JP2004119993A - Chip bonding equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide chip-bonding equipment that can shorten the unit process time and improve the efficiency of the bonding operation. <P>SOLUTION: The chip-bonding equipment, which uses an ACF8 (an anisotropic conductive material) to bond a chip 3 onto a substrate 1, is equipped with two transfer mechanisms 21, that transfer an ACF to a substrate 1 via a transfer head 23 by using an ACF tape for an ACF transfer station 20, and aligns an alignment pitch of the transfer mechanisms 21 having a pitch P of a transfer object position on the substrate 1 by using a lead-screw mechanism 26. Hence, it is possible to concurrently execute an ACF transfer to plural positions, thus reducing the total unit process time and improving the bonding operation. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a chip bonding apparatus for mounting a chip on a substrate such as a display panel and bonding the chip with an anisotropic conductive agent.

(4) A driver chip is mounted on a substrate such as a display panel. In this mounting operation, first, an anisotropic conductive agent (hereinafter abbreviated as “ACF”) is transferred to a chip mounting position on a substrate, and a chip is mounted on the transferred ACF. Then, by pressing the chip against the substrate under predetermined conditions, the ACF is thermally cured and the chip is fixed to the substrate, and the electrodes of the chip are electrically connected to the electrodes of the substrate.

Such a bonding apparatus generally includes a transfer station for transferring the above-described ACF, a chip mounting station for mounting a chip on the transferred substrate, and holding the mounted chip under predetermined heat and load conditions for a predetermined time. There is provided a pressure bonding station for thermally curing the ACF by doing so, and a transport means for transferring the substrate between the stations. Then, the substrate carried into the transfer station from the upstream is carried out downstream after completing predetermined operations in each station.

作業 By the way, the work mode in each station differs depending on the contents of the work. For example, in the transfer station, the transfer work of the ACF is performed for each mounting position, and in the mounting station, the mounting work is similarly performed for each chip. In the crimping station, a plurality of chips are crimped simultaneously.

Of the operations at each of the above stations, high-speed operation is possible at the mounting station, and multiple simultaneous processing is possible at the crimping station, so the tact time per chip at these stations can be relatively easily reduced. Is possible. On the other hand, in the transfer station, depending on the type of the ACF, it takes a long time to adhere to the surface of the substrate, and generally, the operation time in the transfer operation requires the longest time in the bonding process. For this reason, the delay in the tact time in the transfer station delays the entire tact time, which is a factor that hinders the improvement in the efficiency of the bonding process.

Therefore, an object of the present invention is to provide a chip bonding apparatus capable of shortening the tact time and improving the efficiency of the bonding operation.

The chip bonding apparatus according to claim 1, wherein the chip is bonded to a substrate with an anisotropic conductive agent, wherein the first movable table on which one substrate is mounted is provided. An anisotropic conductive agent transfer unit for transferring an anisotropic conductive agent from an anisotropic conductive tape to which an agent is attached to a transfer target portion of a substrate placed on the first movable table; A second movable table on which one substrate on which the agent has been transferred is mounted, a chip mounting portion for mounting a chip on the substrate mounted on the second movable table, and the first movable table A transfer arm for transferring the substrate to the second movable table, wherein the anisotropic conductive agent transfer unit is configured to transfer two different transfer target portions of one substrate placed on the first movable table. Anisotropic conductive tape is And a transfer mechanism 2 groups of transferring the anisotropic conductive adhesive is pressed into.

A chip bonding apparatus according to a second aspect of the present invention is the chip bonding apparatus according to the first aspect, further comprising a pitch adjusting unit that relatively aligns an arrangement pitch of the two transfer mechanisms with a pitch of a transfer target portion. .

According to a third aspect of the present invention, in the chip bonding apparatus of the first aspect, a third movable table on which a substrate on which the chip is mounted is mounted, and the third movable table is mounted on the third movable table. An elevating / lowering mechanism for pressing and heating a chip mounted on the substrate by a pressure bonding head to bond the chip to the substrate, and a transfer arm for transferring the substrate from the second movable table to the third movable table are provided.

According to the present invention, the transfer of the anisotropic conductive agent can be performed at two places at the same time, the overall tact time can be shortened, and the efficiency of the bonding operation can be improved.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention, FIG. 2 is a front view of the chip bonding apparatus, FIG. 3A is a perspective view of an ACF transfer station of the chip bonding apparatus, 3B is a partial front view of a transfer mechanism of the chip bonding apparatus, FIG. 4 is a perspective view of a mounting station of the chip bonding apparatus, and FIG. 5 is a perspective view of a pressure bonding station of the chip bonding apparatus. 6 is a partial front view of the bonding apparatus for the same chip.

First, the structure of the chip bonding apparatus will be described with reference to FIGS. 1 and 2, an ACF transfer station 20 (anisotropic conductive agent transfer section), a mounting station 30 (chip mounting section), and a pressure bonding station 40 are arranged in series on the upper surface of the base 10. The mechanical units constituting each of these work stations are held by a frame 11 arranged on a base 10.

The ACF transfer station 20, the mounting station 30, and the crimping station 40 include a first movable table 12A, a second movable table 12B, and a third movable table 12C, respectively. These movable tables have the same structure, and are configured by stacking a Y table 13, an X table 14, and a θ table 15.

A supply table 2 for the substrate 1 is provided upstream of the ACF transfer station 20 (left side in FIG. 1). A moving table 5 is provided on the upper surface of the base 10 in the longitudinal direction, and the transfer arm 6 reciprocates along the moving table 5. The substrate 1 positioned on the supply table 2 is picked up by the suction pad 7 of the transfer arm 6 and transferred downstream along the transfer path N. The transported substrate 1 is placed on the θ table 15 of each of the movable tables 12A, 12b, and 12C that has moved to the transport path N. Then, in each of the above-described work stations, a chip bonding operation is performed. The substrate 1 on which bonding has been completed is placed on the collection table 4 downstream (right side in FIG. 1) of the pressure bonding station 40 and collected.

Next, each work station will be described with reference to the drawings. First, the ACF transfer station 20 will be described with reference to FIGS. Two transfer mechanisms 21 are mounted on the block 20a held by the frame 11 (see FIG. 1). The transfer mechanism 21 includes a supply reel 22 and a transfer head 23. The supply reel 22 supplies the ACF tape T stored in a wound state. The ACF tape T is obtained by sticking ACF (anisotropic conductive agent) to a resin base tape T ′. The transfer head 23 transfers the ACF 8 to the surface of the substrate 1 by pressing the ACF tape T drawn from the supply reel 22 against the substrate 1. The base tape T ′ after the ACF transfer is wound up on the collection reel 24 and collected.

FIG. 3B shows the transfer operation of the ACF 8 by the transfer head 23. The ACF tape T pulled out from the supply reel 22 is guided by a guide 25 and is positioned parallel to the lower surface of the transfer head 23. The ACF tape T is pressed against the surface of the substrate 1 by pressing down the transfer head 23 in a state where the ACF transfer portion of the substrate 1 is aligned with the transfer head 23. Thereafter, when the transfer head 23 is raised, the ACF 8 adhered to the ACF tape T is transferred to the surface of the substrate 1 and only the base tape T 'is peeled off, whereby the transfer of the ACF 8 is completed.

送 り As shown in FIG. 2, the transfer unit 21 on one side is provided with a feed screw mechanism 26. By rotating the feed screw 28 screwed into the nut 27 fixed to the transfer mechanism 21 with the handle 29, the arrangement pitch of the two transfer heads 23 can be changed. Therefore, by adjusting the arrangement pitch P of the transfer head 23 to the arrangement pitch of the two ACF transfer target sites on the surface of the substrate 1 or a distance of an integral multiple thereof, the ACF is simultaneously transferred to the two separated ACF transfer target sites. can do. That is, the feed screw mechanism 26 is a pitch adjusting means for relatively adjusting the arrangement pitch of the transfer mechanism for transferring the ACF 8 to the pitch of the transfer target portion.

Next, the mounting station 30 will be described with reference to FIGS. In FIG. 4, a tray 37 is placed on the tray supply table 36. The chips 3 are stored in the tray 37 in a lattice-like arrangement. An XY table in which uniaxial tables 34 and 35 are combined is provided on the tray supply table 36, and the chip 3 is picked up from the tray 37 by a pickup head 33 mounted on the XY table.

(4) The picked-up chip 3 is placed on the holding portion 39 on the slide table 38. Then, the chip 3 aligned by the holding unit 39 moves to a pickup position by the transfer nozzle 32 on the slide table 38. Next, the chip 3 picked up by the transfer nozzle 32 moves above the substrate 1 held on the second movable table 12B by rotating the turntable 31. The ACF 8 has already been transferred to the chip mounting position of the substrate 1 in the previous station. Then, by recognizing the substrate 1 by the camera 16, the substrate 1 and the chip 3 are aligned, and the chip 3 is mounted on the ACF transferred to the substrate 1.

Next, the crimping station 40 will be described with reference to FIG. 5, a pressure bonding head 41 is mounted on a block 40a held by a frame 11 (see FIG. 1) so as to be able to move up and down by a lifting and lowering mechanism 42. The substrate 1 is mounted on the third movable table 12C, and the chip 3 is mounted on the ACF 8 transferred to the substrate 1.

The lower surface of the edge of the substrate 1 is supported by the lower receiving block 43. When the pressure bonding head 41 is lowered in this state, the pressure bonding head 41 comes into contact with the upper surface of the chip 3, whereby the chip 3 is connected via the ACF 8. It is pressed against the surface of the substrate 1. The pressure bonding head 41 includes a heater for heating, and the ACF is heated via the chip 3 when pressed. The chip 3 is bonded to the substrate 1 by maintaining the pressing and heating state for a predetermined time.

This chip bonding apparatus is configured as described above, and its operation will be described below. First, in FIG. 1, the substrate 1 positioned on the supply table 2 is picked up by the suction pad 7 of the transfer arm 6 and transferred to the ACF transfer station 20 along the transfer path N. Here, the substrate 1 placed on the θ table 15 of the first movable table 12A
Moves to the ACF transfer position and is aligned with the transfer mechanism 21. ACF is transferred to the substrate 1 by two transfer mechanisms 21.

{That is, the ACF is transferred to two different transfer target portions of the same substrate 1 by the respective transfer mechanisms 21. At this time, since the arrangement pitch between the transfer mechanisms 21 is variable by the feed screw mechanism 20, the arrangement pitch between the transfer mechanisms 21 can be matched to the pitch of the transfer target portion even for substrates of different types.

After that, the substrate 1 on which the ACF transfer has been performed returns to the transport path N, where it is picked up again by the transport arm 6 and transported to the mounting station 30. Then, the chip 3 is mounted on the ACF 8 transferred at the ACF transfer station 20 here. Next, the substrate 1 on which the chip 3 is mounted is transported by the transport arm 6 to the pressure bonding station 40, and is placed on the third movable table 12C. The chip 3 mounted in the mounting station 30 is pressed and heated by the pressure bonding head 41, so that the chip 3 is bonded to the substrate 1 and the connection electrode of the chip 3 is connected to the electrode of the substrate 1 by the conductive component in the ACF. And electrically conductive.

(4) Thereafter, the substrate 1 on which bonding has been completed is taken out by the transfer arm 6 and placed on the collection table 4, and one cycle of the bonding operation is completed. In the above-described bonding operation, the ACF transfer to the two transfer target sites is performed simultaneously at the ACF transfer station 20 requiring the longest required work time, so that the line balance among the ACF transfer, mounting, and pressure bonding processes is maintained. Thus, efficient chip bonding can be performed.

Note that, in the present embodiment, an example has been described in which simultaneous transfer is performed for two transfer portions on the same substrate, but the present invention can be applied to a case where two substrates are to be bonded. . In this case, as shown in FIG. 6A, two substrates 1A and 1B are mounted on a movable table 12 having separate X tables 14A and 14B and θ tables 15A and 15B as pitch adjusting means. Place. Thus, the pitch P2 between the transfer target portions of the substrates 1A and 1B can be adjusted to the pitch P1 of the transfer head 23. In this case, the X tables 14A and 14B and the θ tables 15A and 15B serve as pitch adjusting means.

Further, instead of performing such individual positioning, the two substrates 1A and 1B are mounted on a common mounting table provided on the movable table 12 of the ACF transfer station 20 by the transfer arm 6 having a positioning mechanism. At this time, the transfer portions may be placed at positions where the pitch between the transfer target portions is equal to the pitch P1 between the two transfer heads 23. In this case, the transfer arm 6 corresponds to the pitch adjusting means.

According to the present invention, the transfer of the anisotropic conductive agent can be performed simultaneously at a plurality of locations, and the overall tact time can be shortened to improve the efficiency of the bonding operation. Therefore, the present invention is useful as a chip bonding apparatus. .

1 is a perspective view of a chip bonding apparatus according to an embodiment of the present invention. Front view of a chip bonding apparatus according to an embodiment of the present invention. (A) A perspective view of an ACF transfer station of the chip bonding apparatus according to one embodiment of the present invention. (B) A partial front view of a transfer mechanism of the chip bonding apparatus according to one embodiment of the present invention. 1 is a perspective view of a mounting station of a chip bonding apparatus according to an embodiment of the present invention. 1 is a perspective view of a crimping station of a chip bonding apparatus according to an embodiment of the present invention. Partial front view of a chip bonding apparatus according to an embodiment of the present invention.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 Substrate 3 Chip 6 Transfer arm 8 ACF
Reference Signs List 20 ACF transfer station 21 Transfer mechanism 23 Transfer head 26 Feed screw mechanism 30 Mounting station 40 Crimping station

Claims (3)

A chip bonding apparatus for bonding a chip to a substrate using an anisotropic conductive agent, comprising: a first movable table on which one substrate is placed; and an anisotropic conductive tape to which the anisotropic conductive agent is attached An anisotropic conductive agent transfer section for transferring an anisotropic conductive agent to a transfer target portion of a substrate placed on the first movable table, and a single substrate on which the anisotropic conductive agent is transferred. A second movable table to be placed, a chip mounting portion for mounting a chip on a substrate placed on the second movable table, and a transport for transporting the substrate from the first movable table to the second movable table. Arm, and the anisotropic conductive agent transfer unit presses an anisotropic conductive tape against two different transfer target portions of one substrate placed on the first movable table by a transfer head. Transfer of anisotropic conductive agent Chip bonding apparatus characterized by comprising a mechanism. 2. The chip bonding apparatus according to claim 1, further comprising a pitch adjusting unit that adjusts an arrangement pitch of the two transfer mechanisms relatively to a pitch of a transfer target portion. A third movable table on which the substrate on which the chip is mounted is mounted, and a lifting and lowering mechanism for pressing and heating the chip mounted on the substrate mounted on the third movable table with a pressure bonding head and bonding the chip to the substrate; 2. The chip bonding apparatus according to claim 1, further comprising: a transfer arm configured to transfer a substrate from the second movable table to the third movable table.

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