JP2004289071A - Wiring board and method of manufacturing the same, semiconductor device, electronic device, and electronic equipment - Google Patents

Abstract

An object of the present invention is to improve design flexibility of a wiring board.
A wiring board includes a substrate having a plurality of through holes, a wiring pattern formed on the substrate and having a plurality of wirings and a plurality of electrical connection portions, and a plurality of electrical connection portions. And a wire 30 that electrically connects the first electrical connection portion 22 and the second electrical connection portion 26 provided at a position distant from the first electrical connection portion 22. . The first electrical connection portion 22 overlaps the first through hole 12 among the plurality of through holes, and the second electrical connection portion 26 includes the second through hole among the plurality of through holes. 16 overlaps. One end of the wire 30 is bonded to the back surface of the first electrical connection portion 22 in the first through hole 12, and the other end of the wire 30 is bonded to the second end in the second through hole 16. Is bonded to the back surface of the electrical connection part 26 of the first embodiment.
[Selection diagram] FIG.

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring board and a method for manufacturing the same, a semiconductor device, an electronic device, and an electronic apparatus.
[0002]
[Prior art]
[0003]
[Patent Document 1]
JP-A-6-188559
BACKGROUND OF THE INVENTION
In COF (Chip On Film) mounting applied as a technique for electrically connecting a semiconductor chip to an electro-optical panel (for example, a liquid crystal panel), a double-sided wiring board may be used as a wiring board connected to the electro-optical panel. is there. According to this, it is possible to cross each wiring in a state of being electrically independent, so that the degree of freedom in designing the wiring board is high. However, in the case of a double-sided wiring board, wiring processing (such as a photolithography technique) is performed on both sides of the board, and through holes are also required. Therefore, there is a demand for a low-cost wiring board with a simple manufacturing process.
[0005]
An object of the present invention is to improve the degree of freedom in designing a wiring board.
[0006]
[Means for Solving the Problems]
(1) A wiring board according to the present invention includes: a board having a plurality of through holes;
A wiring pattern formed on the substrate and having a plurality of wirings and a plurality of electrical connection portions,
A wire for electrically connecting a first electrical connection of the plurality of electrical connections with a second electrical connection provided at a position distant from the first electrical connection; When,
Including
The first electrical connection portion overlaps a first through hole of the plurality of through holes,
The second electrical connection portion overlaps a second through hole of the plurality of through holes,
One end of the wire is bonded to the back surface of the first electrical connection in the first through hole,
The other end of the wire is bonded to the back surface of the second electrical connection in the second through hole. According to the present invention, for example, a plurality of wirings can cross each other by a wire in a state of being electrically independent. That is, since multilayer wiring can be substantially realized by the wires, the degree of freedom in designing the wiring board is greatly improved. Further, since the wire is bonded in the through hole, the thickness of the substrate can be omitted, and the height of the wire can be suppressed. Further, it is possible to prevent the wire from coming into contact with the wiring pattern at a portion other than the bonding portion, and it is possible to reliably prevent the wire from being electrically defective.
(2) In this wiring board,
At least one of the plurality of wires is routed through a region between the first and second electrical connections,
The wire may be formed across the at least one wiring.
(3) In this wiring board,
A plurality of the first and second electrical connection portions are provided, respectively;
The wires may electrically connect the respective first and second electrical connections.
(4) In this wiring board,
The plurality of first electrical connection portions are arranged in a plurality of rows, adjacent first electrical connection portions are arranged in a staggered manner,
The plurality of second electrical connection units may be arranged in a plurality of rows, and adjacent second electrical connection units may be arranged in a staggered manner. According to this, the apparent connection pitch can be widened, so that a plurality of electrical connection portions can be densely provided within a limited region of the substrate.
(5) In this wiring board,
At least two of the plurality of wires may be formed to cross each other. According to this, further multilayer wiring becomes possible, and the degree of freedom in designing the wiring board is further improved.
(6) In this wiring board,
The wire may include a conductive wire and an insulating coating covering a surface of the conductive wire. According to this, since the conductive wire can be insulated, for example, the sealing portion of the wire can be omitted, and thus, for example, the flexibility of the substrate can be greatly improved.
(7) In this wiring board,
The semiconductor device may further include a sealing unit that seals the wire. By doing so, it is possible to prevent an electric short circuit of a wire or the like.
(8) In this wiring board,
The sealing portion may seal each end of the wire. According to this, for example, the flexibility of the substrate is improved as compared with the case where the entire wire is sealed.
(9) In this wiring board,
The plurality of electrical connections include at least one select terminal that allows a design change,
One of the first and second electrical connection units may be selected from the at least one select terminal. According to this, since the design of the wiring board can be changed, the degree of freedom in the design can be greatly improved.
(10) In this wiring board,
The substrate may be a flexible substrate that can be bent.
(11) In this wiring board,
The wire is a first wire;
Among the plurality of electrical connection portions, a third electrical connection portion electrically connects a third electrical connection portion and a fourth electrical connection portion provided at a position distant from the third electrical connection portion. Two wires, further comprising:
One end of the second wire is bonded to a surface of the third electrical connection facing away from the substrate;
The other end of the second wire may be bonded to a surface of the fourth electrical connection facing away from the substrate. According to this, since both surfaces of the substrate can be used, further multi-layer wiring becomes possible, and the degree of freedom in designing the wiring substrate is further improved.
(12) In this wiring board,
The first and second electrical connection portions may be lands having a width larger than that of the wiring. According to this, since the wire is connected to the land having a wide electrical connection area, the electrical connection between the two is stabilized.
(13) The semiconductor device according to the present invention comprises:
Said wiring board,
A semiconductor chip electrically connected to the wiring pattern,
including.
(14) The electronic device according to the present invention includes:
The semiconductor device;
An electro-optical panel electrically connected to the wiring pattern of the semiconductor device;
including.
(15) An electronic apparatus according to the present invention includes the above electronic device.
(16) In the method for manufacturing a wiring board according to the present invention, the first electrical connection among the wiring patterns formed on the substrate having the plurality of through holes and having the plurality of wirings and the plurality of electrical connection portions. Bonding one end of a wire to the first portion and bonding the other end of the wire to a second electrical connection provided at a position remote from the first electrical connection;
The first electrical connection portion overlaps a first through hole of the plurality of through holes,
The second electrical connection portion overlaps a second through hole of the plurality of through holes,
In the bonding step, one end of the wire is bonded to the back surface of the first electrical connection portion in the first through hole, and the other end of the wire is bonded in the second through hole. Is bonded to the back surface of the second electrical connection portion. According to the present invention, for example, a plurality of wirings can cross each other by a wire in a state of being electrically independent. That is, since multilayer wiring can be substantially realized by the wires, the degree of freedom in designing the wiring board is greatly improved. Further, since the wire is bonded in the through hole, the thickness of the substrate can be omitted, and the height of the wire can be suppressed. Further, it is possible to prevent the wire from coming into contact with the wiring pattern at a portion other than the bonding portion, and it is possible to reliably prevent the wire from being electrically defective.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that, in each drawing, the wiring 21 is omitted for convenience of drawing, but the wiring 21 is continuous as appropriate.
[0008]
(Electronic devices and semiconductor devices)
FIG. 1 is a diagram showing an electronic device according to an embodiment of the present invention. The electronic device 1 includes a semiconductor device 3. The semiconductor device 3 is one in which semiconductor chips 60 and 62 are mounted on a wiring substrate (including the substrate 10) described later.
[0009]
The electronic device 1 may be a display device that converts an electrical information signal into a visually recognizable optical information signal. The electronic device 1 further includes an electro-optical panel 100. Examples of the electro-optical panel (for example, display panel) 100 include a liquid crystal panel, a plasma display panel, and an electroluminescent display panel. The electro-optical panel 100 includes a substrate (eg, a glass substrate) 102, and a plurality of terminals (not shown) formed on the substrate 102 and a plurality of terminals (wiring pattern 20) of the semiconductor device 3 overlap. They are electrically connected to each other.
[0010]
In the example shown in FIG. 1, a semiconductor chip (first driver) 60 is electrically connected to a first pattern (part of the wiring pattern 20) on the substrate 10, and a second pattern (not shown) on the substrate 10. Another semiconductor chip (second driver) 62 is electrically connected to a part of the wiring pattern 20). In an active matrix type liquid crystal device, one of the first and second patterns is a scanning electrode, and the other is a signal electrode. The first and second patterns are connected to one side of the electro-optical panel 100. In that case, it is required to form the first and second patterns (wiring pattern 20) within a limited area of the substrate 10, but in such a case, the wiring substrate according to the present embodiment is applied. Then it is effective.
[0011]
(Wiring board)
2 and 3 are views showing a part of the wiring board according to the embodiment of the present invention. The wiring board includes a substrate 10, a wiring pattern 20, and wires 30.
[0012]
The substrate 10 is a base substrate. In the present embodiment, the substrate 10 is a flexible substrate that can be bent (for example, can be bent so as to overlap in a plane). The flexible substrate is formed of an organic material (for example, a resin (polymer)), and may be, for example, a polyimide substrate or a polyester substrate. The substrate 10 may be a flexible substrate for COF (Chip On Film). As a modification, the substrate 10 may be a rigid substrate, or may include at least a part of an inorganic material. Note that the substrate 10 may be a single-layer substrate or a multilayer substrate (for example, a two-layer or three-layer substrate). In the case of a multilayer substrate, an adhesive material may be interposed between upper and lower layers.
[0013]
In the present embodiment, the wiring pattern 20 is formed on the substrate 10 (for example, one surface of the substrate 10). The wiring pattern 20 is made of a conductive material, and may be formed by etching a metal, for example. The wiring pattern 20 may be formed of a plurality of layers, and may have, for example, a copper (Cu) -based core layer and a gold (Au) -based surface layer. Alternatively, a nickel (Ni) -based intermediate layer may be interposed between the copper-based and gold-based layers. When a wire 30 described later is a gold-based wire, electrical connection between the wire 30 and the wiring pattern 20 can be achieved by diffusion of gold.
[0014]
The wiring pattern 20 includes a plurality of wirings 21 and a plurality of electrical connection portions (first and second electrical connection portions 22 and 26 in FIG. 2). Each electrical connection is electrically connected to one of the wirings 21. The electrical connection may be a land. The lands are preferably larger than the width required for wire bonding described later. Therefore, it is preferable that the width of the land is larger than that of the wiring 21. By doing so, a wide area for electrical connection can be secured, so that electrical connection is stabilized. The shape of the land may be either square or circular. In this embodiment, the electrical connection portion is a land, but the present invention is not limited to this, and the electrical connection portion may be the wiring 21 itself having substantially the same width as the wiring 21.
[0015]
The substrate 10 has a plurality of through holes (first and second through holes 12 and 16 in FIG. 3). The through hole overlaps with the wiring pattern 20. Specifically, as shown in FIG. 3, the first electrical connection portion 22 overlaps the first through hole 12, and the second electrical connection portion 26 overlaps the second through hole 16. are doing. The first electrical connection portion 22 (or the second electrical connection portion 26) may close the opening of the first through hole 12 (or the second through hole 16). The first electrical connection portion 22 (or the second electrical connection portion 26) may be a land, and has a width larger than the width of the first through hole 12 (or the second through hole 16). May have. Alternatively, the first electrical connection portion 22 (or the second electrical connection portion 26) may have a width smaller than the width of the first through hole 12 (or the second through hole 16). . In that case, a part of the opening of the first through hole 12 (or the second through hole 16) is not closed.
[0016]
The wire 30 is a conductive wire. The wire 30 can also be called a jumper component (wiring). The wire 30 may be a wire used for wire bonding of a semiconductor chip (for example, a gold-based wire). The entire conductive wire of the wire 30 may be exposed.
[0017]
The wire 30 electrically connects the first electrical connection 22 and the second electrical connection 26. The second electric connection part 26 is provided at a position distant from the first electric connection part 22. As shown in FIG. 3, one end of the wire 30 is bonded to the back surface (the surface facing the substrate 10) of the first electrical connection portion 22 in the first through hole 12, and the other end of the wire 30 is connected to the other end of the wire 30. The end is bonded to the back surface (surface facing the substrate 10) of the second electrical connection portion 26 in the second through hole 16. That is, the wire 30 is drawn out to the opposite side of the substrate 10 from the wiring pattern 20. According to this, since the wire 30 is bonded in the through hole, the thickness of the substrate 10 can be omitted, and the height of the wire 30 can be suppressed. Further, it is possible to prevent the wire 30 from coming into contact with the wiring pattern 20 at a portion other than the bonding portion, and it is possible to reliably prevent an electrical failure of the wire 30. Further, by forming the wires 30 on the back surface side of the substrate 10, the front surface side (the wiring pattern 20 side) of the substrate 10 can be flattened. For example, electronic components can be easily mounted on the front surface side of the substrate 10. Such assembling process can be performed smoothly.
[0018]
When at least one (a plurality of wires in FIG. 2) wiring 21 is routed so as to pass through a region between the first and second electrical connection portions 22 and 26, the wire 30 straddles the wiring 21. (So as not to contact the wiring 21). That is, the wire 30 is formed so as to pass below the wiring 21 in a region between the first and second electrical connection portions 22 and 26. By doing so, the plurality of wirings can cross each other in a state of being electrically independent, and the degree of freedom in designing the wiring pattern can be increased. As a modification, the wire 30 may be formed across an electronic component (not shown) (so as not to contact the electronic component).
[0019]
As shown in FIG. 3, a bump may be provided on one of the first and second electrical connection portions 22 and 26. For example, when the first bonding of the wire 30 is performed on the first electrical connection portion 22, a part of the wire 30 remains as a bump on the first electrical connection portion 22. By performing bonding on the bumps in this manner, the wire loop height can be kept low.
[0020]
In the example shown in FIG. 2, a plurality of first and second electrical connection portions 22 and 26 are provided, respectively, and a wire 30 is connected to (a pair of) first and second electrical connection portions 22 and 26, respectively. Are electrically connected. As shown in FIG. 2, the plurality of wires 30 may be drawn out in a direction that does not intersect with each other (for example, a parallel direction).
[0021]
The plurality of electrical connections include at least one select terminal that allows a design change, and one of the first and second electrical connections 22 and 26 is selected from the select terminal. It may be. The selection of the select terminal may be in a form of selecting one of a plurality of terminals, or a form of selecting only one (as a result of selection). For example, a plurality of select terminals for supplying electric signals of different numerical values are prepared, and select terminals for supplying electric signals of optimal numerical values are selected as the first or second electric connection units 22 and 26 from these select terminals. You may. According to this, since the design of the wiring board can be changed after the wiring pattern 20 is formed on the substrate 10, the design flexibility can be greatly improved. Therefore, it is possible to efficiently manufacture a plurality of types of wiring boards that meet the specifications of each customer.
[0022]
A resist (not shown) (for example, a solder resist) may be formed on the surface of the substrate 10 where the wiring pattern 20 is formed. The surface of the wiring pattern 20 (the surface facing away from the substrate 10) may be covered with a resist. Oxidation, corrosion, and electrical failure of the wiring pattern 20 can be prevented by the resist.
[0023]
In the example illustrated in FIG. 3, the wiring board further includes a sealing portion 42 that seals the wires 30. The sealing portion 42 is formed of an insulating material (for example, resin). The sealing portion 42 may be formed by potting molding or transfer molding. The sealing section 42 may seal the entire wire 30. When there are a plurality of wires 30, the sealing portion 42 may be sealed for each wire 30 or the plurality of wires 30 may be sealed together. The sealing section 42 also seals the first and second electrical connection sections 22 and 26. By doing so, it is possible to prevent an electrical short circuit of the wire 30 or the like.
[0024]
According to the present embodiment, one end of wire 30 is bonded to the back surface of first electrical connection portion 22 in first through hole 12, and the other end of wire 30 is Is bonded to the back surface of the second electrical connection portion 26 in the through hole 16 of FIG. In this way, the plurality of wirings can cross each other while being electrically independent. That is, since the multilayer wiring (three-dimensional wiring) can be substantially realized by the wires 30, the degree of freedom in designing the wiring board is greatly improved. In particular, as described above, when high-density wiring is required in a limited area of the substrate 10, the use of the wiring substrate according to the present embodiment is effective. Further, since it is not necessary to use a double-sided or multi-layered wiring board which is expensive and time-consuming to manufacture, it is possible to provide a wiring board which is low-cost and easy to manufacture.
[0025]
4 to 8 are views showing modified examples of the wiring board according to the embodiment of the present invention.
[0026]
As a first modified example, as shown in FIG. 4, a plurality of first electrical connection portions 22, 23, and 24 and a plurality of second electrical connection portions 26, 27, and 28 are respectively provided in a plurality of rows. They may be arranged. The first electric connection portion will be described in detail as an example. At least one (two in FIG. 4) wiring 21 passing through a region between the first and second electric connection portions 22 and 26 is sequentially arranged from the side. , A plurality of first electrical connections 22 form a first row, a plurality of first electrical connections 23 form a second row, and a plurality of first electrical connections 24 Forming a third column. The electrical connections in each row may be arranged in a straight line. The electrical connections in adjacent rows (eg, the first electrical connections 22, 23 in the first and second rows or the first electrical connections 23, 24 in the second and third rows) , Are arranged in a staggered manner. Further, the first electrical connection portions 22, 24 in the first and third rows are also arranged in a staggered manner. Each of the first electrical connection portions 22, 23, and 24 overlaps with one of the first through holes 12, 13, and. The same applies to the plurality of second electrical connection portions 26, 27, and 28. Note that each of the second electrical connection portions 26, 27, 28 overlaps with any of the second through holes 16, 17, 18. According to this, since the apparent connection pitch can be widened, a plurality of electrical connection portions can be densely provided in a limited area of the substrate 10.
[0027]
As shown in FIG. 4, for example, wires 30 electrically connect the plurality of first electrical connections 22 in the first row and the plurality of second electrical connections 28 in the third row. You may connect. More specifically, one end of the wire 30 is bonded to the back surface of the first electrical connection portion 22 in the first through hole 12, and the other end of the wire 30 is bonded in the second through hole 18. May be bonded to the back surface of the second electrical connection portion 28. Similarly, the plurality of first electrical connection portions 23 in the second row are electrically connected to the plurality of second electrical connection portions 27 in the second row by wires 30. Is also good. Further, similarly, the wires 30 electrically connect the plurality of first electrical connection portions 24 in the third row and the plurality of second electrical connection portions 26 in the first row. Is also good. According to this, the plurality of wires 30 can be pulled out in a direction that does not intersect with each other (for example, in a parallel direction), and an electrical short between the wires 30 can be prevented.
[0028]
As a second modification, as shown in FIG. 5, the plurality of wires 30, 36 may be formed to cross each other. In the example shown in FIG. 5, a plurality of wires 30 and 36 cross each other below a region (a region where the wiring 21 passes) between the first and second electrical connection portions 22 and 26. The plurality of wires 30 and 36 may be drawn in directions orthogonal to each other. The wire 30 is out of contact with the wire 36. For example, the loop height of the wire 30 may be higher than the loop height of the wire 36. Note that, apart from the example shown in FIG. 5, three or more wires may cross each other. According to this, further multilayer wiring becomes possible, and the degree of freedom in designing the wiring board is further improved.
[0029]
As a third modification, as shown in FIG. 6, a wire 50 including a conductive wire (for example, a gold wire) 52 and an insulating coating (for example, a resin coating) 54 that covers the surface of the conductive wire 52 may be used. . More specifically, the wire 50 has a peripheral surface of the conductive wire 52 covered with an insulating coating 54. According to this, since the conductive wires 52 can be insulated, for example, the sealing portion 42 can be omitted, and thereby the flexibility of the substrate 10 can be greatly improved. Therefore, the substrate 10 is easily bent.
[0030]
At each end of the first and second electrical connection portions 22 and 26 of the wire 50, the conductive wire may be exposed. In that case, as shown in FIG. 7, the sealing portion 44 may seal each end (bonding portion) of the wire 50. The sealing portion 44 is also provided in the first and second through holes 12 and 16. The sealing section 44 may also seal each of the first and second electrical connection sections 22 and 26. By doing so, it is possible to prevent electrical short-circuiting of the wire 50 and the like, and to improve the reliability of mechanical connection between the wire 50 and the electrical connection portion. Further, since the flexibility of the substrate 10 is improved as compared with the case where the entire wire 50 is sealed, for example, the substrate 10 is easily bent.
[0031]
As a fourth modification, as shown in FIG. 8, the wire 30 may be formed on the side of the substrate 10 opposite to the wiring pattern 20, and the wire 130 may be formed on the side of the wiring pattern 20 of the substrate 10. That is, the wires 30 and 130 as jumper components may be provided on both surfaces of the substrate 10. In the example shown in FIG. 8, one end of the wire 130 is bonded to the surface of the third electrical connection 122 facing away from the substrate 10, and the other end of the wire 130 is connected to the fourth electrical connection 122. The bonding portion 126 is bonded to the surface facing the opposite side to the substrate 10. As shown in FIG. 8, the wires 30 and 130 may be drawn out in a direction that does not intersect with each other (for example, a parallel direction), or may be drawn out in a direction that intersects with each other (for example, an orthogonal direction). According to this, since both surfaces of the substrate 10 can be used, further multi-layer wiring becomes possible, and the degree of freedom in designing the wiring substrate is further improved.
[0032]
(Method of Manufacturing Wiring Board / Method of Manufacturing Semiconductor Device)
In the method of manufacturing a wiring board according to the present embodiment, one end of a wire 30 is bonded to a first electrical connection portion 22 of a wiring pattern 20 on a substrate 10, and a second electrical connection portion is formed. The other end of the wire 30 is bonded to 26 (see FIG. 2). Specifically, one end of the wire 30 is bonded to the back surface (the surface facing the substrate 10) of the first electrical connection portion 22 in the first through hole 12, and the other end of the wire 30 is Bonding is performed on the back surface (the surface facing the substrate 10) of the second electrical connection portion 26 in the second through hole 16 (see FIG. 3). Thereafter, the wire 30 is sealed if necessary (see FIG. 2). Further, a semiconductor device may be manufactured by mounting a semiconductor chip on the above-described wiring board. The plurality of through holes (first and second through holes 12, 16) of the substrate 10 can be formed by punch, laser, or chemical means. In addition, it is preferable to perform plating (nickel plating and gold plating) on portions of the wiring pattern 20 that are exposed by the first and second through holes 12 and 16. Note that other matters and effects can be derived from the contents described in the above electronic device, semiconductor device, and wiring board, and thus description thereof is omitted.
[0033]
As an electronic apparatus according to an embodiment of the present invention, FIG. 9 shows a notebook personal computer 1000, and FIG. 10 shows a mobile phone 2000. These electronic devices include the above-described electronic device, semiconductor device, or wiring board.
[0034]
The present invention is not limited to the embodiments described above, and various modifications are possible. For example, the invention includes configurations substantially the same as the configurations described in the embodiments (for example, a configuration having the same function, method, and result, or a configuration having the same object and result). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same operation and effect as the configuration described in the embodiment, or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[Brief description of the drawings]
FIG. 1 is a diagram showing an electronic device according to an embodiment of the present invention.
FIG. 2 is a diagram showing a wiring board according to the embodiment of the present invention.
FIG. 3 is a diagram showing a wiring board according to the embodiment of the present invention.
FIG. 4 is a diagram showing a first modification of the wiring board according to the embodiment of the present invention;
FIG. 5 is a diagram showing a second modification of the wiring board according to the embodiment of the present invention.
FIG. 6 is a diagram showing a third modification of the wiring board according to the embodiment of the present invention.
FIG. 7 is a diagram showing a third modification of the wiring board according to the embodiment of the present invention;
FIG. 8 is a diagram showing a fourth modification of the wiring board according to the embodiment of the present invention.
FIG. 9 is a diagram showing an electronic apparatus according to the embodiment of the present invention.
FIG. 10 is a diagram showing an electronic apparatus according to the embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic device 3 ... Semiconductor device 10 ... Substrate 12 ... 1st through-hole 13 ... 1st through-hole 14 ... 1st through-hole 16 ... 2nd through-hole 17 ... 2nd through-hole 18 ... 2nd Through hole 20 ... wiring pattern 21 ... wiring 22 ... first electrical connection part 23 ... first electrical connection part 24 ... first electrical connection part 26 ... second electrical connection part 27 ... second Electrical connection portion 28 ... second electrical connection portion 30 ... wire 36 ... wire 42 ... sealing portion 44 ... sealing portion 50 ... wire 52 ... conductive wire 54 ... insulating coating 60 ... semiconductor chip 62 ... semiconductor chip 100 ... Electro-optical panel 122 ... First electrical connection part 126 ... Second electrical connection part 130 ... Wire

Claims (16)

A substrate having a plurality of through holes,
A wiring pattern formed on the substrate and having a plurality of wirings and a plurality of electrical connection portions,
A wire for electrically connecting a first electrical connection of the plurality of electrical connections with a second electrical connection provided at a position distant from the first electrical connection; When,
Including
The first electrical connection portion overlaps a first through hole of the plurality of through holes,
The second electrical connection portion overlaps a second through hole of the plurality of through holes,
One end of the wire is bonded to the back surface of the first electrical connection in the first through hole,
A wiring board, wherein the other end of the wire is bonded to a back surface of the second electrical connection portion in the second through hole. The wiring board according to claim 1,
At least one of the plurality of wires is routed through a region between the first and second electrical connections,
A wiring board, wherein the wires are formed so as to straddle the at least one wiring. The wiring board according to claim 1 or 2,
A plurality of the first and second electrical connection portions are provided, respectively;
A wiring board, wherein the wires electrically connect the first and second electrical connection portions. The wiring board according to claim 3,
The plurality of first electrical connection portions are arranged in a plurality of rows, adjacent first electrical connection portions are arranged in a staggered manner,
A wiring board, wherein the plurality of second electrical connection portions are arranged in a plurality of rows, and adjacent second electrical connection portions are arranged in a staggered manner. The wiring board according to claim 3 or 4,
A wiring board, wherein at least two of the plurality of wires are formed to cross each other. The wiring board according to any one of claims 1 to 5,
The wiring board includes: a conductive line; and an insulating coating covering a surface of the conductive line. The wiring board according to any one of claims 1 to 6,
A wiring board further including a sealing portion for sealing the wire. The wiring board according to claim 7,
The wiring board, wherein the sealing portion seals each end of the wire. The wiring board according to any one of claims 1 to 8,
The plurality of electrical connections include at least one select terminal that allows a design change,
A wiring board, wherein one of the first and second electrical connection portions is selected from the at least one select terminal. The wiring board according to any one of claims 1 to 9,
The wiring substrate is a flexible substrate that can be bent. The wiring board according to any one of claims 1 to 10,
The wire is a first wire;
Among the plurality of electrical connection portions, a third electrical connection portion electrically connects a third electrical connection portion and a fourth electrical connection portion provided at a position distant from the third electrical connection portion. Two wires, further comprising:
One end of the second wire is bonded to a surface of the third electrical connection facing away from the substrate;
A wiring substrate, wherein the other end of the second wire is bonded to a surface of the fourth electrical connection portion facing away from the substrate. The wiring board according to any one of claims 1 to 11,
The wiring board, wherein the first and second electrical connection portions are lands having a width larger than that of the wiring. A wiring board according to any one of claims 1 to 12,
A semiconductor chip electrically connected to the wiring pattern,
Semiconductor device including: A semiconductor device according to claim 13,
An electro-optical panel electrically connected to the wiring pattern of the semiconductor device;
Electronic devices including. An electronic apparatus comprising the electronic device according to claim 14. One end of a wire is bonded to a first electrical connection portion of a wiring pattern formed on a substrate having a plurality of through holes and having a plurality of wirings and a plurality of electrical connection portions, Bonding the other end of the wire to a second electrical connection provided at a location remote from the one electrical connection;
The first electrical connection portion overlaps a first through hole of the plurality of through holes,
The second electrical connection portion overlaps a second through hole of the plurality of through holes,
In the bonding step, one end of the wire is bonded to the back surface of the first electrical connection portion in the first through hole, and the other end of the wire is bonded in the second through hole. And a method of manufacturing a wiring board to be bonded to a back surface of the second electrical connection portion.

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