an embodiment, the following effects can be obtained. Here, the communication portion is a portion where the fluid flowing through the minute flow channel changes the direction of the flow in the through hole, and means a portion where the minute flow channel intersects with the through hole and the vicinity thereof. The structure in which the fluid of the communicating portion flows without blocking means that the fluid flowing in the microchannel flows without blocking, or that the droplet flowing in the microchannel flows without deformation and separation. This means that fluids and liquid droplets flow smoothly in the minute flow path.

  In general, a microchannel structure is formed by bonding a cover body in which through holes corresponding to a fluid introduction hole and a fluid discharge hole are formed at predetermined positions on a substrate on which a microchannel is formed. Have been. In the case of such an aspect, when the cover body and the microchannel substrate are bonded together, a positional shift between the microchannel and the through hole occurs, or a communication portion between the microchannel and the through hole is closed. As described in the present application, by forming a micro-channel structure in which the micro-channel and the through-hole are formed on the same substrate, it is not necessary to form the through-hole in the cover body. , And blockage at the communicating portion between the microchannel and the through-hole can be prevented.

  In general, when the microchannel and the through-hole communicate with each other, the cross-sectional area opening ratio at the communication portion between the microchannel and the through-hole (100% is defined as the case where all the cross sections of the communication portion are open). If is larger than the cross-sectional area of particles such as solids and droplets contained in the fluid, the fluid will not be blocked in the microchannel or the droplet will not be deformed or separated in the channel. For example, when a fluid containing no solid matter of 20% or more with respect to the cross-sectional area of the communicating portion between the microchannel and the through hole is sent to the microchannel of the microchannel structure, As long as the opening ratio is 20% or more of the cross-sectional area at the communicating portion with the hole, it is sufficiently possible to send a fluid containing no solid matter having a cross-sectional area of 20% or more to the microchannel of the microchannel structure. It is.

  Further, the microchannel structure of the present invention is a microchannel structure which may have a protrusion near the side of the microchannel. Furthermore, it is a microchannel structure which may be constituted by a microchannel substrate provided with a projection near the side of the through hole. By adopting such an embodiment, when the microchannel substrate and the cover are bonded together, the degree of sealing of the connection surface between the microchannel and the through hole and the cover can be increased. This embodiment is particularly effective when the microchannel base and the cover are bonded by pressure bonding.

  The microchannel structure of the present invention is a microchannel structure comprising a microchannel substrate having at least one orientation flat on the microchannel substrate. Generally, when mass production is performed using a microchannel structure, a method of stacking and integrating the microchannel structure is used. In this case, a fluid such as a gas or a liquid is introduced into each of the laminated and integrated microchannel structures, or a fluid or the like such as a gas or a liquid is discharged from each of the laminated and integrated microchannel structures. For this purpose, a microchannel structure having a through-hole formed in the cover is also used. In this case, it is necessary to align the holes of the plurality of microchannel substrates with the holes of the plurality of cover bodies. Therefore, it is preferable to form one or more orientation flats on the microchannel substrate, for example, to form two or more orientation flats at desired positions. In particular, when two orientation flats are formed so as to cross each other at right angles, the alignment becomes easier.

  Here, the bonding of the microchannel substrate and the cover body, or the bonding of the microchannel structures is not limited to the pressure bonding described above, but also includes known bonding such as thermal bonding, room temperature bonding, and bonding using an adhesive or the like. Is generally used. In the present invention, any method may be used as necessary.

  The through holes are generally formed by a technique such as machining. However, in a through-hole formed by a method such as machining, it is difficult to suppress generation of minute burrs having a size of submicron to several microns, and the through-hole has a very poor surface roughness (Ra). For this reason, for example, when a droplet having a good particle size distribution generated in the micro channel passes through the through hole corresponding to the discharge hole, the droplet is sheared by the fine burrs and the particle size distribution is deteriorated. I do. On the other hand, in the processing of a resin substrate or the like by molding, particularly injection molding, it is possible to process the surface roughness (Ra) of the substrate to a submicron or less as applied to a method of manufacturing an optical disk or the like. By appropriately using these processing methods, as in the present invention, the microchannel and the through-hole are formed in a single molding, and the molding method is preferably injection-molded, whereby the substrate of the microchannel is formed. The roughness (Ra) of the surface, the inner wall of the microchannel, and the inner wall of the through hole can be suppressed to less than 10 nm. Therefore, it is possible to suppress the generation of minute burrs having a size of submicron to several microns generated by a method such as machining. Further, it is preferable that the cover and the microchannel substrate are flatter in order to join the cover and the microchannel structure together. For example, it is more preferable that the surface on which the concave portion corresponding to the minute flow path is formed is not curved and / or the radius of curvature is 5 m or more and 100 m or less.

  The molding in the present invention described above preferably means mold molding or injection molding, and unless otherwise specified, means injection molding. Further, the material of the microchannel substrate in the present invention is not particularly limited as long as it can be formed by molding, and examples thereof include resin and ceramic. Examples of the resin include a thermosetting resin and a thermoplastic resin.

  In addition, the size of the microchannel substrate of the present invention, that is, the area and shape, and the thickness of the substrate are not particularly limited. However, the size of the microchannel substrate is several cm ×, considering that the microchannel substrate has a size that can be easily handled when manufacturing the microchannel substrate, and that the advantages of miniaturization of the manufacturing apparatus as a microreactor are utilized. A square shape of several cm to several tens cm × ten and several cm, or a disc shape of several cm to several tens cm in diameter is preferable, and specifically, a square shape of 5 cm × 5 cm to 20 cm × 20 cm, or a diameter of 5 cm to A disk shape of about 20 cm is preferable. It is preferable that the thickness of the microchannel substrate is within about several mm, preferably about 0.6 mm to 2.0 mm. Further, the size of the through-hole formed in the microchannel substrate of the present invention is not particularly limited. However, since the width of the microchannel is 500 μm or less, the diameter of the through-hole is preferably about several mm. The diameter of the capillary tube connected to the fluid introduction part and the fluid discharge part composed of the hole and the external liquid feed pump and the fluid recovery bottle is about several mm, and the diameter of the hole is more preferably 0.5 to 2. About 0 mm is preferable.

  In general, a mold is used for processing by molding, but the mold of the present invention includes a pin for forming a through hole in the microchannel substrate, and the position of the pin and the number of pins can be arbitrarily changed. It is a metal mold characterized by the above-mentioned. Further, the pin may be a mold that may be tapered toward the tip. By doing so, an arbitrary number of through holes can be formed at arbitrary positions of the cover body, and there is no need to machine each of the through holes one by one by machining or the like. Can be lowered.

  An example is given as an embodiment in which the position of the pin and the number of the pins in the present invention can be arbitrarily changed. Using a mold in which 150 holes for setting up pins are formed in advance, a necessary number of pins are inserted into a place where a through hole is actually formed in the 150 holes. In addition, a dummy pin for closing the hole is inserted into a hole where a through hole is not formed. Thus, an arbitrary number of pins are installed at arbitrary positions. It is needless to say that the present invention is not limited to only this aspect, and can be arbitrarily changed without departing from the gist of the invention.

  In the mold of the present invention, the shape of the pin is preferably tapered toward the tip. This makes it possible to easily peel off the microchannel substrate when the through-hole is formed by molding.

  Further, the mold of the present invention can include a pin for forming a through-hole in the microchannel substrate and / or a projection corresponding to the microchannel for forming the microchannel, and the position of the pin And a mold whose number of pins can be arbitrarily changed. The pin may be a mold that may be tapered toward the tip. The method for manufacturing a microchannel substrate according to the present invention is a manufacturing method using this mold. This makes it possible to form the microchannel and the through-hole in the microchannel substrate by one molding. Also, an arbitrary number of through-holes can be formed at arbitrary positions of the micro-channel substrate, eliminating the need to machine the through-holes one by one by machining or the like, thereby reducing the manufacturing cost of the micro-channel substrate. be able to. Further, by making the shape of the pin tapered toward the tip, when the through-hole is formed by molding, the microchannel substrate can be easily peeled off.

  The method for manufacturing a microchannel substrate according to the present invention is characterized in that the microchannel substrate includes a pin for forming a through-hole in the microchannel substrate, and the position of the pin and the number of pins can be arbitrarily changed. One-sided molding using a mold with a pin that is tapered toward the tip on one side, and a mold with a convex portion corresponding to a microchannel on one side on the opposite side A microchannel substrate provided with a recess corresponding to the microchannel and a through-hole at a predetermined position of the microchannel substrate. More preferably, there is provided a method of manufacturing a microchannel substrate, wherein the mold having a projection corresponding to the microchannel is a stamper. By adopting such an embodiment, it becomes possible to form the microchannel and the through-hole in the microchannel substrate by one molding. Also, an arbitrary number of through-holes can be formed at arbitrary positions of the micro-channel substrate, eliminating the need to machine the through-holes one by one by machining or the like, thereby reducing the manufacturing cost of the micro-channel substrate. be able to. Further, by making the shape of the pin tapered toward the tip, when the through-hole is formed by molding, the microchannel substrate can be easily peeled off. In addition, since the mold on which the protrusion corresponding to the minute flow path is formed is a stamper, the cost can be lower than forming the protrusion corresponding to the minute flow path by directly processing the mold. . Furthermore, by preparing stampers for minute channels of various shapes, a minute channel of a desired shape can be formed only by replacing the stamper.

  The method for manufacturing a microchannel substrate according to the present invention is a method for manufacturing a microchannel substrate, which may be injection-molded. Processing of a resin substrate or the like by injection molding can process the surface roughness (Ra) of the substrate to submicron or less, as is applied to a method of manufacturing an optical disk, etc. The roughness (Ra) of the inner wall of the flow path and the inner wall of the through hole can be suppressed to less than 10 nm. Therefore, it is possible to suppress generation of minute burrs having a size of submicron to several microns due to a technique such as machining. In addition, it is preferable that the microchannel substrate is flatter for bonding the cover body. For example, it is curved in a shape having a center of curvature on the surface side where the concave portion corresponding to the microchannel is formed, and the radius of curvature can be set to 5 m or more and 100 m or less.

  Further, the method for manufacturing a microchannel structure of the present invention includes a member for easily peeling the microchannel substrate from a mold having pins for forming a through hole at a predetermined position on the microchannel substrate. This is a method for manufacturing a microchannel substrate, comprising means such as steps. As described above, a large number of microchannel substrates can be continuously manufactured only with the function of easily separating the microchannel substrate from the mold.

  The present invention has a micro flow path provided with a micro flow path substrate having a micro flow path and a through hole for flowing a fluid, and wherein the micro flow path and the through hole communicate with each other at a communication portion. A micro channel structure, wherein the communication portion has easy transportability. More preferably, the microchannel structure is characterized in that the roughness of the substrate surface of the microchannel, the inner wall of the microchannel, and the inner wall of the through-hole is Ra <10 nm. By adopting such an aspect, it is not necessary to form a through-hole in the cover body, and it is possible to prevent displacement of the minute flow path and the through-hole and blockage at a communication portion between the minute flow path and the through-hole. .

  Also, in general, when the microchannel and the through-hole communicate with each other, if the cross-sectional area opening ratio at the communicating portion between the microchannel and the through-hole is larger than the cross-sectional area of the solid or droplet contained in the fluid, the fluid is There is no clogging in the microchannel and no deformation or separation of the droplet in the channel.

  Further, the microchannel structure of the present invention is a microchannel structure having a convex portion near the side of the microchannel, and further has a microchannel having a convex portion near the side of the through hole. A microchannel structure comprising a channel substrate. By adopting such an embodiment, when the microchannel substrate and the cover are bonded together, the degree of sealing of the connection surface between the microchannel and the through hole and the cover can be increased. This embodiment is particularly effective when the microchannel base and the cover are bonded by pressure bonding.

  The microchannel structure of the present invention is a microchannel structure comprising a microchannel substrate having at least one orientation flat on the microchannel substrate. Generally, when mass production is performed using a microchannel structure, a method of stacking and integrating the microchannel structure is used. In this case, a through hole was also formed in the cover body in order to introduce a fluid into each of the laminated and integrated microchannel structures or to discharge the fluid from each of the laminated and integrated microchannel structures. A microchannel structure is used. In this case, since it is necessary to align the holes of the plurality of microchannel substrates with the holes of the plurality of cover bodies, one or more orientation flats are formed on the microchannel substrate for the alignment. Preferably. In particular, when two orientation flats are formed so as to cross each other at right angles, the alignment becomes easier.

  Further, the mold of the present invention includes a pin for forming a through hole in the microchannel substrate, the position of the pin and the number of the pin can be arbitrarily changed, and the shape of the pin is directed toward the tip. And a tapered shape. By doing so, an arbitrary number of through holes can be formed at arbitrary positions of the cover body, and there is no need to machine each of the through holes one by one by machining or the like. Can be lowered.

  In the mold of the present invention, it is preferable that the shape of the pin is further tapered toward the tip. This makes it possible to easily peel off the microchannel substrate when the through-hole is formed by molding.

  Further, the mold of the present invention includes a pin for forming a through-hole in the microchannel substrate and a projection corresponding to the microchannel for forming the microchannel, and the position of the pin and the number of pins are arbitrary. It is a metal mold characterized by being changeable. Further, the mold is characterized in that the shape of the pin is tapered toward the tip. The method for manufacturing a microchannel substrate according to the present invention is a manufacturing method using this mold. This makes it possible to form the microchannel and the through-hole in the microchannel substrate by one molding. Also, an arbitrary number of through-holes can be formed at arbitrary positions of the micro-channel substrate, eliminating the need to machine the through-holes one by one by machining or the like, thereby reducing the manufacturing cost of the micro-channel substrate. be able to. Further, by making the shape of the pin tapered toward the tip, when the through-hole is formed by molding, the microchannel substrate can be easily peeled off.

  Further, the method for manufacturing a microchannel substrate according to the present invention includes a pin for forming a through-hole in the microchannel substrate, and the position of the pin and the number of pins can be arbitrarily changed. One time, using a mold that is a mold and the shape of the pin is tapered toward the tip on one side, and using a mold on which the protrusion corresponding to the microchannel is formed on the other side, A method of manufacturing a microchannel substrate, comprising: forming a microchannel substrate having a concave portion corresponding to a microchannel and a through hole at a predetermined position of the microchannel substrate by double-sided molding. More preferably, there is provided a method of manufacturing a microchannel substrate, wherein the mold having a projection corresponding to the microchannel is a stamper. By adopting such an embodiment, it becomes possible to form the microchannel and the through-hole in the microchannel substrate by one molding. Also, an arbitrary number of through-holes can be formed at arbitrary positions of the micro-channel substrate, eliminating the need to machine the through-holes one by one by machining or the like, thereby reducing the manufacturing cost of the micro-channel substrate. be able to. Further, by making the shape of the pin tapered toward the tip, when the through-hole is formed by molding, the microchannel substrate can be easily peeled off. In addition, since the mold on which the protrusion corresponding to the minute flow path is formed is a stamper, the cost can be lower than forming the protrusion corresponding to the minute flow path by directly processing the mold. . Furthermore, by preparing stampers for minute channels of various shapes, a minute channel of a desired shape can be formed only by replacing the stamper.

  The method for manufacturing a microchannel substrate according to the present invention is a method for manufacturing a microchannel substrate, wherein the molding is injection molding. Processing of a resin substrate or the like by injection molding can process the surface roughness (Ra) of the substrate to submicron or less, as is applied to a method of manufacturing an optical disk, etc. The roughness (Ra) of the inner wall of the flow path and the inner wall of the through hole can be suppressed to less than 10 nm. Therefore, it is possible to suppress generation of minute burrs having a size of submicron to several microns due to a technique such as machining. In addition, it is preferable that the microchannel substrate is more flat in order to join the cover body. For example, the microchannel substrate is curved into a shape having a center of curvature on the surface side on which the concave portion corresponding to the microchannel is formed, and The radius can be set to 5 m or more and 100 m or less.

  Further, the method for manufacturing a microchannel structure of the present invention includes a means for easily peeling the microchannel substrate from a mold having pins for forming through holes at predetermined positions of the microchannel substrate. A method for manufacturing a microchannel substrate, comprising: As described above, a large number of microchannel substrates can be continuously manufactured only with the function of easily separating the microchannel substrate from the mold.

  Hereinafter, an example of an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to only the following embodiments, and it goes without saying that any changes can be made without departing from the spirit of the invention. Further, the components of these embodiments may be appropriately combined with each other.

  First, a main configuration mechanism of an injection molding machine for obtaining a microchannel substrate made of a thermoplastic resin having a concave portion corresponding to a microchannel and a through hole will be described with reference to FIG. The injection molding machine includes a mold 1 (movable mold 1a, fixed mold 1b), an injection nozzle 2, a compression mechanism 3, and a mold clamping cylinder 4 as main constituent mechanisms. This will be described in detail with reference to FIG. A microchannel substrate having a concave portion corresponding to the microchannel of the present invention and a through-hole is provided by fixing a stamper 5 having a convex portion corresponding to the microchannel to the movable mold 1a. A pin 6 forming a through hole in 1b is fixed by press-fitting. The movable mold 1a for fixing the stamper 5 has a shape for forming an orientation flat that is perpendicular to the injection-molded substrate. Further, a mirror surface of the fixed mold 1b is provided, in which the pin 6 is slidable and a hole is provided at a position corresponding to the arrangement of the pin 6 on a surface forming a mirror surface of the fixed mold 1b into which the pin 6 is inserted. A mold piece having a surface corresponding to the surface and a surface opposite to the mirror surface, that is, a peeling ejector 7 is arranged.

  Next, a method for manufacturing a microchannel substrate made of a thermoplastic resin having a concave portion corresponding to a microchannel and a through hole will be described with reference to FIG. In the method for manufacturing the microchannel substrate, the mold clamping cylinder 4 sets the thickness of the microchannel substrate to be larger than the thickness of the microchannel substrate in advance (primary mold clamping, FIG. 3A). The heated and melted thermoplastic resin is injected from the injection nozzle 2, filled with the thermoplastic resin, and further subjected to a secondary clamping force (FIG. 3B) to obtain the thickness of the injection-molded substrate. At this time, the through-hole is formed at the same time as the transfer of the projection corresponding to the microchannel. Next, after cooling to a temperature at which the filled and compressed thermoplastic resin is cured, the mold is opened. Simultaneously with the opening of the mold, the peeling ejector 7 finely moves in conjunction with the mold (FIG. 3C), thereby extruding the thermoplastic resin from the pins 6 forming the through holes. At the same time, due to the slight movement of the peeling ejector 7, the thermoplastic resin remains on the side of the stamper 5 forming the minute flow path, and the mold opening is completed (FIG. 3D). Next, it is peeled off from the stamper 5 by a spool cut and an ejector pin, and the thermoplastic resin is taken out by vacuum tweezers or the like. By the method as described above, a concave portion corresponding to a microchannel for flowing a fluid and a through hole for introducing or discharging a fluid are provided, the concave portion corresponding to the microchannel communicates with the through hole, and the orientation flat is further formed. A microchannel substrate provided with the same can be obtained. As the thermoplastic resin, for example, resins such as polycarbonate, polyetherimide, and polyacetal can be used, and may be selected according to the application. Further, any resin may be used as long as it is a resin that can be injection-molded. For example, a thermosetting resin such as an epoxy resin may be used.

  Next, an example of a method of manufacturing the stamper 5 for forming a concave portion corresponding to a microchannel for flowing a fluid will be described. A metal film such as gold is formed on a glass master as a base substrate to a thickness that does not allow exposure light to be described later to pass therethrough, and a photoresist is coated thereon. A photomask having a pattern depicting the shape of the microchannel is placed on this, and exposure and development are performed from above. Next, the metal film is etched with an acid or the like. Further, the resist and the glass are etched with hydrofluoric acid or the like, and finally the metal film remaining on the etched surface is dissolved with an acid or the like, whereby a glass master corresponding to the microchannel is obtained. Next, a metal conductive thin film is formed by sputtering or the like on the surface of the glass substrate on which the concave portion corresponding to the microchannel is formed, and the metal conductive thin film is formed by a subsequent metal electroforming process. An activation treatment is performed to improve the adhesion to the layer. Then, a metal electroformed layer is formed by metal electroforming, and the metal conductive film and the metal electroformed layer are integrally peeled from the glass master. Further, by removing the remaining resist, it is possible to obtain a stamper 5 having a convex portion corresponding to the minute channel. This stamper corresponds to a part of one mold (operating mold 1a) constituted by two molds.

  Next, a description will be given of a method of manufacturing a mold provided with a pin 6 having a through hole for introducing or discharging a fluid. A hole for erecting a pin 6 for forming a through-hole at a predetermined position of the microchannel is formed in a mold for forming a concave portion corresponding to the microchannel on the opposite surface. The diameter of the hole to be formed depends on the diameter of the pin to be erected. Next, the pins are erected by a press-fitting method in a mold provided with a hole for erecting the pins 6. The mold on which the pins 6 are erected corresponds to the other mold (fixed mold 1b) composed of two molds. Further, the pins 6 erected on the mold can be extracted as needed. When the pin 6 is removed, a blind pin may be embedded in the hole after the removal by a press-fitting method. The length of the pin 6 forming the through hole in the microchannel substrate depends on the thickness of the microchannel substrate and the thickness of the peeling ejector 7, but the stamper that becomes the mold (operating mold 1a) after the mold is clamped. The length may be adjusted in advance so as not to come into contact with the surface on which the convex portion corresponding to the microchannel 5 is formed. Further, it is desirable that the shape of the pin is tapered only for the length corresponding to the through hole (thickness of the microchannel substrate).

  Next, the peeling ejector 7 will be described. When a through-hole is formed in an injection-molded substrate, the injection-molded substrate cannot be separated from a mold having pins, but remains on the mirror surface of the mold having pins. In order to avoid this, the pin 6 is slidable with respect to the mold provided with the pin 6 (fixed mold 1b), and the mold provided with the pin 6 (operating mold 1a) and the pin 6 A release ejector 7 which is a mold piece having a hole corresponding to the arrangement is provided. A mechanism is provided for extruding the mold piece when the mold is opened, thereby facilitating peeling of the injection-molded substrate having the through hole from the mold (fixed mold 1b) having the pins 6.

  As described above, the concave portion corresponding to the minute channel for flowing the fluid of the present invention and the through hole for introducing or discharging the fluid, and the minute portion in which the concave portion corresponding to the minute channel and the through hole communicate with each other. The channel substrate can be manufactured with the following configuration. That is, the stamper 5 having the convex portion corresponding to the minute flow path is made a part of one of the molds (the operating mold 1a), and the mold (the fixed mold 1b) having the pins 6 forming the through holes. ) And a mold piece (peeling ejector 7) having a hole through which a pin 5 for forming a through hole functioning as a peeling ejector 7 can slide, by injection molding using a micro flow made of a thermoplastic resin. It is possible to obtain a microchannel substrate having a concave portion corresponding to a passage and a through hole, and a concave portion corresponding to a microchannel and a through hole communicating with each other at a communicating portion.

Hereinafter, more specific examples of the present invention will be described. Note that, as described above, the present invention is not limited to only the following embodiments, and it goes without saying that the present invention can be arbitrarily changed without departing from the gist of the invention.
(Example 1)
FIG. 4 shows an embodiment of the present invention.

  A recess (width W = 200 μm, depth (height) D = 100 μm) corresponding to the microchannel 9 for flowing a fluid in the microchannel substrate 8 (outer diameter φ = 140 mm, thickness t = 2.0 mm) ) Were formed as 18 Y-shaped microchannels. Further, as the through holes (diameter φ = 1.2 mm) communicating with the minute flow channels, 54 holes corresponding to the fluid introduction portions 10a and 10b and the fluid discharge portion 11 are provided.

  The configuration of the concave portion corresponding to the microchannel 9 and the mold for forming the through hole is as follows. A stamper 5 having a projection corresponding to the microchannel 9 is mounted on a movable mold 1a of an injection molding machine. The fixed mold 1b includes pins 6 having an outer diameter φ of 1.2 forming 54 through holes at positions corresponding to the fluid introduction portions 10a and 10b and the fluid discharge portion 11. Further, in order to facilitate the peeling of the injection molded substrate from the pin 6 for forming the through hole, 54 slidable tolerances having an outer diameter φ = 1.2 are provided at the same position as the pin 6. A peeling ejector 7 having a through hole is provided in the fixed mold 1b. The two dies are provided with a concave portion corresponding to the microchannel 9 and a through-hole corresponding to the fluid introduction portions 10a and 10b or the fluid discharge portion 11 for penetrating the fluid. The microchannel substrate 8 in which the holes communicated was manufactured in a lump by injection molding polycarbonate. Further, peeling of the injection molded substrate from the fixed mold 1b having 54 pins 6 forming through holes at the time of opening the mold was satisfactory by the operation of the peeling ejector 7. Further, two injection-molded microchannel substrates 8 were laminated by thermal fusion, but the surface was smooth due to the application of compressive force by secondary clamping, and the dimensional change due to heat was extremely small. The stable lamination of the microchannel substrate 8 by the attachment was achieved. Furthermore, since it has two orientation flats 12 perpendicular to the microchannel substrate, positioning at the time of lamination can be easily performed.

  As described above, according to the present invention, a concave portion corresponding to a microchannel for flowing a fluid, a through hole for introducing and subsequently discharging the fluid is provided, and the concave portion corresponding to the microchannel and the through hole communicate with each other. Further, a microchannel substrate having a concave portion and a through hole corresponding to the microchannel can be collectively obtained by using a thermoplastic resin. Further, by applying the secondary compression, it is possible to obtain the microchannel substrate 8 in which the two surfaces of the microchannel substrate 8 are extremely smooth and whose dimensional change due to heat is extremely small.

  In this embodiment, a Y-shaped flow path having an outer diameter φ of the fine flow path substrate of 140 mm, a thickness t of 2.0 mm, a width W of the concave portion corresponding to the fine flow path of 200 μm, and a depth D of 100 μm. 18 and 54 through-holes having a diameter φ of 1.2 mm were formed by injection molding using polycarbonate. However, in the present invention, the width and depth of the microchannel, the shape of the microchannel, the diameter of the through-hole, and the degree of integration of the microchannel are not limited thereto. It goes without saying that these conditions can be changed depending on the applied chemical reaction system or the like, or the size of the fine particles such as the packing material for chromatography. As the resin forming the microchannel substrate 8, a thermoplastic resin is used in this embodiment, but a thermosetting resin may be used.

It is a schematic diagram showing the main composition of the injection molding machine for manufacturing the microchannel board of the present invention. It is a schematic sectional view showing the metallic mold composition of the injection molding machine for manufacturing the microchannel board of the present invention. FIG. 4 is a schematic cross-sectional view showing a mold operation of injection molding for manufacturing the microchannel substrate of the present invention. FIG. 3 is a schematic plan view showing a microchannel substrate of the present invention.

Explanation of reference numerals

1: Mold 1a: Working mold 1b: Fixed mold 2: Injection nozzle 3: Compression mechanism 4: Mold clamping cylinder 5: Stamper 6: Pin 7: Mold piece, peeling ejector 8: Microchannel substrate 9 : Micro channels 10a, 10b: fluid inlet 11: fluid outlet 12: orientation flat

Claims (15)

A microchannel structure, comprising: a microchannel substrate having a microchannel and a through hole for flowing a fluid, wherein the microchannel and the through hole communicate with each other at a communication portion. 2. The microchannel structure according to claim 1, wherein the communication portion has a structure in which the fluid flows without blocking. 3. 3. The microchannel structure according to claim 1, wherein the surface roughness of the microchannel substrate is Ra <10 nm. The microchannel structure according to any one of claims 1 to 3, wherein a convex portion is provided near a side of the microchannel. The microchannel structure according to any one of claims 1 to 4, comprising a microchannel substrate provided with a protrusion near the side of the through hole. The microchannel structure according to any one of claims 1 to 5, wherein the microchannel substrate has one or more orientation flats. In a microchannel structure that generates particles in a microchannel using two or more fluids, a cross-sectional area of the communication portion is larger than a maximum cross-sectional area in a flow direction of particles in the fluid flowing through the microchannel. The microchannel structure according to any one of claims 1 to 6, wherein A mold having a pin for forming a through-hole in a microchannel substrate, wherein the position of the pin and the number of pins can be arbitrarily changed. The mold according to claim 8, wherein the shape of the pin is tapered toward the tip. The mold according to claim 8, further comprising a projection corresponding to the minute channel for forming the minute channel. A micro-channel substrate characterized by forming a through-hole at a predetermined position and a concave portion corresponding to the micro-channel by a single molding using the mold according to any one of claims 8 to 10. Production method. A microchannel formed by a single molding using the mold according to any one of claims 8 to 10 on one side and a mold for forming a projection corresponding to the microchannel on the opposite side. Forming a through-hole at a predetermined position and a concave portion corresponding to the above. The method for manufacturing a microchannel substrate according to claim 12, wherein the mold for forming the convex portion corresponding to the microchannel is a stamper. 14. The method according to claim 11, wherein the molding is injection molding. 15. The microchannel substrate according to claim 11, further comprising means for easily separating the microchannel substrate from a mold having pins for forming through holes at predetermined positions of the microchannel substrate. A method for manufacturing a microchannel substrate according to any one of the above.

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