JP2004119217A - Method for manufacturing display panel, and display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for a display panel, which can form a positioning mark capable of being recognized accurately. <P>SOLUTION: A positioning mark 14 is formed in a region where a swelled part 18a of a partition forming material layer 18 is not produced. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a display panel having an alignment mark and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art A plasma display panel (hereinafter, referred to as a PDP) displays an image by partitioning an airtight space formed between a pair of substrates into a stripe or a matrix and selectively generating a discharge in a plurality of discharge spaces. Is what you do.
[0003]
A general PDP includes, on the inner surface of a front substrate, a transparent electrode and a narrow bus electrode laminated thereon, a row electrode pair (display electrode) constituting a display line, a dielectric layer covering the row electrode pair, a MgO layer. The layers (protective layers) are provided in this order.
[0004]
On the other hand, the inner surface of the rear substrate opposed to the front substrate via the discharge space is formed in a direction orthogonal to the row electrode pairs and covers the column electrodes and the column electrodes constituting the discharge cells at each intersection with the row electrode pairs. A column electrode protective layer (white dielectric layer), partition walls for partitioning a discharge space for each discharge cell, and R, G, and B phosphor layers covering the column electrode protective layer between the partition walls and the side walls of the partition walls are provided. I have.
[0005]
The discharge space is filled with a discharge gas containing neon and xenon gas. The partition is a stripe-shaped partition provided between the column electrodes to partition the discharge cells in the row electrode direction, or a grid-like (border-shaped partition) partitioning the discharge cells in the row electrode direction and the column electrode direction.
[0006]
The dielectric layer covering the row electrode pair has a larger thickness on the bus electrode and between the bus electrodes than other portions, and has a raised dielectric layer protruding toward the discharge space. This raised dielectric layer prevents the discharge generated between the paired row electrodes from jumping in the column direction or spreading to cells adjacent in the row direction to cause erroneous discharge.
[0007]
The dielectric layer is formed by screen-printing a low-melting glass paste or transferring and patterning a film-like low-melting glass layer, followed by firing. In the display area of the panel, the non-display area outside the display area is uniformly solid except for the peripheral portion where the sealing layer is formed.
[0008]
In the above-mentioned PDP, in order to form the phosphor by printing between the partition walls, an alignment mark is used when aligning with the screen plate.
As shown in FIG. 1, the alignment marks 114 are respectively formed in a ring shape in the vicinity of four corners in the non-display area 113 on the outer periphery of the pattern to be printed (display area) 112 on the back substrate 111. .
The alignment marks 114 are aligned such that the screen plate-side alignment marks 115 are inside the ring of the alignment marks 114.
[0009]
Next, a method of forming the alignment mark 114 will be described. FIG. 2 is a schematic cross-sectional view of a manufacturing process for explaining formation of a positioning mark.
The alignment mark 114 is formed in the same step as the partition 121. That is, as shown in FIG. 2A, after the column electrode 116 and the column electrode protection layer 117 are formed on the back substrate 111, a resist film is formed on the partition wall forming material layer 118 made of a low melting point glass paste. Are laminated and patterned by a photolithography method to form a sand blast mask 119 corresponding to the partition pattern 121a and the ring-shaped alignment mark pattern 114a.
[0010]
Further, a sand blasting process is performed via a sand blasting mask 119, and finally sintering is performed to form partition walls 121 and alignment marks 114 as shown in FIG. 2B.
[0011]
FIG. 3 is a plan view showing the positional relationship between the alignment marks 114 and the partition walls 121 formed as described above. FIG. 4 is a sectional view taken along line V1-V1 of FIG. 3 and 4, reference numeral 111 denotes a rear substrate, 114 denotes an alignment mark, 116 denotes a column electrode, 117 denotes a column electrode protective layer, 121 denotes a partition, 123 denotes a dielectric layer, 123a denotes a raised dielectric layer, and 124 denotes a raised dielectric layer. The front substrate, 125 is a phosphor, S is a discharge space, and SL is a gap.
[0012]
[Problems to be solved by the invention]
However, in the formation of the alignment mark 114, when a thick film of the partition wall forming material is applied and then dried, the raised portion 122 having a width of about 5 mm is formed on the outer peripheral portion of the partition wall forming material layer 18 as shown in FIG. Occurs.
[0013]
As shown in FIGS. 1 and 3, the alignment mark 114 according to the related art is provided in a region where the above-mentioned raised portion 118a is generated. Since the width and the height of the raised portion 118a slightly change according to the change in the composition of the low melting point glass paste as the partition wall forming material, the height of the positioning mark 114 is the height of the raised portion 118a. And its height varies.
For this reason, when screen printing the phosphor paste, there is a problem that an error occurs in the alignment processing in the image processing of the alignment mark 114, and a printing shift occurs.
[0014]
The present invention has been made in consideration of the above-described problems, and has as its object to provide a method of manufacturing a display panel capable of producing an alignment mark that can be accurately recognized.
[0015]
[Means for Solving the Problems]
In the method for manufacturing a display panel according to the present invention, as described in claim 1, a partition wall forming material layer is formed by applying a partition wall forming material to a predetermined thickness on a substrate, and a surface of the partition wall forming material layer is formed. A display panel including a thick film pattern forming step of simultaneously performing a sand blasting process through a sand blast mask corresponding to the partition pattern and the alignment mark pattern, and then performing baking to form the partition and the alignment mark at the same time Wherein in the thick film pattern forming step, the alignment mark is formed at a position avoiding a protruding end of the applied partition wall forming material.
[0016]
Further, the display panel according to the present invention, as described in claim 2, a front substrate and a rear substrate facing each other via a discharge space, a sealing layer that seals around the front substrate and the rear substrate, A partition partitioning the discharge space in the display area, and an alignment mark in which a thick film pattern is formed simultaneously with the partition in a non-display area on the outer periphery, and a transparent electrode and a transparent electrode laminated on the inner face of the front substrate. A display electrode comprising a bus electrode, a dielectric layer covering the display electrode, and a raised dielectric layer formed on the bus electrode, wherein the dielectric layer is in the non-display area. It is characterized in that it is formed so as to extend, and the raised dielectric layer is formed so as to extend all over the non-display area except for a portion facing the alignment mark.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The display panel manufacturing method according to the present embodiment includes forming a partition wall forming material layer by applying a partition wall forming material to a predetermined thickness on a substrate, and forming a partition wall pattern and an alignment mark on the partition wall forming material layer. This is a manufacturing method including a thick film pattern forming step of performing sand blasting through a sand blasting mask corresponding to a pattern, and finally performing baking to simultaneously form partition walls and alignment marks.
[0018]
A thick film pattern forming process according to the embodiment will be described with reference to FIGS. FIG. 5 is a schematic cross-sectional view for explaining a thick film pattern forming step according to the embodiment.
[0019]
First, as shown in FIG. 5A, the alignment mark 14 is manufactured in the same step as the partition 21. That is, after the column electrode 16 and the column electrode protective layer 17 are formed on the rear substrate 11, a resist film is laminated thereon on a partition wall forming material layer 18 made of a low-melting glass paste, and patterned by a photolithography method. A sand blast mask 19 corresponding to the partition pattern 21a and the ring-shaped alignment mark pattern 14a is formed. At this time, the alignment mark pattern 14a is formed at a position avoiding the raised portion 18a of the applied partition wall forming material layer 18.
[0020]
Next, as shown in FIG. 5B, a sand blasting process is performed via a sand blasting mask 19, and finally sintering is performed to form the partition walls 21 and the alignment marks 14.
[0021]
As shown in FIG. 6, the alignment marks 14 formed in the above-described thick film pattern forming step are formed at four corners in the non-display area 13 on the outer periphery of the pattern to be printed (display area) 12 on the back substrate 11. Ring-shaped portions are formed in the vicinity, and are formed at positions (regions where the raised portions 18a do not occur) of the raised end portions 18b of the partition wall forming material layer 18 applied in the thick film pattern forming step of FIG. Is done.
[0022]
Note that the positioning mark 14 is used for positioning such that the alignment mark 15 on the screen plate side is located inside the ring of the positioning mark 14.
[0023]
FIG. 7 is a plan view showing the positional relationship between one of the alignment marks 14 formed as described above and the partition 21 in the pattern portion (display area) 12 to be printed. Further, FIG. 8 is a sectional view taken along line V2-V2 of FIG. 7, and FIG. 9 is a sectional view taken along line W2-W2 of FIG. 7 (only the front substrate side is shown).
7 to 9, reference numeral 11 denotes a rear substrate, 14 denotes a positioning mark, 16 denotes a column electrode, 17 denotes a column electrode protective layer, 21 denotes a partition, 23 denotes a dielectric layer, 23a denotes a raised dielectric layer, and 24 denotes a raised dielectric layer. A front substrate, 25 is a phosphor, S is a discharge space, and SL is a gap.
[0024]
As shown in the cross-sectional view of FIG. 8, the display panel according to the present embodiment seals the front substrate 24 and the rear substrate 11 facing each other via the discharge space S, and the periphery of the front substrate 24 and the rear substrate 11. It comprises a sealing layer, a partition 21 for partitioning the discharge space S of the display area 12, and an alignment mark 14 in which a thick film pattern is formed simultaneously with the partition 21 in the outer non-display area 13.
[0025]
Further, a display electrode 26 composed of a transparent electrode and a bus electrode laminated thereon, a dielectric layer 23 covering the display electrode 26, and a raised dielectric layer 23a formed on the bus electrode are formed on the inner surface of the front substrate 24. Have.
[0026]
Further, the dielectric layer 23 is formed so as to extend to the non-display area 13, and the raised dielectric layer 23 a is formed so as to extend all over the non-display area 13 except for the portion facing the alignment mark 14. ing.
[0027]
The alignment marks 14 are formed at the same time as the partition walls 21 by applying a thick film of the partition wall forming material and sandblasting the partition wall forming material. (A region where the raised portion 18a does not occur).
[0028]
Then, as shown in FIG. 7, the width of the ring-shaped alignment mark 14 is wider than the width of the partition 21, so that after firing, the height of the partition 21 is lower than that of the alignment mark 14. For this reason, the raised dielectric layer 23a is not formed in the portion facing the alignment mark 14 (raised notch 23b in FIG. 9).
[0029]
Since the width of the ring-shaped alignment mark 14 is wider than the width of the partition 21, the height of the partition 21 is lower than that of the alignment mark 14 after firing. By making it narrower, it is possible to make it almost the same height as the partition 21.
[0030]
In the display panel of the present embodiment, in the thick film pattern forming step, the alignment mark 14 is formed at a position avoiding the raised end portion 18b of the partition wall forming material layer 18 (region where the raised portion 18a does not occur). The height of the alignment mark 14 is lower than that of the conventional display panel, and the variation in the height of the alignment mark 14 is reduced.
For this reason, the accuracy of recognition of the alignment mark 14 in the image processing is improved, and printing deviation can be prevented.
[Brief description of the drawings]
FIG. 1 is a plan view showing the arrangement of alignment marks on a conventional display panel.
FIG. 2 is a cross-sectional view in a thick film pattern forming process for explaining formation of a conventional alignment mark for a display panel.
FIG. 3 is a plan view of a display panel showing a positional relationship between a conventional alignment mark and a partition.
FIG. 4 is a sectional view taken along line V1-V1 of FIG. 3;
FIG. 5 is a cross-sectional view in a thick film pattern forming step for describing formation of a positioning mark of the display panel according to the embodiment of the present invention.
FIG. 6 is a plan view showing the arrangement of alignment marks on the display panel according to the embodiment of the present invention.
FIG. 7 is a plan view showing a positional relationship between alignment marks and partition walls of the display panel according to the embodiment of the present invention.
8 is a sectional view taken along line V2-V2 of FIG.
FIG. 9 is a sectional view taken along line W2-W2 of FIG. 7;
[Explanation of symbols]
REFERENCE SIGNS LIST 11 back substrate 14 positioning mark 14a positioning mark pattern 18 partition wall forming material layer 18a raised portion 18b raised end portion 21 partition 21a partition pattern 23 dielectric layer 23a raised dielectric layer

Claims (3)

A partition forming material layer is formed by applying a partition forming material to a predetermined thickness on a substrate, and sand blasting is performed on a surface of the partition forming material layer via a sand blast mask corresponding to the partition pattern and the alignment mark pattern. After performing the processing, baking is performed, a display panel manufacturing method including a thick film pattern forming step of simultaneously forming the partition and the alignment mark,
The method of manufacturing a display panel according to claim 1, wherein, in the thick film pattern forming step, the alignment mark is formed at a position avoiding a raised end of the applied partition wall forming material. A front substrate and a rear substrate opposed to each other via a discharge space, a sealing layer sealing the periphery of the front substrate and the rear substrate, a partition for partitioning the discharge space in a display area, and the partition for a non-display area on an outer periphery. At the same time, a positioning mark with a thick film pattern formed thereon,
A display panel comprising a display electrode comprising a transparent electrode and a bus electrode laminated thereon, a dielectric layer covering the display electrode, and a raised dielectric layer formed on the bus electrode, on the inner surface of the front substrate. So,
The dielectric layer is formed so as to extend to the non-display area, and the raised dielectric layer is entirely formed to extend to the non-display area except for a portion facing the alignment mark. A display panel, characterized in that: The alignment mark is formed at the same time as the partition wall by applying a thick film of the partition wall forming material and sandblasting the partition wall forming material, and is formed at a position avoiding the raised end of the partition wall forming material coated with the thick film. The display panel according to claim 2, wherein the display panel is formed.

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