JP2004118255A - Method for producing film with microstructure and film with microstructure - Google Patents

Abstract

An object of the present invention is to provide a method for manufacturing a film with a microstructure, which is a technique for mounting an IC chip or the like on a base film.
A method of manufacturing a film with a microstructure according to the present invention uses a coating apparatus including a roll with a concave hole, an impression cylinder, a developing liquid container, a doctor blade, and a drying zone. In a state where the developing solution container is filled with the developing solution in which the microstructures 3 are dispersed, and a part of the roll is immersed in the developing solution and rotated, the base film is brought into contact with the roll having the concave hole and the impression cylinder. In the manufacturing method of passing through the gap, when the roll with the concave is rotated in the developing solution and is subjected to surface rubbing by the doctor blade 13, the microstructure is fitted into the concave 11h, When the base film 2 passes between the roll 11 having a concave portion and the impression cylinder, the microstructure in the concave portion and a small amount of the developing solution are transferred to the base film, and thereafter, the microstructure in the drying zone is formed. Characterized in that the body 3 is fixed to the base film 2 To.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for producing a film with a microstructure and a film with a microstructure. More specifically, the present invention relates to a manufacturing method for fixing a microstructure to a continuously supplied base film material under regular conditions such as a fixed interval, and a film with the microstructure.
In the present invention, a microstructure can be considered as a solid object having a regulated, fixed size and shape, and for a specific purpose, an integrated semiconductor chip (hereinafter and in the claims, This is expressed as “IC chip”), and an IC chip formed in a predetermined shape is fixed to a film. Such a film with an IC chip is suitable for use of a soft packaging material with a non-contact IC tag, but the production method of the present invention is not limited to the specific purpose.
The field of application of such a technique for other purposes can be considered as a field of mounting electronic components including an IC chip on a flexible film or sheet material.
[0002]
[Prior art]
2. Description of the Related Art An IC tag having a non-contact communication function is attached to a package of food, beverage, or the like. When a non-contact IC tag is attached to an individual article, the non-contact IC tag label is attached to the individual article. However, for a package made of a film material or paper, the It is considered efficient to mount the IC chip at the manufacturing stage.
[0003]
In order to attach a microstructure such as an IC chip to a continuous base film such as a film or paper, generally, the microstructure is temporarily fixed to a small adhesive label or the like to have a size that is easy to handle. Later, a method of pasting is performed on a label machine or the like. However, in this method, the cost and labor of label production are increased, and the capability of the label machine is limited. Therefore, it is inherently difficult to quickly and accurately apply a label to a continuous base film. It is considered.
[0004]
As a method of directly attaching a microstructure to a base film without omitting costly labeling, there is a Fluidic Self Assembly (FSA) technology developed by the University of California, USA and Alien Technology (Patent Documents 1, 2). , 34). This is done by first passing a base film having embossed holes of approximately the same size formed in a slurry-like developing solution in which the microstructures are dispersed, so that the microstructures fit. When the microstructure is accommodated in the embossed hole and excess developer is scraped off by a doctor blade or the like, the microstructure is fixed to the base film.
[0005]
[Patent Document 1] Japanese Patent Application Laid-Open No. 9-120943 [Patent Document 2] Japanese Patent Publication No. 9-506742 [Patent Document 3] US Pat. No. 5,545,291 [Patent Document 4] US Pat. No. 6,274,508 [ [0006]
[Problems to be solved by the invention]
However, the FSA technique requires an embossed hole to be formed in a base film in advance, and is not suitable for application to a thin base film. Further, since the entire base film is immersed in a developing solution, it is difficult to use the base film on paper, for example.
Therefore, in the present invention, the inventors have conceived that a film with a microstructure can be manufactured by applying a gravure printing method generally used in printing technology, and have completed the present invention.
As described above, the present invention applies the gravure printing method, but does not detect a conventional technique of regularly fixing a solid having a predetermined shape to a base film by a method similar to the gravure printing method.
[0007]
[Means for Solving the Problems]
A first aspect of the present invention for solving the above-mentioned problem is to use a coating device having a roll with a concave hole, an impression cylinder, a developing liquid container and a doctor blade, and a drying zone. The base film is passed between the roll with the recess and the impression cylinder in a state where the developing solution in which the structure is dispersed is filled, and a part of the roll with the recess is immersed in the developer and rotates. In the method of manufacturing a film with a microstructure to fix the microstructure to the base film, the roll with the concave is formed with at least one concave hole having substantially the same size and shape as the microstructure, When the roll with the concave is rotated in the developing solution and is subjected to surface abrasion by the doctor blade, the microstructure is fitted into the concave and the excess developing solution and the microstructure on the surface of the roll with the concave are fitted. Is removed, then contact rotation When the base film passes between the roll with the concave hole and the impression cylinder, the microstructure in the concave hole and a small amount of the developing solution vehicle are transferred to the base film, and then pass through the drying zone. A method for manufacturing a film with a microstructure, wherein the microstructure is fixed to a base film as the developing solution vehicle is dried and solidified in the process.
[0008]
A second aspect of the present invention for solving the above-mentioned problem is a method of mounting a microstructure of a fixed size and shape at a regulated position on a running film material, and includes the following (1). Coating equipment configuration conditions, (2) manufacturing operation conditions,
(1) Coating device configuration conditions;
(1) The coating device has a structure similar to that of a general rotogravure printing press, and has a structure in which a portion corresponding to a printing plate cylinder is replaced with a roll having a concave hole. {Circle around (2)} The traveling base film is made to pass between the roll with the concave hole and the impression cylinder that are in line contact with a fixed width, and the pressure release and the pressure adjustment between the roll with the concave hole and the impression cylinder are performed. Being made possible. {Circle around (3)} The roll with concave holes is formed with a plurality of concave holes with a certain regularity for regularly transferring the microstructure to a fixed position of the base film, and the concave hole forms the microstructure. They must be of the same size and shape that can be accommodated. {Circle around (4)} The coating apparatus has a doctor blade for rubbing the roll surface with the concave holes. (5) The coating apparatus is provided with a developing solution container for storing a developing solution in which the microstructure is dispersed, below the roll with the concave hole, and a part of the circumference of the roll with the concave portion is A structure that allows continuous immersion during operation over the entire length of the roll with holes. (6) The coating device has a drying zone. {Circle around (7)} A substrate film supply and take-up device is provided, and tension adjustment and other mechanisms are provided with functions equivalent to those of a normal gravure rotary printing press.
[0009]
(2) manufacturing operation conditions;
{Circle around (1)} The developing liquid is dispersed in a vehicle composed of a resin component and a solvent so that the microstructure can be diffused. {Circle around (2)} When the roll with a hole rotates in the developing solution and the developing solution vehicle and the microstructure adhere to the roll with the hole, the doctor blade rubs the surface of the roll with the hole, and the inside of the hole is removed. And removing excess developer vehicle and microstructures on the surface of the concave roll from the surface of the concave roll while leaving the microstructure and a small amount of the developing liquid vehicle. {Circle around (3)} A microstructure fitted in the concave hole of the concave roll by passing the base film at a predetermined speed while applying tension between the concave roll and the impression cylinder; Transfer of a small amount of the developing solution vehicle attached to the running substrate film. {Circle around (4)} When the microstructure transferred to the base film passes through the drying zone, the microstructure is fixed to the base film as the volatile components in the developing solution evaporate and the resin solidifies. And a method for producing a film with a microstructure, which is realized by providing
[0010]
A third aspect of the present invention to solve the above problems is a film with a microstructure manufactured by the above manufacturing method, which is used for a packaging material with a non-contact IC tag. Body film.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
The present invention is intended to fix and mount a microstructure, particularly an IC chip, on a flat substrate film without providing an embossed concave portion in the substrate film as in the FSA technology.
Such a manufacturing technique can be carried out using a coating apparatus and a method similar to the gravure printing technique. First, description will be made from the configuration conditions and the like of the coating apparatus.
[0012]
FIG. 1 is a diagram showing a main part of a coating apparatus for mounting a microstructure on a base film, FIG. 2 is a diagram showing a roll with a concave hole, and FIG. 3 is a diagram showing a shape of the microstructure. 4 is a diagram showing a state where the microstructure is fitted into the concave hole, and FIG. 5 is a diagram showing a state where an IC chip is mounted on a base film on which an antenna pattern is printed.
[0013]
As shown in FIG. 1, a coating apparatus 1 used in the manufacturing method of the present invention has a roll 11 with a concave hole and an impression cylinder 12, and a base film 2 is provided with a roll 11 with a concave under a constant tension. And the impression cylinder 12 while passing at a constant pressure.
The configuration of the coating apparatus 1 is similar to that of a conventional gravure rotary printing press, but differs from the gravure printing press in that a roll 11 with a concave hole is used instead of a gravure printing plate. .
The use of the doctor blade 13 and the use of a developing liquid container 14 equivalent to an ink pan are the same as those of the gravure rotary printing press. The same applies to the provision of the drying zone 15 and the supply of the base film 2 and a winding device (not shown) for adjusting the tension.
[0014]
In FIG. 1, a base film 2 fed out from a film supply device (not shown) passes between a roll 11 with a hole and an impression cylinder 12 under an appropriate tension. The roll 11 with a concave hole and the impression cylinder 12 are rotating at substantially the same peripheral speed, and rotate in contact with the base film 2 interposed therebetween.
When the antenna pattern 21 is printed on the base film 2, it is necessary to fix (register) the microstructure 3 to the position of the antenna pattern.
[0015]
It is possible to release the pressure between the concaved roll 11 and the impression cylinder 12 to separate them from each other. This is because it is necessary to exchange the roll 11 with the concave hole and the impression cylinder 12 or to re-thread the base film 2 at the start of the work or at the time of cutting the film. In addition, it is necessary to be able to adjust the pressure between the roll 11 having a concave portion and the impression cylinder 12 in order to secure a favorable transition state of the microstructure 3.
[0016]
A developing liquid container (ink pan in the case of printing) 14 for filling the developing liquid 4 in which the microstructures 3 are dispersed is provided on the lower surface of the concaved roll 11, and at least one of the circumferences of the concaved roll 11 is provided. It is necessary that the portion has a structure that can be immersed in the developing solution 4 at all times during operation over the entire length of the roll 11 with concave holes. This is because when the roll 11 with concave holes rotates in the developing liquid container 14, the developing liquid 4 needs to adhere to the surface to be in a flowing state.
Alternatively, the developing solution 4 is supplied to the surface of the concaved roll 11 from a developing solution supply pipe (not shown) to the roll surface, and only the excess developing solution removed by the doctor blade 13 is used as the developing solution container 14. You may make it fall in.
In order to prevent the microstructure 3 from settling on the bottom surface of the developing solution container 14 in the developing solution 4, stirring in the developing solution container 14 is usually performed or a developing solution circulating stirring device (not shown) is developed. Connected to liquid container 14.
[0017]
The developing solution 4 that is excessively supplied to the surface of the concaved roll 11 is then removed by the doctor blade 13 rubbing the surface of the concaved roll 11. The doctor blade 13 is a thin plate-like steel blade as is well known, and has a thickness of about 150 μm. The tip of the blade in contact with the roll is polished straight and sharply before use.
Normally, the blade edge is brought into line contact with the surface of the roll 11 with the concave hole while being sandwiched by the doctor holder 13h, and the holder swings right and left with the rotation of the roll.
[0018]
As the impression cylinder 12, a rubber impression cylinder can be used, and a rubber having an appropriate hardness such as a synthetic rubber is selected and used. The drying zone 15 is required for evaporating and drying a small amount of the solvent in the developing solution 4 vehicle transferred together with the microstructures 3 in the base film 2 to which the microstructures 3 are adhered. Usually, a drying apparatus provided with a far-infrared ray irradiator together with hot air is used.
[0019]
As shown in FIG. 2, the roll 11 with a concave hole has a shaft shaft 111 or is a cylindrical cylinder to which the shaft shaft can be attached, and one or a plurality of concave holes into which the microstructure 3 fits. 11h is formed.
The concave hole 11h may be formed in at least one place on the roll 11 with concave holes. However, usually, in order to transfer the microstructure 3 to the base film 2 efficiently and regularly, a plurality of concave holes 11h are formed. A hole 11h is provided. "Regularly" means that the pitch L1 and the width L2 in the base film flow direction at a position where the microstructure 3 is provided on the base film 2 have a certain regularity.
When the base film 2 is used as a packaging material, one microstructure 3 is fixed to one packaging material. Therefore, the values of L1 and L2 are numerical values determined by the size and shape of the packaging material.
[0020]
The shape of the microstructure 3 has various shapes as shown in FIG. 3, but typical shapes are a cubic shape (a), a rectangular shape (b), a hemispherical shape (c), and a semi-elliptical spherical shape. (D), triangular pyramid (e), quadrangular pyramid (f), conical (g), truncated pyramid (h), or truncated pyramid (i). In the case of a long shape close to a needle even in a rectangular shape, or a conical shape having a small bottom area compared to the length, it is difficult to fit or transfer into the concave hole.
[0021]
The size and shape of the concave hole 11h allow the microstructure 3 to be fitted. However, the larger the area to be transferred to the base film 2 is, the more the microstructure 3 fits into the concave hole 11h. It is also easy to attach and stably adheres to the base film 2, so that the overall shape is slightly larger than the microstructure 3 so that fitting and transfer to the base film 2 are performed smoothly, The opening is further enlarged and formed in such a size that a small amount of the developing liquid 4 and the vehicle of the developing liquid 4 can be accommodated at the same time.
[0022]
FIG. 4 shows a state where the microstructure 3 is fitted into the concave hole 11h.
The recess 11h is preferably formed as follows. For example, when the microstructure 3 has a truncated pyramid shape of a quadrangular pyramid, the slope 11 s of the concave hole 11 h and the microstructure 3 are smaller than the outer shape of the concave hole 11 h and the microstructure 3 are completely identical. It is preferable that there is an angle α in the range of about 2 to 20 °, preferably about 3 to 5 °, between the slopes 3s. This is because the smooth engagement of the microstructure 3 is promoted by this angle.
Further, in order to promote the transfer of the microstructure 3, a space for the vehicle of the developing solution 4 may be left as a concave hole 11h slightly deeper than the actual thickness of the microstructure 3.
[0023]
The formation of the concave hole 11h in the roll 11 with concave holes has no screen line unlike normal gravure printing. When the microstructure 3 is an IC chip, its size (opening surface) is several millimeters or less to about 10 μm square, and its thickness is about 1 to 2 mm or less to about 10 μm.
In the case of normal gravure printing, the depth is about 100 μm even in the case of a deep plate depth. To achieve this depth, direct etching (direct corrosion), electroforming, or mechanical engraving is used. It becomes.
Since the ballad layer (exfoliated copper layer) is also usually about 150 to 200 μm, when the thickness of the microstructure 3 is larger than that, a thicker ballad layer copper is provided or a metal plate is used without using ballad copper. It is necessary to directly engrave.
[0024]
Next, a method for manufacturing a film with a microstructure will be described.
When the roll 11 with the concave holes rotates while the developing liquid 4 is filled in the developing liquid container 14 and is immersed in the developing liquid 4, the developing liquid 4 flows on the roll surface with the rotation of the roll. In this state, the microstructure 3 is fitted into the concave hole 11h before or at the same time as the roll surface is rubbed by the doctor blade 13. In the stage before contact with the doctor blade 3, a furnisher roller (not shown) or the like may be used to promote the fitting.
[0025]
After the doctor blade removes the excess developing solution from the roll surface, only the microstructure 3 and a slight developing solution vehicle remain in the recess 11h. Then, when the base film 2 passes between the roll 11 having a concave hole and the impression cylinder 12, the microstructure 3 fitted in the concave hole 11h of the roll is transferred to the base film 2 side. I do.
In this case, the vehicle of the developing solution 4 remaining in the concave hole 11h together with the microstructure 3 is transferred to the base film first, and the microstructure 3 is formed by the surface tension of the vehicle of the developing solution 4. The action of drawing out to the material film 2 side is performed.
[0026]
The base film 2 to which the microstructures 3 have been transferred further proceeds rightward in FIG. 1, passes through the drying zone 15, and is taken up by a take-up device (not shown).
While passing through the drying zone 15, most of the volatile components in the developing solution 4 vehicle are volatilized, and the remaining resin component is solidified, and the microstructure 3 is fixed to the base film 2 by the solid component due to solidification. .
Thereafter, the substrate film 2 with the microstructure 3 is usually wound up by a winding device, but may be cut into an appropriate length and discharged in a sheet form.
[0027]
FIG. 5 is a diagram illustrating a state in which the IC chip 3c is mounted on the base film 2 on which the antenna pattern 21 is printed. In the case of FIG. 5, the antenna pattern 21 is printed in an electrostatic coupling type pattern, and the IC chip 3c is fixed so as to cover between the connection terminals 21ac and 21bc of both the patterns 21a and 21b.
A slight displacement of the IC chip 3c does not impair the non-contact communication function, but a short circuit occurs when both pads of the IC chip 3c approach only one of the connection terminals 21ac and 21bc of the antenna pattern. , Does not function as a non-contact IC tag. Therefore, the alignment between the antenna patterns 21a and 21b and the IC chip 3c must be made as precise as possible.
[0028]
The antenna pattern 21 is not limited to the electrostatic coupling type pattern as shown in FIG. 5, but may be a coil-shaped (planar winding) electromagnetic induction type pattern.
In the case of the electrostatic coupling type, it is printed on a patch antenna type separated into two pieces as shown in FIG. 5 and used for 125 kHz communication. In the case of the electromagnetic induction type, a planar coil pattern or a dipole type (UHF-SHF band) is used.
[0029]
The antenna pattern 21 can be printed using conductive ink by offset, gravure, silk screen printing, or the like.
As the conductive ink, an ink in which conductive carbon, graphite, silver powder, aluminum powder, or a mixture thereof is dispersed in a vehicle is used.
Alternatively, a transparent conductive ink using tin oxide, indium oxide, doped indium oxide (ITO), titanium oxide powder, a conductive polymer dissolved, or the like may be used, although the ink cost is relatively high.
As the surface resistance of the antenna pattern, a value measured according to JIS K6911 is 10 ⁶ Ω / □ or less, preferably 10 ⁴ Ω / □ or less, so that the reliability of communication can be enhanced.
[0030]
In this way, the base film on which the IC chip is mounted can be used not only for packaging materials with non-contact IC tags, but also for various circuit base materials and display displays by printing electric circuits on the base material in advance. is there. Further, the use as a carrier tape of an electric component is also conceivable.
[0031]
Next, materials for implementing the present manufacturing method will be described.
<Developing liquid>
The developing solution 4 used in the present invention includes the microstructure 3 and a vehicle for dispersing the microstructure 3. The vehicle is composed of a resin component and a volatile solvent similarly to a general printing ink, and has coating aptitude and drying property. Therefore, the vehicle of the developing solution 4 may be a transparent solvent-based adhesive, which is suitable for the purpose in many cases. Further, the developing liquid 4 needs to be kept in a state in which the microstructures 3 are dispersed and have a viscosity state in which the microstructures 3 are not precipitated.
The appropriate viscosity varies depending on the specific gravity and size of the microstructure 3. When the microstructure is an IC chip, it is necessary that the solution viscosity in the range of 100 to 6000 cps (23 ° C.) It was confirmed that the transferability from the roll 11 having the holes to the base film 2 was good without causing precipitation.
[0032]
Examples of the resin layer of the developing solution 4 include an olefin such as polyethylene or a copolymer of ethylene and (meth) acrylic acid, an ethylene-vinyl acetate copolymer, a polyamide, a polyester, a thermoplastic elastomer, and an epoxy. A hot melt resin such as a reaction hot melt resin, a wax, and the like are used.
As the solvent, one that makes the resin layer soluble is selected and used. Generally, toluene, xylol, ethyl acetate, butyl acetate, IPA, methyl alcohol, ethyl alcohol, MEK, MIBK, etc. are used. You.
[0033]
<Microstructure>
An object to which a structure having a certain shape is regularly fixed to the base film 2 is often an electric element. In particular, a semiconductor IC chip, a light emitter, a capacitor, and the like are objects of the present invention.
In the case of the IC chip 3c, when a semiconductor integrated circuit is formed on a silicon substrate and then diced and cut, it is formed in a rectangular cube.
However, when manufacturing the small IC chip 3c at low cost, separation into individual IC chips 3c is performed by etching from the back side of the substrate because it is necessary to reduce the dicing groove area and increase the yield. For this reason, the rear surface side necessarily has a smaller area than the front surface side where the pad portion is located, and the surface between the front surface and the rear surface is usually an inclined surface.
[0034]
Since the surface shape of the chip is usually rectangular, when etched, the overall shape of the IC chip 3c is trapezoidal in cross section, and in particular, it is generally a truncated pyramid of a quadrangular pyramid. However, depending on the purpose and application, the shape may be a rectangular parallelepiped, a cube, a circle or a column, or another shape.
Incidentally, one side of an IC chip having a rectangular surface has a thickness of about 5 mm to 10 μm and a thickness of about 1000 μm to 10 μm.
[0035]
<Base film>
As the base film 2 used in the present invention, a flexible resin film or paper used for general packaging materials and printed wiring can be used.
In general, polyethylene, polypropylene, polyester such as PET and PBT, polystyrene, polyamide such as polyvinyl chloride, polyvinylidene chloride, nylon 6, nylon 66, polyimide, polyamide imide, polyurethane, tetrafluoroethylene, acryl, cellulose acetate And a barrier film such as an inorganic vapor-deposited film or EVOH. Further, paperboard, coated carton paper, corrugated cardboard paper, high-quality paper, resin-impregnated paper, kraft paper and the like are often used.
[0036]
The base film 2 may be white paper without printing, but may be one on which the antenna pattern 21 is printed as described above.
The antenna pattern 21 is preferably printed on the surface of the transparent base film 2 on which the microstructures 3 are mounted for electrical continuity, but if the film has a thickness of several hundred μm or less, it is the opposite surface. Has also been confirmed to make ohmic contact.
Further, between the antenna pattern 21 and the base film 2, there may be another pattern printing (not shown).
[0037]
【Example】
(Example)
An embodiment of the present invention will be described with reference to FIGS.
Approximately 10,000 IC chips (manufactured by Motorola, product name: Bistatix) having a non-contact communication function were prepared as microstructures.
This IC chip had a rectangular parallelepiped shape as shown in FIG. 3B, a bottom surface of 1.5 mm × 2.0 mm and a thickness of 0.4 mm.
On the other hand, a steel roll was engraved to prepare a roll 11 with a concave hole. The concave hole 11h of the concaved roll 11 has an opening surface having a rectangular shape of 1.7 mm × 2.3 mm, a bottom surface having a rectangular shape of 1.6 mm × 2.1 mm, and a depth of IC The thickness was made equal to the thickness of the chip 3c. Therefore, a concave truncated pyramid-shaped hole was formed as a whole. This concave hole 11h was formed by excavating the roll surface with an end mill.
[0038]
As the developing solution 4, a commonly used adhesive for dry lamination (manufactured by Dainippon Ink and Chemicals, Inc., main agent: LX703, curing agent: KR900) is used. All of the 10,000 chips were put therein, stirred and uniformly dispersed. The solution viscosity was adjusted to 230 to 300 cps (23 ° C.).
Thereafter, stirring was appropriately performed so that the IC chip 3c did not precipitate.
[0039]
As the base film 2, a single-sided treated PET (Toyobo E5100) having a thickness of 20 μm was used. The antenna film 21a, 21b was previously printed on the substrate film 2 using conductive ink (conductive black ink, manufactured by Acheson Co.) (FIG. 5).
[0040]
When a part of the circumference of the roll 11 with the concave hole is rotated in a state of being immersed in the developing liquid 4 and the developing liquid 4 attached to the roll is removed (scraped) by the doctor blade 13, the IC is inserted into the concave hole 11h. The chip 3c was fitted, and the adhesive (developing liquid vehicle) was left attached to the IC chip 3c.
When the substrate film 2 was brought into contact with the roll 11 with concave holes and passed through it under pressure by the impression cylinder 12, the IC chips 3c were transferred to the substrate film 2 sequentially. By adjusting the alignment with the antenna, the IC chip 3c could just be transferred to a predetermined position between the antenna patterns 21a and 21b (FIG. 5).
When the substrate film 2 with the IC chip 3c to which the IC chip 3c is transferred is passed through a drying zone at 80 ° C., the solvent is volatilized, and as a result, the IC chip 3c is firmly fixed to the substrate film 2 with an adhesive. Became. Thereby, the film with a microstructure of the present invention was completed.
At this time, the passing speed of the base film (printing speed in the case of printing) was about 60 m / min.
[0041]
The film with the microstructure to which the IC chip 3c is fixed is formed into a bag, cut into unit packages, and predetermined data is recorded on the non-contact IC tag as confirmation items. When a reading test of information was performed using a BiStatix reader “WAVE” manufactured by the company, the recorded data of the non-contact IC tag could be correctly read from a distance of 15 cm.
This reading performance is equivalent to a reading distance of 15 cm in the case of an interposer (a label with a non-contact IC tag).
[0042]
In terms of the production amount, about 4000 pieces of non-contact IC tag-attached packages could be obtained in one hour.
This result shows that the mass productivity can be expected to be sufficiently higher than the speed at which the interposer is attached to the package using the labeler (production capacity: about 500 pieces / hour).
[0043]
【The invention's effect】
As described above, according to the method for manufacturing a film with a microstructure of the present invention, a microstructure, particularly a micro IC chip, can be continuously and efficiently mounted on a base film.
The film with a microstructure of the present invention can be suitably applied to the production of a package with a non-contact IC tag and the like. Therefore, according to the present invention, a large number of packages having a non-contact IC tag function can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 is a diagram showing a main part of an apparatus for mounting a microstructure on a base film.
FIG. 2 is a view showing a roll with a concave hole.
FIG. 3 is a diagram showing the shape of a microstructure.
FIG. 4 is a diagram showing a state in which a microstructure is fitted into a concave hole.
FIG. 5 is a diagram showing a state in which an IC chip is mounted on a base film on which an antenna pattern is printed.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Coating apparatus 2 Base film 3 Microstructure 3c IC chip 4 Developing liquid 11 Roll with concave hole 11h Concave hole 12 Impression cylinder 13 Doctor blade 14 Developing liquid container 15 Drying zones 21, 21a, 21b Antenna pattern

Claims (11)

Using a coating device having a roll with a concave hole, an impression cylinder, a developing liquid container and a doctor blade, and a drying zone, in particular, the developing liquid in which the microstructure is dispersed is filled in the developing liquid container, and the concave hole is used. With a microstructure that fixes the microstructure to the substrate film by passing the substrate film between the roll with the recess and the impression cylinder while a part of the roll with the roll is immersed in the developing solution and rotated. In the method for producing a film, the concave roll has at least one concave hole of substantially the same size and shape as the microstructure, and the concave roll is rotated in the developing solution and is rotated by a doctor blade. When subjected to surface abrasion, the microstructure fits into the recess and the excess developing liquid and microstructure on the surface of the recessed roll are removed. The base film passes between the barrels. In the process, the microstructure in the concave hole and a small amount of the developing solution vehicle are transferred to the base film, and then, in the process of passing through the drying zone, the microstructure is based on the drying and solidification of the developing solution vehicle. A method for producing a film with microstructures, characterized in that the film is fixed to a material film. This is a method for mounting a microstructure of a fixed size and shape at a regulated position on a running film material, and includes the following (1) coating apparatus configuration conditions and (2) manufacturing operation conditions. The manufacturing method of the film with a microstructure realized by this.
(1) Coating device configuration conditions;
(1) The coating device has a structure similar to that of a general rotogravure printing press, and has a structure in which a portion corresponding to a printing plate cylinder is replaced with a roll having a concave hole.
{Circle around (2)} The traveling base film is made to pass between the roll with the concave hole and the impression cylinder that are in line contact with a fixed width, and the pressure release and the pressure adjustment between the roll with the concave hole and the impression cylinder are performed. Being made possible.
{Circle around (3)} The roll with concave holes is formed with a plurality of concave holes with a certain regularity for regularly transferring the microstructure to a fixed position of the base film, and the concave hole forms the microstructure. They must be of the same size and shape that can be accommodated.
{Circle around (4)} The coating apparatus has a doctor blade for rubbing the roll surface with the concave holes.
(5) The coating apparatus is provided with a developing solution container for storing a developing solution in which the microstructure is dispersed, below the roll with the concave hole, and a part of the circumference of the roll with the concave portion is A structure that allows continuous immersion during operation over the entire length of the roll with holes.
(6) The coating device has a drying zone.
{Circle around (7)} A substrate film supply and take-up device is provided, and tension adjustment and other mechanisms are provided with functions equivalent to those of a normal gravure rotary printing press.
(2) manufacturing operation conditions;
{Circle around (1)} The developing liquid is dispersed in a vehicle composed of a resin component and a solvent so that the microstructure can be diffused.
{Circle around (2)} When the roll with a hole rotates in the developing solution and the developing solution vehicle and the microstructure adhere to the roll with the hole, the doctor blade rubs the surface of the roll with the hole, and the inside of the hole is removed. And removing excess developer vehicle and microstructures on the surface of the concave roll from the surface of the concave roll while leaving the microstructure and a small amount of the developing liquid vehicle.
{Circle around (3)} A microstructure fitted in the concave hole of the concave roll by passing the base film at a predetermined speed while applying tension between the concave roll and the impression cylinder; Transfer of a small amount of the developing solution vehicle attached to the running substrate film.
{Circle around (4)} When the microstructure transferred to the base film passes through the drying zone, the microstructure is fixed to the base film as the volatile components in the developing solution evaporate and the resin solidifies. The method for producing a film with a microstructure according to claim 1 or 2, wherein the microstructure is an IC chip. 3. The method according to claim 1, wherein the microstructure is an IC chip having a non-contact communication function. The antenna pattern is printed on the base film in advance, and the microstructure is fixed to a predetermined position of the antenna pattern. The method according to any one of claims 1, 2, and 4, wherein The method for producing a film with a microstructure according to the above. 3. The method according to claim 1, wherein an electric circuit is formed on the base film in advance, and the microstructure is fixed to a predetermined position of the electric circuit. The method according to claim 5, wherein the antenna pattern is printed with a conductive ink. 7. The method for producing a film with a microstructure according to claim 6, wherein the electric circuit is printed with a conductive ink. 3. The method according to claim 1, wherein the vehicle of the developing solution is a solvent-based adhesive. The production of a film with a microstructure according to any one of claims 1, 2, and 9, wherein the developing solution has a solution viscosity of 100 to 6000 cps (23 ° C). Method. A film with a microstructure produced by the method for producing a film with a microstructure according to claim 1, wherein the film is used for a packaging material with a non-contact IC tag. the film.

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