JP2004281668A - Multilayer wiring board and method of manufacturing the same - Google Patents

Abstract

Provided is a multilayer wiring board which has high reliability and can be made compact and the like, and a method of manufacturing the same.
In a configuration of a via connection type multilayer wiring board in which projecting conductive bumps (26) penetrate interlayer insulators (24, 25) and connect wiring pattern layers (21, 22, 23), projecting conductive bumps (26) are formed. The bump 26 has a structure having at least one flange-like protrusion 26a on the outer peripheral surface, and the flange-like protrusion 26a is engaged with the interlayer insulators 24 and 25 in an integrated manner. A conductive bump group is formed by screen printing, a first insulator layer thinner than the height of the bump is arranged and laminated on the bump formation surface, and pressure is applied in the laminating direction to penetrate and expose the insulator. Conductive bumps are printed and overlapped by aligning with the tip surface, and an insulator layer thinner than the height of the bumps is arranged and laminated on the bump formation surface, and the outer periphery is repeatedly formed by pressing and penetrating the insulator. Means for providing a flange-shaped protrusion on the surface is provided.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a highly reliable high-density wiring type multilayer wiring board and a method for manufacturing the same.
[0002]
[Prior art]
As electronic devices such as mobile phones and personal computers become shorter, lighter and thinner, wiring boards for forming electric circuits are required to not only have higher density wiring and shorter, lighter and thinner, but also to have improved circuit reliability. ing. In response to such demands, multilayer wiring boards having different main components, which are shown in enlarged cross-sectional views in FIGS. 5 and 6, have been developed. That is, the wiring patterns 1, 2, and 3 are arranged and arranged in a multi-layer manner with the insulator layer 2 interposed therebetween, and the wiring patterns 1, 2, and 3 are projected conductors that penetrate the interlayer insulator layers 4a and 4b ( A multilayer wiring board having a via connection structure connected by conductive bumps 5 is known (see Patent Documents 1 and 2).
[0003]
In addition, means corresponding to the multilayer wiring board having the above configuration has been developed as schematically shown in FIG. That is, first, as shown in FIG. 7A, a support (for example, a copper foil having a thickness of about 9 to 36 μm) 6 is prepared, and a conductive surface is formed on the bump forming surface 8 of one main surface of the copper foil support 6. The conductive composition (for example, silver paste) is screen-printed to form conductive bumps 7a. Next, when the bumps 7a are dried, the bumps 7a are aligned with the formed bumps 7a, and a silver paste is screen-printed again, and the bumps 7b and 7c are sequentially stacked as shown in FIGS. 7B and 7C. Forming (building up). Here, the print formation of the conductive bumps 7a and the like is usually repeated a plurality of times, depending on the composition of the conductive composition, the dimensions of the bump diameter and the height, and the like.
[0004]
After the formation of the projecting conductive bumps 7, as shown in FIG. 7D, a first thermoplastic insulating layer (for example, a liquid crystal polymer sheet) 9 and a copper layer having a thickness of about 18 μm are formed on the bump forming surface 8. A foil 10 and a press forming plate (for example, a stainless plate) or a roll 11 are sequentially arranged and laminated, and heated and pressed in the laminating direction. By this heating and pressurization, the tip of the bump 7 penetrated the liquid crystal polymer sheet 9 and came into contact with and deformed the copper foil 10 as shown in FIG. A double-sided copper foil-laminated sheet is obtained.
[0005]
Next, after the copper foils 6 and 10 of the double-sided copper foil-bonded sheet are subjected to photoetching treatment to form wiring patterns 6a and 10a, as shown in FIG. The protruding conductive bumps 12a are formed by the same means as the bumps 7, and the conductive bumps 12b and 12c are successively overlaid by overlapping. The copper foils 6 and 10 may be subjected to the photoetching process only at the surface 13 on which the conductive bumps 12 are formed without being simultaneously performed, and the copper foil 6 may be subjected to the photoetching process at the final outer surface wiring patterning stage. .
[0006]
Thereafter, a second thermoplastic insulating layer (for example, a liquid crystal polymer sheet), a copper foil having a thickness of about 18 μm, and a pressing plate (for example, a stainless steel plate) or a roll are formed on the surface on which the bumps 12 are formed in accordance with the above operation. While the layers are sequentially arranged and laminated, a stainless steel plate for pressing is also applied to the wiring pattern surface side, and heating and pressing are performed in the laminating direction. By this heating and pressurization, the tip portion of the bump 12 penetrates the liquid crystal polymer sheet, abuts on the copper foil, and is deformed to obtain a copper foil bonded wiring sheet in which electrical connection is made. The copper foil of the copper foil-bonded wiring sheet thus obtained is subjected to a photoetching treatment to form a wiring pattern, thereby obtaining a three-layer wiring board shown in FIG.
[0007]
In the above, the means for manufacturing the multilayer wiring board shown in FIG. 5 has been described. However, in the case of the multilayer wiring board shown in FIG. 6, basically the same operation is repeated.
[0008]
[Patent Document 1]
JP-A-2000-332369 (page 2, FIG. 3)
[0009]
[Patent Document 2]
JP-A-2002-198628 (page 2, FIG. 3)
[0010]
[Problems to be solved by the invention]
In the via connection type multilayer wiring board, the interlayer connection between the wiring patterns 1, 2, 2, and 3 is performed by pressing and penetrating the conductive bumps, so that high-density wiring and simplification of the manufacturing process are performed. There is an advantage that it can be achieved. In other words, perforations such as drilling can be omitted in connection between wiring pattern layers, and not only is plating treatment in the perforations or filling operation of the conductive composition unnecessary, but also fine and highly reliable via connection. Can be achieved. In particular, in via connection of fine diameter, which is desired for high-density wiring, it is difficult to reliably form a dense and uniform plating layer in a small-diameter hole, or it is difficult to form a dense conductive layer in a small-diameter hole. It is possible to easily and surely solve the problem that it is difficult to fill the conductive composition. Therefore, the via connection type multilayer wiring board and the manufacturing method thereof are receiving attention from the viewpoint of practicality.
[0011]
However, there are concerns about the following problems in terms of mass productivity and practicality. As shown in FIG. 7, first, the conductive bumps 7 and 12 for forming the via connection are formed on the conductive bumps 7a, the overlapping bump layers 7a and 7c, and the conductive bumps 12a by the screen printing a plurality of times. While the layers 12b and 12c are overlaid to secure the height, the bump diameter is regulated and set in consideration of the wiring density. Here, it is not easy to always align the overlapping bump layer with the conductive bumps 7 and 12 with high precision and to overlap them coaxially. In other words, the printed multilayer bumps 7 and 12 may be deviated depending on their height and diameter (fine diameter), so that the interlayer insulator 9 is obliquely inserted or inserted. In the process, the via connection may be broken, and as a result, the reliability of the via connection may be impaired.
[0012]
Next, the conductive bumps 7 and 12 for forming the via connection are in a so-called conical shape, and are in smooth contact and connection with the adjacent interlayer insulator. That is, since the connection is non-engaged with the interlayer insulator, the bonding strength may be insufficient, and there is a concern about reliability in terms of electrical and mechanical aspects. In any case, in the current situation where high-density wiring and compact wiring boards are required, for example, for a conductive bump for forming a via connection, it is possible to easily secure a required height with a fine diameter, It is desired that the conductive bumps can easily secure a certain shape, and can easily form an engaging contact and a joint with an interlayer insulator.
[0013]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a multilayer wiring board which is highly reliable and can be made compact and the like, and a method of manufacturing the same.
[0014]
[Means for Solving the Problems]
According to the present invention, in the configuration of a via connection type multilayer wiring board in which projecting conductive bumps penetrate an interlayer insulator and connect wiring pattern layers, at least one flange-like projecting conductive bump is formed on the outer peripheral surface. A multilayer wiring board having a structure having a projection, wherein the flange-shaped projection is engaged with an interlayer insulator to be integrated.
[0015]
Further, according to the present invention, in the via connection type multilayer wiring board having the above-described configuration, a fine and highly reliable conductive bump having a flange-shaped protrusion on the outer peripheral surface can be easily formed and provided. It is a manufacturing method. That is, a conductive composition is screen-printed on the surface of a support to form a group of projecting conductive bumps, and a first insulator layer (thermoplastic or thermosetting) having a thickness smaller than the height of the bumps is formed on the surface on which the bumps are formed. ) Is arranged and laminated; a pressurized forming plate or roll is arranged on the insulator layer surface, pressure is applied in the laminating direction, and the insulator is inserted so as to abut and deform the tip of the bump against the forming plate or roll; Conductive printing is performed by screen-printing a conductive composition by aligning it with the tip surface of the bump exposed on the insulator surface, and overlaying the conductive bumps.Place an insulator layer thinner than the bump height on the bump formation surface and laminate This is a manufacturing method characterized by having a means for providing a flange-shaped protrusion on the outer peripheral surface by repeatedly inserting an insulator so as to press and deform the tip of the bump into contact with the surface of the pressed body.
[0016]
With the adoption of such a configuration, for example, a projection-like bump having a diameter of 100 μm or less and a height of 200 μm or more and having no bending can be formed, and can be engaged with a penetrating insulator layer (wedge type). It exhibits good adhesion strength due to the bonding. That is, since the height of the bump can be set arbitrarily regardless of the diameter of the conductive bump forming the via connection, a high-density wiring pattern and a highly reliable circuit can be achieved. In other words, it is possible to provide a high-density wiring or a multi-layer wiring board for mounting with high functionality and high reliability and a high-yield multilayer wiring board in mass production, while achieving a reduction in length and size.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1, 2, 3A to 3E, and 4A to 4D.
[0018]
FIG. 1 is an enlarged cross-sectional view illustrating a main part of the multilayer wiring board according to the first embodiment. In the multilayer wiring board according to this embodiment, insulators (for example, prepregs containing liquid crystal polymer and glass cloth) 24 and 25 are used as interlayer insulators, and wiring patterns 21, 22 and 23 are installed, while the interlayer insulator is inserted. A configuration in which the vias are connected between the wiring patterns 21, 22, and 23 by the conductive bumps 26 is employed. In this configuration, the conductive bump 26 forming the via connection has at least one flange-shaped protrusion 26a on its outer peripheral surface, and the flange-shaped protrusion 26a engages with the interlayer insulators 24 and 25. It is characterized by being integrated. That conductive bumps are formed by stacking in Figure 1 bump unit ₂₆ and the bottom surface in a trapezoidal cross section as shown in (b) and the flange-like projection _{26a 1, 26 2, 26 3} , 26 4.
[0019]
Here, between the wiring patterns 21, 22, and 23, projecting conductive bumps 26 projecting integrally from the corresponding wiring patterns 21, 22 penetrate through the interlayer insulators 24, 25 to provide a required electrical connection. Connections are made. That is, the interlayer insulators 24 and 25 are coaxially superimposed and printed in a substantially conical or pyramid shape so that the front end side of the flange-shaped protrusion penetrates the outer peripheral surface formed in a protruding shape. 22 or 22 and 23 are electrically connected. The wiring patterns 21, 22, and 23 are generally formed by photo-etching a copper foil or the like, but are selectively formed by screen printing of a conductive paste or printing and patterning of a plating resist. It may be formed by means such as appropriate plating. The insulators 24 and 25 forming the interlayer insulator are, for example, liquid crystal polymers each having a thickness of about 25 to 100 μm (for example, a BIAC film having a melting point of 335 ° C.).
[0020]
FIG. 2 is an enlarged cross-sectional view illustrating a main part of the multilayer wiring board according to the second embodiment. The wiring board 30 of this embodiment is different from that of the first embodiment in that the shape of the cross section in the axial direction of the conductive bump 31 forming the via connection is changed. Indicates the same part, and the description is omitted.
[0021]
That is, while the structure of the multilayer wiring board having the structure shown in FIG. 1 is a stacked structure of the conductive bumps 26 having the trapezoidal bump units 26 ₁ , 26 ₂ ..., The trapezoidal bump units 31 ₁ , 31 are provided. ₂ is a so-called abacus ball-shaped or pin-wound-shaped stacked structure in which the bottom faces are in contact with each other, and have a large-diameter region 31a and a small-diameter region 31b as shown in FIG. It is structured to form an engagement joint with the bodies 24 and 25.
[0022]
In the wiring board according to each of the above embodiments, the insulator forming the interlayer insulators 24 and 25 of the multilayer wiring board is represented by, for example, Xidal (trade name, manufactured by Dartco) and Vectra (trade name, manufactured by Clanese). And multi-axis oriented liquid crystal polymers and polyether polymers. As the liquid crystal polymer, Vectran A type (melting point: 285 ° C.), Vectran C type (melting point: 325 ° C.), BIAC film (melting point: 325 ° C.), and the like are commercially available. Here, the liquid crystal polymer generally has little hygroscopicity, a dielectric constant of about 3.0 (1 MHz), and excellent high-frequency characteristics, and thus exhibits high-speed signal transmission stability.
[0023]
Further, the conductive bumps 26 and 31 constituting the via connection are made of a mixed system of a conductive metal powder such as gold, silver, copper, nickel and solder and a binder resin. Here, examples of the binder resin include a polycarbonate resin, a polysulfone resin, a polyester resin, a phenoxy resin, a phenol resin, and a polyimide resin.
[0024]
Next, a method for manufacturing a multilayer wiring board according to the first embodiment will be described with reference to FIGS. 3A to 3E schematically showing an embodiment.
[0025]
First, as shown in FIG. 3 (a), a copper foil 21a having a thickness of about 18 μm is prepared, and a metal mask having a hole of 100 μm in a predetermined position of, for example, a stainless steel sheet is positioned on one principal surface thereof. a conductive paste is screen printed arranged to form a cross section conical conductive bump 26 _1. After the conductive bump 261 is dried, 3 (b), the conductive bumps 26 ₁ forming surface, a thin insulating sheet such as a liquid crystal polymer film 24 ₁ in comparison with the conductive bumps 26 ₁ of the height, A press forming plate (for example, a stainless steel plate) or a roll 32 is sequentially stacked and arranged, and if necessary, a press forming plate or roll is also arranged on the copper foil 21a side, and pressure is applied in the laminating direction while heating.
[0026]
This heat and pressure, the conductive bumps 26 ₁ tip inserted through a liquid crystal polymer sheet 24 ₁ is deformed into a flat surface in contact with the molding plate 6 faces. That is, the tip portion of the liquid crystal polymer sheet 24 ₁ having a thickness of highly conductive bumps 26 ₁ compared to is collapsed manner with contact pressure圧当the forming plate or roll 32 surface is flattened, the same liquid crystal polymer sheet 24 ₁ Surface. Then, as shown in FIG. 3 (c), aligned with the bumps 24 ₁ tip surface which is exposed to the liquid crystal polymer sheet 24 _first face, a conductive composition is screen-printed to form superimposed conductive bumps 26 ₂ . Conductive bumps 26 ₂ After drying, the conductive bump 26 ₂ formed plane 24a, a thin liquid crystal polymer film 24 2 in comparison with the height of the conductive bump 26 _2, and the molded plate or sequentially laminating roll 32 for pressurization It is arranged, and if necessary, a press forming plate or roll 33 is also arranged on the copper foil 21a side, and pressurization is performed in the laminating direction while heating. This heat and pressure, the conductive bumps 24 ₂ tip inserted through a liquid crystal polymer sheet 24 ₂ is deformed into a flat surface in contact with the molded plate or roll 32 surface. That is, the tip portion of the liquid crystal polymer sheet 24 _second compared to the thickness high conductive bumps 26 _2, contact pressure圧当the forming plate or roller 32 faces to the same surface of the liquid crystal polymer 24 ₂ as crushed flat.
[0027]
Then, the above operation is repeated as appropriate, and the conductive bumps 263 and 264 are sequentially stacked coaxially to form the conductive bump 26 having the flange-shaped protrusion 26a on the outer peripheral surface constituting the required via connection. At the final stage of forming the conductive bumps 26 or after the formation, for example, a copper foil 22a and a forming plate or roll for pressing are arranged and pressed in the laminating direction while heating, so that both surfaces as shown in FIG. The copper foil 21a, 22a upholstered board (sheet) is manufactured. At least one of the copper foils 21a of the double-sided copper foils 21a and 22a is subjected to a photo-etching process to perform wiring patterning.
[0028]
A conductive bump 26 penetrating an interlayer insulator as shown in FIG. 3E is formed on the surface of the wiring pattern 21 on which the wiring pattern is formed by the same means as described above. That is, the pressure of the overlapped printing form and the liquid crystal polymer 24 ₁ conductive bump 26 _1, transmural interpolation of the tip, the conductive bumps _{26 2,} 26 3, 26 ₄ of overprint formed, liquid crystal polymers the respective printing form overlay of 24 _{2, 24} 3, 24 _4, by pressure, they conductive bumps _{26 2,} 26 3, 26 ₄ transmural interpolation of the tip, and interior wiring pattern 21 as shown in FIG. 3 (e), Further, a copper foil clad board having a structure in which the wiring pattern 21 and the wiring pattern 21 are electrically connected to each other by a via connection is manufactured, and the remaining outer surface copper foils 21a and 23a are subjected to a photoetching treatment, whereby the structure shown in FIG. A multilayer wiring board having the structure as shown in the figure is obtained.
[0029]
Next, a method for manufacturing a multilayer wiring board according to the second embodiment will be described with reference to FIGS. 4A to 4D schematically showing an embodiment.
[0030]
First, a sheet having a good releasability having a thickness of about 100 μm is prepared, and a metal mask having a hole with a diameter of μm drilled at a predetermined position of, for example, a stainless steel sheet is positioned and arranged on one principal surface thereof, and the conductive paste is applied. by screen printing to form a cross section conical conductive bump 31 _1. After the conductive bumps 31 ₁ is dried, as shown in FIG. 4 (a), the conductive bumps 31 ₁ formed surface, the conductive bumps 31 ₁ of the height thin liquid crystal polymer film 24 ₁ in comparison with the copper foil 22a A press forming plate or roll (not shown) is arranged on both main surfaces, and pressurized in the laminating direction while heating.
[0031]
This heat and pressure, the conductive bumps 31 ₁ tip inserted through a liquid crystal polymer sheet 24 ₁ is deformed into a flat surface in contact with the copper foil 22a face. That is, the tip portion of the liquid crystal polymer sheet 24 ₁ having a thickness higher conductive bump 31 as compared to is _1, then crushed in contact with the copper foil 22a face pressure圧当to flatten, to flush of the liquid crystal polymer 24 _1. Then, as shown in FIG. 4 (b), by a sheet 34 is peeled off, aligned with the bumps 31 ₁ bottom surface exposed to the liquid crystal polymer 24 ₁ side, the conductive conductive composition was screen-printed bumps 31 ₂ to the superposition formation.
[0032]
After the conductive bump 31 ₂ drying, the conductive bump 31 ₂ forming surface, conductive bumps 31 _second height thin liquid crystal polymer film 24 2 in comparison _to, and sequentially laminated to place the molded plate or roll pressurization If necessary, a press forming plate or roll is also arranged on the copper foil 22a side, and pressurization is performed in the laminating direction while heating. This heat and pressure, the conductive bumps 31 ₂ tip transmural insert the liquid crystal polymer sheet 24 ₂ is deformed into a flat surface in contact with the molded plate or roll surface. That is, the tip portion of the liquid crystal polymer sheet 24 _second compared to the thickness highly conductive bump 31 _2, crushed becomes flat against pressurized圧当the forming plate or roll surface, as shown in FIG. 4 (c), fabricating a single-sided copper foil 22a-clad board (sheet) 35 which is a liquid crystal polymer 24 ₂ same roughening.
[0033]
Next, the two single-sided copper foils 22a prepared as described above are provided with two upholstered plates (sheets) 35 and 36, and the corresponding conductive bumps are positioned and laminated so as to face each other. integrated by thermal fusion of the liquid crystal polymer 24 ₂ between which, to manufacture a double-sided copper foil clad laminate (sheet) 35-36 as shown. Thereafter, at least one of the copper foils 22a of the double-sided copper foil-clad sheet is subjected to a photo-etching treatment to perform wiring patterning.
[0034]
Subsequently, in the next final step, the structure shown in FIG. 2 is manufactured. A single-sided copper-clad board 35 of FIG. 4C is attached to one surface of the wiring pattern 22a, and the copper foil 22a is etched to form the wiring pattern 23. can get.
[0035]
In addition, the structure of FIG. 2B can be formed on FIG. 4D. That is, pressure on top of the conductive bump 32 ₂ of printing form and the liquid crystal Porimashito 25, transmural interpolation, conductive bumps 32 ₂ formed by printing, pressing by overlapping a liquid crystal polymer 25, conductive bumps 32 ₂ the tip of the tip portion The structure is such that the connection with the wiring pattern is electrically connected by via connection by inserting the part.
[0036]
Thus was furnished a wiring pattern 22 fabricated, and to interconnect workpieces exposed conductive bump 32 ₂ on one main surface, the single-sided copper foil-clad positioned arranged sheet (23), and heating and pressing treatment Then, a copper foil-clad board is manufactured by integrating the copper foil boards 21 and 23 on the remaining outer surface with a photo-etching treatment to form a wiring pattern 23. A multilayer wiring board having a structure as shown in FIG. can get.
[0037]
The present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. For example, the number of built-in wiring patterns may be a three-layer type or a multi-layer type of five or more layers, and a combination of a liquid crystal polymer and an insulator can be appropriately selected according to the application.
[0038]
【The invention's effect】
According to the present invention, a via connection having a diameter of 100 μm or less and a height of 200 μm or more that does not bend is formed, and is joined (wedge-shaped) to an insulator to be inserted to exhibit good adhesion strength. A multilayer wiring board can be provided. That is, irrespective of the diameter of the conductive bump forming the via connection, the height of the bump can be set and selected arbitrarily, and since it has a via connection structure with high electrical and mechanical reliability, It is possible to provide a high-density wiring pattern and a highly reliable multilayer wiring board with high yield. In other words, it is possible to provide a high-density wiring or a multi-layer wiring board for mounting with high functionality and high reliability, and a multi-layer wiring board with high yield in mass production, while achieving a reduction in length and size.
[Brief description of the drawings]
FIGS. 1A and 1B are cross-sectional views showing, on an enlarged scale, main components of a multilayer wiring board according to a first embodiment.
FIGS. 2A and 2B are cross-sectional views showing, on an enlarged scale, main components of a multilayer wiring board according to a second embodiment.
FIGS. 3A to 3E are cross-sectional views schematically showing an embodiment of a method for manufacturing a multilayer wiring board according to the first embodiment.
FIGS. 4A to 4D are cross-sectional views schematically showing an embodiment of a method for manufacturing a multilayer wiring board according to a second embodiment.
FIG. 5 is an enlarged cross-sectional view showing a configuration of a main part of a conventional multilayer wiring board.
FIG. 6 is an enlarged sectional view showing the configuration of another main part of a conventional multilayer wiring board.
FIGS. 7A and 7F are cross-sectional views schematically showing an embodiment of a conventional method for manufacturing a multilayer wiring board.
[Explanation of symbols]
20: multilayer wiring board 21, 22, 23: wiring pattern 21a, 22a: copper foil 24, 25: insulating layer _{24 1,} 24 _2, 24 3, 24 _4: liquid crystal polymer film 26: conductive bump ₂₆ 1, 26 ₂ , 26 ₃ , 26 ₄ : trapezoidal bump unit 26a: brim-shaped projection 31 of conductive bump: conductive bump

Claims (6)

A multilayer wiring board having a via connection structure in which wiring patterns are arranged in multiple layers with an interlayer insulating layer interposed therebetween, and the wiring patterns are connected by projecting conductors penetrating the interlayer insulating layer,
The protrusion-shaped conductor forming the via connection structure has at least one flange-shaped protrusion on the outer peripheral surface, and the flange-shaped protrusion is engaged with and integrated with the interlayer insulator layer. Multilayer wiring board. A step of screen-printing the conductive composition on the support surface to form a conductive bump group,
Placing and laminating a first insulator layer thinner than the height of the bump on the bump formation surface;
A step of arranging a press forming plate or roll on the thermoplastic insulator layer surface, pressing in the laminating direction, and penetrating the first insulator layer so as to abut a bump tip on the forming plate or roll; and ,
Removing the forming plate or roll, aligning the bump tip exposed on the first insulator surface, screen-printing a conductive composition, and superposing and forming a conductive bump;
A step of arranging and laminating a second insulator layer thinner than the height of the bump on the overlapping bump formation surface;
A pressurized forming plate or roll is arranged on the second insulator layer surface, and the second insulator is inserted so as to press the stacked bump tips by pressing in the laminating direction and contact the formed plate or roll. Process and
Step of removing or patterning the support plate by removing the forming plate or roll,
A method for manufacturing a multilayer wiring board, comprising: A step of screen-printing a conductive composition on the bump-forming surface of the support to form a group of conductive cone-shaped bumps,
Placing and laminating a first insulator layer thinner than the height of the bump on the bump formation surface;
A first molding plate or roll for pressing is arranged on the surface of the first insulator layer, and is pressed in the laminating direction so that a tip end of the bump abuts on the first molding plate or roll. A step of penetrating the layers,
Removing the support, aligning the bottom surface of the bump exposed on the first insulator surface with a conductive composition, screen-printing the conductive composition, and superposing and forming a conductive conical bump;
A step of arranging and laminating a second insulator layer thinner than the height of the bump on the overlapping bump formation surface;
A second molding plate or roll for pressing is arranged on the surface of the second insulator layer, and a tip end portion of the bumps pressed and laminated in the stacking direction is brought into contact with the second molding plate or roll to form a second insulating plate. A step of penetrating the body layer,
Removing the first and second forming plates or rolls;
A method for manufacturing a multilayer wiring board, comprising: 4. The method for manufacturing a multilayer wiring board according to claim 2, wherein the first and second insulator layers are liquid crystal polymer-based thermo-resin films. The method for manufacturing a multilayer wiring board according to claim 2, wherein the support is a conductive metal foil. 6. The method for manufacturing a multilayer wiring board according to claim 2, wherein the conductive bumps formed by each screening printing are substantially conical with a bottom diameter of 100 [mu] m or less.

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