JP2004259931A - Resin sealing molding method - Google Patents

Abstract

An object of the present invention is to generate static electricity on a brush when the brush scrapes off resin debris or foreign matter remaining on upper and lower mold surfaces, whereby resin debris or foreign matter adheres to the brush, and the base moves up and down. Each time the mold reciprocates, the amount of resin dust and foreign matter adhering to the brush increases, and eventually, the resin dust and foreign matter is scattered on the mold surface.
A brush is inserted between a pair of upper and lower molds, and a brushing step of scraping off foreign matter remaining on the mold with the brush, a suction step of sucking the scraped foreign matter into a suction port, and ionizing the brush And a static elimination step of spraying air to eliminate static.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
TECHNICAL FIELD The present invention relates to a method for resin-sealing and molding an electronic component.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, as a method of removing resin debris or foreign matter generated in a molding die when resin sealing an electronic component such as a diode or an IC, discharge air from an air discharge port to remove resin debris or foreign matter. There is a device that removes resin dust and foreign matter that are removed from a suction port (for example, see Patent Document 1). FIG. 2A shows a conventional resin sealing molding method described in Patent Document 1. In FIG. 2A, 101 is a base portion, 102 is a slide, 103 is a brush, 104 is an air suction nozzle, 105 is an air discharge nozzle, 106 is an air cylinder, 107 is a slide guide, 108 is an upper die, and 109 is The lower mold 110 is a mold cavity.
[0003]
This type of resin sealing molding method includes a base portion 101 as a main body and an air cylinder 106 connected to one side surface of the base portion 101. A plurality of brushes 103 and air suction nozzles 104 are provided in parallel at the upper and lower ends of the base portion 101, respectively. The nozzle 105 is mounted. The air cylinder 106 is driven to expand and contract to reciprocate the base 101 in the horizontal direction. In order to obtain a stable horizontal reciprocation of the base 101, two slide guides 107 are arranged on both sides of the lower surface of the base 101 in parallel with the air cylinder 106.
[0004]
When the above-described resin sealing molding die is removed by using the cleaning method having such a configuration, first, as shown in FIG. When the mold 108 and the lower mold 109 are opened, the fixed air cylinder 106 is driven by the inflow of air from the compressor to move the brush 103 of the base 101 so as to pass between the upper and lower molds. The removal is performed by utilizing the horizontal reciprocating movement of the base 101. The resin dust and foreign matter adhering to the mold cavities 110 in the opposing surfaces of the upper and lower molds are scraped off by the brush 103 while reciprocating the base 101, and scattered by the air blown out from the air discharge nozzle 105. Thus, floating resin dust and foreign matter are removed by suction from the air suction nozzle 104.
[0005]
[Patent Document 1]
JP-A-10-202669
[Problems to be solved by the invention]
In the above-described conventional configuration, when the brush 103 scrapes off resin dust and foreign matter remaining on the upper and lower mold surfaces, static electricity is generated on the brush 103, thereby causing resin dust and foreign matter to adhere to the brush 103. However, each time the base portion 101 reciprocates between the upper and lower molds, the amount of resin dust and foreign matter adhering to the brush 103 increases, and eventually there is a problem that the resin dust and foreign matter is scattered on the mold surface. Was.
[0007]
The present invention solves the above-mentioned conventional problems, and cleans resin dust and foreign matter without remaining the resin dust and foreign matter that the brush 103 rubs off from the upper and lower mold surfaces on the brush 103 by static electricity. It is an object of the present invention to provide a resin encapsulation molding method that facilitates resin molding.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a resin sealing molding method according to the present invention includes a resin sealing step of resin-encapsulating a lead frame on which an electronic component is mounted using a pair of upper and lower dies, and a lead from the resin-cured mold. A removing step of removing the frame, a brushing step of inserting a brush between a pair of upper and lower molds and scraping off foreign substances remaining on the mold with the brush, and a suction step of sucking the scraped foreign substances into a suction port, And a charge removing step of discharging the brush with ionized air to remove the charge.
[0009]
According to this, it is possible to eliminate static electricity generated when removing resin dust and foreign matter remaining in the mold, and to prevent scattering and floating of resin dust and foreign matter.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a side view showing a resin sealing molding method, and FIG. 1B is a side view showing an operation of a base portion in FIG. 1A. 1 (a) and 1 (b), 1 is a base portion as a main body, 2 is a brush provided on the base portion, 3 is a suction port for sucking resin dust and foreign matter, and 4 is a rubber made of urethane resin material. Reference numeral 5 denotes an ion generator having a charge eliminating effect, 6 denotes an ionized air discharge nozzle for discharging air ionized by the ion generator 5, 7 denotes a suction device which is connected to the suction port 3 and suctions resin dust and foreign matter, 8 Is an upper mold for resin-molding a lead frame (not shown) on which electronic components (not shown) are mounted, and 9 is a resin mold for sealing a lead frame (not shown) on which electronic components (not shown) are mounted. This is a lower mold to be fixed.
[0011]
The detailed configuration will be described below. A brush 2 made of polyphenylene sulfide is provided on both upper and lower surfaces of the base 1 in a direction perpendicular to each surface, and a suction port 3 is formed around the brush 2. Air ionized by the ion generator 5 is blown from the discharge nozzle 6 to the brush 2. According to this, static electricity generated by friction of the brush 2 is removed by ionizing air to prevent resin dust and foreign matter from remaining on the brush 2. Further, rubber plates 4 made of a urethane-based resin material having heat resistance are provided on both upper and lower surfaces of the base portion 1. According to this, it is possible to prevent the resin debris and foreign matter scraping off the foreign matter remaining on the mold from scattering and floating outside the base portion 1. Further, the base unit 1 and the suction device 7 are connected.
[0012]
Next, a resin sealing molding method will be described. When cleaning the resin molding die, first, as shown in FIG. 1, the base 1 is disposed near a pair of molding dies, a lower die 9 and an upper die 8. When the mold 9 and the upper mold 8 are opened, the brush 2 of the base 1 is moved so as to pass between the lower mold 9 and the upper mold 8. Cleaning is performed using the horizontal reciprocating motion of the base 1. That is, resin dust and foreign matter adhering to the respective opposing surfaces of the molding die are rubbed off by the brush 2 while reciprocating the base portion 1 and are removed by suction from the suction port 3 by the suction device 7. . A rubber plate 4 made of a heat-resistant urethane-based resin material is provided on both upper and lower surfaces of the base 1. According to this, it is possible to prevent the resin debris and foreign matter scraping off the foreign matter remaining on the mold from scattering and floating outside the base portion 1.
[0013]
The base 1 that has cleaned the inside of the molding die is pulled out from between the lower die 9 and the upper die 8. At this time, ionized air ionized by the ion generator 5 is blown from the discharge nozzle to the brush 2 to remove static electricity. According to this, the resin dust and foreign matter are prevented from remaining on the brush 2 and are prevented from being scattered in the molding die. Further, the ionized air has an action of ionizing the vicinity of the molding die, and can suppress static electricity generated between the resin sealing molded portion and the molding die.
[0014]
The brush 2 uses horizontal reciprocating motion, and a plurality of rows of brushes can be attached. Cleaning efficiency is further improved by using horizontal reciprocating motion while further applying vibration.
[0015]
As described above, an embodiment of the resin molding method according to the present invention has been described using electronic components, but can be appropriately changed without departing from the spirit of the present invention.
[0016]
【The invention's effect】
As described above, according to the present invention, during cleaning of a molding die, static electricity generated by a brush can be suppressed, and resin dust and foreign matter can be prevented from remaining on the brush. It is possible to prevent quality defects due to chipping of the stop portion or mixing of foreign matter.
[Brief description of the drawings]
1A is a side view showing a resin sealing molding method of the present invention, FIG. 1B is a side view showing operation of a base part of the resin sealing molding method of the present invention, and FIG. FIG. 2A is a side view showing a conventional resin sealing molding method. FIG. 2B is a perspective view showing a conventional resin sealing molding method.
DESCRIPTION OF SYMBOLS 1 Base part 2 Brush 3 Suction port 4 Rubber plate 5 Ion generator 6 Ionized air discharge nozzle 7 Suction device 8 Upper die 9 Lower die 101 Base part 102 Slide 103 Brush 104 Air suction nozzle 105 Air discharge nozzle 106 Air cylinder 107 Slide guide 108 Upper mold 109 Lower mold 110 Mold cavity

Claims (2)

A resin encapsulation process in which a pair of upper and lower molds are used for resin encapsulation on a lead frame on which electronic components are mounted, a removal process of removing the lead frame from the mold after resin curing, and insertion of a brush between the upper and lower molds A brushing step of scraping off foreign matter remaining on the mold with the brush, a suction step of sucking the scraped foreign matter into a suction port, and a charge removal step of spraying ionized air onto the brush to remove charge. Characteristic resin molding method. 2. The method according to claim 1, wherein the brush is made of polyphenylene sulfide.

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