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JP2004119948A - Electromagnetic induction spiral inductor - Google Patents

Electromagnetic induction spiral inductor Download PDF

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Publication number
JP2004119948A
JP2004119948A JP2002285289A JP2002285289A JP2004119948A JP 2004119948 A JP2004119948 A JP 2004119948A JP 2002285289 A JP2002285289 A JP 2002285289A JP 2002285289 A JP2002285289 A JP 2002285289A JP 2004119948 A JP2004119948 A JP 2004119948A
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JP
Japan
Prior art keywords
spiral inductor
wiring layer
electromagnetic induction
divided
inductor conductor
Prior art date
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Granted
Application number
JP2002285289A
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Japanese (ja)
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JP3912248B2 (en
Inventor
Masahito Tsujii
辻井 雅人
Hiroyasu Omori
大森 寛康
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Toppan Inc
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Toppan Printing Co Ltd
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Priority to JP2002285289A priority Critical patent/JP3912248B2/en
Publication of JP2004119948A publication Critical patent/JP2004119948A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic induction spiral inductor, in which inductance efficiency per unit volume can be enhanced, by generating electromagnetic induction, which is generated by the fluctuations of current, not only in one direction but also in multiple directions. <P>SOLUTION: A wiring layer of a spiral inductor conductor is divided into two. A divided wiring layer 21 of the spiral inductor conductor and a divided wiring layer 22 of the spiral inductor conductor are formed on an insulating substrate 11 via an insulating layer 12. The divided wiring layer 21 of the spiral inductor conductor and the divided wiring layer 22 of the spiral inductor conductor are electrically connected by a via 41. The electromagnetic induction spiral inductor with a two-layer structure, in which the divided wiring layer 21 of the spiral inductor conductor and the divided wiring layer 22 of the spiral inductor conductor move in and out via the insulating layer 12, can be obtained. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
本発明は、半導体装置用基板に内蔵されるインダクタの構造に関する。
【0002】
【従来の技術】
高周波回路の応用分野が広がるとともに、回路の小型化の要求が強まっている。半導体では受動素子まで集積されたMMIC(Monolithic Microwave Integrated Circuits)や部品をプリント配線板に内蔵した部品内蔵の半導体装置用基板の研究・開発が進められている。
これらの小型化を進めるためには、配線の高密度化だけでなく、内部回路に使用するL(インダクタ)、C(キャパシタ)、R(レジスター)も高密度化する必要がある。
【0003】
LRCの中でも、インダクタLは高密度にすることが難しく、図4(a)〜(c)に示すような大面積を使用するスパイラルインダクタが使用され、2次元的な構成では、インダクタのインダクタンスを確保するには、ある限界にきている。
【0004】
【発明が解決しようとする課題】
スパイラルインダクタを使用した場合、必要なインダクタンスを得るにはある程度の面積が必要となる。今後、半導体装置用基板が多層化されるにつれ、平面的なインダクタだけではなく、面積(体積)を削減した3次元的なインダクタ構成の必要性が高まっている。
本発明は、上記問題点に鑑み考案されたもので、電流の変化によって生じる電磁誘導を一方向だけでなく、多方向に生じさせることで、単位体積当たりのインダクタンス効率を上げることが可能な電磁誘導スパイラルインダクタを提供することを目的とする。
【0005】
【課題を解決するための手段】
本発明に於いて上記課題を達成するために、本発明は、少なくともインダクタが内蔵された半導体装置用基板において、分割されたスパイラルインダクタ導体配線層が絶縁層を介して少なくとも2層形成されており、前記分割されたスパイラルインダクタ導体配線層がビアにて接続されてスパイラルインダクタを形成していることを特徴とする電磁誘導スパイラルインダクタとしたものである。
【0006】
【発明の実施の形態】
以下本発明の実施の形態につき説明する。
本発明の電磁誘導スパイラルインダクタは、スパイラルインダクタ導体配線層の電流の変化に対して基板に垂直に生じる磁界を作ることで、インダクタ成分を高めるだけでなく、基板に水平な成分への磁界も利用して電磁誘導(コイル状の配線に電流の変化に対してそれを妨げる向きに磁界が発生する現象)による妨げる力を高めることでインダクタ成分を効率よく得るようにしたものである。
このように、本発明の電磁誘導スパイラルインダクタはスパイラルインダクタの電磁誘導作用を強めることで、スパイラルインダクタ導体配線層が持つインダクタンス成分を増加させる。よって、スパイラルインダクタの使用面積を削減することができる。
【0007】
図1(a)は、本発明の電磁誘導スパイラルインダクタの一実施例を示す模式平面図である。この電磁誘導スパイラルインダクタは、スパイラルインダクタ導体配線層を2分割して、分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22が絶縁層12を介して絶縁基材11上に形成されており、分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22はビア41にて電気的に接続され、絶縁層12を介して分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22が行き来する2層構成のスパイラルインダクタを形成したものである。
【0008】
図1(b)は、図1(a)をA−A’線で切断した模式構成断面図で、図1(c)は、図1(a)をB−B’線で切断した模式構成断面図である。
図1(d)は、図1(a)をD方向から見た時の電流の方向を示す説明図で、垂直方向にも電流の向きが発生し、電磁誘導によって発生する磁界の方向が2方向のスパイラルインダクタを形成している。よって、導体配線層に流れる交流電流(特に高周波成分)を妨げる働きをする磁界成分を2方向から得ることで、インダクタ成分を効率よく得るようにし、インダクタンスの値を大きくしている。
【0009】
図2(a)は、本発明の電磁誘導スパイラルインダクタの他の実施例を示す模式平面図である。この電磁誘導スパイラルインダクタは、スパイラルインダクタ導体配線層を8分割して、分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22が絶縁層12を介して絶縁基材11上に形成されており、分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22はビア41にて電気的に接続され、絶縁層12を介して分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22が行き来する2層構成のスパイラルインダクタを形成したもので、スパイラルインダクタ導体配線層の分割数が多い分だけ行き来の回数を増やしている。
【0010】
図2(b)は、図2(a)をA−A’線で切断した模式構成断面図で、図2(c)は、図2(a)をB−B’線で切断した模式構成断面図である。
図2(d)は、図1(a)をD方向から見た時の電流の方向を示す説明図で、垂直方向にも電流の向きが発生し、電磁誘導によって発生する磁界の方向が2方向のスパイラルインダクタを形成している。よって、導体配線層に流れる交流電流(特に高周波成分)を妨げる働きをする磁界成分を2方向から得ることで、インダクタ成分を効率よく得るようにし、インダクタンスの値を大きくしている。この事例では、スパイラルインダクタ導体配線層をアミンダ状に配置することで、インダクタ成分をさらに効率よく得るようにしている。
【0011】
図3(a)は、本発明の電磁誘導スパイラルインダクタの他の実施例を示す模式平面図である。この電磁誘導スパイラルインダクタは、スパイラルインダクタ導体配線層を3分割して、分割されたスパイラルインダクタ導体配線層21、分割されたスパイラルインダクタ導体配線層22及び分割されたスパイラルインダクタ導体配線層23が絶縁層12及び絶縁層13を介して絶縁基材11上に形成されており、分割されたスパイラルインダクタ導体配線層21及び分割されたスパイラルインダクタ導体配線層22及び分割されたスパイラルインダクタ導体配線層23はビア41及びビア42にて電気的に接続され、絶縁層12及び絶縁層13を介して分割されたスパイラルインダクタ導体配線層21、分割されたスパイラルインダクタ導体配線層22及び分割されたスパイラルインダクタ導体配線層22が行き来する3層構成のスパイラルインダクタを形成したもので、スパイラルインダクタ導体配線層の層構成が多い分だけ行き来の回数を増やしている。
【0012】
図3(b)は、図3(a)をA−A’線で切断した模式構成断面図で、図3(c)は、図3(a)をB−B’線で切断した模式構成断面図である。
図3(d)は、図3(a)をD方向から見た時の電流の方向を示す説明図で、垂直方向にも電流の向きが発生し、電磁誘導によって発生する磁界の方向が2方向のスパイラルインダクタを形成している。よって、導体配線層に流れる交流電流(特に高周波成分)を妨げる働きをする磁界成分を2方向から得ることで、インダクタ成分を効率よく得るようにし、インダクタンスの値を大きくしている。さらに、導体配線の最上層と最下層の間に厚みを持たせることで、基板の垂直方向に流れる電流を増やし、インダクタ成分を効率よく得るようにしたものである。
【0013】
【発明の効果】
上記したように、本発明の電磁誘導スパイラルインダクタは、スパイラルインダクタを構成するスパイラルインダクタ導体配線層を分割して、絶縁層を介して配置することにより、電磁誘導によって発生する磁界の方向を2方向発生させ、インダクタ成分を効率よく得ているため、MMICや部品内蔵基板等の集積化を求める半導体において、スパイラルインダクタの面積を削減でき、部品(インダクタ)内蔵の高密度半導体装置用基板を提供することができる。
【図面の簡単な説明】
【図1】(a)は、本発明の電磁誘導スパイラルインダクタの一実施例を示す模式平面図である。(b)は、(a)をA−A’線で切断した模式構成断面図である。(c)は、(a)をB−B’線で切断した模式構成断面図である。(d)は、(a)をD方向から見た時の電流の方向を示す説明図である。
【図2】(a)は、本発明の電磁誘導スパイラルインダクタの他の実施例を示す模式平面図である。(b)は、(a)をA−A’線で切断した模式構成断面図である。(c)は、(a)をB−B’線で切断した模式構成断面図である。(d)は、(a)をD方向から見た時の電流の方向を示す説明図である。
【図3】(a)は、本発明の電磁誘導スパイラルインダクタの他の実施例を示す模式平面図である。(b)は、(a)をA−A’線で切断した模式構成断面図である。(c)は、(a)をB−B’線で切断した模式構成断面図である。(d)は、(a)をD方向から見た時の電流の方向を示す説明図である。
【図4】(a)は、従来のスパイラルインダクタの一例を示す模式平面図である。(b)は、(a)をA−A’線で切断した模式構成断面図である。(c)は、(a)をB−B’線で切断した模式構成断面図である。
【符号の説明】
11……絶縁基材
12、13……絶縁層
21、22、23、31、32……分割されたスパイラルインダクタ導体配線層41、42、43……ビア
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a structure of an inductor incorporated in a semiconductor device substrate.
[0002]
[Prior art]
As the application fields of high-frequency circuits are expanding, demands for circuit miniaturization are increasing. In semiconductors, research and development of MMICs (Monolithic Microwave Integrated Circuits) integrated up to passive elements and substrates for semiconductor devices with built-in components in which components are built in printed wiring boards are being promoted.
In order to promote these miniaturizations, it is necessary to increase not only the density of the wiring but also the density of L (inductor), C (capacitor), and R (register) used in the internal circuit.
[0003]
Among the LRCs, it is difficult to increase the density of the inductor L, and a spiral inductor using a large area as shown in FIGS. 4A to 4C is used. In a two-dimensional configuration, the inductance of the inductor is reduced. There are certain limits to securing.
[0004]
[Problems to be solved by the invention]
When a spiral inductor is used, a certain area is required to obtain a required inductance. In the future, as the number of semiconductor device substrates increases, the need for not only planar inductors but also three-dimensional inductors with reduced area (volume) is increasing.
The present invention has been devised in view of the above problems, and an electromagnetic induction that can be increased not only in one direction but also in multiple directions by increasing the inductance efficiency per unit volume by generating electromagnetic induction caused by a change in current. It is an object to provide an inductive spiral inductor.
[0005]
[Means for Solving the Problems]
In order to achieve the above object in the present invention, the present invention provides a semiconductor device substrate having at least an inductor built therein, wherein at least two divided spiral inductor conductor wiring layers are formed via an insulating layer. An electromagnetic induction spiral inductor is characterized in that the divided spiral inductor conductor wiring layers are connected by vias to form a spiral inductor.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
The electromagnetic induction spiral inductor of the present invention not only enhances the inductor component but also utilizes the magnetic field to the component horizontal to the substrate by creating a magnetic field generated perpendicular to the substrate in response to a change in current in the spiral inductor conductor wiring layer. Then, the inductor component is efficiently obtained by increasing the obstructing force due to electromagnetic induction (a phenomenon in which a magnetic field is generated in a direction that obstructs a change in current in a coil-shaped wiring).
As described above, the electromagnetic induction spiral inductor of the present invention increases the inductance component of the spiral inductor conductor wiring layer by enhancing the electromagnetic induction action of the spiral inductor. Therefore, the use area of the spiral inductor can be reduced.
[0007]
FIG. 1A is a schematic plan view showing an embodiment of the electromagnetic induction spiral inductor of the present invention. In this electromagnetic induction spiral inductor, the spiral inductor conductor wiring layer is divided into two, and the divided spiral inductor conductor wiring layer 21 and the divided spiral inductor conductor wiring layer 22 are placed on the insulating base material 11 via the insulating layer 12. The divided spiral inductor conductor wiring layer 21 and the divided spiral inductor conductor wiring layer 22 are electrically connected by vias 41, and are divided via the insulating layer 12. In addition, a spiral inductor having a two-layer structure in which the divided spiral inductor conductor wiring layers 22 come and go is formed.
[0008]
1B is a schematic cross-sectional view of FIG. 1A taken along line AA ′, and FIG. 1C is a schematic configuration of FIG. 1A taken along line BB ′. It is sectional drawing.
FIG. 1D is an explanatory diagram showing the direction of the current when FIG. 1A is viewed from the direction D. The direction of the current also occurs in the vertical direction, and the direction of the magnetic field generated by electromagnetic induction is 2. To form a spiral inductor. Therefore, by obtaining a magnetic field component acting to prevent an alternating current (particularly, a high-frequency component) flowing through the conductor wiring layer from two directions, the inductor component can be obtained efficiently and the inductance value is increased.
[0009]
FIG. 2A is a schematic plan view showing another embodiment of the electromagnetic induction spiral inductor of the present invention. In this electromagnetic induction spiral inductor, the spiral inductor conductor wiring layer is divided into eight parts, and the divided spiral inductor conductor wiring layer 21 and the divided spiral inductor conductor wiring layer 22 are placed on the insulating base material 11 via the insulating layer 12. The divided spiral inductor conductor wiring layer 21 and the divided spiral inductor conductor wiring layer 22 are electrically connected by vias 41, and are divided via the insulating layer 12. A spiral inductor having a two-layer structure in which the divided spiral inductor conductor wiring layers 22 move back and forth is formed, and the number of times of movement is increased by the number of divisions of the spiral inductor conductor wiring layers.
[0010]
2B is a schematic cross-sectional view of FIG. 2A taken along line AA ′, and FIG. 2C is a schematic configuration of FIG. 2A taken along line BB ′. It is sectional drawing.
FIG. 2D is an explanatory diagram showing the direction of the current when FIG. 1A is viewed from the direction D. The direction of the current also occurs in the vertical direction, and the direction of the magnetic field generated by electromagnetic induction is 2. To form a spiral inductor. Therefore, by obtaining a magnetic field component acting to prevent an alternating current (particularly, a high-frequency component) flowing through the conductor wiring layer from two directions, the inductor component can be obtained efficiently and the inductance value is increased. In this case, the spiral inductor conductor wiring layer is arranged in an aminda shape, so that the inductor component can be obtained more efficiently.
[0011]
FIG. 3A is a schematic plan view showing another embodiment of the electromagnetic induction spiral inductor of the present invention. In this electromagnetic induction spiral inductor, a spiral inductor conductor wiring layer is divided into three parts, and a divided spiral inductor conductor wiring layer 21, a divided spiral inductor conductor wiring layer 22, and a divided spiral inductor conductor wiring layer 23 are formed of an insulating layer. The divided spiral inductor conductor wiring layer 21, the divided spiral inductor conductor wiring layer 22, and the divided spiral inductor conductor wiring layer 23, which are formed on the insulating base material 11 via the insulating layer 12 and the insulating layer 13, The spiral inductor conductor wiring layer 21, the divided spiral inductor conductor wiring layer 22, and the divided spiral inductor conductor wiring layer, which are electrically connected by the via 41 and the via 42 and are divided via the insulating layer 12 and the insulating layer 13. A three-layered spy with 22 coming and going Obtained by forming a Le inductors, we are increasing the number of back and forth by the amount the layer structure of the spiral inductor conductor interconnect layer is large.
[0012]
FIG. 3B is a schematic cross-sectional view of FIG. 3A taken along the line AA ′, and FIG. 3C is a schematic configuration of FIG. 3A taken along the line BB ′. It is sectional drawing.
FIG. 3D is an explanatory view showing the direction of the current when FIG. 3A is viewed from the direction D. The direction of the current also occurs in the vertical direction, and the direction of the magnetic field generated by electromagnetic induction is 2. To form a spiral inductor. Therefore, by obtaining a magnetic field component acting to prevent an alternating current (particularly, a high-frequency component) flowing through the conductor wiring layer from two directions, the inductor component can be obtained efficiently and the inductance value is increased. Further, by providing a thickness between the uppermost layer and the lowermost layer of the conductor wiring, the current flowing in the vertical direction of the substrate is increased, and the inductor component is efficiently obtained.
[0013]
【The invention's effect】
As described above, in the electromagnetic induction spiral inductor of the present invention, the spiral inductor conductor wiring layer constituting the spiral inductor is divided and arranged via the insulating layer, so that the direction of the magnetic field generated by the electromagnetic induction can be changed in two directions. Since the inductor component is generated and the inductor component is efficiently obtained, the area of the spiral inductor can be reduced in a semiconductor that requires integration such as an MMIC or a component-embedded substrate, and a high-density semiconductor device substrate with a built-in component (inductor) is provided. be able to.
[Brief description of the drawings]
FIG. 1A is a schematic plan view showing an embodiment of the electromagnetic induction spiral inductor of the present invention. (B) is a schematic configuration sectional view of (a) cut along the line AA '. (C) is a schematic cross-sectional view of (a) cut along line BB '. (D) is an explanatory view showing the direction of current when (a) is viewed from the D direction.
FIG. 2A is a schematic plan view showing another embodiment of the electromagnetic induction spiral inductor of the present invention. (B) is a schematic configuration sectional view of (a) cut along the line AA '. (C) is a schematic cross-sectional view of (a) cut along line BB '. (D) is an explanatory view showing the direction of current when (a) is viewed from the D direction.
FIG. 3 (a) is a schematic plan view showing another embodiment of the electromagnetic induction spiral inductor of the present invention. (B) is a schematic configuration sectional view of (a) cut along the line AA '. (C) is a schematic cross-sectional view of (a) cut along line BB '. (D) is an explanatory view showing the direction of current when (a) is viewed from the D direction.
FIG. 4A is a schematic plan view showing an example of a conventional spiral inductor. (B) is a schematic configuration sectional view of (a) cut along the line AA '. (C) is a schematic cross-sectional view of (a) cut along line BB '.
[Explanation of symbols]
11 insulating base materials 12, 13 insulating layers 21, 22, 23, 31, 32 split spiral inductor conductor wiring layers 41, 42, 43 vias

Claims (1)

少なくともインダクタが内蔵された半導体装置用基板において、分割されたスパイラルインダクタ導体配線層が絶縁層を介して少なくとも2層形成されており、前記分割されたスパイラルインダクタ導体配線層がビアにて接続されてスパイラルインダクタを形成していることを特徴とする電磁誘導スパイラルインダクタ。In a semiconductor device substrate having at least an inductor built therein, at least two divided spiral inductor conductor wiring layers are formed via an insulating layer, and the divided spiral inductor conductor wiring layers are connected by vias. An electromagnetic induction spiral inductor characterized by forming a spiral inductor.
JP2002285289A 2002-09-30 2002-09-30 Electromagnetic induction spiral inductor Expired - Fee Related JP3912248B2 (en)

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US7935883B2 (en) 2006-09-29 2011-05-03 Kabushiki Kaisha Toshiba Thermoelectric material and thermoelectric conversion module using the same
JP2018160625A (en) * 2017-03-23 2018-10-11 住友電工プリントサーキット株式会社 Planar coil substrate
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CN116153610A (en) * 2021-11-22 2023-05-23 中芯国际集成电路制造(深圳)有限公司 Inductor structure and its formation method

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CN116153610A (en) * 2021-11-22 2023-05-23 中芯国际集成电路制造(深圳)有限公司 Inductor structure and its formation method

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