JP2004119583A - Optical element manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical element wherein the shape of a lens can properly be controlled. <P>SOLUTION: The method for manufacturing an optical element emits light from an emitting surface or takes light from an incident surface. The method includes discharging liquid droplets toward the emitting surface or incident surface to form a lens precursor on the emitting surface or incident surface and curing the lens precursor with the emitting surface or incident surface facing down nearly vertically to form the lens precursor on the emitting surface or incident surface. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for manufacturing an optical element capable of appropriately controlling the shape of a lens.
[0002]
[Background Art]
For the purpose of improving the coupling efficiency of the incident light or the outgoing light, a lens may be formed on the emitting surface of the light emitting element or the incident surface of the light receiving element. In this case, it is important to strictly control the shape of the lens in order to impart desired optical characteristics to incident light or output light.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide a method for manufacturing an optical element capable of appropriately controlling the shape of a lens.
[0004]
[Means for Solving the Problems]
1. First optical element manufacturing method of the present invention
The first method for producing an optical element of the present invention comprises:
A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging droplets toward the emission surface or the incidence surface, a lens precursor is formed on the emission surface or the incidence surface,
Curing the lens precursor with the outgoing or incoming surface oriented substantially vertically downward to form a lens on the outgoing or incoming surface.
[0005]
In the present application, “vertically downward” refers to a direction substantially the same as the direction of gravity. Further, “vertically upward” refers to a direction substantially opposite to the direction of gravity.
[0006]
Further, in the present application, the “outgoing surface or the incoming surface” is “the outgoing surface” when the optical element is an optical element that emits light from the outgoing surface, and “when the optical element takes in light from the incoming surface” Incident surface ". Specifically, when the optical element of the present invention is a light emitting element, the “outgoing surface or incident surface” is the “outgoing surface”, and when the optical element of the present invention is a light receiving element, “the outgoing surface or incident surface” The “surface” is the “incident surface”.
[0007]
According to the first method for manufacturing an optical element of the present invention, the lens precursor is cured while the light exit surface or the light exit surface faces substantially vertically downward. Thus, the curvature and height of the lens can be increased by a simple method without requiring a surface treatment or the like for increasing the curvature and height of the lens.
[0008]
Further, by forming the lens directly on the emission surface or the emission surface, the alignment between the emission surface or the incidence surface and the lens can be easily performed. Thereby, productivity can be improved.
2. Method for manufacturing second optical element
The method for producing a second optical element according to the present invention comprises:
A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging droplets toward the emission surface or the incidence surface, a lens precursor is formed on the emission surface or the incidence surface,
After curing the lens precursor for a predetermined time in a state where the exit surface or the entrance surface is substantially vertically upward, by curing the lens precursor in a state where the exit surface or the entrance surface is substantially vertically downward, Forming a lens on the exit surface or the entrance surface.
[0009]
According to the second method for manufacturing an optical element of the present invention, the same functions and effects as those of the above-described method for manufacturing the first optical element can be obtained. Further, according to the second method for manufacturing an optical element of the present invention, the time for curing the lens precursor in a state where the exit surface or the entrance surface is substantially vertically upward, and the case where the exit surface or the entrance surface is substantially vertical The shape of the lens precursor can be adjusted by adjusting the time for curing the lens precursor in the downward state.
[0010]
Also, for example, because the viscosity of the lens precursor is low, if the exit surface or the entrance surface is oriented substantially vertically downward, when the lens precursor cannot be held on the exit surface or the entrance surface, first, the exit surface or The lens precursor is cured for a predetermined time in a state where the entrance surface is substantially vertically upward, and when the exit surface or the entrance surface is substantially vertically downward, the lens precursor is on the exit surface or the entrance surface. The lens can be formed by increasing the viscosity of the lens precursor to an extent that the lens precursor can be held, and then curing the lens precursor with the exit surface or the entrance surface facing substantially vertically downward. As described above, even when the viscosity of the lens precursor is low, the lens having a desired shape can be formed.
3. Method for manufacturing third optical element
The third method for producing an optical element according to the present invention comprises:
A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging a first droplet toward the emission surface or the incidence surface, a first lens precursor is formed on the emission surface or the incidence surface,
Forming a second lens precursor on the first lens precursor by discharging a second droplet having a higher viscosity than the first droplet toward the first droplet;
Curing the first and second lens precursors to form a lens on the exit or entrance surface.
[0011]
According to the third method for manufacturing an optical element of the present invention, the first lens is ejected toward the first droplet by discharging the second droplet having a higher viscosity than the first droplet. By forming and curing the second lens precursor on the precursor, a lens having a large curvature and height can be formed on the emission surface or an optical element formed on the emission surface.
4. Fourth optical element manufacturing method
The fourth method for producing an optical element according to the present invention comprises:
A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging a first droplet toward the emission surface or the incidence surface, a first lens precursor is formed on the emission surface or the incidence surface,
Forming a second lens precursor on the first lens precursor by discharging a second droplet having a lower viscosity than the first droplet toward the first droplet;
Curing the first and second lens precursors with the outgoing surface or incident surface oriented substantially vertically downward, thereby forming a lens on the outgoing or incident surface.
[0012]
According to the fourth method for manufacturing an optical element of the present invention, by discharging a second droplet having a lower viscosity than the first droplet toward the first droplet, the first lens precursor is discharged. After forming the second lens precursor on the body, the first and second lens precursors are cured. In this case, since the second lens precursor has a lower viscosity than the first lens precursor, the second lens precursor extends downward from the first lens precursor. Thereby, the curvature and height of the finally obtained lens can be increased.
5. Fifth optical element manufacturing method
The fifth method for producing an optical element of the present invention comprises:
A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging and curing the first droplet toward the emission surface or the incident surface, a part of the lens is formed on the emission surface or the incident surface,
Forming a lens on the exit surface or the entrance surface by discharging and curing the second droplet toward a part of the lens.
[0013]
According to the fifth method of manufacturing an optical element of the present invention, the second lens precursor is cured after the first lens precursor is cured. Thereby, even when the viscosity of the first lens precursor is low, the first lens precursor can be surely cured.
[0014]
In this case, the first droplet and / or the second droplet can be cured in a state where the emission surface or the incidence surface is directed substantially vertically downward. Thereby, a lens having a large curvature and a large height can be obtained.
[0015]
The first to fifth optical element manufacturing methods can take the following aspects (1) to (4).
[0016]
(1) The ejection of the droplets (including the first and second droplets) can be performed by an inkjet method or a dispenser method.
[0017]
(2) The droplets (including the first and second droplets) can be made of a material that can be cured by applying energy. Thus, a lens whose shape is controlled can be obtained.
[0018]
(3) The lens can be made of an ultraviolet curable resin. The UV-curable resin is cured by short-time UV irradiation. For this reason, it is possible to cure without going through a process such as a heat process that easily damages the element. Therefore, when an ultraviolet curable resin is used to form the lens, the influence on the element can be reduced. In general, many ultraviolet curable resins have high light transmittance. For this reason, since light loss is small, it is particularly effective when forming a lens having a long optical path length.
[0019]
(4) The optical element may be a surface-emitting light emitting element.
[0020]
In this case, the surface emitting type light emitting element can be any one of a surface emitting type semiconductor laser, a semiconductor light emitting diode, and an organic EL device. Thus, the curvature and height of the lens can be increased by a simple method without requiring a surface treatment or the like for increasing the curvature and height of the lens. Thereby, the configuration of the optical coupling system can be simplified and the cost can be reduced.
[0021]
Further, by forming the lens directly on the emission surface, the alignment accuracy between the emission surface of the surface-emitting type light emitting element and the lens can be improved. Thereby, the coupling efficiency between the surface-emitting light emitting element and the lens can be increased, and the productivity can be improved.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0023]
[First Embodiment]
1. Optical element manufacturing method
1A to 1C are cross-sectional views schematically illustrating a method for manufacturing an optical element 70 according to a first embodiment to which the present invention is applied.
[0024]
In the present embodiment, the optical element 70 is, for example, a light emitting element or a light receiving element. For example, in the case of a light-emitting element, the light-emitting element has a portion for emitting light (emission surface). Specifically, examples of the light emitting element include a semiconductor laser, a semiconductor light emitting diode, and an organic EL device. Examples of the light receiving element include a solid-state imaging device, a photodiode, and an MSM photo detector.
[0025]
In the method for manufacturing an optical element according to the present embodiment, a method for forming a lens 10 on an emission surface or an incidence surface (hereinafter, also referred to as “emission surface or the like”) 20 will be described.
[0026]
(1) First, before forming the lens 10 (see FIG. 1C), the optical element unit 22 including the emission surface 20 and the like (see FIG. 1A) is formed. The optical element unit 22 is, for example, a part necessary for driving as an element. Note that the configuration and manufacturing method of the optical element unit 22 differ depending on the type of the element and the like. Therefore, in FIG. 1A to FIG. 1C, illustration of components of the optical element unit 22 and a method of manufacturing the optical element unit 22 are omitted except for the emission surface 20 and the like.
[0027]
Next, the lens precursor 10b is formed on the emission surface 20 or the like of the optical element unit 22 (see FIG. 1A).
[0028]
Specifically, as shown in FIG. 1A, the lens precursor 10b is formed by discharging the droplet 10a from the droplet discharge port 12 to the emission surface 20 or the like of the optical element unit 22. You. In this case, the size of the lens precursor 10b can be controlled by adjusting the ejection amount of the droplet 10a.
[0029]
As a method of discharging the droplet 10a, a dispenser method or an inkjet method can be exemplified. It is desirable to select an ejection method in consideration of the viscosity of the droplet 10a, the ejection amount, and the like. For example, when the ink jet method is used, the viscosity of the droplet 10a is desirably used at about 20 cps or less. On the other hand, when the dispenser method is used, the viscosity of the droplet 10a may be higher. The dispenser method is a useful method for forming a relatively large lens because the discharge amount of the droplet can be increased. In addition, the ink-jet method is a method useful for forming a fine lens because a discharge amount and a discharge position of a droplet can be strictly controlled.
[0030]
Further, the lens precursor 10b is converted into the lens 10 (see FIG. 1C) by a later curing step. The lens precursor 10b (droplet 10a) is made of a liquid material (for example, an ultraviolet-curable resin or a thermosetting resin) that can be cured by applying energy such as heat or light. Thereby, the lens 10 whose shape is controlled can be obtained. Examples of the ultraviolet curable resin include an ultraviolet curable acrylic resin and an epoxy resin. Examples of the thermosetting resin include a precursor of a thermosetting polyimide resin.
[0031]
The UV-curable resin is cured by short-time UV irradiation. For this reason, it is possible to cure without going through a process such as a heat process that easily damages the element. Therefore, when an ultraviolet curable resin is used for the lens precursor 10b (droplet 10a) to form the lens 10, the influence on the element can be reduced.
[0032]
In general, many ultraviolet curable resins have high light transmittance. For this reason, since light loss is small, it is particularly effective when forming a lens having a long optical path length.
[0033]
The ultraviolet curable resin generally contains at least one of a prepolymer, an oligomer, and a monomer and a photopolymerization initiator. Among the ultraviolet curable resins, it is preferable to use an acrylic resin in consideration of the wide selectivity of the viscosity. Specific examples of the ultraviolet-curable acrylic resin include epoxy acrylates, urethane acrylates, polyester acrylates, polyate acrylates, acrylates such as spiroacetal acrylates, epoxy methacrylates, spiroacetal acrylates, and polyesters. Methacrylates such as methacrylates and polyether methacrylates can be used.
[0034]
(2) Next, the lens precursor 10b is cured in a state in which the light exit surface or the like 20 is oriented substantially vertically downward, thereby forming the lens 10 on the light exit surface or the like 20 (FIGS. 1B and 1C). )reference).
[0035]
Specifically, by setting the exit surface or the like 20 substantially vertically downward, the lens precursor 10b is pulled vertically downward (in the direction of the white arrow shown in FIG. 1B) by gravity. As shown in FIG. 1B, the lens precursor 10b extends vertically downward. In this state, the energy beam 13 is applied to the lens precursor 10b to cure the lens precursor 10b. Through this step, the lens 10 is obtained. The curvature and the height of the obtained lens 10 are larger than the curvature and the height of the lens precursor 10b before the emission surface 20 or the like is turned vertically downward.
[0036]
In order to increase the curvature and height of the obtained lens 10, the material for forming the lens precursor 10b preferably has a large specific gravity. However, in this case, it is necessary that the specific gravity be such that the lens precursor 10b does not detach from the emission surface 20 when the emission surface 20 is oriented vertically downward.
[0037]
FIG. 15 shows an example of an apparatus 300 for curing the lens precursor 10b. In FIG. 15, in an optical element array 1000 in which a plurality of optical elements 70 (not shown) are regularly arranged, a plurality of lenses formed on an emission surface 20 (not shown) of each optical element 70 The case where the precursor 10b is cured is shown. In this apparatus 300, a case is shown in which ultraviolet rays 213 (see FIG. 15) are used as energy rays used to cure the lens precursor 10b.
[0038]
The device 300 includes a sealed box 86, and an inert gas inlet 82, an exhaust port 84, and a UV emission section 90 installed in the box 86. The inert gas inlet 82 is provided for introducing an inert gas such as nitrogen or argon into the box 86. When curing the lens precursor 10b, it is preferable that oxygen does not exist around the lens precursor 10b. For this reason, for example, the lens precursor 10b is cured while the inside of the box 86 is filled with the inert gas.
[0039]
In addition, the optical element array 1000 is installed with the emission surface or the like (not shown) facing vertically downward. In FIG. 15, the surface of the optical element array 1000 opposite to the installation surface (emission surface) of the lens precursor 10 b is adhered with an adhesive 80. An example of the adhesive 80 is an adhesive tape.
[0040]
Further, in the apparatus 300 shown in FIG. 15, a UV irradiation optical fiber 90 is provided to irradiate the lens precursor 10b with ultraviolet rays. After the ultraviolet rays 213 are emitted from the UV emitting section 92 of the UV irradiation optical fiber 90, the lens precursor 10b is irradiated with the ultraviolet rays 213. Thereby, the lens precursor 10b is cured, and the lens 10 is formed.
[0041]
Through the above steps, as shown in FIG. 1C, the lens 10 is formed on the above-described emission surface 20 and the like. This lens 10 has a larger curvature and a higher height than the lens precursor 10b (see FIG. 1A) before the emission surface or the like 20 is directed vertically downward. The lens 10 is formed of a material that is transparent to light emitted or incident from the emission surface 20 or the like.
[0042]
According to the method for manufacturing an optical element of the present embodiment, the lens precursor 10b is cured in a state where the emission surface 20 and the like are directed substantially vertically downward. Thus, the curvature and height of the lens can be increased by a simple method without requiring a surface treatment or the like for increasing the curvature and height of the lens.
[0043]
Further, by directly forming the lens 10 on the emission surface 20 or the like, alignment between the emission surface 20 or the lens 10 and the lens 10 can be easily performed. Thereby, productivity can be improved.
[0044]
In the present embodiment, after the lens precursor 10b is cured for a predetermined time with the emission surface 20 being substantially vertically upward, the lens precursor 10b is cured with the emission surface 20 being substantially vertically downward. can do. Here, the time for curing the lens precursor 10b in a state where the emission surface or the like 20 is substantially vertically upward and the time for curing the lens precursor 10b in a state where the emission surface or the like 20 is substantially vertically downward are adjusted. Thereby, the shape of the lens precursor 10b can be adjusted.
[0045]
In addition, for example, because the viscosity of the lens precursor 10b is low, if the exit surface or the like 20 is oriented substantially vertically downward and the lens precursor 10b cannot be held on the exit surface or the like 20, first, the exit surface or the like 20 is oriented substantially vertically upward. In this state, the lens precursor 10b is cured for a predetermined time, so that the viscosity of the lens precursor 10b is reduced to such an extent that the lens precursor 10b can be held on the emission surface 20 when the emission surface 20 is oriented substantially vertically downward. Enhance. After that, the lens 10 can be formed by curing the lens precursor 10b in a state where the emission surface 20 and the like are directed substantially vertically downward. As described above, the lens 10 having a desired shape can be formed even when the viscosity of the lens precursor 10b is low.
2. Surface-emitting type light-emitting element
Next, an example of a light emitting element obtained by using the above-described method for manufacturing an optical element will be described. In the present embodiment, a case where a surface-emitting type light-emitting element (surface-emitting type semiconductor laser) 100 is used as an optical element will be described.
[0046]
(Structure of surface-emitting light-emitting element)
FIG. 2 is a cross-sectional view schematically illustrating a surface-emitting light emitting device 100 obtained by applying the above-described method for manufacturing an optical element. FIG. 3 is a plan view schematically showing the surface-emitting light emitting device 100 shown in FIG. FIG. 2 is a diagram showing a cross section taken along line AA of FIG.
[0047]
As shown in FIG. 2, a surface-emitting type light emitting device 100 of the present embodiment includes a substrate (n-type GaAs substrate in the present embodiment) 101 and a vertical resonator (hereinafter referred to as a “resonator”) formed on the substrate 101. 140). The surface emitting light emitting element 100 can emit laser light in a direction perpendicular to the substrate 101 from an emission surface 108 provided on the upper surface of the resonator 140.
[0048]
In the surface-emitting type light emitting device 100 of the present embodiment, a lens 110 is provided on the emission surface 108. The lens 110 is formed by applying the above-described method for manufacturing an optical element. The method for manufacturing the lens 110 will be described later in the section “Method for Manufacturing Surface-Emitting Light-Emitting Element”.
[0049]
The lens 110 is formed of a material that is transparent to laser light emitted from the emission surface 108. As described above, since the lens 110 is made of a material transparent to the laser light, it is possible to efficiently emit the laser light, and to obtain a highly efficient surface-emitting type semiconductor laser capable of controlling the mode. Can be.
[0050]
Next, other components of the surface-emitting light emitting device 100 will be described.
[0051]
In the present embodiment, the resonator 140 includes a columnar semiconductor deposit (hereinafter referred to as a “columnar portion”) 130, and the side surface of the columnar portion 130 is covered with the insulating layer 106.
[0052]
The columnar section 130 is formed in the resonator 140. Here, the columnar part 130 is a part of the resonator 140 and refers to a columnar semiconductor deposit including at least the second mirror 104. This columnar portion 130 is embedded with the insulating layer 106. That is, the side surface of the columnar portion 130 is surrounded by the insulating layer 106. Further, a first electrode 107 is formed on the columnar section 130. The first electrode 107 has an opening 118 on the upper surface 130 a of the columnar section 130, and an emission surface 108 is provided in the opening 118.
[0053]
The resonator 140 is, for example, an n-type Al _0.9 Ga _0.1 As layer and n-type Al _0.15 Ga _0.85 40 pairs of distributed reflection type multilayer mirrors (hereinafter, referred to as “first mirrors”) 102 in which As layers are alternately stacked, a GaAs well layer and an Al layer _0.3 Ga _0.7 An active layer 103 composed of an As barrier layer, including a quantum well structure having three well layers, and p-type Al _0.9 Ga _0.1 As layer and p-type Al _0.15 Ga _0.85 30 pairs of distributed reflection type multilayer mirrors (hereinafter, referred to as “second mirrors”) 104 in which As layers are alternately stacked are sequentially stacked. Note that the composition and the number of layers constituting each of the first mirror 102, the active layer 103, and the second mirror 104 are not limited thereto.
[0054]
The second mirror 104 is made p-type by doping C, for example, and the first mirror 102 is made n-type by doping Si, for example. Therefore, the second mirror 104, the active layer 103 not doped with impurities, and the first mirror 102 form a pin diode.
[0055]
In the present embodiment, the portion of the resonator 140 from the laser light emission side of the surface emitting light emitting element 100 to the middle of the first mirror 102 is etched into a circular shape when viewed from the laser light emission side. The case where the columnar portion 130 is formed by the above process will be described. In the present embodiment, the planar shape of the columnar portion 130 is circular, but the shape can be any shape.
[0056]
Further, a current confinement layer 105 made of aluminum oxide can be formed in a region near the active layer 103 among the layers constituting the second mirror 104. The current confinement layer 105 is formed in a ring shape. That is, the current constriction layer 105 has a concentric circular planar shape. In other words, the cross section of the current constriction layer 105 when cut along a plane parallel to the XY plane in FIG. 2 is concentric.
[0057]
In the surface-emitting light emitting device 100 according to the present embodiment, the insulating layer 106 is formed so as to cover the side surface of the columnar portion 130 and the upper surface of the first mirror 102.
[0058]
In the manufacturing process of the surface-emitting type light emitting device 100, after forming the insulating layer 106 covering the side surface of the columnar portion 130, the first electrode 107 is provided on the upper surface of the columnar portion 130 and the upper surface of the insulating layer 106. The second electrodes 109 are formed on 101b, respectively. When these electrodes are formed, an annealing process is generally performed at about 400 ° C. (see a manufacturing process described later). Therefore, when the insulating layer 106 is formed using a resin, the resin forming the insulating layer 106 needs to have excellent heat resistance in order to withstand the annealing process. In order to satisfy this requirement, it is desirable that the resin constituting the insulating layer 106 is a polyimide resin, a fluorine resin, an acrylic resin, an epoxy resin, or the like. Desirably, it is a resin.
[0059]
The first electrode 107 and the second electrode 109 are provided for injecting a current into the resonator 140. Specifically, a current is injected into active layer 103 by first electrode 107 and second electrode 109.
[0060]
As shown in FIG. 2, at least a part of the first electrode 107 is formed on the upper surface of the columnar part 130. Specifically, the first electrode 107 is formed on the upper surface of the columnar section 130 and on the insulating layer 106. The first electrode 107 can be formed, for example, from a stacked film of an alloy of Au and Zn and Au.
[0061]
Further, the first electrode 107 has an opening 118 on the upper surface 130 a of the resonator 130. That is, a portion (opening 118) where the first electrode 107 is not formed is provided at the center of the upper surface 130a of the columnar portion 130. The emission surface 108 is provided in the opening 118. This emission surface 108 becomes an emission port for laser light. In the surface-emitting light emitting device 100 of the present embodiment, a case where the emission surface 108 is circular is shown.
[0062]
Further, a second electrode 109 is formed on the back surface 101b of the substrate 101. That is, in the surface-emitting type light emitting device 100 shown in FIG. 2, the first electrode 107 is bonded on the columnar portion 130 and the second electrode 109 is bonded on the back surface 101 b of the substrate 101. The second electrode 109 can be formed from, for example, a laminated film of an alloy of Au and Ge and Au.
[0063]
(Operation of surface-emitting type light-emitting element)
The general operation of the surface emitting light emitting device (surface emitting semiconductor laser) 100 of the present embodiment will be described below. The following method of driving a surface emitting semiconductor laser is an example, and various changes can be made without departing from the spirit of the present invention.
[0064]
First, when a forward voltage is applied to the pin diode between the first electrode 107 and the second electrode 109, recombination of electrons and holes occurs in the active layer 103, and light emission due to the recombination occurs. Stimulated emission occurs when the generated light reciprocates between the second mirror 104 and the first mirror 102, and the light intensity is amplified. When the optical gain exceeds the optical loss, laser oscillation occurs, and the light enters the lens 110 from the emission surface 108 on the upper surface of the columnar portion 130. After the radiation angle is adjusted by the lens 110, laser light is emitted in a direction perpendicular to the substrate 101 (Z direction shown in FIG. 2). Here, the “perpendicular direction to the substrate 101” refers to a direction (Z direction in FIG. 2) perpendicular to the surface 101a of the substrate 101 (a plane parallel to the XY plane in FIG. 2).
[0065]
(Manufacturing process of surface emitting light emitting device)
Next, an example of a method for manufacturing the surface emitting light emitting device 100 shown in FIGS. 2 and 3 will be described with reference to FIGS. 4 to 10 are cross-sectional views schematically showing one manufacturing process of the surface-emitting light emitting device 100 according to the present embodiment shown in FIGS. 2 and 3, each corresponding to the cross section shown in FIG. 1. .
[0066]
(1) First, a semiconductor multilayer film 150 is formed on the surface of a substrate 101 made of n-type GaAs by epitaxial growth while modulating the composition (see FIG. 4).
[0067]
Here, the semiconductor multilayer film 150 is, for example, an n-type Al _0.9 Ga _0.1 As layer and n-type Al _0.15 Ga _0.85 Forty pairs of first mirrors 102 alternately stacked with As layers, a GaAs well layer and Al _0.3 Ga _0.7 An active layer 103 composed of an As barrier layer, including a quantum well structure having three well layers, and p-type Al _0.9 Ga _0.1 As layer and p-type Al _0.15 Ga _0.85 It comprises 30 pairs of second mirrors 104 in which As layers are alternately stacked. By laminating these layers on the substrate 101 in order, the semiconductor multilayer film 150 is formed. When growing the second mirror 104, at least one layer near the active layer 103 is formed as an AlAs layer or an AlGaAs layer having an Al composition of 0.95 or more (a layer having a high Al composition). This layer is oxidized later to form the current confinement layer 105. In addition, it is desirable that the outermost layer of the second mirror 104 has a high carrier density and facilitates ohmic contact with an electrode (a first electrode 107 described later).
[0068]
The temperature at which the epitaxial growth is performed is appropriately determined depending on the growth method, the raw material, the type of the substrate 101, or the type, thickness, and carrier density of the semiconductor multilayer film 150 to be formed, but is generally 450 ° C. to 800 ° C. Is preferred. Also, the time required for performing epitaxial growth is appropriately determined in the same manner as the temperature. In addition, as a method for epitaxial growth, a metal organic vapor phase epitaxy (MOVPE) method, a molecular beam epitaxy (MBE) method, or a liquid phase epitaxy (LPE) method can be used.
[0069]
(2) Subsequently, the columnar portion 130 is formed (see FIG. 5).
[0070]
Specifically, a photoresist (not shown) is applied on the semiconductor multilayer film 150 and then patterned by a photolithography method to form a resist pattern R100 having a predetermined pattern. Then, using the resist layer R100 as a mask, the second mirror 104, the active layer 103, and a part of the first mirror 102 are etched by, for example, a dry etching method to form a columnar semiconductor deposition body (columnar portion) 130. I do. Through the above steps, the resonator 140 including the columnar section 130 is formed on the substrate 101 as shown in FIG. After that, the resist layer R100 is removed.
[0071]
(3) Next, a current confinement layer 105 is formed as necessary (see FIG. 6).
[0072]
Specifically, as shown in FIG. 6, the substrate 101 on which the resonator 140 has been formed by the above-described process is put into a steam atmosphere of, for example, about 400 ° C., so that the Al composition in the second mirror 104 is changed. The current confinement layer 105 can be formed by oxidizing a layer having a high impurity concentration from the side. The oxidation rate depends on the temperature of the furnace, the supply amount of water vapor, the Al composition and the thickness of the layer to be oxidized (the layer having a high Al composition). In a surface-emitting light emitting device including a current confinement layer formed by oxidation, current flows only in a portion where a current confinement layer is not formed (a portion not oxidized) when driving. Therefore, in the step of forming the current confinement layer by oxidation, the current density can be controlled by controlling the range of the current confinement layer 105 to be formed.
[0073]
(4) Next, the insulating layer 106 surrounding the columnar portion 130 is formed (see FIG. 7).
[0074]
Here, a case where a polyimide resin is used as a material for forming the insulating layer 106 will be described. First, a resin precursor (polyimide precursor) is applied on the resonator 140 by using, for example, a spin coating method to form a resin precursor layer (not shown). At this time, the resin precursor layer is formed so that the thickness thereof is larger than the height of the columnar section 130. As a method for forming the resin precursor layer, a known technique such as a dipping method, a spray coating method, and an ink jet method can be used in addition to the spin coating method described above.
[0075]
Next, the substrate is heated using a hot plate or the like to remove the solvent, and then the upper surface 130a (see FIG. 7) of the columnar section 130 is exposed. As a method of exposing the upper surface 130a of the columnar portion 130, a CMP method, a dry etching method, a wet etching method, or the like can be used. Thereafter, the insulating layer 106 is formed by imidizing the resin precursor layer in a furnace at about 350 ° C. Note that the insulating layer which has been almost completely cured through the imidization step may be etched to expose the upper surface 130a of the columnar portion 130.
[0076]
(5) Next, a first electrode 107 and a second electrode 109 for injecting a current into the active layer 103, and a laser light emission surface 108 are formed (see FIG. 8).
[0077]
First, before forming the first electrode 107 and the second electrode 109, the upper surface 130a of the columnar portion 130 is cleaned using a plasma processing method or the like, if necessary. Thereby, an element having more stable characteristics can be formed. Subsequently, a laminated film (not shown) of, for example, an alloy of Au and Zn and Au is formed on the insulating layer 106 and the upper surface 130a (see FIG. 7) of the columnar section 130 by, for example, a vacuum evaporation method. In this case, an Au layer is formed on the outermost surface. Next, a portion where the laminated film is not formed is formed on the upper surface 130a of the columnar portion 130 by a lift-off method. This portion becomes the opening 118 (see FIG. 8). The emission surface 108 is provided in the opening 118. That is, a region in the opening 118 of the upper surface 130 a of the columnar portion 130 functions as the emission surface 108. Note that in the above step, a dry etching method can be used instead of the lift-off method.
[0078]
Further, a laminated film (not shown) of, for example, an alloy of Au and Ge and Au is formed on the back surface 101b of the substrate 101 by, for example, a vacuum evaporation method. Next, an annealing process is performed. The annealing temperature depends on the electrode material. In the case of the electrode material used in this embodiment, it is usually performed at about 400 ° C.
[0079]
Through the steps (1) to (5) described above, the optical element section 160 including the emission surface 108 is formed (see FIG. 8). The optical element 160 is a part necessary for the surface emitting light emitting element 100 to be driven as an element.
[0080]
(6) Next, the lens 110 is formed on the emission surface 108 (see FIGS. 9 and 10).
[0081]
More specifically, first, as shown in FIG. 10, a lens precursor 110b is formed on the emission surface 108 by discharging a droplet 110a toward the emission surface 108 by an inkjet method. Here, a case where the lens precursor 110b is made of an ultraviolet curable resin will be described.
[0082]
Examples of the inkjet discharge method include: (i) a method of generating pressure by changing the size of bubbles in a liquid (here, a lens material) by heat to discharge a liquid, and (ii) generating a pressure by a piezoelectric element. There is a method of discharging liquid by pressure. From the viewpoint of controllability of pressure, the method (ii) is preferable.
[0083]
The alignment between the position of the nozzle 112 of the inkjet head 120 and the discharge position of the droplet 110a is performed using a known image recognition technique used in an exposure step and an inspection step in a general semiconductor integrated circuit manufacturing process. For example, as shown in FIG. 9, alignment between the position of the nozzle 112 of the inkjet head 120 and the opening 118 of the surface-emitting type light emitting element 100 is performed by image recognition. After the alignment, the voltage applied to the inkjet head 120 is controlled, and then the droplet 110a is ejected. Thus, a lens precursor 110b is formed on the emission surface 108 (see FIG. 10).
[0084]
In this case, the ejection angle of the droplet 110a ejected from the nozzle 112 varies to some extent. However, if the position where the droplet 110a lands is inside the opening 118, the droplet 110a wets and spreads and automatically Is corrected.
[0085]
After performing the above steps, as shown in FIG. 10, the exit surface 108 is directed almost vertically downward (white shown in FIG. 10) by the same method as the above-described method for manufacturing an optical element (see FIG. 1B). The lens precursor 110b is hardened in the state of (drawing arrow direction). Through this step, the lens 110 is formed on the light exit surface 108. Specifically, by setting the exit surface 108 to be substantially vertically downward, the lens precursor 110b is pulled vertically downward by gravity. As a result, as shown in FIG. Extends downward. In this state, the energy beam is applied to the lens precursor 110b to cure the lens precursor 110b. Through this step, the lens 110 is obtained. The curvature and height of the obtained lens 110 are larger than the curvature and height of the lens precursor 110b before the emission surface 108 is directed vertically downward.
[0086]
In this step, for example, the lens precursor 110b can be cured using the apparatus 300 shown in FIG. In the apparatus 300 shown in FIG. 15, instead of the adhesive 80, an element can be attached to a vacuum suction stage and turned over as it is to be installed on the box 86.
[0087]
The optimal wavelength and irradiation amount of the ultraviolet ray depend on the material of the lens precursor 110b. For example, when the precursor 110b is formed using an acrylic ultraviolet curable resin, curing is performed by irradiating an ultraviolet ray having a wavelength of about 350 nm and an intensity of 10 mW for 5 minutes.
[0088]
Through the above process, the surface emitting light emitting device 100 shown in FIGS. 2 and 3 is obtained.
[0089]
(Action and effect)
The surface-emitting light emitting device 100 according to the present embodiment has the same operation and effect as the above-described method for manufacturing an optical element. Further, in the present embodiment, the case where the surface emitting light emitting element 100 is a surface emitting semiconductor laser has been described. In this case, the following operations and effects are obtained.
[0090]
The surface emitting semiconductor laser is expected to be applied to a light source of an optical interconnection having a higher transmission speed between computers or inside a computer. This surface-emitting type semiconductor laser has advantages in that it is easy to increase the number of channels, high-speed response, low power consumption, and the like.
[0091]
When a surface-emitting type semiconductor laser is used as the above-described light source, it is necessary to consider coupling with an optical waveguide such as an optical fiber. On the other hand, the radiation angle of a surface emitting semiconductor laser largely depends on the design of an optical coupling system between the laser and the optical waveguide. Here, when the radiation angle is large, a lens having a large numerical aperture is required, which results in a complicated optical coupling system and an increase in cost. It is also important to improve the alignment accuracy between the surface emitting semiconductor laser and the lens in order to increase the coupling efficiency between the surface emitting semiconductor laser and the lens.
[0092]
According to the method for manufacturing the surface-emitting type light-emitting device 100 of the present embodiment, the lens precursor 110b is cured in a state where the emission surface 108 is directed substantially vertically downward. Thus, the curvature and height of the lens can be increased by a simple method without requiring a surface treatment or the like for increasing the curvature and height of the lens. Thereby, the configuration of the optical coupling system can be simplified and the cost can be reduced.
[0093]
In addition, by forming the lens 110 directly on the emission surface 108, the alignment accuracy between the optical element 160 of the surface emitting type light emitting element (surface emitting type semiconductor laser) 100 and the lens 110 can be improved. Accordingly, the coupling efficiency between the surface-emitting type light-emitting element (surface-emitting type semiconductor laser) 100 and the lens 110 can be increased, and the productivity can be improved.
[0094]
[Second embodiment]
1. Optical element manufacturing method
In the present embodiment, a case will be described in which a lens is formed by discharging a first droplet and a second droplet onto the emission surface 20 or the like. Hereinafter, three examples (first to third examples) to which the method of manufacturing an optical element according to the present embodiment is applied will be described. These examples differ in the method and order of curing the droplets.
[0095]
In any of the examples, the optical element to be formed is, for example, a light-emitting element or a light-receiving element, like the optical element 70 of the first embodiment, and a light-emitting portion (emission surface) or light. And a part (incident surface) for taking in. Further, as specific light emitting elements and light receiving elements to which these examples can be applied, the elements exemplified in the first embodiment can be given.
[0096]
In each example, in principle, the same components as those shown in the method for manufacturing the optical element according to the first embodiment (see FIGS. 1A to 1C) are denoted by the same reference numerals. The detailed description is omitted.
[0097]
(1) First embodiment
In the first embodiment, a case will be described in which the first droplet and the second droplet are sequentially discharged and then cured to form the lens 21 (see FIGS. 11A to 11D). . 11A to 11D are cross-sectional views schematically illustrating a first example to which the method for manufacturing an optical element according to the present embodiment is applied.
[0098]
First, an optical element section 22 including an emission surface 20 and the like is formed by the same method as that described in the first embodiment (see FIG. 11A).
[0099]
Next, a first lens precursor 30b is formed on the emission surface or the like 20 by discharging the first droplet 30a from the droplet emission port 12 toward the emission surface or the like 20 (see FIG. 11A). ).
[0100]
Further, by discharging a second droplet 40a having a higher viscosity than the first droplet 30a from the droplet discharge port 12 toward the first droplet 30a, the second droplet 40a is discharged onto the first lens precursor 30b. A two-lens precursor 40b is formed (see FIG. 11B).
[0101]
The method of discharging the first and second droplets 30a and 40a is the same as the method of discharging the droplet 10a in the first embodiment. Further, as described above, the material of the first and second droplets 30a and 40a is the same as that of the first embodiment as long as the condition that the viscosity of the second droplet 40a is higher than that of the first droplet 30a is satisfied. The same material as the material of the droplet 10a in the embodiment can be used.
[0102]
Next, the first and second lens precursors 30b and 40b are cured (see FIG. 11C). As a result, the lens 21 is formed on the emission surface 20 or the like (see FIG. 11D). As shown in FIG. 11D, the lens 21 includes a first lens unit 30 and a second lens unit 40 formed on the first lens unit 30. Here, the refractive index of the first lens unit 30 and the refractive index of the second lens unit 40 can be made substantially equal.
[0103]
Alternatively, the refractive index of the first lens unit 30 can be larger than the refractive index of the second lens unit 40. In this case, the focal length of the lens 21 can be shortened. The refractive indices of the first and second lens units 30, 40 can be adjusted by appropriately selecting the materials used to form them. Through the steps described above, the optical element 72 is obtained (see FIG. 11D).
[0104]
According to the method of manufacturing the optical element 72 according to the present embodiment, the first lens 30a is ejected toward the first droplet 30a by discharging the second droplet 40a having a higher viscosity than the first droplet 30a. By forming and curing the second lens precursor 40b on the precursor 30b, a lens 21 having a large curvature and a high height can be formed on the emission surface 20 or the like.
[0105]
(2) Second embodiment
In the second embodiment, a case will be described in which a first droplet and a second droplet are sequentially discharged, and then cured while the emission surface or the like 20 is directed vertically downward to form a lens 31 (FIG. 12 (a) to 12 (d)). 12A to 12D are cross-sectional views schematically showing a second example to which the method of manufacturing an optical element according to the present embodiment is applied.
[0106]
First, similarly to the first embodiment, the optical element section 22 including the emission surface 20 and the like is formed (see FIG. 12A).
[0107]
Next, the first lens precursor 30b is formed on the emission surface or the like 20 by discharging the first droplet 30a from the droplet emission port 12 toward the emission surface or the like 20 (see FIG. 12A). ).
[0108]
Further, by discharging a second droplet 50a having a higher viscosity than the first droplet 30a toward the first droplet 30a, the second lens precursor 50b is placed on the first lens precursor 30b. It is formed (see FIG. 12B).
[0109]
The method of discharging the first and second droplets 30a and 50a is the same as the method of discharging the droplet 10a in the first embodiment. Further, as described above, the material of the first and second droplets 30a and 50a is the same as that of the first embodiment as long as the condition that the viscosity of the second droplet 50a is lower than that of the first droplet 30a is satisfied. The same material as the material of the droplet 10a in the embodiment can be used.
[0110]
Next, the first and second lens precursors 30b and 50b are cured in a state where the emission surface 20 and the like are directed vertically downward (the direction of the white arrow shown in FIG. 12C) (see FIG. 12C). . Specifically, the first and second lens precursors 30b are pulled vertically downward by gravitational force by setting the emission surface 20 and the like to be almost vertically downward, as shown in FIG. 12C. The first and second lens precursors 30b, 50b extend vertically downward. In particular, since the second lens precursor 50b has a lower viscosity than the first lens precursor 30b, the second lens precursor 50b extends downward from the first lens precursor 30b. In this state, the first and second lens precursors 30b, 50b are cured by applying the energy rays 13 to the first and second lens precursors 30b, 50b. Through the above steps, the lens 31 is obtained. The curvature and height of the obtained lens 31 are larger than the curvature and height of the first and second lens precursors 30b and 50b (see FIG. 12B) before the emission surface 20 or the like is directed vertically downward.
[0111]
In order to increase the curvature and height of the obtained lens 31, it is preferable that the material for forming the first and second lens precursors 30b and 50b has a large specific gravity. However, in this case, the first lens precursor 30b from the emission surface 20 and the second lens precursor 50b from the first lens precursor 30b do not separate when the emission surface 20 is oriented vertically downward. Is required. As a result, the lens 31 is formed on the emission surface 20 or the like 20 (see FIG. 12D).
[0112]
The lens 31 includes a first lens unit 30 and a second lens unit 50 formed on the first lens unit 30, as shown in FIG. Here, the refractive index of the first lens unit 30 and the refractive index of the second lens unit 50 can be made substantially equal.
[0113]
Alternatively, the refractive index of the first lens unit 30 can be larger than the refractive index of the second lens unit 50. In this case, the focal length of the lens 31 can be shortened. The refractive indices of the first and second lens sections 30, 50 can be adjusted by appropriately selecting the materials used to form them. Through the above steps, the optical element 74 is obtained (see FIG. 12D).
[0114]
According to the method for manufacturing the optical element 74 according to the present embodiment, the first lens 30a is ejected toward the first droplet 30a by discharging the second droplet 50a having a lower viscosity than the first droplet 30a. After forming the second lens precursor 50b on the precursor 30b, the first and second lens precursors 30b, 50b are cured. In this case, since the second lens precursor 50b has a lower viscosity than the first lens precursor 30b, the second lens precursor 50b extends downward from the first lens precursor 30b. Thereby, the curvature and height of the finally obtained lens 31 can be increased.
[0115]
(3) Third embodiment
In the third embodiment, a part of the lens (the first lens unit 30) is formed on the emission surface 20 or the like by discharging and curing the first droplet 30a toward the emission surface 20 or the like. Next, a case will be described in which the second droplet 60a is ejected toward a part of the lens and then cured to form the lens 41 on the emission surface 20 or the like (FIGS. 13A to 13D). 13 (e)). 13A to 13E are cross-sectional views schematically showing a third example to which the method for manufacturing an optical element according to the present embodiment is applied.
[0116]
First, similarly to the first embodiment, the optical element section 22 including the emission surface 20 and the like is formed (see FIG. 13A).
[0117]
Next, the first droplet 30a is discharged toward the emission surface or the like 20 to form a first lens precursor 30b on the emission surface or the like 20 (see FIG. 13A).
[0118]
Next, by applying the energy beam 13 to the first lens precursor 30b, the first lens precursor 30b is cured to form a part of the lens (the first lens unit 30) (FIG. 13B )reference).
[0119]
Further, the second lens precursor 60b is formed on the first lens unit 30 by discharging the second droplet 60a toward the first lens unit 30 (see FIG. 13C).
[0120]
Subsequently, the energy beam 13 is applied to the second lens precursor 60b to cure the second lens precursor 60b (see FIG. 13D). Thus, the second lens unit 60 is formed on the first lens unit 30. Through the above steps, the lens 41 is formed on the emission surface 20 or the like 20 (see FIG. 13E). As shown in FIG. 13E, the lens 41 includes a first lens unit 30 and a second lens unit 60 formed on the first lens unit 30. Here, the refractive index of the first lens unit 30 and the refractive index of the second lens unit 60 can be made substantially equal.
[0121]
Alternatively, the refractive index of the first lens unit 30 can be larger than the refractive index of the second lens unit 60. In this case, the focal length of the lens 41 can be shortened. The refractive indices of the first and second lens units 30, 60 can be adjusted by appropriately selecting the materials used to form them. Through the above steps, the optical element 76 is obtained (see FIG. 13E).
[0122]
The method of discharging the first and second droplets 30a and 60a is the same as the method of discharging the droplet 10a in the first embodiment. Further, as described above, the material of the first and second droplets 30a and 60a is the same as that of the first embodiment as long as the condition that the viscosity of the second droplet 60a is lower than that of the first droplet 30a is satisfied. The same material as the material of the droplet 10a in the embodiment can be used.
[0123]
The method of curing the first and second lens precursors 30b and 60b is the same as in the first embodiment.
[0124]
According to the method of manufacturing the optical element 76 according to the present embodiment, the second lens precursor 60b is cured after the first lens precursor 30b is cured. Thereby, even when the viscosity of the first lens precursor 30b is low, the first lens precursor 30b can be surely cured.
[0125]
In the present example, when the first lens precursor 30b and / or the second lens precursor 60b are cured, similarly to the curing step of the lens precursor 10b in the first embodiment, the emission surface 20 and the like are set. Curing can also be performed in a state where it is directed vertically downward. In this case, similarly to the first embodiment, a lens 41 having a large curvature and a large height can be obtained.
2. Surface-emitting type light-emitting element
Next, the surface emitting light emitting device 200 according to the present embodiment will be described.
[0126]
FIG. 14 is a cross-sectional view schematically showing a surface-emitting light emitting device 200 according to a second embodiment of the present invention.
[0127]
The surface-emitting light emitting device 200 according to the present embodiment is different from the first embodiment in that the lens 210 is formed by applying the above-described method for manufacturing an optical element according to the present embodiment. Has substantially the same structure as the surface emitting light emitting device 100 according to the first embodiment. Components having substantially the same functions as those of the surface-emitting light emitting device 100 according to the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0128]
The lens 210 includes a first lens unit 220 and a second lens unit 240 formed on the first lens unit 220. The lens 210 can be formed by applying any one of the first to third embodiments described above.
[0129]
According to the surface-emitting light emitting device 200, the surface of the first embodiment described above can exhibit the same operation and effect as the light emitting device 100. In addition, according to the surface-emitting type light emitting device 200, the same operation and effect as those of the above-described first to third embodiments can be obtained by the formation process.
[0130]
The present invention is not limited to the embodiments described above, and various modifications are possible. For example, the invention includes configurations substantially the same as the configurations described in the embodiments (for example, a configuration having the same function, method, and result, or a configuration having the same object and result). Further, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. Further, the invention includes a configuration having the same operation and effect as the configuration described in the embodiment, or a configuration capable of achieving the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.
[0131]
For example, in the surface-emitting light-emitting element of the above embodiment, the surface-emitting light-emitting element having one columnar portion has been described. Not. Further, even when a plurality of surface emitting light emitting elements are arrayed, the same operation and effect can be obtained.
[0132]
Further, for example, in the surface emitting light emitting device of the above embodiment, even if the p type and the n type in each semiconductor layer are interchanged, the purpose of the present invention is not deviated. In the surface-emitting light emitting device of the above-described embodiment, an AlGaAs-based light emitting device has been described. It is also possible to use a GaAsSb-based semiconductor material.
[0133]
Further, in the surface-emitting light emitting device of the above embodiment, the case where the GaAs substrate is used as the compound semiconductor substrate has been described. A compound semiconductor substrate such as a substrate, a CdTe substrate, a ZnTe substrate, or a CdS substrate can also be used.
[Brief description of the drawings]
FIGS. 1A to 1C are cross-sectional views schematically showing a method for manufacturing an optical element according to a first embodiment to which the present invention is applied.
FIG. 2 is a cross-sectional view schematically showing a surface-emitting light-emitting element obtained by applying the method for manufacturing an optical element according to the first embodiment.
FIG. 3 is a plan view schematically showing the surface-emitting light emitting device shown in FIG.
FIG. 4 is a cross-sectional view schematically showing one manufacturing process of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIG. 5 is a cross-sectional view schematically showing one manufacturing process of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIG. 6 is a cross-sectional view schematically showing one manufacturing process of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIG. 7 is a cross-sectional view schematically showing one manufacturing process of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIG. 8 is a cross-sectional view schematically showing one manufacturing process of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIG. 9 is a cross-sectional view schematically showing one manufacturing step of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIG. 10 is a cross-sectional view schematically showing one manufacturing process of the surface-emitting light emitting device shown in FIGS. 2 and 3.
FIGS. 11A to 11D are cross-sectional views schematically showing one example of a method for manufacturing an optical element according to a second embodiment to which the present invention is applied.
FIGS. 12A to 12D are cross-sectional views schematically showing one example of a method for manufacturing an optical element according to a second embodiment of the present invention.
FIGS. 13A to 13E are cross-sectional views schematically showing one example of a method for manufacturing an optical element according to a second embodiment of the present invention.
FIG. 14 is a cross-sectional view schematically illustrating a surface-emitting type light-emitting element obtained by applying the method for manufacturing an optical element according to the second embodiment.
FIG. 15 is a diagram schematically illustrating an apparatus used for curing a lens precursor in a state where an exit surface or an entrance surface is directed substantially vertically downward.
[Explanation of symbols]
Reference Signs List 10 lens, 10a droplet, 10b lens precursor, 12 droplet discharge port, 13 energy ray, 20 exit surface or the like (exit surface or incident surface), 21, 31, 41 lens, 22 optical element section, 30 first lens Part, 30a first droplet, 30b first lens precursor, 40, 50, 60 second lens part, 40a, 50a, 60a second droplet, 40b, 50b, 60b second lens precursor, 70, 72, 74, 76 optical element, 80 adhesive, 82 inert gas introduction port, 84 exhaust port, 86 container, 90 UV irradiation optical fiber, 92 UV emission part, 100, 200 surface emitting light emitting element, 101 substrate 101a substrate front surface, 101b substrate rear surface, 102 first mirror, 103 active layer, 104 second mirror, 105 oxidation confinement layer, 106 insulating layer, 107 first electrode , 108 emission surface, 109 second electrode, 110, 210 lens, 110a droplet, 110b lens precursor, 112 nozzle, 113 energy beam, 118 opening, 120 inkjet head, 130 columnar portion, 130a upper surface of columnar portion, 140 Resonator, 150 semiconductor multilayer film, 160 optical element section, 213 ultraviolet ray, 220 first lens section, 240 second lens section, 300 device, 1000 optical element array

Claims (14)

A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging droplets toward the emission surface or the incidence surface, a lens precursor is formed on the emission surface or the incidence surface,
Curing the lens precursor in a state where the exit surface or the entrance surface is oriented substantially vertically downward, thereby forming a lens on the exit surface or the entrance surface. A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging droplets toward the emission surface or the incidence surface, a lens precursor is formed on the emission surface or the incidence surface,
After curing the lens precursor for a predetermined time in a state where the exit surface or the incident surface is substantially vertically upward, by curing the lens precursor in a state where the exit surface or the incident surface is substantially vertically downward, Forming a lens on the light exit surface or the light incident surface. A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging a first droplet toward the emission surface or the incidence surface, a first lens precursor is formed on the emission surface or the incidence surface,
Forming a second lens precursor on the first lens precursor by discharging a second droplet having a higher viscosity than the first droplet toward the first droplet;
Curing the first and second lens precursors to form a lens on the exit surface or the entrance surface. A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging a first droplet toward the emission surface or the incidence surface, a first lens precursor is formed on the emission surface or the incidence surface,
Forming a second lens precursor on the first lens precursor by discharging a second droplet having a lower viscosity than the first droplet toward the first droplet;
Curing the first and second lens precursors with the exit surface or entrance surface oriented substantially vertically downward, thereby forming a lens on the exit surface or entrance surface. Production method. A method for producing an optical element that emits light from an emission surface or captures light from an incidence surface,
By discharging and curing the first droplet toward the emission surface or the incident surface, a part of the lens is formed on the emission surface or the incident surface,
Forming a lens on the exit surface or the entrance surface by discharging and curing the second droplet toward a part of the lens, thereby forming a lens. In claim 5,
A method for manufacturing an optical element, wherein the first droplet is cured with the exit surface or the entrance surface being directed substantially vertically downward. In claim 5 or 6,
A method for manufacturing an optical element, wherein the second droplet is cured with the exit surface or the entrance surface facing substantially vertically downward. In claim 1 or 2,
The method of manufacturing an optical element, wherein the discharging of the droplet is performed by an inkjet method or a dispenser method. In any one of claims 3 to 7,
The method of manufacturing an optical element, wherein the ejection of the first and second droplets is performed by an inkjet method or a dispenser method. In claim 1 or 2,
The method for manufacturing an optical element, wherein the droplet is made of a material curable by applying energy. In any one of claims 3 to 7,
The method for manufacturing an optical element, wherein the first and second droplets are made of a material curable by applying energy. In any one of claims 1 to 11,
The method for manufacturing an optical element, wherein the lens is made of an ultraviolet curable resin. In any one of claims 1 to 12,
The method for manufacturing an optical element, wherein the optical element is a surface-emitting type light emitting element. In claim 13,
The method for manufacturing an optical element, wherein the surface-emitting type light-emitting element is one of a surface-emitting type semiconductor laser, a semiconductor light-emitting diode, and an organic EL device.

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