JP2004119631A - LED module - Google Patents

Abstract

An object of the present invention is to reduce the thickness of an LED module and prevent problems such as breakage and dropout of circuit components due to physical impact.
A second recess (1e) for disposing a circuit component (5) in a wiring board (1) is provided. The second concave portion 1e is in a state where the top 5a of the circuit component 5 is sunk below the surface 1f of the wiring board 1 when the circuit component 5 is provided. That is, the top 5a of the circuit component 5 does not protrude from the surface 1f of the wiring board. The shape of the second concave portion 1e is the same as the concave portion 1a, is circular in a plan view, has a plane surface 1g on which the circuit component 5 is disposed, and has a second surface from the disposed surface 1g. It is formed so as to gradually spread toward the opening of the recess 1e.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an LED chip, a concave portion formed with an arrangement surface on which the LED chip is disposed and a reflection surface of light emitted from the LED chip, and a wiring pattern formed to correspond to the shape of the concave portion. The present invention relates to an LED module including a wiring board including the above and a circuit component disposed on the wiring board and connected to an LED chip.
[0002]
[Prior art]
As an LED module of this type, the present applicant has proposed Japanese Patent Application Laid-Open No. 2001-338505. This device has a wiring board, a plurality of light emitting elements (corresponding to LED chips in the present application) arranged on one surface of the wiring board, and a plurality of holes having a plurality of light emitting elements in the plurality of holes. And a frame disposed on one surface of the wiring board so as to accommodate each. Then, a storage chamber that opens toward one surface of the wiring board is formed between the holes of the frame body, and circuit components are connected to and provided in the wiring pattern of the wiring board in the storage chamber. With this configuration, even when the circuit component is mounted on the wiring board, the circuit component does not cause light reflection or absorption. In addition, since the storage chamber is provided in the frame, high-density mounting of the light emitting element is possible.
[0003]
Further, in the above-mentioned conventional example, since the circuit components are stored in the frame, they are not exposed on the surface. This also has the effect of preventing failures such as breakage and dropout of circuit components due to physical impact (for example, a case where mechanical contact with an LED module box is made when handling the LED module). Can be expected.
[0004]
[Patent Document 1]
JP 2001-338505 A
[Problems to be solved by the invention]
However, in the above-described conventional example, there is a problem that the frame needs to have enough space to accommodate the circuit components, so that the thickness of the frame is increased, and as a result, the thickness of the LED module is increased.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to make it possible to reduce the thickness of an LED module and to prevent problems such as breakage and dropout of circuit components due to physical impact. is there.
[0007]
[Means for Solving the Problems]
The invention according to claim 1 is formed to correspond to the shape of the concave portion and the concave portion formed by forming the LED chip, the disposing surface on which the LED chip is disposed, and the reflecting surface of the light emitted from the LED chip. In a LED module including a wiring board having a wiring pattern and a circuit component provided on the wiring board and connected to an LED chip, the wiring board is provided with the circuit component. It is characterized in that a second concave portion is provided in which the top is lower than the surface of the wiring board.
[0008]
The invention according to claim 2 is characterized in that, in claim 1, the circuit component is sealed with a white sealing member.
[0009]
According to a third aspect of the present invention, in the first or second aspect, the wiring board has a groove in which a wiring pattern is provided.
[0010]
According to a fourth aspect of the present invention, in the third aspect, the wiring pattern is sealed with a white sealing member.
[0011]
According to a fifth aspect of the present invention, in the third or fourth aspect, the wiring patterns intersect with each other in a groove in an insulated state.
[0012]
The invention according to claim 6 is characterized in that, in claim 5, the wiring substrate is provided with second grooves on both sides of the groove.
[0013]
The invention according to claim 7 is characterized in that, in claim 1, the second recess is provided on the front and back surfaces on the opposite side of the recess.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
A first embodiment of the present invention will be described with reference to FIG.
FIG. 1 shows the LED module of the first embodiment, and is a plan view (a) and a cross-sectional view (b) along XX ′ of the plan view (a). The wiring board 1 has a circular recess 1a in plan view. The concave portion 1a is a reflection surface of a planar mounting surface 1b on which the LED chip 3 is disposed, and a reflection of light radiated from the LED chip formed so as to gradually spread from the mounting surface 1b toward the opening of the concave portion 1a. Surface 1c. In this example, the diameter of the arrangement surface 1b is 0.7 mm, the diameter of the portion where the diameter of the reflection surface 1c is the largest is 1.1 mm, and the height of the concave portion 1a is about 0.6 mm. The thickness of the wiring board 1 is 1.6 mm. The wiring board 1 is formed by molding using a white liquid crystal polymer-based resin. For example, a white board is used to efficiently reflect light emitted from the LED chip 3 described later. . The important parts of the present embodiment will be described later.
[0015]
Reference numeral 2 denotes a wiring pattern, and the wiring pattern 2 is continuously provided from the periphery of the arrangement surface 1b of the recess 1a to the surface 1f of the wiring board 1 so as to correspond to the shape of the recess 1a. The LED chip 3 is arranged on the arrangement surface 1b, and the LED chip 3 and the wiring pattern 2 are electrically connected by the gold wire 4. Here, the LED chip 3 has a substantially square shape with one side of 0.3 mm in plan view. Further, the concave portion 1a is filled with a transparent resin 13. As the transparent resin 13, an epoxy resin or a silicone resin is used.
[0016]
What is important is that a second concave portion 1e for disposing the circuit component 5 is provided in the wiring board 1. The second concave portion 1e is in a state where the top 5a of the circuit component 5 is sunk below the surface 1f of the wiring board 1 when the circuit component 5 is provided. That is, the top 5a of the circuit component 5 does not protrude from the surface 1f of the wiring board. The shape of the second concave portion 1e is the same as the concave portion 1a, is circular in a plan view, has a plane surface 1g on which the circuit component 5 is disposed, and has a second surface from the disposed surface 1g. It is formed so as to gradually spread toward the opening of the recess 1e. In this example, the diameter of the arrangement surface 1g is 0.3 mm, the diameter of the portion where the diameter is the largest at the opening of the second recess 1e is 0.5 mm, and the height of the recess 1a is about 0.3 mm. In the second concave portion 1e, the wiring pattern 2 is continuously provided from the concave portion 1a through the surface of the wiring board 1 to the surface 1g on which the second concave portion 1e is provided. The wiring pattern 2 is provided with a predetermined gap in the surface 1g where the second recess 1e is provided, and is continuously provided from the surface 1g where the second recess 1e is provided to the surface 1f of the wiring board 1. A chip resistor, which is a circuit component 5, is electrically connected to the wiring pattern 2 provided on the mounting surface of the second recess 1e. Further, the second concave portion 1e is filled with a white resin 8 which is a white sealing member.
[0017]
FIG. 2 shows a circuit configuration according to the present embodiment. The plurality of LED chips 3 are connected in series to a chip resistor as a circuit component 5 and a DC power supply 14. In such a configuration, when the power of the DC power supply 14 is turned on, a current of several tens to several hundreds mA flows through the LED chip 3 to emit light.
[0018]
In this device, as described above, the wiring board 1 has the second concave portion 1e in which the circuit component 5 is provided, and when the circuit component 5 is provided, the top 5a of the circuit component 5 is The top 5 a of the circuit component 5 does not protrude from the surface 1 f of the wiring board 1 because the circuit component 5 is sunk below the surface 1 f. Thus, it is possible to prevent the circuit component 5 from being damaged or dropped due to a physical impact from the outside of the wiring board 1. Further, since no frame is provided unlike the latter case of the conventional example, the thickness of the wiring board 1 can be reduced.
(Second embodiment)
Next, a second embodiment will be described with reference to FIG. FIG. 3 shows the LED module according to the second embodiment, and is a plan view (a), a cross-sectional view (b) along XX ′ of the plan view (a), and a cross-section along YY ′ of the plan view (a). It is a figure (c).
[0019]
The LED module shown in FIG. 3 has a groove 1 i in a wiring board 1, a wiring pattern 2 is provided at the bottom of the groove 1 i, and is filled with a white resin 8. Same as module. That is, in the section where the wiring pattern 2 of the wiring board 1 is provided, the cross section is trapezoidal in the cross-sectional view (c), and the groove 1i is formed so as to penetrate the recess 1a and the second recess 1e. ing. The wiring pattern 2 is provided on the bottom surface of the groove 1i. Further, the groove 1i is filled with a white resin 8 as a white sealing member, for example, a silicone resin.
[0020]
In this case, in addition to the effects of the first embodiment, since the wiring pattern 2 is not exposed on the front surface 1f of the wiring board 1, it is possible to prevent the wiring pattern 2 from being damaged by external physical impact. Further, since the groove portion 1i is filled with the white resin, the wiring pattern is covered with the white resin, and has the same color as the liquid crystal polymer resin forming the wiring board 1, which is preferable in appearance. When a light distribution lens (not shown) is attached to the wiring board 1, light emitted from the LED chip 3 is partially reflected by the light distribution lens and is reflected again by the white resin 8. Therefore, the luminous efficiency of the LED module can be improved as compared with the case where the white resin 8 is not provided.
(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG.
FIG. 4 shows an LED module according to the third embodiment, which is a plan view (a), a cross-sectional view (b) at XX ′ in the plan view (a), and a cross-sectional view at YY ′ in the plan view (a). It is sectional drawing (c). The LED module shown in FIG. 4 is the same as the LED module of the second embodiment except that a second groove 1j intersecting the groove 1i and a wiring pattern 11 connected by a jumper component 9 are provided.
[0021]
Here, the second groove 1j has a substantially rectangular shape in plan view, and is formed with a predetermined depth above the groove 1i. The wiring pattern 11 is formed continuously from the opening of the groove 1i to the surface 1f of the wiring board 1 so as to follow the shape of the second groove 1j. The wiring pattern 11 is separated by providing a predetermined gap at the opening of the groove portion 1 i, and this portion is electrically connected by the jumper component 9. Further, the second groove 1j is filled with a white resin 8 as a white sealing member.
[0022]
As described above, in addition to the effects of the first and second embodiments, sufficient insulation between the wiring pattern 2 and the wiring pattern 11 can be ensured even when the wiring pattern 11 intersecting with the wiring pattern 2 is provided. Can be.
(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG.
FIG. 5 shows the LED module according to the fourth embodiment, and is a plan view (a) and a cross-sectional view (b) along XX ′ of the plan view (a).
In the LED module shown in FIG. 5, in the first embodiment, a second concave portion 1e in which the circuit component 5 is provided is provided on the front and back surfaces of the LED module opposite to the concave portion 1a. That is, the difference is that the wiring board 1 is provided on the back surface 1f, that is, on the surface facing the surface on which the LED chips 3 are provided (the front surface 1f).
[0023]
In this device, a second concave portion 1e is formed in the back surface 1k of the wiring substrate 1, and a through hole 15 penetrating from the surface 1g where the second concave portion 1e is provided to the front surface 1f is formed. The second concave portion 1e has a wiring pattern 2 on its mounting surface 1g, and the wiring pattern 2 is electrically connected to the wiring pattern 2 disposed on the front surface 1f via a through hole 15.
[0024]
As described above, it is possible to mount the circuit component 5 so that the circuit component 5 does not protrude from the back surface 1k of the wiring board 1. Thus, it is possible to prevent the circuit component 5 from being damaged or dropped due to external physical impact. Further, since the second concave portion 1e is formed on the back surface 1k of the wiring board 1 and the circuit component 5 is provided, even when the light distribution lens (not shown) is attached to the wiring board 1 as described above. Since there is no decrease in reflectance due to the circuit component 5, there is no need to use the white resin 8.
[0025]
In the above embodiment, a white resin is used to seal the circuit component 5 and the wiring patterns 2 and 11, but any resin having a high reflectance may be used. Further, although a chip resistor is used as the circuit component 5, another circuit component such as a transistor may be used.
[0026]
【The invention's effect】
The invention according to claim 1 is formed to correspond to the shape of the concave portion and the concave portion formed by forming the LED chip, the disposing surface on which the LED chip is disposed, and the reflecting surface of the light emitted from the LED chip. In a LED module including a wiring board having a wiring pattern and a circuit component provided on the wiring board and connected to an LED chip, the wiring board is provided with the circuit component. Since the second concave portion whose top is sunk below the surface of the wiring board is provided, the circuit component does not protrude from the surface of the wiring board without providing a frame as shown in the conventional example, and It is possible to prevent problems such as breakage and dropout of circuit components due to physical impact from outside. Further, since no frame is provided, the thickness of the LED module can be reduced.
[0027]
According to a second aspect of the present invention, in the first aspect, the circuit component is sealed with a white sealing member. Therefore, in addition to the effect of the first aspect, the circuit component is covered with a white resin, The color is the same as that of the liquid crystal polymer resin that forms the wiring board, so that the appearance is preferable.
[0028]
According to a third aspect of the present invention, in the first or second aspect, the wiring board has a groove in which a wiring pattern is provided. It is possible to prevent the wiring pattern from being damaged by a physical shock from the outside.
[0029]
In the invention according to claim 4, in claim 3, the wiring pattern is sealed with a white sealing member. Therefore, in addition to the effect of claim 3, the wiring pattern is covered with white resin, The color is the same as that of the liquid crystal polymer-based resin forming the wiring board, so that the appearance is preferable.
[0030]
According to a fifth aspect of the present invention, in the third or fourth aspect, the wiring patterns cross each other in the groove in an insulating state. Thus, sufficient insulation of the intersecting wiring patterns can be ensured.
[0031]
According to a sixth aspect of the present invention, in the fifth aspect, the wiring substrate is provided with the second groove on both sides of the groove, so that in addition to the effect of the fifth aspect, the wiring pattern is exposed on the surface of the wiring substrate. The wiring pattern can be prevented from being damaged by external physical impact.
[0032]
According to a seventh aspect of the present invention, in the first aspect, the second recess is provided on the opposite side of the recess on the front and back surfaces. In addition, it is possible to prevent problems such as breakage and dropout of the circuit component 5, and even when the light distribution lens is attached to the wiring board, there is no decrease in the reflectance due to the circuit component. There is no.
[Brief description of the drawings]
FIG. 1 shows an LED module according to a first embodiment, and is a plan view (a) and a cross-sectional view (b) taken along line XX ′ of the plan view (a).
FIG. 2 is a diagram illustrating a circuit configuration according to the first embodiment.
FIG. 3 shows an LED module according to a second embodiment, which is a plan view (a), a sectional view (b) along XX ′ of the plan view (a), and a cross-sectional view YY ′ of the plan view (a). It is sectional drawing (c).
FIG. 4 shows an LED module according to a third embodiment, which is a plan view (a), a cross-sectional view (b) at XX ′ of the plan view (a), and a YY ′ of the plan view (a). It is sectional drawing (c) in FIG.
FIG. 5 is a plan view showing an LED module according to a fourth embodiment, and is a cross-sectional view (b) taken along line XX ′ of the plan view (a).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Wiring board 1a Depression 1b Arrangement surface 1c Reflection surface 1e Second depression 1f Surface 1g Arrangement surface 1i Groove 1j Second groove 1k Back 2 Wiring pattern 2a Wiring pattern 3 LED chip 4 Gold wire 5 Circuit component 5a Top 7 Bottom 8 White resin 9 Jumper component 11 Wiring pattern 13 Transparent resin

Claims (7)

A wiring board comprising: an LED chip; a concave portion formed with an arrangement surface on which the LED chip is disposed and a reflection surface of light emitted from the LED chip; and a wiring pattern formed to correspond to the shape of the concave portion. And a circuit component provided on the wiring board and connected to the LED chip, wherein the wiring board is provided with the circuit component, and the top of the circuit component is higher than the surface of the wiring board. An LED module, wherein a second recess in a sunken state is provided. The LED module according to claim 1, wherein the circuit component is sealed with a white sealing member. The LED module according to claim 1, wherein the wiring board has a groove in which a wiring pattern is provided. The LED module according to claim 3, wherein the wiring pattern is sealed with a white sealing member. The LED module according to claim 3, wherein the wiring patterns intersect with each other in an insulated state in the groove. The LED module according to claim 5, wherein the wiring substrate is provided with a second groove on both sides of the groove. The LED module according to claim 1, wherein the second recess is provided on the front and back surfaces on the opposite side of the recess.

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